JP3464795B1 - Core piece for non-contact communication type information carrier - Google Patents

Abstract

Abstract: PROBLEM TO BE SOLVED: To provide a core piece capable of improving the handleability of an IC chip when mounted on a non-contact communication type information carrier and improving the productivity of the non-contact communication type information carrier. . SOLUTION: An IC chip 1 on which an antenna coil 3 is formed is inserted into a concave portion 6 of a core piece main body 5, and an IC is formed by a caulking portion 9 formed at an opening end of the concave portion of the core piece main body 5.
Lock the outer periphery of the chip.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a core piece for improving the handleability of an IC chip integrally formed with a non-contact communication antenna and improving the productivity of a non-contact communication type information carrier. .

[0002]

2. Description of the Related Art Conventionally, an IC chip integrally formed with an antenna coil is attached to a component or product for inventory control of the component or product, or is used for application such as entry / exit control or commuter pass. Therefore, a personal identification card in which an IC chip integrally formed with an antenna coil is embedded in a card body has been proposed.

[0003]

However, the IC chip integrally formed with the antenna coil is hard, and when the IC chips contact each other, the coil forming surface is easily damaged.
Since C chips cannot be packed in bags or supplied by a parts feeder, expensive material handling is inevitable.

An IC having an antenna coil integrally formed
Since the chip is extremely thin (thickness is about 0.2 mm to 0.6 mm) and has high brittleness, cracking or chipping due to stress on the coil forming surface side (or its back surface side) easily occurs,
Secondary processing is difficult.

Further, although insert molding of a chip using resin is possible, since there is a large difference in physical characteristics between the IC chip integrally formed with the antenna coil and the molding resin, the moldability is poor and a large number of chips can be taken. It has drawbacks such as difficulty and high cost.

Further, in the case of insert molding, there is a drawback that thermal expansion due to the buried resin and stress strain generated during use directly affect the IC chip, and in the worst case, the circuit of the IC chip is destroyed.

The object of the present invention is to solve the above-mentioned drawbacks of the prior art and to provide an I for which a non-contact communication antenna is integrally formed.
It is an object of the present invention to provide a core piece for a non-contact communication type information carrier for improving the handleability and the productivity when the C chip is mounted on the non-contact communication type information carrier.

[0008]

In order to achieve the above object, the present invention provides a core piece for a non-contact communication type information carrier,
An insulating layer formed on a circuit forming surface of an IC chip, a through hole formed in the insulating layer, and a circuit formed on the insulating layer and formed on the circuit forming surface through the through hole. An IC chip having an antenna coil electrically connected to is inserted into the recess of the core piece body, and the caulking portion formed at the opening end of the core piece body locks the outer periphery of the IC chip. did.

Further, according to the present invention, in the core piece having the above-mentioned structure, a notch portion is provided in a caulking margin for forming the caulking portion.

Further, according to the present invention, in the core piece having the above-mentioned structure, a thin-walled portion is partially provided in a crimping margin for forming the crimped portion.

Further, according to the present invention, in the core piece having the above structure, the IC chip is arranged in the recess so that the antenna coil faces the bottom of the core piece body.

Further, according to the present invention, in the core piece having the above structure, the core piece body is made of a transparent material.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 is a plan view of a core piece for a non-contact communication type information carrier according to the first embodiment, FIG. 2 is a sectional view taken along the line 1A-A in FIG. 3, FIG. 3 is an enlarged perspective view of an IC chip used for the core piece, and FIG. An enlarged plan view of the IC chip, FIG.
6A and 6B are a plan view and a cross-sectional view for explaining a process of mounting the IC chip on the core piece body.

As shown in FIGS. 3 and 4, a square-shaped I
A rectangular spiral antenna coil 3 is integrally formed on the surface of the C chip 1 on the circuit formation side with an insulating layer 2 made of a polyimide resin or the like interposed therebetween. The antenna coil 3 can be formed by an electroforming plating method, a photoresist method, or the like, and both ends thereof are connected to the input / output terminals 4 and 4 of the IC chip 1 through through holes formed in the insulating layer 2.
The length of one side of the IC chip 1 integrally formed with the antenna coil 3 is about 2 mm to 4 mm, and the thickness is about 0.2 mm.
It is about 0.6 mm.

The IC chip 1 is carried on the core piece body 5 as shown in FIGS. Core piece body 5
Is formed of engineering plastic such as thermoplastic, has a circular recess 6 in the center as shown in FIGS. 5 and 6, and has a protruding caulking margin 7 integrally formed around the opening of the recess 6. There is. As shown in FIG. 5, the inner diameter D of the recess 6 is designed to be substantially equal to the length L of the diagonal line of the IC chip 1, and by inserting the IC chip 1 into the recess 6,
The center of the IC chip 1 and the center of the core piece body 5 are aligned with each other, that is, the IC chip 1 is inside the core piece body 5.
Are to be positioned.

As shown in FIG. 6, the IC chip 1 is inserted into the recess 6 with the antenna coil 3 side facing down, and the ultrasonic welding horn 8 is pressed from above the core piece body 5 to heat and soften the caulking margin 7 inward. Then, as shown in FIGS. 1 and 2, the IC chip 1 is inserted and carried in the recess 6 by forming a caulking portion 9 for locking the four corners 1a to 1d of the IC chip 1 as shown in FIGS. Swaging method).

In this example, the IC chip 1 is inserted into the recess 6 with the antenna coil 3 side facing down, and the antenna coil 3 is protected by the bottom 12 of the recess 6, but the antenna coil 3 side is facing up. Even if the IC chip 1 is inserted into the recess 6 as described above, the surface of the antenna coil 3 is lowered inward from the upper surface of the core piece body 5 by the thickness of the crimped portion 9, and thus the antenna coil 3 is supplied in a bag or a parts feeder. Sometimes the antenna coil 3 is not damaged and has a protective effect. If the core piece body 5 is molded from transparent or translucent plastic, it is convenient to check whether the IC chip 1 is mounted or not.

FIG. 7 is a view showing another example of carrying the IC chip 1, in which the IC chip 1 is recessed by an adhesive 10 in this example.
It is inserted and carried inside. Also in this case, the IC chip 1 is inserted into the recess 6 with the antenna coil 3 side facing down.

By thus carrying the IC chip 1 in the recess 6 of the core piece body 5, the antenna coil 3
The core piece 11 can be mass-produced and attached to the member to which the IC chip 1 should originally be attached, since it can be protected and can be easily handled. In particular, it becomes possible to protect the IC chip corners 1a to 1d, which are likely to be chipped due to stress when handling the IC chip 1 or after fitting with the target product, by the core piece.

8 to 10 are views showing an example in which the core piece 11 is mounted on the token 13 used for electronic money transactions, etc., FIG. 8 is a plan view showing a state before the core piece 11 is mounted, and FIG. 9 is a mounting view. Later plan view, FIG. 10 is FIG. 9B-
It is an expanded sectional view on the B line. As shown in FIG. 8, a fitting recess 14 having the same shape as the core piece 11 is formed in the center of a token 13 made of a plastic molded body and having a circular planar shape, and the core piece 11 is fitted and fixed therein.

At this time, as shown in FIG. 10, the bottom portion 12 of the core piece body 5 is mounted on the front side, that is, the antenna coil 3 is mounted as close to the front as possible, and the surface of the bottom portion 12 projects from the surface of the token 13. Fixed not to. By mounting the core piece 11 on the token 13 in this way, various information necessary for electronic money transactions, such as a personal identification number and transaction history, is stored.
The C chip 1 can be used.

An adhesive may be used to connect the core piece 11 and the token 13, or the core piece main body 5 and the token 13 may be provided with unevenness to be a fitting portion (connecting portion).

As a material for the core piece 11, engineering plastics such as polycarbonate, or PPS (polysulfane) or PEI is used for applications requiring heat resistance.
Super engineering plastics such as (polyether imilo) are preferable, and A is used as the material for the token 13.
BS and the like are preferred.

When the fitting property and stress relaxation are taken into consideration as the material of the core piece 11 and the information carrier such as the token 13 into which the core piece 11 is fitted, the core piece 11 is compared with the material hardness of the information carrier such as the token 13. Select a hard material.

When the material of the core piece 11 and the information carrier are the same or the material of the core piece is soft, stress is generated when the core piece 11 is fitted into the recess of the information carrier such as the token 13 or after use. In this case, stress is applied to the main body of the core piece 11 to cause chip cracks in the IC chip corners 1a to 1d. However, as in the present embodiment, the material of the core piece 11 is harder than the material hardness of the information carrier. By selecting it, the stress applied to the IC chip is relieved, and it becomes possible to avoid chip cracking and IC chip circuit destruction.

The above-mentioned hardness is indentation hardness such as Rockwell hardness, durometer hardness, and Bacol hardness,
In particular, it is preferable that the durometer hardness is the hardness that is obtained from the depth of the depression when a test load is applied and the test method is defined by JIS K7215.

11 to 16 are views for explaining the second embodiment of the present invention. FIG. 11 is a plan view of an IC chip, FIG. 12 is an enlarged view of a portion C of FIG. 11 and FIG. A plan view, FIG. 14 is a front view in which a part of the core piece body is cut, FIG. 15 is a plan view of the core piece, and FIG. 16 is a front view in which a part of the core piece is cut.

Depending on the capacity and version of the IC chip 1,
The outer shape of the IC chip 1 may be small. On the other hand, the outer shape of the core piece main body 5 may not be reduced due to the relationship with the information carrier to which it is attached. The present embodiment is a suitable example in such a case.

The IC chip 1 used in this embodiment has a square shape with a side length of 2.3 mm, and a spiral is formed on the surface on the circuit formation side with an insulating layer (not shown) made of polyimide resin or the like interposed. Shaped antenna coil 3 is integrally formed. The antenna coil 3 is formed in a rectangular shape along the outer shape of the IC chip 1. In this embodiment, the coil width is about 14 μm, the gap between the coils is about 4 μm, and the number of turns is about 47 turns. Both ends of the antenna coil 3 are
It is connected to the input / output terminals 4 and 4 through through holes formed in the insulating layer. As shown in FIG.
The antenna coil 3 is formed on the IC chip 1 so that the center O1 of the chip 1 and the winding center O2 of the rectangular spiral antenna coil 3 coincide with each other.

The core piece body 5 has a disk shape and is molded of a thermoplastic resin such as a polycarbonate resin or an epoxy resin as described above, and has a circular recess 6 at the central position as shown in FIGS. 13 and 14. However, a protruding caulking margin 7 is integrally formed around the opening of the recess 6. Caulking fee 7
One or a plurality of V-shaped or U-shaped notches 21 are formed in the circumferential direction.

The diameter D of the recess 6 shown in FIG. 13 is designed to be substantially equal to the diagonal length L of the IC chip 1 shown in FIG.
By inserting the IC chip 1 into the concave portion 6, the winding center O2 of the antenna coil 3 and the center O of the core piece body 5 are inserted.
The antenna coils 3 (IC chip 1) are positioned in the core piece main body 5 so that they coincide with each other.

The IC chip 1 is inserted into the recess 6 as shown in FIG. 16 with the antenna coil 3 side facing down, and the ultrasonic welding horn is pressed from above the core piece body 5 to heat and soften the caulking margin 7 inward. By caulking, as shown in FIGS. 15 and 16, the caulking portion 9 for locking the four corners 1a to 1d of the IC chip 1 is formed, and the IC chip 1 is fixed in the recess 6.

By providing the notch 21 as described above, when the caulking margin 7 is heated and softened inward and caulked, the caulking portion 9 extending inward as shown in FIG. Thus, even the IC chip 1 having a small outer shape can be securely fixed in the core piece body 5. Also I
By placing the C chip 1 in the recess 6 with the antenna coil 3 side facing down, the antenna coil 3 can be protected by the bottom 12 of the recess 6.

As shown in FIGS. 14 and 16, one or a plurality of annular ribs 22 are formed on the outer periphery of the core piece body 5. When the core piece body 5 (core chip 11) is press-fitted into the fitting recess 14 of the token 13 as shown in FIG. 8, the core piece body 5 is tightly fitted into the fitting recess 14 due to the presence of the annular rib 22. 5
The connection strength between the token 13 and can be increased. In the present embodiment, the annular rib 22 that is continuous along the circumferential direction is provided, but if the ribs are intermittently provided along the circumferential direction, the same effect can be obtained.

The core chip 11 formed by fitting the IC chip 1 to the core piece body 5 as described above is press-fitted into the fitting recess 14 of the disk-shaped token 13 as shown in FIGS. The non-contact communication type information carrier according to the embodiment. Since the fitting recess 14 is formed at the central position of the token 13, eventually, although the orientation of the IC chip 1 is arbitrary, the center O4 of the token 13 and the center O2 of the IC chip 1 coincide with each other (FIG. 8). , See FIG. 9).

FIG. 17 is a block diagram showing a data transmission system among the non-contact communication type information carrier 31, the reader / writer 32 and the host computer 44 according to the present invention. The information carrier 31 includes the antenna coil 3 and the power generation circuit 3
3, memory 34, control circuit 35 and the like. The reader / writer 32 includes an antenna coil 36 corresponding to the antenna coil 3 on the information carrier 31 side, a transceiver / receiver 37, a controller 38, and the like. The relationship between the parts is as shown in the figure.

FIG. 18 shows the antenna coil 3 of the information carrier 31.
FIG. 6 is a diagram showing a correspondence relationship between an antenna coil 36 of the reader / writer 32. The antenna coil 36 is wound around the peripheral surface of a cylindrical ferrite core 39 having a lower surface that is substantially the same as the outer shape of the antenna coil 3. The axial direction of the ferrite core 39 is arranged perpendicular to the plane of the antenna coil 3, and the lower surface of the ferrite core 39 is close to the antenna coil 3.

Token 1 attached to the reader / writer 32
3 is positioned by a guide means (not shown) such that the center of the token 13 (center of the antenna coil 3) coincides with the center of the lower surface of the ferrite core 39. The antenna coil 3 and the antenna coil 36 are electromagnetically coupled and data is exchanged regardless of the orientation.

FIG. 19 is a diagram showing a third embodiment of the present invention. In this example, a circular fitting recess 14 is formed inside a case 42 that stores various test objects 41 such as a DNA chip, a test tube, and a test piece, and the antenna coil 3 is formed.
The core piece 11 is fitted into the fitting recess 14 such that the core piece 11 faces the outside of the case 42 (not shown). Core piece 1
Various kinds of data regarding the inspection object 41 are stored in the memory 1 and data is exchanged between the antenna coil 3 on the core piece 11 side and the antenna coil 36 on the reader / writer side via the wall of the case 42. . Therefore, in this embodiment, the case 42 itself serves as a non-contact communication type information carrier.

FIG. 20 is a diagram showing a fourth embodiment of the present invention. In this embodiment, the core piece 11 is placed in the card 43.
It shows an example in which is embedded. Card 43 has the same shape 2
It is configured by sticking together a half of a card through the core piece 11. The core piece 11 is installed at an intermediate position between the two opposing long sides 43a and 43b of the card 43 and near the insertion direction X into the reader / writer.

FIG. 21 is a diagram showing a fifth embodiment of the present invention. This embodiment is different from the fourth embodiment in that the core piece 11 is installed at an intermediate position between two opposing short sides 43c and 43d of the card 43 and near the insertion direction X into the reader / writer. That is the point.

FIG. 22 is a diagram showing a sixth embodiment of the present invention. The difference of this embodiment from the fourth embodiment is that the core piece 11 is installed at the central position of the card 43.

The core piece 11 and the card 43 are integrated as follows.
It is also possible to integrally form the card including the core piece fitting recessed portion by an injection molding method or the like instead of the two bonded shapes, and then fit the core piece into the fitting recessed portion.

In the above-described embodiment, the caulked portion is formed in the core piece body, and the IC chip is thereby carried in the recess. However, the IC chip may be simply fitted and carried in the recess without forming the caulked portion. It is possible.

The contactless communication type information carrier according to the present invention is the token, card, DNA chip, or the like described in the above embodiment.
It is applicable to various industrial fields, not limited to cases that store various test objects such as test tubes and test pieces.

For example, a connector portion of an electronic card such as a PC card standard or a CompactFlash (registered trademark) standard
Frame / case, pen-type pointing device tip, LAN cable or optical cable splice connector, automobile key, optical disk / magnetic disk / tape media case, media itself, etc. It is possible to realize the application by embedding in the.

[0047]

According to the core piece for a non-contact communication type information carrier of the present invention, the IC chip on which the antenna coil is formed is inserted into the recess formed in the core piece body and carried, so that the coil forming surface can be protected. Along with this, it can be made into a size that is easy to handle and can be packed in bags or supplied by a parts feeder. Further, since the outer periphery of the IC chip is locked by the caulking portion formed at the opening end of the recess of the core piece body, the IC chip is prevented from being unduly stressed and can be prevented from cracking or chipping.

Further, in the core piece for a non-contact communication type information carrier of the present invention, since the notch portion is provided in the crimping margin for forming the crimping portion, the crimping portion having no wrinkle can be formed, and the crimping portion of the core piece main body can be formed. Even if the shape of the IC chip becomes small, the IC chip can be securely fixed.

Further, in the core piece for non-contact communication type information carrier of the present invention, since the thin portion is partially provided in the crimping margin for forming the crimped portion, the crimped portion without wrinkles can be formed and the core piece main body can be formed. Even if the shape of the IC chip becomes smaller than the recess, the IC chip can be securely fixed.

Further, in the core piece for a non-contact communication type information carrier of the present invention, the IC chip is arranged in the recess of the core piece body so that the antenna coil faces the bottom of the core piece body. Can be done.

Further, in the core piece for a non-contact communication type information carrier of the present invention, the core piece body is made of a transparent material, so that the mounting state of the IC chip can be confirmed from the outside, which is convenient.

[Brief description of drawings]

FIG. 1 is a plan view of a core piece for a non-contact communication type information carrier according to a first exemplary embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA in FIG.

FIG. 3 is an enlarged perspective view of an IC chip integrally formed with an antenna coil used for the core piece.

FIG. 4 is an enlarged plan view of the IC chip.

FIG. 5 is a plan view for explaining a step of mounting the IC chip on the core piece body.

FIG. 6 is a cross-sectional view for explaining a step of mounting the IC chip on the core piece body.

FIG. 7 is a cross-sectional view showing a modified example of the core piece for a non-contact communication type information carrier.

FIG. 8 is a plan view showing a state before the core piece is attached to the token.

FIG. 9 is a plan view showing a state after the core piece is attached to the token.

FIG. 10 is an enlarged cross-sectional view taken along the line BB of FIG.

FIG. 11 is a plan view of a non-contact communication type information carrier IC chip according to a second embodiment of the present invention.

FIG. 12 is an enlarged view of part C in FIG.

FIG. 13 is a plan view of a core piece body used for the non-contact communication type information carrier.

FIG. 14 is a front view in which a part of the core piece body is cut.

FIG. 15 is a plan view of a core piece.

FIG. 16 is a front view in which a part of the core piece is cut.

FIG. 17 is a block diagram showing a data transmission system of a non-contact communication type information carrier, a reader / writer, and a host computer.

FIG. 18 is a perspective view showing a correspondence relationship between an antenna coil on the information carrier side and an antenna coil on the reader / writer side.

FIG. 19 is a sectional view of a case (non-contact communication type information carrier) according to the third embodiment of the present invention.

FIG. 20 is a plan view of a card (contactless communication type information carrier) according to a fourth embodiment of the present invention.

FIG. 21 is a plan view of a card (contactless communication type information carrier) according to a fifth embodiment of the present invention.

FIG. 22 is a plan view of a card (contactless communication type information carrier) according to a sixth embodiment of the present invention.

[Explanation of symbols]

1 IC chip 1a-1d IC chip corners 3 antenna coil 5 core piece body 6 recess 7 Caulking fee 8 Ultrasonic welding horn 9 Caulking part 10 adhesive 11 core pieces 12 bottom 13 tokens 14 Fitting recess 31 Non-contact communication type information carrier 42 cases 43 cards D Core Pis Body Recess Diameter Diagonal length of LIC chip Center of O1 IC chip O2 Antenna coil winding center O3 Corepis body center O4: The center of the token

Continuation of the front page (56) Reference JP-A-7-146922 (JP, A) JP-A-2001-34725 (JP, A) JP-A-10-193849 (JP, A) Actual development 3-29250 (JP, U) Tokuyo HEI 6-510364 (JP, A) Registered utility model 3008939 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) G06K 19/00-19/18 B42D 15/10

Claims (5)

(57) [Claims] 1. An insulating layer formed on a circuit formation surface of an IC chip, and a through hole formed in the insulating layer,
An IC chip formed on the insulating layer and having an antenna coil electrically connected to the circuit formed on the circuit forming surface through the through hole is inserted into the recess of the core piece body, and A core piece for a non-contact communication type information carrier, wherein an outer periphery of an IC chip is locked by a caulking portion formed at an opening end of a recess of a core piece body. 2. The core piece according to claim 1, wherein
A core piece for a non-contact communication type information carrier, wherein a notch portion is provided in a crimping margin for forming the crimped portion. 3. The core piece according to claim 1, wherein
A core piece for a non-contact communication type information carrier, wherein a thin portion is partially provided in a crimping margin for forming the crimped portion. 4. The core piece according to claim 1, wherein
A core piece for a non-contact communication type information carrier, wherein an IC chip is arranged in the recess so that the antenna coil faces the bottom of the core piece body. 5. The core piece according to claim 1, wherein
A core piece for a non-contact communication type information carrier, wherein the core piece body is made of a transparent material.