JP3385405B2 - Plating method and plating apparatus for long side copper plate of continuous casting mold - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for plating a continuous casting mold used for manufacturing slabs and the like, and more specifically, a pair of long sides so as to form a rectangular casting opening. The present invention relates to a method and apparatus for plating a long-side copper plate in a continuous casting mold in which a pair of short-side copper plates are movably sandwiched between copper plates.

[0002]

2. Description of the Related Art A continuous casting mold for steel plays a role of cooling the surface of molten steel passing therethrough and forming a thin film called a shell layer. For this reason, a plate made of copper or a copper alloy having excellent heat dissipation (hereinafter collectively referred to as "copper plate") is used as the mold, and a back frame supporting the outer surface side of the copper plate is further used. Water is passed to improve heat dissipation. Since the copper plate is soft, the inner surface of the mold is usually coated with a nickel-based alloy plating layer to prevent abrasion due to sliding of the shell layer.If this plating layer is damaged due to use, repair by plating again. It is carried out.

Such a continuous casting mold has a structure in which a pair of short side copper plates are movably sandwiched between a pair of long side copper plates by fastening means such as bolts for fastening a pair of back frames. However, it is conventionally known. When applying a plating layer to this mold, the copper plate on each side can be removed from the back frame and immersed in the plating solution tank, or it can be immersed in the plating solution layer together with the back frame supporting each copper plate on each side. It was done.

[0004]

However, the conventional plating method described above has the following problems.
That is, when the copper plate used as the mold is removed from the back frame, the copper plate is often distorted, so that there is a problem in that the copper plate cannot be accurately attached to the back frame. In particular, recently, since there is a tendency to reduce the thickness of a copper plate so as to cope with high-speed casting in continuous casting, the residual strain on the copper plate is large and it is very difficult to remove it. Therefore, when the copper plate once removed from the back frame is attached to the back frame again, there is a problem in that the copper plate may crack due to distortion or the copper plate may crack.

On the other hand, when the copper plate is plated while being supported by the back frame, such a problem does not occur, but in order to prevent unnecessary plating from depositing on the back frame, and It is necessary to mask the entire back frame in order to prevent the plating solution from being contaminated by oils, fine iron powder, etc. adhering to the. In this case, a large amount of masking material is required for the back frame that supports the copper plate, which not only costs a lot of money, but also causes a problem of discarding a large amount of peeled masking material. Further, since there are many protrusions such as bolts on the back frame, it is difficult to perform masking without gaps. Therefore, it is possible to reliably prevent plating deposition and plating solution contamination at unnecessary plating points. There was a problem that I could not. Furthermore, if the required amount of masking material is large,
There is a problem that the masking work is very complicated and takes time.

Further, not only the copper plate, but also the back frame and the water pipes attached to the back frame must be integrally immersed in the plating solution tank, so that a large plating solution tank is required. Therefore, an extra plating solution must be used, which is uneconomical.

The problem of requiring a large amount of such a masking material and a plating solution has become remarkable especially in the case of plating a long side copper plate, and there has been a demand for improvement in the past.

The present invention has been made to solve the above problems, and plating can be easily performed on a long-side copper plate without causing contamination of the plating solution.
An object of the present invention is to provide a plating method for a casting mold for continuous casting and a plating apparatus capable of reducing the required amount of plating solution.

[0009]

The above object of the present invention is to provide a continuous casting mold in which a pair of short side copper plates are movably sandwiched between a pair of long side copper plates so as to form a rectangular casting opening. In the method of plating the long side copper plate, the pair of long side copper plates are erected so as to be horizontal in a longitudinal direction with the pair of long side copper plates attached to a back frame, and the pair of dummies made of a non-conductive material. A plate composed of a pair of the long side copper plates and a pair of the dummy plates by liquid-tightly sandwiching the plate between the back frames in a state where the inner surfaces are in contact with the upstanding end faces of the long side copper plate, respectively. Forming a tubular body, placing the tubular body on a base in a liquid-tight manner, holding a plating solution inside the tubular body, and holding the anode member so as to face the long side copper plate. Immerse in the plating solution, and use the long side copper plate as a cathode Is achieved by the plating method of the long side copper plates of a continuous casting mold, characterized in that to perform.

In this plating method, an upper contact plate and a lower contact plate having substantially the same length as the longitudinal direction of the long-side copper plate are attached in contact with the upper and lower end faces of the long-side copper plate, respectively. The cylindrical body is mounted on the base in a liquid-tight manner via a lower contact plate, and at least a portion of the cylindrical inner surfaces of the upper contact plate and the lower contact plate which contact the long side copper plate. Is preferably a conductive portion extending along the longitudinal direction of the long-side copper plate, and a conductive tape is preferably attached to the erected edge of the cylindrical inner surface of the long-side copper plate.

Further, in this plating method, it is preferable that the plating solution is supplied from above the cylindrical body and circulated.

The object of the present invention is also to provide a continuous casting mold in which a pair of short side copper plates are movably sandwiched between a pair of long side copper plates so as to form a rectangular casting opening. An apparatus for plating a copper plate, comprising a pair of back frames to which the long side copper plate is attached, a pair of dummy plates made of a non-conductive material, and the long side copper plate standing upright in a horizontal direction. Then, the pair of dummy plates,
Liquid-tightly sandwiching between the back frames so that both upright end surfaces of the long-side copper plate come into contact with the inner surface to form a tubular body composed of the pair of long-side copper plates and the pair of dummy plates. Holding means, a base on which the tubular body is placed in a liquid-tight manner so that the plating solution can be held inside the tubular body, and the tubular body facing the long side copper plate. A long side of a continuous casting mold, comprising an anode member housed inside, and a power supply device having an anode side terminal connected to the anode member and a cathode side terminal connected to the long side copper plate. This is achieved by a copper plate plating apparatus.

This plating apparatus further comprises an upper abutment plate and a lower abutment plate which have substantially the same length as the longitudinal direction of the long side copper plate and are attached to the upper and lower ends of the long side copper plate, respectively. At least the contact portion side with the long side copper plate in the cylindrical inner surface of the contact plate and the lower contact plate, preferably a conductive portion extending along the longitudinal direction of the long side copper plate,
It is preferable to attach a conductive tape to the erected edge of the cylindrical inner surface of the long-side copper plate.

Further, in this plating apparatus, a plating solution outlet is formed on the base, one end side of which is connected to the outlet and the other end side of which is opened above the tubular body, and the pipe is provided through the pipe. It is preferable that a pump for circulating the plating solution inside the tubular body and a filter for filtering the plating solution passing through the pipe are further provided.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a method for plating a continuous casting mold and a plating apparatus according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a perspective view showing a part of a plating apparatus according to an embodiment of the present invention with a part thereof omitted, and FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is a block diagram showing the overall configuration of the plating apparatus according to the embodiment of the present invention.

The plating apparatus 1 is an apparatus for plating a long side copper plate in a continuous casting mold in which a pair of short side copper plates are movably sandwiched between a pair of long side copper plates, and as shown in FIG. , A pair of back frames 10, 10 supporting the pair of long side copper plates L, L, and a pair of dummy plates 12, 12, and further, the dummy plates 12, 12 are provided between the back frames 10, 10 on both sides. It is provided with a plurality of fastening bolts 14 and nuts (not shown) as a holding means for holding in a liquid-tight manner. In addition, in FIG. 1, a pair of back frames 1
Only one of the 0, 10 and the dummy plates 12, 12 is shown and the other is omitted, and the fastening bolt 14 is also shown only on one side of the back frame 10, 10. Illustration of those on the side is omitted. The long-side copper plate L also includes a plate made of a copper alloy as described above.

The back frame 10 is a block-shaped member made of steel or the like, and the back side of the long side copper plate L is attached thereto by bolts (not shown). A plurality of through holes 11 through which the fastening bolts 14 are inserted are formed on both sides of the back frame 10. The dummy plate 12 is, for example, a non-conductive FRP reinforced with glass fiber or alumina fiber.
It is a flat member made of a non-conductive material such as (fiber reinforced plastic). As the material of the dummy plate 12, in addition to this, plastics such as vinyl chloride that can impart strength, or a metal plate such as iron is coated with a polymer material such as vinyl chloride to provide electrical insulation. The added one can be exemplified.

As shown in FIGS. 1 and 2, the plating apparatus 1 includes an upper contact plate 20 and a lower contact plate 22, which are attached to the upper and lower ends of the long side copper plate L, respectively, and a base 30.
Is equipped with. Note that, in FIG. 1, only the upper abutment plate 20 and the lower abutment plate 22 attached to one illustrated long side copper plate L of the pair of long side copper plates L, L are shown, and the other long side copper plate L is shown. Upper contact plate 2 attached to side copper plate L
0 and the lower contact plate 22 are omitted.

The upper abutting plate 20 and the lower abutting plate 22 are block-shaped members having substantially the same horizontal (longitudinal) length as the long side copper plate L, and a sealing material (not shown) is interposed therebetween. It is attached to the upper and lower ends of the long side copper plate L by bolts (not shown). Examples of the material of the upper abutment plate 20 and the lower abutment plate 22 include conductive materials such as iron, copper and nickel. Further, as the sealing material, a material having flexibility, resistance to plating solution and heat resistance such as silicone rubber, fluororubber, polyester and polypropylene can be used, and the same applies to the following sealing materials.

The base 30 is a casing having a recovery port 32 on the upper surface and an outlet 34 and a discharge valve (not shown) on the side surface. The base 30 is preferably made of a non-conductive material that has high strength so as to withstand the liquid pressure of the plating solution, has resistance to the plating solution. Specifically, heat-resistant vinyl chloride, a plate material made of a polymer material such as FRP or PTFE (polytetrafluoroethylene), or those whose back side is reinforced with a reinforcing material made of the same kind of material or metal, The base 30 can be configured.

As shown in FIG. 2, the plating apparatus 1 also includes a pair of anode plates 40, 40 and a power supply device 42 for forming a plating current. The pair of anode plates 40, 40 are provided in parallel with the pair of long side copper plates L, L at regular intervals, and are divided into a plurality along the longitudinal direction. Each anode plate 40 used during plating
For example, a titanium anode case containing the same metal as the plating metal and covered with a cloth anode bag, or a plate of the same metal as the plating metal is directly hung on the bus bar and covered with the anode bag is used. be able to. The anode plate during degreasing can be a flat plate such as iron or SUS, or a mesh plate. The power supply device 42 is the anode plate 4
It is a DC power supply having an anode side terminal and a cathode side terminal which are electrically connected to the 0, 40 and the long side copper plates L, L respectively via conducting wires and the like.

As shown in the block diagram of FIG. 3, the plating apparatus 1 is equipped with a pipe 50, one end of which is connected to the outlet 34 of the base 30 and the other end of which is open above the tubular body T. Further, the filter 5 provided in the middle of the pipe 50
2, circulation pump 54, shut-off valve 56 and plating solution tank 6
It has 0. The plating solution tank 60 is provided with a replenishment tank 62, a stirring pump 64, and a heater (not shown) so that the composition, pH, temperature, etc. of the plating solution can be adjusted.

Although not shown in FIG. 3, a pretreatment liquid tank and a washing water source are provided together with the plating liquid tank 60, and the pretreatment liquid and the plating liquid are switched by switching a valve (not shown). Any of the cleaning water can be circulated through the tubular body T.

Next, with this plating apparatus 1, the long side copper plate L
A method of plating the metal will be described. First, with the long-side copper plate L attached to the back frame 10, the stains, the remaining plating film, the unevenness, and the like attached to the inner surface of the long-side copper plate L are removed by dissolving or polishing with a chemical. Then, as shown in FIG. 1, a conductive tape (fog-prevention) 70 is attached to the longitudinal edge of the inner surface of the long-side copper plate L. The conductive tape 70 preferably has adhesiveness with the plating to such an extent that the plating deposited on the surface does not separate and peel off, and, for example, one based on iron, aluminum, copper or the like can be used. The width of the conductive tape 70 may be determined in consideration of the type of plating solution, the current density, the range used as a mold, etc., but generally 5 to 15
mm, preferably 7 to 12 mm.

Next, the upper contact plate 20 and the lower contact plate 2
A strip-shaped conductive portion is provided on the inner surface of 2 on the contact portion side with the long-side copper plate L. When the upper contact plate 20 and the lower contact plate 22 are made of a conductive material, as shown in FIGS. 1 and 2, the inner surface of the upper contact plate 20 and the lower contact plate 22 is covered with a non-conductive tape. By masking by sticking, applying a non-conductive paint, attaching a non-conductive plate material, or the like, the unmasked remaining portion can be the conductive portion 72. On the other hand, the upper contact plate 20 and the lower contact plate 22
When is made of a non-conductive material, the conductive portion can be formed by attaching a conductive tape, applying a conductive paint, or attaching a conductive plate. As the conductive material,
As with the conductive tape 70 described above, it is preferable to use iron, aluminum, copper or the like.

By providing the conductive portion 72 in this way, it is possible to prevent the current density from increasing at the upper and lower edges of the long-side copper plate L, and to make the plating thickness on the inner surface of the long-side copper plate uniform in the vertical direction. . The width of the conductive portion 72 is 30 mm to 70
mm is preferable, and more preferably 30 mm-
It is 50 mm. If the width of the conductive portion 72 is too small, the effect of making the plating thickness uniform due to the provision of the conductive portion 72 is weakened, and the upper and lower edges of the long-side copper plate L are thicker than the other plated portions. When used as a mold, there is a tendency that the short side interferes with the thick wall portion and becomes immovable, or the molten steel that has penetrated into the gap with the short side is solidified and the short side is fixed. On the other hand, if the width of the conductive portion is too large, unnecessary portions are plated to prevent the above-mentioned adverse effects, resulting in waste of the plating solution.

Next, the lower contact plate 22 is attached to one end of the long-side copper plate L in the up-down direction via a sealing material. And
By sandwiching the pair of dummy plates 12, 12 with the fastening bolts 14 between the pair of back frames 10, 10 with the left and right ends of the long-side copper plates L, L contacting the inner surfaces, respectively, Long-side copper plates L, L and a pair of dummy plates 1
A rectangular tubular body T composed of 2, 12 is formed. When the plating apparatus 1 is used for repairing the plating layer of the long side copper plate L,
The back frame 10 for cooling the long side copper plate and the fastening bolts for sandwiching the short side copper plate used when the mold is used are used as they are for the back frame 10 and the fastening bolts 14 of the plating apparatus 1.
Can be used as, and the plating operation can be performed efficiently.

Then, at the other end of the long side copper plate L in the vertical direction,
After the upper contact plate 20 is attached via the seal material, the tubular body T is placed on the upper surface of the base 30 via the seal material so that the lower contact plate 22 faces downward. The tubular body T is brought into close contact with the base 30 by its own weight, and it becomes possible to hold the pretreatment liquid, the plating solution, etc. inside the tubular body T.

After the preparation for the plating work is completed,
The pretreatment liquid stored in the pretreatment liquid tank (not shown) is circulated through the tubular body T to perform pretreatment of the long-side copper plate L such as alkali degreasing, pickling and electrolytic degreasing. After finishing the pre-processing,
The pretreatment liquid is discharged from a discharge valve (not shown) on the base.

Next, by switching the valve (not shown), washing water is supplied from the water source for washing to the cylindrical body T to sufficiently wash the long side copper plate, the dummy plate and the upper and lower jigs. This wash water is discharged from a discharge valve (not shown) on the base.

Then, by switching the valve (not shown), the plating solution in the plating solution tank is circulated through the tubular body T. The composition, pH, temperature, etc. of the plating solution can be adjusted in the plating solution tank, and the liquid level height of the tubular body T can be adjusted by moving the plating solution tank up or down or by plating the plating solution tank. This can be done by adjusting the liquid volume. As the plating solution, various known plating solutions may be used, such as Ni, Ni-P, Ni-B, and Ni-C.
o, Co, Cr, Ni-Fe, Ni-W, Ni-Co-
It is possible to perform plating of W, Co-W, Ni-P-W, Ni-B-W and the like.

After that, the power supply device 42 is operated to supply a voltage with the positive plate 40 positive and the long side copper plate L negative, and the long side copper plate L is set under predetermined conditions such as temperature, current density, and energization time. The plating is deposited on the inner surface of the. Generally, when plating a flat plate, the current density at the edge is large, so the plating thickness at the edge becomes thicker. However, in the plating apparatus 1 according to the present invention, the upper contact plate 20 and the lower contact plate 22 are electrically conductive. Since the portion 72 is provided, a thick plating is formed on the conductive portion 72, and the plating thickness at the upper and lower edges of the long-side copper plate L can be made substantially the same as the other plated portions. Further, thicker plating is formed on the left and right edge portions of the long-side copper plate L to which the conductive tape 70 is attached than the other plated portions. It can be easily removed by peeling off the tape. As a result, the thickness of the plating layer applied to the long-side copper plate can be made uniform over the entire long-side copper plate.

[0033]

Example: For a pair of long side copper plates in a continuous casting mold,
The plating was carried out by the method according to the invention. The long side copper plate has a length of 1800 mm, a height of 950 mm, and a thickness of 45 mm,
The back frame on which this long side copper plate is set has a length of 2
The size is 500 mm, the height is 950 mm, and the thickness is 300 mm.

First, the oil adhering to the back frame and the long side copper plate was incinerated by a flame, and dust, rust and the like were removed manually by a wire brush.

Next, 10 m is applied to both ends of the long side copper plate in the longitudinal direction.
An iron conductive tape having a width of m was applied to prevent fogging. Then, an iron abutment plate was placed on the upper part of the long-side copper plate via a sealing material, and fixed with bolts from above. Contact plate is 10
A square cross section having a length of 0 × 100 mm and a longitudinal length substantially the same as that of the long-side copper plate were used.

Then, the base was manufactured as follows.
That is, a frame was formed by combining H steels, and after confirming the horizontalness of the upper surface, an iron plate having a thickness of about 10 mm was placed, and further an FRP plate was placed thereon. It should be noted that the iron plate and the FRP plate are preliminarily formed with through holes to which liquid drain pipes are attached, and
The through hole of the RP plate can be opened and closed by a valve.

Next, using a pair of long side copper plates and a pair of FRP dummy plates, a tubular body was formed as follows. 1) One long side copper plate is placed with the attached contact plate facing down. 2) Dummy plates are attached to both ends of the long side copper plate in the longitudinal direction with a sealing material interposed therebetween. 3) Place the other long side copper plate with the attached contact plate facing down. 4) Align the other long side copper plate and the dummy plate,
Secure the dummy plate by tightening the long side copper plates together with the tightening bolts.

After forming the tubular body in this manner, another contact plate is attached to the upper part of the long-side copper plate via a seal material,
The contact plate and the back frame were electrically connected. This contact plate has a height of 200 mm and a width of 10 mm, and uses an iron plate whose length in the longitudinal direction is substantially the same as that of the long-side copper plate, and covers the long-side copper plate side with a non-conductive material other than a strip-shaped region having a height of 10 mm. As a result, it was made to prevent fogging.

Next, this cylindrical body was vertically placed on a base through a sealing material to form a tank, which was connected to an external tank by piping. Then, electrolytic degreasing was performed by supplying a degreasing liquid from an external tank into this tank and immersing and applying a stainless electrode. The electrolytic degreasing conditions were known.

After electrolytic degreasing, the liquid was returned to the external tank, the electrodes and the like were removed, and the inside of the tank was washed with clean water. afterwards,
A screen electrode was used as an electrode for plating, and a known nickel sulfamate plating solution was supplied from an external tank to perform plating at a current density of 3 A / dm ² for 8 hours after the temperature in the tank reached 55 ° C. After that, the plating solution was discharged, the tank was disassembled, and the plating thickness of the long-side copper plate was measured. As a result, a uniform thickness was obtained over the entire plated portion. Furthermore, compared with the case where the long side copper plate is plated with the same thickness by the conventional method of immersing the long side copper plate together with the back frame in the plating solution tank,
The amount of plating solution used was about 30%, the amount of masking material used was about 5%, and the required plating time was about 40%.

[0041]

As is apparent from the above description, according to the plating method and the plating apparatus for a long side copper plate of a continuous casting mold according to the present invention, a cooling bag for supporting the long side copper plate when the mold is used. The frame can be used for plating work with the long side copper plate attached, and the holding means for holding the short side copper plate can be used as it is as the holding means for the dummy plate. Therefore, the cost of the device can be reduced and the work efficiency can be improved.

Further, since a tubular body is formed by a pair of long-side copper plates and a pair of dummy plates, and plating is performed with the plating solution stored inside the tubular body, the long sides together with the back frame are conventionally formed. The required amount of the plating solution can be reduced as compared with the case where the copper plate is immersed in the plating bath. Furthermore, since the plating solution does not come into contact with the back frame or the like that does not require plating, the plating solution is less contaminated and the conventional complicated masking work is unnecessary.

Further, since the dummy plate can be of any size, the volume of the cylindrical body can be adjusted regardless of the size of the long side copper plate by appropriately selecting it according to the size of the long side copper plate. Can be constant. Therefore, like the conventional plating tank, the amount and concentration of the plating solution inside the tubular body can be easily controlled.

When an upper contact plate and a lower contact plate each having a conductive portion are attached to the upper and lower ends of the long-side copper plate, the plating thickness on the inner surface of the long-side copper plate is made uniform along the vertical direction. Further, when the conductive tape is attached to the left and right edges of the long-side copper plate, the plating thickness on the inner surface of the long-side copper plate can be made uniform along the left-right direction.

When the plating solution is circulated by supplying the plating solution from above the tubular body and discharging it from the outlet of the base on which the tubular body is placed, A plating solution flows from the upper part to the lower part inside the plate. Therefore, the floating substances in the plating liquid are easily discharged from the discharge port by this liquid flow, and it is possible to prevent the occurrence of plating roughness (adhesion failure).

[Brief description of drawings]

FIG. 1 is a perspective view showing a part of a principal part of a plating apparatus according to an embodiment of the present invention with a part thereof omitted.

FIG. 2 is a cross-sectional view taken along the line AA of FIG.

FIG. 3 is a block diagram showing an overall configuration of a plating apparatus according to an embodiment of the present invention.

[Explanation of symbols]

1 Plating equipment 10 back frame 12 dummy board 14 Fastening bolt 20 Upper contact plate 22 Lower contact plate 30 base 32 Collection port 34 Outlet 40 Anode plate 42 power supply 50 piping 52 Filter 54 Circulation pump 56 shut-off valve 60 plating solution tank 70 Conductive tape 72 Conductor L long side copper plate T tubular body

Claims (8)

(57) [Claims] 1. A method for plating a long-side copper plate in a continuous casting mold in which a pair of short-side copper plates are movably sandwiched between a pair of long-side copper plates so as to form a rectangular casting opening. In this case, the pair of long side copper plates are erected so that the longitudinal direction thereof is horizontal in a state where they are attached to the back frame, and a pair of dummy plates made of a non-conductive material is used, and the inner surface of the pair of long side copper plates is erected. By sandwiching them in a liquid-tight manner between the back frames in a state where they are in contact with both end faces, respectively, a tubular body composed of the pair of long side copper plates and the pair of dummy plates is formed. Placed liquid-tight on the base, holding the plating solution inside the tubular body, immersing the anode member in the plating solution so as to face the long-side copper plate, the long-side copper plate Continuous casting characterized by electroplating as a cathode The plating method of the long side copper plate of the mold. 2. An upper contact plate and a lower contact plate having substantially the same length as the longitudinal direction of the long side copper plate are attached in a state of being in contact with the upper and lower end surfaces of the long side copper plate, respectively. The cylindrical body is placed on the base in a liquid-tight manner via the, and at least the contact portion side with the long side copper plate on the cylindrical inner surfaces of the upper contact plate and the lower contact plate is the long side. The method for plating a long-side copper plate of a continuous casting mold according to claim 1, wherein the conductive part extends along the longitudinal direction of the side-copper plate. 3. The method of plating a long-side copper plate of a continuous casting mold according to claim 1, wherein a conductive tape is attached to the erected edge of the cylindrical inner surface of the long-side copper plate. . 4. The method for plating a long side copper plate of a continuous casting mold according to claim 1, wherein a plating solution is supplied from above the cylindrical body and circulated. 5. An apparatus for plating a long side copper plate in a continuous casting mold in which a pair of short side copper plates are movably sandwiched between a pair of long side copper plates so as to form a rectangular casting opening. There, a pair of back frames to which the long side copper plate is attached, a pair of dummy plates made of a non-conductive material, and the long side copper plate are erected so that the longitudinal direction is horizontal, and the pair of dummy plates. By liquid-tightly sandwiching between the back frames so that both end surfaces of the long side copper plate standing up against the inner surface respectively come into contact with each other, thereby forming a cylindrical body composed of the pair of long side copper plates and the pair of dummy plates. And a base on which the tubular body is placed in a liquid-tight manner so that a plating solution can be held inside the tubular body, and the tubular shape that faces the long side copper plate. An anode member housed inside the body, and the anode part A plating device for a long side copper plate of a continuous casting mold, comprising: a power source device having an anode side terminal connected to a material and a cathode side terminal connected to the long side copper plate. 6. The upper contact plate further has an upper contact plate and a lower contact plate that have substantially the same length as the longitudinal direction of the long-side copper plate and are attached to the upper and lower ends of the long-side copper plate, respectively. The continuous portion according to claim 5, wherein at least a contact portion side of the lower contact plate with the long side copper plate on the cylindrical inner surface is a conductive portion extending along the longitudinal direction of the long side copper plate. Plating equipment for long side copper plate of casting mold. 7. The plating device for a long side copper plate of a continuous casting mold according to claim 5, wherein a conductive tape is attached to an upstanding edge portion of the cylindrical inner surface of the long side copper plate. . 8. A pipe having an outlet for a plating solution formed on the base, one end side of which is connected to the outlet and the other end of which is open above the tubular body, and the tubular body through the pipe. The long side copper plate of the continuous casting mold according to any one of claims 5 to 7, further comprising a pump for circulating the plating solution inside, and a filter for filtering the plating solution passing through the inside of the pipe. Plating equipment.