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JP3351265B2 - Aromatic polyimide film and copper foil laminated film - Google Patents

Aromatic polyimide film and copper foil laminated film

Info

Publication number
JP3351265B2
JP3351265B2 JP28189596A JP28189596A JP3351265B2 JP 3351265 B2 JP3351265 B2 JP 3351265B2 JP 28189596 A JP28189596 A JP 28189596A JP 28189596 A JP28189596 A JP 28189596A JP 3351265 B2 JP3351265 B2 JP 3351265B2
Authority
JP
Japan
Prior art keywords
aromatic polyimide
film
polyimide film
curl
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP28189596A
Other languages
Japanese (ja)
Other versions
JPH1077353A (en
Inventor
敬 河野
明範 大谷
敏徳 細馬
浩 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP28189596A priority Critical patent/JP3351265B2/en
Publication of JPH1077353A publication Critical patent/JPH1077353A/en
Application granted granted Critical
Publication of JP3351265B2 publication Critical patent/JP3351265B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ポリマー構成単位
としてビフェニルテトラカルボン酸成分とパラフェニレ
ンジアミン成分を必須成分として含む芳香族ポリイミド
からなるテープ状の芳香族ポリイミドフィルム、そして
その芳香族ポリイミドフィルムを用いた銅箔積層フィル
ムに関するものである。本発明は特に、ビフェニルテト
ラカルボン酸二無水物またはその誘導体とパラフェニレ
ンジアミンとを含有する芳香族ポリイミド前駆体(例え
ば、芳香族ポリアミック酸)の溶液を使用して、溶液流
延法によって製膜して得られる、種々の環境下でも優れ
た寸法安定性を有する芳香族ポリイミドフィルムであっ
て、特に高密度パターン化や半導体実装時の位置合わせ
を容易にする、長尺状の芳香族ポリイミドフィルムに関
するものである。
TECHNICAL FIELD The present invention relates to a tape-shaped aromatic polyimide film comprising an aromatic polyimide containing a biphenyltetracarboxylic acid component and a paraphenylenediamine component as essential components as polymer constituent units, and an aromatic polyimide film comprising the same. It relates to the used copper foil laminated film. In particular, the present invention uses a solution of an aromatic polyimide precursor (for example, aromatic polyamic acid) containing biphenyltetracarboxylic dianhydride or a derivative thereof and paraphenylenediamine to form a film by a solution casting method. Aromatic polyimide film having excellent dimensional stability even under various environments obtained by, especially, a long aromatic polyimide film that facilitates high-density patterning and alignment during semiconductor mounting It is about.

【0002】[0002]

【従来の技術】芳香族ポリイミドフィルムは、耐熱性、
耐寒性、耐薬品性、電気絶縁性、機械的強度等において
優れた特性を有することから、種々の分野で広く利用さ
れている。なかでも、ビフェニルテトラカルボン酸成分
とパラフェニレンジアミン成分とからなる芳香族ポリイ
ミドフィルムは、特に耐熱性や機械的強度が高いことが
知られている。従って、このようなタイプの芳香族ポリ
イミドフィルムは、特にその優れた耐熱性、機械的強度
に着目した場合、フレキシブルプリント配線用銅張基板
(FPC)やテープ・オートメーテッド・ボンディング
(TAB)用キャリアテープなどの製造に用いる支持体
として適しているということができる。
2. Description of the Related Art Aromatic polyimide films have high heat resistance,
Because of its excellent properties such as cold resistance, chemical resistance, electrical insulation, and mechanical strength, it is widely used in various fields. Above all, it is known that an aromatic polyimide film composed of a biphenyltetracarboxylic acid component and a paraphenylenediamine component has particularly high heat resistance and mechanical strength. Accordingly, when such an aromatic polyimide film is particularly focused on its excellent heat resistance and mechanical strength, a carrier for a flexible printed wiring copper-clad board (FPC) or a tape automated bonding (TAB) carrier is required. It can be said that it is suitable as a support used in the production of tapes and the like.

【0003】しかし、このポリイミドフィルムが使用さ
れる前記分野では、高精度、高生産性への要求が益々厳
しくなり、金属箔(通常は銅箔)とポリイミドフィルム
とを接着剤で積層した積層体の走行安定性、該積層体の
カール発生の問題、リードの歪みが生じることによる位
置合わせの問題が指摘されている。例えば、高精度の要
求の特に厳しいTAB用途では、スプロケット穴をあけ
た35mm幅、70mm幅等のテープ状で加工するた
め、ベースフィルムであるポリイミドフィルムによって
は、積層体の加工時の走行安定性が悪くなり、積層体に
カールが発生し、高密度パターン化や半導体実装の際
に、前記の位置合わせが困難になり、生産性が低くなる
という問題点が指摘されている。
However, in the field where the polyimide film is used, the demand for high precision and high productivity has become more and more severe, and a laminate in which a metal foil (usually a copper foil) and a polyimide film are laminated with an adhesive is used. It has been pointed out that there is a problem of running stability, a problem of curling of the laminate, and a problem of alignment caused by distortion of leads. For example, in TAB applications, where demands for high precision are particularly severe, processing is performed in a tape shape with a sprocket hole of 35 mm width or 70 mm width. It has been pointed out that curling occurs in the laminated body, and the above-described alignment becomes difficult during high-density patterning and semiconductor mounting, resulting in a decrease in productivity.

【0004】このため、ポリイミドフィルムの寸法安定
性、膨張係数に着目して種々の改良がなされている。例
えば、特開昭61−264027号公報や特開昭61−
264028号公報には、芳香族ポリイミドフィルムを
低張力下に再熱処理して、寸法安定性の高い芳香族ポリ
イミドフイルムを製造する方法が記載されている。
For this reason, various improvements have been made focusing on the dimensional stability and expansion coefficient of the polyimide film. For example, JP-A-61-264027 and JP-A-61-264027
Japanese Patent No. 264028 describes a method for producing an aromatic polyimide film having high dimensional stability by reheating an aromatic polyimide film under low tension.

【0005】これらの公知技術によって、寸法精度の高
い芳香族ポリイミドフィルムは得られるようになった
が、そのような芳香族ポリイミドフィルムは、それをテ
ープ状に裁断して、自動化された機械内で、接着剤テー
プを積層し、次いで孔開け加工などの必要な加工処理を
施したのち、その上に銅箔テープを高精度に積層する操
作などが要求されるTAB用テープとしては、必ずしも
充分な信頼性を示すものとはいえない。
[0005] These known techniques have made it possible to obtain aromatic polyimide films with high dimensional accuracy. However, such aromatic polyimide films are cut into tapes and are cut in an automated machine. It is not always sufficient for a TAB tape that requires an operation of laminating an adhesive tape and then performing a necessary processing such as a perforation process, and then laminating a copper foil tape on it with high precision. It does not indicate reliability.

【0006】[0006]

【発明が解決しようとする課題】本発明の目的は、特
に、テープ状に裁断して自動化装置内で走行させ、接着
剤層を介して銅箔などの金属箔を積層する場合に、高精
度での積層を可能にする芳香族ポリイミドフィルムを提
供することにある。本発明は、特にテープ状で孔開けな
どの機械的加工が施されたのちも安定な走行が可能な芳
香族ポリイミドフィルムを提供することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a high-precision, especially when a metal foil such as a copper foil is laminated through an adhesive layer after being cut into a tape shape and run in an automatic device. An object of the present invention is to provide an aromatic polyimide film which can be laminated with a polyimide film. An object of the present invention is to provide an aromatic polyimide film which can be stably run even after a tape-shaped mechanical processing such as perforation is performed.

【0007】[0007]

【課題を解決するための手段】本発明は、ポリマー構成
単位としてビフェニルテトラカルボン酸成分とパラフェ
ニレンジアミン成分を必須成分として含む芳香族ポリイ
ミドからなる、厚みが50〜125μmの範囲にある
状のフィルムであって、引張強度が30kg/mm2
以上、引張弾性率が500kg/mm2以上、50℃か
ら200℃までの昇温下で測定した線膨張係数が2.5
×10-5cm/cm/℃以下、そして200℃で2時間
加熱した時の加熱収縮率が0.05%以下(特に0.0
3%以下)であり、さらに直径が86mmの円板状フィ
ルムとして水平面に対して垂直な方向に配置した時の、
円板の中心点からの円板の縁部との間の水平方向の距離
で表わされるカール度が3mm以下(特に2mm以下)
であって、また幅方向の厚みの最大傾斜が10mm当り
3μm以下(特に0.1〜2.0μm)であることを特
徴とする長尺状の芳香族ポリイミドフィルムにある。
発明の芳香族ポリイミドフィルムの各物性値は、後述の
実施例に際して記載した測定法と条件に従って測定した
物性値である。本発明はまた、上記の芳香族ポリイミド
フィルムが、カールが実質的に測定されない状態では、
そのいずれかの側の表面に、そしてカールが存在してい
る場合には、カール側とは逆側の表面に、接着剤を介し
て銅箔が積層・接合されてなる銅箔積層フィルムにもあ
る。
The present invention SUMMARY OF] is an aromatic polyimide comprising biphenyl tetracarboxylic acid component and p-phenylenediamine component as a polymer constituting unit, length thickness in the range of 50~125μm
A continuous form of the film, the tensile strength of 30kg / mm 2
As described above, the tensile modulus is 500 kg / mm 2 or more, and the coefficient of linear expansion measured at a temperature rise from 50 ° C. to 200 ° C. is 2.5.
× 10 −5 cm / cm / ° C. or less, and a heat shrinkage rate of 0.05% or less when heated at 200 ° C. for 2 hours (especially 0.0
3% or less), and when arranged as a disc-shaped film having a diameter of 86 mm in a direction perpendicular to the horizontal plane,
The degree of curl represented by the horizontal distance from the center point of the disk to the edge of the disk is 3 mm or less (particularly 2 mm or less)
A is also in elongated aromatic polyimide film, wherein the maximum inclination in the width direction of the thickness of 10mm per 3μm or less (particularly 0.1 to 2.0 [mu] m). Book
Each physical property value of the aromatic polyimide film of the invention is described below.
Measured according to the measurement method and conditions described in the examples
It is a physical property value. The present invention also relates to the above-mentioned aromatic polyimide film, in a state where curl is not substantially measured,
On the surface of either side, and if curl is present, on the surface opposite to the curl side, the copper foil laminated film in which copper foil is laminated and joined via an adhesive is there.

【0008】本発明の芳香族ポリイミドフィルムの示す
カール度は、図1に示すような測定装置を利用して決定
することができる。すなわち、図1の測定装置のhが、
カール度を意味し、カール度は、少数点以下を四捨五入
したmm単位で表わす。本発明の芳香族ポリイミドフィ
ルムの厚みの均一性を示す最大傾斜は、長尺状ポリイミ
ドフィルムの幅方向に沿って厚み測定装置で操作して、
図2に示すような厚みのプロファイルを得たのち、その
内の最大の傾斜部分を判定し、その10mm間での最高
値と最低値との差(t)をμm単位で示す。
The curl degree of the aromatic polyimide film of the present invention can be determined by using a measuring device as shown in FIG. That is, h of the measuring device of FIG.
The curl degree means the curl degree in mm units rounded to the decimal point. The maximum slope indicating the uniformity of the thickness of the aromatic polyimide film of the present invention is operated by a thickness measuring device along the width direction of the long polyimide film,
After obtaining the profile of the thickness as shown in FIG. 2, the maximum inclined portion is determined, and the difference (t) between the maximum value and the minimum value within 10 mm is shown in μm.

【0009】本発明の芳香族ポリイミドフィルムの好ま
しい態様を次に示す。 (1)23℃にて24時間放置した場合の吸水率が1.
8%以下(特に0.2〜1.7%)である上記の芳香族
ポリイミドフィルム。 (2)色調を示すL値が25以上、a値が20以下、そ
してb値が18以上(特に、L値が25〜55、a値が
5〜20、b値が18〜35)である上記の芳香族ポリ
イミドフィルム。 (3)残揮発物含有量が0.1〜0.6重量%の範囲に
ある上記の芳香族ポリイミドフィルム。 (4)引張強度が30〜50kg/mm2 の範囲にある
上記の芳香族ポリイミドフィルム。 (5)引張弾性率が600〜1200kg/mm2 の範
囲にある上記の芳香族ポリイミドフィルム。 (6)線膨張係数が0.4×10-5〜2.5×10-5
m/cm/℃(特に1.0×10-5〜2.5×10-5
m/cm/℃で)の範囲にある上記の芳香族ポリイミド
フィルム。 (7)カール度が2mm以下である上記の芳香族ポリイ
ミドフィルム。 (8)芳香族ポリアミド酸溶液を平面基板上に塗布し、
部分的に乾燥固化して自己支持性フィルムを得て、その
自己支持性フィルムを加熱することにより得た芳香族ポ
リイミドフィルムであって、カールが測定されないか、
あるいはカールが平面基板に接していた側にカール度3
mm以下で測定される上記の芳香族ポリイミドフィル
ム。
Preferred embodiments of the aromatic polyimide film of the present invention are as follows. (1) The water absorption when left at 23 ° C. for 24 hours is 1.
The above aromatic polyimide film having a content of 8% or less (particularly 0.2 to 1.7%). (2) The L value indicating the color tone is 25 or more, the a value is 20 or less, and the b value is 18 or more (especially, the L value is 25 to 55, the a value is 5 to 20, and the b value is 18 to 35). The above aromatic polyimide film. (3) The above aromatic polyimide film having a residual volatile matter content of 0.1 to 0.6% by weight. (4) The above aromatic polyimide film having a tensile strength in the range of 30 to 50 kg / mm 2 . (5) The above aromatic polyimide film having a tensile modulus in the range of 600 to 1200 kg / mm 2 . (6) The coefficient of linear expansion is 0.4 × 10 −5 to 2.5 × 10 −5 c
m / cm / ° C. (especially 1.0 × 10 −5 to 2.5 × 10 −5 c
m / cm / ° C). (7) The aromatic polyimide film having a curl degree of 2 mm or less. (8) applying an aromatic polyamic acid solution on a flat substrate,
Obtain a self-supporting film by partially drying and solidifying, an aromatic polyimide film obtained by heating the self-supporting film, or curl is not measured,
Alternatively, a curl degree of 3
The above aromatic polyimide film measured in mm or less.

【0010】本発明の芳香族ポリイミドを製造するため
に使用するビフェニルテトラカルボン酸成分としては、
3,3’,4,4’−ビフェニルテトラカルボン酸の酸
二無水物、エステル化物、ハロゲン化塩やそれらのハロ
ゲン化物などの誘導体を、必要に応じて他の芳香族テト
ラカルボン酸成分と併用して、好適に使用することがで
きるが、特に3,3’,4,4’−ビフェニルテトラカ
ルボン酸二無水物が好ましい。そして、芳香族ジアミン
としては、パラフェニレンジアミンが単独もしくは他の
芳香族ジアミン成分と併用して使用される。
The biphenyltetracarboxylic acid component used to produce the aromatic polyimide of the present invention includes:
Derivatives of 3,3 ', 4,4'-biphenyltetracarboxylic acid, such as acid dianhydrides, esters, halides and halides thereof, may be used in combination with other aromatic tetracarboxylic acid components as required. Thus, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride is particularly preferred. As the aromatic diamine, paraphenylenediamine is used alone or in combination with another aromatic diamine component.

【0011】本発明においては、上記のビフェニルテト
ラカルボン酸成分およびパラフェニレンジアミン成分を
合計で80モル%以上(テトラカルボン酸成分とジアミ
ン成分の合計量を200モル%とした場合)含有させれ
ば、これらの他に、ほかの芳香族テトラカルボン酸成分
および/または芳香族ジアミン成分を、本発明の効果を
損なわない範囲で一種あるいは多種含ませてもよい。併
用可能な芳香族テトラカルボン酸成分としては、ピロメ
リット酸二無水物、各種異性体のベンゾフェノンテトラ
カルボン酸二無水物、各種異性体のナフタレンテトラカ
ルボン酸二無水物などが挙げられる。併用可能な芳香族
ジアミン成分としては、メタフェニレンジアミン、4,
4’−ジアミノジフェニルエーテル、4,4’−ジアミ
ノジフェニルプロパン、4,4’−ジアミノジフェニル
エタン、4,4’−ジアミノジフェニルメタン、4,
4’−ジアミノジフェニルスルフィドなどが挙げられ
る。
In the present invention, if the biphenyltetracarboxylic acid component and the paraphenylenediamine component are contained in a total of 80 mol% or more (when the total amount of the tetracarboxylic acid component and the diamine component is 200 mol%), In addition to these, one or more other aromatic tetracarboxylic acid components and / or aromatic diamine components may be contained as long as the effects of the present invention are not impaired. Examples of the aromatic tetracarboxylic acid component that can be used in combination include pyromellitic dianhydride, various isomers of benzophenone tetracarboxylic dianhydride, and various isomers of naphthalenetetracarboxylic dianhydride. As the aromatic diamine component that can be used in combination, metaphenylenediamine, 4,
4'-diaminodiphenyl ether, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenylethane, 4,4'-diaminodiphenylmethane, 4,
4'-diaminodiphenyl sulfide and the like.

【0012】本発明の芳香族ポリイミドフィルムにおい
て、カール度が前記の範囲を越えると、支持基板、特に
TAB用途においてテープ状での加工時の走行安定性が
悪くなり、さらに、銅箔貼り合わせ時のカールが大きく
なり、高密度パターン化および半導体実装時の位置合わ
せが容易でなくなる。
In the aromatic polyimide film of the present invention, if the curl degree exceeds the above range, the running stability of the support substrate, particularly in the case of TAB, in the processing of a tape is deteriorated. And the alignment during high-density patterning and semiconductor mounting becomes difficult.

【0013】また、厚みむらが前記範囲外になると、幅
広(通常約500mm幅)の芳香族ポリイミドフィルム
を、例えば35mm幅にスリットした後に、35mm幅
のテープを巻き取る際に、35mm幅のテープ(フィル
ム)14巻毎でそれぞれについて張力の不均一が発生
し、35mmテープの巻き状態が両サイドにおいてずれ
が発生しやすく、スリット工程でトラブルの原因とな
り、生産性が落ちる。なお、色調も重要であり、色調が
低下すると、加工時において、反対面が確認できにくく
なり、加工時の高精度の位置合わせがむずかしくなる。
When the thickness unevenness is out of the above range, a wide (usually about 500 mm wide) aromatic polyimide film is slit into, for example, 35 mm width, and then a 35 mm width tape is wound. (Film) Tension is uneven for each 14 rolls, and the winding state of the 35 mm tape is likely to shift on both sides, causing troubles in the slitting process and reducing productivity. Note that the color tone is also important, and when the color tone is reduced, it is difficult to confirm the opposite surface during processing, and it becomes difficult to perform high-accuracy alignment during processing.

【0014】なお、芳香族ポリイミドフィルムの吸水
率、線膨張係数そして加熱収縮率が、前記範囲内にあれ
ば、種々の環境下(高温、エッチング等)においた場合
の寸法安定性が高くなり、好ましい。さらに、引張強度
および引張弾性率が前記範囲内であると、ハンドリング
が容易で、薄肉化が容易になる傾向にある。
If the water absorption, the coefficient of linear expansion, and the heat shrinkage of the aromatic polyimide film are within the above ranges, the dimensional stability under various environments (high temperature, etching, etc.) becomes high, preferable. Further, when the tensile strength and the tensile elastic modulus are within the above ranges, handling tends to be easy, and thinning tends to be easy.

【0015】本発明の芳香族ポリイミドフィルムは、好
適には下記の製法によって製造することができる。すな
わち、先ずビフェニルテトラカルボン酸類とパラフェニ
レンジアミンとをN,N−ジメチルアセトアミドやN−
メチル−2−ピロリドンなどのポリイミドの製造に通常
使用される有機極性溶媒中で、好ましくは10〜80℃
で1〜30時間重合して、好適にはポリマーの対数粘度
(測定温度:30℃、濃度:0.5g/100ml溶
媒、溶媒:N−メチル−2−ピロリドン)が500〜4
500ポイズであるポリアミック酸(イミド化率:5%
以下)溶液を得る。
The aromatic polyimide film of the present invention can be preferably produced by the following production method. That is, first, biphenyltetracarboxylic acids and paraphenylenediamine are combined with N, N-dimethylacetamide or N-
In an organic polar solvent usually used for the production of polyimide such as methyl-2-pyrrolidone, preferably 10 to 80C
, And the polymer preferably has a logarithmic viscosity (measuring temperature: 30 ° C., concentration: 0.5 g / 100 ml solvent, solvent: N-methyl-2-pyrrolidone) of 500 to 4
500 poise polyamic acid (imidation ratio: 5%
Hereinafter) a solution is obtained.

【0016】次いで、好適には、ポリアミック酸100
重量部に対して0.01〜1重量%の(ポリ)リン酸エ
ステルおよび/またはリン酸エステルのアミン酸などの
リン含有化合物および、ポリアミック酸100重量部に
対して0.1〜3重量部のコロイダルシリカのような無
機フィラー(好適には平均粒径0.005〜2μm)を
添加してポリアミック酸溶液組成物(ドープ液)を調製
する。
Next, preferably, polyamic acid 100
0.01 to 1% by weight, based on parts by weight, of a phosphorus-containing compound such as (poly) phosphate and / or amine acid of phosphate, and 0.1 to 3 parts by weight based on 100 parts by weight of polyamic acid. An inorganic filler such as colloidal silica (preferably having an average particle size of 0.005 to 2 μm) is added to prepare a polyamic acid solution composition (dope solution).

【0017】このドープ液を平滑な表面を有する金属製
のドラムまたはベルトなどの支持体表面に流延して、ド
ープ液の薄膜を形成する。次に、その薄膜を乾燥する際
に、乾燥条件を調製して(キャスティング・乾燥炉中の
入口〜出口を複数にゾーン分割して、その好適な条件は
温度:100〜160℃、時間:1〜60分間)乾燥す
ることにより、固化フィルム中、前記溶媒及び生成水分
からなる揮発分含有量が36〜41重量%で、イミド化
率が10〜60%である長尺状固化フィルム層が得られ
る。次いで、この長尺状固化フィルム層を支持体表面か
ら剥離して長尺状固化フィルムを得る。
The dope solution is cast on a surface of a support such as a metal drum or belt having a smooth surface to form a thin film of the dope solution. Next, when the thin film is dried, drying conditions are prepared (the inlet-outlet in the casting / drying furnace is divided into a plurality of zones, and preferable conditions are temperature: 100-160 ° C., time: 1). By drying, a long solidified film layer having a volatile content of 36 to 41% by weight and an imidization ratio of 10 to 60% in the solidified film is obtained. Can be Next, the long solidified film layer is peeled from the surface of the support to obtain a long solidified film.

【0018】次に、長尺状固化フィルムの幅方向の両端
縁を把持しないで、好適には115〜160℃で、0.
5〜10分間乾燥して乾燥フィルムの揮発分含有量が1
3〜35重量%、イミド化率が20〜70重量%となる
ように調製した後、今度は、該乾燥フィルムの幅方向の
両端縁を把持した状態で、キュア炉内で、約100℃以
上、最高加熱温度を好ましくは350〜500℃の温度
として、1〜50分間乾燥フィルムを更に乾燥・イミド
化して、好適には残揮発物量が1.0重量%以下、特に
0.1〜0.6重量%で、イミド化率95%以上の長尺
状の芳香族ポリイミドフィルムを得ることができる。そ
して、得られた長尺状の芳香族ポリイミドフィルムを、
さらに、好適には低張力下あるいは無張力下に、200
〜400℃程度の温度で加熱して、応力緩和処理を施し
て、巻き取る。この長尺状のフィルムを短冊状に切断し
たものも本発明の特徴を有し、本発明の効果を奏する限
り、本発明の範囲に入る。
Next, the both ends of the elongated solidified film in the width direction are preferably not held at 115 to 160 ° C.
After drying for 5 to 10 minutes, the volatile content of the dried film is 1
After being prepared so as to have a weight ratio of 3 to 35% by weight and an imidization ratio of 20 to 70% by weight, the dried film is held at about 100 ° C. or more in a curing furnace while holding both edges in the width direction of the dried film. The drying film is further dried and imidized at a maximum heating temperature of preferably 350 to 500 ° C. for 1 to 50 minutes, and preferably the residual volatile matter content is 1.0% by weight or less, particularly 0.1 to 0. At 6% by weight, a long aromatic polyimide film having an imidization ratio of 95% or more can be obtained. Then, the obtained long aromatic polyimide film,
Furthermore, preferably under low tension or no tension,
It is heated at a temperature of about 400 ° C., subjected to a stress relaxation treatment, and wound up. What cut | disconnected this elongate film into strip shape also has the characteristic of this invention, and it is within the scope of this invention as long as the effect of this invention is exhibited.

【0019】本発明の芳香族ポリイミドフィルムは、好
適には製造時の前記支持体表面上の薄膜(キャストフィ
ルム)の固化フィルムの揮発分含有量とイミド化率を前
記範囲内でコントロールすること、固化フィルムの幅方
向の両端縁を把持しないで乾燥して揮発分含有量とイミ
ド化率を前記好適な範囲内に調整すること、そして今度
は幅方向の両端縁を把持しながら高温下での加熱による
イミド化を行ない、最後に応力緩和処理を行なうことな
どの最適条件に調整した複数の工程の組合せによって、
厚みが50〜125μm(特に75〜125μm)のよ
うに厚いフィルムであるにもかかわらず、他の物性を損
なうことなく、低いカール度を達成することができる。
In the aromatic polyimide film of the present invention, preferably, the volatile content and the imidation ratio of the solidified film of the thin film (cast film) on the surface of the support at the time of production are controlled within the above ranges, The solidified film is dried without gripping both edges in the width direction to adjust the volatile content and the imidation ratio within the above-mentioned preferred range, and this time under high temperature while gripping both edges in the width direction. By performing imidization by heating and finally adjusting to optimal conditions such as performing stress relaxation treatment, a combination of multiple processes,
Even though the film is as thick as 50 to 125 μm (particularly 75 to 125 μm), a low curl degree can be achieved without impairing other physical properties.

【0020】すなわち、本発明者は、ポリアミック酸溶
液を平滑な支持体表面に流延して薄膜を形成し、その薄
膜を乾燥する条件を選択し、更に応力緩和工程を付加す
ることにより、最終的に得られる長尺かつ厚手の芳香族
ポリイミドフィルムのカールを最適な状態にすることが
可能となることを見出して、本発明を完成するに至った
のである。最適な乾燥条件はフィルム厚みで異なった
り、乾燥温度およびその温度勾配、乾燥時間等の条件で
異なる。そこで、ある条件で一旦、ポリイミドフィルム
を製造し、そのカール度をまず測定した後、そのカール
の面(A、B)、その度合いに基づいて、好適には温度
などの製造条件を変更することによってカール度を変更
して最適な状態を見出すことができる。
That is, the present inventor casts a polyamic acid solution on a smooth support surface to form a thin film, selects conditions for drying the thin film, and further adds a stress relaxation step to obtain a final film. The inventors have found that it is possible to optimally curl a long and thick aromatic polyimide film that can be obtained in an optimal manner, and have completed the present invention. Optimum drying conditions differ depending on the film thickness, conditions such as the drying temperature, its temperature gradient, and drying time. Therefore, once a polyimide film is manufactured under a certain condition, the curl degree is first measured, and then, based on the curl surface (A, B) and the degree, the manufacturing conditions such as temperature are preferably changed. The optimum state can be found by changing the degree of curl.

【0021】また、本発明の芳香族ポリイミドフィルム
において、好適には製造時のポリアミック酸溶液の粘度
と揮発分含有量および加熱・乾燥条件とを前記の好適な
範囲内にすることによって、フィルムの厚みむらの調整
と、色調の調整を行なうことができる。
In the aromatic polyimide film of the present invention, the viscosity of the polyamic acid solution at the time of production, the volatile content, and the heating and drying conditions are preferably within the above-mentioned preferred ranges. Adjustment of thickness unevenness and adjustment of color tone can be performed.

【0022】本発明のポリイミドフィルムは、ビフェニ
ルテトラカルボン酸二無水物とパラフェニレンジアミン
とを重合する方法によって容易に得ることができるが、
ポリアミック酸は、ポリマー構成単位がビフェニルテト
ラカルボン酸類とパラフェニレンジアミンとを必須成分
とし、これらを合計で80モル%以上(合計で200モ
ル%中)、好ましくは100モル%以上(200モル%
中)含有していればよく、前記各条件を満足する範囲内
であればビフェニルテトラカルボン酸類とパラフェニレ
ンジアミンとともに他の成分を重合してもよく、また、
結合の種類はランダム結合、ブロック結合のいずれであ
ってもよい。また、前記条件を満足する限り、主成分が
ビフェニルテトラカルボン酸類とパラフェニレンジアミ
ンとからなるポリアミック酸に、他のポリアミック酸成
分を他の芳香族ジアミン成分、例えばピロメリット酸二
無水物とジアミノジフェニルエーテルを混合して使用し
てもよい。いずれの場合も前記と同様にして目的とする
芳香族ポリイミドフィルムを得ることができる。ただ
し、フィルムの剛性(弾性率)の点からは、前記必須成
分の割合が合計で120モル%以上であることが好まし
い。また、本発明の芳香族ポリイミドフィルムは、上記
の熱イミド化に限定されず化学イミド化によっても同様
に得ることができる。
The polyimide film of the present invention can be easily obtained by a method of polymerizing biphenyltetracarboxylic dianhydride and paraphenylenediamine.
The polyamic acid contains biphenyltetracarboxylic acids and paraphenylenediamine as essential components in a polymer constitutional unit, and a total of 80 mol% or more (in 200 mol% in total), preferably 100 mol% or more (200 mol%
Medium) as long as it is contained, and other components may be polymerized together with biphenyltetracarboxylic acids and paraphenylenediamine as long as the above conditions are satisfied.
The type of connection may be any of random connection and block connection. Further, as long as the above conditions are satisfied, the main component is a polyamic acid composed of biphenyltetracarboxylic acids and paraphenylenediamine, and the other polyamic acid component is replaced with another aromatic diamine component, for example, pyromellitic dianhydride and diaminodiphenyl ether. May be used in combination. In any case, the target aromatic polyimide film can be obtained in the same manner as described above. However, from the viewpoint of the rigidity (elastic modulus) of the film, the ratio of the essential components is preferably 120 mol% or more in total. In addition, the aromatic polyimide film of the present invention is not limited to the above-mentioned thermal imidization, and can be similarly obtained by chemical imidization.

【0023】本発明の芳香族ポリイミドフィルムは、そ
のまま、あるいは巻きぐせが生じている場合は熱処理し
て巻きぐせを解消して、そのまま、あるいは好適にはプ
ラズマ処理やコロナ放電処理などの放射線処理あるいは
アミノシラン処理などのそれ自体公知のフィルム表面活
性化処理を施して、熱硬化性接着剤あるいは熱可塑性ポ
リイミド樹脂などの熱可塑性接着剤を介して銅箔などの
金属箔と積層して、種々の用途、特にTAB用として好
適に使用することができる。
The aromatic polyimide film of the present invention, as it is, or when it is curled, is heat-treated to eliminate the curl, and is subjected to radiation treatment such as plasma treatment or corona discharge treatment, or Applying a film surface activation treatment known per se such as aminosilane treatment, and laminating with a metal foil such as a copper foil via a thermoplastic adhesive such as a thermosetting adhesive or a thermoplastic polyimide resin, for various uses. , Especially for TAB.

【0024】[0024]

【実施例】以下の各実施例と比較例において、ポリイミ
ドフィルムの物性、イミド化率、揮発物含有量、残揮発
物量の測定は以下の方法によって行った。各測定値は任
意の数個(通常5個)の平均値で示す。
EXAMPLES In the following Examples and Comparative Examples, the physical properties, imidation ratio, volatile content and residual volatile content of the polyimide film were measured by the following methods. Each measurement value is indicated by an average value of an arbitrary number (usually 5).

【0025】カール度測定:直径86mmの円板状サン
プルを採取し、各サンプルを除電処理した後、図1に示
すような装置(カール測定台)を使用して、サンプルを
垂直に、かつ円板中央の点で固定した状態で置き、カー
ル長さ(h、mm)を測定して、最大カール長さを得
る。数値は小数点1桁を四捨五入し整数で表示する。従
って、数値が小さい程、カールが少ない。また、カール
面(凹面側)をA面・B面で表示し、最大カール長さと
ともに表示する。なお、A面は流延製膜時の支持体面の
反対側の面を、B面は支持体面と接していた側の面を意
味する。ポリイミドフィルムとしては、一般には、A面
カールの方がB面カールよりも高精度の要求される分野
で好適である。
Measurement of curl degree: A disk-shaped sample having a diameter of 86 mm was sampled, each sample was neutralized, and then, using a device (curl measuring table) as shown in FIG. The plate is placed in a fixed state at the center of the plate, and the curl length (h, mm) is measured to obtain the maximum curl length. Numerical values are displayed as integers with one decimal place rounded off. Therefore, the smaller the numerical value, the less the curl. Further, the curl surface (concave surface side) is displayed on the A surface and the B surface, and is displayed together with the maximum curl length. The surface A means the surface on the side opposite to the surface of the support during casting, and the surface B means the surface on the side in contact with the surface of the support. As a polyimide film, generally, A-surface curl is more suitable in fields requiring higher precision than B-surface curl.

【0026】厚み傾斜の測定:フィルム厚み連続測定器
(安立電気株式会社製の電子マイクロメーター)を用い
て、フィルム(この実施例においては幅508mmのフ
ィルム)の幅方向の厚みプロフィル(図2参照)を連続
的に測定して、全幅内での最大厚み傾斜の部分を判定
し、それを測定して、フィルムの10mm幅当たりの高
さの値(t、μm)として、最大厚み傾斜を示す。
Measurement of thickness gradient: Using a film thickness continuous measuring instrument (an electronic micrometer manufactured by Anritsu Electric Co., Ltd.), a thickness profile in the width direction of the film (in this embodiment, a film having a width of 508 mm) (see FIG. 2). ) Is continuously measured to determine the portion of the maximum thickness gradient within the entire width, and is measured to indicate the maximum thickness gradient as the height value (t, μm) per 10 mm width of the film. .

【0027】色調の測定:日本電色株式会社製のハンタ
ー法に従う測色色差計を用い、L、a、bを色立体で色
を測定する。 L:大きいほど明度が高い。 a:(+)側では赤の度合いを、(−)側では緑の度合
いを示す。 b:(−)側では黄の度合いを、(−)側では青の度合
いを示す。
Measurement of color tone: The color of L, a, and b is measured with a color solid using a colorimetric colorimeter according to the Hunter method manufactured by Nippon Denshoku Co., Ltd. L: Brightness increases as the size increases. a: The degree of red is shown on the (+) side, and the degree of green is shown on the (-) side. b: The degree of yellow is shown on the (−) side, and the degree of blue is shown on the (−) side.

【0028】吸水率測定:ASTM D570−63に
従って測定(23℃×24時間) 引張強度測定:ASTM D882−64Tに従って測
定(MD:長手方向) 引張弾性率測定:ASTM D882−64Tに従って
測定(MD) 線膨張係数(50〜200℃)測定:300℃で30分
間加熱して応力緩和したサンプルをTMA装置(引張り
モード、2g荷重、試料長10mm、20℃/分)で測
Water absorption measurement: Measured according to ASTM D570-63 (23 ° C. × 24 hours) Tensile strength measurement: Measured according to ASTM D882-64T (MD: longitudinal direction) Tensile modulus measurement: Measured according to ASTM D882-64T (MD) Linear expansion coefficient (50-200 ° C) measurement: A sample that has been heated at 300 ° C for 30 minutes and stress-relaxed is measured with a TMA device (tensile mode, 2 g load, sample length 10 mm, 20 ° C / min).

【0029】加熱収縮率(200℃×2時間)測定:8
0×80mmの試験片を作成し、標準状態(23±2
℃)、相対湿度65±5%で24時間静置した後、標点
間の長さを測定し、200℃で2時間加熱した後、標準
状態で24時間静置し、標点間の長さを測定し、下記式
より求める。 加熱収縮率=[(L1 −L2 )/L1 ]×100 L1 :加熱前の標点間長さ(mm) L2 :加熱後の標点間長さ(mm) イミド化率測定:FI−IR(ATR法)により、17
80cm-1と1510cm-1の吸光度の比から求める。
測定は、フィルムのA面について行った。
Measurement of heat shrinkage (200 ° C. × 2 hours): 8
A test piece of 0 × 80 mm was prepared, and a standard condition (23 ± 2
℃), relative humidity 65 ± 5% for 24 hours, measured the length between the gauges, heated at 200 ℃ for 2 hours, then allowed to stand in a standard state for 24 hours, the length between the gauges Is measured and determined by the following equation. Heat shrinkage = [(L 1 −L 2 ) / L 1 ] × 100 L 1 : Length between gauges before heating (mm) L 2 : Length between gauges after heating (mm) Imidation rate measurement : 17 by IR-IR (ATR method)
Determined from the ratio of the absorbance of 80 cm -1 and 1510 cm -1.
The measurement was performed on the A side of the film.

【0030】揮発物含有量測定:下記式より求める。 揮発物含有量=[(A−B)/A]×100 A:加熱前のフィルム重量 B:420℃、20分加熱後のフィルム重量Measurement of volatile content: Determined by the following equation. Volatile content = [(AB) / A] × 100 A: Film weight before heating B: Film weight after heating at 420 ° C. for 20 minutes

【0031】残揮発物量測定:下記式より求める。 残揮発物量=[(C−D)/C]×100 C:150℃×10乾燥後の重量 D:450℃×20加熱処理後の重量Measurement of residual volatile matter content: Determined by the following equation. Residual volatile amount = [(CD) / C] × 100 C: weight after drying at 150 ° C. × 10 D: weight after heating at 450 ° C. × 20

【0032】[比較例1]内容積100リットルの重合
槽に、N,N−ジメチルアセトアミド54.6kgを加
え、次いで3,3’,4,4’−ビフェニルテトラカル
ボン酸二無水物8.826kgとパラフェニレンジアミ
ン3.243kgとを加え、30℃で10時間重合反応
させてポリマーの対数粘度(測定温度:30℃、濃度:
0.5g/100mL溶媒、溶媒:N,N−ジメチルア
セトアミド)が1.60、ポリマー濃度が18重量%で
あるポリアミック酸(イミド化率:5%以下)溶液を得
た。このポリアミック酸溶液に、ポリアミック酸100
重量部に対して0.1重量部の割合でモノステアリルリ
ン酸エステルトリエタノールアミン塩および0.5重量
部の割合(固形分基準)で平均粒径0.08μmのコロ
イダルシリカを添加して均一に混合し、ポリアミック酸
溶液組成物(ドープ液)を得た。
Comparative Example 1 54.6 kg of N, N-dimethylacetamide was added to a polymerization tank having an internal volume of 100 liters, and then 8.826 kg of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride And 3.243 kg of paraphenylenediamine, and the mixture was polymerized at 30 ° C. for 10 hours to obtain a logarithmic viscosity of the polymer (measuring temperature: 30 ° C., concentration:
A polyamic acid (imidization rate: 5% or less) solution having a solvent concentration of 0.50 g / 100 mL, a solvent of N, N-dimethylacetamide (1.60), and a polymer concentration of 18% by weight was obtained. In this polyamic acid solution, polyamic acid 100
0.1 parts by weight of triethanolamine salt of monostearyl phosphate and 0.5 parts by weight (based on solid content) of colloidal silica having an average particle diameter of 0.08 μm are uniformly added to parts by weight. To obtain a polyamic acid solution composition (dope solution).

【0033】このドープ液の回転粘度は3000ポイズ
であった。このドープ液をTダイ金型のスリットから連
続的に、キャスティング・乾燥炉(入口〜出口を複数ゾ
ーンに分割)の平滑な支持体に押出して前記ドープ液の
薄膜を形成し、その薄膜を乾燥する際の乾燥条件を調整
して(各ゾーンの平均温度:142℃、最終ゾーンの温
度:145℃、滞留時間:15分間)乾燥して長尺状固
化フィルムを得た。この長尺状固化フィルムは平均値と
して前記溶媒及び生成水分からなる揮発分含有量が34
重量%であり、イミド化率が34%であった。この長尺
状固化フィルムを支持体表面から剥離し、該固化フィル
ムの幅方向の両端縁を把持固定しないで、加熱炉(平均
温度:145℃)内を滞留時間:2分間で加熱・乾燥し
た。乾燥フィルムの揮発分含有量は26重量%、イミド
化率が35%であった。
The dope had a rotational viscosity of 3000 poise. This dope solution is continuously extruded from a slit of a T-die mold onto a smooth support of a casting / drying furnace (an inlet to an outlet is divided into a plurality of zones) to form a thin film of the dope solution, and the thin film is dried. The drying conditions were adjusted (average temperature of each zone: 142 ° C., temperature of the last zone: 145 ° C., residence time: 15 minutes) to obtain a long solidified film. This long solidified film has an average content of the volatile matter composed of the solvent and the generated water of 34.
% By weight, and the imidization ratio was 34%. The long solidified film was peeled off from the surface of the support, and heated and dried in a heating furnace (average temperature: 145 ° C.) for 2 minutes in a heating furnace without holding and fixing both edges in the width direction of the solidified film. . The volatile content of the dried film was 26% by weight, and the imidation ratio was 35%.

【0034】次いで、該乾燥フィルムの幅方向の両端縁
を把持した状態で、キュア炉(入口温度:140℃、最
高温度:480℃、出口温度:150℃)内を、滞留時
間:15分間で、該乾燥フィルムを乾燥およびイミド化
して、幅508mm、厚み75μm、残揮発物量0.2
5重量%、イミド化率95%以上の長尺状の芳香族ポリ
イミドフィルムを連続的に製造した。次に、上記の芳香
族ポリイミドフィルムをフィルム長手方向に80g/m
2の張力を加えた状態で高温縦型加熱炉内に供給し、
該高温縦型加熱炉内で325℃の加熱温度で3分間加熱
して応力緩和処理を行って巻き取った。得られた芳香族
ポリイミドフィルムの物性を測定した。
Next, while holding both edges in the width direction of the dried film, the dried film is kept in a curing furnace (inlet temperature: 140 ° C., maximum temperature: 480 ° C., outlet temperature: 150 ° C.) for a residence time of 15 minutes. The dried film was dried and imidized to a width of 508 mm, a thickness of 75 μm, and a residual volatile matter content of 0.2.
A long aromatic polyimide film having a weight of 5% by weight and an imidation ratio of 95% or more was continuously produced. Next, the above aromatic polyimide film was coated with 80 g / m2 in the longitudinal direction of the film.
m 2 under a tension applied to the high-temperature vertical heating furnace,
The film was heated at 325 ° C. for 3 minutes in the high-temperature vertical heating furnace, subjected to stress relaxation treatment, and wound up. Physical properties of the obtained aromatic polyimide film were measured.

【0035】[比較例2]比較例1と同様にして製造し
たドープ液を、キャスティング・乾燥炉の平滑な支持体
に押出してドープ液の薄膜を形成し、その薄膜を乾燥す
る条件を変え(各ゾーンの平均温度:135℃、最終ゾ
ーンの温度:140℃、滞留時間:15分間)乾燥する
ことにより、固化フィルムの平均値として前記溶媒及び
生成水分からなる揮発分含有量が42重量%で、イミド
化率が26%である長尺状固化フィルムを形成した。次
いで、上記長尺状固化フィルムを支持体表面から剥離
し、該固化フィルムの幅方向の両端縁を把持しないで加
熱炉(平均温度:145℃)内を滞留時間:2分間加熱
・乾燥した。乾燥フィルムは揮発分含有量が33重量
%、イミド化率が30%であった。
Comparative Example 2 A dope solution produced in the same manner as in Comparative Example 1 was extruded onto a smooth support of a casting / drying furnace to form a thin film of the dope solution, and the conditions for drying the thin film were changed. The average temperature of each zone: 135 ° C., the temperature of the final zone: 140 ° C., the residence time: 15 minutes) By drying, the solidified film has a volatile content of 42% by weight as an average value of the solvent and the generated moisture. A long solidified film having an imidation ratio of 26% was formed. Next, the long solidified film was peeled off from the surface of the support, and heated and dried in a heating furnace (average temperature: 145 ° C.) for 2 minutes without gripping both widthwise edges of the solidified film. The dried film had a volatile content of 33% by weight and an imidization ratio of 30%.

【0036】次いで、該乾燥フィルムの幅方向の両端縁
を把持した状態で、キュア炉(入口温度:140℃、最
高温度:480℃、出口温度:150℃)内を、滞留時
間:5分間で、該乾燥フィルムを乾燥およびイミド化し
て、幅508mm、厚み75μm、残揮発物量0.30
重量%、イミド化率95%以上の長尺状の芳香族ポリイ
ミドフィルムを連続的に製造した。最後に、比較例1に
記載の条件で応力緩和処理を行った。得られた芳香族ポ
リイミドフィルムの物性を測定した。
Then, while holding both edges in the width direction of the dried film, the dried film is kept in a curing furnace (inlet temperature: 140 ° C., maximum temperature: 480 ° C., outlet temperature: 150 ° C.) for a residence time of 5 minutes. The dried film was dried and imidized to a width of 508 mm, a thickness of 75 μm, and a residual volatile matter content of 0.30.
A long aromatic polyimide film having a weight percentage of 95% or more and an imidation ratio of 95% or more was continuously produced. Finally, a stress relaxation treatment was performed under the conditions described in Comparative Example 1. Physical properties of the obtained aromatic polyimide film were measured.

【0037】[比較例3]内容積100リットルの重合
槽に、N,N−ジメチルアセトアミド48.3kgを加
え、次いで3,3’,4,4’−ビフェニルテトラカル
ボン酸二無水物8.826kgとパラフェニレンジアミ
ン3.243kgとを加え、30℃で10時間重合反応
させてポリマーの対数粘度(測定温度:30℃、濃度:
0.5g/100ml溶媒、溶媒:N−メチル−2−ピ
ロリドン)が1.50、ポリマー濃度が20重量%であ
るポリアミック酸(イミド化率:5%以下)溶液を得
た。このポリアミック酸溶液に、ポリアミック酸100
重量部に対して0.1重量部の割合でモノステアリルリ
ン酸エステルトリエタノールアミン塩および0.5重量
部の割合(固形分基準)で平均粒径0.08μmのコロ
イダルシリカを添加して均一に混合してポリアミック酸
溶液組成物(ドープ液)を得た。
Comparative Example 3 48.3 kg of N, N-dimethylacetamide was added to a polymerization tank having an internal volume of 100 liters, and then 8.826 kg of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride And 3.243 kg of paraphenylenediamine, and the mixture was polymerized at 30 ° C. for 10 hours to obtain a logarithmic viscosity of the polymer (measuring temperature: 30 ° C., concentration:
A polyamic acid (imidization ratio: 5% or less) solution having a solvent concentration of 0.5 g / 100 ml, a solvent of N-methyl-2-pyrrolidone) of 1.50 and a polymer concentration of 20% by weight was obtained. In this polyamic acid solution, polyamic acid 100
0.1 parts by weight of triethanolamine salt of monostearyl phosphate and 0.5 parts by weight (based on solid content) of colloidal silica having an average particle diameter of 0.08 μm are uniformly added to parts by weight. To obtain a polyamic acid solution composition (dope solution).

【0038】このドープ液の回転粘度は5000ポイズ
であった。このドープ液を使用した他は比較例1と同様
にして乾燥することにより、固化フィルムの前記溶媒及
び生成水分からなる揮発分含有量が33重量%であり、
イミド化率が33%である長尺状固化フィルムを形成し
た。次いで、上記長尺状固化フィルムを支持体表面から
剥離し、該固化フィルムの幅方向の両端縁を把持しない
で加熱炉(平均温度:145℃)内を滞留時間:2分間
加熱した。乾燥フィルムは揮発分含有量が24重量%、
イミド化率が35%であった。次いで、乾燥フィルムの
幅方向の両端縁を把持した状態で、比較例1と同様にし
て、幅508mm、厚み75μm、残揮発物量0.29
重量%、イミド化率95%以上の長尺状の芳香族ポリイ
ミドフィルムを連続的に製造した。最後に、比較例1に
記載の条件で応力緩和処理を行った。得られた芳香族ポ
リイミドフィルムの物性を測定した。
The rotational viscosity of this dope was 5,000 poise. Drying was performed in the same manner as in Comparative Example 1 except that this dope solution was used, whereby the solidified film had a volatile content of 33% by weight composed of the solvent and generated water,
A long solidified film having an imidation ratio of 33% was formed. Next, the long solidified film was peeled off from the surface of the support, and the solidified film was heated in a heating furnace (average temperature: 145 ° C.) for 2 minutes without gripping both edges in the width direction of the solidified film. The dried film has a volatile content of 24% by weight,
The imidation ratio was 35%. Next, in a state where both edges in the width direction of the dried film were gripped, in the same manner as in Comparative Example 1, the width was 508 mm, the thickness was 75 μm, and the residual volatile matter amount was 0.29.
A long aromatic polyimide film having a weight percentage of 95% or more and an imidation ratio of 95% or more was continuously produced. Finally, a stress relaxation treatment was performed under the conditions described in Comparative Example 1. Physical properties of the obtained aromatic polyimide film were measured.

【0039】[比較例4]ジアミンとして、パラフェニ
レンジアミン3.243kgに代えて4,4’−ジアミ
ノフェニルエーテル6.007kgを、N,N−ジメチ
ルアセトアミドの量を54.6kgから67.6kgに
代えた以外は比較例1と同様にして実施して、幅508
mm、厚み75μm、残揮発物量0.61重量%、イミ
ド化率95%以上の長尺状の芳香族ポリイミドフィルム
(いわゆるRタイプのもの)を連続的に製造した。最後
に、比較例1に記載の条件で応力緩和処理を行った。得
られた芳香族ポリイミドフィルムの物性を測定した。
Comparative Example 4 As a diamine, 6.007 kg of 4,4′-diaminophenyl ether was used instead of 3.243 kg of paraphenylenediamine, and the amount of N, N-dimethylacetamide was increased from 54.6 kg to 67.6 kg. Except having changed, it implemented similarly to the comparative example 1.
A long aromatic polyimide film (so-called R type) having a thickness of 75 μm, a thickness of 75 μm, a residual volatile content of 0.61% by weight, and an imidization ratio of 95% or more was continuously produced. Finally, a stress relaxation treatment was performed under the conditions described in Comparative Example 1. Physical properties of the obtained aromatic polyimide film were measured.

【0040】[実施例1]比較例1と同様にして製造し
たドープ液を、キャスティング・乾燥炉の平滑な支持体
に押出してドープ液の薄膜を形成し、その薄膜を乾燥す
る条件を変え(各ゾーンの平均温度:138℃、最終ゾ
ーンの温度:142℃、滞留時間:15分間)で乾燥す
ることにより、固化フィルムの平均値として前記溶媒及
び生成水分からなる揮発分含有量が39重量%であり、
イミド化率が29%である長尺状固化フィルムを形成し
た。次いで、上記長尺状固化フィルムを支持体表面から
剥離し、該固化フィルムの幅方向の両端縁を把持しない
で加熱炉(平均温度:145℃)内を滞留時間:2分間
加熱して、揮発分含有量が29重量%、イミド化率が3
2%である乾燥フィルムを形成した。次いで、該乾燥フ
ィルムの幅方向の両端縁を把持した状態で、キュア炉
(入口温度:140℃、最高温度:480℃、出口温
度:150℃)内を、滞留時間:15分間で、該乾燥フ
ィルムを乾燥およびイミド化して、幅508mm、厚み
75μm、残揮発物量0.26重量%、イミド化率95
%以上の長尺状の芳香族ポリイミドフィルムを連続的に
製造した。最後に、比較例1と同様にして応力緩和処理
を行って、芳香族ポリイミドフィルムを得た。得られた
芳香族ポリイミドフィルムの物性を測定した。
Example 1 A dope solution produced in the same manner as in Comparative Example 1 was extruded onto a smooth support of a casting and drying furnace to form a thin film of the dope solution, and the conditions for drying the thin film were changed. By drying at an average temperature of each zone of 138 ° C., a temperature of the final zone of 142 ° C., and a residence time of 15 minutes), the content of the volatile matter composed of the solvent and the generated moisture is 39% by weight as an average value of the solidified film. And
A long solidified film having an imidation ratio of 29% was formed. Next, the long solidified film is peeled off from the surface of the support, and is heated in a heating furnace (average temperature: 145 ° C.) for 2 minutes without gripping the both edges in the width direction of the solidified film to volatilize. Content is 29% by weight, imidation ratio is 3
A dry film was formed that was 2%. Next, the drying film is dried for 15 minutes in a curing furnace (inlet temperature: 140 ° C., maximum temperature: 480 ° C., outlet temperature: 150 ° C.) while holding both edges in the width direction of the dried film. The film was dried and imidized to a width of 508 mm, a thickness of 75 μm, a residual volatile matter content of 0.26% by weight, and an imidization ratio of 95.
% Or more of a long aromatic polyimide film was continuously produced. Finally, a stress relaxation treatment was performed in the same manner as in Comparative Example 1 to obtain an aromatic polyimide film. Physical properties of the obtained aromatic polyimide film were measured.

【0041】[実施例2]比較例1と同様にして製造し
たドープ液をTダイ金型のスリットから連続的にキャス
ティング・乾燥炉の平滑な支持体に押出してドープ液の
薄膜を形成し、その薄膜を乾燥して(各ゾーンの平均温
度:140℃、最終ゾーンの温度:150℃、滞留時
間:10分間)乾燥することにより、固化フィルムの平
均値として前記溶媒及び生成水分からなる揮発分含有量
が40重量%で、イミド化率が24%である長尺状固化
フィルムを形成した。次いで、上記長尺状固化フィルム
を支持体表面から剥離し、該固化フィルムの幅方向の両
端縁を把持しないで加熱炉(平均温度:140℃)内を
滞留時間:2分間加熱して乾燥フィルムの揮発分含有量
が27重量%、イミド化率が31%となるように加熱・
乾燥した。
Example 2 A dope solution produced in the same manner as in Comparative Example 1 was continuously extruded from a slit of a T-die mold onto a smooth support of a casting / drying furnace to form a thin film of the dope solution. The thin film is dried (average temperature of each zone: 140 ° C., temperature of the final zone: 150 ° C., residence time: 10 minutes), and dried to obtain a volatile content of the solvent and generated water as an average value of the solidified film. A long solidified film having a content of 40% by weight and an imidization ratio of 24% was formed. Next, the long solidified film is peeled off from the surface of the support, and is heated in a heating furnace (average temperature: 140 ° C.) for 2 minutes without holding both edges in the width direction of the solidified film, and dried to form a dry film. The heating and heating were performed so that the volatile matter content of
Dried.

【0042】次いで、該乾燥フィルムの幅方向の両端縁
を把持した状態で、キュア炉(入口温度:110℃、最
高温度:480℃、出口温度:150℃)内を、滞留時
間:10分間で、該乾燥フィルムを乾燥およびイミド化
して、幅508mm、厚み50μm、残揮発物量0.1
7重量%、イミド化率95%以上の長尺状の芳香族ポリ
イミドフィルムを連続的に製造した。最後に、比較例1
に記載の条件で応力緩和処理を行った。得られた芳香族
ポリイミドフィルムの物性を測定した。
Then, while holding both edges in the width direction of the dried film, the inside of a curing furnace (inlet temperature: 110 ° C., maximum temperature: 480 ° C., outlet temperature: 150 ° C.) is retained for 10 minutes. The dried film was dried and imidized to a width of 508 mm, a thickness of 50 μm, and a residual volatile matter content of 0.1.
A long aromatic polyimide film having a weight of 7% by weight and an imidization ratio of 95% or more was continuously produced. Finally, Comparative Example 1
The stress relaxation treatment was performed under the conditions described in (1). Physical properties of the obtained aromatic polyimide film were measured.

【0043】[実施例3]比較例1と同様にして製造し
たドープ液をTダイ金型のスリットから連続的にキャス
ティング・乾燥炉の平滑な支持体に押出してドープ液の
薄膜を形成し、その薄膜を乾燥して(各ゾーンの平均温
度:134℃、最終ゾーンの温度:138℃、滞留時
間:30分間)乾燥することにより、固化フィルムの平
均値として前記溶媒及び生成水分からなる揮発分含有量
が37重量%で、イミド化率が30%である長尺状固化
フィルムを形成した。
Example 3 A dope solution produced in the same manner as in Comparative Example 1 was continuously extruded from a slit of a T-die mold onto a smooth support of a casting / drying furnace to form a thin film of the dope solution. The thin film is dried (average temperature of each zone: 134 ° C., temperature of the final zone: 138 ° C., residence time: 30 minutes) and dried to obtain a volatile content of the solvent and the generated water as an average value of the solidified film. A long solidified film having a content of 37% by weight and an imidization ratio of 30% was formed.

【0044】次いで、上記長尺状固化フィルムを支持体
表面から剥離し、該固化フィルムの幅方向の両端縁を把
持しないで加熱炉(平均温度:120℃)内を滞留時
間:5分間加熱して乾燥フィルムの揮発分含有量が33
重量%、イミド化率が32%となるように加熱・乾燥し
た。次いで、該乾燥フィルムの幅方向の両端縁を把持し
た状態で、キュア炉(入口温度:140℃、最高温度:
480℃、出口温度:150℃)内を、滞留時間:30
分間で、該乾燥フィルムを乾燥およびイミド化して、幅
508mm、厚み125μm、残揮発物量0.51重量
%、イミド化率95%以上の長尺状の芳香族ポリイミド
フィルムを連続的に製造した。最後に、比較例1に記載
の条件で応力緩和処理を行った。得られた芳香族ポリイ
ミドフィルムの物性を測定した。
Next, the long solidified film is peeled off from the surface of the support, and is heated in a heating furnace (average temperature: 120 ° C.) for 5 minutes without gripping both edges in the width direction of the solidified film. The dry film has a volatile content of 33
Heating and drying were carried out so that the imidation ratio was 32% by weight. Then, a curing furnace (inlet temperature: 140 ° C., maximum temperature:
(480 ° C, outlet temperature: 150 ° C), residence time: 30
In minutes, the dried film was dried and imidized to continuously produce a long aromatic polyimide film having a width of 508 mm, a thickness of 125 μm, a residual volatile content of 0.51% by weight, and an imidation ratio of 95% or more. Finally, a stress relaxation treatment was performed under the conditions described in Comparative Example 1. Physical properties of the obtained aromatic polyimide film were measured.

【0045】[実施例4]比較例1と同様にして製造し
たドープ液を、キャスティング・乾燥炉の平滑な支持体
に押出してドープ液の薄膜を形成し、その薄膜を乾燥す
る条件を変え(各ゾーンの平均温度:138℃、最終ゾ
ーンの温度:140℃、滞留時間:15分間)乾燥する
ことにより、固化フィルムの平均値として前記溶媒及び
生成水分からなる揮発分含有量が41重量%で、イミド
化率が27%である長尺状固化フィルムを形成した。次
いで、上記長尺状固化フィルムを支持体表面から剥離
し、該固化フィルムの幅方向の両端縁を把持しないで加
熱炉(平均温度:145℃)内を滞留時間:2分間加熱
・乾燥した。乾燥フィルムは揮発分含有量が31重量%
で、イミド化率が32%であった。
Example 4 A dope solution produced in the same manner as in Comparative Example 1 was extruded onto a smooth support of a casting / drying furnace to form a thin film of the dope solution, and the conditions for drying the thin film were changed. The average temperature of each zone is 138 ° C., the temperature of the final zone is 140 ° C., and the residence time is 15 minutes). A long solidified film having an imidation ratio of 27% was formed. Next, the long solidified film was peeled off from the surface of the support, and heated and dried in a heating furnace (average temperature: 145 ° C.) for 2 minutes without gripping both widthwise edges of the solidified film. The dried film has a volatile content of 31% by weight
And the imidation ratio was 32%.

【0046】次いで、該乾燥フィルムの幅方向の両端縁
を把持した状態で、キュア炉(入口温度:140℃、最
高温度:480℃、出口温度:150℃)内を、滞留時
間:15分間で、該乾燥フィルムを乾燥およびイミド化
して、幅508mm、厚み75μm、残揮発物量0.3
0重量%、イミド化率95%以上の長尺状の芳香族ポリ
イミドフィルムを連続的に製造した。最後に、比較例1
に記載の条件で応力緩和処理を行った。得られた芳香族
ポリイミドフィルムの物性を測定した。
Then, while holding both edges in the width direction of the dried film, the inside of a curing furnace (inlet temperature: 140 ° C., maximum temperature: 480 ° C., outlet temperature: 150 ° C.) was retained for 15 minutes. The dried film was dried and imidized to a width of 508 mm, a thickness of 75 μm, and a residual volatile matter content of 0.3.
A long aromatic polyimide film having a weight of 0% by weight and an imidization ratio of 95% or more was continuously produced. Finally, Comparative Example 1
The stress relaxation treatment was performed under the conditions described in (1). Physical properties of the obtained aromatic polyimide film were measured.

【0047】[実施例5]N,N−ジメチルアセトアミ
ド53.6kg、パラフェニレンジアミン2.27k
g、4,4’−ジアミノジフェニルエーテル1.802
kg、3,3’,4,4’−ビフェニルテトラカルボン
酸二無水物4.413kg、ピロメリット酸二無水物
3.272kgにした(3,3’,4,4’−ビフェニ
ルテトラカルボン酸二無水物成分とパラフェニレンジア
ミンとの合計モル%:120モル%)他は比較例1と同
様に重合して、ポリアミック酸の溶液(回転粘度:14
00ポイズ、18重量%)を得た。上記のポリアミック
酸溶液から比較例1と同様にして調製したドープ液をT
ダイ金型のスリットから連続的にキャスティング、乾燥
炉の平滑な支持体に押出してドープ液の薄膜を形成して
(各ゾーンの平均温度:138℃、最終ゾーンの温度:
140℃、滞留時間:10分間)乾燥することにより、
固化フィルムの前記溶媒及び生成水分からなる揮発分含
有量が40重量%であり、イミド化率が25%である長
尺状固化フィルムを形成した。次いで、上記長尺状固化
フィルムを支持体表面から剥離し、該固化フィルムの幅
方向の両端縁を把持しないで加熱炉(平均温度:140
℃)内を滞留時間:2分間で、加熱して乾燥フィルムの
揮発分含有量が31重量%、イミド化率が29%となる
ように加熱・乾燥した。
Example 5 53.6 kg of N, N-dimethylacetamide, 2.27 k of paraphenylenediamine
g, 4,4'-diaminodiphenyl ether 1.802
kg of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and 3.272 kg of pyromellitic dianhydride (3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride). Polymerization was carried out in the same manner as in Comparative Example 1 except for the total mol% of the anhydride component and paraphenylenediamine: 120 mol%, and a polyamic acid solution (rotational viscosity: 14)
00 poise, 18% by weight). A dope solution prepared from the above polyamic acid solution in the same manner as in Comparative Example 1 was T
The casting is continuously cast from a slit of a die and extruded onto a smooth support of a drying oven to form a thin film of a dope solution (average temperature of each zone: 138 ° C., temperature of final zone:
140 ° C., residence time: 10 minutes)
The solidified film formed a long solidified film having a volatile content of 40% by weight composed of the solvent and produced water and an imidization ratio of 25%. Next, the long solidified film is peeled from the surface of the support, and is heated without heating both ends of the solidified film in the width direction (average temperature: 140 ° C.).
C.) for 2 minutes, and heated and dried so that the dried film had a volatile content of 31% by weight and an imidization ratio of 29%.

【0048】次いで、該乾燥フィルムの幅方向の両端縁
を把持した状態で、キュア炉内での加熱条件を変えて
(入口温度:140℃、最高温度:440℃、出口温
度:150℃、滞留時間:10分間)、該乾燥フィルム
を乾燥およびイミド化して、幅508mm、厚み50μ
m、残揮発物量0.18重量%、イミド化率95%以上
の長尺状の芳香族ポリイミドフィルムを連続的に製造し
た。最後に、比較例1に記載の条件で応力緩和処理を行
った。得られた芳香族ポリイミドフィルムの物性を測定
した。
Next, while holding both edges in the width direction of the dried film, the heating conditions in the curing furnace were changed (inlet temperature: 140 ° C., maximum temperature: 440 ° C., outlet temperature: 150 ° C., retention time). Time: 10 minutes), the dried film was dried and imidized, and was 508 mm wide and 50 μm thick.
m, the amount of residual volatile matter was 0.18% by weight, and a long aromatic polyimide film having an imidization ratio of 95% or more was continuously produced. Finally, a stress relaxation treatment was performed under the conditions described in Comparative Example 1. Physical properties of the obtained aromatic polyimide film were measured.

【0049】[実施例6]実施例4で得られたポリイミ
ドフィルムについて常法(条件:プラズマ照射時間1時
間、マイクロ波発振出力1KW、プラズマ発生真空度
0.8Torr、プラズマ処理ガス:酸素)により低温
プラズマ処理し、接着剤として前記の接着剤を使用して
試料作製し、評価した。結果をまとめて表1に示す。
Example 6 The polyimide film obtained in Example 4 was subjected to a conventional method (conditions: plasma irradiation time: 1 hour, microwave oscillation output: 1 KW, plasma generation vacuum: 0.8 Torr, plasma processing gas: oxygen). A low-temperature plasma treatment was performed, and a sample was prepared using the above-mentioned adhesive as an adhesive, and evaluated. The results are summarized in Table 1.

【0050】[芳香族ポリイミドフィルムについての評
価] (1)テープ状での走行安定性評価 比較例1〜4、実施例1〜5で得た長尺状芳香族ポリイ
ミドフィルムをスリットし、35mm幅、長さ50mの
テープを作製し、その上に26mm幅の熱硬化性ポリイ
ミド接着剤[ポリイミドシロキサン50重量部、エポキ
シ樹脂(油化シェルエポキシ社製、商品名:エピコート
807)30重量部、フェノールノボラック型硬化剤
(明和化成株式会社製H−1)20重量部、硬化触媒
(2−フェニルイミダゾール)0.01重量部からなる
B−ステージの接着剤の片面をポリエチレンテレフタレ
ートをカバーした接着テープ 硬化物のTg:130
℃]を、ポリイミドテープのB面にその中心線が重なる
ようにラミネートして接着剤付きポリイミドテープを作
製した。この接着剤付きポリイミドテープ(ポリエチレ
ンテレフタレート/接着剤/芳香族ポリイミドテープの
構成)のポリイミド上にスプロケット穴やデバイスホー
ルをパンチングで開け、銅箔(35μm)を130℃、
2kg/cm2 、約1秒間の条件でロール間を通し加熱
圧着した。その銅箔にパターンニング・エッチングによ
りインナーリードやアウターリード等の回路を形成して
テープを作製した。このテープを用い以下のようにして
評価した。なお、実施例1−5および比較例1、2、4
のフィルムは、スリット工程で問題が生じず、比較例3
のフィルムではスリットテープを巻くときトラブルが発
生した。
[Evaluation of Aromatic Polyimide Film] (1) Evaluation of Running Stability in Tape Form The long aromatic polyimide films obtained in Comparative Examples 1 to 4 and Examples 1 to 5 were slit to have a width of 35 mm. A tape having a length of 50 m was prepared, and a thermosetting polyimide adhesive having a width of 26 mm [50 parts by weight of polyimide siloxane, 30 parts by weight of epoxy resin (trade name: Epicoat 807, manufactured by Yuka Shell Epoxy Co., Ltd.), phenol One side of a B-stage adhesive composed of 20 parts by weight of a novolak type curing agent (H-1 manufactured by Meiwa Kasei Co., Ltd.) and 0.01 part by weight of a curing catalyst (2-phenylimidazole) is cured with an adhesive tape covering polyethylene terephthalate on one side. Tg of product: 130
° C] was laminated so that the center line of the polyimide tape was overlapped with the side B of the polyimide tape to produce a polyimide tape with an adhesive. Sprocket holes and device holes are punched on the polyimide of this adhesive-attached polyimide tape (composed of polyethylene terephthalate / adhesive / aromatic polyimide tape), and a copper foil (35 μm) is placed at 130 ° C.
Under a condition of 2 kg / cm 2 and about 1 second, heat and pressure were applied between the rolls. Circuits such as inner leads and outer leads were formed on the copper foil by patterning and etching to produce a tape. This tape was evaluated as follows. In addition, Example 1-5 and Comparative Examples 1, 2, and 4
The film of Comparative Example 3 had no problem in the slitting process.
When the slit tape was wound with the film of No. 1, trouble occurred.

【0051】(2)走行安定性の評価 テープにカールがあるとテープ走行中に、スプロケット
穴から外れたり、逆にテープの走行方向を変える時に歯
車がスプロケット穴から外れなかったりの問題が生じ
る。走行中にスプロケット穴から外れたり、逆に外れな
かったりする状態がある場合はCC、そのような状態が
わずかにある場合はBB、そのような問題がない場合は
AAとした。
(2) Evaluation of running stability If the tape is curled, there arises a problem that the tape comes off the sprocket hole during the running of the tape, or conversely, the gear does not come off the sprocket hole when changing the running direction of the tape. CC indicates that there is a state in which the sprocket hole comes off or does not come off during running, BB indicates that such a state exists slightly, and AA indicates that there is no such problem.

【0052】(3)銅箔貼り合わせ積層体のカール測定 TAB用キャリアテープを70mmの長さで切断し、水
平な面に凹面を下にして置き、最大カール長さ(mm)
を測定する。その長さが2.0mm以下であればAA、
2.0〜2.5であればBB、2.5mm以上であれば
CCとした。
(3) Measurement of curl of laminated copper foil laminate The TAB carrier tape was cut at a length of 70 mm, placed on a horizontal surface with the concave surface facing down, and the maximum curl length (mm)
Is measured. If the length is 2.0 mm or less, AA,
BB was 2.0 to 2.5, and CC was 2.5 mm or more.

【0053】(4)位置合わせ テープにカールがあると、加工時の位置合わせ時に、平
面になるように圧力で押しつけ、加工後、圧力を除くと
再度カールする。この様な操作をすると、リードの歪み
が生じ、正確な位置合わせができなくなる。また、色調
の点に問題があると位置合わせが容易でなくなる。リー
ドの歪みが生じたり位置合わせが正確でない場合はC
C、リードの歪みがわずかに生じたり位置合わせがわず
かに不正確な場合はBB、リードの歪みが生じず位置合
わせが正確な場合はAAとした。 (5)総合評価 TAB用ポリイミドテープとしての総合評価を、優れて
いる場合をAA、そして不都合がある場合をCCとして
判定した。
(4) Alignment If the tape has a curl, it is pressed by a pressure so as to be flat at the time of alignment during processing, and after processing, the tape curls again when the pressure is removed. If such an operation is performed, distortion of the lead occurs, and accurate positioning cannot be performed. In addition, if there is a problem in the color tone, the alignment becomes difficult. If lead distortion occurs or alignment is not accurate, C
C, BB when the lead distortion was slightly generated or the alignment was slightly inaccurate, and AA when the lead distortion was not generated and the alignment was accurate. (5) Comprehensive Evaluation The overall evaluation as a TAB polyimide tape was judged as AA when it was excellent and as CC when there was an inconvenience.

【0054】[0054]

【表1】 表1 ──────────────────────────────────── 比較例 実施例 1 2 3 4 1 2 3 4 5 6 ──────────────────────────────────── フィルム厚 75 75 75 75 75 50 125 75 50 75 カール度 B4 A6 B5 B2 A0 A2 A1 A2 A2 A2 厚み傾斜 1.8 1.8 3.1 1.7 1.7 1.5 1.9 1.6 1.5 1.6 色調 L値 35.1 27.0 35.0 70.2 34.8 49.3 30.0 34.3 49.7 34.0 a値 16.6 21.1 16.7 -3.9 16.8 9.6 19.8 17.1 11.4 16.9 b値 23.5 18.0 23.6 37.3 23.4 30.5 20.5 22.9 33.2 22.7 吸水率 1.5 1.5 1.5 1.8 1.5 1.5 1.4 1.5 1.5 1.5 引張強度 32.9 34.8 33.5 37.2 35.2 43.3 31.4 35.5 37.1 35.1 引張弾性率 650 680 660 360 680 860 660 690 505 688 線膨張係数 2.2 2.1 2.1 4.3 2.1 1.6 2.1 2.1 2.2 2.0 加熱収縮率 0.02 0.02 0.02 0.15 0.02 0.01 0.01 0.02 0.03 0.02 ピール強度 1.4 1.3 1.3 1.2 1.4 1.3 1.3 1.4 1.2 1.6 ──────────────────────────────────── 走行安定性 CC BB CC CC AA AA AA AA AA AA 積層体カールCC CC CC CC AA AA AA AA AA AA 位置合せ BB CC BB CC AA AA AA AA AA AA ──────────────────────────────────── 総合評価 CC CC C CCC AA AA AA AA AA AA ────────────────────────────────────Table 1 Table 1 Comparative Example Example 1 2 3 4 1 2 3 4 5 6 ──────────────────────────────────── Film thickness 75 75 75 75 75 50 125 75 50 75 Curl degree B4 A6 B5 B2 A0 A2 A1 A2 A2 A2 Thickness gradient 1.8 1.8 3.1 1.7 1.7 1.5 1.9 1.6 1.5 1.6 Color tone L value 35.1 27.0 35.0 70.2 34.8 49.3 30.0 34.3 49.7 34.0 a value 16.6 21.1 16.7 -3.9 16.8 9.6 19.8 17.1 11.4 16.9 b value 23.5 18.0 23.6 37.3 23.4 30.5 20.5 22.9 33.2 22.7 Water absorption 1.5 1.5 1.5 1.8 1.5 1.5 1.4 1.5 1.5 1.5 Tensile strength 32.9 34.8 33.5 37.2 35.2 43.3 31.4 35.5 37.1 35.1 Tensile modulus 650 680 660 360 680 860 660 690 505 688 Coefficient of linear expansion 2.2 2.1 2.1 4.3 2.1 1.6 2.1 2.1 2.2 2.0 Heat shrinkage 0.02 0.02 0.02 0.15 0.02 0.01 0.01 0.02 0.03 0.02 Peel strength 1.4 1.3 1.3 1.2 1.4 1.3 1.3 1.4 1.2 1. 6 走 行 Running stability CC BB CC CC AA AA AA AA AA AA Laminate curl CC CC CC CC CC AA AA AA AA AA AA Alignment BB CC BB CC AA AA AA AA AA AA総 合 Overall evaluation CC CC C CCC AA AA AA AA AA AA ─────────────────────────── ─────────

【0055】表1の各項目の単位等は次の通りである。
フィルム厚(μm)、カール度(作に規定のmm)、厚
み傾斜(先に規定のμm/10mm)、吸水率(%)、
引張強度(kg/mm2 )、引張弾性率(kg/mm
2 )、線膨張係数(×10-5cm/cm/℃)、加熱収
縮率(%)、ピール強度(積層体のピール強度、90度
剥離、kg/cm)
The units of each item in Table 1 are as follows.
Film thickness (μm), degree of curl (mm specified in the product), thickness gradient (μm / 10 mm specified earlier), water absorption (%),
Tensile strength (kg / mm 2 ), tensile modulus (kg / mm 2 )
2 ), linear expansion coefficient (× 10 −5 cm / cm / ° C.), heat shrinkage (%), peel strength (peel strength of laminate, 90 ° peel, kg / cm)

【0056】[0056]

【発明の効果】本発明の芳香族ポリイミドフィルムは、
電子回路形成用などの基板フィルムとして用いた場合、
スプロケット穴から外れにくく加工時の走行安定性が良
く、高密度パターン化が可能であり、加工時の位置合わ
せが容易である。また自己支持性が高いため(高密度、
高弾性)薄肉化が可能(低コスト化が可能)である。
As described above, the aromatic polyimide film of the present invention comprises:
When used as a substrate film for forming electronic circuits,
It is hard to come off from the sprocket hole, has good running stability during processing, enables high-density patterning, and facilitates positioning during processing. It also has high self-supporting properties (high density,
(High elasticity) Thinning is possible (cost reduction is possible).

【0057】また、本発明の芳香族ポリイミドフィルム
は、原反として安定的に一定した品質で大量に、工業的
に得ることができる。
The aromatic polyimide film of the present invention can be industrially obtained in large quantities with stable and constant quality as a raw material.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明で定義した芳香族ポリイミドフィルムの
カール度(h)と、その測定装置を示す。
FIG. 1 shows a curl degree (h) of an aromatic polyimide film defined in the present invention and a measuring device thereof.

【図2】本発明で定義した厚みむらの指標となる最大厚
み傾斜(tμm/10mm)の決定のために用いられる
プロファイルの例を示す。
FIG. 2 shows an example of a profile used for determining a maximum thickness gradient (tμm / 10 mm) as an index of thickness unevenness defined in the present invention.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 井上 浩 山口県宇部市西本町一丁目12番32号 宇 部興産株式会社 高分子研究所(宇部) 内 (56)参考文献 特開 平5−271438(JP,A) 特開 昭61−111359(JP,A) 特開 昭62−215631(JP,A) 特開 昭63−61029(JP,A) 特開 平6−207014(JP,A) (58)調査した分野(Int.Cl.7,DB名) C08J 5/18 CFG ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hiroshi Inoue 1-12-32 Nishihonmachi, Ube City, Yamaguchi Prefecture Ube Industries, Ltd. Polymer Research Laboratory (Ube) Inside (56) References JP-A-5-271438 (JP, A) JP-A-61-111359 (JP, A) JP-A-62-215631 (JP, A) JP-A-63-61029 (JP, A) JP-A-6-207014 (JP, A) ( 58) Field surveyed (Int.Cl. 7 , DB name) C08J 5/18 CFG

Claims (8)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 ポリマー構成単位としてビフェニルテト
ラカルボン酸成分とパラフェニレンジアミン成分を必須
成分として含む芳香族ポリイミドからなる、厚みが50
〜125μmの範囲にある長尺状のフィルムであって、
引張強度が30kg/mm2以上、引張弾性率が500
kg/mm2以上、50℃から200℃までの昇温下で
測定した線膨張係数が2.5×10-5cm/cm/℃以
下、そして200℃で2時間加熱した時の加熱収縮率が
0.05%以下であり、さらに直径が86mmの円板状
フィルムとして水平面に対して垂直な方向に配置した時
の、円板の中心点からの円板の縁部との間の水平方向の
距離で表わされるカール度が3mm以下であって、また
幅方向の厚みの最大傾斜が10mm当り3μm以下であ
ることを特徴とする長尺状の芳香族ポリイミドフィル
ム。
1. An aromatic polyimide containing a biphenyltetracarboxylic acid component and a paraphenylenediamine component as essential components as polymer constituent units, and having a thickness of 50.
A long film in the range of ~ 125 µm,
Tensile strength is 30 kg / mm 2 or more, tensile modulus is 500
kg / mm 2 or more, the heat shrinkage rate when the linear expansion coefficient measured at Atsushi Nobori is 2.5 × 10 -5 cm / cm / ℃ or less and heated for 2 hours at 200 ° C. to 200 ° C. from 50 ° C. Is 0.05% or less, and the horizontal direction between the center point of the disc and the edge of the disc when the disc-shaped film having a diameter of 86 mm is arranged in a direction perpendicular to the horizontal plane. elongated aromatic polyimide film curl degree represented by the distance of a less than 3mm, also characterized in that the maximum inclination in the width direction of the thickness is 10mm per 3μm or less.
【請求項2】 23℃にて24時間放置した場合の吸水
率が1.8%以下である請求項1に記載の芳香族ポリイ
ミドフィルム。
2. The aromatic polyimide film according to claim 1, which has a water absorption of 1.8% or less when left at 23 ° C. for 24 hours.
【請求項3】 色調を示すL値が25以上、a値が20
以下、そしてb値が18以上である請求項1に記載の芳
香族ポリイミドフィルム。
3. An L value indicating a color tone is 25 or more and an a value is 20.
The aromatic polyimide film according to claim 1, wherein the value of b is 18 or less.
【請求項4】 残揮発物含有量が0.1〜0.6重量%
の範囲にある請求項1に記載の芳香族ポリイミドフィル
ム。
4. The residual volatile matter content is 0.1 to 0.6% by weight.
The aromatic polyimide film according to claim 1, wherein
【請求項5】 線膨張係数が0.4×10-5〜2.5×
10-5cm/cm/℃の範囲にある請求項1に記載の芳
香族ポリイミドフィルム。
5. A linear expansion coefficient of 0.4 × 10 −5 to 2.5 ×
The aromatic polyimide film according to claim 1, which is in a range of 10 -5 cm / cm / ° C.
【請求項6】 カール度が2mm以下である請求項1に
記載の芳香族ポリイミドフィルム。
6. The aromatic polyimide film according to claim 1, wherein the curl degree is 2 mm or less.
【請求項7】 芳香族ポリアミド酸溶液を平面基板上に
塗布し、部分的に乾燥固化して自己支持性フィルムを得
て、その自己支持性フィルムを加熱することにより得た
芳香族ポリイミドフィルムであって、カールが測定され
ないか、あるいはカールが平面基板に接していた側にカ
ール度3mm以下で測定される請求項1に記載の芳香族
ポリイミドフィルム。
7. A method of applying an aromatic polyamic acid solution on a flat substrate, partially drying and solidifying to obtain a self-supporting film, and heating the self-supporting film to obtain an aromatic polyimide film. 2. The aromatic polyimide film according to claim 1, wherein curl is not measured, or curl is measured at a curl degree of 3 mm or less on the side in contact with the flat substrate.
【請求項8】 請求項1に記載の芳香族ポリイミドフィ
ルムが、カールが実質的に測定されない状態では、その
いずれかの側の表面に、そしてカールが存在している場
合には、カール側とは逆側の表面に、接着剤を介して銅
箔が積層・接合されてなる銅箔積層フィルム。
8. The aromatic polyimide film according to claim 1, wherein the curl is substantially not measured, and the curl side is formed on the surface on either side of the curl. Is a copper foil laminated film in which copper foil is laminated and bonded to the opposite surface via an adhesive.
JP28189596A 1995-10-03 1996-10-03 Aromatic polyimide film and copper foil laminated film Expired - Lifetime JP3351265B2 (en)

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JP4967497B2 (en) * 2006-07-25 2012-07-04 東洋紡績株式会社 Polyimide film
JP2008093930A (en) * 2006-10-11 2008-04-24 Toyobo Co Ltd Transparent electrically conductive polyimide film
KR101340820B1 (en) * 2008-09-23 2013-12-11 코오롱인더스트리 주식회사 Plastic substrate
JP5650109B2 (en) * 2008-06-30 2015-01-07 コーロン インダストリーズ インク Plastic substrate and element including the same
KR101321628B1 (en) * 2009-06-26 2013-10-23 코오롱인더스트리 주식회사 Plastic substrate and element containing the same
JP6281382B2 (en) * 2014-04-02 2018-02-21 住友金属鉱山株式会社 Method for producing polyimide film
JP6523736B2 (en) * 2015-03-27 2019-06-05 東レ・デュポン株式会社 Polyimide film
JP2017186466A (en) * 2016-04-07 2017-10-12 コニカミノルタ株式会社 POLYIMIDE FILM, ITS MANUFACTURING METHOD, AND ORGANIC ELECTROLUMINESCENT DISPLAY

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