JP3348781B2 - High frequency semiconductor package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a high-frequency semiconductor package, and more particularly, to a high-frequency semiconductor package having a heat sink structure.

[0002]

2. Description of the Related Art In order to efficiently release heat generated from a semiconductor during operation of the semiconductor and to suppress a rise in the temperature of the semiconductor, a technique of making thermal contact with a heat sink having an excellent heat radiation effect during operation is generally used. ing.

A conventional technique will be described with reference to FIG. FIG. 3A shows the appearance of a high-frequency semiconductor package having a heat sink structure. The package shown in FIG. 3A is in thermal contact with the heat sink 6 by screws 7 passing through one or more flange screw holes 2 on one side (FIG. 3B).

[0004] Further, there is generally known a technique as disclosed in JP-A-04-116957, which has a screw hole penetrating from the upper surface of a package and fixes the entire package to a heat sink.

[0005]

However, as shown in FIG. 3 (c), due to the curvature of the package radiator plate 1 and the deformation of the package radiator plate 1 due to the screw tightening stress passing through the flange portion screw holes 2, A gap 8 may be generated between the heat sink 1 and the heat sink 6. Due to the formation of the gap 8, the thermal contact between the heat sink 1 and the heat sink 6 is reduced,
It has been pointed out that the heat dissipation of the semiconductor becomes insufficient.

Further, however, Japanese Patent Application Laid-Open No. H04-11695
Arranging the circuit mounting portion 4 having the hermetic seal structure on the heat radiating plate 6 as disclosed in Japanese Patent Publication No. 7-No. 7 requires installing a threaded hole to penetrate the circuit mounting portion over the entire surface of the hermetic seal structure. It was difficult to do.
For these reasons, the screw holes 2 are arranged only at the ends of the flanges. Accordingly, when the package shape is large or long in the lateral direction, the physical distance between the screw holes 2 becomes large, so that the package heat radiation plate 1 is curved or the screw is tightened through the flange screw holes 2. The deformation of the package heatsink 1 due to the stress increases, and the heatsink 1
It has been pointed out that a gap 8 is easily generated between the heat sink 6 and the heat sink 6.

It is an object of the present invention to provide a high-frequency semiconductor package having a uniform heat dissipation property in a high-frequency semiconductor package having a heat sink structure in which a heat sink is screwed at a flange of a heat sink.

[0008]

According to the present invention, there is provided a high-frequency semiconductor package comprising a screw provided on a flange of a heat sink.
In a high-frequency semiconductor package with a heatsink structure that is screwed to the heatsink with a screw that penetrates the hole, a threaded hole that does not penetrate the heatsink is arranged on the contact surface between the heatsink and the heatsink, and the screwhole is used to remove the heatsink from the heatsink side. It is characterized by having means for screwing to the heat sink.

The threaded hole is a threaded hole formed by threading the inner surface of a hole that does not penetrate the heat sink in the direction of the contact surface from the heat sink side, and the number of screws with which the heat sink is screwed at the flange portion of the heat sink. And a plurality of threaded holes according to the screw arrangement.

In the case of a fine screw thread,
It has at least 4 or more threads, and in the case of coarse threads, has at least 3.5 or more threads.

Further, the threaded hole has a thread diameter at least 1.5 times the thread diameter at which the heat sink is screwed at the flange of the heat sink.

By using a threaded hole which does not penetrate the back surface of the heat sink of the present invention, the heat dissipation between the package and the heat sink becomes uniform and the thermal contact is improved.

[0013]

Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing components of one embodiment of the present invention, and FIG. 2 is a diagram showing components of another embodiment of the present invention.

FIG. 1A is an overall view of a high-frequency semiconductor package showing an embodiment of the present invention. The heat radiating plate 1 has a flange screw hole 2 and a rear screw hole 3. A circuit mounting portion 4 having a hermetic seal structure and leads 5 for interfacing the circuit mounting portion and the internal circuit are provided on the upper surface of the heat sink 1. FIG. 1B is a cross-sectional view showing a state in which the high-frequency semiconductor package according to the embodiment of the present invention is mounted on a heat sink. The high-frequency semiconductor package is mounted on the heat sink 6 by screws 7. FIG. 1C is an enlarged view of a portion where the high-frequency semiconductor package of FIG.

The operation of the embodiment of the present invention will be described below. As shown in FIG. 1B, the high-frequency semiconductor package is mounted on a heat sink 6 and used. At this time, the high frequency semiconductor package is in thermal contact with the heat sink 6 by the screw 7 passing through one or more flange screw holes 2 on one side and the screw 7 passing through the rear screw hole 3 from the heat sink side. Can be

Another embodiment of the present invention will be described with reference to FIG. Depending on the number of screws and the arrangement of the screws on which the heat sink 6 is screwed at the flange portion of the heat sink, the heat sink 1
The number of threaded holes 3 is determined. Heat sink 6
By providing a plurality of threaded holes 3 for fastening screws to the heat sink 1 from the side, the heat dissipation of the heat sink 6 and the heat sink 6 of a high-frequency semiconductor package having heat sinks of various shapes and sizes can be improved. It becomes possible. FIG. 2A shows a case in which two of the high-frequency semiconductor packages are arranged at the center of the heat sink. FIG. 2B shows an example in which three pieces are arranged at equal intervals. In any of the embodiments, the thermal contact between the flange portion and the heat sink 6 can be improved, and the heat dissipation of the semiconductor can be improved.

The threaded hole 3 has at least four or more threads in the case of fine threads, and has at least 3.5 or more threads in the case of coarse threads. Screws are securely tightened.

Further, it is desirable that the threaded hole 3 has a screw diameter of at least 1.5 times the screw diameter of the heat sink 6 screwed at the flange portion of the heat sink 1 in order to surely screw the screw. .

By using the threaded hole 3 which does not penetrate the back surface of the heat sink 1 of the present invention, the heat dissipation between the high-frequency semiconductor package and the heat sink becomes uniform, and the thermal contact is improved.

[0020]

The effects of the embodiment of the present invention will be described below. FIG. 1C is an enlarged view of the embodiment of the present invention in a state where the heat sink 6 is mounted. As described in the operation of the embodiment, the high-frequency semiconductor package includes the screw 7 passing through the screw hole 2 in the flange portion and the heat sink 6.
The thermal contact between the package radiator plate 1 and the heat sink 6 is obtained by the screws 7 passing through the rear threaded holes 3 from the side. At this time, by using the screw 7 that passes through the backside threaded hole 3 from the heat sink 6 side, the screw can be minimized in the gap 8 between the package radiator plate 1 and the heat sink 6. Therefore, the heat generated from the semiconductor is conducted to the package radiator plate 1 and then to the heat sink 6 with the next lowest thermal resistance, so that the heat generated from the semiconductor can be radiated to the air very efficiently. Temperature rise can be suppressed.

According to the present invention, the use of a threaded hole that does not penetrate the back surface of the heat sink improves the thermal contact between the package and the heat sink, and has the effect of obtaining uniform heat dissipation.

[Brief description of the drawings]

FIG. 1 shows the appearance of a high-frequency semiconductor package according to one embodiment of the present invention, and FIG. 1A is an external view of a high-frequency semiconductor package having two flange-side screw holes and one back-side screw hole on one side. FIG. 1B is a cross-sectional view of a high-frequency semiconductor package in which a screw is in thermal contact with a heat sink,
FIG. 1C is an enlarged sectional view of a contact portion.

FIG. 2 shows the appearance of a high-frequency semiconductor package according to another embodiment of the present invention. FIG. 2 (a) shows the appearance of a high-frequency semiconductor package having two screw holes on one side and two screw holes on the back side. FIG. 2 (b) is an external view of a high-frequency semiconductor package having one flange portion screw hole on one side and three rear screw holes.

3A and 3B show the appearance of a conventional high-frequency semiconductor package having a heat sink structure, and FIG. 3A is an external view of a high-frequency semiconductor package having two flange screw holes on one side;
FIG. 3B is a cross-sectional view of the high-frequency semiconductor package in thermal contact with the heat sink by a screw, and FIG. 3C is an enlarged cross-sectional view of a contact portion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat sink 2 Screw hole for flange part 3 Screw hole on back 4 Circuit mounting part 5 Lead 6 Heat sink 7 Screw 8 Gap

Claims (6)

(57) [Claims] 1. A screw provided on a flange of a heat sink.
A high-frequency semiconductor package having a heat-dissipating plate structure that is screwed to a heat sink with a screw that penetrates a female hole , wherein a threaded hole that does not penetrate the heat-dissipating plate is arranged on a contact surface between the heat-sink and the heat sink. A high-frequency semiconductor package comprising: means for fastening a screw from a heat sink side to a heat sink by means of the screw hole . 2. The high-frequency semiconductor package according to claim 1, wherein the threaded hole is a threaded hole from the heat sink side to an inner surface of a hole that does not penetrate the heat sink in the direction of the contact surface. 3. The high-frequency wave according to claim 1, wherein the screw holes are a plurality of screw holes in accordance with the number of screws and the screw arrangement, in which the heat sink is screwed at the flange portion of the heat sink. Semiconductor package. 4. The high-frequency semiconductor package according to claim 1, wherein said threaded hole has a fine thread, and has at least four or more threads. 5. The high-frequency semiconductor package according to claim 1, wherein the threaded hole has a coarse thread, and has at least 3.5 or more threads. 6. The threaded hole according to claim 1, wherein the threaded hole has a thread diameter of at least 1.5 times a thread diameter of the heat sink screwed at a flange portion of the heat sink. The high-frequency semiconductor package according to any one of the above.