JP3265190B2 - Method of manufacturing pellicle film - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a pellicle film, and more particularly to a method of manufacturing a pellicle film used as a dust proof when manufacturing a semiconductor device such as an LSI or a super LSI or a liquid crystal display panel. .

[0002]

2. Description of the Related Art In the manufacture of semiconductor devices such as LSIs and VLSIs, or liquid crystal display panels, semiconductor wafers or liquid crystal original plates are irradiated with light to perform patterning. In this case, the dust absorbs light or reflects light, so that the transferred pattern is deformed,
However, the size, quality, appearance, and the like are impaired, and the performance and manufacturing yield of semiconductor devices and liquid crystal display panels are reduced.

[0003] For this reason, these operations are usually performed in a clean room. However, it is difficult to always keep the exposure master normal even in this clean room. A pellicle membrane that adheres well to the pellicle is adhered. In this case, the dust does not directly adhere to the surface of the exposure original plate, but adheres to the pellicle film. Therefore, if the focus is set on the pattern of the exposure original plate during lithography, the dust on the pellicle film becomes irrelevant to the transfer. . This pellicle membrane is made of nitrocellulose,
This pellicle film is made of cellulose acetate or the like and is transparent to allow good light to pass through. A good solvent for the pellicle film is applied to the upper part of a pellicle frame made of aluminum, stainless steel, etc., and air-dried and adhered (Japanese Patent Application Laid-Open No. 58-1983). (See U.S. Pat. No. 4,861,402, US Pat. No. 4,861,402)
63-27, 707).

[0004]

In this method of manufacturing a pellicle film, the film material is dissolved in a solvent to form a solution having a concentration of 3 to 10%, and the solution is cast using a spin coater or a knife coater. A method of forming a film on a silicon wafer or a glass substrate by a method is performed, and the pellicle film thus formed is formed on the substrate and then separated from the substrate. However, the pellicle film is usually a very thin polymer film in order to obtain a high transmittance, and has a very small film strength, so that there is a problem that the film is broken when it is to be peeled off from the substrate.

[0005]

The present invention SUMMARY OF] is a method for manufacturing a pellicle film to solve such problems, when for peeling the pellicle film from the substrate, the pellicle film
The pellicle film is peeled off in a state where the same kind of charge as that to be charged is applied to the substrate .

That is, as a result of various studies on the method of peeling the pellicle film formed on the substrate from the substrate, the present inventors have found that when the pellicle film is peeled from the substrate,
The present inventors have found a method of peeling a pellicle film in a state in which the same kind of charge as that charged to a substrate is applied to a substrate . As a result, it has been found that peeling can be performed without breaking the film, and a target pellicle film can be easily and efficiently obtained.

Hereinafter, this will be described in detail. The present invention relates to a method for producing a pellicle film, and a film having commercial value as a pellicle can be obtained without breaking the film. The method for producing a pellicle film of the present invention comprises:
The present invention relates to an improvement in a process of peeling a pellicle film formed on a substrate by a conventional method from a substrate, and to impart a charge to the substrate at the time of peeling to peel the substrate.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the method of the present invention, a pellicle film forming material is dissolved in a solvent to prepare a solution having a concentration of 3 to 10% by weight, and this solution is subjected to a solution casting method using a spin coater or a knife coater. in after deposited as a pellicle film on a silicon substrate or glass substrate, although this is to make the pellicle film is peeled from the substrate, the present invention is at this time, electric charge of the same kind of charge charged pellicle film Attached to the substrate
The pellicle film is peeled off in the state given. This is because the substrate and the film are different materials, and when they are separated from each other, positive and negative charges are generated in the substrate and the film. This charge generates an attractive force, and the film cannot be peeled unless it is overcome. Here, if the same charge as the charge generated in the film at the time of separation is applied to the substrate, the attractive force of the charge can be canceled and separation can be performed.

As the pellicle film forming material used in the present invention, those for ordinary pellicle films can be used.
Cellulose derivatives such as nitrocellulose and cellulose acetate described above; polyvinyl acetal such as polyvinyl propional and polyvinyl butyral; polycarbonate; polymethyl methacrylate; polyethylene terephthalate; perfluoropolymer, etc. can be used. , Methyl propyl ketone, ethyl acetate, methyl acetate, perfluorotributylamine and the like can be used. Further, the film is usually formed as a transparent film having a thickness of 0.5 μm to 10 μm, and the film formation conditions are a drying temperature of 80 to 250 ° C. and a drying time of 1 to 20 minutes.

In a specific method for applying charges in the method of the present invention, as shown in FIG. 1, charges are generated by an electrostatic generator 1 and the charges are injected into a film-forming substrate 2 using a cable, and the charges are transferred. The applied jig 3 is peeled by the peeling jig 3. The charge to be injected is either positive or negative, which depends on the material of the film and the material of the substrate. For example, when the film material is more easily negatively charged than the substrate material, a negative charge must be injected into the substrate. Voltage range is ± 1,000V ~
± 100,000 V, and this value also changes depending on the film material and the substrate material.

[0011]

Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. (Pellicle film forming method) Cytop CT as a film forming material
XS [trade name of Asahi Glass Co., Ltd.] was dissolved in perfluorotributylamine.CT solv.180 [trade name of Asahi Glass Co., Ltd.] as a solvent to obtain a 5% by weight solution. Then, the solution was coated on a silicon substrate having a diameter of 200 mm and a thickness of 1.2 mm with its surface polished to a thickness of 0.82 μm using a spin coater.
m, and dried at 180 ° C. for 15 minutes to form a pellicle film. This was used in Examples and Comparative Examples.

(Example 1) The pellicle film obtained above was placed in a clean room at a temperature of 23 ° C and a relative humidity of 50%.
As described with reference to FIG. 1, a peeling portion was peeled off by using a peeling jig while applying voltages of -1,000 V and -50,000 V by an electrostatic generator. (Comparative Example 1) For comparison, the pellicle film was peeled off without applying a voltage to the peeled portion on the substrate. Table 1 shows a comparison of the difficulty levels of the above three peelings.

[0013]

[Table 1]

[0014]

According to the method of the present invention, the pellicle film can be separated from the substrate in the air, and the desired pellicle film can be obtained easily and efficiently.

[Brief description of the drawings]

FIG. 1 is a schematic view illustrating a method of peeling a pellicle film from a substrate in the present invention.

[Explanation of symbols]

 1 static electricity generator, 2 substrate, 3 peeling jig.

Claims (1)

(57) [Claims] The method according to claim 1 pellicle film formed on a substrate in a manufacturing method of the pellicle film is peeled off from the substrate surface, Periku
A method for producing a pellicle film, wherein the pellicle film is peeled off in a state where the same kind of charge as that charged on the pellicle film is applied to the substrate .