JP3245687B2 - Adjustment method of heat dissipation constant - Google Patents
Adjustment method of heat dissipation constantInfo
- Publication number
- JP3245687B2 JP3245687B2 JP14858292A JP14858292A JP3245687B2 JP 3245687 B2 JP3245687 B2 JP 3245687B2 JP 14858292 A JP14858292 A JP 14858292A JP 14858292 A JP14858292 A JP 14858292A JP 3245687 B2 JP3245687 B2 JP 3245687B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- heat dissipation
- temperature
- dissipation constant
- samples
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 27
- 238000000034 method Methods 0.000 title claims description 11
- 238000005259 measurement Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004868 gas analysis Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- -1 humidity Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、サーミスタ等の感温素
子の熱放散定数の調整方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adjusting the heat dissipation constant of a temperature-sensitive element such as a thermistor.
【０００２】[0002]
【従来の技術】サーミスタ等の感温素子を自己加熱する
と、素子の熱放散定数がその周囲の気体の熱伝導率の違
いによって変化するため、この現象を応用して従来より
サーミスタはガス分析や湿度検出用センサに利用されて
いる。2. Description of the Related Art When a temperature-sensitive element such as a thermistor is self-heated, the heat dissipation constant of the element changes due to the difference in the thermal conductivity of the surrounding gas. Used in humidity detection sensors.
【０００３】図１に感温素子を用いたガス分析又は湿度
検出回路を示す。図中Ｓは試料となる検出用素子、Ｃ
は、温度補償用素子である。FIG. 1 shows a gas analysis or humidity detection circuit using a temperature-sensitive element. In the figure, S is a detection element serving as a sample, C
Is a temperature compensating element.
【０００４】両素子Ｓ，Ｃは、抵抗Ｒ1，Ｒ2（いずれも
１０ＫΩ）とともに組合わされてブリッジ回路を構成
し、抵抗ＲS（３３０Ω）を通して電源Ｅの電圧（ＤＣ
１５Ｖ）が印加され、両素子Ｓ，Ｃの電圧差が電圧計Ｖ
に検出される。検出用素子Ｓと、温度補償用素子Ｃとの
抵抗温度特性は均一に揃っていなければならない。The two elements S and C are combined with resistors R 1 and R 2 (both are 10 KΩ) to form a bridge circuit, and the voltage (DC) of the power supply E is passed through the resistor R S (330Ω).
15V) is applied and the voltage difference between the two elements S and C is
Is detected. The resistance-temperature characteristics of the detecting element S and the temperature compensating element C must be uniform.
【０００５】検出用素子Ｓの熱放散定数が周囲の気体の
熱伝導率の違いによって変化すると、両素子の自己加熱
温度に差が生じ、そのために抵抗値が異なり、ブリッジ
回路には不平衡電圧が出力され、ガス分析や湿度の検出
が行われる。[0005] When the heat dissipation constant of the detecting element S changes due to the difference in the thermal conductivity of the surrounding gas, a difference occurs between the self-heating temperatures of the two elements. Is output, and gas analysis and humidity detection are performed.
【０００６】[0006]
【発明が解決しようとする課題】ところで、検出用素子
Ｓと、温度補償用素子Ｃとを組合せてセンサの検出回路
を構成する場合に、従来は予め両素子の熱放散定数を測
定して特性が良く揃った素子の組合せを選定して回路に
組込んでいたが、熱放散定数を測定するには素子を自己
加熱しなければならず、自己加熱温度が安定するまでに
長時間を要するほか、特性測定後の素子の管理，素子の
選択組合せに厄介な管理を要するなどの問題があった。By the way, when a detecting circuit of a sensor is constituted by combining a detecting element S and a temperature compensating element C, conventionally, the heat dissipation constant of both elements is measured in advance. In order to measure the heat dissipation constant, the element must be self-heated, and it takes a long time for the self-heating temperature to stabilize. In addition, there is a problem that element management after characteristic measurement and troublesome management for selecting and combining elements are required.
【０００７】本発明の目的は、感温素子の組合せを任意
に選定し、回路を組立てた後に素子の熱放散定数を調整
する方法を提供することにある。It is an object of the present invention to provide a method for arbitrarily selecting a combination of temperature-sensitive elements and adjusting a heat dissipation constant of the elements after a circuit is assembled.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、本発明による熱放散定数の調整方法においては、容
器の機械的変形処理を有し、容器内に収容された感温素
子の熱放散定数を調整する方法であって、容器は、ハー
メチックシールされたものであり、感温素子は、容器の
ハーメチック端子に両端のリード線を取付けて容器内に
宙吊りに取付けられたものであり、前記容器にマウント
された構造の感温素子を試料として２個選定し、両試料
をブリッジ回路に結線して動作状態に保ち、両試料の端
子電圧および出力電圧を同時に測定し、容器の機械的変
形処理は、両試料の端子電圧および出力電圧測定の結
果、熱放散定数が小さく、端子電圧の低い試料に対して
行なうものであり、熱放散定数が小さく、端子電圧の低
い試料の感温素子の容器の一部を変形加工し、感温素子
と変形した容器の一部との間の距離を変化させ、両試料
の端子電圧の差が無くなったところで調整を完了する処
理である。 In order to achieve the above object, a method for adjusting a heat dissipation constant according to the present invention comprises mechanically deforming a container and dissipating heat from a thermosensitive element contained in the container. a method of adjusting the constants, the container has been hermetically sealed, the temperature-sensitive element, which is attached to the hanging into the container by attaching a lead wire at both ends hermetic terminal of the container, the Mount on container
Two temperature-sensitive elements with the same structure were selected as samples, and both samples were
To the bridge circuit to keep it operating,
Child voltage and the output voltage is measured at the same time, the mechanical deformation process of the container, forming the terminal voltage and the output voltage measurements both samples
As a result, the heat dissipation constant is small and the terminal voltage is low.
Low heat dissipation constant and low terminal voltage.
A part of the container of the temperature-sensitive element of the sample
The distance between the sample and the deformed container
When the difference between the terminal voltages of
Reason.
【０００９】[0009]
【作用】図２に容器内にマウントされた感温素子のマウ
ント構造を示す。容器１は、ＴＯ−５等をもって作られ
たベース２とキャップ３とを組合せてハーメチックシー
ルされたものである。FIG. 2 shows a mounting structure of a temperature-sensitive element mounted in a container. The container 1 is hermetically sealed by combining a base 2 and a cap 3 made of TO-5 or the like.
【００１０】感温素子４は、例えばサーミスタであり、
素子の両端から引き出されたリード線５は、ベース２に
取付けられたハーメチック端子６に溶接され、両ハーメ
チック端子６，６間に感温素子４を宙吊りに取付けてい
る。The temperature sensing element 4 is, for example, a thermistor,
Lead wires 5 drawn out from both ends of the element are welded to a hermetic terminal 6 attached to the base 2, and the temperature-sensitive element 4 is suspended between the hermetic terminals 6 and 6 in a suspended state.
【００１１】ハーメチック端子６，６を通して感温素子
４に通電すると、素子４は自己発熱し、自己発熱により
生じた熱は、リード線５，５を通して熱伝導によりハー
メッチク端子６，６からの放熱と、素子表面から輻射に
よる放熱のほか周囲の気体に放熱される。この周囲の気
体を通しての熱放散は、周囲の気体の熱伝導率並びに素
子表面と素子を囲む容器１の内壁、例えば、ＴＯ−５の
ベース２又はキャップ３までの距離によって変化し、素
子４から容器１までの距離が熱放散に与える影響は特に
大きい。When the temperature-sensitive element 4 is energized through the hermetic terminals 6, 6, the element 4 self-heats. In addition to the heat radiation from the element surface, the heat is also released to the surrounding gas. The heat dissipation through the surrounding gas varies depending on the thermal conductivity of the surrounding gas and the distance between the element surface and the inner wall of the container 1 surrounding the element, for example, the base 2 or the cap 3 of the TO-5. The effect of the distance to the container 1 on heat dissipation is particularly large.
【００１２】熱放散定数は、感温素子４に一定の電流を
流したときの端子間電圧を測定することにより、その大
小を検知することができる。図３は、感温素子としてガ
ラス封入された直径１ｍｍのサーミスタを、ハーメチッ
クシールされたＴＯ−５の容器内に収容した試料につい
て、サーミスタに定電流２５ｍＡを通電し、サーミスタ
と容器のベース間を変化させたときに端子間電圧を測定
した結果を示す図である。The magnitude of the heat dissipation constant can be detected by measuring the voltage between terminals when a constant current is applied to the temperature-sensitive element 4. FIG. 3 shows a sample in which a 1 mm diameter thermistor glass-enclosed as a temperature sensing element is housed in a hermetically sealed TO-5 container. It is a figure showing the result of having measured the voltage between terminals at the time of changing.
【００１３】この測定例からわかるように、感温素子の
位置が５０ミクロン変化しても端子電圧は約７０ｍＶ変
動し、感温素子の取付け位置のバラツキが熱放散定数の
バラツキの主な要因となっている。As can be seen from this measurement example, the terminal voltage fluctuates by about 70 mV even if the position of the temperature-sensitive element changes by 50 μm. Has become.
【００１４】然るに、ミクロンオーダーで感温素子の取
付け精度を高めることは実際上難しく、強いて行なうと
すれば、高精度の複雑な設備を必要とする。そこで、本
発明においては、感温素子４を取付けた容器１の一部、
例えばキャップ３の一部を機械加工により変形させ、感
温素子４と、キャップ３間の距離を変化させることによ
り感温素子４の熱放散定数を微妙に調整するものであ
る。この調整が問題になるのは、前述のように、前記容
器にマウントされたマウント構造の感温素子を検出用素
子Ｓと、温度補償用素子Ｃとに用いてブリッジ回路を構
成する場合である。両素子Ｓ、Ｃの温度抵抗特性は均一
に揃っていなければならない。本発明においては、前記
マウント構造の感温素子を試料として２個を任意に選定
し、両試料をブリッジ回路に結線してこれを動作状態に
保ち、両試料の端子電圧および出力電圧を同時に測定す
る。その測定の結果、熱放散定数が小さく、端子電圧が
低いと判断された試料に対して感温素子の容器の一部を
変形加工し、その試料の感温素子と変形した容器の一部
との間の距離を変化させてゆく。容器の変形の程度が進
行するにしたがって、両試料の端子電圧の差が狭まって
ゆき、両試料の端子電圧の差が無くなったところで調整
を完了する。調整の完了は、ブリッジ回路の出力電圧を
監視し、その出力電圧がゼロになった時点で調整完了が
判断できる。 However, it is practically difficult to increase the mounting accuracy of the temperature-sensitive element on the order of microns, and if it is required, it requires complicated equipment with high precision. Therefore, in the present invention, a part of the container 1 to which the temperature sensing element 4 is attached,
For example, a part of the cap 3 is deformed by machining to change the distance between the thermosensitive element 4 and the cap 3 to finely adjust the heat dissipation constant of the thermosensitive element 4. Explanation This adjustment is a problem, as described above, the volume
Element for detecting a temperature-sensitive element with a mounting structure
A bridge circuit is formed using the element S and the temperature compensating element C.
This is the case. Temperature resistance characteristics of both elements S and C are uniform
Must be aligned. In the present invention,
Arbitrarily select two mountable temperature sensing elements as samples
And connect both samples to the bridge circuit to bring it into operation.
And measure the terminal voltage and output voltage of both samples simultaneously.
You. As a result of the measurement, the heat dissipation constant was small and the terminal voltage was
For a sample determined to be
Deformed, temperature-sensitive element of the sample and part of the deformed container
And change the distance between them. The degree of deformation of the container increases
The difference between the terminal voltages of both samples
Adjusted when the difference between the terminal voltages of both samples disappeared
Complete. When the adjustment is completed, the output voltage of the bridge circuit is
Monitoring, and when the output voltage becomes zero, the adjustment is completed.
I can judge.
【００１５】[0015]
【実施例】以下に湿度，炭酸ガス，酸素等のガス検出用
センサの熱放散定数の調整方法について、本発明の実施
例を説明する。試料の熱放散定数の調整には図５に示す
調整装置７を用いた。An embodiment of the present invention will be described below with reference to a method of adjusting the heat dissipation constant of a sensor for detecting a gas such as humidity, carbon dioxide, oxygen, or the like. The adjustment device 7 shown in FIG. 5 was used for adjusting the heat dissipation constant of the sample.
【００１６】調整装置７は、試料固定板８に向き合わせ
て調整軸９を進退動可能に設置し、ステッピングモータ
１０に駆動されて回転するねじ１１にスライド板１２を
連動させ、該スライド板１２の進退動を調整軸９に伝導
させるようにしたものである。The adjusting device 7 has an adjusting shaft 9 installed so as to be capable of moving forward and backward in opposition to the sample fixing plate 8, and a sliding plate 12 which is driven by a stepping motor 10 and rotates with a screw 11. Is transmitted to the adjustment shaft 9.
【００１７】図２の構造の素子を２個選定して試料Ｓ，
Ｃを図１に示すブリッジ回路に結線し、これを動作状態
とする。両試料Ｓ，Ｃの端子電圧および出力電圧を同時
に測定し、熱放散定数が小さく、端子電圧の低い試料Ｓ
（又はＣ）を試料固定板８にセットし、試料ＳのＴＯ−
５キャップ３の頂部に調整軸９の先端が接する位置に向
き合せ、ステッピングモータ１０を駆動して調整軸９を
試料Ｓのキャップ３に押し付け、図４中、破線で示すよ
うにキャップ３の一部を内側に変形させる。試料Ｓの熱
放散定数は、キャップ３の変形程度によって調整され
る。Two elements having the structure shown in FIG.
C is connected to the bridge circuit shown in FIG. The terminal voltage and the output voltage of both samples S and C are measured simultaneously, and the heat dissipation constant is small, and the sample S having a low terminal voltage is measured.
(Or C) is set on the sample fixing plate 8, and the TO-
5, the tip of the adjustment shaft 9 is in contact with the top of the cap 3, and the stepping motor 10 is driven to press the adjustment shaft 9 against the cap 3 of the sample S. As shown by a broken line in FIG. Deform the part inward. The heat dissipation constant of the sample S is adjusted according to the degree of deformation of the cap 3.
【００１８】図６に調整前，調整中，調整後の試料の端
子電圧，出力電圧の測定例を示す。調整前は、両試料
Ｓ，Ｃの端子電圧の差が大きく、その差の１／２が出力
電圧として測定されたが、調整中は、キャップの変形程
度が進行するにしたがって、端子電圧の差が調整前の１
／２に狭まり、端子電圧の差がなくなったところで調整
を完了する。調整後は、ブリッジ回路の出力電圧はゼロ
となる。FIG. 6 shows a measurement example of the terminal voltage and the output voltage of the sample before, during, and after the adjustment. Before the adjustment, the difference between the terminal voltages of the two samples S and C was large, and half of the difference was measured as the output voltage. However, during the adjustment, as the degree of deformation of the cap progressed, the difference between the terminal voltages increased. Is 1 before adjustment
/ 2, and the adjustment is completed when the difference between the terminal voltages disappears. After the adjustment, the output voltage of the bridge circuit becomes zero.
【００１９】以上の操作により、熱放散定数が調整され
た試料Ｓ，Ｃの対の一方を検出用素子、他方を温度補償
用素子に用いてガス検出センサとして使用する。他の目
的のセンサに用いるときにも、その調整要領は全く同じ
である。With the above operation, one of the pair of samples S and C whose heat dissipation constant has been adjusted is used as a gas detection sensor by using one of the pair as a detecting element and the other as a temperature compensating element. The adjustment procedure is exactly the same when used for a sensor for another purpose.
【００２０】[0020]
【発明の効果】以上のように本発明によるときには、セ
ンサのブリッジ回路に組込む前に予め感温素子の熱放散
定数を測定しておく必要は全くなくなり、センサのブリ
ッジ回路に組込んだ後に、一方の素子の容器を変形させ
つつ対の感温素子の各々の端子電圧を測定し、且つブリ
ッジ回路の出力電圧を監視して感温素子の熱放散定数を
調整することができ、したがって、ガス検出器のような
微小な電気信号を得るために必要な検出器の高性能化，
高精度化を容易に実現できる効果を有する。As described above, according to the present invention, there is no need to previously measure the heat dissipation constant of the temperature-sensitive element before incorporating it into the bridge circuit of the sensor. The terminal voltage of each of the pair of temperature sensing elements can be measured while deforming the container of one element, and the output voltage of the bridge circuit can be monitored to adjust the heat dissipation constant of the temperature sensing element. Higher performance of detectors required to obtain minute electrical signals such as detectors,
This has the effect of easily realizing high precision.
【図１】感温素子を用いたセンサの検出回路の一例を示
す図である。FIG. 1 is a diagram illustrating an example of a detection circuit of a sensor using a temperature-sensitive element.
【図２】感温素子を取付けた容器の構造を示す図であ
る。FIG. 2 is a view showing a structure of a container to which a temperature sensing element is attached.
【図３】素子と容器のベース間の距離を変化させたとき
の素子の端子電圧を示す図である。FIG. 3 is a diagram showing terminal voltages of the element when the distance between the element and the base of the container is changed.
【図４】容器の変形加工例を示す図である。FIG. 4 is a view showing an example of deformation processing of a container.
【図５】容器の変形加工に用いる調整装置の構成を示す
図である。FIG. 5 is a diagram showing a configuration of an adjusting device used for deforming a container.
【図６】熱放散定数の調整前，調整中，調整後における
２個のサーミスタ素子の端子電圧と、ブリッジ回路の出
力の変化を示す図である。FIG. 6 is a diagram showing changes in terminal voltages of two thermistor elements before, during, and after adjustment of a heat dissipation constant, and changes in output of a bridge circuit.
１ 容器 ２ ベース ３ キャップ ４ 感温素子 ５ リード線 ６ ハーメチック端子 ７ 調整装置 ８ 試料固定板 ９ 調整軸 １０ ステッピングモータ １１ ねじ １２ スライド板 Ｓ 検出用素子（試料） Ｃ 温度補償用素子（試料） DESCRIPTION OF SYMBOLS 1 Container 2 Base 3 Cap 4 Temperature sensing element 5 Lead wire 6 Hermetic terminal 7 Adjusting device 8 Sample fixing plate 9 Adjusting shaft 10 Stepping motor 11 Screw 12 Slide plate S Detection element (sample) C Temperature compensation element (sample)
Claims (1)
収容された感温素子の熱放散定数を調整する方法であっ
て、 容器は、ハーメチックシールされたものであり、 感温素子は、容器のハーメチック端子に両端のリード線
を取付けて容器内に宙吊りに取付けられたものであり、前記容器にマウントされた構造の感温素子を試料として
２個選定し、両試料をブリッジ回路に結線して動作状態
に保ち、両試料の端子電圧および出力電圧を同時に測定
し、 容器の機械的変形処理は、両試料の端子電圧および出力
電圧測定の結果、熱放散定数が小さく、端子電圧の低い
試料に対して行なうものであり、熱放散定数が小さく、
端子電圧の低い試料の感温素子の容器の一部を変形加工
し、感温素子と変形した容器の一部との間の距離を変化
させ、両試料の端子電圧の差が無くなったところで調整
を完了する処理であることを特徴とする熱放散定数の調
整方法。1. A method for adjusting the heat dissipation constant of a temperature-sensitive element housed in a container, the method comprising mechanically deforming the container, wherein the container is hermetically sealed. Is attached to the hermetic terminal of the container with the lead wires at both ends and suspended in the container in a suspended state, and the temperature-sensitive element having the structure mounted on the container is used as a sample.
Select two, connect both samples to the bridge circuit and operate
And simultaneously measure the terminal voltage and output voltage of both samples
The mechanical deformation of the container depends on the terminal voltage and output of both samples.
As a result of voltage measurement, heat dissipation constant is small and terminal voltage is low
It is performed on the sample, the heat dissipation constant is small,
Deformation processing of a part of the temperature sensitive element container of the sample with low terminal voltage
Changes the distance between the temperature sensing element and a part of the deformed container
And adjust when there is no difference between the terminal voltages of both samples.
A method for adjusting a heat dissipation constant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14858292A JP3245687B2 (en) | 1992-05-15 | 1992-05-15 | Adjustment method of heat dissipation constant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14858292A JP3245687B2 (en) | 1992-05-15 | 1992-05-15 | Adjustment method of heat dissipation constant |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05326209A JPH05326209A (en) | 1993-12-10 |
| JP3245687B2 true JP3245687B2 (en) | 2002-01-15 |
Family
ID=15455972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14858292A Expired - Fee Related JP3245687B2 (en) | 1992-05-15 | 1992-05-15 | Adjustment method of heat dissipation constant |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3245687B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6760075B2 (en) | 2000-06-13 | 2004-07-06 | Panoram Technologies, Inc. | Method and apparatus for seamless integration of multiple video projectors |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2022196438A1 (en) * | 2021-03-15 | 2022-09-22 |
-
1992
- 1992-05-15 JP JP14858292A patent/JP3245687B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6760075B2 (en) | 2000-06-13 | 2004-07-06 | Panoram Technologies, Inc. | Method and apparatus for seamless integration of multiple video projectors |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05326209A (en) | 1993-12-10 |
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