JP3198175B2 - Position shift detector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION This invention is related to <br/> to the displacement detecting device, and more particularly, that the resin mold portion of the semiconductor device is displaced dropped or position from the frame portion of the lead frame, the light The present invention relates to a displacement detection device that is detected by a detection unit .

[0002]

2. Description of the Related Art As the degree of integration of semiconductor devices has increased, finer processing has been required for their manufacture, and hanging pins and the like for supporting the semiconductor devices on a frame portion of a lead frame have become thinner. For this reason, the semiconductor device may fall or be displaced from the frame portion of the lead frame due to breakage of the suspension pin, for example, during a process of molding the external lead of the resin-sealed semiconductor device into a predetermined shape using a mold. . If there is an abnormality such as a drop in the semiconductor device, the external leads cannot be formed properly.

Conventionally, there is a semiconductor device detection device using an optical sensor to detect a semiconductor device 10 that has fallen or is displaced from a lead frame in a mold for molding external leads of the semiconductor device 10. As shown in FIG. 6, the light emitting unit 51 and the light receiving unit 53 of the optical sensor are disposed on the upper surface of the lower mold 55 so as to face each other. And
Between the light emitting unit 51 and the light receiving unit 53, a feed plate 54 for guiding the lead frame 14 on the surface of the lower die 55 in the transport direction is disposed so as to be vertically movable. The light emitted from the light emitting unit 51 of the optical sensor is supplied to the feed plate 54 while the lead frame 14 is being conveyed.
A through hole 56 is provided so that the optical path 52 can pass between the upper surface of the lower die 55 and the lower surface of the semiconductor device 10. Reference numeral 58 denotes a guide post for guiding the operation of the movable die. According to the semiconductor device detection device, the semiconductor device 1
When 0 is dropped or the like, the light emitted from the light emitting unit 51 is blocked, so that an abnormality such as a drop of the semiconductor device can be detected.

[0004]

However, in the above-described conventional device for detecting a semiconductor device, the light emitting section 5 of the optical sensor is used.
1 and the head size of the light receiving unit 53 limit the mounting pitch. For this reason, especially in the case of the small semiconductor device 10, it is difficult to dispose a plurality of optical sensors at predetermined positions, the number of optical paths 52 of the optical sensors cannot be set sufficiently, and the detection accuracy cannot be improved. was there. In addition, since a plurality of optical sensors are usually used for each step of the transfer mold, the number of optical sensors increases and the amount of wiring increases, which causes a problem that the apparatus becomes complicated.

Accordingly, an object of the present invention is to improve the detection accuracy.
And simplification of the device can be realized.
An object of the present invention is to provide a position shift detecting device.

[0006]

To achieve the above object, the present invention has the following arrangement. In other words, Ridofure
In a semiconductor device mounted on a frame.
Position detection device that detects the position deviation
By refracting one light beam , the semiconductor
A light source that passes the lower side of the device multiple times in different optical paths
Supply means and a lower side of the semiconductor device by the light supply means.
Of the light beam supplied to the light source after passing through the lower side
And a light detecting means for detecting

Further , the refracted light is used for the lead frame.
It travels in the longitudinal direction of the arm. This
A single optical path to detect abnormalities in multiple semiconductor devices.
You can get out.

[0008]

According to the position deviation detecting device of the present invention, the light supply
Depending on the step, the lower side of the semiconductor device
Since the light is passed, the position shift of the semiconductor device
Detection accuracy can be improved.

Further, the refracted detection light is used as a lead frame.
Travel in the longitudinal direction of the
It is possible to detect abnormalities of a number of semiconductor devices.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows the displacement according to the present invention.
FIG. 2 is a cross-sectional view showing one embodiment of the detection device , and FIG. 2 is a plan view of the embodiment of FIG. Reference numeral 10 denotes a semiconductor device, which is supported on a frame portion of the lead frame 14 by hanging pins. In this embodiment, the case where the semiconductor device 10 is supported by the frame portion of the lead frame in two rows along the direction in which the semiconductor device is transported is illustrated. Of course, the invention can be applied. Reference numeral 22 denotes a light- emitting unit, which is a light supply unit, and constitutes a part of an optical sensor. The light-emitting unit 22 is fixed to the upper surface of the lower mold holder 42, and transmits light along the transport path of the semiconductor device 10 (arrow in FIG. A direction) (the length of the lead frame )
Direction) . Reference numeral 26 denotes a light receiving unit serving as a light detecting unit, which constitutes a part of an optical sensor, is fixed to the upper surface of the lower mold holder 42, and moves along the transport path of the semiconductor device 10 in the same direction as the transport direction. Receives light. Also,
A plurality of lower molds 40 are fixed to the lower mold holder 42 at predetermined intervals.

Reference numeral 30 denotes a feed plate, which is formed in a rectangular frame shape and is provided to be vertically movable. On the opposite surface of the longitudinal frame of the feed plate 30,
A slide groove 32 is provided to guide the lead frame 14 to be slid and conveyed. The feed plate 30 is located above the lead frame 14 when the lead frame 14 is conveyed, as shown in FIG. 1, and descends together with the upper die (movable die) when the external lead is formed.
The semiconductor device is guided so as to be placed at a predetermined position of the mold. The lead frame 14 is provided on the feed plate 3.
When the “0” is located at the upper side, it is transported at a predetermined pitch by a pin that reciprocates in the transport direction.

Reference numeral 34 denotes a prism, which is fixed to a front end of the feed plate 30 by a fixing plate 35 and a fixing member 36 so as to face the light emitting surface of the light emitting section 22. The light emitted by the light emitting section 22 is refracted by 180 ° by the prism 34, and
In the opposite direction to the transport direction. Thereby, the optical path 2 of the light
4 is the semiconductor device 1 normally transferred to the upper surface of the lower mold 40
It is preferably arranged to run between the lower surface of the zero. Then, the light is refracted by 180 ° again by the prism 34 fixed to the rear end of the feed plate 30 so as to face the light receiving surface of the light receiving unit 26, and reaches the light receiving unit 26. In this embodiment, when the feed plate 30 is located above and the lead frame 14 is transported, an abnormality such as a drop of the semiconductor device 10 is detected. For this reason, as shown in FIG. 1, the fixing plate 35 has a through hole so that when the feed plate 30 is located at a predetermined height, the light emitted by the light emitting section 35 can be transmitted and reach the prism. Is provided. A guide post 45 guides a movable reciprocating motion.

FIG. 3 shows the frame portion 1 of the lead frame 14.
5, the semiconductor device 10 supported by the suspension pins 16
FIG. External lead 12 of semiconductor device 10
In forming the, the tip of the outer lead 12 is disconnected from the frame part 15, the semiconductor device 10 comprises a frame portion 1
5 is supported only by the hanging pins 16 . Therefore, when the suspension pin 16 is broken as shown in FIGS. 3 and 4, the semiconductor device 10 is in a sagging (displaced) state as shown in FIG. 4, for example. Also, not limited to displacement,
It may fall from the frame 15. At this time, as shown in FIG. 4, the displacement of the resin mold portion of the semiconductor device 10 from the frame portion 15 of the lead frame 14 can be detected by blocking the light emitted from the light emitting portion 22. .

Although abnormalities such as dropping of the semiconductor device are detected as described above, in the embodiment of FIG. 1, the light emitting section 22 and the light receiving section 26 are fixed to the lower mold holder 42, and the light emitting section 22 is fixed.
The prism 34 is fixed to the feed plate 30 so as to face the light receiving section 26 and the light receiving section 26, respectively. This prism 34
Is fixed to the feed plate 30 that moves up and down, but there is no electrical connection or the like, so that there are few portions that may be damaged. Further, the shape of the prism 34 is different from the head shape of the optical sensor, and the size and the like can be freely selected. Therefore, the semiconductor device 10 of the feed plate 30 is transported so as not to interfere with the semiconductor device 10 being transported. 1 can be suitably mounted at a position along the route (lower in the embodiment of FIG. 1). The light emitting unit 22 and the light receiving unit 26 of the optical sensor that need to be electrically connected to the prism 34.
Means the lower mold holder 42 that does not move relative to the apparatus main body.
Can be fixed downward along the path along which the semiconductor device 10 is transported. For this reason, it is not necessary to provide a through hole in the feed plate 30 as in the related art, and the light emitting portion 22
And the light receiving section 26 can be suitably and easily arranged.

In the embodiment shown in FIG. 1, the light emitted from the light emitting section 22 of the optical sensor is refracted so that the optical path 24 of the light extends along the transport direction in which the plurality of semiconductor devices 10 are sequentially transported. By detecting the interruption of the light, an abnormality such as a drop of the semiconductor device 10 is detected. That is, the abnormality of the semiconductor devices 10 arranged in the transport direction can be simultaneously detected by one optical sensor. For this reason, even if the number of optical sensors is reduced, an abnormality of the semiconductor device 10 can be effectively detected.

By the way, in order to detect the drop and the displacement of the semiconductor device with high accuracy, the optical path 24 of the light emitted from the light emitting section 22 may be arranged at a high density. According to the present invention, a large number of light paths can be obtained from one light emitting section 22 by using a prism or a reflecting mirror for the light , so that the light paths 24 can be easily arranged with high density. Further, as shown in FIG. 4, detects the sag of the semiconductor device 10 by the upper of the two optical paths 24, when arranging the optical path 24 to detect the drop of the semiconductor device 10 by the lower of another optical path 24 Conventionally, for a small semiconductor device, the optical path 2
It was difficult to suitably arrange No. 4. On the other hand, according to the present invention, since the arrangement of the prism and the like is easy,
The optical path 24 can be suitably arranged.

Further, as shown in FIG.
If the light emitted from the light emitting section 22 is refracted by the prism 34 and the like and passes through the detecting section for detecting an abnormality such as a drop of the semiconductor device a plurality of times and reaches the light receiving section 26, one light emission By the light emitted from the unit 22, a large number of light paths 24 can be obtained. For this reason, even if the number of the optical sensors 20 is reduced, an abnormality such as a fall of the semiconductor device can be effectively detected, and the device can be simplified and the cost can be reduced.

According to the above embodiment, the abnormality of the semiconductor device 10 is detected by blocking the light of the optical sensor, but the light is normally blocked by the resin sealing portion above the frame portion 15 of the semiconductor device 10. Then, when the semiconductor device 10 falls, the light may pass therethrough to detect the abnormality of the semiconductor device 10 as a matter of course.

Further, if the light emitted from the light emitting section is of a strong directivity like a laser beam or of a high light intensity, the light can effectively reach the light receiving section even after being refracted and reflected many times. Can be. For this reason, the entire length of the optical path for detection can be made longer, and the number of optical sensors can be further reduced. As described above, various preferred embodiments of the present invention have been described. However, the present invention is not limited to these embodiments, and it goes without saying that many more modifications can be made without departing from the spirit of the invention. That is.

[0020]

According to the displacement detecting apparatus of the present invention, the light
Depending on the supply means, the lower side of the semiconductor device is placed in a different optical path.
Light is transmitted multiple times, so that
The detection accuracy of the displacement can be improved. Furthermore, refraction
The detected light travels in the longitudinal direction of the lead frame.
In this way, a single optical path can be used to detect abnormalities in multiple semiconductor devices.
You can get out.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a plan view of the embodiment of FIG.

FIG. 3 is a plan view showing a semiconductor device as an object to which the present invention is applied.

FIG. 4 is an explanatory diagram illustrating a state in which a semiconductor device blocks an optical path .

FIG. 5 is a plan view illustrating another embodiment of the present invention.

FIG. 6 is a plan view showing a conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Semiconductor device 12 External lead 14 Lead frame 15 Frame part 16 Hanging pin 22 Light emitting part 24 Optical path 26 Light receiving part 30 Feed plate 34 Prism 40 Lower mold 42 Mold holder

Continued on the front page (72) Inventor Yoshitaka Todoro 90, Kamikakuma, Tokura-cho, Hanishina-gun, Nagano Prefecture Inside Yamada Manufacturing Co., Ltd. (72) Inventor Fujio Kanayama 6-7-35 Kita Shinagawa, Shinagawa-ku, Tokyo Sony Corporation (72) Inventor Sumio Hokari 6-35, Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation (72) Inventor Hitoshi Shibue 6-35, Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation (56) References JP-A-4-199666 (JP, A) JP-A-1-97599 (JP, A) JP-A-61-176468 (JP, U) JP-A-57-86478 (JP, U) ( 58) Field surveyed (Int.Cl. ⁷ , DB name) G01V 8/20 H01L 23/50

Claims (2)

(57) [Claims] 1. A semiconductor device mounted on a lead frame.
Detects misalignment with respect to the lead frame at
A misalignment detection device that refracts one light beam, thereby enabling the semiconductor device to operate.
Light supply means for passing the lower side several times in different optical paths
When supplied to the lower side of the semiconductor device by the light supplying means
Detecting the amount of light of the light beam after passing through the lower side
Position detecting device, comprising: a light detecting unit.
Place. 2. The lead frame according to claim 1, wherein said refracted light is transmitted to said lead frame.
2. The vehicle according to claim 1, wherein the vehicle travels in a longitudinal direction of the vehicle.
Position shift detection device.