JP3176552B2 - Display device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention generally relates to a display device for displaying various information, and more particularly, to a display device in which a power supply unit, which is a heating element, is arranged together with a display unit in the same housing.

[0002]

2. Description of the Related Art Conventionally, display devices utilizing a CRT display or electroluminescence have been used in OA equipment such as personal computers.
Various thin and light liquid crystal display devices with low power consumption have been proposed in JP-A-6-230344. Hereinafter, a liquid crystal display device 1500 will be described with reference to FIGS. 238 to 241 as an example of a display device.

The liquid crystal display device 1500 includes a liquid crystal panel 1501 as shown in FIG.
As shown in detail in FIG. 239, the liquid crystal panel 1501
It has two glass substrates 1502 and 1503 with a thickness of 1.1 mm, and a plurality of strip-shaped transparent electrodes 1505 and 1506 are formed on the surfaces of these substrates 1502 and 1503. In addition, these transparent electrodes 1505, 1506
Is covered with insulator films 1507 and 1509 of SiO ₂ to prevent short circuit. Further, a polyimide orientation control film 1 is formed on the insulator films 1507 and 1509.
510 and 1511 are formed, and the orientation control film 151 is formed.
Rubbing treatment is performed on the surface of 0,1511 to give an alignment regulating force. In addition, both substrates 1502 and 150
In the gap of No. 3, a large number of bead spacers 1512,... And a sealing adhesive 1513 are interposed at the peripheral edge. The gaps between the substrates are defined by the bead spacers 1512,.
2,1503 are adhered. Further, both substrates 150
A liquid crystal 1515 is interposed between the gaps 21503.

The liquid crystal panel 15 having such a structure is
01 is attached to the fixing plate 1521 by an elastic silicone adhesive 1520, and the fixing plate 1521
, A transparent display plate 1522 is attached. The liquid crystal panel 1501 includes a liquid crystal driving element 1523.
And a driver board 1525 are connected (FIG. 24).
0), of which the driver board 1525 is attached to the fixed plate 1521.

[0005] On the other hand, as shown in FIG.
530 are arranged. This backlight unit 1
Reference numeral 530 includes a linear light source 1531, a diffusion plate 1532, a reflection plate 1533, and the like. The light from the linear light source 1531 is reflected and diffused by the reflection plate 1533 and the diffusion plate 1532, and then the liquid crystal panel 530 is formed. It is configured to irradiate 1501.

As the liquid crystal 1515 described above, a ferroelectric liquid crystal having high-speed response and bistability and capable of displaying a large screen is used instead of the conventional nematic liquid crystal. The characteristics of the ferroelectric liquid crystal strongly depend on the temperature, and the threshold value at which the liquid crystal molecules switch greatly changes with the temperature, and the response speed (one scanning line writing frequency) decreases as the temperature decreases (see FIG. 241). . Further, the ferroelectric liquid crystal has a narrow temperature range in which a chiral smectic phase exhibiting ferroelectricity is stably present, and undergoes a phase transition to a crystal phase near zero degree. Then, once crystallized, even if the temperature returns to the temperature range showing the chiral smectic phase, the liquid crystal molecules do not return to the original state until the alignment state (the chiral smectic phase having a uniform layer structure at the time of manufacture). In some cases, the display became unsuitable.

Therefore, in such a liquid crystal display device using ferroelectric liquid crystal, it is necessary to maintain the liquid crystal panel 1501 at a predetermined temperature in order to maintain the image quality by increasing the response speed of the ferroelectric liquid crystal. was there. Therefore, between the liquid crystal panel 1501 and the backlight unit 1530, as shown in FIG.
And the liquid crystal panel 1501 is configured to be heated by the heater panel 1526.
Further, a heater control circuit 1535 for controlling the heater panel 1526 was also provided.

[0008]

However, in the conventional liquid crystal display device, the heater panel 152
6, there is a problem that the power consumption increases.

Further, the number of parts is increased by the amount required for the heater panel 1526 and the heater control circuit 1535. As a result, the labor and time required for manufacturing are increased, and the maintenance becomes complicated. There has been a problem that it is disadvantageous and that the price of the device is high.

Accordingly, an object of the present invention is to provide a display device which prevents an increase in power consumption, prevents a complicated manufacturing process and maintenance, and suppresses a price increase.

It is another object of the present invention to provide a display device having the above-described desired performance, a uniform temperature distribution of the temperature units of the display unit, and excellent display quality.

A further object of the present invention is to provide a thin, high-visibility display device having the above-described high performance.

[0013]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has a display unit for displaying an image, a backlight unit for illuminating the display unit, and an electrical connection between the backlight unit and the display unit. An inverter unit that controls the inverter unit and the display unit, and a power supply unit that supplies power to the inverter unit and the controller unit and has a distribution of heat generation states, The display unit is arranged on the front side of the backlight unit, and the inverter unit and the controller unit are arranged on the back side of the backlight unit.
The power supply unit is arranged on a side surface of a backlight unit, an inverter unit, and a controller unit, and the display unit, the backlight unit, the inverter unit, the controller unit, and the power supply unit are provided in the same housing. A display device which is arranged and integrated, wherein the inverter unit and the controller unit are arranged side by side along a back surface of the backlight unit, and the power supply is provided between the power supply unit and the display unit. A heat insulating means is provided at a position corresponding to an area of the unit where heat generation is higher, and the inverter unit is disposed above an area of the power supply unit where heat generation is lower.

Further, the present invention provides a display unit for displaying an image, a backlight unit for illuminating the display unit, an inverter unit for electrically controlling the backlight unit, and the inverter unit and the display unit. A controller unit for electrically controlling;
A power supply unit that supplies power to the inverter unit and the controller unit and has a distribution of heat generation states, wherein the display unit is disposed on a front side of the backlight unit, and a back side of the backlight unit. The inverter unit and the controller unit are arranged in a display unit,
The power supply unit is arranged on a side surface of a backlight unit, an inverter unit, and a controller unit, and the display unit, the backlight unit, the inverter unit, the controller unit, and the power supply unit are provided in the same housing. A display device body that is arranged and integrated, wherein the inverter unit and the controller unit are arranged side by side along the back surface of the backlight unit, and are disposed between the power supply unit and the display unit. A heat insulating unit is provided at a position corresponding to a region of the power supply unit where heat generation is higher, and the inverter unit is disposed above a region of the power supply unit where heat generation is lower, and supports the display device main body and the display device main body. And a supporting device.

When the display device is started based on the configuration of the present invention, power is supplied from the power supply unit to the inverter unit and the controller unit. Thus, the display unit is electrically controlled by the controller unit, and as a result, an image is displayed on the display unit. On the other hand, the backlight unit is turned on via the controller unit and the inverter unit, and illuminates the display unit.
With this illumination, the image of the display unit is easily visually recognized.

Further, since the display unit, the backlight unit, the inverter unit, the controller unit, and the power supply unit are arranged and integrated in the same housing, the transportation and movement of the device are facilitated. .

In particular, since the power supply unit is disposed integrally on the side surface of the display unit and in the same housing together with the display unit, heat from the power supply unit is efficiently transmitted to the display unit. Well communicated.

Further, since the display device is provided with the support device, the angle in the vertical and horizontal directions can be freely adjusted, and the visibility can be optimized.

[0019]

Embodiments of the present invention will be described below with reference to the drawings.

First, the overall structure of the liquid crystal display device will be described with reference to FIGS.

As shown in FIG. 1, the liquid crystal display device 1 according to the present embodiment includes a display device main body 200 for displaying various information, and the main body 200 is supported by the support device 3.

Next, the external structure of the display device main body 200 will be described with reference to FIGS.

The display device main body 200 includes a front cover 201 and a rear cover 202, and
1 has an opening 201a (see FIG. 2).
A liquid crystal panel P is disposed inside the opening 201a (details will be described later), so that the liquid crystal panel P can be viewed from the outside. Furthermore, this opening 20
1a is closed by a display plate (transparent member) 242 made of a transparent and rigid glass plate (details will be described later), and is configured to protect the liquid crystal panel P.
Further, a parting frame 204 is formed on the back surface of the display plate 242, and a screen A is formed in a portion surrounded by the frame 204. Note that these front covers 201
The rear cover 202 is made of, for example, ABS (acrylonitrile-butadiene-styrene) resin, and its inner surface is plated with Ni to reduce radiation noise.

Regarding such means for preventing radiation noise,
For example, as shown in FIG. 242, a radiation noise prevention plate 2400 of a predetermined shape made of steel such as tinplate may be provided in a predetermined region in the housing.

More specifically, the noise prevention plate 240
Reference numeral 0 denotes a backlight upper plate 5 serving as a support member of a backlight unit as shown in FIGS.
50, the backlight unit 530, the inverter unit 570, and the controller unit 572 are provided in a housing as shown in FIG.

The position, material, and position of the radiation noise prevention plate
The shape is not particularly limited, and can be set optimally according to the arrangement of the noise generation source and the like.

On the front side of the front cover 201, a brightness adjustment volume 203 and an image quality adjustment volume 205 are arranged (details will be described later). Further, an LED 206 is disposed below these volumes 203 and 205. The LED 206 is turned on when the main switch 213 is turned on, and blinks when the power management function is operating for power saving. Thus, the operation state of the display device main body 200 is displayed. Further, as shown in FIG. 3, a color adjustment switch 207 is disposed on the side of the display device main body 200, and an AC power cable connection 209 and a ground connection 210 are formed in the vicinity thereof. I have. And this A
As shown in FIG. 4, the C power cable connection portion 209 has:
An AC power cable 211 is connected, and the AC power cable 211 is disposed so as to be hooked on a hook 212 projecting from the rear cover 202. A ground wire (not shown) is connected to the ground connection portion 210, so that the display device main body 200 is grounded. Further, this AC power cable connection portion 209
The main switch 213 is arranged near the.

Further, a large number of heat radiation holes are formed in the rear cover 202 so as to release internal heat. That is, the upper surface of the rear cover 202 is swelled as shown in FIG. 6, and a large number of heat radiation holes 202a,. 4 are formed below these heat radiating holes 202a,... On the side of the rear cover 202.
Are formed as shown in FIG.
Further, as shown in FIG. 3, heat radiating holes 202d,... And 202e,. Further, on the bottom surface of the rear cover 202, FIG.
Are formed as shown in FIG. A fine mesh net member (not shown) may be provided on the inner surface side of the rear cover corresponding to these heat radiation holes to prevent fine dust and the like from entering the inside of the display device housing through the holes. .

On the other hand, two pins 202g, 202g are protruded at a predetermined distance in the middle of the rear surface of the cover 202, and screw portions 202h, 202h,
202h are formed. And these pins 20
The display device main body 200 is attached to the above-described support device 3 by 2g,... And the screw portions 202h,. Further, an interface cable connecting portion 215 is formed at a position where the hook 212 is formed and a target position (see FIG. 5).
This connection part 215 has an interface cable 216
Are connected to connect the display device main body 200 to a host computer (not shown).

Next, the internal structure of the display device main body 200 will be described with reference to FIGS.

As shown in FIG. 8, an indicator unit 220 is disposed at a position corresponding to the LED 206 at the lower portion of the rear surface of the front cover 201, and controls the lighting of the LED 206. In the vicinity,
Brightness adjustment volume 203, image quality adjustment volume 20
5 and a trimmer unit 221 provided with a color adjustment switch 207. Then, turning the brightness adjustment volume 203 clockwise turns the screen darker, and turning the volume adjustment counterclockwise turns the screen brighter,
The screen brightness can be adjusted by the operation. In addition, when the screen looks dark or white, or the image quality is disturbed such as an afterimage, the image quality adjustment volume 205 can be adjusted clockwise or counterclockwise to adjust the image quality. , Uniformity is maintained. Furthermore, a color adjustment switch 2
By turning 07 counterclockwise, halftones (halftones) are better expressed, and by turning clockwise, sharpness is achieved, so that the color of the image can be adjusted in eight levels. <Regarding the Switch Power Supply Unit 223> The switch power supply unit 223 is arranged below the display device main body 200 as shown in FIG. The switch power supply unit 223 has a primary side on the left side when viewed from the back of the apparatus, and as shown in FIG. 9, includes a main switch 213, an AC power cable connection unit 209, and an AC power cable (not shown). Connected to an AC power source. The switch power supply unit 223 has a secondary side on the right side when viewed from the rear of the device, and supplies power to a controller unit 572 and an inverter unit 570 described later. Note that reference numeral 223a in FIG.
Is a transformer. <About the heat insulating plate 225> Since the switch power supply unit 223 has a DC power conversion unit on the left side when viewed from the front of the device, the left side generates more heat than the right side. . Therefore, if no countermeasures are taken, the screen at the upper left has the highest temperature and the screen at the lower right has the lowest temperature as viewed from the front of the apparatus, resulting in non-uniform temperature distribution and non-uniform display quality. Such a problem is most remarkable in “all white / all black display”, and is remarkable in a liquid crystal panel using a ferroelectric liquid crystal having severe temperature characteristics.

In the present embodiment, in order to solve such a problem, the heat insulating plate 225 is disposed on the upper left side of the switch power supply unit 223. Hereinafter, this heat insulating plate 22
5 will be described with reference to FIGS. 10 and 11.

The heat insulating plate 225 is shown in FIGS.
As shown in FIG. 1 (a), on the upper surface side of the switch power supply unit 223, a portion on the right side (FIG. 8) when viewed from the back side of the display and a portion on the left side when viewed from the display side (secondary side). And the flow of heat from the unit 223 to the liquid crystal panel P (display unit 230) and the like is suppressed. This heat insulating plate 225 is made of vinyl chloride,
As shown in FIG. 1 (b), both ends of the backlight unit 53
0 (details will be described later) and the switch power supply unit 223 are respectively fixed by screws (not shown).

The heat generated on the secondary side of the switch power supply unit 223 by the heat insulating plate 225 temporarily moves along the heat insulating plate 225 to the right side (as viewed from the front of the panel) as shown in FIG. And then flows to the liquid crystal panel P side. Therefore, the temperature in the lower right of the figure rises,
The temperature rise in the upper left portion of the drawing is suppressed, and as a result, the temperature distribution of the liquid crystal panel P is improved to be uniform, and the liquid crystal panel P having a uniform display quality can be obtained.

In the switch power supply unit 223, a region where the above-mentioned heat insulating plate 225 is not disposed is covered with a fine mesh net member (not shown) on the upper surface side to prevent foreign matter from entering the unit. Can be prevented.

Further, in the display device of this embodiment, as shown in FIGS.
, And an inverter unit 570 and a controller unit 572 are juxtaposed on the back side of the display unit 230 and the backlight unit 530.

Regarding the positional relationship between the inverter unit 570 and the controller unit 572, considering that the former generates a larger amount of heat during operation, the switch unit 233 is located above the region where the heat generation is smaller (ie, the power supply unit 233). (Secondary side), which is located diagonally above the portion where the above-mentioned heat insulating plate 225 is provided. Thus, the temperature distribution of the display panel P is improved to be more uniform.

According to experiments by the present inventors, in the liquid crystal panel P using ferroelectric liquid crystal, the effect of the positional relationship between the power supply unit and other units in addition to the heat insulating plate 225 of the present embodiment is as follows. The temperature distribution of the liquid crystal panel P is 1 to
A decrease of about 1.5 ° C. was observed, and it was confirmed that the display quality was uniform. <About the arrangement of the display unit 230, etc.>
As shown in (b), a display unit 230 is disposed above the heat insulating plate 225.

The display unit 230 has a cell frame 231 as shown in FIG. This cell frame 231
Is formed in a frame shape and has a large number of screw holes 231a,
(See FIG. 13) and can be attached to the front cover 201. Also, this cell frame 231
A cell fixing plate 233 is supported on the internal opening 231b of the cell via a cell elastic holding member (silicon resin) 232. Here, the cell elastic holding member 232 is formed of a rubber material, supports the cell fixing plate 233 in a suspended state, and suppresses transmission of vibration and impact between the cell frame 231 and the cell fixing plate 233. It is configured to be. The adhesion by the cell elastic holding member 232 is performed by filling a gap between the cell frame 231 and the cell fixing plate 233 with a rubber-based adhesive in a state where the cell fixing plate 233 is disposed in the cell frame 231 and curing the cell. That has been achieved. The cell fixing plate 233 has an opening 235 as shown in FIG.
have. Further, the cell frame 231 is formed of a resin in which glass fibers are dispersed.

On the upper surface of the cell fixing plate 233, an elastic member (silicon resin) 23 is formed along the periphery of the opening.
The liquid crystal panel (liquid crystal element) P is adhered to the cell fixing plate 233 by the elastic member 236. The liquid crystal panel P has the opening 235 closed from above. In addition, this elastic member 236
Rubber type that shows elasticity after curing (silicone rubber, etc.)
The liquid crystal panel P is bonded to the elastic member 236 before being cured. The elastic member 236 is arranged and fixed so as to surround the display area of the liquid crystal panel P.

Further, on the lower surface of the cell fixing plate 233, a ridge 237 is formed continuously along the entire periphery of the opening 235, and the diffusion plate 239 is formed on the ridge 237.
Is attached to close the opening 235 from below (see FIG. 14). And these cell fixing plates 233,
A substantially sealed space S1 is formed by the diffusion plate 239, the liquid crystal panel P, and the like.

Further, on the lower surface of the cell fixing plate 233, the narrow ridges 2 are formed so as to surround the ridges 237.
A frame-shaped sponge member 241 is attached between a backlight unit 530 (details will be described later) disposed below and the ridge 240. Then, the diffusion plate 239, the cell fixing plate 233,
A substantially closed space is formed by the ridge 240, the sponge member 241, and the backlight unit 530, and dust is prevented from entering the light emitting surface of the backlight unit 530 and the lower surface of the diffusion plate 239. . The sponge member 241 has elasticity, and is configured to absorb the vibration when the display unit 230 vibrates.

On the other hand, the opening 201a of the front cover 201 is closed by the display
1. A substantially sealed space S2 is formed by the display panel 242 and the liquid crystal panel P. When the liquid crystal panel P vibrates due to an external impact or the like, the vibration is early due to the air damper effect of the space S2. The shock is transmitted to the liquid crystal panel P after being attenuated. On the lower surface of the front cover 201, an elastic member 243 is attached in a frame shape along the entire periphery of the opening 201a, so that the liquid crystal panel P
And the front cover 201 to further partition the substantially sealed space S2 to enhance the air damper effect and prevent dust from entering the surface of the liquid crystal panel P. Further, the elastic member 243 has elasticity, and is configured to absorb the vibration when the liquid crystal panel P vibrates.

The liquid crystal panel P has a liquid crystal driving TAB.
Driver boards 400,... Are electrically and mechanically connected via 330,.
These driver boards 400,...
33 are supported on the ridges 437,. The structure and connection state of the TABs 330,..., And the support mechanism of the driver boards 400,.

The display plate 242 is attached to the surface of the front cover 201 in FIG.
8, a cell cover 703 is provided on the back side of the front cover 201 (the side on which the liquid crystal panel P is arranged), and as shown in FIG. It may be attached by an adhesive member 244 such as an adhesive tape (see FIG. 15). In such a case, the elastic member 243 such as a sponge
It may be formed in a frame shape along the entire periphery of the opening 703a of the cell cover 703 (see FIG. 92) and disposed between the liquid crystal panel P and the cell cover 703 (see FIG. 148).

In FIG. 12, the cell fixing plate 23
3, a ridge 237 for attaching the diffusion plate 239, and a ridge 24 to which the sponge member 241 abuts.
Although 0 has been formed, as shown in FIG. 16, it is also possible not to form a ridge on the lower surface of the cell fixing plate 233. In this case, the diffusion plate 239 is attached to the lower surface of the cell fixing plate 233, and the sponge member 241 is attached to the cell fixing plate 23.
3 is in contact with the lower surface. <Material of Cell Fixing Plate 233> Here, the material of the cell fixing plate 233 will be described.

In general, the liquid crystal panel P being driven has transparent electrodes (specifically, scanning electrodes 269,... And information electrodes 28).
The temperature rises due to Joule heat generated in (1,. Then, the heat in the peripheral portion of the liquid crystal panel P escapes through the cell fixing plate 233, so that a temperature distribution occurs in the panel P.
However, since this temperature distribution gives a distribution to the driving characteristics of the ferroelectric liquid crystal, it is ideally desirable to have no temperature distribution. Therefore, a material such as a resin having a low thermal conductivity is desired for the cell fixing plate 233.

When the orientation is deteriorated due to mechanical stress or the like applied at the time of assembling, it is necessary to heat the liquid crystal panel P to perform reorientation processing. The liquid crystal panel P is adhered to the cell fixing plate 233. Therefore, the cell fixing plate 233 is also heated during the reorientation heat treatment. For this reason, the cell fixing plate 233 is made of a material having a heat deformation temperature higher than 80 ° C. to 100 ° C. applied by the reorientation heat treatment (if the thermal expansion at this temperature is comparable to that of the liquid crystal panel substrates 262 and 280). In addition, the disorder of the orientation due to the concave deformation due to the reorientation heat treatment can be neglected).

From these points, as a material of the cell fixing plate 233, polycarbonate or the like that can be molded can be considered, and this polycarbonate is 6.6 × 10 ^−5.
/ Deg and the external dimensions of the cell fixing plate 233 are 300 mm × 370 mm, the room temperature (25 mm)
Substrate) 262, 280 (8
When × lO ^-6 / deg) will be calculated the difference in thermal expansion between the difference of elongation of the short side is the difference in elongation of 1.218mm, and the addition long side becomes 1.502Mm. That is, the distance between the liquid crystal panel P on the short side and the driver board 400 is about 0.
It expands by 6 mm and spreads about 0.75 mm on the long side. With this degree of elongation, the concave deformation of the liquid crystal panel P due to the reorientation heat treatment does not cause much problem, but this elongation is caused by the connection between the liquid crystal panel P and the liquid crystal driving TAB 330 or the driver board 400 and the liquid crystal. Drive TA
Since it concentrates on the connection with B330, the connection is broken. Therefore, in consideration of the disconnection of the connection portion and the like, it is necessary to select a material having a small linear expansion coefficient such as a glass substrate used for the liquid crystal panel P as the material of the cell fixing plate 233.

Therefore, in this embodiment, the resin material having a small linear expansion coefficient often contains an additive (for example, glass fiber) for suppressing the linear expansion. The made polycarbonate is used for the cell fixing plate 233. That is, the cell fixing plate 233 is formed of a material (polycarbonate containing 30% of acicular glass fibers) having a small linear expansion coefficient anisotropy and a small coefficient itself.

When the cell fixing plate 233 is formed by mold molding, the additive is acicular, and if the molding base is simply poured into the mold, the needle-like additive is distributed along the flow of the molding base. Therefore, the coefficient of linear expansion becomes anisotropic. Therefore, in this embodiment, in order to reduce the anisotropy of the coefficient of linear expansion, four injection holes are provided at the center of each side of the mold of the cell fixing plate 233, and the molded base is injected. FIG. 17 is a perspective view for explaining the mold. The mold 250 includes a lid 250a and a mold 250b.
, And air vent holes 252. Thereby, the glass fibers have a non-uniform direction (random direction) and can be uniformly dispersed.

With the structure described above, even if the re-orientation heat treatment is performed, the liquid crystal panel P and the liquid crystal driving TAB
The connection between the liquid crystal panel P and the driver board 400 and the connection between the liquid crystal driving TAB 330 and the driver board 400 are not broken, and the alignment is not deteriorated due to the warpage generated in the liquid crystal panel P due to the realignment heat treatment. <Regarding Liquid Crystal Panel P> Next, the structure of the liquid crystal panel P will be described with reference to FIGS.

As shown in FIG. 18, the liquid crystal panel P has a pair of electrode substrates 26 arranged in parallel so as to face each other.
0,261.

The upper electrode substrate 260 is a transparent 1.1 mm thick glass substrate 262 (hereinafter referred to as “upper substrate 26”).
2 ″), and a substrate (transparent substrate) 2
The color filters 263R, 263G, 263B, 263W (1.5 μ
m thickness) are arranged with a predetermined gap. Also, in the gap between the color filters 263R,.
A black matrix 265 made of a Ta alloy and having a thickness of 1000 ° is arranged. The upper substrate 2
A blue plate glass having a SiO ₂ film formed by polishing one side is used for 62.

Further, the black matrix 26
5 and the color filters 263R,...
Is covered by a passivation layer 266 of
The thickness of the passivation layer 266 is 500
For example, a SiO ₂ film 267 of Å is formed. Further, on the surface of the SiO ₂ film 267, a large number of stripe-shaped scanning electrodes 269,... Are formed by ITO to a thickness of about 700 °, and the scanning electrodes 269,.
Surface, for example, MoTa (400 mm thick) / AlSi
Metal electrodes 270,... Having a three-layer structure of Cu (1000 mm thick) / MoTa (200 mm thick) are formed, and play a role of reducing the electric resistance and increasing the driving speed of the liquid crystal panel.

The electrodes 269,..., 270,
Are covered with an insulating film 271. This insulating film 271 is composed of a TaO _X layer having a thickness of 900
It is configured by laminating a Ti-Si layer of 0 ° and further contains fine particles. Further, on the surface of the insulating film 271, an alignment control film 2 made of polyimide is formed.
72 are formed to a thickness of about 200 °.

On the other hand, the lower electrode substrate 261 is similarly made of a transparent 1.1 mm-thick glass substrate 280 (hereinafter, referred to as “lower substrate 2”).
80 "), and the lower substrate (transparent substrate)
A number of stripe-shaped information electrodes 281,... Made of ITO are formed on the surface of the 280. The lower substrate 2
For the glass plate 80, blue sheet glass having one surface polished and formed with an SiO ₂ film as necessary is used.

A matrix electrode is formed by the information electrodes 281,... And the scanning electrodes 269,. Further, the surface of these information electrodes 281,...
Metal electrodes 282 having a three-layer structure of about 2,000 mm thick / MoTa (about 200 mm thick) are formed. These electrodes 281,. It is covered with a film 283 and further covered with an orientation control film 285.

Then, these electrode substrates 260, 261
A large number of spacers 290,... Are arranged in the gap, and are defined so that the gap between the substrates is constant. Further, in the gap, a particulate adhesive (trade name “Trepearl”) 291,... And a sealing material 292 are also arranged.
The two electrode substrates 260 and 261 are bonded. Further, a ferroelectric liquid crystal 293 is sandwiched between the substrates.

.. And the information electrode 2
81,... May be formed of In ₂ O ₃ other than ITO.

[0061] The insulating film 271 may be a SiO ₂ film formed by sputtering, SiO ₂
In addition, an inorganic insulating material such as Ta ₂ O ₅ may be used.
An inorganic insulating film obtained by applying and firing an organometallic compound containing at least one element of i, Ti, Ta, Zr, Al and the like can also be used. The film thickness is 200 mm.
It may be in the range of up to 3000 °.

Further, the alignment control film 272 can be obtained by applying a polyimide forming solution with a spinner and heating at a temperature of 270 ° C. for 1 hour, but is not limited to polyvinyl alcohol, polyimide, polyamideimide, polyesterimide, polyparaxylylene. , Polyester, polycarbonate, polyvinyl acetal, polyvinyl chloride, polyamide, polystyrene, cellulose resin, melamine resin,
An organic insulating material such as a urea resin or an acrylic resin may be used. The thickness may be in the range of 50 ° to 1000 °. Then, the surface of the orientation control film 272 is rubbed in one direction with a nylon rubbing cloth, whereby a uniaxial orientation axis having an orientation regulating force substantially in the same direction as the rubbing direction is provided.

Further, when the upper and lower substrates 262 and 280 are bonded to each other, for example, bead spacers 290,... (Silica beads, alumina beads, etc.) having an average particle size of about 1.5 μm are scattered on one substrate, and A sealing material 292, which is an epoxy resin adhesive, is formed by screen printing, and these two substrates 262 and 280 are
The seal material 292 was solidified by heat treatment, with the gap being held at an interval of μm to 3 μm. Thereafter, the liquid crystal panel P was manufactured by injecting the ferroelectric liquid crystal 293.

Next, the shape of the color filters 263R,... Will be described with reference to FIGS.

FIG. 19 is a sectional view taken along the line BB of FIG. 18. As shown in FIG. 19, the color filters 263R,... Of the four colors RGBW are rectangular and adjacent to each other at a predetermined distance. ing. These four color filters 263R,
Are formed in the portions where... Are arranged, and a predetermined color is displayed by a combination of the colors of light transmitted through these color filters 263R,. Note that these four color filters 2
As shown in FIG. 20, transparent scanning electrodes 269 are formed in the area where 63R,... Are arranged. The metal electrodes 270,...
Are provided with openings 270a,... In the areas where the 3Rs,... Are arranged, so as to transmit light from the backlight unit 530.

On the other hand, FIG. 21 is a sectional view taken along the line AA in FIG. 18, and as shown in FIG.
(Which overlap the color filters 263R,...) And narrow portions 281b,... Are formed in a comb shape, and a pair of adjacent information electrodes 281 are formed.
A, 281B are arranged so that these wide portions 281a,. And
The illustrated four wide portions 281a, 281a, 281a,
281a is the above-described four color filters 263R,
Are arranged so as to overlap with each other to form four pixels (see FIG. 22). The metal electrodes 282 are formed along the edges of the information electrodes 281.

Incidentally, the above-mentioned substrates 262 and 280 have different shapes.
As shown in the figure, the left edge 262a when the panel is viewed from the display side.
In FIG. 7, the wide upper substrate 262 protrudes from the lower substrate 280, and the upper and lower edges 280a and 280b protrude from the lower substrate 280, which has a narrower shape than the upper substrate 262. Note that neither of the substrates 262 and 280 is projected at the right edge of the panel when viewed from the display side.

According to the present invention, in the liquid crystal panel P, at least the left edge 262a (substrate 262 side), the upper edge 280a and the lower edge 280b (substrate 280 side) have a liquid crystal driving TAB 330 as shown in FIG.
(A) and (B) can be implemented. On the other hand, an injection port for introducing liquid crystal into the panel is provided at an edge where the driving TAB is not mounted. A thermistor 310 for detecting the temperature during driving of the liquid crystal of the panel is attached to the edge where neither of the substrates 262 and 280 protrudes to compensate for the temperature of the liquid crystal display device (see FIG. 28 for details).
Along below). Then, the above-described scanning electrodes 269,.
Are the left edges 2 of the upper substrate 262 together with the metal electrodes 270,.
62a are extended to the outside, and the other information electrodes 281 are also extended to the upper and lower edges 280a, 280b of the lower substrate 280 together with the metal electrodes 282, and are exposed to the outside. I have. <Shape of Each Electrode at the Edge of the Substrate> Here, the shape of each electrode at the edge of the substrate 262a, 280a, 280b will be described with reference to FIG. Since the electrodes at the edge of the substrate have substantially the same configuration in the upper substrate 262 and the lower substrate 280, the left edge 26 of the upper substrate 262
, And the metal electrodes 270,.
.. Will be described, and the other lower substrate 280 will be described.
Information electrodes 28 at the upper and lower ends 280a and 280b
, And the description of the shapes of the metal electrodes 282,.

FIG. 25 shows the left end 262a of the upper substrate 262.
Is a diagram showing the arrangement of scanning electrodes 269,... And metal electrodes 270,. The upper substrate 2 in FIG.
The lower edge of 62 corresponds to the left edge 262a of the upper substrate 262 in FIG. 24 (hereinafter, referred to as “exposed portion 262a”). The hatched portions in FIG. 25 indicate the scanning electrodes 269,
. And the metal electrodes 270 are shown.

As shown in the figure, in the region 262A of the central portion of the upper substrate 262 (the central portion in the width direction of the upper substrate 262 in a direction orthogonal to the longitudinal direction of the scanning electrodes 269,...), A large number of stripes are formed. The scanning electrodes 269,.
Extend to the exposed portion 262a of the upper substrate 262 with the same cross-sectional shape, and metal electrodes 270,. However, the upper substrate 26
2 except for the exposed portion 262a.
Are the same as the formation width of the scanning electrodes 269,.
The scanning electrodes 269,...
(However, as described above, the openings 270 are provided in the portions corresponding to the color filters 263R,.
a,... are formed. ), At the exposed portion 262a of the upper substrate 262, only the both edges of each scanning electrode 269,... Are covered with the metal electrodes 270,.
The central portion of each scanning electrode 269 has a non-laminated structure.

On the other hand, regions 262 on both sides of region 262A
B ₁ , 262B ₂ and at the exposed portion 262a,
Wide portions 300, 300 made of transparent electrodes are formed in a rectangular shape, respectively. Marks for visually performing alignment (second alignment mark, fourth alignment mark) are formed on the surfaces of these wide portions 300, 300. Alignment mark.
Two “substrate-side visual marks”) 301 and 301 are formed. These substrate side visual marks 301,... Are formed in a horizontally long rectangular shape and are parallel to each other with a predetermined gap as shown in the figure, and are formed of the same material as the metal electrodes 270,. Have been. The region 262B ₁ adjacent to the region 262A
And at a portion other than the exposed portion 262a, a plurality of (four in the figure) electrodes 299,.
And the metal electrodes 270 are stacked, and the scanning electrodes 269 are electrically connected to the wide portions 300 described above. Furthermore, the region 262B ₂ of the other side (left side in the drawing), and in the portion other than the exposed portion 262a of the upper substrate 262, electrode 299 having a stacked structure of the scan electrode 269 and the metal electrode 270 is only one form The scanning electrode 269
The wide part 300 is also electrically connected to the wide part 300.

On the other hand, these regions 262B ₁ and 2
The outer 62B ₂ alignment marks 303 and 303 are respectively formed. These alignment marks 30
Are made of the same material as the metal electrodes 270, and have a small circular shape. Further, while the above-described board side visual marks 301, 301 are to be visually inspected, these alignment marks 303, 303 are provided.
Is a target of image recognition by the camera (hereinafter, referred to as “substrate-side automatic marks 303, 303”). In the present embodiment, the liquid crystal panel P has 262
Electrode 299 formed on the A region, ... is adapted to be driven by other areas 262B _1, 262B ₂ electrode 299 formed on, ... is a ground electrode. <Regarding the Polarizing Plate 321> Incidentally, the polarizing plates 321 and 322 are provided on both upper and lower surfaces of the liquid crystal panel P as shown in FIG.
Are adhered, and among them, the surface of the polarizing plate 321 on the side facing the display plate 242 is subjected to a diffusion treatment.

The display plate 242 is a glass plate which has been subjected to a chemical strengthening treatment, and both surfaces thereof are diffused by a chemical treatment such as an anti-glare treatment, a boric acid treatment, a honing treatment, a film formation treatment, or a physical treatment. Surfaces 242a, 242b
Are formed.

In the present embodiment, for example,
The haze of the polarizing plate 321 is set to 25%, and the display plate 2
Assuming that the haze of the liquid crystal panel P is 5%, the haze of the diffusion surface (diffusion surface of the display panel 242) closer to the liquid crystal panel P is higher than that of the diffusion surface (242a, 2
42b) is set to be larger than the haze. In addition, the above-described diffusion process is achieved by finishing the surface with irregularities. In the present embodiment, the average distance between the irregularities on the diffusion surface is set to 20 to 25 μm with respect to the minimum pixel width of 50 μm of the liquid crystal panel P. (1/2 or less of the minimum pixel width of 50 μm).

In this embodiment, the surface of all members arranged on the viewing side of the liquid crystal panel P (ie, the surface of the polarizing plate 321 and both surfaces of the display plate 242) is subjected to diffusion processing. Therefore, the reflection of light from the external light source is reduced, and the display of the liquid crystal panel P is easily recognized. As a result of measurement by the present inventors, it was confirmed that the reflectance of the display device main body 200 according to the present embodiment was 6%, which was reduced to one third or less of the conventional device.

When the degree of haze due to the diffusion process performed as described above is large, generally, if the distance between the liquid crystal panel P and the diffusion surface is large, characters and figures displayed on the panel are blurred. In the present embodiment, the degree of haze of the polarizing plate 321 attached to the liquid crystal panel P is set to be higher than the degree of haze of the display plate 242 disposed at a distance from the panel P. Therefore, such blurring can be reduced, and as a result, the display contents of the liquid crystal panel P can be clearly recognized.

In general, when the shape of the unevenness formed for the diffusion process is rough, optical unevenness occurs in the display and the image looks glare. The anti-glare effect is weakened without blurring the outline. However, in the present embodiment, since the average interval between the unevenness of the diffusion surface is set to 20 to 25 μm with respect to the minimum pixel width of 50 μm of the liquid crystal panel P as described above, there is no problem as described above, Good quality can be maintained.

The display plate 321 is not limited to the one having the diffusion surface formed by the chemical treatment or the physical treatment as described above. As shown in FIG. 27, a commercially available non-glare film is formed on both sides of the chemically strengthened glass. (Material, PET, haze is 5%) 323, 324 may be attached. Also in this case, the surface of the polarizing plate 321 is subjected to a diffusion treatment, and its haze is 25%. In addition, the shape of the surface subjected to the diffusion processing is such that an average interval of unevenness is 20 to 25 μm for a minimum pixel width of 50 μm of the liquid crystal panel.
It is. With this configuration, since the chemically strengthened glass is used for the display plate 242, the glass is less likely to be damaged than a normal glass plate, and the chemically strengthened glass is less likely to bend than a general glass plate. In addition, the gap between the display panel 242 and the liquid crystal panel P can be reduced. Therefore, blurring of display contents is reduced, and visibility is improved. Further, it is possible to make the haze of the display panel 242 higher than that in the above-described embodiment by the amount corresponding to the reduction in blur, and in that case, the reflectance is further reduced. Further, the display plate 242
Because films 323 and 324 are attached to the surface of
Even if a large force acts on the display panel 242 to break the display panel, the display panel is not scattered.

Further, a low-reflection coating (low-reflection treatment) may be applied to the surfaces of the diffusion surfaces formed on the surfaces of the display plate 242 and the polarizing plate 321. This coating is applied by a method such as dip, potting, spray, sol-gel, vapor deposition, etc., and the coating layer is formed in a single layer or a multilayer. Thereby, the reflectance can be further reduced. According to actual measurements made by the inventor, the reflectance was about 1/6 that of the conventional example. <Regarding the thermistor 310> In the present embodiment, as shown in FIG. 28, the TAB 330,... Is not connected to the right edge when viewed from the display side of the liquid crystal panel P, so that it contacts the edge. A thermistor 310 is provided. Hereinafter, the structure of the thermistor 310 will be described with reference to FIG.
9 and FIG. 30.

The thermistor 310 is connected to a lead wire 311 as shown in FIG. 29, and the lead wire is fixed to an elastic member 313 by a silicon resin 312. The elastic member 313 is formed of a silicone foam sponge or the like and has a substantially U-shaped cross section (see FIG. 30). A fixing member 315 is arranged so as to wrap these elastic members 313 and the like, and lower end portions 315a, 315 of the fixing member 315 are provided.
The thermistor 310 is arranged at a predetermined position based on fixing the 15 a to the cell fixing plate 233. In this fixing, the elastic member 313 is pressed against the liquid crystal panel P from the end face 313a opposite to the thermistor 310 so that the liquid crystal panel P is urged. In order to allow the thermistor 310 to accurately detect the temperature of the liquid crystal panel P, as shown in FIG. 29, the periphery of the thermistor 310 except for an elastic member 313 such as a silicone foam sponge is used.
Only air with high thermal resistance is present.

In this embodiment, the thermistor 31
0 is an edge in the display panel P that is located at a substantially uniform distance from various heat sources during driving, or where no TAB is mounted from the viewpoint that heat is not localized, It can be installed below the midpoint of the vertical axis of the panel. Thus, the thermistor 310 can observe the average temperature of the liquid crystal on the entire surface of the panel, and can perform more accurate temperature compensation in driving the liquid crystal with the uniformity of the temperature inside the liquid crystal panel as described above. Become. <About the anisotropic conductive adhesive film 320,...> By the way, the edges 262a, 280a,
As shown in detail in FIG. 24, a large number of anisotropic conductive adhesive films 320,... Are bonded to 280b. ...) are the respective substrates 262,
280 (see FIGS. 31, 32, and 33).
reference). The liquid crystal driving T connected to the upper substrate 262
32, one surface (upper surface shown) is adhered to the upper substrate 262, and the other surface (lower surface shown) is adhered to the driver board 400, as shown in FIG. Further, in the liquid crystal driving TABs 330 connected to the lower substrate 280, the same surface (the lower surface in the drawing) is bonded to the lower substrate 280 and the driver board 400 as shown in FIG.

Here, the anisotropic conductive adhesive film 320 will be described.

The anisotropic conductive adhesive film 320 is formed of a curable resin which forms a cured body under predetermined heating and curing conditions, and the resin contains conductive particles dispersed therein. The conductive particles include metal particles or alloy particles such as Ni, Au, Ag, and solder, and the resin spherical particles include Ni, A
Good conductive particles coated with a metal such as u are used. Further, the resin spherical particles having the same coefficient of linear expansion as the curable resin can be used. The conductor is contained in an amount of 0.5 to 5.0 parts by weight, preferably 5 to 20 parts by weight, based on 100 parts by weight of the solid content of the curable resin, and has an average particle size of 5 to 50 μm. Preferably it is 10 to 30 μm.

As the thermosetting resin used in the present invention, a thermosetting epoxy resin, a thermosetting silicone resin, a thermosetting polyimide resin, or the like can be used.

[0085]

(Equation 1) It is desirable to determine each value so that

Further, the electrode pitch is preferably 125
The effect is more enhanced when the density is higher than the pitch of 8 μm (8 lines / mm), more preferably, higher than the pitch of 100 μm (10 lines / mm).

The optimum relationship between the electrode pitch and the electrode width is determined by the anisotropic conductive adhesive film 320 used.
It is desirable to determine the size according to the size and the degree of dispersion of the 0 conductive particles. Nevertheless, the ratio between the space between the electrodes and the electrode width is usually 1: 1.

Further, these terminals 332,.
A liquid crystal driving IC 350 is mounted between 3,... By TAB. Here, the liquid crystal driving IC 350 will be described with reference to FIGS. 38 to 43 (hereinafter, the driving IC in the scanning liquid crystal driving TAB is referred to as “scanning IC 350
A "and drive IC for TAB for information side liquid crystal drive
Is referred to as “information side IC 350B”).

As shown in FIG. 38, the scanning IC 350A has a control circuit 351. The control circuit 351 has various signals (chip select input XCS, common latch) from the drive controller 450 via the driver board 400. Signal XCLTCH,
The common sampling clock input CSCLK and the common output clear input XCCLR) are input. here,
The chip select input XCS is a signal for selecting a chip (see Table 1).

[0090]

[Table 1] However, at the time of double scanning, it follows the input / output timing.

Further, the common latch signal XCLTCH is
It is a transfer enable signal of the sampled address data, and is a common sampling clock input CSCLK.
Are CWFD0 to CWFD3, XCLTCH, CA0
CA6, XCS synchronization signal. Note that XCLTCH
Assuming that 1H is between "L" and the next "L", the number of CSCLK clocks during 1H cycle is 2 or more. Further, the common output clear input XCCLR exclusively sets the channel output to the VC level regardless of the state of other logic input signals. (L active) At this time, the internal logic continues to operate.

On the other hand, a decoder 352 is connected to the control circuit 351.
Common address inputs CA0 to CA6 and common direction CDIR are input. Here, the common address inputs CA0 to CA6 are signals for designating address data, and the common direction CDIR is a signal for switching the correspondence between the address data and the output channel. Specifically, it is as shown in Table 2.

[0093]

[Table 2] On the other hand, the scanning-side IC 350A includes two logic circuits 353 and 355.
3, common waveform data CWFD0 to CWFD3 are input. This common waveform data CWFD0 to CWF
D3 is a data signal for setting a quaternary output waveform (see Table 3).

[0094]

[Table 3] However, CWFD2 and CWFD3 are valid only during double scanning. Condition 1: CWFD0, CWFD1 When standard scanning (M2 = L), M0, M1, M2, C
The voltage level during the 1H cycle of the output selected by An is determined.

When double scanning (M2 = H), M0, M
1, M2, and CAn determine the voltage level during the first 1H cycle of the output selected. Condition 2: CWFD2, CWFD3 When standard scanning (M2 = L), CWFD2, CWFD
3 is fixed at "L" or "H".

In the case of double scanning (M2 = H), M0, M
The voltage level during the 1H cycle of the 2H of the output selected by 1, M2, and CAn is determined. However, the voltage level of the output not selected in the conditions 1 and 2 is the VC level.

Further, mode setting inputs M0 to M2 are input to the other logic circuit 355 (see Table 4).

[0098]

[Table 4] Further, the scanning-side IC 350A is a common driver 35.
The common driver 356 includes a quaternary level power supply (FLC driving quaternary level power supply) V1, which is applied to the scanning electrodes 269,... To drive the liquid crystal panel P.
V5, VC, and V2 are input.

Further, a reset input XCRESET is input to the scanning IC 350A. All registers are reset by the reset input XCRESET, and outputs of all channels are set to the VC level. In addition, the power supply VEE for the FLC drive output circuit and the power supply VDD for the logic are input to the scanning side IC 350A, and the high breakdown voltage output system GNDVSS
1 and the logic system GNDVSS2 are connected.

Then, based on the input of the various signals described above to the scanning IC 350A, the scanning IC 350A
Output common signal outputs (scanning signals) C1 to C128 (see FIG. 39).

As shown in FIG. 40, the information-side IC 350B includes a control circuit 360. The control circuit 360 includes a driver board 400
Various signals (cascade input SDI, cascade output SDO segment latch signal XSLTCH, clock input SCL
K, segment output clear input XSCLR). Here, the cascade input SDI is an input of the cascade signal, and the cascade output SDO is an output of the cascade signal. Also, the segment latch signal XSLT
CH is a signal for controlling the sampling and holding of the image data. The sampling of the image data is performed at the L level, and the holding of the image data is performed at the H level. And the held data is SW
Determining a segment output in the FD _n and XSCLR. Further, the clock input SCLK is a clock of a register, and data ID0 to ID7 are output by rising edges.
Is to be latched. Further, the segment output clear input XSCLR is a signal for exclusively setting the channel output to the VC level regardless of the state of other logic input signals. Even if the channel output is set to the VC level, the internal logic continues to operate.

On the other hand, this information-side IC 350B has 8-bit data MPX361, and image data inputs ID0 to ID7 and a sampling direction setting input SDIR are input to the 8-bit data MPX361. Here, the sampling direction setting input SDIR is a signal for setting the sampling order (left sampling / right sampling) of the image data (see Table 5). Also,
Table 6 shows the correspondence between image data and channels.

[0103]

[Table 5]

[0104]

[Table 6] On the other hand, the information side IC 350B includes a logic circuit 362, and the segment sampling clock SSCLK and the segment waveform data SWFD0 to SWFD3 are input to the logic circuit 362. Among them, the segment sampling clock SSCLK has SWFD0 to SWFD3 and XSL at its rising edge.
This is a signal for sampling the TCH, and the segment waveform data SWFD0 to SWFD3 are data for setting a ternary output waveform (see Table 7).

[0105]

[Table 7] The information side IC 350B is a segment driver 363.
The segment driver 363 includes F
LC drive three-level power supplies V3, VC, V4 and test inputs XSTEST0, XSTEST1 are input (see Table 8).

[0106]

[Table 8] Further, a reset input XS is provided to the information side IC 350B.
RESET is input and this reset input XSR
As shown in Table 9, the ESET resets the channel output to VC when it is at the L level (it also has a power-on reset function).

[0107]

[Table 9] Further, the power supply VEE for the FLC drive output circuit and the power supply VDD for the logic are input to the information side IC 350B, and the high withstand voltage output system GNDVSS1 and the logic system GNDVSS2 are connected.

Then, based on the various signals input to the information side IC 350B, the information side IC 350B
From the segment signal output (information signal) S1 to S160
Is output (see FIG. 41).

FIGS. 42 and 43 show scanning-side ICs.
The wiring state of the information IC 350B and the information side IC 350B is shown.

Next, the detailed shapes of the output terminals 333 will be described with reference to FIGS.

Output terminal 33 of TAB 330 for driving liquid crystal
As shown in detail in FIGS. 44, 45, and 46, TAB side marks (first alignment mark, third alignment mark) 370, 370, 371, 3,.
371 are formed. That is, 3 counting from the outside
Positioning marks 370, 370 (hereinafter, “T”) for visual adjustment are provided between the first and fourth output terminals 333, 333.
AB-side visual marks 370, 370 ") are formed, respectively, and alignment marks 371, 371 (for automatic adjustment) are formed at the portions where the first output terminal 333 and the second output terminal 333 are formed. In the following, “TAB-side automatic marks 371, 371” are formed.The base film portion 331 is formed in the portion SA where these marks 370,. Are not formed, and the output terminals 333,... Are exposed.
Are formed of the same material as the output terminals 333, that is, those obtained by plating the surface of a copper foil with Au plating, Sn plating or Ni plating. Specifically, these marks 370,..., 371,.
Are left without being etched away when patterning... In addition, these marks 370, ...,
The output terminals 333 that do not contribute to 371,.
Are formed in a number and a gap corresponding to the electrodes 299,... Formed in the region 262A of FIG. Mark 370,
, 371,... Four left and right output terminals 333,
333, 333, and 333 are regions 262B ₁ ,
It has become so connected to the wide portion 300, 300 formed in the 262B _2. Furthermore, the substrate side visual mark 30
47 are formed at positions sandwiching the TAB side visual marks 370 without overlapping with each other when the liquid crystal panel P and the liquid crystal driving TAB 330 are properly connected, as shown in detail in FIG. And TAB side automatic mark 3
, And the substrate-side automatic marks 303,... Are formed at positions not overlapping each other.

By the way, the above-described liquid crystal driving TAB 33
The alignment between 0 and the liquid crystal panel P is performed by a dedicated alignment device.

The apparatus has a liquid crystal panel alignment unit (not shown) on which the liquid crystal panel P is placed.
The unit is configured to be movable. The apparatus also includes a TAB alignment unit (not shown) on which the liquid crystal driving TAB 330 is placed, and the unit is also configured to be movable. Furthermore, the liquid crystal panel P
4 (the opposite side of the liquid crystal drive TAB 330)
As shown in FIG. 8, the liquid crystal panel P and the liquid crystal driving TAB3
A camera CA for recognizing the position of the substrate 30 is disposed, and recognizes the substrate side automatic marks 303,... Under illumination by coaxial incident light, and recognizes the TAB side automatic marks 371,. It is configured as follows.

Next, the liquid crystal panel P and the liquid crystal driving TAB3
FIGS. 49 and 50 show the operation at the time of the alignment with FIG.
It is explained along. Here, FIG. 49 shows the positional relationship between the liquid crystal driving TAB 330 and the liquid crystal panel P during alignment, and FIG. 50 shows the positional relationship after the alignment is completed.

Now, the liquid crystal panel P is provided with a liquid crystal driving TAB3.
When connecting the liquid crystal panel 30, the liquid crystal panel P is placed on the liquid crystal panel alignment unit, and the liquid crystal driving TAB 33 is mounted.
0 is placed on the TAB alignment unit. This placing operation may be performed automatically by a dedicated device, or may be manually performed by an operator.

Then, the substrate 262 and the TAB for driving the liquid crystal
330 are visually recognized, or the board-side visual marks 301,...
Approximate alignment (coarse adjustment) is performed using 0,.
The TAB side visual marks 370,... And the TAB side automatic marks 371,.
2B ₁ region or the metal electrode 270 located 262B outside the area of the _second region), so as not to overlap and so on. In addition,
In this coarse adjustment stage, as shown in FIG. 49, output terminals 333 on the TAB side and electrodes 299 on the glass substrate side.
Is out of alignment.

Next, when automatic fine adjustment by a camera or the like is started, the TAB-side automatic marks 371,... Held at an appropriate position (recognizable range) by the coarse adjustment become transparent substrate 262 and anisotropically. .. Are recognized by the camera CA via the conductive adhesive film 320 (previously thermally transferred to the substrate side), and the other substrate side marks 301... Are recognized via the transparent substrate 262. The image recognition information from the camera CA is sent to a predetermined information processing unit (not shown), and the processing unit calculates the amount of deviation between the marks 371 and 301. This displacement amount is sent as a signal to an alignment drive unit (not shown), and the drive unit finely adjusts the positions of both alignment units so that the displacement amount becomes an appropriate value. Thus, the alignment between the liquid crystal panel P and the liquid crystal driving TAB 330 is completed, and the positional relationship between them is as shown in FIG. The position adjustment is performed by driving the liquid crystal panel alignment unit, the TAB alignment unit, or both. Further, the operator confirms whether or not such automatic fine adjustment has been accurately performed, based on the relative positions of the visual marks 301 and 370. <About the thermocompression bonding device> As described above, when the alignment between the substrate 262 and the liquid crystal driving TAB 330 is completed, thermocompression bonding is performed by the thermocompression bonding device, and the substrate 262 and the liquid crystal driving TAB 330 are electrically and mechanically connected. Connected to. Next, this thermocompression bonding apparatus will be described with reference to FIG.

The thermocompression bonding device 390 is used at 150 to 300 ° C.
The head 391 is configured to be moved up and down by means (not shown). As shown, the tip of the thermocompression bonding head 391 is formed smaller than the exposed width of the output terminal 333 and has a cross-sectional shape corresponding to the connection portion.
The liquid crystal drive TAB 330 is pressed only at the connection portion. Specifically, the width of the connection portion is about 1.5 to 2.0 mm, and the width of the thermocompression bonding head 391 is 1.5 mm. Also, this thermocompression bonding head 391
Is formed of a high-resistance metal or alloy, for example, molybdenum or stainless steel. A heating power supply (not shown) is connected to this thermocompression bonding head 391, and a power supply (generally, a voltage of 50 V to 500 V, preferably 80 V to 200 V and a current of 0.1 A to 10 A, preferably about 1 A to 5 A). The thermocompression bonding time is about several seconds.

On the other hand, below this thermocompression bonding head 391, a compression bonding sheet 392 is arranged. A Teflon film (Nitto Denko Nitoflon R No. 900UL) having a thickness t = 0.05 mm is used for the pressure-bonding sheet 392. In addition, 70 to 70
A material having a compressive strength in the range of 170 kgf / cm ² , for example, an ethylene tetrafluoride film, may be used. Further, a stage 393 is arranged below the thermocompression bonding head 391, and an end of the liquid crystal panel P is mounted on the stage 393 during thermocompression.

When connecting the liquid crystal panel P to the liquid crystal drive TAB 330, the anisotropic conductive adhesive film 320 is previously mounted on the surface of the substrate 262 as described above. Next, as described above, the liquid crystal panel P and the TAB for driving liquid crystal are used.
After positioning with 330,
The liquid crystal panel P and the liquid crystal driving TAB 330 are connected by thermocompression bonding via a compression bonding sheet 392 by a thermocompression bonding head 391 heated to 150 to 300 ° C.

The width of the thermocompression bonding head 391 is 1.5
However, the width is not limited to 80 mm and may be 80% or less of the exposed width of the terminal 333, specifically, within a range of 1 to 2 mm. This allows the adhesive resin of the anisotropic conductive adhesive film 320 to flow to a portion that does not contribute to the connection of the terminal 333 (the longitudinal direction of the terminal 333),
Resin remaining between the liquid crystal panel side electrode and the terminal 333 can be reduced, and the extruded resin can be prevented from moving the terminal 333 in the lateral direction. In addition, by appropriately setting the exposed width of the terminal 333 and the width of the thermocompression bonding head 391, the length of the electrode 333 contributing to connection can be set to 1 mm or more, and high connection reliability can be maintained.

Further, the thickness of the pressure-bonding sheet 392 is set to 0.
The thickness is in the range of 25 to 50 μm, but if the thickness is in the range of 25 to 50 μm, the TAB side terminal 3 has good thermal conductivity.
The effect of pinching the terminal 33 is generated, and the bending of the TAB side terminal 333 can be further prevented.

Next, the liquid crystal panel P and the liquid crystal driving TAB3
The connection structure with 30 will be described with reference to FIG.

In the liquid crystal driving TAB 330, FIG.
As shown in detail in FIG. 2, the base film portion 331 is partially removed in the region D 'to expose the output terminals 333, and these output terminals 333 are connected to the scanning electrodes 269,... Or the information electrodes 281,. Are aligned and connected.

On the surfaces of the substrates 262 and 280, an anisotropic conductive adhesive film 320 is previously mounted on a portion corresponding to the region F 'of the output terminal 333, and the output terminal 333 and the substrates 262 and 280 (Accurately, information electrode 2
81,... Or the scanning electrodes 269,...) Are connected only in the region F ′. In the region E ′ in the drawing, the output terminal 333 is not fixed and is exposed. Note that reference numeral 395 in the drawing is a coat resin.

As shown in FIG. 53 (cross-sectional view along the line CC 'in FIG. 57), the liquid crystal panel P and the liquid crystal driving TA
The connection portion with B330 may be covered with silicon resin 396. Thereby, the corrosion resistance and connection strength of the connection portion are improved, and the reliability of the display device main body 200 is improved. The hardness of the silicone resin 396 is set to 5
By setting the angle to 0 degrees or less, the connection portion between the liquid crystal panel P and the liquid crystal driving TAB 330 can be made flexible, and breakage when deformation stress is applied can be suppressed. <About driver board 400> TAB for liquid crystal drive
Are fixed to the liquid crystal panel side as described above, while the other input terminals 332 are fixed to the driver boards 400.

In the present embodiment, three driver boards 400, 400, 400 are provided, and these driver boards 400,... Are, as shown in FIG. It is arranged on each side. The left driver board (scanning driver board) 400L is connected to the scanning electrodes 269,... Via the liquid crystal driving TABs 330,. TAB33 for liquid crystal drive
0,... Are connected to the information electrodes 281,.
However, the information electrodes 281,... Are alternately extended vertically as shown in FIG.
Every other information electrode is connected. In the following, when it is necessary to distinguish between the left and upper and lower driver boards 400,..., The left driver board is referred to as “common driver board 400L” and the upper driver board is referred to as “upper driver board 400”.
U ", and the lower driver board is referred to as" lower driver board 400D ".

Here, the structure of the driver board 400 will be described with reference to FIG.

The driver board 400 is formed in six layers using an epoxy resin containing glass fiber as a base material, and a resist film is formed on upper and lower surfaces thereof (not shown). A wiring layer made of copper is mounted on each base material.

On the first layer 401 of the driver board 400, a large number of connection electrodes 401a,... Are formed, and the liquid crystal driving TAB 330 is connected (details will be described later). As shown in FIG. LCD driving IC 350A,
, 350B,..., Liquid crystal driving power supplies V1, V
5, VC, V2 and various signals.
The second layer 402 is a signal line layer, to which address signals CA0 to CA6, waveform setting signals CWFD0 to 3 and the like are sent. Further, the third layer 403 is formed of GN
The D layer is maintained at the reference potential VSS. Further, the fourth layer 405 is an analog power supply layer to which power supply VEE for an output channel is applied.
The fifth layer 406 is a logic power supply layer to which a logic power supply VDD is applied. Further, the sixth layer 407 is a connector mounting surface, on which connectors 490,.
. And the driver controller 450 for inputting and outputting signals and power.

By the way, the driver board 4 having the above-described configuration is used.
00 is electrically and mechanically connected to the liquid crystal drive TABs 330,... The connection structure will be described with reference to FIGS.

In the TAB 330 for driving a liquid crystal, FIG.
7 and FIG. 54 (a cross-sectional view along the line BB ′ in FIG. 57), the base film portion 331 is partially removed,
The input terminals 332,... Are exposed.

On the other hand, the connection electrodes 401a,... Of the driver board 400 are provided with openings in the solder resist 410 at portions corresponding to the regions of the end portions F of the input terminals 332,. The input terminals 332,... Of the liquid crystal drive TAB 330 are shown in FIG.
Only in the region of FIG. 5, only the metal leads are connected and fixed to the driver board 400 by soldering, and in the region of FIG. Note that the solder 411 is applied so as to be higher than the height of the surrounding solder resist 410 as shown in FIG. 58 before the liquid crystal drive TAB 330 is connected. Also,
The input terminals 332 of the liquid crystal drive TAB 330 are shown in FIG.
As shown in FIG. 7, it is formed so as to form a row in a direction perpendicular to the side of the board 280, and the solder 411 is also formed on the board 28.
It is formed so as to form a row in a direction perpendicular to the side of 0.

Next, a method for connecting the driver board 400 and the liquid crystal driving TAB 330 will be described with reference to FIG. The device 420 used for the connection is shown in FIG.
As shown in FIG. 7, a thermocompression head 421 heated to 200 to 300 ° C. is provided, and the thermocompression head 421 is supported so as to be movable in the vertical direction. A stage 422 is disposed below the thermocompression bonding head 421 so that the driver board 400 is placed at the time of thermocompression bonding. Further, the tip width of the thermocompression bonding head 421 is 1.2 mm.

Driver board 400 and TA for driving liquid crystal
When connecting to the B330, flux is applied to the solder resist 410 on the driver board side, and the driver board 400 and the TAB 330 for driving the liquid crystal are aligned.

Next, the thermocompression bonding head 421 is moved from 200 to 30.
The substrate is heated to 0 ° C., the thermocompression head 421 is lowered, and the driver board 400 and the liquid crystal driving TAB 330 are pressurized and thermocompressed between the thermocompression head 421 and the stage 422. That is, a portion for pressurizing both the solder resist 410 and the solder 411 via the input terminals 332,... Is thermocompression-bonded, and the input terminals 332,.

By the way, the driver board 4 having the above-described configuration is used.
00 may be supported by the cell fixing plate 233. The support structure will be described with reference to FIGS.

At four corners of the cell fixing plate 233, as shown in FIG. 60, four holding plates 430, 431, 432, 43
3 are fixed by screws 435,.
Of the four pressing plates 430,..., Two pressing plates 430, 431 located on the left side of the liquid crystal panel P are formed in a substantially L shape in plan view, and the remaining two pressing plates 432, 433. Are formed in a substantially I-shape in plan view. Also, these four holding plates 430,.
As shown in FIG. 61 and FIG. 62, both are formed by bending stepwise,
Are arranged with a slight gap (0.1 to 0.2 mm) in a portion where the liquid crystal driving TAB 330,...

[0139] Pressing plates 436, 436 and 436 are also arranged at the center of each driver board 400. As shown in FIG. 63, these holding plates 436 have both ends bent at right angles to have a U-shape.
Holes 436a,... Are formed in the bent portions.
Further, in the portion where each of the driver boards 400,... Is arranged, the protrusions 437,.
Are formed on the side surfaces of the protruding portions 437,... At the portions where the above-described pressing plates 436,. Then, the driver boards 400,... Are placed on the protrusions 437,.
Are arranged, and the holes 436a,... Of the pressing plates 436,... Are engaged with the protrusions 437a,.
33 is fixed. Like the other four pressing plates 430,..., These pressing plates 436,... Also have a slight gap (0. (1 to 0.2 mm). The width of the protrusion 437 of the cell fixing plate 233 is set to be slightly larger than the width of the driver board 400 as shown in the figure, so that the driver board 400 can move slightly.

Next, the operation when the environmental temperature at which the display device main body 200 is used changes will be described.

Now, when the temperature of the environment in which the display apparatus main body 200 is used changes, or when the main body 200 receives a temperature stress in the manufacturing process, the liquid crystal panel P thermally expands or contracts. However, since the driver board 400 is movably supported with respect to the cell fixing plate 233,
Driver board 4 even when temperature change is received
00 moves along the surface of the cell fixing plate 233 to follow the liquid crystal panel P and the like, and as a result, the TAB 330,
, Or a joining portion such as soldering at both ends thereof is not stressed, and the TAB 330 for driving the liquid crystal and the joining portion are not broken.

On the other hand, the driver board 400 may be supported as described above by the holding plates 430,..., And does not largely jump off the cell fixing plate 233 even when the display device main body 200 receives vibration or impact. <Wiring between driver boards, etc.> By the way, as described above, the driver board 400 has its sixth layer 40
Reference numeral 7 denotes a connector mounting surface, on which connectors 490,... Are mounted so as to input / output signals / power between the driver boards and the driver controller 450. Hereinafter, wiring between the driver boards, the driver board 400 and the driver controller 45 will be described.
The wiring between 0 and 0 will be described with reference to FIGS.

In this embodiment, as shown in FIG. 64, three driver boards 400L, 400U, 4
00D, one of them (common driver board) 400L is disposed on the left side of the liquid crystal panel P,
Are connected to the liquid crystal panel P (upper substrate 262) via liquid crystal driving TABs 330,... An upper driver board 400U and a lower driver board 400D are arranged on both upper and lower sides of the liquid crystal panel P, respectively, and are connected to the liquid crystal panel P (lower substrate 280) via a liquid crystal driving TAB 330,.

Of these, the common driver board 400L and the driver controller 450 are connected by two flat cables 451 and 452, and from one cable 451, as shown in FIG. Various signals such as waveform setting signals CWFD0 to CWFD3 are supplied, and power supplies V1, V2, V3, and V3 for driving the liquid crystal panel P are supplied from the other cable 452.
4, V5, and VC are supplied.

The upper and lower driver boards 400U,
400D is one flat cable 453, 455 each.
Are connected to the driver controller 450 via a power supply and signals for driving the liquid crystal driving ICs 350,... Are supplied. Further, as shown in FIGS. 64 and 39, the common driver board 400L and the other driver boards 400U and 400D are connected via flat cables 456 and 457, respectively. Power supply V3, VC, 400U, 400D
V4 is supplied.

By the way, the scanning ICs 350A,... Supplied with the powers V1, VC, V2, receive the scanning signals 460,.
Is applied to each of the scanning electrodes 269,. The scanning signal 460 includes a reset pulse 461 and a selection pulse 462 output following the reset pulse, as shown in FIG.
(C), the scanning electrodes 269,... Are sequentially applied (line-sequential scanning). Here, FIGS. 65 (a) to 65 (c) show the state of line sequential scanning,
The (n + 1) th and (n + 2) th scan electrodes are shown as examples, and the other scan electrodes 269,... are also line-sequentially scanned. Further, as can be understood from FIGS. 65A to 65C, while the scan signal 460 is applied to one scan electrode (for example, the nth scan electrode), the other scan electrodes (n Constant scanning voltage VC
Is applied. That is, in the case of 1/480 duty, for example, V1 or V1
When the potential of 2 is applied, the VC potential is applied to the other 479 lines.

[0147] The power supply V3, VC, V4 information side IC350B ₁ supplied with the, ..., 350B _2, ......, respectively Figure 65 (d) and information signals of the waveform shown in (e) electrodes 281, Are applied.

On the other hand, in the present embodiment, bypass capacitors C3 and C4 are arranged on driver board 400. The bypass capacitors C3 and C4 will be described with reference to FIG.

Reference numeral 472 in the figure denotes one information electrode 28.
Reference numeral 473 denotes a pixel formed by the information electrode 281b and the scanning electrode 269a. Reference numeral 473 denotes a pixel formed by 1a and one scanning electrode 269a. R1, R2, and R3 are electrodes 281a, 269a,
281b shows the internal resistance. Further, reference numeral 47
5, 476, 477 are liquid crystal driving ICs 350B ₁ ,
350A, respectively show a switching element disposed 350B _2.

On the other hand, reference numeral 452a indicates a power supply line for supplying the power supplies V3 and V4.
, As shown, from the driver controller 450, a power supply line 452a, it is supplied to the data electrode 281a via the driver board 400 L, and the information side IC350B _1. Reference numeral 452b denotes a power supply line for supplying a power supply VC. The power supply VC is supplied from the driver controller 450 to the power supply line 452 as shown in the figure.
b, driver board 400L, and information side IC 350
A is supplied to the scanning electrode 269a via A. Further, reference numeral 452c indicates a power supply line for supplying the power supplies V3 and V4, and the power supplies V3 and V4 are supplied from the driver controller 400L to the power supply line 45 as shown in the figure.
2c, driver board 400L, and information side IC 35
It is supplied to the data electrode 281b via the 0B _2. Symbols R4, R5, R6 indicate the internal resistance of each power supply line 452a,..., And the above-described cable 452 is configured by a large number of such power supply lines 452a,.

On the other hand, the driver controller 450
, Bypass capacitors C1 and C2 are interposed between the power lines 452b and 452a and between the power lines 452b and 452c, respectively. In the driver board 400, the power supply line 452 is also provided.
b and the power supply line 452a, and between the power supply line 452b and the power supply line 452c.
3, C4 are interposed. Therefore, these bypass capacitors C3, C4 are arranged downstream of the power supply lines 452a, ... and upstream of the information electrodes 281a, ..., that is, between the power supply lines 452a, ... and the information electrodes 281a, .... ing. Even when the liquid crystal is switched by the switching elements 475,..., The peaky current is supplied by the bypass capacitors C3, C4, so that the peaky current does not flow through the power supply lines 452a,.

Next, the operation of the display device of the present embodiment will be described.

Now, when the display device main body 200 is driven, power and signals for driving the scanning ICs 350A,... Are supplied from the driver controller 450 to the scanning ICs 350A,. , Information side IC350B
The power and signals for driving ₁ ,..., B ₂ ,.
And driver boards 400 U, the information side IC350B ₁ through 400D, ..., B _2, is supplied to ....

On the other hand, the power sources V1, VC, V2 are supplied from the driver controller 450 to the scanning ICs 350A,... Via the cable 452 and the driver board 400L, and the scanning ICs 350A,. , .... This scanning signal 46
0,... Indicate the scanning electrodes 26 by the line sequential scanning described above.
9 are sequentially applied. Power supplies V3, VC, V4
Is the driver board 400L via the cable 452.
, Two flat cables 456, 45
7 and the driver board 400 U, the information side IC350B ₁ through 400D, ..., B _2, is supplied to .... The signals having the waveforms shown in FIGS. 65 (d) and (e) are formed by these information-side ICs 350B ₁ ,..., B ₂ ,.
The signal is applied to each information electrode 281,. In this case, since the signal waveforms are the same, all the information electrodes 281 of the liquid crystal panel P are always at the same potential.

Here, considering the behavior at the time t1, the scanning electrode 26 to which the scanning signal 460 is not applied.
, Are applied with the constant voltage VC as described above, and the voltage V3 is applied to all the information electrodes 281,. Therefore, the information electrodes 281,... And the scanning electrodes 269,.
(See FIG. 66) formed by the information electrodes 281,..., The scanning electrodes 269,.
A current flows instantaneously toward. At time t2, the voltage V4 is applied to all the information electrodes 281,... And the constant voltage VC is applied to most of the scan electrodes 269,.
An electric current flows instantaneously toward 1,. Such a current is not limited to only the times t1 and t2, but generally occurs at the time of switching of the liquid crystal. With the generation of the current, a sharp rush current component is generated in the power supply lines of the flat cables 456 and 457. appear. However, in the present embodiment, since the bypass capacitors C3,... Are provided in the driver board 400L, the steep rush current component is removed, and the cables 451 and 452 are not affected by the rush current component. . That is, a steep rush current of the current flows between the driver board 400L and the driver board 400U or between the driver board 400L and the driver board 400D via the flat cable 456 and the flat cable 457, and the electrodes 269,. ,... Are consumed by the internal resistances R1,.
It flows gently through 56,457.

According to the present embodiment, power supplies V3, V4,
The cables 456 and 457 for supplying VC are short cables arranged very close to the liquid crystal panel P.
Impedance can be reduced, and a drive waveform with less delay can be supplied to the liquid crystal panel P. As a result, good display characteristics can be satisfied.

The steep rush current component generated by the switching of the liquid crystal is generated by the bypass capacitors C3,.
As a result, no induced current is generated in the cables 451 and 452, and as a result, the driving IC 35
The malfunction of 0,... Can be avoided.

Further, in the present embodiment, the electrode 2
69,..., 281,.
, B2,... Are supplied to the information-side ICs 350B ₁ ,..., B ₂ ,... Via the driver board 400L, and power for driving these ICs is separately provided via cables 453, 455. Since it is supplied, the space problem is also solved.

In FIG. 64, two cables (flat cables 451 and 45) connecting the common driver board 400L and the driver controller 450 are provided.
2) and upper and lower driver boards 400U, 400D
Although one cable (flat cable 453, 455) is used to connect the cable and the driver controller 450, the number of cables is not limited to this, and the number of cables may be increased depending on the amount of signals to be transmitted. FIG.
3, FIG. 28, FIG. 68, and FIG. 69 show a state in which a plurality of flat cables 451,... <About the flat cables 451,... And the connector 490> By the way, the flat cables 451,.
Are connected to the sixth layer 407 (see FIG. 56) of the driver board 400 via connectors 490,.
Here, the structure of the flat cable 451 and the connector 490 will be described with reference to FIG.

As shown in FIG. 67, the flat cable 451 includes an insulating support layer (base film) 491, and a shield wiring layer (reference potential wiring) 492 as a conductive layer on both sides of the insulating support layer (base film) 492. A signal wiring layer (preferably a wiring group) 493 is formed. These layers 492, 493 are formed of insulating protective layers 495, 49.
5 respectively.

A connector 490 is connected to the flat cable 451. This connector 490
Is a U-shaped mold part 496 as a housing.
And contacts 49 disposed on the upper and lower surfaces thereof, respectively.
7,499, and the contact 497 is connected to the signal wiring layer 4.
The contact 499 is configured to be in contact with the shield wiring layer 492. In addition, each contact 497,499
Is formed of a conductive member having a convex portion inside the mold portion, and the flat cable 451 is formed by these convex portions.
Are held vertically. Reference numeral 497a is a soldered contact provided as needed.

The signal wiring layer 493 includes Al, C
Metal layers such as u, Ni, Pe, Au, and Ag are preferably used, and a flexible polymer material such as a polyester film, a polyamide film, and a polyimide film is preferably used for the insulating support layer 491 and the protective layers 495 and 495. Used.

The thickness of each layer is appropriately selected from the range of 10 to 500 μm.

Here, only the flat cable 451 interposed between the driver controller 450 and the common driver board 400L has been described.
The other flat cables 452 have the same structure.

In this embodiment, since the flat cables 451 and connectors 490 and so on are used, high-density mounting can be realized and noise (radiation noise) can be realized.
Logic malfunctions can be prevented without being adversely affected by fluctuations of the reference voltage or the reference voltage, and the panel can be made larger.

The above-described effect is more exhibited when the arrangement pitch of each wiring of the signal wiring (wiring group) is 3 mm or less, more preferably 1 mm or less.

Incidentally, the flat cable 45 described above is used.
Are connected to the driver boards 400,... Via connectors 490,. FIG. 68 is a view of the display unit 230 as viewed from the back side (the side of the backlight unit 530), and FIG. 69 is a view of the display unit 230 as viewed from the front side. <Backlight Unit 530> Next, the configuration of the backlight unit 530 used in the present embodiment will be described with reference to FIGS. 70 and 71. FIG.

The backlight unit 530 includes a rectangular light guide plate (light guide means) 531 as shown in FIG. The light guide plate 531 is formed of a transparent acrylic or the like, and four linear light sources (RGB 3
Wavelength tubes) 532, 532, 532, and 532 are light guide plates 53.
1 are sandwiched therebetween. Here, a high-intensity lamp such as a hot cathode tube is used as the linear light source 532. On the rear side of these linear light sources 532,..., Reflectors (reflecting means) 533 are arranged so as to surround each linear light source 532,.
From the light guide plate 531 efficiently. The reflection plates 533 are formed of an aluminum plate or the like, and a silver vapor deposition film having a high reflectance is formed on the inner surface thereof.

Further, the rear surface (the lower surface in the figure) of the light guide plate 531
Is formed with a diffuse reflection pattern portion (luminance distribution adjusting means) 535. The diffuse reflection pattern portion 535 is composed of a large number of dots formed in a predetermined density distribution, and reflects and diffuses the light transmitted through the light guide plate 531 to the liquid crystal panel P side to increase the amount of emitted light and to make the luminance uniform. To enhance the display quality of the liquid crystal panel P (details will be described later). In addition,
The diffuse reflection pattern portion 535 is formed by applying a white paint in a dot shape on the back surface of the light guide plate 531 by a printing method or the like.

Further, a rear reflector (diffuse reflector) 536 is arranged along the rear surface of the light guide plate 531. The rear reflector 536 is configured by forming a silver vapor-deposited film on a surface (a surface on the light guide plate side) of an aluminum plate or the like.

On the other hand, a prism sheet 537 is disposed on the front side (upper side in the figure) of the light guide plate so as to make the directionality of the illumination light uniform. The prism sheet 537 is arranged so that the prism surface (irregularity) faces the liquid crystal panel side, and is arranged so as to form a row in the horizontal direction of the screen.

Next, the mounting structure of the reflection plates 533,... Will be described with reference to FIGS.

In this embodiment, the linear light source 53
72 are provided with grommets 539,... Formed of a resin having high heat conductivity, as shown in FIG.
Are formed. Also, in the reflection plates 533,..., Engagement holes 533a,.
Are formed. Then, these engagement holes 533a,
Are engaged with the engagement protrusions 539a,.
The linear light sources 532,... And the reflection plates 533,. The reflecting plates 533 are curved and extend toward the light guide plate 531 as shown in the figure.

On the other hand, on the upper surface of the light guide plate 531 (the surface on the liquid crystal panel side), as shown in FIG. 74, a backlight upper plate 550 formed of a metal plate (for example, a thin steel plate) is arranged. . This backlight upper plate 550 is the same as that shown in FIG.
As shown in FIG. 5, the light emitting portion is formed in a frame shape so as to be exposed, and has a large number of screw holes 554,... And is screwed to the front cover 201.

On the lower surface of the light guide plate 531, there is disposed a backlight lower plate 551 made of a metal plate (for example, a thin steel plate) (see FIG. 74). The backlight lower plate 551 is formed over almost the entire surface of the light guide plate 531, and has a rear surface (a surface opposite to the light guide plate 531) on which a flange portion (cutout) for attaching the inverter unit 570 and the controller unit 572 is provided. (Raised portion) is projected (not shown). The flange unit is used to screw the inverter unit 570 and the like.

The backlight upper and lower plates 55
0,551 and the light guide plate 531, the reflection plate 533,
... are held at both ends. The upper and lower plates 550, 551 are connected to the light guide plate 53 by screws 552,.
1 and these backlight upper and lower plates 5
50, 551, reflection plates 533, ..., linear light source 532,
, And the light guide plate 531 are integrated. The backlight unit 530 is attached to the front cover 201 by the backlight upper plate 550 as described above.

Further, lamp holder holders 553 are arranged on the back of each of the reflection plates 533, and the lamp holder holders 553 are screwed with screws 55.
Are fixed to the backlight upper plate 550 by 5,. This ensures that the linear light sources 532 are held. The linear light sources 532 are replaced by removing the screws 555.

In the above structure, the linear light source 53 is formed only by engaging the engagement protrusions 539a,... With the engagement holes 533a,.
, And the reflection plates 533,... Can be easily and reliably integrated. Thereby, the linear light sources 532,.
And the reflecting plates 533,... Can be easily and reliably fixed and held at appropriate positions with respect to the light guide plate 531 so that the target optical performance can be exhibited, and luminance unevenness does not occur. In addition, the work efficiency at the time of assembly can be improved.

Also, in the above structure, the grommet 53
The elasticity is given to the engaging projections 539a, and the diameter near the base of the engaging projections 539a,
33a, slightly larger than the diameter of the reflector 5
When the engaging protrusions 539a,... Are engaged with the engaging holes 533a,.
Can be prevented from inadvertently coming off the grommets 539,. Further, the engagement protrusions 539a,.
When the length is set to about 10 mm, it becomes easy to work by pulling when engaging. If it interferes with other parts after assembling, an unnecessary protruding portion may be cut off. The shape of the engagement protrusions 539a,... May be conical or pyramid, and the shape of the engagement holes 533a,.
What is necessary is just to match the shape of the engagement protrusions 539a,. <Diffuse Reflection Pattern Section 535> Next, the distribution density of the diffuse reflection pattern section 535 will be described with reference to FIGS.
4 will be described.

In the present embodiment, the distribution density of the diffuse reflection pattern portion 535 is as shown in FIGS. 76 and 77. That is, the distribution density in the cross section including the linear light sources 532 and 532 arranged to face each other is:
As shown by the solid line in FIG. 76, the setting is such that the vicinity of the linear light source 532 is the lowest, and the distance increases as the distance from the linear light source 532 increases. The distribution density (referred to as the area ratio of the diffuse reflection pattern occupied per unit area at each position of the light guide plate, that is, at a point) is at the part farthest from the linear light source 532, that is, at the center of the backlight unit. It is configured such that it changes gradually and continuously (so that the rate of change of the distribution density does not become discontinuous) by drawing a gentle curve. Further, as shown in FIG. 77, the in-plane distribution density of the diffuse reflection pattern portion 535 is set to be highest near the center of the light guide plate 531, and becomes lower toward the end of the light guide plate 531. It is set to be. The uniform distribution density curve (a line connecting points having equal distribution densities) is a closed loop having no corners, and preferably has an outer shape of an effective emission surface of the light guide plate 531 (a rectangle in the present embodiment). The curves are almost similar and have no corners. The ratio of the major axis / minor axis in the uniform distribution density curve is set to be substantially equal to the ratio of the major side to the minor side of the emission effective surface. Here, the emission effective surface means that light is emitted from the light guide plate 531 toward the liquid crystal panel P.
The surface on the light guide plate.

In general, the dots 535a,... Of the diffuse reflection pattern portion 535 are, as shown in FIG.
The central portion of the light guide plate 1 is formed so that the area is large and the gap is small, and the area is small and the gap is large as it approaches the end of the light guide plate 531. Then, the distribution density in this plane is shown by an equal distribution density curve as shown in FIG. 79, and each equal distribution density curve has a concentric rectangular shape. The distribution density in the cross section including the linear light sources 532 and 532 arranged so as to face each other is the lowest in the vicinity of the linear light source 532 as shown by the broken line in FIG. Was set to increase in proportion to the distance. In a place where the distribution density of the diffuse reflection pattern portion 535 is high, the light guide plate 531 is provided.
Is increased, and the amount of light is reduced where the distribution density is low. Incidentally, the distribution pattern of the diffuse reflection pattern portion 535 is as shown in FIG.
In addition to the pattern shown in FIG. 9, there is also a pattern in which the uniform distribution density curve is rhombic as shown in FIG.

The light transmitted through the light guide plate 531 is partially reflected at the critical angle at the light guide plate 531, partially reflected at the diffuse reflection pattern section 535, and partially reflected at the rear reflection plate 536. And illuminated the liquid crystal panel P.

By the way, in the general backlight unit as described above, the distribution density of dots is as shown in FIG.
Is set as shown by the dashed line, and shows a sharp steep change at one point in the center, that is, the change rate of the distribution density changes discontinuously at one point where the distribution density is strong, The brightness was highest at one point of the portion, and a bright line (a portion with a high brightness) was generated around this point, and the display quality of the liquid crystal panel P was degraded. In particular, when the dots are formed with the planar distribution shown in FIG. 79, an X-shaped bright line 560 as shown in FIG. 81 is generated along a line (that is, a diagonal line) connecting the corners of the uniform distribution density curve. When dots were formed with the distribution shown in FIG. 80, a cross-shaped bright line 561 as shown in FIG. 82 was generated along the line connecting the corners of the uniform distribution density curve.

In particular, in recent years, the size and brightness of the edge type backlight unit have been increased with the increase in size and color of the liquid crystal panel, and it is necessary to increase the total luminous flux of the linear light source. However, the above problem was remarkable.

According to the present embodiment, the bright lines in the planar light from the backlight unit 530 are suppressed, the luminance is made uniform, and the display quality of the liquid crystal panel P is improved. FIG. 83 shows the luminance distribution of the backlight unit 530 measured, and the luminance distribution is shown by an isoluminance curve. It can be understood that the luminance is made uniform by changing the luminance.

In the above configuration, the distribution density of the diffuse reflection pattern portion 535 is as shown in FIG. 77, but need not be limited to this. For example, as shown in FIG. 84, the luminance may be low at four corners of the light guide plate 531 or the like, and by increasing the distribution density of the diffuse reflection pattern portion 535 from its surroundings, the luminance of light emitted from this portion is reduced. , The luminance of the planar light as a whole can be made uniform. Conversely, if the brightness is too high locally, the diffuse reflection pattern portion 535 in that portion
By lowering the distribution density, the luminance can be similarly made uniform. Such adjustment of the distribution density needs to be performed according to the type (characteristics) and arrangement of the light source.

In the backlight unit 530, the diffuse reflection pattern portion 535 is
Although it is formed by a,..., it is needless to say that the present invention is not limited to this and may be a mesh.

Furthermore, the backlight unit 530
In the above, the light guide plate 531 formed of an acrylic plate or the like was used.
A space may be used instead of 1. <Structure of Inverter Unit 570> As shown in FIG. 8, an inverter unit 570 is mounted on the back surface of the above-described backlight unit 530 via an insulating plate 571, and a controller is arranged adjacent to the unit. The unit 572 is attached (FIG. 85).
And FIG. 86). Since the inverter unit 570 is attached to the backlight unit 530 via the insulating plate 571, both are insulated.

Here, as shown in FIG. 87, the inverter unit 570 comprises four filament drive circuits 5
90, 590, 590, and 590.
The filament drive circuits 590,... Are configured to preheat each filament of the four linear light sources 532,.

The inverter unit 570 includes two lighting circuits 591 and 591. One lighting circuit 591 allows two linear light sources 532 and 5 opposing each other.
32 is turned on.

Further, the inverter unit 570 includes a lamp life detection lighting stop circuit 592. As shown in FIG. 88, this lamp life detection lighting stop circuit 592 comprises four life detection circuits 593, 593, 593, 5
93, and these four life detecting circuits 593, 593.
Are connected to the linear light sources 532,. Each of the life detecting circuits 593,.
5,595,595,595 are respectively connected. Note that these life detecting circuits 593,... Continually monitor the lighting voltage of the linear light sources by stepping down and rectifying the voltage across the linear light sources 532,. Each of the life detecting circuits 593,... Has a comparator such as a comparator IC. When the lighting voltage of the linear light source exceeds a predetermined value, the life stopping circuits 595,. It sends a signal. Furthermore, of the four lighting stop circuits 595,... Described above, two lighting stop circuits 5 for the two linear light sources 532, 532 opposed to each other.
Reference numerals 95 and 595 are connected to one lighting circuit 591, and when one of the linear light sources 532 reaches the end of its life, the lighting circuit 591 is controlled so that two linear light sources opposing each other. The light sources 532 and 532 are simultaneously turned off. As shown in FIG. 87, the inverter unit 570 includes a dimming circuit 597 to which a dimming volume 596 is connected, and is configured to adjust the luminance of the linear light sources 532,. Further, the inverter unit 570 includes an initial lighting control circuit 599.

Next, the operation of inverter unit 570 will be described.

As the linear light sources 532 approach the end of their life, the lighting voltage of the tube gradually increases. When the lighting voltage exceeds a predetermined value, the life detecting circuits 593,... Send a life detecting signal to the lighting stop circuits 595,.
The lighting stop circuits 595,... Stop the lighting of the linear light source 532 by controlling the lighting circuits 591,. Here, since one lighting circuit 591 controls the lighting of the two linear light sources 532 and 532 opposed to each other, these two linear light sources are controlled based on a signal from the lighting stop circuit 595. The lights 532 and 532 are turned off, and the illumination of the liquid crystal panel P is performed by the remaining two linear light sources 532 and 532. <Regarding Diffusion Plate 239> In the above-described backlight unit 530, light emitted from the linear light sources 532,... Is reflected by the rear reflector 535 and emitted from the prism sheet 537. Then, the emitted light passes through the diffusion plate 239 and is diffused at that time.

The diffusion plate 239 is formed by treating both surfaces of a transparent member such as a transparent plastic such as acrylic or polycarbonate, or glass, etc. in a mat-like manner.

Here, the luminance viewing angle characteristics in the case where the diffusion plate 239 is arranged will be described with reference to FIG.

Note that, as shown in the explanatory diagram of FIG. 90, the luminance viewing angle characteristic is obtained by changing the viewing angle (θ) from the front (0) of the light emitting surface.
Degrees) to ± 60 degrees, the luminance of the light emitting surface (c
d / m ² ) with a color luminance meter (TOPCON BM-7)
It is measured by the following.

The vertex angle of the prism sheet 537 in the backlight unit 530 is set to about 90 degrees, and the diffusion plate 2
When no 39 is arranged, the front luminance becomes high (about 50% higher than the case where the diffusion plate is arranged) as shown by a curve B in FIG. 89, but the luminance sharply increases near a viewing angle of ± 45 degrees. When the viewing angle becomes larger, the brightness increases again. Such characteristics are fatal defects in large liquid crystal panels which need to have a wide viewing angle. That is, when the liquid crystal panel is viewed from an oblique direction, there are points that are dark and cannot be seen. In addition, with such characteristics, not only a sudden change in luminance but also coloring due to the reflection of the slope in the viewing angle direction that matches the slope direction of the prism of the prism sheet 537 occurs.

On the other hand, when the diffusion plate 239 is arranged, as shown by the curve A in FIG. 89, the attenuation of the front luminance increased by the prism sheet 537 is small, and the entire light emitted through the prism sheet 537 is emitted. The light is directed to the front side within a viewing angle of 60 degrees by the diffusion action of the diffusion plate 239, and the drop in luminance near the viewing angle ± 45 degrees as described above is also eliminated. That is, by disposing the diffusion plate 239, illumination with high luminance and good viewing angle characteristics can be achieved even in a large size.

Since the diffusion plate 239 exists, the pitch of the prisms of the prism sheet 537 is diffused and becomes invisible, and the liquid crystal panel P and the prism sheet 53 are not seen.
There is no occurrence of moiré between the film 7 and.

By the way, when the amount of transmitted light from the edge light of the diffusion plate 239 was compared with a case where a transparent member having a glossy surface not subjected to a mat-like treatment was arranged, it was found to be about 5% larger. . This is because, in a transparent member that is not subjected to the mat-like treatment, a part of the light from the light guide plate 531 is reflected by the glossy surface (lower surface), and the amount of transmitted light is reduced accordingly.

As a result of an experiment, it was found that better viewing angle characteristics can be obtained by making the mat-like treatment of the diffusion plate 239 as fine as possible and setting the thickness to 1.0 mm or more. <Regarding the Controller Unit 572> Next, the controller unit 572 will be described with reference to FIG.

As shown in FIG. 91, the controller unit 572 includes a driver controller 450, a temperature sensor interface 600, a backlight controller 601, a _VOP controller 602, an image adjustment trimmer interface 603, and the like.

Of these, the driver controller 450
Are connected to the system controller 610 and, as described above, are connected to the liquid crystal panel P via the driver boards 400,... And the liquid crystal driving TABs 330,. .

Further, the temperature sensor interface 600
Is configured to perform temperature detection by connecting a thermistor 310 and to perform temperature compensation based on the detected temperature.

Further, the backlight controller 601
Is connected to an inverter 570. When the liquid crystal panel P is not used for a predetermined time, the inverter 57
By controlling 0, the luminance of the backlight unit 530 is reduced.

Further, the V _OP controller 602 controls the drive voltage, and the image adjustment trimmer interface 603 controls the trimmer unit. <About the Supporting Device> The liquid crystal display device 1 according to the present embodiment has a display device main body 2 having the above-described configuration.
00, the display device body 200
Are supported by the support device 3 as shown in FIGS. 93 (a), (b) and (c). Hereinafter, the support device 3 will be described.

As shown in FIGS. 94 and 95, the support device 3 is formed in a substantially horizontal H-shape when viewed from the back.
When the display device main body 200 is mounted, the rotation center is located behind the position of the center of gravity. The support device 3 supports the display device main body 200 at an arbitrary position within a predetermined angle in the vertical and horizontal directions so that the angle can be adjusted.

Further, the support device 3 has the stand support 5 erected on the support base 6 so as to be rotatable left and right by an arbitrary angle within a predetermined angle. A display mounting member 4 which is a supported member mounting member for supporting the display device 200 from the back is laid horizontally. As shown in FIG. 96, the support device 3 is positioned at the center of gravity when the display device main body 200 is not mounted. The center 33 is set to be shifted rearward in the horizontal direction from the center of rotation 34, and the center of gravity 33 is set to be shifted forward in the horizontal direction from the center of rotation 34 when the display device main body 200 is mounted. Moreover, the support device 3 is configured to avoid the influence of unnecessary electromagnetic waves from the display device main body 200 as described later.

[0209] First, the display mounting member 4 will be described.

As shown in FIGS. 97 to 100, the display mounting member 4 includes a tilt member (display holder) 7 having a U-shape in plan view, a support device main body juxtaposed outside the display holder 7, and a It is provided with drag adjustment mechanisms (tilt mechanisms) 10r and 10l for tilting the display holder 7 with respect to the support device main body. Then, the width B ₂ of the display attachment member 4 is smaller than the width B ₁ of the display device main body 200 (FIG. 10
1 (a)), the vertical length of the display mounting member 4 is also formed to be smaller than the vertical length of the display device main body 200 (see FIG. 101 (b)).
The display screen is displayed on the display device main body 2 as shown in FIG.
When viewed from the front of 00, the display mounting member 4 is formed in a size that is invisible from both left and right sides and both upper and lower ends. That is, the display mounting member 4 is arranged within the entire projected area of the display device main body 200.

The display holder 7 is made of metal such as stainless steel which supports the back surface of the display device main body 200 (see FIGS. 93 (a), (b) and (c)). Further, as shown in FIG. 98, the display holder 7 is arranged such that the shaft mounting portions 7r and 7l at the left and right ends of the intermediate portion 7a disposed along the back surface of the display device main body 200 face the side surfaces of the display device main body 200. It is bent. On the upper edge of the intermediate portion 7a, engaging portions (recesses) 7b, 7b are engaged with pins 202g (see FIG. 94), which are engaged portions, protruding from the back surface of the display device main body 200. In the lower part of the intermediate portion 7a, holes 7c, 7c for screwing the display holder 7 on the back surface of the display device main body 200 are formed.

Further, the support device main body is provided with a support arm 8.
And an upper arm cover 9a and a lower arm cover 9b which cover the support arm 8 from both upper and lower surfaces. Upper arm cover 9a and lower arm cover 9b
Is an acrylonitrile butadiene styrene copolymer (AB
It is formed of a synthetic resin material such as S). As shown in FIG. 100, the support arm 8 is formed such that the length of the connecting portion 8a is longer than the length of the intermediate portion 7a of the display holder 7, and the left and right ends thereof are opposed to the shaft mounting portions 7r, 7l, and the brackets 8r, 8l are integrally connected.

Then, as shown in FIG. 98, the tilt mechanisms 10r, 10l are provided between the shaft mounting portions 7r, 7l of the left and right display holders 7 and the brackets 8r, 8l of the support arm 8.
10 l are each mounted.

The left and right tilt mechanisms 10r and 10l are
As shown in FIG. 103 (a), a shaft member 12 disposed in a lateral direction, a lock spring 13 whose intermediate portion is externally rotatably inserted on the shaft member 12, and one end of the lock spring 13 is hooked. And the lock springs 13 on the left and right sides are arranged so that the winding directions coincide with each other.
The center of rotation of the shaft member 12 is shown in FIGS.
As shown in FIG. 11, when the display device main body 200 is mounted, it is set to be shifted rearward in the horizontal direction from the position of the center of gravity. The home position (predetermined posture) may be in a state where the display device main body 200 is inclined at an arbitrary angle within a predetermined angle, or may be in a vertical state.

The lock spring 13 has an inner diameter of the shaft member 12.
Are formed to have a smaller diameter than the outer diameter, and one end penetrates the non-rotating bearing 14 and is hooked to the brackets 8r, 8l. The other end of the lock spring 13 is in a free state although the extension of the lock spring 13 is suppressed by the spring holder 15 into which the shaft member 12 is fitted. Shaft member 1
2 has a shaft mounting portion 7 having an inner end through a washer 16.
r and 7l, and the outer end is rotatably supported by the non-rotating bearing 14 and the brackets 8r and 8l. The lock spring 13 for the shaft member 12 moves the display holder 7 upward (FIG. 103).
The inner diameter of the lock spring 13 is increased when the display holder 7 is rotated in the direction of the arrow A shown in FIG. 10B, and locked when the display holder 7 is rotated in the downward direction (the direction of the arrow B shown in FIG. 103B). It is wound so that the inner diameter of the spring 13 is reduced.

Therefore, the tilt mechanisms 10r, 10l
The downward direction is the same direction as the torque WX by the own weight W of the display device main body 200 generated around the shaft member 12 based on the own weight W of the display device main body 200 and the deviation amount X whose center of gravity is horizontally shifted from the center of rotation. When the opposite direction is upward, the tilt mechanism 10r, 10l acts on the display device main body 200 downward from the tilt mechanisms 10r, 10l against the operation of tilting the display device main body 200 upward by an arbitrary angle within a predetermined angle. Generated torque T
The magnitude of _r1 is defined as the upward generated torque _Tr2 acting on the display device main body 200 from the tilt mechanisms 10r, 10l against the operation of tilting the display device main body 200 downward by an arbitrary angle within a predetermined angle. Set smaller than the size. Moreover, the difference between the upward torque T _r2 and down torque _{T r1 ΔT (= T r2 -T} r1) is set in accordance with the magnitude of the torque WX caused by the own weight of the display device main body 200. Thereby, the difference between the upward and downward operating forces can be reduced. Further, since the tilt mechanisms 10r and 10l are provided on the left and right, the torque difference ΔT between the left and right tilt mechanisms 10r and 10l is set so as to offset the torque WX due to the weight of the display device main body 200. As a result, the upward and downward operating forces can be made substantially the same.

The display device main body 200 can be turned upward by a predetermined inclination angle β (see FIG. 112 (a)) and downward by a predetermined inclination angle γ (see FIG. 112 (b)). It is configured as follows. In order to rotate the display apparatus main body 200 upward by the angle β and downward by the angle γ, the shaft member 1 is rotated.
The arrangement position of the connecting portion 8a with respect to 2 is defined by Expressions (1) and (2).

That is, as shown in FIG. 113, which is a cross section taken along the line AA in FIG. 112 (c), an orthogonal coordinate Y having the position of the shaft member 12 as the origin, the Y axis in the front-rear direction, and the Z axis in the vertical direction.
When −Z is set, the vertical tilt angles of the display screen of the display device main body 200 are β and γ, respectively, and the horizontal distance from the back surface of the display device main body 200 to the shaft member 12 is t, Is the tilt operation angle β

[0219]

Z ≦ ｛(Y−tcosβ) / tanβ｝ −tsinβ (1) The downward tilt operation angle γ is

[0220]

[Formula 2] Z ≧ {(t cos γ−Y) / tan γ} + tsin γ (2) Specifically, the upward tilt operation angle β is 2
0 ° and the downward tilt operation angle γ is 5 °. And
Based on the above equations (1) and (2), it is possible to define the maximum possible size and strength of the upper arm cover 9a and the lower arm cover 9b that accommodate the support arm 8 and the tilt mechanisms 10r and 10l. .

Further, the tilting mechanisms 10r and 10l do not act on the operation force for rotating the display device main body 200, and when the display device main body 200 is at the home position, the tilt mechanisms 10r and 10l are shifted forward from the center of gravity position. The torque generated by the own weight W of the display device main body 200 around the shaft member 12 is applied in the direction in which the lock spring 13 is tightened, the inner diameter of the lock spring 13 is reduced, and the shaft member 12 is tightened.

The tilt mechanisms 10r and 10l are, for example, as shown in FIG. 114, the action point U at the upper end of the display device main body 200 located at the home position in the vertical state.
When _{the 1} is pressed by a predetermined or more operation force F ₁ is tilted upward a display device main body 200, the locking spring via the display holder 7 by the operation force F ₁ to the shaft member 12 is added to the point U ₁ 13 is configured to rotate relative to the winding direction. As a result, the inner diameter of the lock spring 13 increases, and the pressure contact force on the shaft member 12 decreases. For this reason, when tilting the display device main body 200 upward, the torque T generated downward
_r1 becomes small, the operation force F ₁ at the time of upward turning than the moment based on the own weight W of the downward torque T _r1 and the display device main body 200 is increased, it is possible to rotate the display holder 7 in the upward direction (FIG. 104
reference).

Similarly, for example, as shown in FIG. 115, the action point D ₁ at the lower end of the display device main body 200 located at the home position in a vertical state is pressed by a predetermined or more operating force F ₁ to raise the display device main body 200 upward. when the tilting direction, are configured to rotate relative with respect to the winding direction of the lock spring 13 via the display holder 7 by the operation force F ₁ to the shaft member 12 is added to the point D _1. As a result, the inner diameter of the lock spring 13 increases, and the pressure contact force on the shaft member 12 decreases. Therefore, when the display device main body 200 is tilted upward, the downwardly generated torque _Tr1 is reduced, and the downwardly generated torque _Tr1 and the own weight W of the display device main body 200 are reduced.
Operation force F ₁ at the time of upward turning becomes larger than based moment, it is possible to rotate the display holder 7 in the upward direction (see FIG. 105).

[0224] In this case, the value of the operation force F ₁ added as shown in FIG. 116 is too large, the human power can not be rotate the display device main body 200 in the upward direction, it can be operated by human force the upper limit of the operating force F ₁ 40
(N: Newton). If the value of the operation force F ₁ is too small, slight since display apparatus main body 200 will be unnecessarily rotated by an external force, the lower limit of the operation force F ₁ so as not to rotate by unnecessary external force 10 (N ).

On the other hand, the torque _{Tr 1} generated downward when the inner diameter of the lock spring 13 is increased, and the vertical distance l ₁ from the position of the shaft member 12 to the action point U ₁ (D ₁ ) are fixed values. There, since the operation force F ₁ is also set to a predetermined value, bias amount X ₁ of the position of the shaft member 12 to the center of gravity of the display device main body 200 (3) is defined as equation.

[0226]

X ₁ = (F ₁ l ₁ −T _r1 ) / W (3) In general, the display device main body 200 is not always in the vertical state, so the display device main body 20
Regardless of the inclination state of 0, if the position of the shaft member 12 is behind the center of gravity of the display device main body 200, the general expression is given by Expression (4).

[0227]

F ₁ = {T _r1 + W (X cos α + l ₂ sin α)} / (l ₁ cos α + X ₃ sin α) (4) where l _{2 is} the position of the shaft member 12 and the center of gravity of the display device main body 200. X ₃ : The position of the shaft member 12 and the point of action U ₁ for applying the operating force
Amount of deviation from (D ₁ ) α: the rotation angle when the display device main body 200 rotates vertically (the upward rotation is positive) In this case, the operation force when the display device main body 200 is tilted upward The range of F _{1 is in} the range of 10 ≦ F ₁ ≦ 40.

[0228] Furthermore, the tilt mechanism 10r, 10l, for example by pressing the display unit operation force F ₂ given more working point U ₂ at the upper end of body 200 located at the home position of the vertical state as shown in FIG. 117 when tilting the display device main body 200 in a downward direction, so that relative rotation in the opposite direction to the winding direction of the lock spring 13 via the display holder 7 by the operation force F ₂ to the shaft member 12 is added to the point U ₂ Is configured. Thereby, the inner diameter of the lock spring 13 is reduced, and the pressing force and the frictional force on the shaft member 12 increase. However, the moment based on the weight W of the display device main body 200 is equal to the operating force F.
Becomes larger than the upward generated torque T _r2 participating in _2, it is possible to rotate the display device main body 200 in a downward direction by the operation force F ₂ (see FIG. 106).

[0229] Similarly, under the display device display device main body 200 to press the action point D ₂ of the lower end by a predetermined or more operation force F ₂ of the main body 200 located at the home position of the vertical state as shown in FIG. 118 for example when the tilting direction, and is configured such that the axis member 12 is relatively rotated in a direction opposite to the winding direction of the lock spring 13 via the display holder 7 by the operation force F ₂ applied to the working point D _2. Thereby, the inner diameter of the lock spring 13 is reduced, and the pressing force and the frictional force on the shaft member 12 increase. However, since the moment based on the own weight W of the display device main body 200 is applied to the operation force F ₂ to face the upward generated torque T _r2, it is possible to rotate the display device main body 200 in a downward direction by the operation force F ₂ (See FIG. 107).

[0230] In this case, the value of the operation force F ₂ addition, as shown in FIG. 116 is too large, the human power can not be rotate the display device main body 200 downward, can be operated by human force the upper limit of the operation force F ₂ 40
Set to (N). If the value of the operation force F ₂ is too small, slight since display apparatus main body 200 will be unnecessarily rotated by an external force, the lower limit of the operation force F ₂ so as not to rotate by unnecessary external force 10 (N ).

On the other hand, the torque _{Tr 2} generated upward when the inner diameter of the lock spring 13 is reduced, and the vertical distance l ₁ from the position of the shaft member 12 to the point of action U ₂ (D ₂ ) are fixed values. There, since the operation force F ₂ is also set to a predetermined value, bias amount X ₂ of the position of the shaft member 12 to the center of gravity of the display device main body 200 (5) is defined as equation.

[0232]

Equation 5] _{X 2 = (T r2 -F 2} l 1) / W (5) Accordingly, by setting the bias amount X by smaller one of X _1, X _2, the amount of deviation is large To prevent the torque WX due to its own weight from becoming unnecessarily large.

Similarly, since the display device main body 200 is not always in the vertical state, the position of the shaft member 12 is maintained regardless of the inclination of the display device main body 200. Is behind the center of gravity of, the general equation is given by equation (6).

[0234]

[6] _{F 2 = {T r1 -W (} Xcos α + l 2 sin α)} / (l 1 cos α + X 3 sin α) (6) In this case, the operation force when tilting the display device main body 200 upward The range of F _{2 is in} the range of 10 ≦ F ₂ ≦ 40.

By setting the operation forces F ₁ and F _2, a light tilt operation can be realized even when the display device main body 200 is inclined.

Next, the stand support 5 will be described.

The stand support 5 is shown in FIGS.
As shown in FIG.
Are covered with a front support cover 18f and a rear support cover 18b. The support portion 17 is formed by molding and processing a bulk molding compound-based unsaturated polyester material, and the front support cover 18f and the rear support cover 18 are formed.
b is formed of an acrylonitrilobutadiene styrene copolymer (ABS) material.

At the upper end of the column 17, an arm supporting plate 19 for fixing the column to the connecting portion 8a of the supporting arm 8 is provided.
A stopper 20 is attached to the lower part of the front support column cover 18f, the lower end of which abuts when the display device main body 200 is tilted downward.

In the center of the lower surface of the turntable 17a, FIG.
As shown in FIGS. 19 to 121, a circular shaft portion 17b is protrudingly provided. Around the lower surface of the turntable portion 17a, a metal fixed ring 21 such as stainless steel and a horizontal turn ring 22 made of polyacetal are provided. Are arranged in this order, and the shaft portion 17b is fitted into these. Then, the rotating table 1
The fixing ring 21 is fixed around the lower surface of 7a. Further, in the center of the lower surface of the rotating table 17a, FIG.
As shown in FIG.
122, which is slightly larger than the inner diameter of the column, shown in FIG.
The horizontal rotation ring 22 is interposed between the support portion retaining plate 23 and the fixing ring 21.
The horizontal rotation ring 22 is fixed to a rotation ring support plate 24 as shown in FIG.
2 and the rotating ring support plate 24 are fixed to a stand base 25 as shown in FIG.

Further, on the lower surface of the horizontal rotation ring 22,
As shown in FIG. 121, a plurality of bosses 22a are protruded to facilitate the assembly of the horizontal rotation ring 22 and the stand base 25, and the bosses 22a are fitted to the stand base 25. Rotating ring support plate 2 in hole 25b
4 and are fitted. Further, as shown in FIG. 122, a half-moon-shaped hole 23a is formed in the support portion 23.

In the above-mentioned stand support 5, the support 1
7. The combination of the disk portion made up of the members of the fixing ring 21 and the support portion 23 and the members of the horizontal rotation ring 22, the rotation ring support plate 24 and the stand base 25 are integrated. Since it rotates, the fixing ring 2
A sliding surface is formed between the first rotating ring 22 and the horizontal rotation ring 22. Therefore, when the material of the horizontal rotation ring 22 is polyacetal, good sliding with the fixed ring 21 can be expected due to self-lubrication.

As described above, the support device 3 is provided with the stand support 5 erected so that the angle can be adjusted in the left and right directions with respect to the support base 6, and the display mount for vertically operating the stand support 5 with respect to the stand support 5. The display device main body 200 is supported via the member 4. Further, the display device main body 200 supplies power thereto, or when information input by a keyboard is displayed on the display device main body 200 via the electronic device main body, etc.
It is necessary to connect a cable 31 such as a power cable or an interface cable to the display device main body 200.

For this reason, as shown in FIG. 123, the display device 1 provided with the support device 3 of the present embodiment has a cup 31 around a place (for example, on a desk) where the display device 1 is placed by the cable 31. Alternatively, in order to prevent things such as a vase from falling or falling, and to prevent the cable 31 from being pinched under the support base 6 when the display device 1 is placed on a desk, A C-shaped clamp 32, which is a cable gripping member, is integrally protruded below the rear support cover 18b of the support 5.

With this configuration, for example, as shown in FIG. 123, the connector 31a of the cable 31 is connected to the connection port provided on the back surface of the display device main body 200, and the intermediate portion of the cable 31 is bent to form a loop. , And the other device connection side of the middle portion of the cable 31 is locked to the clamp 32. Thus, the cable 31 can be disposed along the stand support 5 to the connection port of the display device main body 200. Even when the angle of the stand support 5 with respect to the support base 6 is adjusted in the left-right direction, the display device main body 200 can be used.
Is rotated in the left-right direction integrally with the stand support 6, so that the object around the place where the display device 1 is placed by the cable 31 does not fall or fall. Moreover, since the loop is formed by bending the middle portion of the cable 31, the cable 3 is tilted by the display device main body 200.
1 is not pulled and the stability of the support device 3 is not impaired. Further, since the cable 31 is clamped along the stand support 5, when the support device 3 is placed on, for example, a desk, the cable 31 is placed below the support base 6.
Of the support device 3 and the support device 3 can be easily installed on the installation surface.

Next, the support base 6 will be described.

The support base 6 is obtained by covering a stand base 25 shown in FIG. 124 to which the horizontal rotation ring 22 and the rotation ring support plate 24 are fixed with a base cover 26. A projection 25a is provided to be engaged with the hole 23a of the support portion 23 shown in FIG. And this projection 25a
The hole 23a regulates the rotation range of the stand support 5 in the left-right direction.

[0247] Also, the rotating base 1 is attached to the base cover 26.
A turning base portion through hole 26a into which the reference numeral 7a is inserted is formed, and a turning portion cover 27 for closing the turning base portion through hole 26a is provided in the turning base portion through hole 26a.

Further, anti-slip seats 28 having a large frictional force, such as rubber and sponge, are fixed to the four corners of the stand base 25 to prevent the stand base 25 from moving when the stand support 5 is rotated in the left-right direction. I have.

By the way, since the display device main body 200, which is a relatively heavy object, is attached to the support device 3 of the present embodiment, the display device 1 of the display device 1 mounted on an inclined surface within an allowable limit is provided. Device body 2
It is necessary to ensure that the stability of the display device 1 is not lost even when the 00 is rotated back and forth.

Therefore, a region formed by sequentially and virtually connecting a plurality of non-slip seats (contact portions) 28 which are in direct contact with the installation surface on a plane is defined as an effective support region, and the installation surface is an inclined surface. Perpendicular to the horizontal reference plane from the center of gravity of the display device 1 mounted on the inclined surface of the allowable maximum tilt angle θ, when the maximum allowable tilt angle θ in the front-rear direction allowed by the display device 1 is The non-slip seat 28 is disposed on the stand base 25 so that the base passes through the effective support area.

This relationship is defined by equation (7). That is, when the position of the center of gravity of the display device 1 changes in the front-rear direction and the vertical direction, the height from the installation surface to the center of gravity when the center of gravity is located at the frontmost end is h ₁ ,
H ₂ a height from the installation surface to the center of gravity when the center of gravity is located at the rearmost end, the horizontal distance between the frontmost end and rearmost and X _4, the effective support and a perpendicular line dropped with respect to the horizontal reference plane from the center of gravity Assuming that an intersection with the region is H, the width of the effective support region in the front-rear direction passing through the intersection H, that is, the width D of the anti-slip seat 28 in the front-rear direction is expressed by Expression (7).

[0252]

D = X ₄ + (h ₁ + h ₂ ) tan θ (7) By setting the width D to be equal to or larger than the value obtained from the expression (7), the stability of the display device 1 is lost. Will not be.

The expression (7) is set assuming that the maximum allowable inclination angle in the front direction and the maximum allowable inclination angle in the rear direction of the installation surface of the display device are the same θ.

That is, the support device 3 has a stand post 5 rotatable about an axis in a direction perpendicular to the sixth support, and the stand post 5 has an outer peripheral edge rotating with respect to the support base 6. When the diameter of the disk portion is d, the diameter d is set to be smaller than the width D of the effective support area.

Similarly, since the display device main body 200, which is a relatively heavy object, is attached to the support device 3 of the present embodiment, the display device 1 mounted on an inclined surface within the allowable limit is set. Display device body 2
It is necessary to ensure that the stability of the display device 1 is not lost even when the 00 is rotated left and right.

Therefore, a region formed by sequentially and virtually connecting a plurality of non-slip seats (contact portions) 28 which are in direct contact with the installation surface on a plane is defined as an effective support region, and the installation surface is an inclined surface. Perpendicular to the horizontal reference plane from the center of gravity of the display device 1 mounted on the inclined surface having the allowable maximum inclination angle θ, when the maximum allowable inclination angle θ in the left-right direction allowed by the display device 1 of FIG. The non-slip seat 28 is disposed on the stand base 25 so that the base passes through the effective support area.

This relationship is defined by equation (8). That is, the height from the installation surface of the stand base 25 to the center of gravity of the display device 1 is h (in FIG. 126, it is assumed that the entire surface of the stand base 25 of the support base 6 is the installation surface). If the position of one of the center of gravity is changed in the lateral direction, the two horizontal distances of the center of gravity position and X _5, the intersection of the perpendicular and the effective support region hung down with respect to the horizontal reference plane from the center of gravity when the H The width of the effective support area in the left-right direction passing through the intersection H, that is, the width B of the anti-slip seat 28 in the left-right direction is expressed by the following equation (8).

[0258]

B = 2htan θ + X ₅ (8) By setting the width B to be equal to or larger than the value obtained from the equation (8), the stability of the display device 1 is not lost.

The equation (8) is set assuming that the maximum allowable leftward tilt angle and the maximum allowable rightward tilt angle of the installation surface of the display device are the same θ.

Next, radio wave countermeasures will be described.

By the way, in recent years, many electronic devices using electromagnetic waves such as mobile phones have become widespread. There is a problem in that peripheral devices cause electromagnetic interference and radio interference due to electromagnetic waves (radiation interference waves) emitted from electronic devices. In connection with this, the electromagnetic environment compatibility (Electr compatibility) which prevents the device or system from being affected by the electromagnetic ambient environment and not affecting the others and causing performance degradation, malfunction, etc.
o-magnetic Compaitibility (EMC) has become an environmental issue.

For this EMC countermeasure, unnecessary electromagnetic signals,
Or, electromagnetic interference, which is an electromagnetic interference that has a negative effect on the function of an electronic device as a result of electromagnetic noise, such as deterioration or malfunction or failure.
(EMI), and immunity (EMS) (Electromagnetic Susceptibility) (EMS) (Electromagnetic Susceptibility), which operates without adverse effects even when an electronic device receives electromagnetic interference generated by another device.

In Japan, the VCCI standard stipulates that the level of radiated interference waves radiated from electronic equipment be kept below a specified value. Similarly,
In the United States and Europe, it is required to be regulated by FCC standards and EN standards, which are legally binding, and to keep them below the standard values.

Normally, radiated emission exceeding this standard value is
This is a harmonic component generated by an electronic circuit having a high clock frequency. Moreover, since only a part of the frequency range of the harmonic component exceeds the specified value, if measures are taken to limit the frequency exceeding the specified value to a certain level or less, radiated interference can be reduced economically and effectively. Can be suppressed.

On the other hand, flat displays such as liquid crystal display devices are rapidly spreading, and their sizes are gradually increasing. However, stand members for supporting large flat display devices are subject to design restrictions. And because of mechanical constraints and to keep costs low,
Generally, there is a tendency to use a metal material formed in a horizontal H shape or an inverted T shape.

However, the ordinary display device body 2
The stand member that supports 00 resonates at a specific frequency that becomes a radiated interference wave, and a noise component is amplified.

Therefore, in the present invention, a support device 3 as in the present embodiment has been considered. As shown in FIGS. 94 and 95, this support device 3 has a stand support 5 erected on a support base 6 and a display mounting member 4 attached to the upper end of the stand support 5. It is formed by material.

A color ferroelectric liquid crystal driven by a clock of a maximum of 20 MHz is provided for each of the supporting device 3 taking measures against resonance for radiation interference and the support device taking no measures against resonance for radiation interference. The display device main body 200 is mounted, the display device main body 200 is operated normally at the open site, and an antenna is set up at a position 10 m away from the display device main body 200 to measure the level of the radiated disturbance.

In this case, a measuring device having a configuration as shown in FIG. 127 is used. The measuring device includes an antenna 41 for receiving a radiated interference wave radiated from the display device main body 200, an amplifier 42 for amplifying a received signal received by the antenna 41, and a frequency component of an electric signal. A spectrum analyzer 43 effective for observing the harmonic distortion in which the amplitudes of the radiated interference waves are displayed in a list, a recorder 44 for recording the overall status of the radiated disturbance waves obtained by sweeping all frequencies by the antenna 41 and the spectrum analyzer 43, and a spectrum analyzer 43 And a receiver 45 which is provided in parallel with the recorder 44 and measures the level of the radiated disturbance at a specific frequency of the swept radiated disturbance.

As the antenna 41, 30 MHz to 30
The area of 0 MHz is Biological Antenna.
a and use Logperiodic
Use Antenna.

The measuring device operates as follows. That is, the entire frequency range to be measured by the antenna 41 and the spectrum analyzer 42 is swept, and the entire state of the radiated disturbance is recorded in the recorder 43. Thereafter, with respect to a specific frequency component of the radiated interference wave, the level of the radiated interference wave is accurately measured again by the receiver 44 to determine whether or not the level is within the standard value.

As a result, the measured values of the electromagnetic field strength of the vertical deflection wave in the case where no countermeasures are taken against the radiated interference wave are as shown in FIG. 128. FIG. 129 shows measured values of the electromagnetic field strength of the vertical deflection wave when the resonance countermeasures are taken.

According to this, in the support device in which no countermeasures are taken against the radiated disturbance, as shown in FIG.
It was found that radiated emission exceeding the specified level was generated.

On the other hand, in the support device 3 in which the countermeasures against resonance for the radiated interference wave are taken, as shown in FIG. 129, the radiated interference wave exceeding the level of the VCCI standard value (representing the data of the measurement example 1) is generated. It was found not to occur.

Measurement Example 1 shows a ferroelectric display shown in FIG.
And the radiated interference was measured. As shown in FIG. 98, the support device 3 has a display mounting member 4 on which a display device main body 200 is mounted on an upper end of an insulating stand support 5 erected on a support base 6.
With this configuration, mechanical strength and cost can be satisfied.
A result below the level of the CCI standard was obtained.

In the measurement example 2, the support arm of the support device was made of an insulating material such as a synthetic resin, and a test was performed in the same manner as in the measurement example 1 described above. The result was lower than the VCCI standard value in all frequency ranges. However, this support device is practically unsatisfactory because of the lack of mechanical strength of the support arm.

In Measurement Example 3, a display mounting member 4 and a stand support 5 were connected via an electrically insulating member, and a test was performed in the same manner as in the above-described example. As a result, although the level of the VCCI standard value was slightly higher than that of the measurement examples 1 and 2, it was lower than the VCCI standard value level in all frequency regions.

On the other hand, in Comparative Example 1, the measurement was performed with the ferroelectric display being supported by the supporting device. The result is shown in FIG. In other words, the support device has a configuration in which a display mounting member on which the display unit is mounted is laid horizontally on the upper end of a metal stand pillar erected on the support base. With this configuration, mechanical strength and cost are reduced. Although the above point was almost satisfied, the result that the radiated emission was generated exceeding the level of the VCCI standard value was obtained.

Although the above results vary depending on the driving conditions and the display pattern of the ferroelectric display, in this experiment, the ambient temperature was 23 ° C., the driving voltage was 20 V, the frame frequency was about 15 Hz, and the display pattern was radiated. This is an H-shaped repetition pattern that is normally used when measuring an interference wave.

From these results, it can be seen that by forming the supporting device 3 as in the present embodiment, the display device main body 2 can be formed.
It has been found that the support device 3 does not resonate with the electromagnetic wave of a specific frequency which is radiated from the driving circuit of the liquid crystal display or the like and which enters the driving circuit from the outside. In general, a supporting device made of a metal material generates induced radiation by radiated disturbance, and since the supporting device has an antenna structure, the radiated disturbance from the supporting device or an electromagnetic wave of a specific frequency to the supporting device is amplified. It is thought to be done.

Therefore, by configuring the support device 3 as in Measurement Example 1 to Measurement Example 3, the measured value of the radiated disturbance wave or the electromagnetic wave of the specific frequency is not amplified and the VCC is not amplified.
This is below the level of the I standard value.

To mount the display device main body 200 on the display holder 7, the pins 202g are engaged with the concave portions 7b, 7b of the display holder 7 (see FIG. 94), and then the display device main body 200 and the display holder 7 are screwed. Stop (see FIG. 95).

An operation of rotating the display device main body 200 to an arbitrary position in the vertical direction will be described.

First, in a state where the operation force F for rotating the display device main body 200 is not applied and the display device main body 200 is located at an arbitrary home position, the shaft member 12 based on the forward shift of the center of gravity is displaced. The torque generated by the weight W of the surrounding display device body 200 is applied in the direction of tightening the lock spring 13, and the lock spring 1
3, the shaft member 12 is tightened. For this reason, the display device main body 200 is in a stopped state due to the frictional force of the lock spring 13 on the shaft member 12.

Next, in order to rotate the display device main body 200 located at the home position shown in FIG. 108 upward, for example, the action point U ₁ at the upper end of the display device main body 200 is pressed by a predetermined or more operating force F ₁ . I do. Operation force F ₁ which thereby applied to the point U ₁ is
The shaft member 12 is rotated via the display holder 7 in a direction to increase the inner diameter of the lock spring 13. For this reason, the pressure contact force on the shaft member 12 is reduced, and the display device main body 2
00 when tilting upward and decreases the downward torque T _r1 generated, the operation force F ₁ at the time of upward turning relative downward torque T _r1 and the own weight W of the display device main body 200 As a result, the display device main body 200 can be tilted upward. Then, while pressing the operation force F ₁ a predetermined or more display apparatus main body 200, a display device main body 200 is rotated upward. Thereafter, when releasing the predetermined or more operation force F ₁ to the display device main body 200 returns to state an inner diameter press-contact force of the shaft member 12 reduced in diameter the original lock spring 13, the display device main body 200 is operating force F
It will stop at the position where ₁ was released.

For example, in order to rotate the display device main body 200 located at the home position upward as shown in FIG. 109, an operation force F ₁ of a predetermined value or more is applied to the action point D ₁ at the lower end of the display device main body 200. Add. As a result, the operation force F ₁ applied to the point of action D ₁ rotates the shaft member 12 via the display holder 7 in a direction to increase the inner diameter of the lock spring 13. For this reason, the shaft member 1
2, the downward generated torque _Tr1 generated when the display device main body 200 is tilted upward is reduced, and the downward generated torque _Tr1 and the own weight W of the display device main body 200 are reduced. operation force F ₁ at the time of upward turning increases Te, to allow tilting of the display holder 7 upwardly. Then, while a predetermined or more operation force F ₁ is applied to the display device main body 200, a display device main body 200 is rotated upward. Thereafter, when releasing the predetermined or more operation force F ₁ to the display device main body 200, the pressing force of the shaft member 12 the inner diameter of the locking spring 13 is reduced in diameter returns to its original state, the display device main body 200 is operating force F ₁ Will stop at the position where is released.

Thus, the display device main body 2
00 can be rotated to any position upward by more than a predetermined operating force F ₁ that against the downward torque T _r1. Further, since the back surface of the display device main body 200 abuts on the connecting portion 8a of the support arm 8, further rotation of the display device main body 200 upward is restricted.

Next, for example, as shown in FIG. 110, in order to rotate the display device main body 200 located at the home position in the downward direction, an operation force F of a predetermined level or more is applied to the action point U ₂ at the upper end of the display device main body 200. Add ₂ . Accordingly, the operation force F ₂ applied to the action point U ₂ rotates the shaft member 12 via the display holder 7 in a direction in which the inner diameter of the lock spring 13 is reduced. For this reason, the shaft member 1
2 and the frictional force increases, but the moment based on the own weight W of the display device main body 200 is increased by the operating force F.
Becomes larger than the upward generated torque T _r2 participating in _2, to enable the operation force F ₂ the tilting of the display device main body 200 downward. Then, while a predetermined or more operation force F ₂ is applied to the display device main body 200, a display device main body 200 is rotated downward. Thereafter, when releasing the predetermined or more operation force F ₂ to the display device main body 200, the inner diameter of the lock spring 13 returns to the pressed state of the original of the shaft member 12, the display device main body 200 is stopped at a position releasing the operation force F ₂ Will do.

In order to rotate the display device main body 200 located at the home position downward as shown in FIG. 111, for example, the operating point D ₂ at the lower end of the display device main body 200 is set to an operating force F ₂ higher than a predetermined value. pressed by the operation force F ₂ to thereby exerted on the point D ₂
Rotates the shaft member 12 via the display holder 7 in a direction in which the inner diameter of the lock spring 13 is reduced. For this reason, the pressure contact force and the frictional force on the shaft member 12 increase,
Since the moment based on the own weight W of the display device main body 200 is larger than the upward generated torque T _r2 are added to the operation force F _2, it is possible to rotate the display device main body 200 in a downward direction by the operation force F _2.

Thus, the display device main body 2
00 can be rotated to any position in the downward direction by a predetermined or more operation force F ₂ that against the upward generated torque T _r2. Further, the lower end of the display device main body 200 abuts against the stopper 20 of the stand support 5, whereby further rotation of the display device main body 200 in the downward direction is restricted.

From the above, the display device main body 200
Can be operated with almost the same operating force when operating in the upward direction and when operating in the downward direction. The display device main body 20 can be operated at an arbitrary position within a predetermined angle without discomfort.
0 can be tilted.

On the other hand, to rotate the display device main body 200 in the left-right direction, an operating force is applied to the action point on the side surface of the display device main body 200 to rotate the display device main body 200 relative to the support device 3. Good. In this case, a horizontal rotation ring 22 is inserted between a fixing ring 21 fixed to the column 17 and a column retaining portion 23, and the horizontal rotation ring 22 and the rotation ring support plate 2 are inserted.
4 is fixed to the stand base 25, and the hole 23 a of the pillar portion retaining portion 23 is inserted into the projection 25 a of the stand base 25, and as shown in FIG. In the case of rotating the projection 2, the projection 2 located substantially at the center of the half-moon-shaped hole 23 a
By rotating the supporting portion retaining portion 23 so as to slide the hole 23a along 5a, the display device main body 200 is rotated by approximately 90 ° in the clockwise direction.
Similarly, as shown in FIG.
For example, when the display screen of No. 00 is rotated to the right, the hole 23 is formed along the projection 25a located substantially at the center of the hole 23a.
By rotating the support portion retaining portion 23 so as to slide a, the display device main body 200 can be rotated by approximately 90 ° in the counterclockwise direction.

As described above, the depth D of the support base 6 is set to (7)
Since the width B is defined by the equation (8) and the width B is defined by the equation (8), if the support base 6 is installed within the allowable maximum inclination angle, the display device main body 200 is rotated by 90 ° in either the left or right direction. Even so, the position of the center of gravity is on the plane of the support 6, and the display device main body 200 can be stably rotated in the left-right direction.

Next, the advantages of the embodiment of the display device having the above-described support device will be described.

According to the present embodiment, the display unit 23
Since the switch power supply unit 223 is included in the same housing (in the front cover 201 and the rear cover 202) together with 0, the temperature of the display unit 230 rises due to the heat generated by the power supply unit 223. In particular, in the case of the display unit 230 using a ferroelectric liquid crystal, the power supply unit 223
As a result, the temperature of the display unit 230 rises, the response speed of the ferroelectric liquid crystal increases, and good image quality is maintained. In the present embodiment, the power supply unit 22
3 is disposed substantially below the display unit 230, heat from the power supply unit 223 efficiently moves to the display unit 230 side, the response speed of the ferroelectric liquid crystal is increased, and good image quality is maintained. You.

Further, according to the present embodiment, heat insulating plate 225 is arranged at a predetermined position between switch power supply unit 223 and liquid crystal panel P, and furthermore, inverter unit 5
Since the positional relationship between the liquid crystal panel 70 and the controller unit 572 is in a specific state, the temperature distribution in the liquid crystal panel P is uniform, and the display quality is also uniform.

Further, the front cover 201 and the rear cover 2
Since a large number of heat radiating holes 202a are formed at predetermined locations in 02, the temperature distribution of the display unit 230 (liquid crystal panel P) can be controlled in combination with the heat insulating plate 225. Therefore, the temperature distribution of the liquid crystal panel P becomes uniform, and the display quality is also made uniform.

Further, according to the present embodiment, it is not necessary to provide a separate heater or a control circuit for heating display unit 230 in order to improve the temperature distribution of the liquid crystal panel, so that power consumption is reduced. In addition, the number of parts is reduced, and the assemblability and maintainability are improved, and the reduced number of parts reduces the weight and is convenient for transportation and movement. In addition, the device itself becomes inexpensive.

Furthermore, since the display unit 230 and the switch power supply unit 223 are housed integrally in the same housing (in the front cover 201 and the rear cover 202) and are not separated from each other, the display device main body 200 Easy to move.

Further, the switch power supply unit 223 includes the display unit 230, the backlight unit 530, the inverter unit 570, and the controller unit 57.
Since the display device main body 2 is disposed on the side surface (lower surface side), the display device main body 200 can be made thinner and the installation space can be reduced. This is particularly effective when the display device main body 200 is installed on a desk. Further, according to the present embodiment, since inverter unit 570 and controller unit 572 are arranged side by side along the back surface of backlight unit 530, display unit main body 2
00 is further reduced in thickness.

Further, according to the present embodiment, since the display device main body 200 is supported by the support device 3 so that the angle can be adjusted, the user can freely arrange the display device main body 200 in a posture in which an image is easy to see. As a result, the visibility of the liquid crystal display device 1 is improved.

On the other hand, according to the present embodiment, since the thermistor 310 is fixed by the fixing member 315,
The attachment of the thermistor 310 is reliable and easy. In addition, the thermistor 310 can be attached using a small gap in the display device main body 200, and the display device main body 200 can be made thinner and smaller accordingly.
Furthermore, the temperature of the liquid crystal panel P is increased by making the elastic members 313 and the like that fix the thermistor 310 have high thermal resistance, and that there is only air with high thermal resistance around the thermistor 310 except for the elastic members 313. Can be measured accurately.

According to the present embodiment, since the front cover 201 and the rear cover 202 can be easily attached and detached, maintenance inside the apparatus is easy, and for example, the life is shortened due to the high brightness of the lamp. Therefore, even if it becomes necessary to replace the backlight unit 530, the backlight unit 530 can be easily replaced. Also, when replacing the backlight unit 530, FIG.
As shown in FIG. 4, the sealed state of the spaces S1 and S2 formed above and below the display unit 230 is not impaired.
No dust adheres to the surface of the liquid crystal panel P (accurately, the surfaces of the polarizing plates 321 and 322), and there is no possibility of display defects. Therefore, the wiping operation for removing the dust is not required, and the replacement operation can be easily performed even in a clean room. When the backlight is replaced, the diffusion plate 23
9 is exposed and dust and the like easily adhere to the lower surface of the diffusion plate 239. However, since the diffusion plate 239 is not affected by mechanical stress as in the liquid crystal panel P, it can be wiped off. Even if it is still attached,
Since the light is diffused by the diffusion plate 239 itself, the attached dust is difficult to see, so that it is unlikely to cause display defects.

On the other hand, since a substantially closed space S2 is formed above the display unit 230, the liquid crystal panel P
Is vibrated by the air damper effect of the space S2, the vibration is attenuated at an early stage, thereby preventing the display quality from deteriorating.

On the other hand, in the present embodiment, the display plate 242 is formed of a glass plate. This glass plate has a modulus of longitudinal elasticity that is about 30 times larger than that of a transparent resin plate (for example, an acrylic plate), and can reduce deflection against stresses such as external static pressure. Therefore, even if the space S2 repeatedly expands and contracts due to the vibration of the display unit 230, the display plate 242 hardly bends due to the expansion and contraction. As a result, the air damper effect of the space S2 can be maintained. Vibration can be attenuated in a short time.

Further, since it is not necessary to form a closed space with the backlight unit 530, the structure shown in FIG.
As shown at 35, ventilation holes 620,.
Are formed to improve the ventilation around the backlight unit 530. As a result, most of the heat generated by the backlight unit 530 is released to the outside through the ventilation holes 620,. Further, heat not released from the ventilation holes 620,... Is also blocked by the diffusion plate 239 provided between the backlight unit 530 and the liquid crystal panel P. Therefore, the heat transmitted to the liquid crystal panel P by the convection in the space S1 is considerably reduced, and the temperature distribution becomes uniform.

According to the present embodiment, the liquid crystal driving TAB
The alignment between the liquid crystal panel P and the liquid crystal panel P is performed by the alignment marks 301,..., 303,.

Also, the substrate side marks 301,..., 303,
Is not only made of metal, but also in the area 2 near the mark.
Since 62B ₁ and 262B ₂ are transparent without the metal electrode 270 formed thereon, the substrate side marks 301,.
, And the contrast between the regions 262B ₁ and 262B ₂ is increased. Therefore, even if coaxial incident light is used in image recognition by a camera, the accuracy of image recognition is improved with transparent electrodes (that is, scanning electrodes 269,... And information electrodes 28).
The liquid crystal panel P is not affected by the thickness of the liquid crystal panel P
In addition, the alignment accuracy of the liquid crystal drive TAB 330 is improved.

In general, as in this embodiment, TA
When the image recognition of the B-side automatic marks 371 and 371 is performed via the liquid crystal panel P, the TAB-side automatic marks 371 and 371 are used.
.. Overlap with an opaque member such as a metal electrode, image recognition becomes impossible. However, in the present embodiment, the substrate 26
Are provided with the transparent areas 262B ₁ and 262B ₂ , the TAB side marks 371 and so on
_1, is capable of always image recognition as long located 262B _2, there is no problem as described above.

On the other hand, the substrate side marks 301,.
Are easily formed in the process of forming the metal electrodes 270, and do not require a dedicated process for forming a mark. Therefore, it is possible to prevent an increase in the manufacturing cost of the liquid crystal panel P and a complicated manufacturing process.

According to the present embodiment, the substrate side automatic marks 303,... And the TAB side automatic marks 371,.
Even when the liquid crystal panel P and the liquid crystal driving TAB 330 are at the regular connection position, they are formed so as to have a certain deviation. Here, for example, only one of the liquid crystal panel P and the liquid crystal driving TAB 330 is set on the alignment, or one of the alignment marks 303 and 37 even if both components are set normally.
If 1 is out of the recognition range of the camera, the camera will recognize only one of the alignment marks 303 or 371. Then, assuming that both marks 303 and 371 are not configured to have a deviation amount at the regular connection position as in the present embodiment, it is determined that the alignment has been completed even in the case described above. Although it is erroneously recognized, according to the present embodiment, there is no such problem.

Further, according to the present embodiment, the visual marks 301,..., 370,. Therefore, the position accuracy can be improved by using both the automatic position adjustment and the visual position confirmation. Also, for example, even when the shapes of the automatic marks 303 and 371 are incomplete and image recognition is not possible, according to the present embodiment, alignment can be performed visually.

On the other hand, according to the present embodiment, the manufacturing cost can be reduced by automatically connecting the liquid crystal panel P and the liquid crystal driving TAB 330.

According to the present embodiment, the holding plates 430,.
, The driver board 400,.
33, so that the driver boards 400,... Do not greatly jump off the cell fixing plate 233 even when the display device main body 200 receives an impact or vibration. , Driver board 400, ... and LCD drive TAB
.. Are not hindered, and the image display on the liquid crystal panel P is performed smoothly.

According to the present embodiment, the holding plate 43
0,... Are the driver boards 400,.
Because it is supported so that it can move slightly along 33,
Even if the liquid crystal panel P thermally expands or contracts due to a change in environmental temperature or the like, the driver boards 400,... Can move with the deformation of the liquid crystal panel P. Therefore, the connection between the driver board 400 and the liquid crystal driving TAB 330 and the connection between the liquid crystal driving TAB 330 and the liquid crystal panel P are not disconnected.
There is no disconnection of 330.

Further, according to the present embodiment, the holding plate 4
By using 30,..., The driver board 40
0,... Can be supported using a very small space on the top surface of the board. That is, the supporting space that must be secured in the driver boards 400,... Can be made very small, so that the driver boards 400,.
00 can be reduced in size. Further, a plurality of driver boards 400,.
Since it is supported by 1, the number of parts is reduced, the assembling work can be simplified, and the manufacturing cost and the parts cost can be reduced.

Further, according to the present embodiment, since cell fixing plate 233 is formed of polycarbonate containing glass fiber, it has low thermal conductivity. Therefore, heat dissipation from the liquid crystal panel P is reduced, and the temperature distribution of the liquid crystal panel P is kept uniform.

In this embodiment, the liquid crystal driving TA
The structure in which the input terminal 332 of B330 is provided in a direction perpendicular to the arrangement direction of the output terminals 333 will be described in further detail. Since the tape carrier used for the liquid crystal drive TAB 330 is expensive and the ratio of the tape carrier to the component cost of the liquid crystal drive TAB 330 is large, it is preferable that the area of the tape carrier used for the liquid crystal drive TAB 330 is small. TAB for liquid crystal drive for various reasons
It is desirable to arrange the input terminals 332 of 330 in parallel with the output terminals 333 to reduce the length of the tape carrier.

However, as described above, the liquid crystal driving TAB 33
When the 0 input terminal 332 is arranged in parallel with the output terminal 333, the following problem occurs.

That is, in a high-definition display having a large number of pixels, the gap between the transparent electrodes (that is, the scanning electrodes 269 and the information electrodes 281) of the liquid crystal panel P is narrowed, and accordingly, the output terminal 333 of the liquid crystal driving TAB 330 is connected. The gap also becomes smaller. Further, the width of the liquid crystal driving TAB 330 and the gap between adjacent liquid crystal driving TABs 330 are also reduced. On the other hand, when the input terminals 632,... Of the liquid crystal drive TAB 630 are formed at optimal intervals so as not to cause a problem such as a short circuit or non-adhesion at the time of connection with the driver board 400, these input terminals 632,. Are larger than the total width (full length of the array dimensions) of the output terminals 333,... As shown in FIGS. 136 and 137. And such a TAB for driving a liquid crystal
When the 630 is actually used for a high-definition liquid crystal panel, the TABs for driving the liquid crystal (accurately, the input terminals 632 of the TABs 630 for driving the liquid crystal) overlap each other, and the wiring to the driver board 400 cannot be performed. there were.

If the gap between the input terminals 632 is reduced to solve such a problem, there are problems such as short-circuiting and non-adhesion when connecting to the driver board 400.

Since the driver board 400 is connected to the liquid crystal panel P via the liquid crystal drive TAB 630 as described above, the driver board 400
The total length of 0 must correspond to the liquid crystal panel P, and the connection electrodes 401a,.

However, in the case of a large liquid crystal panel P of about 24 inches, as shown in detail in FIG. 138, errors occur in the entire length of the driver board 400 and the connection electrodes 401a,. Input terminal 6
.. And the pitch of the connection electrodes 401a,. In such a case,
The errors are accumulated and the connection electrodes 401a,.
, 32,... Has a problem that the contact area required for connection cannot be secured. The contact area when soldering with a soldering tool is (contact area) = {(connection electrode width) − (position error)} ×
(Soldering tool width) However, (connection electrode outer shape) = (input terminal outer diameter). Becomes

According to the structure of the TAB described above, the input terminals 332,.
Are not arranged parallel to, and are arranged at right angles to, the input terminals 332 of the TAB 330 for driving the liquid crystal without having to widen the ends as shown in FIG. The gap between the input terminals 332,... Can be set to an optimum value, and problems such as short-circuit and non-adhesion can be prevented before connecting to the driver board 400.

According to the present embodiment, input terminal 3
Are formed as described above, the area of the tape carrier can be reduced, and the cost of the tape carrier, and hence the cost of the display device main body 200, can be reduced.

Further, with the enlargement of the liquid crystal panel, even if the input terminals 332 of the liquid crystal driving TAB 330 are slightly displaced from the connection electrodes 401a,. … And input terminal 33
Are formed along the direction of the displacement (see FIG. 139), and the width of the soldering tool is sufficiently larger than the longitudinal dimension of each input terminal 332,... And connection electrode 401a. , The distance of the contact portion 636 between the input terminal 332 and the connection electrode 401a does not change, and the dimensional error of the driver board 400 does not affect the connection between the input terminal 332 and the connection electrode 401a. The contact area is secured. Therefore, the liquid crystal driving TAB 330
The connection between the power supply and the driver board 400 is reliable and has high reliability.

According to the present embodiment, as shown in FIG. 59, the thermocompression bonding head 421 and the stage 422
Almost the entire exposed portion of the input terminal 332 of the liquid crystal drive TAB 330 is thermocompression-bonded, so that the solder resist 410 is connected to the thermocompression head 42 via the input terminal 332.
Pressed by 1. As a result, even if the solder 411 is melted, the solder 411 is prevented from creeping up (intruding) into the solder resist 410, and the input terminal 332 is soldered and fixed only in the area F shown in FIG. The region can be exposed without being connected and fixed.

Also, the solder 411 is a TAB3 for driving a liquid crystal.
In the state before 30 is connected, as shown in FIG.
Since the solder terminals are provided so as to be higher than the height of the surrounding solder resist, the input terminals 332 and the solder 411 can be brought into sufficient contact with each other when thermocompression bonding is performed by the thermocompression bonding head 421, and good connection can be performed. .

Furthermore, in the present embodiment, the TAB 330 for driving the liquid crystal has the base film portion 331 partially removed and the input terminals 332,... And the output terminals 33,. Stress due to thermal expansion, heat shrinkage, and the like of the film portion 331 is reduced. Therefore, the input terminals 332,... And the output terminals 33,.

On the other hand, in the case of a liquid crystal panel using a ferroelectric liquid crystal, a step of bringing the liquid crystal into an isotropic state at a high temperature of about 100 ° C. may be performed in order to align the liquid crystal. Due to the difference in thermal expansion between the substrates 262 and 280 and the driver board 400, a shear stress acts on the TAB 330 for driving the liquid crystal along the sides of the substrates 262 and 280. However, in this embodiment, the input terminal 332 and the output terminal 333 of the liquid crystal driving TAB 330 are not connected to the driver board 400 and the liquid crystal panel P in the region E of FIG. 54 and the region E ′ of FIG.
Even if the above-mentioned shear stress occurs, the terminals 332, 33
By the deformation of 3, the cutting of the base film portion 331 can be avoided.

As described above, according to the present embodiment, the substrate 2
At both (or at least one of the connection portions) between the liquid crystal drive TAB 330 and the liquid crystal drive TAB 330 and the driver board 400 (or at least one of the connection portions), the base film portion 331 is opened and metal Since only the leads are formed and only a part of the metal leads are connected, even when a shear stress is generated in the side direction of the substrates 262 and 280, the metal leads that are not connected and fixed are formed.
Since there is a deformation allowance in the column direction of the metal leads, the environmental temperature is low (for example, −20 ° C.) to high (for example, 60 ° C.)
° C), cutting of the base film portion 331 can be avoided.

The board 262 and the driver board 40
Due to the difference in thermal expansion from zero, a shear stress may be generated in the liquid crystal driving TAB 330 in the side direction of the substrate 262 on which the liquid crystal driving TAB 330 and the driver board 400 are arranged. However, in the present embodiment, the liquid crystal driving TA
As shown in FIG. 57, the input terminals 332 of B330 are formed so as to form a row in a direction perpendicular to the side of the board 262, and the solder 411 also forms a row in a direction perpendicular to the side of the board 262. Input terminal 332
Has a deformation allowance and an elongation allowance.
Disconnection or the like of B330 can be prevented.

In this embodiment, the driver board 400 uses a multilayer board made of a glass epoxy material, and the coefficient of thermal expansion of the driver board 400 is set to 0.08 to 0.125%, and the board 262, If the environmental temperature is low (for example, -2)
When the temperature fluctuates from 0 ° C.) to a high temperature (for example, 60 ° C.), due to a difference in thermal expansion between the glass substrate and the driver board, the TAB 330 for driving the liquid crystal and the TAB 330 for driving the liquid crystal generated in the side direction of the glass substrate on which the driver board is disposed. The general characteristics of the FR4 grade glass epoxy multilayer substrate include a heat shrinkage of 0.02 to 0.025% from a high temperature state.
Therefore, when exposed to a high temperature, the liquid crystal drive TAB 33
In some cases, shear stress on the TAB 330 for driving the liquid crystal, which is generated in the side direction of the glass substrate on which the driver board is disposed, may increase.

On the other hand, in the present embodiment, before the driver board 400 is connected to the input terminals 332,... By doing so, the shrinkage rate can be reduced, and the shear stress on the liquid crystal driving TAB 330 generated in the side direction of the glass substrate on which the liquid crystal driving TAB 330 and the driver board are arranged can be reduced.

According to the present embodiment, the thermocompression bonding head 39
1 is a TAB 33 for driving a liquid crystal through a sheet 392 for pressure bonding.
Since 0 is pressed to prevent direct contact with the liquid crystal driving TAB 330, the thermocompression bonding head 391 is prevented from being stained by the anisotropic conductive adhesive film 320 during thermocompression. Further, the crimping sheet 392 relaxes and absorbs the slight inclination of the head 391 and the minute unevenness of the connection electrode portion during the crimping, so that the reliability of the connection state can be improved.

Further, the thermocompression bonding head 391 has a liquid crystal drive T only at the connection portion (region F 'in FIG. 52).
Since the AB 330 is pressed, the amount by which the anisotropic conductive adhesive film 320 is melted by heating and flows out to a region other than the connection portion (region E ′ in FIG. 52) is reduced, and the output in the region E ′ is reduced. The terminal 333 can be prevented from being fixed to the substrate 280.

According to the present embodiment, when the life of the linear light source has expired, the lighting of the linear light source is stopped by the life detecting circuits 593,... And the lighting stop circuits 595,.
Therefore, it is possible to avoid a state in which the filament is broken at the end of the life of the linear light source and abnormal heat generation at the end of the tube, thereby preventing deformation of other components due to the heat generation.

In this embodiment, when one linear light source has reached the end of its life, two linear light sources, the linear light source and a linear light source opposed to the linear light source, are used. Off,
The illumination of the liquid crystal panel P is performed by the remaining two linear light sources 532 and 53
Perform in 2. Therefore, all the linear light sources are not turned off, so that the screen of the liquid crystal panel P does not suddenly become black and the work becomes impossible. Also, the illumination of the liquid crystal panel P is not performed by the remaining three linear light sources,
Since the operation is performed using two symmetrically arranged linear light sources, the luminance distribution on the screen is also symmetrical, so that the operation is not impossible.

Furthermore, according to the present embodiment, the number of lighting circuits 591 and 591 is only half the number of linear light sources, so that the cost is reduced accordingly.

In the above-described embodiment, the heat insulating plate 225 is formed of vinyl chloride and fixed with screws. However, the present invention is not limited to this, and heat from the switch power supply unit 223 is cut off. Other materials and fixing methods may be used as long as they can be used. In particular,
When the heat insulating plate 225 is formed of a metal such as iron or aluminum, not only the temperature distribution and display quality are improved, but also the metal heat insulating plate is formed as described in the above embodiment. When fixed to both the switch power supply unit 223 and the backlight unit 530, their connection strength is improved and the switch power supply unit 2
23 is grounded to reduce radio noise.

The shape and mounting position of the heat insulating plate 225 may be any as long as the heat from the switch power supply unit 223 can be cut off. For example, the heat insulating plate 225 may be inclined so as to be at the upper right as viewed from the front of the device, whereby heat generated on the secondary side of the switch power supply unit 223 is smoothly guided to the right side portion, and the temperature is reduced. Distribution and display quality are further improved. In the above-described embodiment, the heat insulating plate 225 is disposed on the left side when viewed from the front of the apparatus. However, the present invention is not limited to this, and may be disposed over the entire width of the apparatus main body 200. In addition, a hole may be formed at a predetermined position (the right side when viewed from the front of the apparatus) of the heat insulating plate 225. As a result, the heat flow can be accurately controlled, the temperature distribution can be made more uniform, and the display quality can be made uniform.

In the above-described embodiment, the thermistor 310 is fixed to the cell fixing plate 233. However, the present invention is not limited to this, and the thermistor 310 may be fixed to the backlight unit 530.

In the above-described embodiment, the thermistor 310 is fixed by the fixing member 315. However, the present invention is not limited to this. For example, FIG.
As shown in FIG.
Is formed, and the silicone resin 312 or the elastic member 313 is held by the fixing claws 233A.
0 may be fixed.

Further, in the above-described embodiment, the thermistor 310 is arranged so as to be in contact with the end face of the liquid crystal panel P. However, the present invention is not limited to this, and as shown in FIG. You may arrange | position so that it may contact the part other than a display area. In this case, the thermistor 310 to which the lead wire 311 is connected is
An elastic member 313 such as a silicone foam sponge may be sealed with a silicone resin 312 or the like and fixed so as to be sunk between the liquid crystal panel P and a cell fixing plate (or a backlight unit). Even in such a case, it is important to determine the installation position of the thermistor 310 so that the average temperature inside the liquid crystal panel can be detected.

The structure for mounting the thermistor 310 is not limited to a transmissive liquid crystal panel.
The present invention can be applied to a so-called reflection type liquid crystal panel.

On the other hand, in the above embodiment, FIG.
142, the diffusion plate 239 is attached to the cell fixing plate 233, and the closed space S1 is formed by using the diffusion plate 239. However, the present invention is not limited to this.
As shown in FIG.
Is attached to the cell fixing plate 233 instead of the diffusion plate 239, and the diffusion plate 239 is attached to the backlight unit 530.
It may be fixed to the surface of the device.

In the above-described embodiment, the linear light source 532 used for the backlight unit 530 may be a fluorescent lamp or another type of light source. Further, in the above-described embodiment, the so-called edge type backlight unit 530 is used. However, the present invention is not limited to this, and a direct type backlight unit may be used.

Further, in the above-described embodiment, the exposure width of the output terminal 333 (the width of the area D 'shown in FIG. 52) in the liquid crystal driving TAB 330 is set to 2.5 mm. The width (the width of the region E 'shown in FIG. 52) is about 0.5 to 1 mm.
Further, the input terminal 332 of the liquid crystal driving TAB 330
Is 2 mm, and the width of the portion not connected to the driver board 400 (the width of the region E shown in FIG. 54) is 0.5 to 1 mm. Further, the crimping head 3 for crimping the output terminal 333
The width of the tip of 91 is 1.5 mm, and the width of the tip of the crimping head 421 for crimping the input terminal 332 is 1.2 mm. Of course, these dimensions are not limited. Dimensions may be used.

Furthermore, although solder was used as a connecting member between the driver board 400 and the TAB 330 for driving the liquid crystal, the present invention is not limited to this, and an anisotropic conductive adhesive film may be used.

In the above-described embodiment, both the input terminal 332 and the output terminal 333 of the liquid crystal drive TAB 330 are exposed with the base film portion 331 partially removed, but it is a matter of course that the present invention is not limited to this. However, only one of the terminals 332 or 333 may be exposed.

Further, the conductive particles in the anisotropic conductive adhesive film are desirably particles which can be deformed by pressing, and further desirably low melting point metal particles such as solder. Thereby, the conductive particles are deformed during thermocompression bonding, and the contact area of each conductive particle is increased (for example,
The particles having a diameter of 10 μm are deformed to have a diameter of 50 μm), so that a more reliable electrical connection can be achieved.

Further, the thickness of the anisotropic conductive adhesive film 320 before electrode bonding is desirably about 10 to 30 μm, and this thickness is desirably determined depending on the size of the conductive particles and the thickness of the electrode. . For example, when the electrode thickness is 18 μm, the anisotropic conductive adhesive film 320
Is desirably about 15 μm. At least the thickness of the anisotropic conductive adhesive film 320 before connection should be such that it has a volume sufficient to fill the gap between the electrodes and / or the gap between the electrode and the support. preferable.

It is preferable to note that if the thickness of the anisotropic conductive adhesive film 320 is too large, the connection gap between the electrodes may not be reduced, or sufficient connection may not be achieved. <Another Embodiment Regarding Alignment Mark> Next, referring to FIG.
This will be described with reference to FIGS.

In this embodiment, the laminated state of the scanning electrodes 269,... And the metal electrodes 270,... On the exposed portion 262a of the upper substrate 262 is as shown in FIG. The hatched portions in the figure indicate the scanning electrodes 26.
9 and the metal electrodes 270 are stacked.

That is, in the region 262A of the central portion of the upper substrate 262 (the central portion in the width direction of the upper substrate 262 in the direction orthogonal to the longitudinal direction of the scanning electrodes 269,...), The scanning electrodes 269,. Are extended to the end portion (exposed portion) of the upper substrate while maintaining the laminated state, whereas the scanning electrodes 269,... And the metal electrodes 270,. The laminated structure is only halfway through, and only the scanning electrodes 269 are formed in the regions 262B ₁ and 262B ₂ . Further, in this embodiment, the liquid crystal panel P _1, the electrode 299 formed in the region 262A, ... are designed to be driven by, region 262B _1, 262B ₂ which is formed on the scan electrodes 269, ... Is a so-called ground electrode.

In addition, these areas 262B ₁ and 262B
₂ , substrate side marks 700, 700 are formed.
These substrate-side marks 700 are provided on the outermost electrode 26.
It is formed on the outer side of the electrodes 9 and 269 at positions adjacent to the electrodes 269 and 269, and each has a substantially square shape. Although FIG. 143 shows only the electrode shape of the upper substrate 262, the other lower substrate 280 also has electrodes and substrate-side marks having the same configuration.

Next, the shape and the like of the output terminals 333 of the liquid crystal driving TAB 330 will be described with reference to FIG.

The liquid crystal driving TAB 330 has a base film portion 331, an input terminal (not shown), output terminals 333,..., And a liquid crystal mounted between these terminals. And a driving IC (not shown).

Of these, the output terminals 333,.
As shown in FIG. 4, it has a stripe shape and is formed by applying Au plating or Sn plating to the surface of a copper foil. Note that these output terminals 333, ... of the gap and the number is, the liquid crystal panel P ₁ side of the scanning electrodes 269, which corresponds to ... gap or number.

Then, the outermost output terminals 333, 333
Are provided with TAB side marks 701 and 701, respectively. Note that these TAB side marks 701,.
Are formed of the same material as the output terminals 333. Specifically, these marks 701 are left without being removed by etching when patterning the output terminals 333. In the present embodiment, the substrate side marks 700 and 700 and the TAB side mark 70
The 1,701, the liquid crystal panel P ₁ and the liquid crystal driving TAB3
30 are formed at positions where they do not overlap each other when properly connected. Specifically, the substrate side mark 7
Although the gap between 00 and 700 is equal to the gap between the TAB side marks 701 and 701, in the normal connection position, the gap shown in FIG.
Are formed so as to be shifted along the longitudinal direction of the electrodes 299,.

Next, the liquid crystal panel P ₁ and the liquid crystal driving TAB
The operation at the time of alignment with 330 will be described with reference to FIGS. 145 and 146. Here, FIG. 146 shows the TAB 330 for driving the liquid crystal and the liquid crystal panel P during alignment.
Shows the positional relationship between _1, FIG. 145 shows the positional relationship after the alignment completion.

[0362] Now, TAB for driving the liquid crystal in the liquid crystal panel P ₁
When connecting the 330, the liquid crystal panel P ₁ is placed on the liquid crystal panel alignment unit, TAB for driving liquid crystal
330 is placed on the TAB alignment unit. This placing operation may be performed automatically by a dedicated device, or may be manually performed by an operator. However, in this case, TAB
Areas other than the side mark 701, 701 is a region 262A (i.e., the region 262B ₁ or the region outside the region 262B ₂₎ metal electrodes 270 positioned so as not to overlap ... and coarse adjustment the position of the two alignment units There is a need to. In this stage of the coarse adjustment, as shown in FIG. 146, the output terminal 333 of the TAB side, ... and the glass substrate side of the electrode 299, ... and, at a distance shifted by d ₁ state.

Next, when automatic fine adjustment by a camera or the like is started, the TA which is held at an appropriate position by the coarse adjustment is set.
The B-side marks 701,... Are recognized by a camera via a transparent substrate 262, an anisotropic conductive adhesive (not shown), and a base film portion 331, and the other substrate-side marks 70,.
0,700 is recognized through the transparent substrate 262. Then, the image recognition information from the camera is sent to a predetermined information processing unit (not shown), and the processing unit
, 701,... Are calculated. This deviation amount is sent as a signal to an alignment driving unit (not shown),
The drive unit finely adjusts the positions of the two alignment units so that the deviation amount becomes an appropriate value. In addition,
Such position adjustment is performed by driving the liquid crystal panel alignment unit, the TAB alignment unit, or both. After the fine adjustment, FIG.
As shown in FIG. 5, the marks 700,..., 701,... Are shifted only by a predetermined amount in the longitudinal direction of the electrodes 299,. Then, after the the fine adjustment ends, the output terminal 333 of the TAB side, ... and the glass substrate side of the electrode 299, ... deviation d ₁ of is eliminated.
Before setting the upper substrate 262 and the liquid crystal driving TAB 330 in the alignment device, the upper substrate 26
2 and the like, an anisotropic conductive adhesive is applied to at least one of the connection ends in advance, or an anisotropic conductive adhesive film is thermally transferred, and after the alignment is completed, a thermocompression bonding head (not shown) And the liquid crystal drive TAB 33
0 is thermocompression-bonded, and both are fixed in a regular position. In addition,
In FIG. 145 and FIG. 146, only the alignment marks 700,..., 701,... On one side have been described, but the image recognition is also performed on the alignment marks 700,. Further, by performing image recognition on the marks on both sides, the alignment is accurate.

According to the present embodiment, the substrate side mark 70
Are made of metal, and the regions 262B ₁ ,... Near the mark are transparent without the metal electrodes 270,.
62B ₁ ,... Therefore, even with coaxial incident light in the image recognition by the camera, without the image recognition accuracy is dependent on the thickness of the transparent electrodes, the liquid crystal panel P ₁ and liquid crystal drive TAB33
The alignment accuracy of 0 is improved.

In general, as in this embodiment, TA
If the B-side mark 701, ... the image recognition performed via the liquid crystal panel P ₁ is, TAB-side mark 701, ... becomes impossible image recognition overlaps an opaque member such as metal electrodes.
However, in this embodiment, since the transparent area on the upper substrate 262 262B _1, ... a is provided, TAB-side mark 701, ... is the region 262B _1, it can always image recognition as long located ... in There is no such problem as described above.

On the other hand, the substrate side marks 700,... Are easily formed in the step of forming the metal electrodes 270,..., And do not require a dedicated step for forming the marks. Accordingly, it is possible to prevent the complication of the rise and manufacturing process in the manufacturing cost of the liquid crystal panel P _1.

[0367] According to this embodiment, the substrate-side mark 700 and the TAB-side mark 701, as is has a constant deviation in the case where the liquid crystal panel P ₁ and the liquid crystal driving TAB330 is in normal connection position Is formed. Here, for example, a liquid crystal panel P ₁ or the liquid crystal driving TAB300 one part Kano any case or only not set, both parts of one be set correctly alignment mark 700 on the alignment, Are out of the recognition range of the camera, the camera recognizes only one of the alignment marks 700 or 701. Then, as in the present embodiment, both marks 700,
If 701 is not configured to have a deviation amount at the regular connection position, it is erroneously recognized that the alignment has been completed even in the case described above. If so, there is no such problem.

[0368] On the other hand, according to this embodiment, by performing the connection between the liquid crystal panel P ₁ and the liquid crystal drive TAB330 automatically, the manufacturing cost can be reduced.

It is to be noted that the metal electrodes 270,.
.. May be formed over the entire width of the scanning electrodes 269,..., Or may be formed on a part of the scanning electrodes 269,.

The number of transparent electrodes that are not covered with the metal electrodes is not limited to the number shown in each of the above embodiments. Further, in the above-described embodiment, the electrodes formed in the regions 262B,... Are ground electrodes. However, the present invention is not limited to this, and may be used for driving a liquid crystal panel. However, in that case,
It is necessary to take measures for lowering the resistance, such as applying a drive voltage to a set of a plurality of electrodes.

Further, the portions where the TAB side marks 701,... Are formed may be exposed by removing the base film portion, or the base film portion may be formed. <Another Embodiment Regarding Pressing Plate> Next, another embodiment relating to the pressing plate for the driver board in the display unit will be described with reference to FIG.

In the first embodiment described above, a slight gap is formed between the holding plates 430,... And the driver board 400. In the present embodiment, as shown in FIG. The holding plate 702 is made of a leaf spring made of a metal or a synthetic resin, and the tip of the holding plate 702 is urged toward the upper surface of the driver board 400. However, the urging force of the holding plate 702 is set to such a degree as not to hinder the movement of the driver board 400 in the direction parallel to the cell fixing plate 233. FIG.
In FIG. 7, only the structure of one holding plate is shown, but the other holding plates are also constituted by leaf springs, and their ends are urged to the upper surface of the driver board 400.

According to the present embodiment, since the holding plate 702 is formed of a leaf spring, the holding plate 702 having the same size and the same shape can be applied to driver boards having different thicknesses. Becomes As a result, parts can be shared, and the cost of the display device main body 200 is reduced. Further, according to the present embodiment, driver board 400 can be supported in a state where there is no play in a direction perpendicular to cell fixing plate 233, that is, in a state where there is no play at all. Therefore, the movement (bounce) of the driver board 400 due to vibration or impact is more accurately suppressed, and the disconnection between the driver board 400 and the liquid crystal driving TAB 330, and the disconnection between the liquid crystal panel P and the liquid crystal driving TAB 330. Further, the breakage of the liquid crystal drive TAB 330 itself can be reliably prevented, and the image display state of the liquid crystal panel P can be favorably maintained.

According to the present embodiment, even if the liquid crystal panel P thermally expands or contracts due to a change in environmental temperature or the like, the driver board 400 can move with the deformation of the liquid crystal panel P. Therefore, the driver board 400
The connection between the liquid crystal driving TAB 330 and the liquid crystal driving TAB 330 and the liquid crystal panel P is not disconnected, and the liquid crystal driving TAB 330 is not disconnected. Also, the holding plate 702 as described above
The driver board 400 can be supported by using a very small space on the upper surface of the board. That is, the supporting space that must be secured in the driver board 400 can be made very small, so that the driver board 400,
As a result, the size of the display device main body 200 can be reduced. Further, a plurality of driver boards 400, 40
Since 0 is supported by one pressing plate 702, the number of parts is reduced, the assembling work can be simplified, and the manufacturing cost and the parts cost can be reduced.

In the above embodiment, the material of the holding plate 702 is not particularly limited.
Is made of a conductive material, which is maintained at a predetermined potential to serve as a ground terminal, and
2 may be electrically connected to the ground terminal of the driver board 400. This facilitates securing the ground potential of the driver board 400. <Another Embodiment of Supporting Structure of Display Panel 242> Next, another embodiment of a supporting structure of the display panel facing the display unit of the present invention will be described with reference to FIG.

In the present embodiment, as shown in FIG. 148, a cell cover 703 is provided on the back side of the front cover 201 (on the side where the liquid crystal panel P is arranged).
The cell cover 703 is formed of a polycarbonate resin in which glass fibers are dispersed, and its outer surface (front surface, back surface, and side surface) is plated with nickel or the like. The cell cover 703 is formed in a frame shape having an opening 703a, and the frame portion has a substantially L-shaped cross section as shown in the figure.

On the other hand, in the present embodiment, the above-mentioned cell fixing plate 233 is attached to the cell cover 703 via the cell elastic holding member 232 and the cell frame 231. A display plate 242 is adhered to the concave portion on the surface of the cell cover 703 by an adhesive member 244 (see FIG. 15), and the opening 703 a of the cell cover 703 is closed by the display plate 242. Further, the cell cover 703 is attached to the front cover 201 so as to form a predetermined gap between the cell cover 703 and the front cover 201, and the display plate 242 is sandwiched between the cell cover 703 and the front cover 201. Held in state. Then, the opening 201a of the front cover 201 is closed by the display plate 242 arranged as described above.

The display plate 242, cell cover 703, cell fixing plate 233, and liquid crystal panel P form a substantially closed space S2. An elastic member 243 is attached to the lower surface of the cell cover 703 (the surface facing the display unit 230) along the entire periphery of the opening 703a, and the elastic member 243 contacts the display unit 230. Thus, the space S2 is further partitioned to prevent dust from entering the surface of the liquid crystal panel P.

In such a support structure, the front cover 20
1 and the rear cover 202 can be easily attached and detached. Therefore, even if the backlight unit 530 needs to be replaced due to a shortened life due to the high brightness of the lamp, the backlight unit 530 can be easily replaced. it can. Further, even when the backlight unit 530 is replaced, the hermetically sealed state of the spaces S1 and S2 formed above and below the display unit 230 is not impaired. There is no risk of occurrence. Therefore, the wiping operation for removing the dust is not required, and the replacement operation can be easily performed even in a clean room. When the backlight is replaced, the diffusion plate 239 is exposed and dust and the like easily adhere to the lower surface of the diffusion plate 239. However, since the diffusion plate 239 is not affected by mechanical stress unlike the liquid crystal panel P, a wiping operation is performed. In addition, even if the dust or the like remains attached, the attached dust becomes difficult to see because the light is diffused by the diffusion plate 239 itself, and therefore, it may cause display defects. Hateful.

On the other hand, since a substantially closed space S2 is formed above the display unit 230, the liquid crystal panel P
Is vibrated by the air damper effect of the space S2, the vibration is attenuated at an early stage, thereby preventing the display quality from deteriorating.

On the other hand, in the present embodiment, the display plate 242 is formed of a glass plate. This glass plate has a modulus of longitudinal elasticity that is about 30 times larger than that of a transparent resin plate (for example, an acrylic plate), and can reduce deflection against stresses such as external static pressure. Therefore, even if the space S2 repeatedly expands and contracts due to the vibration of the display unit 230, the display plate 242 hardly bends due to the expansion and contraction. As a result, the air damper effect of the space S2 can be maintained. Vibration can be attenuated in a short time.

Furthermore, since there is no need to form a closed space with the backlight unit 530, a vent hole is formed in the rear cover 202 to improve the ventilation around the backlight unit 530, as in the above embodiment. As a result, most of the heat generated by the backlight unit 530 is released to the outside through the ventilation holes. In addition, heat that is not released from the ventilation holes is also generated by the backlight unit 53.
The light is blocked by a diffusion plate 239 provided between the liquid crystal panel P and the liquid crystal panel P. Therefore, the heat transmitted to the liquid crystal panel P by the convection in the space S1 is considerably reduced, and the temperature distribution becomes uniform. <Another Embodiment Regarding Backlight Unit> Next, another embodiment regarding the backlight unit will be described with reference to FIGS. 149 to 151.

As shown in FIG. 149, the backlight unit 710 according to the present embodiment includes a front transmission plate 711 arranged in parallel with the rear reflection plate 536. A space SB is formed between the plate SB and the plate 711.

The front transmission plate 711 is formed of a thin transparent light guide plate, and a reflection pattern 712 is formed on the lower surface thereof. That is, the reflection pattern 712 is arranged on the front side of the space SB so as to face the rear-surface reflection plate 536. This reflection pattern 712 is formed, for example, by vapor-depositing aluminum in a mesh shape or a dot pattern shape.
Is configured to reduce the amount of light emitted to the side (forward), and to increase the amount of light in places where the distribution density is low. The distribution density of the reflection pattern 712 is shown in FIG.
50 and FIG. 151. That is,
The distribution density in a cross section including the linear light sources 532 and 532 arranged to face each other and passing through the center of the light guide plate surface is highest near the linear light source 532 as shown in FIG. In addition, it is set so as to become lower as the distance from the linear light source 532 increases. In addition, the distribution density is changed gently and continuously (in such a manner that the rate of change of the distribution density does not become discontinuous) by drawing a gentle curve in a portion (central portion) farthest from the linear light source 532. Is configured. Further, as shown in FIG. 151, the distribution density of the reflection pattern 712 is set so as to be lowest near the center of the front transmission plate 711, and becomes higher as it approaches the end of the front transmission plate 711. Is set to The in-plane uniform distribution density curve is a closed loop having no corner, and preferably, the front transmission plate 71
Outline of the effective emission surface 1 (rectangular in the case of this embodiment)
This curve is almost similar to the above and has no corner. The ratio of the major axis / minor axis in the uniform distribution density curve is set to be substantially equal to the ratio of the major side to the minor side of the emission effective surface.

On the other hand, a prism sheet 713 is arranged on the upper surface of the front transmission plate 711 to make the direction of illumination light uniform. The prism sheet 713 is disposed so that the ridge direction of each prism coincides with the longitudinal direction of the linear light source 532, and the apex side of the prism faces the front transmission plate 711.

According to the present embodiment, bright lines in planar light emitted from the backlight unit are suppressed, luminance is made uniform, and display quality of the liquid crystal panel is improved.

Although the distribution density of the reflection pattern 712 is as shown in FIG. 151 in the above embodiment,
Of course, there is no need to be limited to this. For example, there are places where the luminance is low, such as the four corners of the backlight unit 710, and the distribution density of the reflection pattern 712 is made lower than its surroundings, so that the luminance of the light emitted from this part is raised and the surface as a whole The brightness distribution of the shape light can be made to be a continuous change, and can be substantially uniformized (see FIG. 84). Conversely, when the luminance is locally too high, the luminance can be made uniform by increasing the distribution density of the reflection pattern 712 in that part. Such adjustment of the distribution density needs to be performed according to the type (characteristics) and arrangement of the light source. Further, in the above-described embodiment, the space SB is used as the light guide means. However, the present invention is not limited to this, and a transparent member such as an acrylic plate may be used. <Another embodiment relating to information signal> Next, the information side IC
_{350B 1, ..., 350B 2,} ... ( see Figure 38-41)
FIG. 1 shows a case where the waveform of the output signal is changed.
Explanation will be made along 52. In this case, FIG.
As apparent from (d) and (e), the information side IC 350B
_When V3 is selected for the output of ₁ ,.
The output of 350B ₂ ,... Selects V4 and the information side IC 35
0B _1, when the output of ... has selected V4, the information side IC350B _2, the output of ... selects V3.

In the case shown in FIG. 152, for example, at time t1, most of the scanning electrodes 269,... To which no scanning signal is applied take a constant potential VC, and the information side IC 350
The information electrodes 281 connected to B ₁ ,... Take the potential V3, and the information electrodes 281 connected to the other information-side IC 350B ₂ ,. Then, a current flows from the V3 line of the driver board 400U to the V4 of the driver board 400D in almost the entire area of the liquid crystal panel P. On the other hand, at time t2, a current flows from the V3 line of the driver board 400D to the V4 line of the driver board 400U in almost the entire area of the liquid crystal panel P.

Even when such a signal is applied, the same effects as described above can be obtained. That is, cables 456, 457 for supplying power sources V3, V4, and VC
Is a short cable disposed very close to the liquid crystal panel P, so that the impedance can be reduced and a driving waveform with less delay can be supplied to the liquid crystal panel P. As a result, good display characteristics can be satisfied.

Further, the peaky current is supplied by the bypass capacitors C3,..., And no peaky current flows through the cable. As a result, malfunction of the drive circuit can be avoided.

Furthermore, in the present embodiment, the electrode 2
69,..., 281,.
3, V4, VC only driver board 400L via the information side IC350B _1, ..., 350B _2, and supplies ..., these IC350B _1, ..., 350B _2, ...
Is supplied separately via cables 453 and 455, so that the space problem as in the conventional example can be solved.

In the above embodiment, the information-side ICs 350B ₁ ,.
₂ and... And driver boards 400U and 400D are arranged, respectively.
As shown in FIG. 53, the information side I is provided only above the liquid crystal panel P.
C350B _1, may be arranged a ... and upper driver board 400 U. Further, in the above-described embodiment, the bypass capacitors C3,... Are provided on the common driver board 400L. However, the present invention is not limited to this, and may be provided on another driver board. <Other Embodiments Regarding Signal Wiring> Further, other embodiments regarding signal wiring will be described with reference to FIGS.
7 will be described.

In this embodiment, the common driver board 400L and the driver controller 450
The two flat cables 451 and 452 are connected to each other.
Are supplied with power V1, VC, V2. Also,
Power and control signals for driving the scanning ICs 350A,... Are supplied by the other cable 452.

On the other hand, the other two driver boards 400
U, 400D and the driver controller 450
Book flat cable 720, 721 or 722, 7
23 and one cable 720 or 7
Information side IC350B ₁ from 22, ..., 350B _2, ... supply V3, VC, V4 is supplied to the other cable 7
21 or 723, the information side IC 350B ₁ ,.
A power supply and a control signal for driving 50B ₂ ,... Are supplied.

Also, the common driver board 400L and the upper driver board 400U are connected to the flat cable 7
25, and the common driver board 4
00L and the lower driver board 400D are connected by a flat cable 726. Further, the ground of the upper driver board 400U and the ground of the lower driver board 400D are connected to a flat cable 727.
Connected by

The scanning ICs 350A,... Supplied with the power supplies V1, VC, V2 are, for example, shown in FIG.
(C) are applied to the respective scanning electrodes 269,. The scanning signal 7
Reference numeral 30 denotes a reset pulse 7 as shown in FIG.
155, and a selection pulse 732 outputted following the reset pulse. As shown in FIGS. 155 (a) to 155 (c), the selection pulse 732 is sequentially applied to the scanning electrodes 269,. It is configured. Here, FIG.
(c) shows the state of line-sequential scanning, taking the n-th, (n + 1) -th, and (n + 2) -th scanning electrodes as examples.
The other scanning electrodes 269 are also line-sequentially scanned. Further, as can be understood from FIGS. 155 (a) to 155 (c), one scan electrode (for example, nth scan electrode)
While the scanning signal 730 is applied to the scanning electrodes 710, the constant voltage VC is applied to the other scanning electrodes (scanning electrodes other than the n-th scanning electrode). That is, for example, in the case of 1/480 duty,
When the potential V1 or V2 is applied to one arbitrary line as shown in the drawing, the potential of VC is applied to the other 479 lines.

On the other hand, the information-side ICs 350B ₁ ,..., 350B ₂ ,.
Signals having the waveforms shown in FIGS.
Are applied. The information electrode 2
The voltage waveforms applied to the scanning signals 73 are the same as those shown in FIG.
It is configured to synchronize to zero.

The information electrodes 281,...
It is also configured so that signals having waveforms shown in (d) and (e) are applied. Here, upper driver board 400U
Information side IC350B by _1, ... and the signal applied through the (see FIG. 156 (d)), the lower driver board 4
The signal (see FIG. 156 (e)) applied via the information-side IC 350B ₂ ,... By 00D means that when one of the signals is at the potential V3 or V4, the other signal is at the potential V4 or V4.
3, when one signal is at the potential VC, the other signal is also at the potential VC.

FIG. 157 is a diagram showing a circuit applied to the present embodiment. Reference numeral 733 in the figure denotes a pixel formed by one information electrode 281a and one scanning electrode 269a. Reference numeral 734 denotes a pixel formed by the information electrode 281b and the scanning electrode 269a. Here, symbol C indicates the capacitance between scanning and information. R1, R2, and R3 are electrodes 281a,
269a and 281b indicate internal resistance. further,
Reference numerals 735, 736, and 737 denote ICs 350B ₁ , 3
50A, respectively show a switching element disposed 350B _2. On the other hand, symbols R4, R5, R6
Indicates the internal resistance of the flat cables 720, 722, 451. Then, for example, power supplies V3, VC, V4
Is the information-side IC 350 via the flat cable 720.
B _1, and is converted into a signal of a predetermined shape by the switching element 735.
a. Similarly, power supply V
1, VC and V2 are also supplied to the scanning-side IC 350A via the flat cable 722, and the switching element 736
Is converted into a signal of a predetermined shape, and the signal is applied to the scanning electrode 269a.

Next, the operation of the present embodiment when the signal shown in FIG. 155 is applied will be described.

Now, when the apparatus is driven, the scanning IC 35
0A,... From the driver controller 450 via the flat cable 452 and the driver board 400L.
A,... And the information side IC 350B ₁ ,.
B _2, the power and control signals for driving the ..., the information-side IC350B ₁ from the driver controller 450 via the flat cable 721 or 723, ..., 350B
₂ ,….

On the other hand, the power supplies V1, VC and V2 are supplied from the driver controller 450 via the flat cable 451 and the driver board 400L to the scanning IC 350.
, And is converted into the scanning signal 730 having the above-described waveform by the scanning ICs 350A,. This scanning signal 730 is applied to each scanning electrode 26 by the line sequential scanning described above.
9 are sequentially applied. Power supplies V3, VC, V4
The information side IC350B ₁ via the flat cable 720 or 722, ..., 350B _2, is supplied to .... Then, these information-side ICs 350B ₁ ,.
_2, the signal waveforms shown in FIG. 155 (d) and (e) is formed by ..., the signal each information electrode 281, are applied to .... In this case, since the signal waveforms are the same, all the information electrodes 281 of the liquid crystal panel P are always at the same potential.

In such a voltage applied state, at time t1, which is the time of liquid crystal switching, constant voltage VC is applied to scan electrodes 269,... To which scan signal 730 is not applied, as described above. Information electrodes 281, ...
Are equally applied with the voltage V3. Therefore, over almost the entire area of the liquid crystal panel P, from the information V3 line to the scanning VC line (the information driver boards 400U and 40U).
0D to the scan driver board 400D). At time t2, which is another liquid crystal switching time, the voltage V4 is applied to all the information electrodes 281,..., And the constant voltage VC is applied to most of the scanning electrodes 269,. A current flows from the scanning VC line to the information V4 line (from the scanning driver board 400L to the information driver boards 400U and 400D) over almost the entire area of the liquid crystal panel P.

As described above, for example, at times t1 and t2, the liquid crystal power supply system (V3, V
A sharp current flows through the liquid crystal power supply system (V3, VC, V4) line on the C, V4) line and the flat cable.
A ground line is adjacent to these liquid crystal power supply system lines, and an induced current is generated in the ground line due to generation of electromotive force due to electromagnetic induction. Since the direction of current flow is opposite between time t1 and time t2, the direction of electromotive force is also opposite.

By the way, in the conventional device, the driver board 400L and the upper driver board 400U,
Since the device 400D was not connected, the current for canceling the electromotive force returned to the driver controller 450 through one flat cable, and flowed through the other flat cable. Therefore, since the path through which the current flows is very long, the impedance of this path becomes very large,
As a result, it was not possible to respond to a sudden current generated by electromagnetic induction.

However, in the present embodiment, the driver boards 400L and 400U and the driver board 4
Since 00L and 400D are connected by flat cables 725 and 726, current flows through these flat cables 725 and 726. And these flat cables 725, 726
Is short, the impedance does not increase, and the common driver board 400 fluctuates in the opposite direction.
It is possible to suppress the fluctuation of L and the ground on the information side driver boards 400U and 400D.

Next, the operation of the present embodiment when the signal shown in FIG. 156 is applied will be described.

[0408] In this case, at time t1, the information electrode 281 connected to the information side IC350B _1, ... voltage V3 is applied to the information electrodes 281 connected to the other information side IC350B _2, ... to Is applied with a voltage V4, and a potential difference is generated between the adjacent information electrodes 281,. As a result, current flows from the V3 line of the upper driver board 400U to the V4 line of the lower driver board 400D. On the other hand, at time t2, the applied voltage is reversed and the information side IC 350B ₁
The voltage V3 is applied from the information side IC350B ₂ voltage V4 is applied from. As a result, from the V3 line of the lower driver board 400D to the upper driver board 40D.
A current flows to the 0U V4 line. As described above, when the signal shown in FIG. 156 is applied, a current flows between the upper driver board 400U and the lower driver board 400D, although the flowing direction changes depending on the time. This current causes a current to flow through the adjacent ground line due to electromagnetic induction.

By the way, in the conventional apparatus, the upper driver board 400U and the lower driver board 400U
Since D was not connected, the current for eliminating the electromotive force returned to the driver controller 450 through one flat cable, and further flowed through the other flat cable. Therefore, since the path through which the current flows is very long, the impedance of this path becomes very large. As a result, it is impossible to respond to a sudden current generated by electromagnetic induction.

However, in the present embodiment, upper driver board 400U and lower driver board 400U
Since D and D are connected by the flat cable 727, current flows through the flat cable 727. Therefore, also in this case, the impedance does not increase, and the fluctuation of the ground on the upper and lower driver boards 400U and 400D, which fluctuates in the opposite direction, can be suppressed.

According to the present embodiment, ground fluctuations that occur during liquid crystal switching are
L, 400U, 400D with flat cable 725,7
It can be suppressed by connecting at 26,727. Such an effect is particularly remarkable for a large ground fluctuation appearing when a specific display pattern is displayed, so that stable display performance can be obtained in any display pattern.

Next, another embodiment relating to the signal wiring will be described with reference to FIG. The same parts as those shown in FIG. 156 are denoted by the same reference numerals and description thereof will be omitted.

In the present embodiment, the driver controller 450 and each of the driver boards 400U, 400
D is one flat cable 721, 72
3 only. The upper driver board 400U and the common driver board 400L are:
The lower driver board 400D and the common driver board 400L are connected by two flat cables 725 and 739.
6,740. The supply of the power for driving the liquid crystal to the driver boards 400U and 400D is not performed from the driver controller 450 via the flat cables 720 and 722 as in the above-described embodiment, but the flat cable 451 and the common driver board 400L. And flat cable 739, 740
Via the Internet. The information side IC350B _1, ..., 350B _2, the power and control signals for driving the ..., as in the above embodiment, and is configured to be supplied by the flat cable 721.

Next, according to the present embodiment, at the time of liquid crystal switching, a steep current flows through the liquid crystal power supply system as in the above embodiment, and an induced current is generated in each ground line accordingly. I do. However, according to the present embodiment, each driver board 400U, 400L, 400
Since D is connected by the flat cables 739, 740, and 727, the path through which the current flows becomes short, the impedance does not increase, and the fluctuation of the ground can be suppressed.

According to the present embodiment, ground fluctuations that occur during liquid crystal switching are
L, 400U, 400D with flat cable 739,7
It can be suppressed by connecting at 40,727. Such an effect is particularly remarkable for a large ground fluctuation appearing when a specific display pattern is displayed, so that stable display performance can be obtained in any display pattern.

Next, still another embodiment relating to the signal wiring of the present invention will be described with reference to FIG.
Note that the same portions as those shown in FIG. 158 are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, the scanning ICs 350A ₁ ,.
_2, ... are disposed, the scan electrodes 269, ..., the scanning side IC350A _1, ... and 350A _2, are connected alternately to .... A driver board 400R is connected to the scanning ICs 350A ₂ ,... On the right side, and the driver board 400R and the driver controller 45 are connected.
0 is connected by a flat cable 741. Further, the driver board 400R and the upper driver board 400U have two flat cables 742,
743 and the driver board 40
The OR and the lower driver board 400D are connected by two flat cables 745 and 746. The supply of power for driving the liquid crystal to the driver board 400R is performed by the flat cable 451, the driver board 400L, the flat cables 739 and 740, the driver boards 400U and 400D, and the flat cable 74.
, And the power supply and control signals for driving the scanning ICs 350A ₂ ,... Are directly supplied from the driver controller 450 to the driver board 400R by the flat cable 741. Has become.

Next, according to the present embodiment, at the time of liquid crystal switching, a steep current flows through the liquid crystal power supply system as in the above embodiment, and an induced current is generated in each ground line accordingly. I do. However, according to the present embodiment, each of the driver boards 400L, 400U, 400
D, 400R are flat cables 727, 739, 74
0, 742, and 745, the path through which the current flows becomes short, the impedance does not increase, and the fluctuation of the ground can be suppressed.

According to the present embodiment, ground fluctuations that occur during liquid crystal switching are
L, 400U, 400D, and 400R can be suppressed by connecting the flat cables 727, 739, 740, 742, and 745. Such an effect is particularly remarkable for a large ground fluctuation appearing when a specific display pattern is displayed, so that stable display performance can be obtained in any display pattern. In addition,
It is needless to say that the same effect can be obtained even when the power supply for driving the liquid crystal is supplied to each driver board.

Next, another embodiment of the signal wiring of the present invention will be described with reference to FIG.

In the present embodiment, one upper driver board 400U and one scanning driver board 400L are connected to the liquid crystal panel P. The power supply for driving the liquid crystal to the upper driver board 400U is supplied by the flat cable 451 and the driver board 400U.
The power and control signals for driving the information-side ICs 350B ₁ ,... Are supplied directly from the driver controller 450 via the flat cable 721. The driver board 400L and the upper driver board 400U are connected via a flat cable 725, and are configured to suppress a ground fluctuation at the time of liquid crystal switching.

According to the present embodiment, since each of the driver boards 400L and 400U is connected via the flat cable 725, fluctuation of the ground at the time of liquid crystal switching can be prevented, and stable display performance can be obtained. It is needless to say that the same effect can be obtained even when the liquid crystal driving power is supplied to each driver board.

Next, another embodiment of the signal wiring of the present invention will be described with reference to FIG.

In the present embodiment, the ground lines of each of the driver boards 400L, 400U, and 400D are not connected by a flat cable as in the above-described embodiments, but are connected inside the liquid crystal panel P. . That is, the liquid crystal panel P, electrode 747 in addition to the electrodes for the information display, and ... is formed, these electrodes 747, ..., the liquid crystal driving IC350B _1, ..., 35
Are connected to the ground lines of the driver boards 400U and 400D via electrodes arranged at both ends of a TCP (tape carrier package) on which 0B ₂ ,. Are formed on the liquid crystal panel P, and these electrodes 748 are connected to the ground line of the driver board 400L. The electrodes 747,... And 748,.
.. "), And connects the ground lines of the information driver boards 400U and 400D to the ground line of the common driver board 400L.

According to the present embodiment, since the ground of each driver board 400L,... Is connected, fluctuation of ground during liquid crystal switching can be prevented, and stable display performance can be obtained. Further, according to the present embodiment, parts such as a flat cable and a connector for connecting each of the driver boards 400L,... Become unnecessary, and the cost is reduced accordingly. <Another Embodiment Regarding Driver Board Support Structure> In the above embodiment, the driver board 40
Are supported by the holding plates 430,... (See FIG. 60), but in the present embodiment, the pressing plates 430,. 750 and an elastic member 751 are used. Hereinafter, a specific structure will be described with reference to FIGS. 162 to 166.

In this embodiment, as shown in FIGS. 162 (a plan view of the support structure) and 163 (a cross-sectional view taken along the line AA in FIG. 162), the cell fixing plate 233 includes a driver board. A ridge 750 is provided in an area where
Are formed. The ridge 750 is provided on the liquid crystal panel P
As shown in detail in FIG. 163, the center line of the driver board 400 (two equals in parallel with the arrangement direction of the electrodes of the liquid crystal panel P) is provided. The liquid crystal panel P is formed on the outer side of the dividing line o. That is, the protrusion 750 is formed so as to support a side of the driver board 400 far from the liquid crystal panel P.

In addition, above this ridge 750, FIG.
As shown in FIG. 64, the elastic member 751 is
52, and the elastic member 7
51 is also disposed outside the center line o of the driver board 400 (on the side away from the liquid crystal panel P).
The lower surface of the elastic member 751 faces the driver board 400 at a small distance, and the driver board 400 has a small gap so that it is sandwiched between the elastic member 751 and the ridge 750. Has become.

Next, the operation and effect of this embodiment will be described with reference to FIGS. 165 and 166.

Now, for example, when a drop impact in the + Y direction is applied to the liquid crystal panel P, as shown in FIG. 165, the liquid crystal panel P moves in the same direction due to the drop impact, and the cell fixing plate 233 moves in the + Y direction. The elastic member 23 is deformed like a bow.
6 is compressed between the liquid crystal panel P and the cell fixing plate 233. When a drop impact in the −Y direction is applied to the liquid crystal panel P, as shown in FIG. 166, the liquid crystal panel P moves in the same direction, and the cell fixing plate 233 deforms in an arc in the −Y direction, The elastic member 243 is extended between the liquid crystal panel P and the display panel support member 752.

At this time, the relative positional relationship between the liquid crystal panel P and the driver board 400 changes due to the relationship between the deformation of the cell fixing plate 233 and the contraction / extension of the elastic members 236 and 243, and the driver board 400 moves. That is, since the driver board 400 is supported on the side farther than the liquid crystal panel P by the protrusions 750 and the elastic members 751, it rotates and moves as shown in FIGS. 165 and 166.

Thus, even when a strong shock or vibration is applied, the stress applied to the liquid crystal drive TAB 330 can be reduced, and the breakage of the TAB 330 and the disconnection of the connection portion can be prevented.

Further, since the driver board 400 has a small gap and is sandwiched between the elastic member 751 and the ridge 750, the driver board 400 excessively jumps when a strong shock or vibration is applied. Can be prevented. Further, some deformation of the driver board 400 itself is allowed. Therefore, the liquid crystal driving TAB3
The stress applied to the TAB 330 can be reduced, and breakage of the TAB 330 and disconnection of the connection portion can be prevented.

Next, another embodiment of the support structure of the driver board will be described with reference to FIGS. 167 to 168.

In the above embodiment, the ridge 750 provided on the cell fixing plate is formed continuously over the entire area where the driver board 400 is arranged. As shown in the figure, three ridges 760, 760, 76 are provided at the cell fixing plate 233 at both ends and the center in the longitudinal direction of the driver board 400.
0 is formed. Also, these ridges 760,.
Elastic members 761, 761, 7 are provided above the drawing, respectively.
61 are arranged (see FIG. 168). The lower surfaces of these elastic members 761,... Oppose the driver board 400 at a minute distance, and a minute gap is formed between them. In addition, these elastic members 76
Are a plurality of liquid crystal driving TABs 330,.
Are disposed at positions corresponding to the gaps.

The remaining structure is almost the same as that of the above-described embodiment, and these ridges 760 are provided at the center line of the driver board 400 (two lines parallel to the electrode arrangement direction of the liquid crystal panel P). (Liquid crystal panel P)
(On the side remote from the liquid crystal panel P) on the driver board 400 (see FIG. 168).

Next, the effect of this embodiment will be described.

According to the present embodiment, the elastic member 761,
Are arranged at positions corresponding to the gaps between the plurality of liquid crystal driving TABs 330,.
Can be avoided, and the liquid crystal driving TABs 330 can be prevented from being damaged.

According to this embodiment, the same effects as those of the above-described embodiment can be obtained.

That is, even when shock or vibration is applied to the display device main body 200, the driver board 400 moves as shown in FIGS. 165 and 166. Therefore, stress applied to the liquid crystal driving TAB 330 can be reduced, and breakage of the TAB 330 and disconnection of the connection portion can be prevented beforehand.

Also, since the driver board 400 has a small gap and is sandwiched between the elastic members 761,... And the ridges 760, the excess of the driver board 400 when a strong impact or vibration is applied. Jump can be prevented. Further, some deformation of the driver board 400 itself is allowed. Therefore, the liquid crystal driving TA
The stress applied to B330 can be reduced,
It is possible to prevent breakage of 0 and disconnection of the connection portion.

In the above-described embodiment, the driver board 400 is connected to the ridges 750 of the cell fixing plate 233,
760,..., Of course, the present invention is not limited to this. A projection is formed on the surface of the backlight unit (the surface close to the driver board 400), and the driver board 400 is mounted on the projection. May be placed.

Also, the ridges 750 of the cell fixing plate 233,
, And the elastic members 751,... Are not particularly limited in material and hardness.

Further, in the above embodiment, the elastic members 751,... And the ridges 750,.
May be provided directly above or directly below the input terminals 320,... Of the driver boards 400, thereby preventing the mounting area of the driver board 400 for the electric elements from being narrowed. <Other Embodiments Regarding Flat Cable and Connector> In the above embodiment, the flat cables 451 have two conductive layers (wiring layers 492 and wiring groups 493) and an insulating support layer 491. Had been
Some modifications will be described with reference to FIG.

A flat cable 770 shown in FIG.
Has joints formed at both ends, and at each joint,
One shield wiring layer 771 and one signal wiring layer (wiring group) 772 are exposed.

The flat cable 7 shown in FIG.
Reference numeral 80 denotes a shield wiring layer 781 arranged so as to surround the signal wiring layer 772 to improve the shielding effect. At the joints at both ends, the signal wiring layer (wiring group) 772 is exposed to the upper side in the drawing, and the shield wiring layer 781 is exposed to the lower side in the drawing, as in FIG.

[0446] Further, in the flat cable 790 shown in Fig. 47 (c), at least one of the signal wiring layers 772 is short-circuited to the shield wiring layer 781, so that cross stroke between signal lines is prevented. Note that FIG. 14 also shows a state in which the connector 791 is connected to the flat cable 790.

Further, in the flat cable 800 shown in FIG. 17D, the shield wiring layer 802 on the side of the signal wiring layer 801 has been removed. The exposure relationship with the shield wiring layer 802 is reversed.

The flat cable 8 shown in FIG.
The cross-sectional shape of the flat cable 7 shown in FIG.
The signal wiring layer 811 and the shield wiring layer 812 are both exposed to the upper side at both ends of the flat cable. On the other hand, connector 8
13 are contact points 815, 8 having convex portions on the lower side and having different heights.
16, and these contacts 815 and 816 are in contact with the shield wiring layer 812 and the signal wiring layer 811, respectively.

Next, another embodiment of the flat cable will be described with reference to FIG.

In the flat cable 820 shown in the figure, a signal line group 821 is arranged on one side, a GND layer 822 as a shield layer is arranged on the opposite side, and both ends of the signal line group are connected to the GND layer. The metal part is exposed for this purpose.

This flat cable 820 can be formed by a method using a so-called double-sided FPC, or a single-sided FPC and a GND.
It is conceivable to use a type in which the layers are bonded together. In the case of bonding, a flat cable for a signal line and a flat cable for a GND layer are separately formed and bonded together, or a signal line portion and a GND layer portion are formed and bonded on the same single-sided FPC. A method is also acceptable.

Further, as shown in FIG. 171, the GND layer 8
172 may be arranged only on the opposite surface of the signal line group 831, or the GND layer 830 may be arranged all around the signal line group 831 as shown in FIG.

Next, another embodiment of the connector will be described with reference to FIGS. 173 and 174.

As shown in FIGS. 173 and 174, the connector 850 according to the present embodiment sets the lower contact 852 of the upper and lower contacts in the molded portion 851 to the reference potential (G).
ND) is provided with a uniform contact surface over the entire width for connecting the shield wiring.

[0455] The contact 852 is connected to the fixing terminal 85.
3, 853, and are bonded to the ground solder lands LD of the driver board 400 to be mounted.

Here, the mold part 85 of the connector 850 is used.
Polyamide, liquid crystal polymer, polyphenylene sulfide, or the like is preferably used as 1 and the internal insulator, and the height of the mold portion 851 is desirably 2.0 mm or less.

Next, another embodiment of the connector will be described with reference to FIG.

[0458] In the connector 860 according to the present embodiment, a fixing plate 861 called a retainer is arranged and inserted into the inner surface of the molded portion 496, and the connector contact 49 is provided.
7,499 are firmly contacted by the flat cable 451. Further, by operating the fixing plate 861, a clearance at the time of inserting the flat cable can be secured, and the inserting operation becomes easy.

Next, another embodiment of the connector will be described with reference to FIG.

In this embodiment, the lower contact 499
Both ends 499a, 499a of the driver board 400 protrude long and penetrate the driver board 400.
00 is fixed by soldering on the back surface to ensure electrical and mechanical connection.

Next, another embodiment of the connector and the flat cable will be described with reference to FIG.

In the flat cable to which this embodiment is applied, the signal line group 492 is formed on the lower side, and the shield wiring layer (GND layer) 493 is formed on the upper side of the signal line group 492. In connector 890, lower contact 497 is arranged so as to contact signal line group 492, and upper contact 892 is arranged so as to contact shield wiring layer 493. Then, this upper contact 892
Are extended so as to cover the lower contact 497 and also function as a shield plate.

Next, another embodiment of the connector and the flat cable will be described with reference to FIGS. 178 and 179.

As shown in FIG. 178, the flat cable 900 to which the present embodiment is applied has an insulating support layer 90
1, a signal wiring layer 902 and a maximum power supply voltage VCC (a reference potential such as 5 V) layer 903 are formed on both surfaces of the layer. And these layers 902, 9
03 are covered with insulating protective layers 905 and 905, respectively. The protective layer 905 on the highest power supply voltage VCC (reference potential such as 5V) layer has a shield wiring layer (GND).
Layer) 906 is formed. Further, the shield wiring layer (GND layer) 906 is covered with a protective layer 907.

As shown in FIG. 179, the signal wiring layer 902 is composed of a number of wirings, and includes a maximum power supply voltage VCC (a reference potential such as 5 V) layer 903, a shield wiring layer (GND layer) 906, Are formed by one unpatterned metal layer. Also,
The maximum power supply voltage VCC (5
The protruding length of the reference potential (e.g., V) layer 903 is shorter than the protruding length of the shield wiring layer (GND layer) 906.
3, 906 are configured to be exposed in the same direction (the lower side in FIG. 178).

On the other hand, in the connector 910, an upper contact 912 is arranged on the upper part of the mold part 911 so that the convex part faces downward, and on the lower part of the mold part 911, the convex part faces upward. And two lower contacts 913 and 915 having different heights. Then, in a state where the upper contact 912 is connected to the flat cable 900,
Are in contact with the signal wiring layer 9025, and the lower contacts 913, 91
5 are in contact with a shield wiring layer (GND layer) 906 and a maximum power supply voltage VCC (a reference potential such as 5 V) layer 903, respectively.

Next, another embodiment of the connector and the flat cable will be described with reference to FIGS. 180 and 181.

In the present embodiment, the flat cable 920 is, as shown in FIG.
And a shield wiring layer 922 as a conductive layer and a signal wiring layer (preferably a wiring group) 9 on both surfaces of the layer.
23 are formed respectively. In addition, these layers 9
22, 923 are covered with an insulating protective layer 925, respectively.

The connector 930 is connected to the upper contact 931.
And a lower contact 932. Among them, the upper contact 931 is arranged above the mold portion 933 so that the convex portion faces downward, and the lower contact 932 is arranged below the mold portion 933 so that the convex portion faces upward. Are located. When the flat cable is connected, the upper contact 931 and the lower contact 932 are connected to the signal wiring layer 9.
23 and the shield wiring layer 922 so as to sandwich the flat cable 920. Further, the upper contact 931 extends on the opposite side to the side where the flat cable 920 is inserted, and is soldered to the driver board 400. Also,
The lower contact 932 extends on the side where the flat cable 920 is inserted, and is soldered to the driver board 400.

Next, another embodiment of the connector will be described with reference to FIG.

[0471] In the connector 950 shown in the figure, the lower contact 952 is formed over the entire width of the connector, and has a uniform contact surface. The flat cable 820 shown in FIG. 170 is connected to the connector 950.

According to the present embodiment, the reference potential (GND) is applied to the wiring layer formed over the entire width and the contact side, so that a stronger reference potential is obtained, and the signal line side is connected to the reference potential. The fluctuation of the potential of the signal line is also suppressed by shortening the physical distance of
It is also possible to suppress the occurrence of radiation noise.

Next, another embodiment of the connector will be described with reference to FIG.

In the connector 960 shown in the figure, the lower contact 962 is formed over the entire width of the connector and has a uniform contact surface, and its ends 962a, 962a project from the mold side. It is bent downward and soldered and fixed to a driver board (not shown). With the configuration of such a connector, X in FIG.
The width in the direction (the direction in which the printed wiring is inserted) is suppressed.

Next, another embodiment of the connector will be described with reference to FIG.

[0476] In the connector 970 shown in the figure, the lower contact 972 is formed over the entire width of the connector and has a uniform contact surface, and its ends 972a, 972a protrude from the side of the mold section. It is bent downward and soldered and fixed to a driver board (not shown). Here, in the present embodiment, the lower contact 9
The ends 972a, 972a of the 72 are divided into a plurality as shown.

According to the present embodiment, since the ends 972a and 972a of the lower contact 972 are divided into a plurality,
Work such as soldering is easy, and the mounting process is simplified.Also, due to the change in the shape of the connection between the driver board and the connector, the heat distribution of the connector and printed wiring during reflow mounting has been improved. It is possible to reduce the effect of heat such as deformation.

Next, another embodiment of the flat cable will be described with reference to FIG.

[0479] The flat cable 990 shown in the figure has an insulating support layer 991 and a striped signal wiring layer (group) 992 is formed on one surface thereof. Also,
On the other side, a stripe-shaped GND layer (group) 993 as a shield wiring layer is formed. Then, the signal wiring layer (group) 992 and the GND layer (group) 993
Are exposed at both ends of the flat cable for connection with the connector.

Next, another embodiment of the flat cable will be described with reference to FIG.

[0481] The flat cable 10 according to the present embodiment.
00 has a signal wiring group 1001,..., And the wiring group 1001,. Further, the signal wiring group 1001, above the signal wiring group 1001,...
, A shield wiring layer 1003 is formed so as to surround the protection layer 10.
05. Note that as a material of the support layer 1002, an insulating material having a higher dielectric constant than the material of the protective layer 1005 is used.

According to the flat cables and connectors according to the embodiments described above, the GND between a plurality of printed boards (for example, driver boards) can be firmly connected to each other. Common mode noise and normal mold noise on the upper and flat cables can be reduced. Also, even if a plurality of connectors are mounted on a printed circuit board, a pattern can be formed without dividing GND, and a stable G
It contributes to forming ND. Furthermore, it has the effect of firmly shielding the flat cable, and has a great effect on the radiation noise suppression.It can reduce the required amount of noise suppression components such as three-terminal filters, ferrite beads or ferrite cores, and reduce costs. To contribute. On the other hand, since the GND wire, which previously required one core or a plurality of cores, is no longer necessary, the cable width can be narrowed.
It contributes to the reduction of radiation noise. In particular, the effect is large in a device requiring a relatively long flat cable such as a large flat display having a diagonal size of 15 inches or more. Further, when a flat cable is normally shielded, it is necessary to lower the shield layer to the ground potential by a through hole or the like. However, according to each of the above embodiments, this is not necessary.

FIGS. 187 and 188 are a plan view and a sectional view, respectively, showing a display device connected by the above-mentioned flat cable or connector. Although the connector is indicated by reference numeral 490 and the flat cable is indicated by reference numeral 451, any of the above-described connectors and flat cables may be used.

In this embodiment, the cell fixing plate 10
As shown in FIG. 188, the base 10 is formed by being bent downward, and a chassis 1011 is attached to a lower end thereof. Further, the cell fixing plate 1010 and the liquid crystal panel P are bonded by an elastic bonding material 1012.

In such an apparatus, a large number of flat cables 451 and connectors 490 as described above are arranged.

FIG. 189 is a diagram showing an example in which connectors 490 are arranged on a rigid board 1020.

In the example shown in the drawing, the signal line 49 is provided at the connector portion with respect to the shield wiring layers 499 and SL in one direction.
7, SGL crosses. Therefore, it is not necessary to provide the intersection outside the connector, and the occupation of unnecessary mounting area can be suppressed as much as possible.

Next, a case where a ferroelectric liquid crystal is used for the liquid crystal panel P will be described.

Panel capacitance C = ε _r · ε _O ·· S / d ε: relative permittivity, ε _O : vacuum permittivity, S: electrode area,
d: Electrode (cell) gap Since the pixel size is equal, the capacitance per line (matrix wiring) is equal to that of ferroelectric liquid crystal, for example, S
The capacity is about two to three times larger than the TN type liquid crystal and about five times larger than the TFT type liquid crystal. In order to keep the rising speed of the drive waveform equivalent, if the capacitance C is two to three times, the wiring resistance R per line of the ferroelectric liquid crystal (including the ON resistance of the driver IC) is 1 / l that of the STN type.
A low resistance of about 2/3 and 1/5 of that of the TFT type is required.

Also, the inrush current per line is substantially inversely proportional to the wiring resistance R and proportional to the voltage, and therefore has a peak value 4 to 9 times that of the STN type. Since the current flowing on the driver board is proportional to the screen size, the peak value exceeds 10 times that of the STN type.

Also, since the ferroelectric liquid crystal has a large screen size, the size of the printed circuit board becomes large, and the cable becomes a long system, so that noise due to induction and common mode noise tend to increase.

In the liquid crystal device using the ferroelectric liquid crystal as described above, by using the printed wiring and connection device of the present invention in the line of the drive control system, the display image quality is greatly improved. <Other Embodiment of Backlight Unit> Next, another embodiment of the backlight unit will be described with reference to FIG.

In the present embodiment, the linear light source 532
A reflector 1030 made of aluminum or the like is formed around the reflector 1030.
Is a backlight upper and lower plate 55 formed of a metal sheet metal.
0,551. Thereby, the linear light source 5
The heat of 32 is dissipated through the reflection plate 1030 and the backlight upper and lower plates 550 and 551. Further, the reflecting plate 1030 is connected to the backlight upper and lower plates 55.
It is configured so as to help the heat radiation effect by releasing to 0,551.

According to the present embodiment, when the linear light source 532 is turned on, the light from the linear light source 532 is transmitted to the light guide plate 531.
, And is reflected by a reflector (not shown) to irradiate the liquid crystal panel P. Therefore, when characters and the like are displayed on the liquid crystal panel P, the characters and the like are recognized by light.

In this embodiment, since the grommet (not shown) and the reflecting plate 1030 are formed of a material having a high thermal conductivity, the heat of the linear light source 532 is easily dissipated through these. And is not transmitted much to the liquid crystal panel P.

According to the present embodiment, since the silver film is deposited on the surface of the reflection plate 1030, the light of the linear light source 532 is efficiently reflected. Further, since the present embodiment is an edge-type backlight unit, the thickness of the display device main body 200 can be reduced. further,
Since the heat from the linear light source 532 is easily dissipated through a grommet (not shown) made of a material having a high thermal conductivity or a reflecting plate 1030, the liquid crystal panel P is hardly affected by the heat. In addition, a decrease in display quality due to the influence of heat can be suppressed. Furthermore, even if a temperature distribution occurs in the backlight unit, the influence of the temperature distribution on the liquid crystal panel P is reduced, and the driving conditions of the liquid crystal panel P do not become uneven. On the other hand, since the amount of heat transmitted to the liquid crystal panel P is reduced, a lamp having a high calorific value can be used, and therefore, higher luminance can be achieved.

In the above-described embodiment, the reflection plate 1030 is made of aluminum. However, the present invention is not limited to this, and another metal may be used as long as it has good heat conductivity. . In the above-described embodiment, a silver thin film is deposited on the surface of the reflection plate 1030. However, the method is not limited to this as long as it is an optically enhancing method. For example, a white coating may be applied. You may.

On the other hand, in the above-described embodiment, the grommet is formed of a resin having high thermal conductivity.
It is preferable to increase the heat radiation effect by contacting a metal portion such as 50, 551. Further, as shown in detail in FIG. 190 (a), a radiation fin F1 may be added to the reflection plate 1030 to enhance the radiation effect, and as shown in FIG. Reflector 10 by casting or the like
It may be formed integrally with 30.

Further, a black paint may be applied to the back surface of the reflection plate 1030 to enhance the radiation effect. In addition, you may dye not only apply to black.

The same effect can be obtained by using a composite plate in which a black film is fused to the back surface of the reflection plate.

Next, another embodiment of the backlight unit will be described with reference to FIGS. 191 and 192. FIG.

In this embodiment, a part 551a of the backlight lower plate 551 is cut and raised as shown in FIG. 191, and the part 551a has an inverter unit 570 and a control unit (not shown). ) Are attached by screws 1050,... (See FIG. 192), so that the ground line of these units and the backlight lower plate 551 are electrically connected.

Also, through holes 53 are formed at four corners of the light guide plate 531.
Are formed, and these through holes 531a,.
Have hollow shafts 1051, with taps at both ends.
Are embedded, and the backlight upper plate 550 and the backlight lower plate 551 are attached by screws 1052,.

[0504] Further, the leaf spring 105 is attached to the rear cover 202.
3 is attached to urge the ground portion of the backlight lower plate 551, and electrical conduction between the backlight lower plate 551 and the rear cover 202 is achieved.

The material of the hollow shafts 1051,... And the reflectors 533,... Is made of brass or aluminum having excellent conductivity.
1 is electrically and strongly coupled.

The front cover 201 and the rear cover 202 are provided with shield plating (electroless plating, copper plating overcoated with nickel plating). Then, the plated portion of the front cover 201 and the rear cover 2
02 is electrically connected to the plated portion.

[0507] Further, the backlight upper plate 550 is fixed to the front cover 201, and is electrically and strongly coupled to the plated portion of the front cover 201.

According to the present embodiment, the ground lines of the inverter unit 570 and the control unit (not shown) are connected to the front cover 20 via the backlight upper plate 550 and the like.
1 and is connected to a plated portion of the rear cover 202 via a leaf spring 1053. Accordingly, noise and the like are reduced, driving performance is improved, and a dedicated member for electrical connection is not required, so that space efficiency and assemblability are improved.

[0509] In the above embodiment, the leaf spring 1
053 was used, but of course it is not necessary to be limited to this,
A coil spring may be used. The front and rear covers 20
The plating of 1,202 may be performed by electrostatic painting. Further, the front and rear covers 201 and 202 may be formed of a conductive metal material such as magnesium or aluminum die cast.

Next, along FIGS. 193 to 196,
Another embodiment regarding the backlight unit will be described.

In this embodiment, as shown in FIGS. 193 and 194, through-holes 531a,... Are formed at the four corners (portions that are not optically affected) of the light guide plate 531. Note that these through holes 531a,.
As shown in detail, the backlight upper plate 550 has a large diameter and the backlight lower plate 551 has a small diameter. The through holes 531a,.
60 is embedded. As shown in detail in FIG. 193, this shaft 1060 has a large-diameter portion 1060a and oval-shaped portions 1060b, 1
060b.

[0512] Further, the backlight upper plate 550 is formed with an elongated hole 550a slightly larger than the oval-shaped portion 1060b. Then, in a state where the backlight unit is assembled, the oval-shaped portion 1060b has the elongated hole 550a.
Will be arranged so as to protrude therefrom.

[0513] The other oval portion 1060b is disposed only inside the light guide plate 531 and the lower backlight plate 55
1 does not protrude. The backlight lower plate 551 has long holes 551a,... Similar to the backlight upper plate 550 (see FIG. 196).

As shown in detail in FIG. 195, between the long hole 550a and the oval portion 1060b arranged in the long hole 550a, there are gaps in the front and rear directions with respect to the four diagonal directions. S is formed. The gap S is determined based on the temperature rise value and the linear expansion coefficient of each member. For example, the size of the light guide plate 531 is 345 × 285 mm (diagonal length 447 m).
m), the material is acrylic (methacrylic resin), and when the temperature is increased from room temperature 25 ° C. to 55 ° C. inside the housing, the linear expansion coefficient is 6 × 10 ⁻⁵ / ° C. .4
Expands 8 mm. In other words, about 0.7 from one side of the screen
It will expand 4mm. Therefore, the gap S between the shaft 1060 and the long hole 550a may be 0.8 mm or more. Furthermore, since it is necessary to consider the reduction in dimensions due to the temperature drop, when the room temperature drops from 55 ° C. to 25 ° C., the long hole 550a has a gap S of 0.8 mm or more in the diagonal direction of the four corners. It will be good if it is. Note that this dimension may be appropriately changed according to the size and material of the light guide plate 531.

[0515] The lower hole 551 of the backlight lower plate 551 is also provided.
1a,... Are passed through screws 552,.
The gap in the diagonal direction between the screws 1a,... And the screws 552,.

According to the present embodiment, a large temperature change occurs, and the light guide plate 531 and the backlight upper and lower plates 550, 5
Even if there is a misalignment with 51, their attachment is
, 551a,... Having a predetermined gap S, the light guide plate 531 can freely expand and contract. Therefore, the light guide plate 531 is broken,
Uniform light emission can be maintained without uneven deformation, and a display device with high display quality can be obtained.

[0517] The long hole 55 in the shaft 1060
The protruding portion from 0a does not need to have an oval cross section as described above, and may be a square or a rectangle.

Next, another embodiment of the structure of the entire display device including the backlight unit will be described with reference to FIGS. 197 to 200. FIG.

[0519] In the present embodiment, the front cover 201
As shown in FIG. 197, the interior cover 107
0 is fixed. The interior cover 1070 has an opening 1070a formed in a portion corresponding to the opening 201a of the front cover 201, and the display panel 242 is sandwiched and fixed by both opening edges. The cell fixing plate 233, the cell frame 231 and the interior cover 1070 are made of glass-containing polycarbonate resin, and the cell frame 231 is fixed to the interior cover 1070. Further, the cell fixing plate 233 has a recess at the periphery of the opening, and the diffusion plate 239 is attached to the recess.

[0520] The linear light sources 532 of the backlight unit 530 are driven at a driving frequency of 30 to 50 kHz. Further, the front cover 201 and the rear cover 202 are made of ABS resin, and the inner surfaces thereof are plated to reduce the emission of radio waves.

In the present embodiment, the inverter unit 570 has inverter terminals 1071,.
198, and these inverter terminals 1071,... And the linear light sources 532,... Are connected by lead wires 1072,.

Also, a large number of lead wire fixing members 1073,... Are attached to the backlight lower plate 551, and the lead wires 1072,. Specifically, the lead wires 1072,.
Is wired between the inverter unit 570 or the control unit 572 and the linear light source 532 along the upper linear light source 532 or the lower linear light source 532 in the drawing. Are connected to the inverter terminals 1071,.

According to the present embodiment, the lead wire 107
Are wired so as not to constitute an antenna and are wired in a gap between both units 570 and 572, unlike the conventional one, so that the noise level is reduced.

The present inventor measured low frequency electromagnetic waves at point A (side position of the display device 1080) shown in FIG. 199, and found that the positions of the lead wires 1072,. It was confirmed that the noise level was reduced. Here, the display device 1
The distance X (see FIG. 200) from the center of 080 to the measurement position was 0.5 m.

[0525] In the above embodiment, the edge type backlight unit for distributing the linear light source to the edge of the panel has been described. However, the direct type backlight unit (linear light source 532, ... In the backlight unit disposed immediately below the panel), the lead wire 10
.. May be wired as shown in FIG.

Are wired along the upper edge of the backlight unit and above the inverter unit 570 or the control unit 572, and pass through the gap between the two units 570 and 572 to be connected to the inverter terminals. 1071,...

Next, regarding the backlight unit,
In particular, another embodiment relating to the operation of the backlight unit will be described with reference to FIGS.

In this embodiment mode, as shown in FIG. 202, a lighting device 1090 is provided, and this lighting device 1090 has a lighting circuit 1091. Lighting circuit 1
Reference numeral 091 is configured to supply a lighting current to the linear light source 532 to perform a lighting operation.

The lighting device 1090 has a filament drive circuit 1092. The filament drive circuit 1092 supplies a preheating current to the filament of the linear light source 532 during the preheating period, so that the filament is driven before lighting. Heating is performed to improve dischargeability.

Further, the lighting device 1090 has a starting lighting control section 1093, and the starting lighting control section 1093 is provided.
A lighting switch 1095 is attached to 93. The start-time lighting control unit 1093 includes a preheating period generation unit 1096 and a lighting device power control unit 1097, as shown in detail in FIG. Of these, as shown in FIG. 204, the preheating period generating section 1096 has a resistive element 1099 and a capacitive element 1100, and a time constant circuit for measuring the preheating period of the lighting device 1090 is provided by these elements. Is formed. The lighting device power control unit 1097 includes a transistor 1105 and the like.
When the lighting switch 1095 is turned on, a preheating current is supplied to the linear light source 532, and the preheating period generation unit 109
The configuration is such that the supply of the preheating current is stopped after waiting for the signal indicating the end of the time measurement from 6. Note that the start-up lighting control unit 1
093 has a similar time constant circuit in addition to the above-described time constant circuit.
It is configured to measure a time period (a period indicated by a symbol T2 in FIG. 206A).

The lighting device 1090 has a dimming unit 1120 as shown in FIG.
To 0, a dimming variable resistor 1121 is connected. The dimming unit 1120 controls the linear light source 5 for a certain period after the end of the preheating period (for example, a period indicated by a symbol T2 in FIG. 206A).
32 is lit at the highest brightness to guarantee reliable lighting,
Thereafter, the lighting current is changed according to the dimming variable resistor 1121, and the linear light source 532 is turned on with the set brightness. However, the dimmer 1120 is known to have various configurations such as a variable duty ratio of an applied voltage in addition to a variable current, and the present invention does not depend on the configuration of the dimmer.

Next, the operation of the present embodiment will be described. (Operation at the time of lighting) Now, the lighting switch 1095 is ON.
Then, the potential V11 is applied to the emitter of the transistor 1105 of the lighting device power supply control unit 1097, and a potential lower by 0.6 to 0.7 V than V11 is applied to the base. As a result, the emitter and the collector of the transistor 1105 are conducted, and the potential V11 is output from the output terminal 01 of the lighting device 1090. This output V11 is applied to the filaments of the linear light sources 532,... Via the filament drive circuit 1092, and the filament is preheated. Then, the filament is heated before lighting, and the discharge property is improved.

Also, due to conduction between the emitter and the collector of the transistor 1105, the input voltage V10 to the preheating period generation unit 1096 becomes the same potential as V11, and the base potential of the transistor 1101 becomes V10 (=) almost simultaneously with the start of the preheating described above. V11) (see FIG. 205A). At this time, the collector and the emitter of the transistor 1101 are turned on, and the output terminal O2 of the preheating period generator 1096 is set to the GND potential (see B in FIG. 205).

Since the output terminal O2 of the preheating period generator 1096 is connected to the base of the transistor 1105 of the lighting device power supply controller 1097, the base potential of the transistor 1105 is held at the GND potential. The conduction state between the emitter and the collector of 1105 is maintained.

[0535] Thereafter, the potential of the base of the transistor 1101 starts to drop by a time inversely proportional to the product of the resistance of the resistor 1099 and the capacitance of the capacitor 1100. When this potential becomes 0.6 to 0.7 V, the transistor 1
101, the collector and the emitter become non-conductive,
The potential of the output terminal O2 of the preheating period generator 1096 is V10
Becomes equal to Specifically, after the rise of V10, T10
After the lapse of time, the output terminal O of the preheating period generation unit 1096
The potential of 2 becomes equal to V10 (see B in FIG. 205). Therefore, the base potential of the transistor 1105 is also equal to V10, and the emitter and the collector of the transistor 1105 are turned off. Thereby, the preheating of the filament by the filament drive circuit 1092 ends. (Operation when turning on lighting switch 1095 during preheating period) Now, turning on lighting switch 1095 during the preheating period
Is turned off, the base potential of the transistor 1101 of the preheating period generation unit 1096 is maintained at a predetermined value (0.6 to 0.7 V) or more (although it has dropped as described above). , The collector and the emitter of transistor 1101 are maintained in a conductive state, and preheating period generating section 1096
Is maintained at the GND potential during the preheating period. Therefore, during this time, the base potential of the transistor 1105 is also kept at the GND potential and does not rise to V11.
The lighting device power control unit 1097 continues to supply the power of the V11 potential to the inside of the lighting device 1090. That is, once the lighting switch 1095 is turned on, the preheating current continues to be supplied to the filament even if the switch 1095 is subsequently turned off.

When the base potential of the transistor 1101 drops below a predetermined value (0.6 to 0.7 V), the collector and the emitter of the transistor 1101 become non-conductive, and the preheating period generating section The potential of the output terminal O2 of 1096 becomes equal to V10 (see B in FIG. 205). Therefore, the base potential of the transistor 1105 is also equal to V10, and the emitter and the collector of the transistor 1105 are turned off. As a result, the lighting device power control unit 1097 stops supplying power to the inside of the lighting device 1090, and the filament drive circuit 1092
The preheating of the filament is completed. (Operation at Lighting) As described above, when the preheating period ends and the switch 1095 is in the ON state, the starting lighting control unit 1093 activates a time constant circuit provided separately for the preheating period. While the time constant circuit is counting, the dimming unit 1120 controls the dimming of the linear light source 532 so that the brightness becomes the highest.
To work on. The light control unit 1120 is connected to the linear light source 5.
32 is turned on in the state of the highest luminance. As a result, the temperature of the linear light source 532 rises, the sustainability of discharge is improved regardless of the ambient temperature, and reliable lighting is guaranteed.

[0537] Further, after the time constant circuit completes the set time measurement, the start-up lighting control section 1093 sends a predetermined signal to the dimming section 1120. Then, the light control unit 1120 outputs a signal corresponding to the value of the light control variable resistor 1121 to the lighting circuit 1.
091, and the lighting circuit 1091 sends a lighting current corresponding to the value of the dimming variable resistor 1121 to the linear light source 531.
Feed to 2. As a result, the linear light source 532 illuminates the liquid crystal panel P with the predetermined luminance set by the dimming variable resistor 1121. In this case, the dimming variable resistor 1121
The feedback control to the lighting circuit 1091 by the resistive voltage division of
The dimming unit 1120 performs this.

Next, the effect of this embodiment will be described.

First, in order to clarify the effect of the present embodiment, a conventional problem will be described with reference to FIGS.

FIG. 206 (a) is a diagram showing the temporal change of the lighting current flowing through the linear light source in the normal case (when the lighting switch that has been turned on is kept in the on state without being turned off). FIG. 3B is a diagram showing a temporal change of the lighting voltage (effective value) applied to both ends of the linear light source in that case.

In the case of the figure, in the preheating period T1, no lighting current flows, and only the preheating current flows to each filament. Thereafter, in the period T2, the dimming unit controls the lighting circuit, and the linear light source is illuminated with the highest luminance. Further, in the period T3, the dimming unit controls the lighting circuit, and the linear light source is illuminated with a predetermined luminance.

When the lighting switch is turned off during the preheating period T1, the preheating current is immediately cut off in the conventional apparatus, and the filament preheating operation has been completed. Further, even when the lighting switch is turned off, the timing of the preheating period is continued.

Therefore, if the lighting switch is turned on,
If the OFF → ON operation is performed during one preheating period, the timing of the preheating period is not reset, but the preheating current is cut off when OFF, and the time during which the preheating current is flowing (substantial preheating time) The period T is shown in FIG.
4) was shortened and not sufficiently preheated. In such a case, as shown in FIG. 207, in the period T5 after the end of the preheating period (T4), the predetermined lighting current I3 (= I1) is supplied to the linear light source as in the case described above. However, an excessive voltage increase (V) due to insufficient preheating of the filament due to insufficient preheating.
4) is induced, causing excessive damage to the filament, causing blackening of both ends of the linear light source and shortening of the life of the linear light source, thereby impairing the reliability of the lighting device and the linear light source itself. There was a problem. Further, since the voltage rise is induced as described above, there is a problem that the power consumption is increased 1.5 times as much as the normal case. Here, FIG.
FIG. 7A is a diagram showing a temporal change of the lighting current after the second switch ON in that case, and FIG.
FIG. 3 is a diagram showing a temporal change of a lighting voltage.

The time during which the voltage V4 is applied becomes longer each time the above-described operation (ON → OFF → ON operation of the lighting switch during the same preheating period) is performed. V4 continues to be applied (see FIG. 208). As the above-described operation is repeated, the period during which the voltage V4 is applied becomes longer, the power consumption increases, and further, the blackening of both ends of the linear light source and the shortening of the life of the linear light source are promoted. It will be.

On the other hand, according to the present embodiment, the following effects can be obtained.

That is, according to the present embodiment, once the lighting switch 1095 is turned on, the preheating current continues to be supplied to the filament even if the switch 1095 is subsequently turned off.

Therefore, if the lighting switch 109 is
5 ON, switch 1095 OFF during preheating period
When the switch 1095 is turned on during the preheating period (the lighting switch is turned on during the same preheating period).
Even if (OFF → ON operation is performed), since the preheating current is continuously supplied to the filament from the first switch ON, insufficient preheating does not occur. As a result, blackening of both ends of the linear light source as described above and a reduction in the life of the linear light source are prevented, and an increase in power consumption is also suppressed.

Also, since the dimming section 1120 turns on the linear light source 532 at the highest luminance after the end of the preheating period, the temperature of the linear light source 532 rises, and the discharge maintaining property is maintained regardless of the ambient temperature. Is improved, and reliable lighting is guaranteed.

In the above-described embodiment, the preheating period generating section 1096 is constituted by a differentiating circuit as shown in FIG. 204, but may be constituted as shown in FIGS. 209 to 210.

In FIG. 209, preheating period generating section 11
Reference numeral 30 denotes an integrating circuit. According to this, when the lighting switch 1095 is turned on, the input voltage V10 to the preheating period generating unit 1130 becomes V1 as described above.
1 and the collector and the emitter of the transistor 1131 become conductive, and the preheating period
The 0 output terminal 03 is at the GND potential. On the other hand, the base potential of the transistor 1131 is V10 due to the time inversely proportional to the product of the resistance 1133 and the capacitance of the capacitor 1134.
(= V11), and the base potential becomes V10−
(0.6 to 0.7 V), the collector and the emitter become non-conductive, and the output terminal 03 of the preheating period generator 1130 becomes equal to V10.

In FIG. 210, the preheating period generating section 1140 has an oscillator 1141 and a counting circuit 1142, and is constituted by a digital time constant circuit. Specifically, pulses output from the transmitter 1141 are counted by the counting circuit 1142, and an output change in a desired period is obtained.

In the above embodiment, the start-time lighting control section 1093 is configured as shown in FIG. 204, but may be configured as shown in FIG. 211. That is, the start-up lighting control unit 1150 controls the relay 1 that performs a mechanical operation.
151, an input indicating an ON period of the lighting switch and an input indicating a preheating period are connected to P2 and P3,
By executing the logical sum of both inputs by the logical sum circuit 1153 of the digital integrated circuit, a necessary time until a desired power cutoff for preventing a phenomenon that the linear light source 532 is deteriorated is secured. <Another Embodiment of Cell Fixing Plate> Next, still another modification of the cell fixing plate will be described with reference to FIG. The same parts as those shown in FIG. 148 are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, the cell fixing plate 12
No. 00 has no opening, and is a colorless and transparent blue glass plate (linear expansion coefficient 0.85 × 10 ⁻⁵ / de) having almost the same linear expansion coefficient as the substrates 262 and 280 used for the liquid crystal panel P.
g) is used.

The liquid crystal panel P is fixed to the lower surface of the cell fixing plate 1200 using a silicon adhesive 1201. Further, the TAB 330 for driving the liquid crystal and the driver board 400 are similarly fixed to the lower surface of the cell fixing plate 1200.

[0555] A backlight unit 1202 is provided below the liquid crystal panel P. The backlight unit 1202 includes a plurality of fluorescent lamps 1203,
, A reflector 1205 for guiding the light emitted from the fluorescent lamps 1203,... To the liquid crystal panel P, and a diffuser 1206 for providing uniform brightness over the entire display area.
And so on. And the backlight unit 1
Above 202, a lower polarizing plate 1207 in which a polarizing film is attached to a transparent plate such as glass or acrylic is provided.

Thus, even if the temperature is applied by the reorientation heat treatment, the liquid crystal panel P and the fixing plate 1200 expand to the same extent, so that the liquid crystal panel P is not deformed into a concave shape, and the liquid crystal driving TAB 330 is also fixed to the fixing plate. Since it is attached to the liquid crystal panel 1200, stress is not concentrated on the connection portion with the liquid crystal panel P, and disconnection or the like does not occur.

The fixing plate 1200 may be provided with a hole in the display area of the liquid crystal panel P, or a part other than the display area may be formed by printing, painting, or the like without forming a hole. May not be seen from the display surface side. At this time, the silicon adhesive 1201 is preferably made black. <Embodiment of Display Apparatus Equipped with Vibration Suppression Plate> Next, another embodiment of the vibration suppression structure in the display apparatus will be described with reference to FIGS. 213 to 218.

In general, in the structure shown in FIG. 12, when the liquid crystal panel P is driven, the substrates 262 and 280 opposed to each other vibrate each other due to energization.
In some cases, the noise is transmitted to 1,... And the like, and becomes noise that can be recognized by the user.

In order to suppress this noise, there are methods of lowering the voltage of the applied signal and increasing the frequency outside the audible range. However, according to these methods, the operating characteristics of the liquid crystal panel P itself are reduced. And the display quality is degraded.

The present embodiment aims at solving such a problem. Hereinafter, regarding the first embodiment,
This will be described with reference to FIGS. 213 and 214.

In the present embodiment, the liquid crystal panel P
Has a diagonal length of about 420 mm, and a damping material 1220 is attached to the upper surface of the liquid crystal panel P. The damping material 1220 has a frame-like shape, and is attached to a portion of the liquid crystal panel P outside the image display area with an adhesive. The liquid crystal panel P is mounted on the upper surface of the cell fixing plate 233 via a buffer 236, and an opening 235 is formed in a portion of the cell fixing plate 233 where the liquid crystal panel P is mounted.
Further, a driver board 400 is mounted on the upper surface of the cell fixing plate 233, and the driver board 400 is connected to the electrodes of the liquid crystal panel P via the liquid crystal driving TAB 330. Further, a cell frame 231 is arranged around the above-mentioned cell fixing plate 233, and the entire edge of the cell fixing plate 233 and the cell frame 231 are bonded via a cell elastic holding member 232. Further, a backlight unit 530 is attached to the lower part of the cell frame 231, and light from the backlight unit 530 passes through the opening 235 and the liquid crystal panel P
It is configured to be irradiated.

Next, the operation of the present embodiment will be described.

Now, when the device is driven, a signal is sent to the liquid crystal panel P via the driver board 400 and the like, and a signal of a predetermined shape is applied to the electrodes arranged so as to face each other. Therefore, an electric field is applied to the liquid crystal, the orientation of the liquid crystal molecules changes according to the direction of the electric field, and light from the backlight unit 530 is blocked or transmitted. Then, various information is displayed on the basis of light blocking or transmission for each pixel. This signal is continuously applied, and the direction of the electric field changes at a speed of 3 Hz to 20 Hz. As a result, the fast movement of the liquid crystal molecules is transmitted to the upper and lower substrates as vibration.

[0564] By the way, conventionally, the vibration was transmitted to the upper and lower substrates and amplified to generate noise, but in the present embodiment, the vibration is attenuated by the damping material 1220 to reduce the noise. Is done.

Next, the effect of this embodiment will be described.

According to the present embodiment, since vibration is attenuated by vibration damping material 1220 and noise is reduced, mental fatigue can be reduced even when the device is used for a long time.
Further, according to the present embodiment, it is not necessary to lower the voltage of the signal to be applied or to increase the frequency outside the audible range in order to reduce noise, and the operating characteristics of the liquid crystal panel P itself may be impaired. Absent. The inventor actually driven the device and measured the sound pressure level at a position 25 cm from the liquid crystal panel P. As a result, as shown by a dotted line in FIG. 214, it was confirmed that noise due to driving of the liquid crystal was reduced.

Next, another embodiment of the vibration damping material will be described with reference to FIG.

In this embodiment, a vibration damping member 1221 made of a transparent material is provided, and this vibration damping member 1221 is provided in the image display area of the liquid crystal panel P as shown in FIG. It is adhered to the whole surface including the part.

As shown in FIG. 216, when polarizing films 321 and 322 are attached to both upper and lower surfaces of liquid crystal panel P, damping material 1221 is used as upper polarizing film 3.
What is necessary is just to stick on the upper surface of 21. In this case, the damping material 122
1 is attached to the surface of the liquid crystal panel P, and the polarizing film 32
1,322 may be stuck on the surface of the damping material 1221. In this case, the molecules of the resin used for the vibration damping material 1221 may be non-oriented.

According to this embodiment, the same effects as those of the above-described embodiment can be obtained. That is, even when the display device main body is used for a long time, mental fatigue can be reduced, and the operation characteristics of the liquid crystal panel P itself are not impaired.

Further, another embodiment relating to the vibration damping material will be described with reference to FIG.

In this embodiment, a fixed frame 1230 made of metal such as aluminum is provided, and the liquid crystal panel P and the backlight unit 530 are covered with the fixed frame 1230. The fixed frame 12
A frame-shaped damping material 1231 is adhered to the upper surface of 30. Further, another damping material 1221 is attached to the liquid crystal panel P as described above.

According to the present embodiment, the vibration generated in liquid crystal panel P is attenuated by two damping members 1221 and 1231, so that noise is further reduced.

Further, another embodiment of the vibration damping material will be described with reference to FIG.

FIG. 218 shows the structure of a laminated film 1250 used in the present embodiment. This laminated film 1250 has a vibration damper 1251. This vibration damping material 1251 is configured by laminating an elastic adhesive layer 1252 made of resin and a hard resin layer 1253. These are both transparent, the elastic adhesive layer 1252 is formed of a silicon-based, acrylic-based, or urethane-based resin, and the hard resin layer 1253 is formed of polycarbonate,
It is formed of acrylic or polyethylene terephthalate, and its surface is subjected to a low reflection treatment. In addition,
The thickness of the elastic adhesive layer 1252 is 50 to 200 μm,
The thickness of the hard resin layer 1253 is 0.1 to 2 mm.

The laminated film 1250 has a polarizing film 1255. Triacetate films 1256 and 1256 are laminated on both surfaces of the polarizing film 1255 to protect the polarizing film 1255.
The polarizing film 1255 is manufactured by stretching a PVA film and adsorbing a dye. Also,
The lower triacetate film 1256 is covered with an acrylic adhesive layer 1257, and the acrylic adhesive layer 1257 is covered with a cover film 1259 made of polyethylene terephthalate or the like. Then, the laminated film 1250 is
59 is used by peeling off and attaching an acrylic adhesive layer 1257 to a glass substrate or the like.

In the above embodiment, the damping members 1221,... Are attached to one side of the liquid crystal panel P. However, the present invention is not limited to this. You may. Also, the vibration damping material 122
In the case where 1 is attached to the entire surface of the liquid crystal panel P, the surface of the vibration damping material is formed with unevenness to perform a diffusion process, or a plurality of films having different refractive indices are laminated on the vibration damping material to obtain low reflection. It is preferable to perform a treatment. Further, in the above-described embodiment, the hard layer 1253 is formed of a resin, but is not limited to this, and may be formed of a metal layer such as aluminum or stainless steel. <Another Embodiment Regarding Adhesion of Liquid Crystal Driving TAB> As described above, as a method of connecting the liquid crystal driving TAB to the liquid crystal panel, a base film portion of the liquid crystal driving TAB is partly removed and an output terminal And connecting the output terminal using an anisotropic conductive film. According to this method, stress due to thermal expansion, heat shrinkage, and the like of the base film portion is reduced.

However, when such an anisotropic conductive film is used, conductive particles exist in the gap between adjacent output terminals (see FIG. 219), and electrical insulation cannot be achieved.
There is a problem that reliability is lowered. When the liquid crystal driving TAB and the liquid crystal panel are connected, thermocompression bonding is performed. However, the conductive particles are crushed by dust or the like mixed in the thermocompression bonding or are continuously arranged, so that adjacent output terminals can be connected to each other. There is also a danger of compromising insulation.

As a method for solving such a problem, a resin 1260 having a high insulating property and a photocuring property is used, and the resin 1260 is used to drive the liquid crystal driving TAB 330 (output terminal 3).
33) and the liquid crystal panel P (electrode 269) are connected (see FIG. 220). However, such a resin 12
60, the soft-etched output terminal 3
Maintaining the connection between the electrode 33 and the electrode 269 only by the contraction stress of the resin against the residual stress of the film carrier has a problem in connection reliability.

Therefore, in the present embodiment, FIG.
1 and FIG. 222, the liquid crystal drive TAB 330
An insulating adhesive 1265 is used to connect the (output terminal 333) and the liquid crystal panel P (electrode 269).

Hereinafter, the structure of the present embodiment will be specifically described.

In this embodiment, the liquid crystal driving TA
The base film portion 331 of B330 is partially removed, and the output terminal 333 is partially exposed to form a so-called overhang structure. Further, in the present embodiment, the lower surface of the output terminal 333 (the surface adhered to the base film portion 331) is not subjected to soft etching, and has a thickness of 2 to 3 μm.
In this state, about 1 m irregularities 1266 are left. Furthermore, these output terminals 333 and the electrodes 2 on the liquid crystal panel side
The output terminal 333 and the electrode 269 are thermocompressed in a state where they face each other with the insulating adhesive 1265 interposed therebetween, thereby providing electrical and electrical connection. A mechanical connection has been made. Further, the insulating adhesive 1265 is in a sheet shape as shown in FIG. After the thermocompression bonding, the insulating adhesive 1265 does not remain between the output terminal 333 and the electrode 269 on the liquid crystal panel side.

[0583] According to this embodiment, since the unevenness 1266 is formed on the surface of the output terminal 333, the adhesion to the base film 331 is enhanced.

[0584] These irregularities serve as minute contacts with the electrode 269 on the liquid crystal panel side, and high connection reliability can be obtained. The present inventor has confirmed by a thermal shock test that higher connection reliability is obtained when the unevenness 1266 is formed than when the unevenness 1266 is not formed. Also, an output terminal with an overhang structure,
The same connection was made using the soft-etched output terminal 333 to the output terminal having no overhang structure (the base film portion was left in the connection portion). However, the present inventor has also confirmed by a thermal shock test that the connection reliability is higher than the connection reliability at the output terminal that is not so.

Further, since the insulating adhesive 1265 is in the form of a sheet, workability is improved.

Further, after the thermocompression bonding, the insulating adhesive 1265 is arranged in the gap between the adjacent output terminals, and since there is no conductive particle, the electrical insulation between the terminals can be obtained.

According to this embodiment, the insulating adhesive 1265 is used for the liquid crystal driving TAB 330 (the output terminal 33).
3) and the liquid crystal panel P (electrode 269) are thermocompression-bonded in a state where they are arranged, so that high connection reliability can be obtained.

[0588] Further, since these irregularities 1266 are inevitably produced in manufacturing, they do not cause an increase in cost.

In the above embodiment, the liquid crystal drive TAB 330 (output terminal 333) and the liquid crystal panel P
(Electrode 269), and the thermocompression bonding is performed in a state where the insulating adhesive 1265 is disposed. Needless to say, the insulating adhesive 1265 is not limited thereto. Alternatively, thermocompression bonding may be performed in a state where the thermocompression bonding is performed. <Another Embodiment Regarding Adhesion of Liquid Crystal Drive TAB 330> As shown in FIG. 221, the connection portion between the output terminal 333 of the liquid crystal drive TAB 330 and the liquid crystal panel P (electrode 269) has a density of 10 output terminals 333. If it is more than / mm, there is a problem that the connection strength is low and the connection is easily broken by an external force. The present embodiment aims to solve such a problem.

The present embodiment will be described below with reference to FIGS. 223 and 224.

In the present embodiment, the liquid crystal driving TA
As shown by reference numeral A in FIG. 223, a part of the base film portion 331 of B330 is removed to expose the output terminal 333 (a so-called overhang structure), and the output terminal 333, the liquid crystal panel side electrode 269, Is the substrate edge 1
It is electrically and mechanically connected by an anisotropic conductive adhesive film 320 at a predetermined distance from 270. The anisotropic conductive adhesive film 320 is formed by dispersing conductive particles in an insulating adhesive.

In the vicinity of the substrate edge 1270 (portion B in the figure), the substrate 269 and the liquid crystal driving TAB 33
0 are bonded and fixed by an insulating adhesive 1271. Note that, in this adhesive portion B, the liquid crystal driving TA
In B330, the output terminal 333 is not exposed, and the base film is left. Here, reference numeral 1272 is a protruding electrode, and reference numeral 1273 is a sealing resin.

Next, the effect of the present embodiment will be described.

According to the present embodiment, the substrate 269 and the TAB 330 for driving the liquid crystal are in contact with the insulating adhesive 1 at the B portion.
271 increases the connection strength. Therefore, even when a force is applied from the outside, the force transmitted to the portion A is reduced, the breakage of the output terminal 333 is prevented, and the electrical connection between the liquid crystal panel P and the liquid crystal driving TAB 330 can be secured.

In the above embodiment, the electrical and mechanical connection between the output terminal 333 and the liquid crystal panel side electrode 269 is obtained by thermocompression bonding via the anisotropic conductive adhesive film 320. However, needless to say, the present invention is not limited to this, and thermocompression bonding may be performed via a thermosetting insulating adhesive.

In the above-described embodiment, the base film portion 331 is formed above the liquid crystal driving TAB 330 (see FIG. 223). However, the present invention is not limited to this, and as shown in FIG. TAB330 for
May be formed on the lower side.

Further, a liquid crystal panel P and a liquid crystal driving TAB
The adhesive for bonding 330 to the portions A and B may be of different types or of the same type. In that case, as shown in FIGS. 225 and 226, the adhesive may be continuously arranged (note that FIG.
The base film 331 is a TAB 330 for driving a liquid crystal.
226 shows an example in which the base film portion 331 is formed below the liquid crystal driving TAB 330).

In the above-described embodiment, the electrode 269 on the liquid crystal panel side is not formed in the portion B (see FIG. 223). However, the present invention is not limited to this. It may be extended to a part. In this case, the electrical connection between the electrode 269 on the liquid crystal panel side and the output terminal 333 may be made in the portion B as well. <Another Embodiment Regarding Thermocompression Bonding Apparatus> In general, when the TAB 330 for driving a liquid crystal is thermocompression-bonded to the liquid crystal panel P, a thermocompression bonding apparatus 1290 as shown in FIG. 227 is used.

[0599] This type of thermocompression bonding apparatus 1290 includes a thermocompression bonding tool 1291 supported vertically movably, and a thermocompression bonding portion 1292 is formed on the lower surface of the tool. In addition, the thermocompression bonding tool 1291 is attached to the heater main body 129.
In the inside of the heater main body 1293, the same number (three in the figure) of heaters 1295, 1296, and 1297 as the number of liquid crystal drive TABs to be thermocompression-bonded are arranged. Further, one thermocouple 1299 is disposed below the heater main body 1293 at a position corresponding to the center of the thermocompression bonding portion 1292. Then, these three heaters 1295,.
And one thermocouple 1299 are connected to one common temperature controller 1300, and are configured to raise and maintain the thermocompression bonding tool 1291 at a set temperature.

In the thermocompression bonding apparatus 1290, the heaters 1295,... Are divided into three parts as shown in FIG.
The center heater 1296 is connected to the end heaters 1295 and 1295.
There is a problem that the heat capacity is lower than that of No. 97. Also,
The conventional thermocompression bonding apparatus 1290 has only one thermocouple 1299 near the center heater 1296, and controls all the heaters 1295,... By this thermocouple 1299. Although the temperature reached the set temperature without overshooting, the other heaters 1295 and 1297 had overshoots in temperature. As a result, the thermocompression bonding tool 12
There is a problem that it takes time for the entire 90 to reach the set temperature. In addition, only the end of the heater main body 1293 thermally expands by an amount corresponding to the overshoot, and
There is a problem that flatness of the thermocompression bonding portion 1292 is hardly ensured. On the other hand, the heater main body 1293 is
5,... Have a special structure that is divided into three parts.

This embodiment aims at improving a thermocompression bonding apparatus for TAB mounting in order to solve the above-mentioned problems. Hereinafter, the present embodiment will be described with reference to FIGS.

[0602] The thermocompression bonding apparatus 1310 according to the present embodiment.
As shown in FIG. 228, each of the temperature controllers 1312 has the same number (three in the figure) of heaters 1311, temperature controllers 1312, and thermocouples 1313 as the number of TABs for liquid crystal driving to be thermocompression-bonded. The heater 1311 and the thermocouple 1313 are connected one by one, and the temperature is controlled individually.

According to the present embodiment, each heater 1311
Is individually controlled by a thermocouple 1313 and a temperature controller 1312 arranged near the heater, so that overshoot does not occur when the power is turned on. Therefore, the time required for the entire thermocompression bonding tool to reach the set temperature is shorter than before, and the flatness of the thermocompression bonding portion 1316 is also ensured. Further, when the heater is disconnected, only the broken heater needs to be replaced, and it is not necessary to replace the entire heater body as in the related art, and the replacement cost is reduced.

In the above embodiment, the number of heaters 1311 is equal to the number of liquid crystal drive TABs to be thermocompression-bonded. However, the number of heaters 1311 is not limited to this and may be increased. For example, as shown in FIG. 229, auxiliary heaters 1320 may be additionally provided at both ends of the thermocompression bonding tool so as to eliminate a temperature drop at that portion.

In the above-described embodiment, the thermocompression bonding portion 1316 is flat. However, as shown in FIG. 230, a portion 1330 that does not contribute to thermocompression bonding may be recessed. In such a case, the heater 1311 is arranged in a portion other than the portion. Accordingly, thermocompression bonding can be appropriately performed even if there is an object to which pressure or heat is not applied (see reference numeral 1332) in the liquid crystal panel P. <Another embodiment related to the inverter unit>
Regarding other embodiments related to the inverter unit,
This will be described with reference to FIGS. 231 and 232. Note that the same parts as those shown in FIG. 88 are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, four linear light sources 532 are provided as shown in FIG. 231, and each linear light source 532 is provided with a life detecting circuit 593 as shown in FIG. ,..., Lighting stop circuits 595,. The lighting circuits 591 are connected to a power supply 1350.

Here, the life detecting circuits 593,... Constantly reduce the voltage across the linear light sources 532,... By resistance division and rectify the voltage, and constantly monitor the lighting voltage of the linear light sources. When the lighting voltage exceeds a predetermined value, a life detecting signal is sent to the lighting stop circuits 595,. In addition, the lighting stop circuit 5
Are configured to stop the lighting of the linear light sources by controlling the lighting circuits 591, based on the life detection signals from the life detecting circuits 593, 593.

Next, the operation of the present embodiment will be described.

Now, as the linear light source 532 approaches the end of life, the lighting voltage of the tube gradually increases. When the lighting voltage exceeds a predetermined value, the life detecting circuit 593 sends a life detecting signal to the lighting stop circuit 595. The lighting stop circuit 595 controls the lighting circuit 591 based on the life detection signal to stop lighting of the linear light source.

According to this embodiment, it is possible to avoid a state in which the filament is broken at the end of the life of the linear light source and an abnormal heat generation at the end of the tube. Therefore, other components are not deformed by the heat generation.

Also, since each linear light source 532 is individually controlled by an independent lighting circuit 591, only the linear light source that has reached the end of its life is extinguished and the other normal linear light sources remain lit. . Therefore, all the linear light sources are not turned off, so that the screen of the liquid crystal panel P does not suddenly become black and the work becomes impossible.

In the above embodiment, the four linear light sources 532 are arranged as shown in FIG. 231. However, it is needless to say that the present invention is not limited to this.
As shown in FIG. 23, two light guide plates 531 may be arranged two on each side, and as shown in FIG. 234, a light guide plate 531 may be a direct type having four linear light sources.

In the above-described embodiment, the number of linear light sources is four. However, the number is not limited to this, and may be more, for example, six or eight.

Further, in the above embodiment, the life detecting circuit 593 monitors the lighting voltage of the tube. However, the present invention is not limited to this, and the temperature is detected by a temperature detecting element such as a thermistor. Such a configuration may be used. Then, it is possible to monitor the rise in the temperature of the tube end at the end of the life, and stop the lighting of the linear light source when the temperature becomes higher than a certain temperature. <Anisotropic conductive adhesive film> TA for liquid crystal drive
The anisotropic conductive adhesive film connecting the output terminal F of B and the electrode of the liquid crystal panel P is made of a thermosetting resin containing conductive particles dispersed therein. Here, thermosetting resin includes
A thermosetting epoxy adhesive, a thermosetting silicone resin, a thermosetting polyimide resin, or the like is used.

It is to be noted that the present invention is not limited to the film-like one, and an adhesive in a paste state may be used and applied by a printing method or the like.

Next, the effect of this embodiment will be described.

Since the above-mentioned liquid crystal panel P uses ferroelectric liquid crystal, as described by Okada et al. In US Pat. No. 4,639,089, a high-temperature side is required for generating a monodomain alignment state. Slow cooling from isotropic phase (5 ℃)
/ Hour) to produce a chiral smectic phase. At present, it is impossible to form a monodomain orientation state when the step of cooling to the chiral smectic phase or the step of raising the temperature to the isotropic phase is performed rapidly.

Therefore, when the liquid crystal panel P having the ferroelectric liquid crystal is electrically connected to the liquid crystal driving TAB 330, the liquid crystal panel P is partially or entirely connected by the above-described connection method using the thermocompression bonding step. Since the heated liquid crystal panel P is rapidly cooled after the release of the thermocompression bonding, the liquid crystal panel P is rapidly cooled. Therefore, when the liquid crystal panel P returns to the chiral smectic phase, the monodomain alignment state may not be generated. Such disorder of the alignment state can be restored to the original alignment state of the mono-domain again by performing a re-orientation process. However, as described below, a conventional thermoplastic resin is mainly used at the time of the re-alignment. When the anisotropic conductive adhesive described above is used, problems such as an increase in connection resistance have occurred.

However, in the present embodiment, such a problem is solved.

FIG. 235 is a graph for explaining the effect of the present embodiment. FIG.
(B) is a mounting structure outside the present invention,
That is, in a resin made of a conductive anisotropic adhesive (a styrene-butadiene copolymer (50 superposed parts) and a delbenphenol resin (50 superposed parts) using a thermoplastic resin; -90 (manufactured by Nippon Shokubai Kagaku Kogyo Co., Ltd.) Conductor particles 1 whose surface is coated with Au
(C) shows the connection resistance value during reorientation in the case where the zero superposed portion is dispersed and contained.
The connection resistance value during reorientation in the mounting structure of the above-described conductive structure in which the overlapping portion of the conductor 10 is dispersed and contained in the 0 overlapping portion is shown.

According to FIG. 235, room temperature T ₁ (about 23 ° C.)
To a reorientation treatment temperature T ₂ (80 ° C.) for a time t ₁
From about 2 to t _{2 in} about 2 hours and re-orientation treatment,
In the case of a mounting structure outside the present invention, the initial connection resistance value R ₁ (about 2
Ω) is cooled to R ₂ (approximately 10 Ω) in an atmosphere of 80 ° C. and then room temperature T ₁
(23 ° C.), R ₃ (about 3Ω) and the connection resistance increased. This is made of a thermoplastic resin, a glass substrate of the liquid crystal panel P, and a film carrier tape (base film portion 331).
In addition to the difference in the coefficient of linear expansion between them, the thermoplastic resin is softened by the reorientation temperature and the adhesive strength is weakened, so that the distance between the connection electrodes of the liquid crystal panel P and the connection electrodes of the film carrier tape is increased, It is thought that this occurs because the contact area and the number of contact particles of the conductive particles contributing to the electrical connection are reduced due to the floating.

In the case of the embodiment of the present invention, the initial resistance value R ₁
(About 2 Ω) increases the connection resistance to R ₂ (about 3 Ω) in a 50 ° C. atmosphere, but gradually cools it from time t ₁ to t _{2 in} about 2 hours, and R ₃ (at room temperature T ₁ (23 ° C.) About 2Ω), which is almost equal to the initial resistance value R ₁ . The reason why the connection resistance value slightly increases in an atmosphere at 80 ° C. and returns to the initial connection resistance value when gradually cooled to room temperature is considered to be due to expansion and contraction of the thermosetting resin.

As described above, according to the method of the present invention, the ferroelectric liquid crystal panel P in which the alignment state is disordered is subjected to a realignment treatment (in order to repair the disorder in the orientation of the ferroelectric liquid crystal caused by rapid cooling and rapid heating). Then, the ferroelectric liquid crystal is heated again to the isotropic phase, and then the alignment state of the monodomain is readjusted by slow cooling according to the above-mentioned prescription.) A disadvantage has been found that causes an increase in the connection resistance.

The output terminal 333 wired to the above-described base film 331 is connected to a liquid crystal driving IC 350. The liquid crystal driving IC 350 is connected to the output terminal 33.
3 and a bonding member, the periphery of which is protected by an adhesive.

As the liquid crystal having bistability which can be used in the present invention, a chiral smectic liquid crystal having ferroelectricity is most preferable. Among them, a chiral smectic C phase (SmC ^* ) or H phase (SmH ^* ) liquid crystal Is suitable. This ferroelectric liquid crystal is described in “Le Journal de Physic Letter”.
e Physic letter) 36 volumes (L-6
9) ", 1875," Ferroelectric Liquid Crystal "(FerroelectricLiq)
Uid Crystals ”);“ Applied Physics Letters ”(“ Applied Physics ”).
s Letters, Vol. 36 (No. 11), 1980, "Submicron Second Bistable Electrooptic Switching in Liquid Crystal" (SubmicroSecond Bist)
able Electricswitch
ng in Liquid Crystal ”), Solid State Physics 16 (141) 1981“ Liquid Crystal ”, US Patent No. 45
No. 61726, U.S. Pat. No. 4,589,996,
It is described in U.S. Pat. No. 4,592,858 and the like, and the ferroelectric liquid crystal disclosed therein can be used in the present invention.

More specifically, as an example of the ferroelectric liquid crystal compound used in the present invention, decyloxybenzylidene P'-amino-2-methylbutylcinnamate (DOB
AMBC), hexyloxybenzylidene-P'-amino-2-chloropropylcinnamate (HOBACP
C) and 4-o- (2-methyl) -butylresorcylidene-4′-octylaniline (MBRAS).

In the case where a panel is formed using these materials, in order to maintain a temperature state such that the liquid crystal compound becomes a SmC ^* phase or a SmH ^* phase, the panel is formed, if necessary, by a steel block or the like in which a heater is embedded. Can be supported.

In the present invention, the aforementioned SmC ^* , SmH ^*
Besides, ferroelectric liquid crystals represented by chiral smectic F phase, I phase, J phase, G phase and K phase can also be used.

FIG. 236 schematically illustrates an example of a ferroelectric liquid crystal cell. 262 and 280 are In ₃ O
₂ , a substrate (glass plate) coated with a transparent electrode such as SnO ₂ or ITO (indium-tein oxide), and an SmC ^* phase liquid crystal in which a liquid crystal molecular layer 1360 is oriented so as to be perpendicular to the glass surface. Is enclosed. A bold line 1361 represents a liquid crystal molecule, and the liquid crystal molecule 1361 has a dipole moment 1362 in a direction perpendicular to the molecule. Substrates 262 and 280
When a voltage equal to or higher than a certain threshold is applied between the upper electrodes, the helical structure of the liquid crystal molecule 1361 is released, and the dipole moment 1362 is directed to the direction of the electric field.
1 can be changed. Liquid crystal molecule 1361
Has an elongated shape and exhibits refractive index anisotropy in the major axis direction and the minor axis direction.Therefore, for example, if polarizers arranged in a crossed Nicols positional relationship with each other above and below the glass surface, voltage is applied. It is easily understood that the liquid crystal optical modulation element whose optical characteristics change depending on the polarity. Further, when the thickness of the liquid crystal cell is made sufficiently thin (for example, 1 μm),
As shown in FIG. 237, even when no electric field is applied, the helical structure of the liquid crystal molecules is released, and the dipole moment P
a or Pb is upward (1370a) or downward (137
0b). In such a cell, as shown in FIG.
When a or Eb is applied for a predetermined time, the dipole moment increases 137 with respect to the electric field vector of the electric field Ea or Eb.
The orientation is changed to 0a or downward 1370b, and accordingly, the liquid crystal molecules are aligned in one of the first stable state 1371a and the second stable state 1371b.

There are two advantages of using such a ferroelectric liquid crystal as the optical modulator / demodulator. First, the response speed is extremely fast, and second, the orientation of the liquid crystal molecules has a bistable state. The second point will be described with reference to, for example, FIG. 237. When an electric field Ea is applied, the liquid crystal molecules are oriented to a first stable state 1371a. This state is stable even when the electric field is turned off. Also, when an electric field Eb in the opposite direction is applied, the liquid crystal molecules are oriented to the second stable state 1371b and change the direction of the molecules, but remain in this state even after the electric field is cut off. As long as the applied electric field Ea does not exceed a certain threshold value, each orientation state is also maintained.
In order to effectively realize such a high response speed and bistability, it is preferable that the cell is as thin as possible, and generally, 0.5 μm to 20 μm, particularly 1 μm to 5 μm is suitable.

[0631]

As described above, according to the present invention,
The display unit and the power supply unit are arranged and integrated in the same housing, and further, a heat insulating plate is provided according to the heat generation state of the power supply unit, and the positional relationship between the heat insulating plate and the inverter unit or the controller unit is optimized. , The heat from the power supply unit is transmitted to the display unit,
The temperature rise of the display unit becomes uniform. In particular, in the case of a display unit using a ferroelectric liquid crystal, the response speed of the ferroelectric liquid crystal is increased due to the heat generated by the power supply unit, and good image quality can be maintained.

Also, according to the present invention, there is no need to provide a heater or the like for warming the display unit, the power consumption is reduced, the number of parts is reduced, the assemblability and maintenance are improved, and the number of parts is reduced. It is lighter by a small amount and is convenient for transportation and movement. In addition, the device itself becomes inexpensive.

Further, since the display unit, the backlight unit, the inverter unit, the controller unit, and the power supply unit are arranged in the same housing and are not integrated and separated from each other, the display device body can be easily moved. It is.

Further, the output electrodes and input electrodes of the printed circuit board are exposed by removing a part of the base film portion, so that the electrodes are cut even when the base film portion expands or contracts due to a temperature change. Never.

In the case where an alignment mark is formed on a printed circuit board or a transparent substrate, the connection between the printed circuit board and the transparent substrate becomes accurate by performing alignment using the mark.

Further, when the cell fixing plate and the cell frame are formed of a resin in which glass fibers are dispersed, the heat conductivity of the cell fixing plate and the cell frame is reduced, so that heat dissipation from the liquid crystal element is reduced. In addition, the temperature distribution of the liquid crystal element can be made uniform. As a result, the display quality of the liquid crystal element is made uniform.

Further, when an elastic member such as silicon resin is disposed between the liquid crystal element and the cell fixing plate, between the cell cover and the liquid crystal element, or between the cell frame and the cell fixing plate. In this case, the liquid crystal element is elastically supported, and the transmission of vibration and the like are reduced. Therefore, deterioration of display quality due to vibration is prevented. Further, when the closed space is formed by using these elastic members, the vibration is further attenuated by the air damper effect, and the deterioration of the display quality due to the vibration is more reliably prevented.

[0638] When the cell cover is plated with nickel, radiation noise is reduced.

Further, when a transparent member is attached to a predetermined position of the cell cover, the liquid crystal element is protected, and when the transparent member is subjected to a diffusion process, the reflection of light from an external light source is reduced and an image is displayed. Easy to recognize.

Further, when a light source is arranged around the light guide means in the backlight unit, the thickness of the display device can be reduced. In that case, if the reflection means is arranged so as to cover the light source, light from the light source is efficiently guided to the light guide means. Further, when the engaging projection is formed on the light source and the engaging hole is formed on the reflecting means, the light source and the reflecting means can be easily attached and detached. Further, when a brightness distribution adjusting means for adjusting the brightness distribution of the light emitted from the backlight unit is provided, the brightness distribution is made uniform and the display quality is improved.

According to the present invention, a display unit for displaying an image, a backlight unit for illuminating the display unit, an inverter unit for electrically controlling the backlight unit, and the inverter unit and the display unit A controller unit for electrically controlling;
A power supply unit that supplies power to the inverter unit and the controller unit and has a distribution of heat generation states, wherein the display unit is disposed on a front side of the backlight unit, and a back side of the backlight unit. The inverter unit and the controller unit are arranged in a display unit,
The power supply unit is arranged on a side surface of a backlight unit, an inverter unit, and a controller unit, and the display unit, the backlight unit, the inverter unit, the controller unit, and the power supply unit are provided in the same housing. A display device which is arranged and integrated, wherein the inverter unit and the controller unit are arranged side by side along the back surface of the backlight unit, and in the power supply unit, between the display unit and the power supply unit. A display device is provided, wherein a heat insulating means is provided at a position corresponding to an area of the power supply unit where heat generation is higher, and the inverter unit is disposed above an area of the power supply unit where heat generation is lower.

Further, according to the present invention, a display unit for displaying an image, a backlight unit for illuminating the display unit, an inverter unit for electrically controlling the backlight unit, the inverter unit and the display unit A power supply unit that supplies power to the inverter unit and the controller unit and has a distribution of heat generation states, wherein the display unit is disposed on the front side of the backlight unit. In addition, the inverter unit and the controller unit are disposed on the back side of the backlight unit, and the power supply unit is disposed on the side surface of the display unit, the backlight unit, the inverter unit, and the controller unit, and Previous A display unit, wherein the display unit, the backlight unit, the inverter unit, the controller unit, and the power supply unit are disposed and integrated in the same housing, and the inverter unit and the controller unit are A heat insulating means is arranged along the back surface of the backlight unit and provided at a position corresponding to an area of the power supply unit between the display unit and the power supply unit where heat generation is greater, and the inverter unit is A display device includes a display device main body and a supporting device that supports the display device main body and is disposed above an area where heat generation of the power supply unit is small.

[Brief description of the drawings]

FIG. 1 is a front view showing the overall configuration of a liquid crystal display device according to the present invention.

FIG. 2 is a front view showing the external structure of the display device main body.

FIG. 3 is a rear view showing the external structure of the display device main body.

FIG. 4 is a right side view showing the external structure of the display device main body.

FIG. 5 is a left side view showing the external structure of the display device main body.

FIG. 6 is a plan view showing the external structure of the display device main body.

FIG. 7 is a bottom view showing the external structure of the display device main body.

FIG. 8 is an exploded perspective view showing the internal structure of the display device main body.

FIG. 9 is a block diagram showing the internal configuration of the switch power supply unit.

FIG. 10 is a diagram for explaining the effect of the heat insulating plate;
(a) is a front view of the display device main body, (b) is a side view of the display device main body.

11A and 11B are views for explaining an attachment position of a heat insulating plate, wherein FIG. 11A is a front view of a display device main body, and FIG. 11B is a side view of the display device main body.

FIG. 12 is a sectional view showing the internal structure of the display device main body.

FIG. 13 is a front view showing the structure of the display unit.

FIG. 14 is a rear view showing the structure of the display unit.

FIG. 15 is a rear view showing the mounting structure of the display panel.

FIG. 16 is a partial sectional view showing the structure of a cell fixing plate.

FIG. 17 is a perspective view showing a mold used for manufacturing the cell fixing plate.

FIG. 18 is a cross-sectional view illustrating the internal structure of a liquid crystal panel.

FIG. 19 is a plan view illustrating the shape of a color filter.

FIG. 20 is a plan view for explaining shapes of metal electrodes and the like.

FIG. 21 is a plan view for explaining shapes of information electrodes and the like.

FIG. 22 is a diagram showing a positional relationship between an information electrode and a color filter.

FIG. 23 is a plan view showing the shapes of an upper substrate and a lower substrate.

FIG. 24 is a partially enlarged view showing the shapes of an upper substrate and a lower substrate.

FIG. 25 is a diagram for explaining the shape of the edge of the electrode and the shape of the alignment mark on the upper substrate.

FIG. 26 is a cross-sectional view for explaining a state of diffusion processing in a display panel or the like.

FIG. 27 is a cross-sectional view illustrating an example in which a non-glare film is attached.

FIG. 28 is a front view showing the structure of the display unit, particularly the arrangement position of the thermistor.

FIG. 29 is a sectional view showing a mounting structure of the thermistor.

FIG. 30 is an exploded perspective view showing the internal structure of the thermistor.

FIG. 31 is a plan view showing an arrangement position of a TAB for driving a liquid crystal.

FIG. 32 is a cross-sectional view showing a mounting structure of a scanning-side liquid crystal driving TAB.

FIG. 33 is a cross-sectional view showing a mounting structure of the information-side liquid crystal driving TAB.

FIG. 34 is a plan view showing the structure of a scanning-side liquid crystal driving TAB.

FIG. 35 is a plan view showing the structure of an information-side liquid crystal driving TAB.

FIG. 36 is a side view showing the structure of a scanning-side liquid crystal driving TAB.

FIG. 37 is a side view showing the structure of the information-side liquid crystal driving TAB.

FIG. 38 is a block diagram illustrating an internal configuration of a scanning IC.

FIG. 39 is a block diagram for explaining a connection state between a scanning-side IC and a driver board.

FIG. 40 is a block diagram for explaining the internal configuration of the information IC.

FIG. 41 is a block diagram for explaining a connection state between the information side IC and the driver board.

FIG. 42 is a side view showing the structure of a scanning-side liquid crystal driving TAB.

FIG. 43 is a side view showing the structure of the information-side liquid crystal driving TAB.

FIG. 44 is a diagram showing the shapes of output terminals and alignment marks in a liquid crystal driving TAB.

FIG. 45 is a view for explaining the shape of the alignment mark on the scanning liquid crystal driving TAB side.

FIG. 46 is a view for explaining the shape of an alignment mark on the information-side liquid crystal driving TAB side.

FIG. 47 is a diagram illustrating a connection state between a liquid crystal driving TAB and a liquid crystal panel.

FIG. 48 is a view for explaining a state of alignment between the liquid crystal driving TAB and the liquid crystal panel.

FIG. 49 is a view for explaining the operation during alignment.

FIG. 50 is a view for explaining a state of completion of alignment.

FIG. 51 is a diagram showing a configuration of a thermocompression bonding apparatus (liquid crystal panel side).

FIG. 52 is a cross-sectional view for explaining a connection state between the liquid crystal driving TAB and the liquid crystal panel.

FIG. 53 is a cross-sectional view for explaining a connection state between the liquid crystal driving TAB and the liquid crystal panel.

FIG. 54 is a cross-sectional view for explaining a connection state between the liquid crystal drive TAB and the driver board.

FIG. 55 is a view for explaining an arrangement state of a liquid crystal drive TAB.

FIG. 56 is an exploded view for explaining the structure of the driver board.

FIG. 57 is a view for explaining a connection state between a liquid crystal panel, a liquid crystal driving TAB, and a driver board.

FIG. 58 is a view for explaining a state before crimping by the thermocompression bonding apparatus.

FIG. 59 is a diagram showing a configuration of a thermocompression bonding apparatus (driver board side).

FIG. 60 is a view for explaining the structure of the display unit, in particular, the arrangement of the holding plate.

FIG. 61 is an exploded perspective view for explaining the shape and the like of a holding plate.

FIG. 62 is a sectional view taken along line AA of FIG. 60;

FIG. 63 is a sectional view taken along line BB of FIG. 60;

FIG. 64 is a schematic view for explaining a wiring state of a flat cable.

FIG. 65 is a waveform chart showing waveforms of an information signal and a scanning signal.

FIG. 66 is a block diagram for explaining a wiring state;

FIG. 67 is a sectional view showing the structure of a flat cable and a connector.

FIG. 68 is a bottom view showing the structure of the display unit, particularly the attachment position of the flat cable and the like.

FIG. 69 is a plan view showing the structure of the display unit, in particular, the mounting position of the flat cable and the like.

FIG. 70 is a cross-sectional view illustrating a structure of a backlight unit.

FIG. 71 is a perspective view illustrating the arrangement positions of a linear light source and a light guide plate.

FIG. 72 is a partially exploded perspective view showing the configuration of the backlight unit.

FIG. 73 is a partial cross-sectional view showing the structure of a backlight unit.

FIG. 74 is a partial cross-sectional view illustrating a configuration of a backlight unit.

FIG. 75 is a plan view for explaining the shape of the backlight upper plate.

FIG. 76 is a view for explaining a reflection pattern density distribution;

FIG. 77 is a view for explaining a reflection pattern density distribution;

FIG. 78 is a view for explaining a conventional reflection pattern density distribution.

FIG. 79 is a view for explaining a conventional reflection pattern density distribution.

FIG. 80 is a view for explaining a conventional reflection pattern density distribution.

FIG. 81 is a view for explaining a conventional problem relating to a backlight unit.

FIG. 82 is a view for explaining a conventional problem relating to a backlight unit.

FIG. 83 is a view illustrating a luminance distribution of a backlight unit.

FIG. 84 is a view for explaining another example of the reflection pattern density distribution;

FIG. 85 is a rear view showing a mounting structure of the controller unit and the like.

FIG. 86 is a side view showing a mounting structure of the controller unit and the like.

FIG. 87 is a block diagram illustrating the structure of an inverter unit.

FIG. 88 is a block diagram illustrating the structure of an inverter unit.

FIG. 89 is a view for explaining luminance distribution characteristics of a backlight unit.

FIG. 90 is a view for explaining a method of measuring the luminance distribution of the backlight unit.

FIG. 91 is a block diagram showing a configuration of a controller unit.

FIG. 92 is a diagram showing a back surface structure of a display panel.

FIG. 93 is a view showing the entire structure of the liquid crystal display device, wherein (a) is a front view thereof, (b) is a plan view thereof,
(C) is a side view thereof.

FIG. 94 is a perspective view illustrating a case where the display device main body is disengaged from the tilt member of the support device.

FIG. 95 is a perspective view illustrating a case where the display device body is mounted on the tilt member.

FIG. 96 is a side view showing a state where the support device stands alone.

FIG. 97 is an exploded perspective view showing the above supporting device.

FIG. 98 is a front view showing the support device of the above.

FIG. 99 is a side view showing the support device of the above.

FIG. 100 is a plan view showing the support device of the above.

101A and 101B show the size of the width between the display device main body and the support device, FIG. 101A is a plan view thereof, and FIG.

FIGS. 102A and 102B show the positional relationship between the support device and the display device main body, wherein FIG. 102A is a plan view thereof and FIG.

103A and 103B show a part of a tilt mechanism, FIG. 103A is a plan view thereof, and FIG. 103B is a sectional view taken along line bb of FIG. 103A.

104 is an operation explanatory diagram at the time of an upward operation by applying an operation force to the action point in FIG. 114;

105 is an explanatory diagram of an operation when an operation force is applied to the action point in FIG. 115 and an upward operation is performed.

106 is an explanatory diagram of an operation at the time of an upward operation by applying an operation force to the action point in FIG. 117.

107 is an explanatory diagram of an operation at the time of an upward operation by applying an operation force to the action point in FIG. 118.

108 is an operation explanatory diagram illustrating generation of an operating force, a torque generated in a shaft member, a moment based on its own weight, and the like in FIG. 114.

109 is an operation explanatory diagram illustrating generation of an operating force, a torque generated in a shaft member, a moment based on its own weight, and the like in FIG. 115.

110 is an operation explanatory diagram illustrating generation of an operating force, a torque generated in a shaft member, a moment based on its own weight, and the like in FIG. 117.

111 is an operation explanatory diagram illustrating generation of an operating force, a torque generated in a shaft member, a moment based on its own weight, and the like in FIG. 118;

112A and 112B show a state in which the display device body is operated in the vertical direction, where FIG. 112A is a side view illustrating an upward tiltable range, FIG. 112B is a side view illustrating a downward tiltable range, (c) is a plan view when the display device main body is at the home position.

113 is a view showing a tiltable range of a cross section taken along line AA of FIG. 112 (c).

FIG. 114 is a diagram illustrating an action point at an upper end of the display device main body mounted on the support device.

FIG. 115 is a diagram illustrating an operation point of a lower end of the display device main body mounted on the support device.

FIG. 116 is a diagram showing the basis of the setting range of the operation force.

FIG. 117 is a diagram showing an action point at the upper end of the display device main body mounted on the support device.

FIG. 118 is a diagram illustrating an operation point of a lower end of the display device main body mounted on the support device.

FIG. 119 is a sectional view taken along line AA of FIG. 122;

120 is a sectional view taken along line BB of FIG. 122.

FIG. 121 is a sectional view taken along line CC of FIG. 122.

FIG. 122 is a plan view showing a support portion retaining plate.

FIG. 123 is a perspective view of the display device as viewed from the back.

FIG. 124 is a bottom view showing the stand base of the support base.

125 is a sectional view taken along line DD of FIG. 124.

FIG. 126 is an explanatory diagram defining a width B of a support base.

FIG. 127 is a block diagram for measuring an electromagnetic field intensity.

FIG. 128 is a distribution diagram showing measured values of the electromagnetic field strength of a vertically polarized wave when no resonance countermeasures are taken against the radiated disturbance.

FIG. 129 is a distribution diagram illustrating measured values of the electromagnetic field strength of a vertically polarized wave when a countermeasure against resonance is applied to a radiated interference wave.

FIG. 130 is an explanatory view showing a state in which the support portion retaining plate is rotated clockwise with respect to the stand base.

FIG. 131 is an explanatory view showing a state in which the support portion retaining plate is rotated counterclockwise with respect to the stand base.

FIG. 132 is an explanatory diagram for defining a depth D of the support base.

FIG. 133 is an explanatory diagram showing the diameter of the turntable and the depth of the support table.

FIG. 134 is a cross-sectional view for explaining how the backlight unit is replaced.

FIG. 135 is a cross-sectional view for explaining a state in which a ventilation hole is provided in the rear cover.

FIG. 136 is a view for explaining a conventional problem in the liquid crystal driving TAB.

FIG. 137 is a view for explaining a conventional problem in a liquid crystal driving TAB.

FIG. 138 is a view for explaining a conventional problem in a liquid crystal driving TAB.

FIG. 139 is a view for explaining an attachment structure between the liquid crystal drive TAB and the driver board.

FIG. 140 is a sectional view showing another example of the thermistor mounting structure.

FIG. 141 is a cross-sectional view showing still another example of the thermistor mounting structure.

FIG. 142 is a sectional view showing another example of the arrangement of the diffusion plate.

FIG. 143 is a view for explaining another example of the alignment mark (the liquid crystal panel side).

FIG. 144 is a view for explaining another example of the alignment mark (the TAB side for driving the liquid crystal).

FIG. 145 is a view for explaining a state of completion of alignment.

FIG. 146 is a view for explaining an operation at the time of alignment.

FIG. 147 is a cross-sectional view for explaining another embodiment of the holding plate.

FIG. 148 is a cross-sectional view for explaining another embodiment of the support structure of the display panel;

FIG. 149 is a cross-sectional view illustrating another embodiment of the backlight unit.

FIG. 150 is a view for explaining a reflection pattern density;

FIG. 151 is a view for explaining a reflection pattern density;

FIG. 152 shows waveforms of information signals and scanning signals (other examples)
FIG.

FIG. 153 is a view for explaining another example of wiring.

FIG. 154 is a view for explaining another example of wiring.

FIG. 155 is a waveform chart for explaining waveforms of an information signal and a scanning signal.

FIG. 156 is a waveform of an information signal and a scanning signal (another example).
FIG.

FIG. 157 is a block diagram showing a wiring state.

FIG. 158 is a view for explaining another example of wiring.

FIG. 159 is a view for explaining another example of wiring.

FIG. 160 is a view for explaining another example of wiring.

FIG. 161 is a view for explaining another example of wiring.

FIG. 162 is a diagram for explaining an arrangement of a driver board;

FIG. 163 is a cross-sectional view for explaining a driver board support structure;

FIG. 164 is a cross-sectional view for explaining a driver board support structure.

FIG. 165 is a view for explaining how the driver board moves.

FIG. 166 is a view for explaining how the driver board moves.

FIG. 167 is a cross-sectional view illustrating a driver board support structure (another example).

FIG. 168 is a cross-sectional view illustrating a driver board support structure (another example).

FIG. 169 is a view for explaining another embodiment relating to a flat cable;

FIG. 170 is an exemplary view for explaining another embodiment relating to a flat cable;

FIG. 171 is a view for explaining another embodiment relating to a flat cable;

FIG. 172 is a view for explaining another embodiment relating to a flat cable;

FIG. 173 is a view for explaining another embodiment relating to the connector;

FIG. 174 is a view for explaining another embodiment relating to the connector;

FIG. 175 is a diagram illustrating another embodiment of the connector.

FIG. 176 is a diagram illustrating another embodiment of the connector.

FIG. 177 is a diagram illustrating another embodiment of the connector.

FIG. 178 is a diagram illustrating another embodiment of the connector;

FIG. 179 is a view for explaining another embodiment relating to a flat cable;

FIG. 180 is an exemplary view for explaining another embodiment of the connector;

FIG. 181 is a view for explaining another embodiment of the connector;

FIG. 182 is a view for explaining another embodiment relating to the connector;

FIG. 183 is a view for explaining another embodiment of the connector;

FIG. 184 is a view for explaining another embodiment of the connector;

FIG. 185 is a view for explaining another embodiment relating to a flat cable;

FIG. 186 is a diagram for describing another embodiment regarding the flat cable.

FIG. 187 is a view for explaining the arrangement of flat cables and connectors.

FIG. 188 is a view for explaining the arrangement of flat cables and connectors.

FIG. 189 is a perspective view for explaining a connector mounting structure.

FIG 190 is a diagram illustrating another embodiment of a backlight unit.

FIG. 191 is a diagram illustrating another embodiment of a backlight unit.

FIG. 192 is a cross-sectional view illustrating a grounding structure.

FIG. 193 is a diagram illustrating another embodiment of a backlight unit.

FIG. 194 is a diagram illustrating another embodiment of a backlight unit.

FIG. 195 is a diagram illustrating another embodiment of a backlight unit.

FIG. 196 is a diagram illustrating another embodiment of a backlight unit.

FIG. 197 is a diagram illustrating a positional relationship between a backlight unit and an inverter unit.

FIG. 198 is a diagram illustrating a wiring state between a backlight unit and an inverter unit;

FIG. 199 is a diagram illustrating an effect of this embodiment;

FIG. 200 illustrates an effect of this embodiment.

FIG. 201 is a diagram illustrating a wiring state (another example) between a backlight unit and an inverter unit.

FIG. 202 is a block diagram illustrating a structure of a lighting device applied to another embodiment.

FIG. 203 is a block diagram showing the overall configuration of a start-up lighting control unit.

FIG. 204 is a block diagram showing a detailed configuration of a start-up lighting control unit.

FIG. 205 is a waveform chart for explaining voltage changes at the V10 terminal and the 02 terminal in the starting lighting control unit.

206A is a diagram illustrating a temporal change of a lighting current flowing to a linear light source in a normal case (a case where a lighting switch that has been turned on is not turned off and is kept on as it is). FIG. FIG. 4B is a diagram showing a temporal change of a lighting voltage (effective value) applied to both ends of the linear light source in that case.

FIG. 207 is a diagram for explaining a conventional problem.
(a) Turns off the switch during the first preheating period and turns it on again.
FIG. 7B is a diagram illustrating a temporal change of a lighting current after the second switch ON when N is set, and FIG. 7B is a diagram illustrating a temporal change of a lighting voltage.

FIG. 208 is a view for explaining a conventional problem.

FIG. 209 is a block diagram for explaining another example of the preheating period generation unit.

FIG. 210 is a block diagram for explaining another example of the preheating period generating section.

FIG. 211 is a block diagram illustrating another example of a lighting device power control unit.

FIG. 212 is a cross-sectional view illustrating another embodiment of the diffusion plate.

FIG. 213 is a cross-sectional view illustrating a display unit including a vibration damper.

FIG. 214 is a view for explaining effects of the vibration damping plate.

FIG. 215 is a cross-sectional view illustrating a display unit (another example) including a damping plate.

FIG. 216 is a cross-sectional view illustrating a display unit (another example) including a damping plate.

FIG. 217 is a cross-sectional view illustrating a display unit (another example) including a damping plate.

FIG. 218 is a cross-sectional view illustrating a display unit (another example) including a damping plate.

FIG. 219 is a view for explaining a conventional problem in an anisotropic conductive film.

FIG. 220 is a view for explaining an example of bonding TAB for driving a liquid crystal;

FIG. 221 is a view for explaining another embodiment relating to the bonding of the TAB for driving a liquid crystal;

FIG. 222 is a sectional view taken along the line XX ′ of FIG. 179;

FIG. 223 is a view for explaining another embodiment relating to the bonding of the liquid crystal driving TAB.

FIG. 224 is a diagram for describing another embodiment relating to bonding of a liquid crystal driving TAB.

FIG. 225 is a view for explaining another embodiment relating to bonding of a TAB for driving a liquid crystal;

FIG. 226 is a diagram for describing another embodiment relating to bonding of a liquid crystal driving TAB.

FIG. 227 is a view for explaining a conventional thermocompression bonding apparatus and its problems.

FIG. 228 is a diagram illustrating an embodiment of a thermocompression bonding apparatus.

FIG. 229 is a diagram illustrating another embodiment of the thermocompression bonding apparatus.

FIG. 230 is a diagram illustrating another embodiment of the thermocompression bonding apparatus.

FIG. 231 is a perspective view showing the overall configuration of a backlight unit.

FIG. 232 is a diagram illustrating another embodiment of the inverter unit.

FIG. 233 is a perspective view showing another arrangement example of the linear light source.

FIG. 234 is a perspective view showing another arrangement example of the linear light source.

235A is a diagram for explaining a change in reorientation processing temperature, FIG. 235B is a diagram for explaining a change in connection resistance (conventional example), and FIG. FIG. 4 is a diagram for describing Embodiment).

FIG. 236 is a schematic diagram illustrating a configuration of a ferroelectric liquid crystal element in a state where a voltage is applied.

FIG. 237 is a schematic view showing the configuration of a ferroelectric liquid crystal element in a state where no voltage is applied.

FIG. 238 is a cross-sectional view illustrating a structure of a conventional liquid crystal display device.

FIG. 239 is a cross-sectional view illustrating a structure of a liquid crystal panel.

FIG. 240 is a plan view illustrating the structure of a general liquid crystal display device.

FIG. 241 is a diagram for explaining temperature dependency of one scanning line writing frequency;

FIG. 242 is a view showing the structure of an electromagnetic shield plate provided on the inner surface of a rear cover (housing).

[Explanation of symbols]

Reference Signs List 1 liquid crystal display device (display device) 201 front cover (housing) 201a opening 202 rear cover (housing) 215 interface cable connection portion 230 display unit 223 switch power supply unit (power supply unit) 231 cell frame 232 cell elastic holding member (Silicon resin) 233 Cell fixing plate 236 Elastic member (silicone resin) 239 Diffusion plate 241 Sponge member (elastic member) 242 Display plate (transparent member) 243 Elastic member 262 Upper substrate (transparent substrate) 269 Scan electrode 280 Lower substrate (Transparent substrate) 281, ... Information electrode 293 Ferroelectric liquid crystal 301, ... Substrate side visual mark (second alignment mark, fourth alignment mark) 303, ... Substrate side automatic mark (Second alignment mark) , Fourth alignment mark) 320,... Lum 321, 322 Polarizing plate 330,... TAB (printed circuit board) for driving liquid crystal 330 A,..., Scanning side TAB (scanning side printed circuit board) 330 B,. (Input electrode) 333 ... output terminal (output electrode) 350A scanning side drive IC 350B information side drive IC 370, ... TAB side visual mark (first alignment mark, third alignment mark) 371, ... TAB side Automatic mark (first alignment mark, third alignment mark) 400, ... Driver board 400L Common driver board (scanning driver board) 400U, 400D Upper and lower driver board (information side driver board) 401a, ... Connection electrode 411 Solder 430, ... Pressing plate 451 Hula Cable 452 flat cable 453 flat cable 454 flat cable 455 flat cable 456 flat cable 490, ... connector (first connector, second connector) 530 backlight unit 531 light guide plate (light guide means) 532, ... linear light source 533, reflection means 533a, engagement hole 535 diffuse reflection pattern portion (brightness distribution adjustment means) 536 rear reflection plate (diffuse reflection means) 537 prism sheet 539 grommet 539 engagement projection 550 backlight upper plate 551 backlight lower plate 570 Inverter unit 572 Controller unit 2400 Radiation noise prevention plate P Liquid crystal panel (liquid crystal element)

──────────────────────────────────────────────────続 き Continued on the front page (72) Katsumi Kurematsu, Inventor 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Yoshihiro Onitsuka 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon (72) Inventor Masanori Takahashi 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Hiroshi Takabayashi 3-30-2, Shimomaruko 3-chome, Ota-ku, Tokyo Inside Canon Inc. ( 72) Inventor Makoto Uehara 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Yoji Takai 3-30-2 Shimomaruko 3-chome, Ota-ku, Tokyo Canon Inc. (72) Invention Person Osamu Yuki 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Yasushi Maeda 3-30-2 Shimomaruko, Ota-ku, Tokyo Kya (56) References JP-A-6-102489 (JP, A) JP-A-5-34693 (JP, A) JP-A-5-93899 (JP, A) JP-A-7-56169 (JP) , A) Japanese Utility Model 4-59878 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G02F 1/1333 G02F 1/13357 G02F 1/1345 G02F 1/141 G09F 9/00 304

Claims (62)

(57) [Claims] A display unit for displaying an image; a backlight unit for illuminating the display unit; an inverter unit for electrically controlling the backlight unit; and electrically controlling the inverter unit and the display unit. A power supply unit that supplies power to the inverter unit and the controller unit and has a distribution of heat generation states. The display unit is disposed on the front side of the backlight unit, and The inverter unit and the controller unit are arranged on the back side of the light unit, the power supply unit is arranged on the side surface of the display unit, the backlight unit, the inverter unit, and the controller unit, and the display unit A display device in which the backlight unit, the inverter unit, the controller unit, and the power supply unit are arranged and integrated in the same housing, wherein the inverter unit and the controller unit are disposed on a back surface of the backlight unit. A heat insulating means is provided between the power supply unit and the display unit at a position corresponding to a region where the heat generation of the power supply unit is larger, and the inverter unit generates heat of the power supply unit. A display device, wherein the display device is arranged above an area having a small size. 2. The power supply unit, wherein the display unit, the backlight unit, the inverter unit, and the controller unit are arranged above the power supply unit, and the inverter unit is located above an area where heat generation of the power supply unit is small. 2. The display device according to claim 1, wherein the controller unit is located above a region where the heat generation of the power supply unit is large via the heat insulating member. 3. 3. The display device according to claim 1, wherein the housing includes a front housing and a rear housing detachably supported on the front housing, and at least a front surface of the display unit is the front part. 2. The display device according to claim 1, wherein at least a back surface side of the inverter unit, the controller unit, and the power supply unit is covered by the rear housing, while being covered by a housing. 3. 4. The liquid crystal display device according to claim 1, wherein the display unit includes a liquid crystal element, a plurality of printed boards disposed around the liquid crystal element and electrically connected to the liquid crystal element, and the plurality of printed boards and the controller unit. A driver board for electrical connection, a cell fixing plate for supporting the liquid crystal element and the driver board, and a cell frame for supporting the cell fixing plate, and wherein the controller unit includes the driver board and The display device according to claim 1, wherein a signal is sent to the liquid crystal element via the printed circuit board to drive the liquid crystal element. 5. A liquid crystal device comprising: a pair of transparent substrates disposed so as to be parallel to each other; a scanning electrode and an information electrode respectively formed on surfaces of the pair of transparent substrates; The display device according to claim 4, comprising: a liquid crystal; 6. The display device according to claim 5, wherein the liquid crystal is a ferroelectric liquid crystal. 7. The printed circuit board receives a signal from the controller unit and supplies a scan signal to the scan electrode, and receives a signal from the controller unit to transmit an information signal to the information signal. The display device according to claim 5, comprising: an information-side printed circuit board to be supplied. 8. The scanning-side printed circuit board includes a base film portion made of polyimide, an output electrode and an input electrode made of copper formed on the base film portion, and electrically connected to the output electrode and the input electrode. 8. The display device according to claim 7, comprising: a scanning-side drive IC. 9. The information-side printed circuit board includes a base film portion made of polyimide, an output electrode and an input electrode made of copper formed on the base film portion, and electrically connected to the output electrode and the input electrode. 8. The display device according to claim 7, comprising: an information-side drive IC. 10. An output electrode of the scanning-side printed circuit board is connected to a scanning electrode of the liquid crystal element via an anisotropic conductive adhesive film, and the anisotropic conductive adhesive film is formed of metal particles or metal plating. 9. The display device according to claim 8, comprising a thermosetting resin containing a large number of resin particles subjected to the following. 11. An output electrode of the information-side printed circuit board is connected to an information electrode of the liquid crystal element via an anisotropic conductive adhesive film, and the anisotropic conductive adhesive film is formed of metal particles or metal plating. The display device according to claim 9, wherein the display device is made of a thermosetting resin containing a large number of resin particles subjected to the following. 12. The output electrode of the scanning-side printed circuit board has an exposed electrode part whose base film part is partially removed and partially exposed, and the exposed electrode part is a tip of the output electrode. The display device according to claim 8, wherein a base film portion is formed in an intermediate region other than the portion, and a base film portion remains at a tip portion of the output electrode. 13. The output electrode of the information-side printed circuit board has an exposed electrode part partially exposed by removing a base film part, and the exposed electrode part is a tip of the output electrode. 10. The display device according to claim 9, wherein a base film portion is formed in an intermediate region other than the portion, and a base film portion remains at a tip portion of the output electrode. 14. The scan-side printed circuit board has a first alignment mark near an output electrode, and the transparent substrate on which the scan electrode is formed has a second alignment mark near the scan electrode. The display device according to claim 8, wherein the output electrode and the scan electrode are aligned and connected via these alignment marks. 15. The information-side printed circuit board has a third alignment mark near an output electrode, and the transparent substrate on which the information electrode is formed has a fourth alignment mark near the information electrode. The display device according to claim 9, wherein the output electrode and the information electrode are aligned and connected via these alignment marks. 16. The scanning driver board which is interposed between the controller unit and the scanning printed circuit board and supplies a scanning signal to the scanning electrodes, the driver unit, the controller unit and the information side printing board. The display device according to claim 7, further comprising: an information-side driver board interposed between the substrate and the information electrode to supply an information signal to the information electrode. 17. The scanning driver board according to claim 16, wherein a substrate made of epoxy resin containing glass fiber and a wiring layer made of copper are alternately laminated. The display device according to the above. 18. The information-side driver board is formed by alternately laminating a substrate made of an epoxy resin containing glass fiber and a wiring layer made of copper. The display device according to the above. 19. The display device according to claim 16, wherein the scanning-side driver board has connection electrodes, and the input electrodes of the scanning-side printed circuit board are connected to the connection electrodes by soldering. 20. The display device according to claim 16, wherein the information-side driver board has connection electrodes, and the input electrodes of the information-side printed circuit board are connected to the connection electrodes by soldering. 21. The input electrode of the scanning-side printed circuit board has an exposed electrode part partially exposed by removing a base film part, and the exposed electrode part is a tip of the input electrode. 9. The display device according to claim 8, wherein a base film portion is formed in an intermediate region other than the portion, and a base film portion remains at a tip portion of the input electrode. 22. The input electrode of the information-side printed circuit board has an exposed electrode portion partially exposed by removing a base film portion, and the exposed electrode portion is a tip of the input electrode. The display device according to claim 9, wherein a base film portion is formed in an intermediate region other than the portion and a tip portion of the input electrode remains. 23. A reference potential for driving the scanning-side drive IC and the information-side drive IC is shared by the scanning-side driver board and the information-side driver board. The display device according to claim 16. 24. The display device according to claim 23, wherein the scanning driver board and the information driver board are connected by a flat cable to share the reference potential. 25. The display device according to claim 4, wherein the cell fixing plate is made of a resin in which glass fibers are dispersed. 26. The display device according to claim 25, wherein the resin is made of polycarbonate. 27. The display device according to claim 4, wherein the cell frame is made of a resin in which glass fibers are dispersed. 28. The display device according to claim 27, wherein the resin is made of polycarbonate. 29. A liquid crystal device, wherein a silicon resin is disposed in an end region of the liquid crystal element, and the liquid crystal element is elastically supported by the cell fixing plate via the silicon resin. The display device according to claim 4. 30. The cell frame is formed in a frame shape and is arranged so as to surround the cell fixing plate, and the cell fixing plate is elastically formed by the cell frame via a silicone resin. The display device according to claim 4, wherein the display device is supported. 31. The display device according to claim 4, wherein a holding plate is arranged on the cell fixing plate, and the driver board is supported by the cell fixing plate via the holding plate. . 32. A cell cover is disposed inside the housing, the cell fixing plate is supported by the housing via the cell cover, and the cell cover is formed of a resin in which glass fibers are dispersed. The display device according to claim 4, wherein: 33. The display device according to claim 32, wherein the resin is made of polycarbonate. 34. The display device according to claim 31, wherein the cell cover is plated with nickel. 35. A diffuser plate is attached to the cell fixing plate, disposed between the backlight unit and the liquid crystal element, and the light from the backlight unit is diffused by the diffuser plate. The display device according to claim 4, wherein: 36. The cell cover is disposed between the housing and the liquid crystal element, and has an opening in a portion where the liquid crystal element is arranged, and closes the opening. 33. The display device according to claim 32, wherein a transparent member is attached to the cell cover, and the transparent member is subjected to a diffusion process. 37. An apparatus according to claim 32, further comprising: an elastic member disposed between said cell cover and said liquid crystal element to form a substantially closed space together with said cell cover and said liquid crystal element. Display device. 38. The liquid crystal device and the driver board are elastically supported in a space surrounded by the cell fixing plate, the cell frame, and the cell cover. The display device according to the above. 39. The display device according to claim 4, wherein polarizing plates are respectively arranged on both surfaces of the liquid crystal element. 40. A polarizing plate is disposed on each of both surfaces of the liquid crystal element, and among the polarizing plates, a polarizing plate disposed on the side of the transparent member is subjected to a diffusion process. The display device according to claim 36. 41. The backlight unit, comprising: a light source; a light guide unit through which light from the light source is transmitted; and a light guide unit disposed between the backlight unit and the display unit with the light guide unit interposed therebetween. Diffuse reflection means for diffusing and reflecting light,
And a prism sheet arranged to face the diffuse reflection unit with the light guide unit interposed therebetween and to guide light transmitted through the light guide unit toward the display unit. The display device according to 1. 42. The display device according to claim 41, wherein the light source is disposed around the light guide. 43. The light source comprises four linear light sources, and these four linear light sources are arranged so as to surround four sides of the light guide means. The display device according to claim 42. 44. The display according to claim 43, wherein the backlight unit is provided so as to cover the light source, and further includes a reflection unit that guides light from the light source to the light guide unit. apparatus. 45. The light source has an engaging projection, and the reflecting means has an engaging hole with which the engaging projection is detachably engaged. The display device according to claim 44, wherein the light source and the reflecting means are integrated by the engagement of the light source. 46. A backlight distribution unit, comprising: a luminance distribution adjusting unit disposed between the diffuse reflection unit and the light guide unit to adjust a luminance distribution of light emitted from the backlight unit. The display device according to claim 41, wherein: 47. The display device according to claim 46, wherein said light guiding means is a transparent plate, and said brightness distribution adjusting means is formed on a surface of said light guiding means. 48. The backlight unit has a backlight upper plate and a backlight lower plate, and the light source, the light guide means, the diffuse reflection means, and the prism sheet are provided on the backlight. 42. The display device according to claim 41, wherein the display device is sandwiched between a plate and a backlight lower plate. 49. An elastic member is arranged between the upper panel of the backlight and the display unit along a periphery of the display unit, and the elastic member is substantially sealed with the display unit and the backlight unit. The display device according to claim 48, wherein a space is formed. 50. The display device according to claim 48, wherein said inverter unit and said controller unit are supported by said backlight lower plate. 51. A first connector attached to the display unit, a second connector attached to the controller unit, and a flat cable made of a flexible printed circuit board disposed between the connectors. The display device according to claim 1, wherein the display unit and the controller unit are electrically connected by the connector and the flat cable. 52. The flat cable comprises a base film, signal wiring formed on one surface of the base film, and reference potential wiring formed on the other surface of the base film. The display device according to claim 51, wherein: 53. The first and second connectors each have a plurality of contacts, and the plurality of contacts are in contact with either the signal wiring or the reference potential wiring of the flat cable. The display device according to claim 51, wherein: 54. In a portion other than a portion where the flat cable and the connector are connected, a signal wiring of the flat cable is covered with the reference potential wiring via an insulating layer. 52. The display device according to 52. 55. The display device according to claim 51, wherein the first connector is attached to the driver board of the display unit. 56. An apparatus according to claim 56, further comprising: an interface cable connecting portion connected to said controller unit, wherein said controller unit is connected to a host computer via said interface cable connecting portion. The display device according to 1. 57. The display device according to claim 1, wherein a heat radiation hole is provided at a predetermined position of the housing. 58. The display device according to claim 4, wherein the liquid crystal element includes a thermistor for detecting a temperature of the liquid crystal. 59. The liquid crystal element is a quadrilateral panel, and a plurality of printed boards are arranged only on one side on a side surface on which a power supply unit is arranged and on three sides including its opposite side. 59. The display device according to claim 58, wherein the thermistor is provided in a power supply unit from a middle point of one side that is not set. 60. The display device according to claim 59, wherein the one side on which the printed circuit board is not disposed is located near the heat insulating member of the power supply unit. 61. A display unit for displaying an image, a backlight unit for illuminating the display unit, an inverter unit for electrically controlling the backlight unit, and electrically controlling the inverter unit and the display unit. A power supply unit that supplies power to the inverter unit and the controller unit, and has a distribution of heat generation states. The display unit is disposed on a surface side of the backlight unit, and The inverter unit and the controller unit are arranged on the back side of the light unit; the power supply unit is arranged on the side surface of the display unit, the backlight unit, the inverter unit, and the controller unit; A display device body in which the backlight unit, the inverter unit, the controller unit, and the power supply unit are arranged and integrated in the same housing, wherein the inverter unit and the controller unit are the backlight; A heat insulating means provided between the power supply unit and the display unit at a position corresponding to a region where the heat generation of the power supply unit is larger, the heat insulating means being provided between the power supply unit and the display unit; A display device comprising: a display device main body disposed above an area where heat generation is small; and a support device that supports the display device main body. 62. The display device according to claim 62, wherein the support device has an adjustment mechanism for adjusting an angle of the display device main body in the vertical and horizontal directions, and the display device main body is supported at a desired angle by the support device. 62. The display device according to claim 61, wherein: