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JP3170508U - Thermal insulator for reflow furnace - Google Patents

Thermal insulator for reflow furnace Download PDF

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Publication number
JP3170508U
JP3170508U JP2011003193U JP2011003193U JP3170508U JP 3170508 U JP3170508 U JP 3170508U JP 2011003193 U JP2011003193 U JP 2011003193U JP 2011003193 U JP2011003193 U JP 2011003193U JP 3170508 U JP3170508 U JP 3170508U
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Prior art keywords
furnace
heat
furnace body
reflow furnace
reflow
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Expired - Fee Related
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JP2011003193U
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Japanese (ja)
Inventor
勝美 釣賀
勝美 釣賀
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Priority to JP2011003193U priority Critical patent/JP3170508U/en
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Publication of JP3170508U publication Critical patent/JP3170508U/en
Priority to KR1020110111993A priority patent/KR101116187B1/en
Priority to PCT/KR2011/008238 priority patent/WO2012157823A1/en
Priority to CN2011800045134A priority patent/CN102892541A/en
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Thermal Insulation (AREA)
  • Furnace Details (AREA)

Abstract

【課題】半田付け行程で使用されるリフロー炉の炉体を保温することで、リフロー炉の消費電力を低減させること及び室温を上昇させない効果が得られる炉体の保温カバーを提供する。【解決手段】加熱空間で形成される炉体の外周面を保温体で包み込むことで、炉体外面から放出される熱を封じ込めることを特徴とする。炉体の外周面を保温体で覆うことにより、断熱性を向上させ、炉内の熱保持エネルギーを最小限にとどめることで、電気エネルギーの削減につながり、省エネの効果がある。【選択図】図１An object of the present invention is to provide a heat insulating cover for a furnace body that can reduce the power consumption of the reflow furnace and increase the room temperature by maintaining the temperature of the furnace body of the reflow furnace used in the soldering process. The present invention is characterized in that heat released from the outer surface of the furnace body is contained by enclosing the outer peripheral surface of the furnace body formed in the heating space with a heat insulating body. By covering the outer peripheral surface of the furnace body with a heat insulator, the heat insulation is improved and the heat retention energy in the furnace is kept to a minimum, leading to a reduction in electrical energy and an energy saving effect. [Selection] Figure 1

Description

本考案は、基板に電子部品を実装したあと、半田付け工程で使用されるリフロー炉の炉体を保温することで、リフロー炉の消費電力を低減させること及び室温を上昇させない効果が得られる、炉体の保温カバーに関する。  The present invention, after mounting electronic components on the substrate, by keeping the furnace body of the reflow furnace used in the soldering process, the effect of reducing the power consumption of the reflow furnace and not increasing the room temperature can be obtained. The heat insulation cover for the furnace body.

従来のリフロー炉は、基板に部品を実装する場合、半田ペーストを介して部品を搭載し、リフロー炉を通過させてリフロー半田付けを行っている。リフロー炉内は、炉体というコンベアが流れる空間内を電熱ヒーター等で２００度程度に暖め、その空気熱で半田ペーストを溶かして部品を基板に半田付けを行っている。  In a conventional reflow furnace, when a component is mounted on a substrate, the component is mounted via a solder paste, and reflow soldering is performed through the reflow furnace. In the reflow furnace, the space in which the conveyor called the furnace body flows is heated to about 200 degrees by an electric heater or the like, and the solder paste is melted by the air heat to solder the component to the board.

炉体内の空間は大きいため、電熱ヒーターで空気を暖めるためには大きな電力を必要としている。また、作業を開始する前に十分に炉体内を温める必要があるため、一度、リフロー炉を停止させてしまうと、再起動させるための長い時間も必要である。  Since the space in the furnace is large, a large amount of electric power is required to warm the air with an electric heater. In addition, since it is necessary to warm the furnace sufficiently before starting the work, once the reflow furnace is stopped, a long time is required for restarting.

従来の特許出願においては、リフロー炉を、外乱が入らない密封された加熱空間を形成する加熱用シールド構成にし、このリフロー炉に温風吹出し口を設けて、この温風吹出し口にダクトを介して送風機の空気吐出口を接続し、ダクト内に温風発生器を配置し、温風発生器に、この温風発生器における温風の温度及び加熱時間を制御する温度制御器を接続すると共に、送風機に、この送風機における風量及び送風時間を制御する風量制御器を接続することで、温風を直接被加熱物（プリンと基板及び電子部品）に吹き付ける構成を採用した出願がある（例えば、特許文献１参照）。  In the conventional patent application, the reflow furnace has a heating shield configuration that forms a sealed heating space that does not receive disturbance, a hot air outlet is provided in the reflow furnace, and the hot air outlet is provided with a duct. Connect the air outlet of the blower, place the hot air generator in the duct, and connect the temperature controller to control the temperature and heating time of the hot air in this hot air generator In addition, there is an application that adopts a configuration in which hot air is directly blown to an object to be heated (pudding, substrate, and electronic component) by connecting an air volume controller that controls the air volume and blowing time in the air fan to the air fan (for example, Patent Document 1).

特願２０００−１８６７０６号公報Japanese Patent Application No. 2000-186706

しかし、従来のりフリー炉においては、先行技術文献にあげたように、密閉空間に温風を流し込むことで、温度制御を調整しやすいものはあるが、炉体の外周面から放出される熱に対する対策は行ってこなかった。  However, in conventional paste-free furnaces, as mentioned in the prior art documents, there are some that can easily adjust the temperature control by flowing warm air into the sealed space, but with respect to the heat released from the outer peripheral surface of the furnace body No countermeasures have been taken.

そこで、本考案では、加熱空間で形成される炉体の外周面を保温体で包み込むことで、炉体外面から放出される熱を封じ込めることを特徴とする。  Therefore, the present invention is characterized in that the heat released from the outer surface of the furnace body is contained by enclosing the outer peripheral surface of the furnace body formed in the heating space with a heat insulating body.

炉体の外周面を保温体で覆うことにより、断熱性を向上させ、炉内の熱保持エネルギーを最小限にとどめることで、電気エネルギーの削減につながり、省エネの効果がある。  By covering the outer peripheral surface of the furnace body with a heat insulator, the heat insulation is improved and the heat retention energy in the furnace is kept to a minimum, leading to a reduction in electrical energy and an energy saving effect.

また、炉体の外周面を保温体で覆うことにより、炉体外周面からの熱の放出を少なくすることができるので、リフロー炉の機械周辺の室温上昇を抑え、作業環境向上につながるとともに、作業環境の空調費用の削減効果も見込める。  In addition, by covering the outer peripheral surface of the furnace body with a heat insulating body, it is possible to reduce the release of heat from the outer peripheral surface of the furnace body, thereby suppressing room temperature rise around the machine of the reflow furnace, leading to an improvement in the working environment, It can also be expected to reduce the air conditioning costs of the work environment.

また、本考案では、保温体の外周面にさらに断熱部材を装着することができるので、より一層の炉内の熱保持を高めることや、炉体からの放熱を抑えることができる。  Moreover, in this invention, since a heat insulating member can be further attached to the outer peripheral surface of the heat retaining body, it is possible to further increase the heat retention in the furnace and to suppress heat dissipation from the furnace body.

また、本考案では、リフロー炉を使用しないときに、リフロー炉の温度維持のため使用するエネルギーを削減するため、炉体の外周面に特殊フィルムヒーターを取り付けることができるので、炉体外周面の温度を保つことができ、炉体内の熱風温度が低下しにくくなり、炉体自身のヒーターを停止させても、炉体の内部温度を保つことができる。さらに、一度リフロー炉を停止させた後、再度立ち上げる際の電気エネルギーの削減を図ることもできる。  Further, in the present invention, when a reflow furnace is not used, a special film heater can be attached to the outer peripheral surface of the furnace body in order to reduce energy used for maintaining the temperature of the reflow furnace. The temperature can be maintained, the hot air temperature in the furnace body is less likely to decrease, and the internal temperature of the furnace body can be maintained even if the heater of the furnace body itself is stopped. Furthermore, once the reflow furnace is stopped, the electric energy when starting up again can be reduced.

さらには、本考案の保温体は、外周面の周囲に設けた吸着手段により炉体に吸着されているため、リフロー炉の整備等のとき、保温体を容易に取り外して整備を行うことができる。  Furthermore, since the heat insulating body of the present invention is adsorbed to the furnace body by the adsorbing means provided around the outer peripheral surface, the heat insulating body can be easily removed and serviced during maintenance of the reflow furnace. .

本考案を示す断面図である。It is sectional drawing which shows this invention. 本考案の他の実施例を示す断面図である。It is sectional drawing which shows the other Example of this invention. 本考案の他の実施例を示す斜視図である。It is a perspective view which shows the other Example of this invention.

符号の簡単な説明Brief description of symbols

１０ 保温体
１１ 吸着部材
１２ 接続部材
１３ ポケット部
Ｒ 炉体
Ｈ フィルムヒーター
Ｎ ノズル
Ｄ ダンパーDESCRIPTION OF SYMBOLS 10 Thermal insulation body 11 Adsorption member 12 Connection member 13 Pocket part R Furnace body H Film heater N Nozzle D Damper

図１に示すのは、本考案のリフロー炉用保温体の取り付け状態を示す断面図である。リフロー炉の搬送方向と直行する面を断面にしたもので、炉体Ｒの断面が四角く表現されており、その中央下側には、搬送レールが配置されている。  FIG. 1 is a cross-sectional view showing an attached state of the reflow furnace heat insulator of the present invention. The cross section of the surface perpendicular to the transport direction of the reflow furnace is shown, and the cross section of the furnace body R is expressed as a square, and a transport rail is disposed below the center thereof.

符号１０で示されるのは、本考案の保温体で、外周が放火用素材の袋体で形成され、その袋体の内部にグラスファイバーが充填されている。符号１１で示されるものは、吸着部材で、本実施例では磁石が用いられている。この吸着部材１１は保温体１０に接合されており、保温体１０を炉体Ｒに密着させている。  Reference numeral 10 denotes a heat retaining body according to the present invention, the outer periphery of which is formed of a bag body made of an arson material, and the inside of the bag body is filled with glass fiber. What is indicated by reference numeral 11 is an attracting member, and a magnet is used in this embodiment. The adsorption member 11 is joined to the heat retaining body 10, and the heat retaining body 10 is in close contact with the furnace body R.

符号１２で示されるものは、接続部材であり、ベルクロファスナーで構成されている。接続部材１２は、保温体１０どうしをつなぎ合わせることで、保温体１０どうしの隙間をなくし、炉体Ｒからの熱の放出を防ぐことができる。  What is shown by the code | symbol 12 is a connection member, and is comprised with the Velcro fastener. The connecting member 12 can eliminate the gap between the heat retaining bodies 10 by connecting the heat retaining bodies 10 together, and prevent the heat release from the furnace body R.

保温体１０の内部に充填される保温素材はグラスファイバーに特定されず、他の保温素材でも良い。また、吸着部材１１は磁石に特定されず、両面テープやフックなどの他の吸着手段でもよい。また、接続部材１２はベルクロファスナーに限定されず、ファスナーや両面テープ、細長い紐どうしを縛りあげるバンドのような接続手段でもよい。  The heat insulating material filled in the heat insulating body 10 is not limited to glass fiber, and other heat insulating materials may be used. Further, the attracting member 11 is not limited to a magnet, and may be another attracting means such as a double-sided tape or a hook. The connecting member 12 is not limited to a Velcro fastener, and may be a connecting means such as a fastener, a double-sided tape, or a band that ties up long and slender strings.

また図２は本考案の他の実施例である。符号１３で示すものは、ポケット部であり、保温体１０の炉体Ｒ側の中央に内部に空間を有するように取り付けられている。符号Ｈで示されるものはフィルムヒーターでポケット部１３の内部に挿入されている。このフィルムヒーター１３が、炉体Ｒが休止状態時であるときに作動することで、炉体Ｒの温度をある一定温度に保持することができ、リフロー炉を再起動させるときの電力を少なくすることができる。また、このフィルムヒーターＨは炉体Ｒの側面に取り付けることも可能である。そのようにすれば、より炉体Ｒの保温力を高めることができる。  FIG. 2 shows another embodiment of the present invention. What is shown by the code | symbol 13 is a pocket part, and is attached so that it may have a space in the center at the side of the furnace body R of the heat retaining body 10. What is indicated by a symbol H is inserted into the pocket portion 13 by a film heater. By operating the film heater 13 when the furnace body R is in a resting state, the temperature of the furnace body R can be maintained at a certain constant temperature, and the power required for restarting the reflow furnace is reduced. be able to. The film heater H can also be attached to the side surface of the furnace body R. By doing so, the heat retaining power of the furnace body R can be further increased.

フィルムヒーターＨはこれに限定されず、他の加温機能を有するものでもよい。  The film heater H is not limited to this, and may have another heating function.

図３は、本考案の他の実施例である。符号Ｎで示されるものは、空気を炉体Ｒの外面に流入させるためのノズルである。このノズルＮは保温体１０を貫通し、Ｎ１から冷えた空気を流入させ、Ｎ２から炉体Ｒで暖められた空気が排出され、その熱い空気はリフロー炉の排出口からリフロー炉外部に排出される。  FIG. 3 shows another embodiment of the present invention. What is indicated by a symbol N is a nozzle for flowing air into the outer surface of the furnace body R. The nozzle N passes through the heat retaining body 10 and allows air cooled from N1 to flow in. The air warmed in the furnace body R is discharged from N2, and the hot air is discharged to the outside of the reflow furnace from the discharge port of the reflow furnace. The

符号Ｄで示されるものは、ダンパーである。このダンパーＤは、空気が冷えている場合はノズルＮ２の空気が外部に流れないように閉じられ、炉体Ｒを冷やすために空気を流したい場合には、ノズルＮ２の空気を排出するように開く構造になっている。  What is indicated by a symbol D is a damper. The damper D is closed so that the air of the nozzle N2 does not flow to the outside when the air is cold, and the air of the nozzle N2 is discharged when it is desired to flow the air to cool the furnace body R. It has an open structure.

このようなダンパーＤの作用により、炉体Ｒを急激に冷やしたい場合にはダンパーＤを開いて冷たい空気で炉体Ｒを冷やすことができる。この構造により、リフロー炉に流す基板の種類を変えるために、温度プロファイルを変更する場合に、一度炉体Ｒを冷やして、温度プロファイルを変更することが容易になる。  By such an action of the damper D, when it is desired to cool the furnace body R rapidly, the damper body R can be opened and the furnace body R can be cooled with cold air. With this structure, when the temperature profile is changed in order to change the type of the substrate that flows in the reflow furnace, it becomes easy to cool the furnace body R once and change the temperature profile.

Claims (4)

袋状の断熱素材で構成される袋体と、該袋体の内部に密封された断熱体で構成されるリフロー炉用保温体。  A heat insulator for a reflow furnace comprising a bag made of a bag-like heat insulating material and a heat insulator sealed inside the bag. 前記保温体の外辺部の少なくとも１辺に、吸着手段を設けた、請求項１に記載のリフロー炉用保温体。  The heat retaining body for a reflow furnace according to claim 1, wherein adsorption means is provided on at least one side of the outer side of the heat retaining body. 前記保温体の外面部に、袋状のポケット部を設けた、請求項１乃至２に記載のリフロー炉用保温体。  The heat retaining body for a reflow furnace according to claim 1, wherein a bag-like pocket portion is provided on an outer surface portion of the heat retaining body. 前記ポケット部に、保温用のヒーターを入れた、請求項３に記載のリフロー炉用保温体。  The heat retaining body for a reflow furnace according to claim 3, wherein a heater for heat insulation is placed in the pocket portion.
JP2011003193U 2011-05-19 2011-05-19 Thermal insulator for reflow furnace Expired - Fee Related JP3170508U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011003193U JP3170508U (en) 2011-05-19 2011-05-19 Thermal insulator for reflow furnace
KR1020110111993A KR101116187B1 (en) 2011-05-19 2011-10-31 A Lagging Material For A Reflow Apparatus.
PCT/KR2011/008238 WO2012157823A1 (en) 2011-05-19 2011-11-01 Insulation body for reflow device
CN2011800045134A CN102892541A (en) 2011-05-19 2011-11-01 Insulation body for reflow device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011003193U JP3170508U (en) 2011-05-19 2011-05-19 Thermal insulator for reflow furnace

Publications (1)

Publication Number Publication Date
JP3170508U true JP3170508U (en) 2011-09-22

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Application Number Title Priority Date Filing Date
JP2011003193U Expired - Fee Related JP3170508U (en) 2011-05-19 2011-05-19 Thermal insulator for reflow furnace

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Country Link
JP (1) JP3170508U (en)
KR (1) KR101116187B1 (en)
CN (1) CN102892541A (en)
WO (1) WO2012157823A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2754517A1 (en) * 1977-12-07 1979-06-13 Wacker Chemie Gmbh PROCESS FOR IMPROVING THERMAL PROTECTION OBJECTS
JP2000165031A (en) * 1998-11-26 2000-06-16 Koyo Thermo System Kk Reflow furnace
JP4271299B2 (en) * 1999-06-28 2009-06-03 光洋サーモシステム株式会社 Reflow furnace
KR100327124B1 (en) * 1999-07-27 2002-03-13 윤종용 Soldering apparatus for screen printer
JP2002016353A (en) 2000-06-28 2002-01-18 Canon Inc Reflow soldering method and mounting board
US7402778B2 (en) * 2005-04-29 2008-07-22 Asm Assembly Automation Ltd. Oven for controlled heating of compounds at varying temperatures
JP5264079B2 (en) * 2007-01-12 2013-08-14 有限会社ヨコタテクニカ Heating device
JP2010155269A (en) * 2008-12-27 2010-07-15 Senju Metal Ind Co Ltd Solder bath and method of heating solder contained in the solder bath

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KR101116187B1 (en) 2012-03-06
CN102892541A (en) 2013-01-23
KR20110126091A (en) 2011-11-22
WO2012157823A1 (en) 2012-11-22

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