JP3162488U - Heat dissipation device - Google Patents

Abstract

Disclosed is a heat dissipation device capable of reducing heat resistance, improving heat dissipation effect, reducing material weight, and suppressing cost. A heat radiator includes a heat radiator and a heat pipe. The heat radiator includes a plurality of heat radiation fins stacked on each other, and the heat radiator includes a heat radiation portion and a heat absorption portion in contact with a heat generation source. A groove 114 is provided, and a cross section of the groove is formed by an arcuate closing side 1142 and an opening 1141. The heat pipe has a heat absorbing end and a heat radiating end, and the cross-sectional shape of the heat absorbing end is constituted by a flat heat absorbing surface in contact with the heat source and an arcuate heat conducting surface following the flat heat absorbing surface. The heat-absorbing end of the heat pipe is fitted into the groove, the flat heat-absorbing surface is exposed from the opening of the groove, and the heat is directly conducted from the heat generation source so as to be flush with the heat-absorbing end surface of the radiator. [Selection] Figure 2

Description

  The present invention relates to a structure of a heat radiating device, and more particularly to a structure of a heat radiating device with reduced manufacturing cost and thermal resistance.

  A heat pipe is a heat conduction component that is currently used universally for electronic equipment and electronic components. Generally, heat pipes are filled with heat transfer media such as water, ethanol, and acetone that have good fluidity, high heat of vaporization, relatively low boiling point, and stable chemical properties. Usually, many protruding capillary structures are formed.

  In actual use, one end of the heat pipe is connected to the heat pipe base of the electronic component as an evaporation end, and the other end is connected to many radiating fins as a cooling end. When the evaporating end of the heat pipe receives heat, the heat transfer medium in the evaporating end of the heat pipe is vaporized and simultaneously absorbs a large amount of heat of vaporization, so that the temperature of the heat pipe base is lowered. When the heat transfer medium diffuses to the cooling end of the heat pipe in a gaseous state, the heat transfer medium attaches to the capillary structure, cools and returns to liquefaction, and then returns to the evaporation end of the heat pipe. At the same time, a large amount of heat of condensation is diffused through the radiation fins.

  FIG. 1 is a three-dimensional exploded view of a conventional heat dissipation device. The heat dissipating device 3 according to the prior art includes a heat dissipating member 31 having a plurality of fins, one pedestal 32 and at least one heat pipe 33. The radiator 31 includes one heat receiving portion 311 and one heat radiating portion 312, and the heat receiving portion 311 is attached to the pedestal 32. One end of the heat pipe 33 is inserted between the heat receiving portion 311 and the pedestal 32, and the other end is inserted into the heat radiating portion 312. The heat radiating device 3 contacts the pedestal 32 and one heat source 4 and absorbs heat generated by the heat source 4. The heat is conducted to the radiator 31 and the heat pipe 33 by the pedestal 32, and is diffused from the heat pipe 33 to the heat radiating portion 312 of the radiator 31, thereby increasing the heat radiation efficiency.

  The base 32 of the heat dissipation device 3 in the prior art has two uses. 1. The heat radiator 31 is fixed and coupled, and the heat is directly conducted to the heat radiation portion 312 in the fin of the heat radiator 31 to be radiated to the outside. 2. Since the heat pipe 33 is a single cylindrical pipe, the heat pipe 33 cannot be directly in contact with the heat source 4, so that the pedestal 32 is installed and at least one groove in which the heat pipe 33 can be accommodated on one side of the pedestal 32. 321 is provided and combined with the radiator 31. Thereby, the pedestal 32 comes into contact with the heat source 4 and conducts heat to the radiator 31 and the heat pipe 33.

  If there is a gap when combining the heat dissipation component and the heat dissipation component, a thermal resistance phenomenon occurs. This can be solved somewhat by joining welding materials. However, when excessive heat dissipation parts are combined, the heat dissipation efficiency becomes relatively poor. In addition, combining many heat dissipating parts to conduct heat takes assembly time and costs.

  Furthermore, since the volume of the heat radiating device main body is increased by the combination of the pedestal and the heat radiator, it is inconvenient for transportation and movement, and a large volume heat radiating device cannot be used in a place where the heat radiating space is limited. The disadvantages of the prior art are: 1, cost is relatively high. 2. The assembly time is long. 3. It does not apply to places where the heat dissipation space is relatively small. 4. In view of low conduction and heat dissipation efficiency, further improvements were necessary.

JP 2002-246521 A

  In order to solve the drawbacks of the prior art, a first object of the present invention is to provide a structure of a heat dissipation device that lowers thermal resistance. The second object is to provide a structure of a heat dissipation device that saves production costs. A third object is to provide a structure of a heat dissipation device that can be easily assembled.

In order to solve the above problems, the present invention provides a structure of a heat dissipation device. Included is one radiator, at least one heat pipe. The heat radiator is configured by stacking a plurality of heat radiation fins. The radiator has one heat dissipating part and one heat absorbing part, the heat absorbing part has an end face in contact with the heating element, the end face is provided with at least one groove, and the groove has an arcuate closing side and the end face. It consists of an opening to the end face.
The heat pipe 12 has a heat absorbing end 121 and a heat radiating end 122, and the heat absorbing end 121 is configured by a flat heat absorbing surface 1211 in contact with a heat generating source and a circular arc heat conducting surface 1212 following the heat absorbing end 121. The heat absorbing end 121 of the heat pipe 12 is fitted in the groove 114, and the heat radiating end 122 is inserted into the heat radiating portion 111. The heat conducting surface 1212 is bonded corresponding to the closed side 1142, and the heat absorbing surface 1211 is flush with the end surface 113.

In order to solve the above-mentioned problems, the present invention further provides the following structure of a heat dissipation device. Included is one radiator and at least one heat pipe. The radiator 11 is configured by stacking a plurality of radiating fins 2 on each other. The heat radiator 11 has one heat radiating portion 111 and one heat absorbing portion 112, and the heat absorbing portion 112 has an end face 113 for a heat source, and the end face 113 has a single opening 115. Holes 116 are respectively provided on both sides of the heat absorption part 112, and the holes 116 communicate with each other through an opening 115.
The heat pipe 12 has one heat absorbing end 121 and one heat radiating end 122, and the heat absorbing end 121 includes a flat heat absorbing surface 1211 whose transverse cross section is in contact with a heat generating source, and an arc-shaped heat conducting surface 1212 following the flat heat absorbing surface 1211. Consists of. The heat absorbing end 121 of the heat pipe 12 is correspondingly inserted into the hole 116, and the heat conducting surface 1212 and the heat absorbing surface 1211 are exposed in the opening 115 and do not contact the radiator 11. The heat radiating end 122 is inserted into the heat radiating portion 111.

  The heat pipe directly absorbs and conducts heat through the flat heat absorbing surface, thereby reducing the thermal resistance, reducing the cost, and reaching the best heat dissipation effect. Moreover, since the material of a part of the heatsink is appropriately reduced, the purpose of reducing the weight and the cost of the material is achieved. The merit of the present invention is 1. Lowering the production cost. 2. Realized light weight. 3. Reduce the generation of thermal resistance. 4. Quick and convenient assembly.

The heat dissipating device of the present invention can be assembled quickly and conveniently by installing a radiator and a heat pipe so that the heat pipe directly absorbs heat and dissipates heat to reduce thermal resistance and increase heat dissipation effect. Can reduce the assembly cost.

It is a three-dimensional exploded view of a heat dissipation device in the prior art. It is a three-dimensional exploded view of the first embodiment of the heat dissipation device in the present invention. 1 is a three-dimensional assembly diagram of a first embodiment of a heat dissipation device according to the present invention. 1 is a front view of a first embodiment of a heat dissipation device according to the present invention. It is a three-dimensional exploded view of the second embodiment of the heat dissipation device in the present invention. It is a three-dimensional assembly drawing of the second embodiment of the heat dissipation device in the present invention. It is a three-dimensional assembly drawing of the third embodiment of the heat dissipation device in the present invention. It is a three-dimensional assembly drawing of the fourth embodiment of the heat dissipation device in the present invention. It is a three-dimensional assembly drawing of the fifth embodiment of the heat dissipation device in the present invention. It is a three-dimensional assembly drawing of the sixth embodiment of the heat dissipation device in the present invention. It is a three-dimensional assembly drawing of the seventh embodiment of the heat dissipation device in the present invention. It is a three-dimensional assembly drawing of the eighth embodiment of the heat dissipation device in the present invention. It is a three-dimensional assembly drawing of the ninth embodiment of the heat dissipation device in the present invention. It is a three-dimensional assembly drawing of the tenth embodiment of the heat dissipation device in the present invention. It is a three-dimensional assembly drawing of the eleventh embodiment of the heat dissipation device in the present invention. It is a three-dimensional assembly drawing of the twelfth embodiment of the heat dissipation device in the present invention.

〔Example〕
In order to clearly show the structure of the heat dissipation device according to the present invention, a detailed description will be given with reference to the drawings.

  2, 3, and 4 are a three-dimensional exploded view, an assembly view, and a front view of the first embodiment of the heat dissipation device according to the present invention. As shown in the figure, the radiator 1 includes one radiator 11 and at least one heat pipe 12.

The heat radiator 11 is composed of a plurality of heat radiating fins 2 stacked on each other. The radiator 11 has one heat radiating portion 111 and one heat absorbing portion 112, an end face 113 in contact with the heat generation source is formed on the heat absorbing portion 112, and at least one groove 114 is provided on the end face 113. The cross-sectional shape is configured by an arcuate closing side 1142 and an opening 1141. The heat dissipating part 111 is adjacent to the heat absorbing part 112 and extends from one side of the heat absorbing part 112 in the opposite direction to the heat absorbing part 112. At least one hole 1111 is provided in the heat radiating portion 111.

  The heat pipe 12 has a heat absorbing end 121 and a heat radiating end 122, and the heat absorbing end 121 includes a flat heat absorbing surface 1211 in contact with a heat generation source in the cross section and an arc-shaped heat conducting surface 1212 that follows the flat heat absorbing surface 1211. The heat absorbing end 121 of the heat pipe 12 is fitted in the groove 114, and the heat radiating end 122 is inserted into the heat radiating portion 111. The heat conducting surface 1212 is bonded corresponding to the closed side 1142, and the heat absorbing surface 1211 is flush with the end surface 113.

  The width of the groove opening 1141 formed in the heat absorbing surface of the radiator 11 is smaller than the maximum width of the closed side 1142 of the cross section of the groove. The cross-sectional shape of the groove 114 is the same as the cross-sectional shape of the heat absorbing end 121 of the heat pipe 12.

  5 and 6 are three-dimensional exploded views and assembly views of the second embodiment of the heat dissipation device according to the present invention. As shown in the figure, the heat radiating device 1 includes one heat radiator 11 and at least one heat pipe 12.

The radiator 11 is configured by stacking a plurality of radiating fins 2 on each other. The radiator 11 includes one heat radiating portion 111 and one heat absorbing portion 112, and the heat absorbing portion 112 forms an end face 113 in contact with a heat generation source, and a groove 114 is formed in the end face 113.
Holes 116 through which the heat pipes are inserted are provided on both surfaces of the heat absorbing portion 112, and the holes 116 communicate with each other through the openings 115. The heat dissipating part 111 is adjacent to the heat absorbing part 112 and extends from one side of the heat absorbing part 112 in the direction opposite to the heat absorbing part 112. The heat dissipating part 111 is provided with at least one hole 1111.

The heat pipe 12 has one heat absorbing end 121 and one heat radiating end 122, and the heat absorbing end 121 includes a flat heat absorbing surface 1211 and an arc-shaped heat conducting surface 1212 in the cross section thereof, and continuously The surface 1211 forms an endothermic end section with the heat conducting surface 1212. The heat absorbing end 121 of the heat pipe 12 is correspondingly inserted into the hole 116, and the heat conducting surface 1212 and the heat absorbing surface 1211 are exposed in the opening 115 and do not contact the radiator 11.
The heat radiating end 122 is inserted into the heat radiating portion 111.

  The heat dissipating device 1 is in contact with at least one heat generating component 5 to conduct heat, and the heat absorbing surface 1211 of the heat pipe 12 is brought into direct contact with the heat generating component 5 in the opening 115.

  7 and 8 are three-dimensional assembly views of the third and fourth embodiments of the heat dissipation device according to the present invention. As shown in the figure, the radiator 11 further includes a first portion 117, a second portion 118, and a third portion 119. The first and third portions 117 and 119 described in the embodiments of the present invention are respectively installed at both ends of the second portion 118, but may be arbitrarily arranged. The thickness of the radiating fin 2 of the first and third portions 117 and 119 is larger than the thickness of the radiating fin 2 of the second portion 118. Alternatively, a material having a relatively strong structural strength can be selected. With these designs, the overall structural strength of the heat dissipation device 1 can be significantly increased.

9 and 10 are three-dimensional assembly views of the fifth and sixth embodiments of the heat dissipation device according to the present invention. As shown in the figure, the structures of the fifth and sixth embodiments and the correspondence between the components are the same as those of the first embodiment, and therefore will not be mentioned here again.
The difference between the fifth and sixth embodiments and the first embodiment is that the radiator 11 of the heat radiating device 1 has a first reinforcing portion 13 and a second reinforcing portion 14. The first and second reinforcing portions 13 and 14 are installed at both ends of the radiator 11 to reinforce the structural strength of the radiator 11. Further, the difference between the fifth and sixth embodiments is that the installation positions of the first and second strengthening portions 13 and 14 of the sixth embodiment are the same as the first and second strengthening portions 13 and 14 of the fifth embodiment. It is about 90 degrees different from the installation position.

  11 and 12 are three-dimensional assembly views of the seventh and eighth embodiments of the heat dissipation device according to the present invention. Since the structures of the seventh and eighth embodiments and the correspondence between the components are the same as those of the second embodiment, they will not be mentioned here again. The difference between the seventh and eighth embodiments and the second embodiment is that the radiator 11 of the heat radiating device 1 has the first reinforcing portion 13 and the second reinforcing portion 14. The first and second reinforcing portions 13 and 14 are respectively installed at both ends of the radiator 11 to reinforce the structural strength of the radiator 11. The difference between the seventh and eighth embodiments is that the first and second strengthening portions 13 and 14 of the eighth embodiment are installed at the first and second strengthening portions 13 and 14 of the seventh embodiment. It is about 90 degrees different from the installation position.

FIGS. 13 and 14 are three-dimensional assembly diagrams of ninth and tenth embodiments of the heat dissipation device according to the present invention. Since the structures of the ninth and tenth embodiments and the correspondence between the components are the same as those of the first embodiment, they will not be mentioned here again.
The difference between the ninth and tenth embodiments and the first embodiment is that the radiator 11 has at least one first strengthening portion 13, at least one second strengthening portion 14, and at least one third strengthening portion 15. It is to be. The first and second reinforced portions 13 and 14 are respectively installed at both ends of the third reinforced portion 15, and a plurality of radiating fins 2 are provided between the third reinforced portion 15 and the first and second reinforced portions 13 and 14. Have tools. The first, second, and third reinforcing portions 13, 14, and 15 reinforce the structural strength of the radiator 11. The difference between the ninth and tenth embodiments is that the first, second, and third reinforcing portions 13, 14, and 15 of the tenth embodiment are installed at the first and second positions of the ninth embodiment. The installation position of the third strengthening portions 13, 14, 15 is different by about 90 degrees.

  FIG. 15 and FIG. 16 are three-dimensional assembly views of the eleventh and twelfth embodiments of the heat dissipation device according to the present invention. Since the structure of the eleventh and twelfth embodiments and the correspondence between the components are the same as those of the second embodiment, they will not be mentioned here again. The different parts of the eleventh, twelfth and second embodiments are that the radiator 11 includes at least one first strengthening portion 13, at least one second strengthening portion 14, and at least one third strengthening portion 15. It is to have. The first and second reinforced portions 13 and 14 are respectively installed at both ends of the third reinforced portion 15, and a plurality of radiating fins 2 are provided between the third reinforced portion 15 and the first and second reinforced portions 13 and 14. Have tools. The first, second, and third reinforcing portions 13, 14, and 15 reinforce the structural strength of the radiator 11. The difference between the eleventh and twelfth embodiments is that the installation positions of the first, second, and third strengthening portions 13, 14, and 15 in the twelfth embodiment are the same as those in the eleventh embodiment. It differs from the installation position of the 1st, 2nd, 3rd reinforcement | strengthening part 13,14,15 about 90 degree | times.

  As shown in FIGS. 9 to 16, the first reinforcing portion 13 has a first coupling portion 131, and the first coupling portion 131 has a first coupling end 1311 and a first coupling groove 1312. The second reinforcing portion 14 has a second coupling portion 141, and the second coupling portion 141 has a second coupling end 1411 and a second coupling groove 1412. The third reinforcing portion 15 includes a third coupling portion 151, and the third coupling portion 151 includes a third coupling end 1511 and a third coupling groove 1512. That is, the first, second, and third coupling ends 1311, 1411, and 1511 of the first, second, and third reinforcing portions 13, 14, and 15 are formed into the first, second, and third coupling grooves 1312, 1412, and 1512, respectively. By fitting, the first, second, and third reinforcing portions 13, 14, and 15 can be assembled and connected to each other.

  In addition, all of the heat dissipating devices of the present invention can be composed of only the above-described strengthening portion, and the strengthening portion is made of a material having heat conduction characteristics. The material can be metallic or non-metallic.

DESCRIPTION OF SYMBOLS 1 Heat radiation apparatus 11 Radiator 111 Heat radiation part 1111 Hole 112 Heat absorption part 113 End surface 114 Groove 1141 Opening 1142 Closure side 115 Groove 116 Hole 117 First part 118 Second part 119 Third part 12 Heat pipe 121 Heat absorption end 122 Heat radiation end 1211 Heat absorption surface 1212 Heat-conducting surface 5 Heat-generating component 13 First strengthening part 131 First joint part 1311 First joint end 1312 First joint groove 14 Second strengthening part 141 Second joint part 1411 Second joint end 1412 Second joint groove 15 Third strengthening Part 151 Third coupling part 1511 Third coupling end 1512 Third coupling groove

Claims (16)

Consists of a radiator and heat pipe,
The radiator is configured by stacking a plurality of radiating fins on each other,
The radiator has one heat radiating part and one heat absorbing part,
The endothermic portion has an end face for a heat source, and at least one groove is provided in the end face, and the cross-sectional shape is constituted by an arcuate closed side and an end face side opening,
The heat pipe has one heat absorbing end and one heat radiating end, and the cross-sectional shape of the heat absorbing end is composed of a flat heat absorbing surface in contact with the heat source and an arc-shaped heat conducting surface,
The heat absorbing end of the heat pipe is fitted in the groove, the heat dissipating end is inserted into the heat dissipating part, the heat conducting surface is bonded correspondingly to the closed side, and the heat absorbing surface is flush with the end surface. A structure of a heat dissipation device.   The structure of the heat radiating device according to claim 1, wherein a width of the opening is smaller than a width on the closed side. 2. The structure of a heat radiating device according to claim 1, wherein the shape of the groove is the same as the shape of the cross section of the heat absorption end of the heat pipe. The radiator further includes a first part, a second part, and a third part, and the first and third parts are respectively installed on both ends of the second part,
The structure of the heat radiating device according to claim 1, wherein the thickness of the heat radiating fins of the first and third portions is larger than the thickness of the heat radiating fins of the second portion. The structure of the heat radiating device according to claim 1, wherein the heat radiator has at least one reinforcing portion.   The heat radiator further includes at least one first strengthening portion and at least one second strengthening portion, and the first and second strengthening portions are respectively installed at both ends of the heat radiator. Item 1. The structure of the heat dissipation device according to Item 1. The radiator has at least one first strengthening portion and at least one second strengthening portion, at least one third strengthening portion,
The first and second reinforced portions are respectively installed at both ends of the third reinforced portion, and have a plurality of radiating fins between the third reinforced portion and the first and second reinforced portions. Item 1. The structure of the heat dissipation device according to Item 1. The first reinforcing portion has a first coupling portion, the first coupling portion has a first coupling end and a first coupling groove,
The structure of a heat dissipation device according to claim 6, wherein the second reinforcing portion has a second coupling portion, and the second coupling portion has a second coupling end and a second coupling groove. The first reinforcing portion has a first coupling portion, the first coupling portion has a first coupling end and a first coupling groove,
The second reinforcing portion has a second coupling portion, the second coupling portion has a second coupling end and a second coupling groove,
8. The structure of a heat dissipation device according to claim 7, wherein the third reinforcing portion has a third coupling portion, and the third coupling portion has a third coupling end and a third coupling groove. It consists of a radiator and a heat pipe,
The radiator is configured by stacking a plurality of radiation fins on each other,
The radiator has one heat-dissipating part and one heat-absorbing part for a heat source, the heat-absorbing part has one end face, and one opening is recessed in the end face,
At least one hole is installed on each side surface of the heat absorbing part 112, and communicates with each other through the opening.
The heat pipe has one heat absorbing end and one heat radiating end, and the cross-sectional shape of the heat absorbing end is composed of a flat heat absorbing surface in contact with the heat source and an arc-shaped heat conducting surface,
The heat absorbing end of the heat pipe is correspondingly inserted into the hole, the heat conducting surface and the heat absorbing surface are exposed in the opening, do not contact the radiator,
A structure of a heat radiating device, wherein the heat radiating end is inserted into the heat radiating portion.   The radiator further includes a first portion, a second portion, and a third portion, and the first and third portions are respectively installed at both ends of the second portion, and the heat radiation fins of the first and third portions are arranged. The structure of the heat dissipation device according to claim 10, wherein the thickness is greater than the thickness of the heat dissipation fin of the second portion. The structure of a heat radiating device according to claim 10, wherein the heat radiator has at least one reinforcing portion.   The heat radiator further comprises at least one first strengthening portion and at least one second strengthening portion, and the first and second strengthening portions are respectively installed at both ends of the heat radiator. Structure of the heat dissipation device described.   The radiator has at least one first strengthening portion, at least one second strengthening portion, and at least one third strengthening portion, and the first and second strengthening portions are respectively installed at both ends of the third strengthening portion. The structure of a heat radiating device according to claim 10, further comprising a plurality of heat radiating fins between the third reinforced portion and the first and second reinforced portions. The first reinforcing portion has a first coupling portion, the first coupling portion has a first coupling end and a first coupling groove,
The structure of a heat dissipation device according to claim 13, wherein the second reinforcing portion has a second coupling portion, and the second coupling portion has a second coupling end and a second coupling groove. The first reinforcing portion has a first coupling portion, the first coupling portion has a first coupling end and a first coupling groove,
The second reinforcing portion has a second coupling portion, the second coupling portion has a second coupling end and a second coupling groove,
15. The structure of a heat dissipation device according to claim 14, wherein the third reinforcing portion includes a third coupling portion, and the third coupling portion includes a third coupling end and a third coupling groove.

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