JP3035961B2 - Marking method in high level plating - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a marking method for engraving various marks and symbols on metal products and the like.

[Conventional technology]

2. Description of the Related Art Marking for plating a metal product surface to indicate a product name or a manufacturer name is performed in a wide field. A typical example of this marking is to stamp the mark on the metal surface and then plating the entire product, and FIG. 4 shows a schematic diagram of the process.

The surface of the metal workpiece 1 is processed to a high surface accuracy by polishing the marked portion from the rough surface before the finish processing as shown in FIG. Thereafter, the mark 2 is stamped by a stamping jig as shown in FIG.
And a plating layer 3 having a substantially uniform thickness is formed. This makes it possible to display the mark 2 portion white using the irregular reflection due to the unevenness remaining on the mark 2 portion.

In addition to such a marking method, a high-leveling plating method has been conventionally used as a method for performing plating that does not cause unevenness including the surface of the mark 2 portion. This is done by engraving the mark 2 as shown in FIG. 5 (b) without polishing the surface of the work 1 in FIG. 5 (a), and then plating by high level plating so that the entire surface becomes a uniform surface. The layer 3 is formed.

[Problems to be solved by the invention]

However, in the former method, since the surface of the work 1 is polished before the marking of the mark 2, the number of processing steps increases, which is not preferable in terms of cost. In addition, since the plating layer 3 is relatively thin, there is a fear that the plating layer 3 may be peeled off or cracked in the portion of the mark 2 having severe irregularities.

In the case where the high leveling plating method is used, such obstacles as peeling can be suppressed. However, since the surface of the plating layer 3 has a uniform surface including no irregularities including the mark 2, the gloss of the mark 2 tends to be difficult to distinguish from the surface of the surrounding work 2. For this reason, the display of the mark 2 becomes unclear, and there is a problem in appearance as a final product.

Therefore, an object of the present invention is to provide a marking method that makes use of the advantage that the plating layer is not peeled off or cracked due to high-leveling plating and that makes it easy to identify the display of the mark.

[Means for solving the problem]

In the method of marking in the high leveling plating according to the present invention, a mark (2) is stamped on a fabric or a machined surface of a work (1) by a basic pattern of a convex line (2a) and a concave line (2b). Thereafter, high leveling plating is performed to make the thickness of the plating layer 3 thinner than the depth of the concave stripes 2b, and the surface shape of the irregularities is raised along the irregularities of the convex stripes (2a) and the concave stripes (2b). And

Further, in the above configuration, the basic pattern may be formed by inclining the concave streaks and the convex streaks with respect to the erect image of the mark to be imprinted.

[Action]

FIG. 1 is a schematic longitudinal sectional view of a work surface to be treated by the method of the present invention.

FIG. 1 (a) shows the surface of the workpiece 1 as it is, as in FIGS. 4 (a) and 5 (a) of the prior art, either as raw material or as a machined surface after machine cutting. Then, the mark 2 is engraved at a predetermined position as shown in FIG. 3B without performing a precision surface processing such as polishing on this surface.
The printing process (engraving process) is performed by a conventionally employed embossing method, etching method, laser beam irradiation, or the like, and a method of forming minute unevenness in the range of several μm to several tens μm. After the marking of the mark 2, a plating layer 3 is formed by a high leveling plating method as shown in FIG.

Here, the mark 2 is displayed by a pattern in which a plurality of uneven stripes are formed, and an example thereof is shown in a schematic plan view in FIG.

The pattern of the mark 2 is formed by a plurality of convex stripes 2a and concave stripes 2b therebetween as shown in FIG. As shown in FIG. 2 (a), these ridges 2a and concave ridges 2b are formed by running in a diagonal direction in which the mark 2 is inclined if the mark 2 displays a substantially square area. Have been. Also, as shown in FIG.
The convex stripes 2a and the concave stripes 2b perpendicular to the pattern may be run to form a lattice shape. And, in addition to these patterns, horizontal or vertical protruding lines parallel to one side of the square of the mark 2 are provided.
2a and the concave stripe 2b can also be formed.

As shown in FIG. 1C, the plating layer 3 formed by high-leveling plating on the portion of the mark 2 having the pattern of the ridges 2a and the ridges 2b extends over the entire mark 2 as shown in FIG. The thickness is set to such an extent that the surface shapes of 2a and the concave stripe 2b appear. That is, instead of having a uniform surface shape including the mark 2 as shown in FIG. 5 (c), the thickness of the plating layer 3 is thinner than at least the depth of the concave stripe 2b. Leave two portions of irregularities.

Accordingly, the pattern of the mark 2 is different from the surface of the other work 1 in that the irregular reflection due to the unevenness becomes remarkable, and a display that can be clearly identified even after the plating layer 3 is applied is obtained. Since the ridges 2a and the ridges 2b are inclined when viewed from the viewer as shown in FIG. 2A, the range in which the display can be identified is widened. That is, in FIG. 2 (a), upper 45 degrees from the lower left or lower from the upper right
Only when viewed in the 45-degree direction, the projections 2a and the depressions 2b coincide with the running direction, so that irregular reflection by these stripes 2a and 2b is unlikely to occur. On the other hand, when the mark 2 is viewed from all ranges except these two directions, the viewing direction and
The direction in which 2a and the ridge 2b run must intersect. Therefore, from other than the above two directions, the pattern of the mark 2 can be confirmed by the irregular reflection of the ridges 2a and the ridges 2b. Also,
In the case of a grid shape as shown in FIG. 2 (b), a rectangular section defined by the ridges 2a and the ridges 2b is three-dimensionally carved in four directions. You can make it stand out.

〔Example〕

FIG. 3 shows an example of a pattern of a mark imprinted on the surface of the faucet fitting.

FIG. 2A shows a mark 2 in which the letter T is formed. When the mark 2 is erected, the ridges 2a and the ridges 2b are formed so as to have a 45-degree upward slope. . These convex ridges 2a and concave ridges 2b are stamped by a dedicated marking jig, and the pitch P of these ridges 2a and 2b is
The depth D of 0.2 mm and the concave stripe 2b is formed to be 0.05 mm. The depth of the groove of the jig for engraving the depth D is 0.
08mm one was used.

For the mark 2 pattern stamped by the jig,
Plating is performed by an electroplating method. Nickel is used as the plating metal, and the conditions for electroplating are each 5 A current density.
/ dm ² , time 8 minutes, plating thickness 5 to 8 μm. In addition,
It is a matter of course that the setting can be made so as to satisfy the optimum condition without being limited to this condition. Then, the final leveling ratio (the ratio of thinning the convex portions of the fine irregularities of the base material and smoothing the electrode portions by thickly depositing the concave portions) is 90 to 95% under the condition that plating is performed at 5 μm on the surface roughness of 2 μm. The indicated commercially available brightener was used.

As shown in FIG. 1 (c), the plating layer 3 for the mark 2 has a thickness such that the projections and depressions of the ridges 2a and the ridges 2b are raised, and the plating layer 3 covering the mark 2 is a plating layer 3 around the mark.
Is processed so as not to become a uniform plane. As a result of this processing, the ridges 2a and the ridges 2b run obliquely with respect to the erect T-shape, so that the mark 2 could be clearly displayed using diffuse reflection due to these irregularities.

FIG. 3 (c) shows the letter O of the alphabet as mark 2. In this case as well, when the letter O is erected, the ridge 2a and the ridge 2b are provided with a 45-degree slope that rises to the right. Are formed respectively. In addition to the above, various characters, symbols, and other designs may be formed in a pattern of the convex ridges 2a and the concave ridges 2b that are obliquely inclined. Also, the second
A grid-like pattern as shown in FIG.

〔The invention's effect〕

In the present invention, a pattern in which a concave shape and a convex shape are obliquely inclined with respect to the erect image of the mark to be imprinted is formed as a basic pattern, and plating is performed by a high leveling plating method so that the shape of these irregularities is raised. I am trying to apply. Therefore, compared to the case of forming a plating layer with the same thickness as the work surface around the mark as in the conventional high-leveling plating method, the mark is easier to identify because the plating layer itself has irregularities. The display will also be clear. In addition, since the basic pattern of the mark is formed by ridges and valleys running obliquely to the erect image of the mark, irregular reflection due to unevenness is identified from all ranges other than the direction in which these stripes run. it can. Therefore,
You can check the mark from a wide range of points of view,
A display that makes the mark stand out can be made by a synergistic effect with the gloss of the plating layer while keeping the unevenness.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a surface portion of a work for illustrating a process of the marking method of the present invention, FIG. 2 is a diagram showing an example of a pattern of convex and concave lines for displaying a mark, and FIG. a) is a diagram showing a T-shaped pattern, FIG. 3 (b) is a longitudinal sectional view of a ridge and a valley viewed in the direction of the arrow in FIG. 3 (a), and FIG. 3 (c).
FIG. 4 is a diagram showing a pattern when an O-shaped mark is formed, FIG. 4 is a cross-sectional view of a work surface showing a conventional stamping plating process, and FIG. 5 is a diagram showing a high-leveling plating process. 1: Work 2: Mark, 2a: Convex stripe 2b: Concave stripe 3: Plating layer D: Depth, P: Pitch

Claims (2)

(57) [Claims] 1. A method according to claim 1, wherein the workpiece or the surface of the workpiece after machine cutting is stamped with a basic pattern of a ridge (2a) and a ridge (2b) for drawing a mark (2). High leveling plating to make the thickness of the plating layer 3 thinner than
A marking method in high-leveling plating, characterized in that the surface shape of the irregularities is raised along the irregularities of the convex stripes (2a) and the concave stripes (2b). 2. The marking method according to claim 1, wherein the basic pattern is formed by obliquely sloping the concave and convex ridges with respect to the erect image of the mark to be engraved.