JP3012356U - Shield case structure - Google Patents

Abstract

(57) [Abstract] [Purpose] The structure of a shield case to be mounted on a printed circuit board, which can be easily attached and detached, and which does not require an expensive soldering device for laser heating, and solders parts etc. Shield case structure that can be attached with a soldering iron. A structure of a shield case in which a plurality of mounting legs 2 to be soldered and attached to a shield case 1 are provided, and slits 3 are provided on both sides of the mounting legs 2 to reduce heat diffusion during soldering.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to the shape structure of a shield case mounted on a printed circuit board.

[0002]

[Prior art]

 There are roughly two ways to attach the shield case to the printed circuit board. One of them is a drawing for explaining one embodiment for mounting the shield case on the printed circuit board as shown in FIG. 2, and the other mounting structure is the shield case shown in FIG. 3 on the printed circuit board. Some of the drawings are for illustration of other embodiments for mounting.

The structure of the shield case mounted on the printed circuit board of FIG. 2 will be described. In the figure, 1 is a shield case, 2 is a mounting leg portion of the shield case 1, 4 is a printed circuit board, and 6 is a mounting hole through which the mounting leg portion 2 of the shield case 1 is inserted.

To mount the shield case 1 on the printed circuit board 4, first, the mounting leg portions 2 of the shield case 1 are inserted into the mounting holes 6 of the printed circuit board 4 and soldered in this state. This soldering includes soldering on the side where the shield case is mounted and soldering on the side of the circuit pattern that is the other side of the printed circuit board.

Although it is easy to attach the shield case to the printed circuit board by the method of FIG. 2, the mounting hole 6 must be provided in the printed circuit board 4 instead, so that the mounting hole 6 should be avoided. It is necessary to design a circuit that circulates the circuit pattern.

FIG. 3 shows a mounting structure in which all the contact surfaces of the shield case 1 are soldered to the printed circuit board 4, and such soldering processing requires soldering equipment such as laser heating. This laser-heated soldering device is very expensive, so the equipment cost is high. Moreover, the solder may be removed from the shield case 1 for repair or the like, and the circuit pattern and attached parts may be damaged by heating each time the solder is refilled.

[0007]

[Problems to be solved by the device]

 In the structure in which the mounting legs of the shield case are mounted on the printed circuit board as described above, the printed circuit board must have mounting holes. For this reason, the circuit pattern must be routed avoiding the mounting holes. Also, in the case of a method of soldering on the entire contact surface of the shield case that contacts the printed circuit board of another method, an expensive soldering device by laser heating or the like is required. This is a shield case structure that can be easily mounted with a normal soldering iron and can be mounted on the printed circuit board without the need for mounting holes.

[0008]

[Means for Solving the Problems]

 The shield case to be mounted on the printed circuit board has a plurality of mounting legs that are mounted by soldering on the side that contacts the printed circuit board.The mounting legs are soldered on both sides of the mounting leg from the end of the shield case. This structure has slits to reduce the heat diffusion at the time.

[0009]

[Action]

 The slits in the shield case are deeply cut to reduce heat diffusion. Therefore, the mounting legs are directly soldered to the ground pattern of the printed circuit board, but the heat diffusion between the ground pattern of the printed circuit board and the shield case is mainly conducted from the shield case, but the mounting legs sandwiched by the slits. In this case, heat is conducted to the shield case body after the heat is conducted from the end of the thin mounting leg between the slits to the end of the slit, so the soldering process for the mounting leg is performed using the soldering iron for general parts. Soldering can be done by.

[0010]

EXAMPLE FIG. 1 is a perspective view of a shield case according to the present invention mounted on a printed circuit board. The figure will be described. In the figure, 1 is a shield case, 2 is a mounting leg, 3 is a slit for preventing heat diffusion during soldering, 4 is a printed circuit board, and 5 is solder.

A ground pattern (not shown) is provided on the component mounting surface of the printed circuit board 4, and the ground pattern is provided so as to face the plurality of mounting legs 2 of the shield case 1. Soldering is performed with the ground pattern of the printed circuit board 4 and the mounting legs 2 of the shield case 1 in contact with each other. At this time, the mounting leg portion 2 and the ground pattern of the printed circuit board 4 are fixed by melted solder. Even if heat is conducted to the shield case 1 side and escapes, since there are deeply cut slits on both sides of the mounting leg 2, heat conduction limited by the width of the mounting leg 2 is a normal component. A soldering iron for soldering etc. is enough. Therefore, the shield case 1 can be easily attached and detached at the time of repair or adjustment. The length of the mounting leg portion 2 may be the same as the length of the shield case 1 up to the printed circuit board 4, or may be longer than that and bent by an amount corresponding to a longer length to be soldered.

[0012]

[Effect of device]

 Since the mounting legs according to the present invention are provided with slits on both sides to reduce heat conduction, soldering can be facilitated. Therefore, an ordinary soldering iron for soldering components etc. can be sufficiently used without the need for an expensive soldering device by laser heating as in the case of soldering the entire contact surface. In addition, since there is no mounting hole for inserting the mounting legs of the shield case on the printed circuit board, it is not necessary to avoid routing the circuit pattern through the mounting hole. It is simplified and leads to cost reduction. In addition, there is a practical advantage that the work can be performed without damaging other parts and circuit patterns even when the shield case is attached and detached for maintenance.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which a shield case according to the present invention is mounted on a printed circuit board.

FIG. 2 is a drawing for explaining an embodiment for mounting a shield case of the related art on a printed circuit board.

FIG. 3 is a view for explaining another embodiment for mounting a shield case according to the related art on a printed circuit board.

[Explanation of symbols]

 1 Shield case 2 Mounting leg 3 Slit 4 Printed circuit board 5 Solder 6 Mounting hole

Claims (1)

[Scope of utility model registration request] 1. A structure of a shield case to be mounted on a printed circuit board, wherein a plurality of mounting leg parts to be mounted on the printed circuit board by soldering are provided on the side of the shield case that contacts the printed circuit board surface, and the mounting leg parts. The structure of the shield case is characterized in that slits are provided on both sides of the mounting leg from the end of the shield case to reduce heat diffusion during soldering.