JP3059689B2 - Manufacturing method of wiring board - Google Patents
Manufacturing method of wiring boardInfo
- Publication number
- JP3059689B2 JP3059689B2 JP9128316A JP12831697A JP3059689B2 JP 3059689 B2 JP3059689 B2 JP 3059689B2 JP 9128316 A JP9128316 A JP 9128316A JP 12831697 A JP12831697 A JP 12831697A JP 3059689 B2 JP3059689 B2 JP 3059689B2
- Authority
- JP
- Japan
- Prior art keywords
- dry film
- resin
- manufacturing
- wiring board
- resin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は配線基板の製造方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wiring board.
【０００２】[0002]
【従来の技術】図３により従来の配線基板の製造方法を
説明する。まず、図３(ａ)に示すように、樹脂板１に穴
２を設け、中心線が穴２の中心線と一致した孔３ａを有
するシルクスクリーン（孔版）３を樹脂板１の表面上に
位置させ、スキージにより導電ペースト４を穴２内に充
填する。この場合、樹脂板１とシルクスクリーン３との
間に隙間ができるから、導電ペースト４が穴２の周囲の
樹脂板１の表面とシルクスクリーン３との間に広がって
しまう。つぎに、図３(ｂ)に示すように、シルクスクリ
ーン３を除去したのち、熱処理を行なって導電ペースト
４を焼結して導電体５としたのち、研磨により穴２の周
囲に広がった導電体５を除去する。つぎに、樹脂板１の
両面に導電体５と接続された配線層（図示せず）を形成
する。2. Description of the Related Art A conventional method for manufacturing a wiring board will be described with reference to FIG. First, as shown in FIG. 3A, a hole 2 is provided in a resin plate 1, and a silk screen (stencil) 3 having a hole 3 a whose center line coincides with the center line of the hole 2 is placed on the surface of the resin plate 1. The hole 2 is filled with the conductive paste 4 by a squeegee. In this case, since a gap is formed between the resin plate 1 and the silk screen 3, the conductive paste 4 spreads between the surface of the resin plate 1 around the hole 2 and the silk screen 3. Next, as shown in FIG. 3B, after the silk screen 3 is removed, a heat treatment is performed to sinter the conductive paste 4 to form a conductor 5, and then the conductive material spread around the hole 2 by polishing. The body 5 is removed. Next, a wiring layer (not shown) connected to the conductor 5 is formed on both surfaces of the resin plate 1.
【０００３】[0003]
【発明が解決しようとする課題】しかし、このような配
線基板の製造方法においては、穴２の周囲に広がった導
電体５を除去しなければならないから、製造作業が面倒
である。However, in such a method of manufacturing a wiring board, since the conductor 5 extending around the hole 2 must be removed, the manufacturing operation is troublesome.
【０００４】本発明は上述の課題を解決するためになさ
れたもので、製造作業を容易に行なうことができる配線
基板の製造方法を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to provide a method of manufacturing a wiring board which can easily perform a manufacturing operation.
【０００５】[0005]
【課題を解決するための手段】この目的を達成するた
め、本発明においては、基板材料の表面にドライフィル
ムを設け、上記ドライフィルムおよび上記基板材料に穴
を設け、上記穴内に導電ペーストを充填し、上記導電ペ
ーストを焼結し、上記ドライフィルムを除去する。In order to achieve this object, in the present invention, a dry film is provided on the surface of a substrate material, holes are provided in the dry film and the substrate material, and a conductive paste is filled in the holes. Then, the conductive paste is sintered, and the dry film is removed.
【０００６】また、基板材料の表面にドライフィルムを
設け、上記ドライフィルムおよび上記基板材料に穴を設
け、上記穴内に流動性を有する樹脂を充填し、上記流動
性を有する樹脂を熱処理して固体樹脂とし、上記ドライ
フィルムを除去する。Also, a dry film is provided on the surface of the substrate material, holes are provided in the dry film and the substrate material, a fluid resin is filled in the holes, and the fluid resin is heat-treated to form a solid. The resin and the dry film are removed.
【０００７】[0007]
【発明の実施の形態】図１により本発明に係る配線基板
の製造方法を説明する。まず、図１(ａ)に示すように、
樹脂板１１の裏面に銅箔１２を設け、樹脂板１１の表面
にドライフィルム１３を設け、選択的にレーザ光線を照
射することにより、ドライフィルム１３および樹脂板１
１に穴１４、１５を設ける。この場合、銅箔１２には穴
が設けられることはない。つぎに、図１(ｂ)に示すよう
に、スキージにより穴１４、１５内に導電ペースト１６
を充填する。つぎに、図１(ｃ)に示すように、１７０
℃、３時間の熱処理を行なうことにより、導電ペースト
１６を焼結して導電体１７とする。この場合、導電体１
７の容積は導電ペースト１６の容積よりも小さくなる。
つぎに、図１(ｄ)に示すように、ドライフィルム１３の
表面を研磨し、薬液でドライフィルム１３を除去したの
ち、研磨により樹脂板１１の表面から突出した導電体１
７を除去する。つぎに、樹脂板１１の両面に導電体１７
と接続された配線層（図示せず）を形成する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a wiring board according to the present invention will be described with reference to FIG. First, as shown in FIG.
The copper foil 12 is provided on the back surface of the resin plate 11, the dry film 13 is provided on the surface of the resin plate 11, and the dry film 13 and the resin plate 1 are selectively irradiated with a laser beam.
1 are provided with holes 14 and 15. In this case, the copper foil 12 is not provided with a hole. Next, as shown in FIG. 1B, a conductive paste 16 is formed in the holes 14 and 15 with a squeegee.
Fill. Next, as shown in FIG.
By conducting heat treatment at a temperature of 3 ° C. for 3 hours, the conductive paste 16 is sintered to form a conductor 17. In this case, the conductor 1
The volume of 7 is smaller than the volume of the conductive paste 16.
Next, as shown in FIG. 1D, the surface of the dry film 13 is polished, and the dry film 13 is removed with a chemical solution.
7 is removed. Next, conductors 17 are provided on both surfaces of resin plate 11.
To form a wiring layer (not shown) connected to the substrate.
【０００８】この配線基板の製造方法においては、樹脂
板１１の表面とドライフィルム１３とが密着するから、
穴１５の周囲に導電体１７が広がることがないので、樹
脂板１１の表面から突出した導電体１７を除去する作業
を容易に行なうことができるため、製造作業を容易に行
なうことができる。また、シルクスクリーン、メタルマ
スクなどを用いる必要がないから、導電体１７が設けら
れるピッチを非常に小さくすることができるとともに、
穴１４、１５の径が複数の値のときにも、容易に製造す
ることができる。In this method of manufacturing a wiring board, since the surface of the resin plate 11 and the dry film 13 are in close contact with each other,
Since the conductor 17 does not spread around the hole 15, the operation of removing the conductor 17 protruding from the surface of the resin plate 11 can be easily performed, so that the manufacturing operation can be easily performed. Further, since it is not necessary to use a silk screen, a metal mask, or the like, the pitch at which the conductors 17 are provided can be made extremely small, and
Even when the diameters of the holes 14 and 15 are a plurality of values, it can be easily manufactured.
【０００９】なお、導電体１７の容積と導電ペースト１
６の容積との関係を考慮してドライフィルム１３の厚さ
を定めれば、導電体１７の上面と樹脂板１１の表面とを
同一面とすることができ、この場合にはドライフィルム
１３の除去後の導電体１７の研磨作業が不要となるか
ら、製造作業を極めて容易に行なうことができる。The volume of the conductor 17 and the conductive paste 1
If the thickness of the dry film 13 is determined in consideration of the relationship with the volume of the dry film 6, the upper surface of the conductor 17 and the surface of the resin plate 11 can be flush with each other. Since the polishing work of the conductor 17 after the removal is not required, the manufacturing work can be performed very easily.
【００１０】つぎに、図２により本発明に係る他の配線
基板の製造方法を説明する。まず、図２(ａ)に示すよう
に、樹脂板２１の裏面に銅箔２２を設け、樹脂板２１の
表面にドライフィルム２３を設け、選択的にレーザ光線
を照射することにより、ドライフィルム２３および樹脂
板２１に穴２４、２５を設ける。この場合、銅箔２２に
は穴が設けられることはない。つぎに、図２(ｂ)に示す
ように、スキージにより穴２４、２５内に流動性を有す
る樹脂２６を充填する。つぎに、図２(ｃ)に示すよう
に、熱処理を行なうことにより、流動性を有する樹脂２
６を固体樹脂２７とする。この場合、固体樹脂２７の容
積は流動性を有する樹脂２６の容積よりも小さくなる。
つぎに、図２(ｄ)に示すように、ドライフィルム２３の
表面を研磨し、薬液でドライフィルム２３を除去したの
ち、研磨により樹脂板２１の表面から突出した固体樹脂
２７を除去する。つぎに、樹脂板２１の両面に配線層
（図示せず）を形成する。Next, another method of manufacturing a wiring board according to the present invention will be described with reference to FIG. First, as shown in FIG. 2A, a copper foil 22 is provided on the back surface of a resin plate 21, a dry film 23 is provided on the surface of the resin plate 21, and the dry film 23 is selectively irradiated with a laser beam. Further, holes 24 and 25 are provided in the resin plate 21. In this case, no holes are provided in the copper foil 22. Next, as shown in FIG. 2B, the holes 24 and 25 are filled with a fluid resin 26 by a squeegee. Next, as shown in FIG. 2 (c), heat treatment is performed to obtain a resin 2 having fluidity.
6 is a solid resin 27. In this case, the volume of the solid resin 27 is smaller than the volume of the resin 26 having fluidity.
Next, as shown in FIG. 2D, the surface of the dry film 23 is polished, the dry film 23 is removed with a chemical solution, and then the solid resin 27 projecting from the surface of the resin plate 21 is removed by polishing. Next, wiring layers (not shown) are formed on both surfaces of the resin plate 21.
【００１１】この配線基板の製造方法においては、樹脂
板２１の表面とドライフィルム２３とが密着するから、
穴２５の周囲に固体樹脂２７が広がることがないので、
樹脂板２１の表面から突出した固体樹脂２７を除去する
作業を容易に行なうことができるため、製造作業を容易
に行なうことができる。In this method of manufacturing a wiring board, since the surface of the resin plate 21 and the dry film 23 are in close contact with each other,
Since the solid resin 27 does not spread around the hole 25,
Since the operation of removing the solid resin 27 protruding from the surface of the resin plate 21 can be easily performed, the manufacturing operation can be easily performed.
【００１２】なお、固体樹脂２７の容積と流動性を有す
る樹脂２６の容積との関係を考慮してドライフィルム２
３の厚さを定めれば、固体樹脂２７の上面と樹脂板２１
の表面とを同一面とすることができ、この場合にはドラ
イフィルム２３の除去後の固体樹脂２７の研磨作業が不
要となるから、製造作業を極めて容易に行なうことがで
きる。In consideration of the relationship between the volume of the solid resin 27 and the volume of the resin 26 having fluidity, the dry film 2
3, the upper surface of the solid resin 27 and the resin plate 21
Can be made the same surface, and in this case, the polishing work of the solid resin 27 after the removal of the dry film 23 becomes unnecessary, so that the manufacturing work can be performed extremely easily.
【００１３】また、上述実施の形態においては、選択的
にレーザ光線を照射することにより、ドライフィルム１
３および樹脂板１１に穴１４、１５を設け、またドライ
フィルム２３および樹脂板２１に穴２４、２５を設けた
が、他の方法によりドライフィルムおよび基板材料に穴
を設けてもよい。また、上述実施の形態においては、基
板材料として樹脂板１１、２１を用いたが、他の基板材
料を用いてもよい。また、上述実施の形態においては、
樹脂板１１、２１に樹脂板１１、２１を貫通する穴１
５、２５を設けたが、基板材料に基板材料を貫通しない
穴を設けてもよい。In the above embodiment, the dry film 1 is selectively irradiated with a laser beam.
Although holes 14 and 15 are provided in 3 and resin plate 11 and holes 24 and 25 are provided in dry film 23 and resin plate 21, holes may be provided in the dry film and the substrate material by other methods. Further, in the above-described embodiment, the resin plates 11 and 21 are used as substrate materials, but other substrate materials may be used. In the above embodiment,
Holes 1 penetrating resin plates 11 and 21 in resin plates 11 and 21
Although 5 and 25 are provided, a hole which does not penetrate the substrate material may be provided in the substrate material.
【００１４】[0014]
【発明の効果】本発明に係る配線基板の製造方法におい
ては、基板材料の表面とドライフィルムとが密着するか
ら、穴の周囲に導電体、固体樹脂が広がることがないの
で、基板材料の表面から突出した導電体、固体樹脂を除
去する作業を容易に行なうことができるため、製造作業
を容易に行なうことができる。In the method for manufacturing a wiring board according to the present invention, since the surface of the substrate material and the dry film are in close contact with each other, the conductor and the solid resin do not spread around the hole, so that the surface of the substrate material does not spread. Since the operation of removing the conductor and the solid resin protruding from the substrate can be easily performed, the manufacturing operation can be easily performed.
【図１】本発明に係る配線基板の製造方法の説明図であ
る。FIG. 1 is an explanatory diagram of a method for manufacturing a wiring board according to the present invention.
【図２】本発明に係る他の配線基板の製造方法の説明図
である。FIG. 2 is an explanatory diagram of a method for manufacturing another wiring board according to the present invention.
【図３】従来の配線基板の製造方法の説明図である。FIG. 3 is an explanatory diagram of a conventional method for manufacturing a wiring board.
１１…樹脂板 １３…ドライフィルム １４…穴 １５…穴 １６…導電ペースト １７…導電体 ２１…樹脂板 ２３…ドライフィルム ２４…穴 ２５…穴 ２６…流動性を有する樹脂 ２７…固体樹脂 DESCRIPTION OF SYMBOLS 11 ... Resin plate 13 ... Dry film 14 ... Hole 15 ... Hole 16 ... Conductive paste 17 ... Conductor 21 ... Resin plate 23 ... Dry film 24 ... Hole 25 ... Hole 26 ... Resin which has fluidity 27 ... Solid resin
Claims (2)
上記ドライフィルムおよび上記基板材料に穴を設け、上
記穴内に導電ペーストを充填し、上記導電ペーストを焼
結し、上記ドライフィルムを除去することを特徴とする
配線基板の製造方法。A dry film is provided on a surface of a substrate material,
A method of manufacturing a wiring board, comprising: providing holes in the dry film and the substrate material; filling the holes with a conductive paste; sintering the conductive paste; and removing the dry film.
上記ドライフィルムおよび上記基板材料に穴を設け、上
記穴内に流動性を有する樹脂を充填し、上記流動性を有
する樹脂を熱処理して固体樹脂とし、上記ドライフィル
ムを除去することを特徴とする配線基板の製造方法。2. A dry film is provided on a surface of a substrate material,
Wiring characterized by providing a hole in the dry film and the substrate material, filling the hole with a resin having fluidity, heat-treating the resin having fluidity into a solid resin, and removing the dry film. Substrate manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9128316A JP3059689B2 (en) | 1997-05-19 | 1997-05-19 | Manufacturing method of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9128316A JP3059689B2 (en) | 1997-05-19 | 1997-05-19 | Manufacturing method of wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10322018A JPH10322018A (en) | 1998-12-04 |
| JP3059689B2 true JP3059689B2 (en) | 2000-07-04 |
Family
ID=14981766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9128316A Expired - Fee Related JP3059689B2 (en) | 1997-05-19 | 1997-05-19 | Manufacturing method of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3059689B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100723270B1 (en) | 2005-12-13 | 2007-05-30 | 전자부품연구원 | Multi-layer printed circuit board manufacturing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2601128B2 (en) | 1992-05-06 | 1997-04-16 | 松下電器産業株式会社 | Method of manufacturing circuit forming substrate and circuit forming substrate |
-
1997
- 1997-05-19 JP JP9128316A patent/JP3059689B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2601128B2 (en) | 1992-05-06 | 1997-04-16 | 松下電器産業株式会社 | Method of manufacturing circuit forming substrate and circuit forming substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10322018A (en) | 1998-12-04 |
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