JP2930061B2 - Electronic component mounting position adjustment jig - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for adjusting a position when an electronic component employing a BGA package is mounted on a circuit board.

[0002]

2. Description of the Related Art Among electronic components, in particular, in semiconductor devices such as integrated circuits, the number of terminals is remarkably increased with the advancement of functions, so that a narrower terminal pitch of a package is strongly required. The B was developed to meet this demand.
This is a package for electronic components called a GA (ball grid array) package. FIG. 7 is a perspective view showing an example of a BGA package. As shown in FIG. 1, in the BGA package 100, a large number of solder bumps 1 are formed on the lower surface 102 of the package body portion 101.
04 are arranged as terminals. A circuit board on which a BGA component employing such a BGA package 100 is mounted has a large number of bumps 1 on the BGA package 100.
Numerous lands are formed corresponding to the BGA
When mounting the components, the BGA components are arranged such that the bumps 104 of the BGA package 100 match the positions of the lands on the circuit board, and are soldered by a reflow device or the like so that the BGA components are mounted on the circuit board. It is attached. By the way, the bump 104 of the BGA package 100
In general, when arranging BGA components on a circuit board, it is necessary to accurately align the bumps 104 of the BGA package 100 with the lands of the circuit board.

When mass-producing electronic devices using BGA components, usually, the BGA components are automatically arranged on a circuit board by a component mounting machine. In this case, the component mounting machine arranges the BGA component at a required position based on given position data based on a specific position on the circuit board. FIG. 8 is an explanatory diagram showing an example of the relationship between the reference position on the circuit board and the position where the BGA components are arranged. In this example, the lower left corner 108 of the circuit board 106 is a reference position, and the component mounting machine uses this position as a reference, that is, data of x coordinate values indicating the arrangement position of the BGA component 110 with the origin as an origin, That is, position data Δx and y coordinate value data, that is, position data Δy are given, and the component mounting machine arranges the BGA component 110 on the circuit board 106 based on these data.

FIG. 9 shows a BGA component 11 by a component mounting machine.
FIG. 9 is an explanatory diagram showing a state of positioning of 0. In the component mounting machine, first, a suction unit (not shown) is brought into contact with the upper surface of the BGA component 110, and the BGA component 110 is sucked and lifted.
Circuit board 1 representing A component 110 by position data Δx, Δy
The sheet is conveyed to a position near the position on the line 06. Thereafter, for example, a component mounting machine without a BGA image recognition function as disclosed in Japanese Patent Application Laid-Open No. 7-273148 makes the four restricting claws 112 abut on the four sides of the BGA component 110, respectively. By appropriately moving each regulating claw 112 in the direction of arrow A, the position of the BGA component 110 is made to exactly match the position represented by the position data Δx, Δy,
The suction is canceled and the BGA component 110 is arranged at that position. In FIG. 9, it is moved from the position indicated by the dotted line to the position indicated by the solid line as indicated by the arrow B.

When the BGA component 110 is placed on the circuit board 106 by the component mounting machine, the component mounting machine positions the BGA component 110 on the basis of the position data as described above. It is necessary to give position data appropriately to the component mounting machine in order to accurately arrange at the required position. by the way,
The positions of the lands formed on the circuit board are slightly different from those of the design due to an error in the production of the circuit board. Therefore, appropriate position data according to the circuit board must be provided to the component mounting machine for each lot of the circuit board.

Therefore, conventionally, a BGA has been used by a component mounting machine.
Repeat the process of arranging the components on the circuit board, checking the gap between the BGA package bump and the land of the circuit board, and correcting the position data given to the component mounting machine based on the results. Thus, the correct position data was set for the component mounting machine.

However, as can be seen from FIG. 7, since each bump 104 is formed on the lower surface 102 of the BGA package 100, when the BGA component is arranged on the circuit board, each bump 104 is formed on each land. It is not possible to visually determine whether or not they are accurately positioned. Therefore, conventionally, after placing a BGA component on a circuit board by a component mounting machine, the BGA component is removed, and a fine trace formed by the bump 104 abutting on the land of the circuit board is formed by an operator. Saw that the extent of the displacement was inferred and the position data was corrected.

[0008]

However, since the correction work of such position data largely depends on the intuition and experience of the worker, only a skilled worker can perform the work. In some cases, it took a long time to obtain the product, and the production line could not be started up as scheduled. Further, it is not preferable to mount a BGA component, which is a high-value-added electronic component, on a circuit board repeatedly for alignment in order to ensure product quality.

For example, as disclosed in Japanese Patent Application Laid-Open No. 7-273148, when a BGA component is placed on a circuit board by a component mounting machine, an image of the lower surface of the BGA package is photographed with a television camera. Although it is possible to correct the position data by grasping the positional relationship between the bumps of the BGA package and the lands of the circuit board from the image data, the apparatus becomes large-scale and expensive. Also, a BGA placed on a circuit board using an X-ray inspection machine
Although it is possible to see the positional relationship between the bumps and the lands by seeing through the components, in this case, too, the apparatus becomes large-scale and costs are required.

The present invention has been made to solve such a problem, and an object of the present invention is to mount an electronic component which can easily and at low cost and align a BGA component with a circuit board without skill. An object of the present invention is to provide a position adjusting jig.

[0011]

In order to achieve the above object, an electronic component mounting position adjusting jig according to the present invention provides an electronic component to be mounted on a circuit board in a package body portion excluding a BGA package bump. It has substantially the same shape and dimensions as the outer shape, is formed of a transparent material, has a lower surface corresponding to the bump forming surface of the package body portion, the lower surface is formed flat, and Positioning marks are formed at positions corresponding to positions of a plurality of bumps selected from all the bumps of the BGA package, the bumps of the BGA package are arranged in a rectangular matrix, and the positioning marks are formed on the lower surface. The positions where the use marks are formed include positions corresponding to the positions of the bumps arranged at the four corners of the rectangular matrix. .

When the electronic component mounting position adjusting jig of the present invention is used, since the jig is formed of a transparent material, the positioning mark on the lower surface thereof coincides with the land on the circuit board. It can be clearly checked from the upper surface side of the jig whether it is present or not, and if it is misaligned, its direction and degree can be accurately measured. Therefore, by setting the degree of displacement between the land and the positioning mark within an allowable range, the bump of the actual BGA component and the land on the circuit board can be accurately matched.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described based on embodiments with reference to the drawings. FIG. 1 is a perspective view showing an example of an electronic component mounting position adjusting jig according to the present invention. The electronic component mounting position adjusting jig 2 (hereinafter, also simply referred to as the mounting position adjusting jig 2) has a shape and a dimension corresponding to a bump of a BGA package of an electronic component (BGA component) to be mounted on a circuit board. Are substantially the same as the outer shape and dimensions of the package body except for the above. In the present embodiment, the shape is formed in a substantially square plate shape. The lower surface 4 corresponding to the bump forming surface of the BGA component is flat. The mounting position adjusting jig 2 is formed of a transparent material, and the lower surface 4 side can be seen from the upper surface 6 side. Specific materials include glass, acrylic,
Alternatively, polycarbonate or the like can be used.

Positioning marks are formed on the lower surface 4 of the mounting position adjusting jig 2 at positions corresponding to the positions of a plurality of bumps selected from all the bumps of the BGA package of the electronic component mounted on the substrate. Have been. In the example shown,
These positioning marks are filled circles 8. In the present embodiment, the bumps of the BGA package of the electronic component are arranged so as to form a rectangular matrix, similarly to the case of the BGA component shown in FIG. 8, and the plurality of selected bumps correspond to the rectangular matrix. Bumps arranged at four corners. Therefore, the circles 8 are formed at the positions corresponding to the positions of the four bumps at the four corners. In this embodiment, the diameter of the circle 8 is slightly smaller than the diameter of each land on the circuit board on which each bump is arranged.

Next, mounting of an electronic component using such a mounting position adjusting jig 2 will be described. FIG. 2 is a flowchart illustrating a mounting position adjusting method of the electronic component according to the embodiment. First, the mounting position adjusting jig 2 is set in the component mounting machine instead of the BGA component, and the mounting position adjusting jig 2 is arranged on the circuit board (step S1 in FIG. 2). here,
Position data Δx based on the design values in advance for the component mounting machine,
Δy is given. Therefore, the component mounting machine, based on the position data, as described above with reference to FIG.
The mounting position adjusting jig 2 is disposed with reference to the corner position of the circuit board.

FIG. 3 is a perspective view showing the mounting position adjusting jig 2 thus arranged on the circuit board. On the circuit board 12, lands 10 for connecting bumps of a BGA package are arranged in a rectangular row, and the mounting position adjusting jig 2 is arranged thereon.

Next, the operator observes the mounting position adjusting jig 2 arranged on the circuit board 12 by the component mounting machine, and sees the mounting position adjusting jig 2 from the upper surface side to the lower surface side, and mounts. It is determined whether the four circles 8 of the position adjustment jig 2 are shifted from the positions of the four lands 10 at which the four corner bumps of the bumps of the BGA package are to be arranged thereon (step). S2). Then, as shown in FIG. 4, those four lands 10 located at the four corners of the rectangular matrix
On the other hand, when the positions of the four circles 8 are shifted (in the case of Yes in step S2), the worker visually measures the direction and degree of the shift of the circles 8 with respect to the lands 10 (step S2). S3) Then, the mounting position adjusting jig 2
Is removed from the circuit board 12 and set on the component mounting machine again (step S4). Subsequently, the position data Δx and Δy are corrected based on the result of the visual measurement in step S3 so that the circle 8 matches the land 10 (step S3).
5) Return to step S1 and again mount position adjusting jig 2
Are arranged on the circuit board 12 based on the corrected position data.

The operator repeats such a procedure several times to keep the deviation within an allowable range and to change the positions of the four circles 8 formed on the lower surface 4 of the mounting position adjusting jig 2. It becomes possible to match the positions of the corresponding four lands 10 on the circuit board. FIG. 5 is a perspective view showing the mounting position adjusting jig 2 arranged on the circuit board 12 with the circle 8 aligned with the land 10, and FIG. 6 is an enlarged view of the land 10 in this case. FIG. The circle 8 is completely included inside the land 10, and when the operator visually confirms this state in step S2, the positioning operation is completed (No in step S2). As described above, since the circles 8 are formed on the lower surface 4 of the mounting position adjusting jig 2 at positions corresponding to the positions of the four corner bumps of the bumps of the BGA component, after the above-described positioning operation, When the actual BGA components are arranged on the circuit board 12 by the component mounting machine, the bumps of the BGA components are correctly arranged on the lands 10 of the circuit board 12.

As described above, when the mounting position adjusting jig 2 of the present embodiment is used, the circle 8 formed on the lower surface 4 of the jig 2 matches the land 10 on the circuit board 12. It can be clearly checked from the upper surface 6 side of this jig 2 whether it is present or not, and if it is displaced, the degree can be accurately measured. Therefore, by performing the alignment according to the above-described procedure based on the present invention, it is possible to easily and at low cost mounting the BGA component on the circuit board 12 without using an expensive, large-scale apparatus and without skill. Positioning can be performed.

The present invention has been described based on the embodiments. However, this is merely an example, and the present invention can be implemented in various forms without being limited to this example. For example, in this embodiment, four filled circles 8
However, the number of such positioning marks is not limited to four, but can be variously selected, such as two, three, five, and the like. Further, the position of the positioning mark may be a position corresponding to any one of a plurality of bumps in addition to the position corresponding to the position of the bump disposed at the vertex of the virtual rectangular surface. Further, as the positioning marks formed on the mounting position adjusting jig 2, in addition to the filled circles, for example, non-filled circles, double circles, crosses, crosses, etc. may be formed. It is possible.

[0021]

As described above, the electronic component mounting position adjusting jig of the present invention achieves the above object by providing a package body portion of the electronic component to be mounted on a circuit board, excluding a bump of a BGA package. Has a shape and dimensions substantially the same as the outer shape and dimensions of the package, is formed of a transparent material, has a lower surface corresponding to the bump forming surface of the package body portion, the lower surface is formed flat, and the lower surface is Positioning marks are formed at positions corresponding to the positions of a plurality of bumps selected from all the bumps of the BGA package, the bumps of the BGA package are arranged to form a rectangular matrix, and The positions where the positioning marks are formed include positions corresponding to the positions of the bumps arranged at the four corners of the rectangular matrix. To. Therefore, when the electronic component mounting position adjusting jig of the present invention is used, it is determined whether the positioning mark formed on the lower surface of the jig matches the land on the circuit board. The position adjustment jig can be clearly confirmed from the upper surface side, and when it is shifted, its direction and degree can be accurately measured. Therefore, by positioning the component mounting machine using this mounting position adjustment jig, BGA components can be easily and inexpensively mounted on a circuit board at low cost without using expensive, large-scale equipment. Positioning at the time of mounting can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an electronic component mounting position adjusting jig according to the present invention.

FIG. 2 is a flowchart illustrating a procedure for mounting an electronic component according to the embodiment.

FIG. 3 is a perspective view showing a jig for adjusting a mounting position of electronic components arranged on a circuit board.

FIG. 4 is an enlarged plan view showing a location of a land when a circle and a land do not match.

FIG. 5 is a perspective view showing a mounting position adjusting jig for electronic components arranged on a circuit board in a state where a circle matches a land.

FIG. 6 is an enlarged plan view showing a location of a land when a circle and a land coincide with each other.

FIG. 7 shows an electronic component (BGA) employing a BGA package.
It is a perspective view which shows an example of a (part).

FIG. 8 is an explanatory diagram showing an example of a relationship between a reference position on a circuit board and a position where a BGA component is arranged.

FIG. 9 is an explanatory diagram showing how a component mounting machine positions a BGA component.

[Explanation of symbols]

2 ... electronic component mounting position adjustment jig, 8 ... filled circle, 10 ... land, 12 ... circuit board, 100
... BGA package, 101 ... body part, 104 ...
... Bump, 106 circuit board, 108 lower left corner of circuit board, 110 electronic component (BGA component), 112
...... Restricting claws.

Claims (3)

(57) [Claims] 1. An electronic component to be mounted on a circuit board, having substantially the same shape and size as the outer shape and size of a package body except for bumps of a BGA package, formed of a transparent material, The lower surface is formed flat with a lower surface corresponding to a bump forming surface of a package body portion, and is positioned at a position corresponding to a position of a plurality of bumps selected from all the bumps of the BGA package on the lower surface. Marks are formed, and the bumps of the BGA package form a rectangular matrix.
Are arranged at positions where the positioning marks are formed on the lower surface.
The positions are the positions of the bumps arranged at the four corners of the rectangular matrix.
A mounting position adjusting jig including a corresponding position . 2. The positioning mark is filled in.
Circle, unfilled circle, double circle, cross
2. A mark or a cross mark.
A mounting position adjusting jig for the electronic component described . 3. The transparent material is glass, acrylic,
Characterized by being one of polycarbonate
The jig for adjusting a mounting position of an electronic component according to claim 1 .