JP2998751B1 - Ball mounting jig and method - Google Patents

Abstract

A ball is prevented from being displaced when a conductive ball is mounted on an electronic component, and the component is prevented from being broken when an electronic component with a ball is inspected. An apparatus for mounting a conductive ball (3) on an electronic component has a stepped ball holding surface (14) that approximates a curved surface that matches a mounting surface swelled in the longitudinal direction of the electronic component (1) to attract the ball. A ball mounting jig 10 having a structure having suction holes is used. This jig prevents misalignment and mounting errors when the conductive balls 3 are mounted. By using an elastic body, a nozzle and the like for the ball holding surface, a more suitable ball mounting jig 10 is obtained. For the method of mounting the ball, using the jig of the present invention, and by releasing the vacuum suction while the ball is in contact with the mounting surface,
Prevents misalignment and destruction of components. Further, as an application of the present invention, a suitable inspection pin support jig for inspecting an electronic component with a ball is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ball mounting jig used in a ball mounting apparatus for mounting a conductive ball on a wiring board, a semiconductor chip and other electronic components, and a method therefor .

[0002]

2. Description of the Related Art Conventionally, electronic parts have been reduced in size and weight by various methods. In recent years, electronic components have been miniaturized by using conductive balls as external terminals. An example thereof will be described with reference to FIGS.
4A and 4B are schematic views of an electronic component with leads, wherein FIG. 4A is an external perspective view, and FIG. 4B is an enlarged sectional view. FIG.
1 is a schematic view of a CSP (Chip Size Package), in which (a) is an external perspective view and (b) is an enlarged sectional view.

As shown in FIG . 4 , in an electronic component 1 with leads 2, an electrode pad of a semiconductor chip 1a is a gold wire 2
It is connected to the lead 2 via a. Further, as shown in FIG. 11, in the CSP 1b, the conductive balls 3 are directly transferred to the electrode pads of the CSP 1b.

As described above, gold wires 2a and leads 2 are required as external terminals of the semiconductor chip 1a.
Since only the conductive balls 3 are used as the external terminals of the CSP 1b, the CSP 1b is extremely reduced in size and weight. Therefore, CS having conductive balls 3
P1b is in practical use, and further development is expected in the future.

A method for mounting conductive balls will be described as a conventional example with reference to FIG . FIG. 6 is an enlarged sectional view of a main part of a conventional ball mounting jig. In FIG. 1, a ball mounting jig 10 is attached to a mounting portion 11 of a ball mounting device (not shown). The ball mounting jig 10 has a protrusion 1 corresponding to the electrode pad of the CSP 1b.
3 as a plate-like structure. Further, the protrusion 13 has a suction hole 12 for vacuum suction of the conductive ball 3.
Is provided. The virtual ball holding surface formed by connecting the tips of the projections 13 is planar.

When the conductive balls 3 are mounted by the ball mounting apparatus having such a configuration, first, one conductive ball 3 is held on all the projections 13 by vacuum suction. Next, the mounting part 11 is provided with the conductive balls 3.
Is moved to the upper part of the CSP 1b while keeping the position, the position is adjusted and then lowered, the conductive ball 3 is pressed on the CSP 1b coated with an adhesive substance such as a flux or an adhesive, and then the vacuum suction is released. . Finally, the conductive ball 3 is mounted on the CSP 1b by raising the mounting portion 11.

Although not shown, the inspection pin supporting jig of the electronic component inspection apparatus for performing an inspection by abutting an inspection pin on a conductive ball includes a flat main body made of a non-conductive material. A through-hole is provided in the inspection pin support surface corresponding to the point, and the inspection pin protrudes from the through-hole.
The virtual test pin support surface formed by connecting the tips of the test pins is flat.

[0008]

However, due to the miniaturization and weight reduction of electronic components, it has become impossible to secure sufficient strength as electronic components. That is, the mounting surface of the electronic component on which the conductive ball is mounted may be deformed into a curved surface due to warpage, distortion, or the like due to insufficient strength or residual thermal stress in the process.

As described above, when the conductive ball mounting surface is deformed into a curved surface, all of the conductive balls adsorbed on the flat ball holding surface do not come into contact with the mounting surface but are partially contacted. The conductive balls are floating from the mounting surface. Since the floating conductive ball does not contact the adhesive substance, it drops to the mounting surface when the vacuum suction is released. At this time, depending on the condition of the mounting surface, there is a problem that the conductive ball is no longer mounted at a predetermined position, resulting in displacement.

Further, in order to solve the above problem, the mounting surface of the electronic component is corrected for warpage, and the mounting portion is subjected to a large force before releasing the vacuum suction in order to bring the floating conductive ball into contact with the adhesive substance. May be pushed in. At this time, when the mounting surface is largely deformed into a curved surface, since the conductive balls do not uniformly hit each electrode pad, there is a problem that the pressure is not uniform and the conductive balls are not mounted. Further, for example, in a CSP, a large force is locally applied due to a pushing force, and there is a possibility that a semiconductor chip may be broken.

In an electronic component inspection apparatus for performing an inspection by contacting an inspection pin with a conductive ball, when a virtual surface formed by connecting the tips of the conductive ball is a curved surface,
There is a problem that a part of the inspection pin does not contact the conductive ball, so that an accurate inspection cannot be performed. Therefore, when the test pins are strongly contacted with the conductive balls, some test pins are strongly contacted, and in a large semiconductor chip, there is a possibility that an electronic component is broken.

The present invention has been made to solve the above problems.
When mounting conductive balls on electronic components
Ball mounting equipment that can securely mount the ball
The purpose is to provide a device and its method.

[0013]

According to a first aspect of the present invention, there is provided a ball mounting jig for mounting a conductive ball on a wiring board, a semiconductor chip, or other electronic components. A jig body having a stepped ball holding surface approximated to a curved surface of the mounting surface of the electronic component, and a conductive ball mounting position of the electronic component,
It is configured to include suction holes formed in the ball holding surface .

As a result, the conductive balls are almost displaced.
And mount the ball mounting jig at low cost.
Can be

According to a second aspect of the present invention, a button according to the first aspect is provided.
In the jig mounting jig, the jig main body has a ball holding surface.
Forming an elastic body, attached to the back of this elastic body
And a rigid body.

Thus, the delicate curved surface of each electronic component
In response to, for ball holding surface is elastic deformation, more good
Mount conductive balls with high positional accuracy.

According to a third aspect of the present invention, there is provided a ball mounting method comprising:
Balls are mounted on wiring boards, semiconductor chips and other electronic components.
A ball mounting method according to claim 1 or 2, wherein
Using a mounting jig to hold the conductive ball,
While the conductive ball is in contact with the electronic component,
Is a method for releasing the suction at the nozzle.

Thus, the conductive balls can be used for the electronic parts.
Reliable contact with the adhesive substance applied to the mounting surface and displacement
To prevent conductive balls from being mounted more than necessary.
To prevent damage to electronic components.
it can.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. It should be noted that the drawings to be referred to show the size of each component so that the present invention can be understood,
It merely shows the shape and arrangement.
Therefore, the present invention is not limited only to the illustrated example. 1 to 3 show the ball mounting jig upside down to facilitate understanding of the present embodiment.

[0020] A first embodiment will be described with reference to FIG. 1 <First Embodiment>. FIG.
Is a stepped ball mounting jig that approximates the depression in the center.
In the schematic diagram, (a) is a perspective projection view, (b) is A of (a).
It shows the -A 'enlarged sectional view. Not shown
However, the mounting surface of the electronic components has a convex curved surface at the center.
I have.

[0021] In the figure, the ball mounting jig 10 is
As a structure composed of a rectangular flat jig body 10a,
The jig main body 10a has a mounting surface for an electronic component (not shown).
Bode with a concave stepped shape in the center approximated to a curved surface
A holding surface 14. Ma The ball holding surface 14
Is to attach the suction holes 12 drilled corresponding to the ball mounting position.
It is provided.

[0022] In the conventional ball mounting jig 10, a conductive ball
When mounting the tool on a warped CSP, as shown in FIG.
Some of the conductive balls are floating from the mounting surface.
Do not touch the quality. On the other hand, in the first embodiment of the present invention,
In the ball mounting jig 10, the ball holding surface 14
The ball has a shape that approximately matches the mounting surface,
All the conductive balls sucked by the suction holes 12 of the holding surface 14
Is the adhesive substance on the mounting surface of the electronic component
To prevent misalignment of the conductive ball.

[0023] With such a structure, the holding surface
Processing becomes easy and inexpensive ball mounting jig 10 is manufactured.
can do.

[0024] <Second embodiment> FIG. UsingSecondAn embodiment will be described.FIG.
Is a stepped ball mounting jig that approximates the longitudinal depression
(A) is a perspective projection view and (b) is a schematic view of (a).
It shows the AA ′ cross-sectional view. In FIG.
The mounting jig 10 comprises a rectangular flat jig body 10a.
The jig body 10a is provided with an electronic device (not shown).
Approximate a concave surface in the longitudinal direction that matches the mounting surface of the component
Ball holding surface 14 having a stepped shape
You. Also, the ball holding surface 14 has a position corresponding to the ball mounting position.
A correspondingly formed suction hole 12 is provided. like this
With the structure, the processing of the holding surface is easy and
It is possible to manufacture a costly ball mounting jig 10.

[0025] More specifically described, as follows. For example, an electronic component on which conductive balls are mounted has a rectangular shape with a short side of 14 mm and a long side of 20 mm, and two rows of 15 electrode pads in a row at a pitch of 1.27 mm in the long side direction.
It is assumed that they are arranged and that they have a shape warped by 0.05 mm so that the center of the mounting surface of the electronic component protrudes. Note that the outer shape of the electrode pad is 0.6 mm, and the diameter of the conductive ball is 0.55 mm.

When a ball is mounted on the electronic component by using a conventional ball mounting jig 10 having a flat ball holding surface 14, a positional deviation of 0.1 mm or less at the center of the component and 0 mm at the end of the component. .2 mm or more, and there was a problem that a ball mounting error occurred.

[0027] In contrast, as a ball mounting jig 10 according to the embodiment, to form a ball holding surface 14 recessed central portion by providing three stages a step of 0.017 mm.
When the ball was mounted by this ball mounting jig,
All of the conductive balls sucked into the suction holes 12 of the ball holding surface 14 came into contact with the adhesive substance on the mounting surface of the electronic component almost at the time of mounting. As a result, the displacement at the end of the component was within 0.1 mm, and the mounting error of the ball was eliminated.

[0028] <Third embodiment> FIG. UsingThirdAn embodiment will be described.FIG.
FIG. 3 is a side sectional view showing a ball mounting jig with an elastic body.
The ball mounting jig 10 of this embodiment is a flat organic material.
Other elastic body 15 and flat metal, ceramic, etc.
Jig body 10 in which rigid bodies 16 are overlapped and joined
a. Elastic body 1 of jig body 10a
5 matches the mounting surface of an electronic component (not shown).
Has a stepped shape approximating a concave surface in the longitudinal direction
A ball holding surface 14 is provided. Also, the ball holding surface 1
Reference numeral 4 denotes a suction hole 1 that is opened corresponding to the ball mounting position.
2 is provided.

The ball holding surface 14 is elastically deformed at the time of mounting, so that the ball holding surface 14 has a shape that more approximately matches the mounting surface, thereby further preventing the conductive ball from being displaced.
Further, even flat ball holding surface, but to prevent positional displacement by deformation of the elastic body, in the third embodiment,
The conductive ball can be prevented from being displaced more favorably. In addition,
The elastic body 15 and the rigid body 16 may have a shape other than a flat plate shape. (The same applies to the following embodiments.)

[0030] Next, a method of mounting a conductive ball according to the present embodiment will be described with reference to FIGS. FIG.
Shows a side sectional view of a ball mounting jig for a warped CSP. In FIG. 6 , as a method of mounting the conductive balls 3, first, one conductive ball 3 is held in all the suction holes 12 by vacuum suction. Next, the mounting part 11 moves to the upper part of the CSP 1b while holding the conductive ball 3, and after adjusting the position, descends, and the conductive part 3 is placed on the CSP 1b coated with an adhesive such as flux or adhesive. After pressing the ball 3, the vacuum suction is released. Finally, the mounting portion 11 is raised, so that the conductive balls 3
Is mounted on the CSP 1b.

[0031] However, as shown in FIG. 7, CSP1b
When the mounting surface is deformed into a curved surface, the virtual surface formed by connecting the tips of the protrusions 13 becomes a flat surface.
All of the conductive balls 3 adsorbed on the surface cannot come into contact with the mounting surface, and some of the conductive balls 3 float from the mounting surface and do not come into contact with the adhesive substance.

[0032] Therefore, by using either a ball mounting jig according to claim 1 or 2, can be mounting surface of CSP1b is contacted conductive balls be modified into a curved surface on the mounting surface of the CSP1b.

Furthermore, in a state where all of the conductive ball 3 in contact with the mounting surface, by releasing the suction in the suction holes or nozzles, conductive balls 3, the adhesive force of the viscous substance, the temporary fixing to the mounting surface It is mounted without displacement.

Further , since it is not necessary to apply a large force to correct the warpage of the CSP 1b, the conductive ball is pressed more than necessary to the mounting surface, thereby preventing mounting errors and applying unnecessary force. Of the electronic component can be prevented.

In the above-described embodiment, an example in which the present invention is configured under specific conditions has been described. However, the present invention includes various modifications. In addition, although it is a ball mounting jig, its shape and structure are, of course, included in the present invention even if integrated with the mounting portion.

[0036]

As described above, the ball mounting cure of the present invention is
According to the tool, a stepped shape approximating the curved surface of the mounting surface of the electronic component
By using a ball holding surface that matches the surface,
Mount the ball in the correct position without mistake
Can be

Further , the conductive ball is mounted using the ball mounting jig according to the present invention, and in a state where the conductive ball is in contact with the mounting surface, the conductive ball is released from suction by the suction hole or the nozzle. In addition, mounting can be performed without mounting errors, and mounting can be performed without breaking electronic components.

[Brief description of the drawings]

FIG. 1 shows a stepped bow approximating a central depression.
(A) is a perspective projection view, (b)
(A) is an AA 'enlarged sectional view of (a).

FIG. 2 shows a stepped bore approximating a longitudinal depression.
(A) is a perspective projection view,
(B) shows an AA ′ cross-sectional view of (a).

FIG. 3 is a side showing a ball mounting jig with an elastic body .
It is sectional drawing.

FIG. 4 is a schematic view of an electronic component with a lead.
(A) is an external perspective view, and (b) is an enlarged sectional view.
You.

FIG. 5 is a CSP (Chip Size Pack);
(a) is an outline perspective view, and (b) is a schematic view of FIG.
FIG. 3 shows an enlarged sectional view.

FIG. 6 is a view showing a main part of a conventional ball mounting jig.
It is an expanded sectional view.

FIG. 7 is a view showing a ball mounting jig for a warped CSP .
In the side sectional view, shows the side sectional view of the conventional ball mounting jig.
ing.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 1a Semiconductor chip 1b CSP (Chip Size Package) 2 Lead 2a Gold wire 3 Conductive ball 4 Wiring board 10 Ball mounting jig 10a Jig main body 11 Mounting part 12 Suction hole 13 Projection part 14 Ball holding surface 15 Elastic body 16 Rigid body

Claims (3)

(57) [Claims] 1. A ball mounting jig for mounting a conductive ball on a wiring board, a semiconductor chip and other electronic components, comprising: a jig main body having a stepped ball holding surface approximating a curved surface of a mounting surface of the electronic component; Corresponding to the conductive ball mounting position of the electronic component,
A ball mounting jig comprising: a suction hole formed in a ball holding surface . 2. The ball mounting jig according to claim 1 , wherein said jig body comprises an elastic body forming a ball holding surface and a rigid body attached to a back surface of said elastic body. 3. A method for mounting a conductive ball on a wiring board, a semiconductor chip, or another electronic component, comprising: holding the conductive ball by using the ball mounting jig according to claim 1 ; A ball mounting method, wherein the suction in the suction hole or the nozzle is released while the conductive ball is in contact with the electronic component.