JP2979772B2 - Die bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus, in which a raising / lowering operation of a nozzle shaft, a .theta. Rotation operation, and a lateral movement operation of a head portion are performed by a direct motor.

[0002]

2. Description of the Related Art FIG. 3 is a perspective view of a conventional die bonding apparatus for mounting a chip on a substrate. In the figure, reference numeral 100 denotes a head portion having a nozzle shaft 101.
A nozzle 102 is attached to a lower end portion of the nozzle shaft 101, and the chip P of the wafer 103 is sucked to the nozzle 102 and transferred to a substrate 104 such as a lead frame.

[0005] Reference numeral 105 denotes a motor, which rotates the nozzle shaft 101 through a timing belt 106 about the axis thereof to set a rotation angle. The nozzle shaft 101, the motor 105, and the like are held on a lifting plate 108 via a bracket 107. A nut 109 is mounted on the back of the lifting plate 108, and the nut 10
9 is rotated by a motor 111, the lift plate 108 moves up and down, and the wafer 103
The pickup operation of the upper chip P and the mounting operation on the substrate 104 are performed. Reference numeral 112 denotes a vertical linear guide.

Reference numeral 113 denotes a sliding plate, and the linear guide 112 is mounted on the front surface of the sliding plate 113. A nut 114 is mounted on the rear surface of the sliding plate 113. When a ball screw 115 screwed to the nut 114 is rotated by a motor 116, the sliding plate 113 reciprocates in the lateral direction. 117 is a horizontal linear guide.

Next, the operation will be described. The motor 116 is driven to move the sliding plate 113 in the horizontal direction,
Is positioned directly above the chips P on the wafer 103. Next, by driving the motor 111 to move the nozzle 102 up and down, the chip P is sucked and picked up. Next, the motor 116 is driven to move the sliding plate 113 in the horizontal direction Y, and the nozzle 102 is positioned directly above the substrate 104.
Next, by driving the motor 111, the nozzle 102
Is moved up and down, and the chip P is mounted on the substrate 104. During the above operation, by driving the motor 105, the nozzle 10
2 is set.

[0006]

The above-mentioned conventional means includes a rotating operation of the nozzle 102, an elevating operation, and a head unit 10 by a timing belt 106, nuts 109 and 114, ball screws 110 and 115, and linear guides 112 and 117.
0 is performed in the horizontal direction. However, with such mechanical means, the motors 105, 111,
There is a problem that the load on the M. 116 is extremely large, and it is difficult to increase the operation speed.

In order to prevent dust from adhering to the chip P, die bonding is performed in a clean room. However, in the above-mentioned conventional means, the timing belt 106 and the ball screws 110 and 115 are generated due to mechanical friction accompanying driving. Dust, metal powder, belt powder, and grease powder scattered, and the cleanliness of the clean room was likely to be reduced.

Accordingly, an object of the present invention is to provide a die bonding apparatus which can solve the problems of the conventional means.

[0009]

In order to achieve this, the present invention provides a head unit and a first unit for reciprocating the head unit in a lateral direction.
And a second direct motor for moving the head portion up and down, a third direct motor for moving the nozzle shaft up and down, and a third motor for rotating the nozzle shaft by θ about its axis. And a direct motor. And the second
Direct motor inserts the above nozzle shaft at the center
Disk-shaped yoke and provided outside this yoke
Coil, and the third direct motor is
A disk-shaped magnet with the nozzle shaft inserted in the center
And the coil provided outside this magnet
It consists of

[0010]

According to the above construction, the rotating operation of the nozzle, the elevating operation, and the moving operation of the head portion in the horizontal direction are all performed by the direct motor, so that high-speed operation is possible and dust from the parts is generated. Can be eliminated.

[0011]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a die bonding apparatus, and FIG. 2 is an exploded view of a main part. Reference numeral 1 denotes a head unit having a collet-type nozzle 2 for sucking chips P on a wafer 51 as a chip supply unit. 52 is a substrate on which the chip P is mounted. Reference numeral 11 denotes a first direct motor composed of a linear motor,
The head unit 1 is mounted on the slider 13 and moves in the lateral direction Y. Reference numeral 14 denotes a coil provided on the guide 12, and reference numerals 15 and 16 denote a yoke and a magnet provided on the lower surface of the slider 13. The slider 13 is provided with an air hole 17 constituting an air receiver, and slightly floats on the guide 12 to move in the lateral direction Y.

In FIG. 2, reference numeral 21 denotes a second direct motor comprising a linear motor provided in the head unit 1. Reference numeral 22 denotes a yoke on which the nozzle shaft 3 is inserted.
Is installed. The yoke 22 has a disk shape, and has a magnet 23 mounted on the peripheral surface thereof, and a coil 24 provided outside the yoke 22. Therefore, the coil 24
When power is supplied to the nozzle, the nozzle shaft 3 moves up and down in the up-down direction Z, and the nozzle 2 performs an operation of picking up the chips P on the wafer 51 and an operation of mounting the chips on the substrate 52.

Reference numeral 31 denotes a third direct motor comprising a linear motor, in which the nozzle shaft 3 is inserted at the center.
Disc shaped magnet 32, outside of magnet 32
, A core 33 and a coil 34 are provided. A spline 4 is mounted on the nozzle shaft 3,
The spline 4 passes through the center of the magnet 32 so as to be able to move up and down. Therefore, the nozzle shaft 3
It is inserted into the center of the magnet 22 and the magnet 32.
When the coil 34 is energized, the nozzle shaft 3 rotates in the θ direction about its axis.

This die bonding apparatus is configured as described above, and the operation will be described next.

By driving the first direct motor 11,
The head unit 1 is moved directly above the wafer 51. Next, the second direct motor 21 is driven to move the nozzle 2 up and down, and the chips P on the wafer 51 are sucked and picked up. Next, the first direct motor 11 is driven to move the head unit 1 directly above the substrate 52, and the second direct motor 21 is driven to transfer the chip P to the substrate 5.
2 By driving the third direct motor 31 during the above operation, the nozzle shaft 3 is rotated by θ, and the rotation angles of the nozzle 2 and the tip P are set.

This apparatus is similar to the conventional means shown in FIG.
Since no timing belt, nuts, and ball screws are used, the load on the direct motors 11, 21, and 31 is extremely small, and the operation can be performed at a high speed. The degree does not decrease.

In the present invention, the chip P on the wafer 51 is used.
Is transferred to the displacement correction stage, where the X of the chip P is
After the displacement in the Yθ direction is corrected, the chip P is picked up by the head unit 1 and mounted on the substrate 52.

[0019]

As described above , according to the present invention , the load on the direct motor is extremely small, the operation can be performed at high speed, and there is no generation of dust. Also, the second direct motor
A disk-shaped yoke with a nozzle shaft inserted in the center
It consists of a coil provided outside this yoke,
No. 3 direct motor with nozzle shaft inserted in center
Disc-shaped magnet and the outside of this magnet
The center of gravity of the nozzle shaft
Extremely well balanced and therefore on the nozzle shaft
Nozzle shuffling even when moving up and down or rotating at high speed
Is difficult to swing and therefore the chip pick-up operation
・ Stable operations such as mounting operation and rotation angle setting operation at high speed
Can be done.

[Brief description of the drawings]

FIG. 1 is a perspective view of a die bonding apparatus according to the present invention.

FIG. 2 is an exploded view of a main part of a die bonding apparatus according to the present invention.

FIG. 3 is a perspective view of a conventional die bonding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Head part 2 Nozzle 3 Nozzle shaft 11 1st direct motor 21 2nd direct motor 31 3rd direct motor 51 Chip supply part 52 Substrate

──────────────────────────────────────────────────の Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/52

Claims (2)

(57) [Claims] A first direct motor for reciprocating the head portion in a lateral direction, wherein the head portion includes a nozzle shaft having a nozzle, and a second shaft for vertically moving the nozzle shaft. and direct motor, the nozzle shaft includes a third direct motor for rotating θ around its axis, the second direct
The motor is a circle with the nozzle shaft inserted in the center
A plate-shaped yoke and a coil provided outside this yoke
And the third direct motor comprises the nozzle
A disk-shaped magnet with the shaft inserted in the center
Die bonding apparatus to a coil provided in the outside of the magnet, wherein the formation Rukoto. 2. A spline is mounted on the nozzle shaft.
Then, place this spline on the third direct motor.
It is noted that the magnet was penetrated up and down freely in the center.
2. The die bonding apparatus according to claim 1, wherein: