JP2962385B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device, which is characterized in that a semiconductor element is mounted face-down on a circuit board and sealed with a resin.

[0002]

2. Description of the Related Art Conventionally, a semiconductor device is connected to an external terminal of a circuit board one by one from an aluminum electrode provided on the periphery of a semiconductor element by an ultrafine wire of Au or Al, and a package for mechanical protection. The mainstream is to use the one that has been sealed (resin sealed). In general, a semiconductor element molded by epoxy resin is used for packaging. However, Input / Output connected to a semiconductor device such as a memory or a microcomputer.
In a semiconductor element having t (I / O), the package size is increasing with the increase in the number of functions and the chip size and the number of electrode terminals. However, recently, in electronic devices that are becoming smaller, lighter, and thinner, an increase in package size has become a problem. In order to solve this problem, there is a flip-chip mounting method in which the semiconductor element is mounted face down as one of the methods which have been conventionally excellent in the high density mounting of the semiconductor element.

As a conventional method of manufacturing a semiconductor device, a sealing step of the flip chip method will be described with reference to the drawings. 4, 5, 6, and 7 are process diagrams showing a sealing step of a flip chip method in a conventional method of manufacturing a semiconductor device. 4, 5, 6, and 7, 1 is a semiconductor element having a protruding electrode, 2 is a circuit board,
Reference numeral 3 denotes a sealing resin supply nozzle, and reference numeral 4 denotes an epoxy, silicon-based sealing resin, or the like.

Hereinafter, a sealing method in a conventional method for manufacturing a semiconductor device will be described with reference to FIGS. 4, 5, 6, and 7. FIG.

First, as shown in FIGS. 4 (a) and 4 (b), a semiconductor element 1 having a protruding electrode is flip-chip mounted on a circuit board 2 and connected to an electrode on the circuit board 2 by a solder material or the like. The sealing resin supply nozzle 3 is set on the side surface of the semiconductor element 1 for each side, and the sealing resin 4 of epoxy, silicon or the like is supplied while moving in parallel, and the semiconductor element 1 is connected to the semiconductor element 1 by utilizing the capillary phenomenon. The sealing resin 4 is filled in the gap with the circuit board 2.

Next, as shown in FIGS. 5A and 5B, the semiconductor element 1 is sealed on the opposite side surface by the sealing method.
And the circuit board 2 is filled with the sealing resin 4.

Next, as shown in FIGS. 6A and 6B, a gap between the semiconductor element 1 and the circuit board 2 is filled with the sealing resin 4 on the rear side surface by the sealing method.

Finally, as shown in FIGS. 7A and 7B,
According to the sealing method, the sealing resin 4 is inserted into the gap between the semiconductor element 1 and the circuit board 2 on the front surface, which is an unsealed portion.
And the resin is cured to complete the semiconductor device.

[0009]

However, in the conventional method of manufacturing a semiconductor device, the epoxy,
In order to supply the sealing resin 4 made of silicon or the like and supply the sealing resin 4 by utilizing the capillary phenomenon, the sealing resin 4 is provided in a gap between the semiconductor element 1 having the protruding electrodes and the circuit board 2. May be left in the gaps in the process of filling with. In the reliability test of the semiconductor device, the air bubbles cause a leak current defect between the semiconductor elements and a contact failure due to corrosion of the electrode portion of the semiconductor element 1, thereby causing a significant decrease in the reliability of the semiconductor device. Was. For this reason, it is conceivable to remove air bubbles in the gap by using a circuit board having a circuit board provided with an air vent through hole and filling the sealing resin, but in this case, through the air vent through hole from the lower surface of the circuit board, The sealing resin may be dripped, and this process requires a large number of steps.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and manufactures a semiconductor device capable of preventing bubbles generated during a resin sealing step, preventing dripping of a sealing resin, and facilitating a sealing operation. The aim is to provide a method.

[0011]

In order to solve the above-mentioned problems, a method of manufacturing a semiconductor device according to the present invention has the following configuration. That is, a step of mounting on a circuit board having a transmural hole a semiconductor device by a face-down, the sealing resin supply nozzle from the left and right lateral end in the planar direction of the semiconductor element in which the mounting relative to the semiconductor element a step of supplying the sealing resin is filled covering the sealing resin on the periphery of the gap and the semiconductor element and the circuit board having the semiconductor element and the front Kinuki hole while translating,
Wherein a sealing resin is supplied while moving in parallel equipped with a sealing resin supply nozzle from the front and rear sides at both ends in the plane direction of the semiconductor element to the semiconductor element, having the semiconductor element and the front Kinuki hole circuit a method of manufacturing a more becomes a semiconductor device and the step of filling covering the sealing resin on the periphery of the gap and the semiconductor element with the substrate, the holes in the circuit board
Up to four diameters ranging from φ50 [μm] to φ300 [μm]
Alternatively, a circuit board provided with five through holes is used .

[0012]

According to the above construction, when filling the gap between the semiconductor element and the circuit board with the sealing resin in the sealing step, the circuit board has at least one through hole having an appropriate hole diameter. Therefore, the bubbles escape from the through-holes, the bubbles are prevented from remaining in the gaps, and the sealing resin can be prevented from dripping, thereby facilitating the sealing operation.

[0013]

An embodiment of the present invention will be described below with reference to the drawings.

FIGS. 1, 2 and 3 are process diagrams showing a method of manufacturing a semiconductor device according to an embodiment of the present invention.
1A is a sectional view, and FIG. 1B is a bottom view. 2A is a sectional view, and FIG. 2B is a plan view. FIG. 3 (a)
Is a sectional view, and (b) is a plan view. 1, 2 and 3, 1 is a semiconductor element having a protruding electrode, 3 is a sealing resin supply nozzle, 4 is an epoxy sealing resin, 5 is an air vent through hole, 6 is a circuit board, 7 is It is a bubble.

First, as shown in FIGS. 1 (a) and 1 (b), a semiconductor element 1 having a projecting electrode on a circuit board 6 having an air vent through hole 5 on the bottom face is face-down by a high precision positioning device. After mounting, the circuit board 6 and the semiconductor element 1
And are connected by a conductive adhesive such as a solder material.

Next, as shown in FIGS. 2A and 2B, resin sealing is performed to improve mechanical properties and reliability of a product in which the circuit board 6 and the semiconductor element 1 are connected. In this method, the circuit board 6 is placed on a heating table, heated from below the circuit board 6, and the circuit board 6 on the heating table is fixed by vacuum suction. Next, a sealing resin supply nozzle 3 is set on each of the left and right side surfaces of the semiconductor element 1 for each side. Then, the epoxy-based sealing resin 4 is supplied while the sealing resin supply nozzle 3 is moved in parallel, and a gap (50 μm) between the semiconductor element 1 and the circuit board 6 is supplied.
m to 100 μm) with the sealing resin 4.

Next, as shown in FIGS. 3 (a) and 3 (b), the sealing resin supply nozzles 3 are set for each side on both front and rear sides which are unsealed portions. By supplying the sealing resin 4 while moving the
The gap between the semiconductor element 1 and the circuit board 6 is filled with the sealing resin 4, and the periphery of the semiconductor element 1 is filled with the sealing resin 4, and the filled sealing resin 4 is cured. The sealing is completed.

In addition, as the sealing resin 4 when the filling is zero, other than the liquid epoxy resin as the epoxy resin, a silicon resin can be used as the sealing resin. The melt viscosity of the sealing resin when filling is 80 to 300 at 25 [° C.] when the resin is an epoxy resin.
[CP], and the gap between the semiconductor element 1 and the circuit board 2 can be easily filled.

In the following, two, four, five air vent through holes 5 having several kinds of diameters are produced by the manufacturing method shown in the embodiment.
After flip-chip mounting and connecting the semiconductor element 1 having the protruding electrode to the ten circuit boards 6 provided, the epoxy-based sealing resin 4 is filled in the gap between the semiconductor element and the circuit board,
Tables 1 and 2 show the results of measurement of bubbles formed in the gap between the semiconductor element 1 and the circuit board 6 when resin sealing is performed and the dripping of the sealing resin 4 from the circuit board 6. ),
The results are shown in (Table 3) and (Table 4).

[0020]

[Table 1]

[0021]

[Table 2]

[0022]

[Table 3]

[0023]

[Table 4]

As described above, in the method of manufacturing a semiconductor device according to the present embodiment, the structural conditions of the circuit board 6 are as follows.
The number of the air vent through holes 5 provided in the circuit board 6 is 4
Or 5 holes, and the hole diameter is from φ50μm to φ
It is understood that the range of 300 μm is suitable. In addition, the arrangement position of the air vent through-hole 5 is not limited because it varies depending on the wiring pattern of the circuit board 2, the size of the semiconductor element 1 having the protruding electrode, and the like.

[0025]

As described above, the present invention provides a semiconductor device using a circuit board provided with at least one air vent through hole having an appropriate hole diameter in a sealing step of flip chip mounting of a semiconductor element. An object of the present invention is to provide a method of manufacturing a semiconductor device capable of efficiently removing bubbles remaining in a gap between an element and a circuit board.

[Brief description of the drawings]

FIG. 1 is a process chart showing a method for manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a process chart showing a method for manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 3 is a process chart showing a method for manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 4 is a process chart showing a conventional method for manufacturing a semiconductor device.

FIG. 5 is a process chart showing a conventional method for manufacturing a semiconductor device.

FIG. 6 is a process chart showing a conventional method for manufacturing a semiconductor device.

FIG. 7 is a process chart showing a conventional method for manufacturing a semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Circuit board 3 Sealing resin supply nozzle 4 Sealing resin 5 Air vent through hole 6 Circuit board 7 Bubbles

Claims (1)

(57) [Claims] 1. A mounting a semiconductor element on a circuit board having a transmural hole by face-down, the sealing resin supply nozzle from the left and right lateral end in the planar direction of the semiconductor element in which the mounting semiconductor element a step of supplying a sealing resin while moving in parallel, to fill covering the sealing resin on the periphery of the gap and the semiconductor element and the circuit board having the semiconductor element and the front Kinuki hole relative to the the sealing resin is supplied while moving parallel to the semiconductor element encapsulation resin supply nozzle from the front and rear sides at both ends in the plane direction of the mounted semiconductor element, the circuit board having the semiconductor element and the front Kinuki hole a manufacturing method of a gap and a semiconductor semiconductors device that Na more and filling covering the sealing resin on the periphery of the elements of the hole diameter on the circuit board is ø50 [[mu] m]
4 or 5 through holes in the range of ~ 300 [μm]
A semiconductor device characterized by using a provided circuit board.
Manufacturing method of the device.