JP2958829B2 - Contact image sensor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting and connecting a plurality of sensor substrates each having a light-transmitting substrate on which a color filter or the like is stacked on an insulating substrate on which a large number of light receiving elements are formed in a line. The present invention relates to a structure of an end portion of a long contact image sensor configured as described above.

[0002]

2. Description of the Related Art Conventionally, a solid-state imaging device used for a facsimile or the like includes, for example, a plurality of individual electrodes on an insulating substrate.
There has been proposed a contact type image sensor that has a thin film structure in which a photoelectric conversion layer and a common electrode are sequentially laminated to form a light receiving element array, and projects image information of a document or the like one-to-one to convert it into an electric signal. Since the width of the light receiving element array having a thin film structure is limited by a film forming apparatus for forming a metal film or a semiconductor film,
For example, in order to be able to read the document of the A-column No. A in Japanese Industrial Standard, three A3-wide sensor boards on which a light-receiving element array is formed are arranged so as to be connected and connected, and a long light-receiving area of A0 width is used. An element array has been obtained.

In recent years, with the development of an image sensor capable of reading a color image, for example, as shown in FIG. 3, a light receiving element array in which a large number of light receiving elements 10 are arranged in a line on an insulating substrate 1 is formed. A structure in which a red, green or blue filter 21 is formed on a transparent substrate 2 and the transparent substrate 2 is arranged on an insulating substrate 1 via an adhesive 11 so that the filter 21 corresponds to each light receiving element 10. Color image sensors have been proposed. The light receiving element 10 is configured by sequentially laminating individual electrodes made of a discretely formed metal film, a photoelectric conversion layer made of a semiconductor film, and a strip-shaped common electrode made of a transparent conductive film on the insulating substrate 1.

[0004]

In order to obtain a long color image sensor, the end of the color image sensor having the above-described structure is set at a desired distance from the connection-side end light receiving element 10a (about 10 μm in the case of 400 dpi). Cut at the position
As shown in FIG.
Although the connection is made above, the protruding portion 31 of the adhesive 30 is generated at the connecting portion, and the light incident on the connecting portion is reflected by the protruding portion 3.
In this case, there is a problem that the light is diffusely reflected at 1 and the output value of the light receiving element near the connection portion varies. The end of each color image sensor constituting the long color image sensor is about 10 μm from the connection-side end light receiving element 10a.
(In the case of 400 dpi)
As shown in FIG. 3, incident light A (image information) from the document surface side of the outer end light receiving elements 10b of the sensor substrates at both ends constituting the color image sensor is smaller than that of the inner light receiving elements 10 as shown in FIG. (There is little incident light due to the document surface reflected light from the right side with respect to the light receiving element 10b), and there is a problem that uniformity with other light receiving elements 10 cannot be ensured. Furthermore, since the light B incident from the end of the transparent substrate 2 becomes flare light, there is a problem that the output value of each light receiving element 10 varies.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has improved optical nonuniformity in a light receiving element at an end of a sensor substrate of a contact type image sensor, and has improved uniformity with a light receiving element inside the sensor substrate. It is an object of the present invention to provide an endmost structure of an image sensor for planning.

[0006]

In order to solve the above-mentioned problems of the prior art, a contact type image sensor according to the present invention is a transparent image sensor in which a filter is laminated on the light receiving element side on an insulating substrate on which a large number of light receiving elements are formed. A sensor substrate is formed by arranging an optical substrate, and an outer end of the sensor substrate is positioned at least one pixel pitch from an outermost end of the light receiving element. Further, a light shielding film is formed on the sensor substrate at least one pixel pitch from the outermost end of the light receiving element.

[0008]

According to the present invention, the outer end of the contact type image sensor is located at least one pixel pitch from the outermost end of the light receiving element formed on the sensor substrate and the light shielding film is formed. The flare light is prevented from being incident on the edge light receiving element of the substrate, and an optically uniform structure can be obtained between the edge light receiving element and the light receiving element located inside the substrate.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIG. The color image sensor includes a sensor substrate in which a light receiving element 10 formed by stacking discrete electrodes, photoelectric conversion layers, and common electrodes formed discretely on an insulating substrate 1 made of glass; Filter 21
Is formed on the transparent substrate 2 with the adhesive 30 interposed therebetween so that each filter 21 corresponds to each light receiving element 10. Portions having the same configuration as FIG. 3 showing the conventional example are denoted by the same reference numerals.

When obtaining a long color image sensor,
Dicing blades (cutting blades) at both ends of the sensor substrate
A plurality of sensor substrates are connected and connected by cutting (not shown). At the time of cutting the sensor substrate, about 10 μm (4
00 dpi), the outer edge of the sensor substrate corresponding to both ends of the long image sensor is one pixel from the extreme end of the light receiving element 10b formed at the edge of the sensor substrate. Cut outside the pitch t or more. Each color image sensor constituting the long color image sensor is applied onto the sensor support substrate 3 via an adhesive 30 (for example, an acrylic adhesive manufactured by Nippon Loctite, an epoxy adhesive manufactured by Toho Kasei Co., Ltd.). The same adhesive 30 is applied on the transparent substrate 2 while connecting and connecting on the connected adhesive 3, and the long transparent member 4 is arranged so as to cover the whole of the plurality of connected and connected color image sensors. I have. The transparent member 4 is formed of a glass plate similar to the transparent substrate 2 or a transparent organic film having the same refractive index as the transparent substrate 2.

At both ends of the transparent member 4, a light-shielding resin film 40 is formed on the upper surface one pixel t or more outside the endmost light receiving element 10b.
(For example, a color mosaic manufactured by CK-2000 Fuji Hunt). Further, a similar light-shielding resin film 4 is formed on both side surfaces of the insulating substrate 1, the transparent substrate 2 and the transparent member 4.
1 is applied.

According to the above structure, as shown in FIG. 1, the light receiving element 10b of the longest color image sensor has a range of light A incident from the document surface side located within the sensor substrate. Can be the same as element 10;
The structure can be made optically uniform with respect to the other light receiving elements 10. Further, by disposing the transparent member 4, the adhesive 30 at the connection connection portion is flattened, and the light incident near the connection portion is reduced. The variation in the output value of the light receiving element due to the irregular reflection of light can be prevented, and an image signal faithful to the original image can be obtained. Further, the application of the light-shielding resin films 40 and 41 prevents light from entering the transparent substrate 2 and the transparent member 4 from the end of the color image sensor, and the flare caused by this light entering the inside of the sensor substrate by total reflection. Can be prevented.

FIG. 2 shows another embodiment of the present invention.
This is an example in which the transparent member 4 arranged on the transparent substrate 2 is longer than the width of the long color image sensor. In this embodiment, the light-shielding resin film 40 and the transparent member 4 are provided on the upper surface of the long color image sensor at least one pixel t outside the endmost light receiving element 10b.
And a light-shielding resin film 41b is applied to both end surfaces of the insulating substrate 1 and the transparent substrate 2, respectively. Other configurations are the same as those in FIG. 1, and the same components are denoted by the same reference numerals and description thereof will be omitted.

[0014]

According to the present invention, the outer end of the sensor substrate of the contact type image sensor is located at least one pixel pitch outward from the end of the light receiving element formed at the end of the sensor substrate. An optically uniform structure can be obtained between the end light receiving element and the light receiving element located inside the substrate, and a variation in output value can be prevented, and an image signal faithful to a document image can be obtained. In addition, since the light-shielding film is formed, it is possible to prevent flare light from being incident on the light receiving element at the end of the sensor substrate, thereby preventing variation in the output value of the light receiving element and obtaining an image signal that is faithful to the original image. Can be.

[Brief description of the drawings]

FIG. 1 is a partially sectional explanatory view of a long color image sensor showing one embodiment of the present invention.

FIG. 2 is a partially sectional explanatory view of a long color image sensor showing another embodiment of the present invention.

FIG. 3 is an explanatory cross-sectional view showing a connected state of a conventional color image sensor.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate, 2 ... Transparent substrate, 3 ... Sensor support substrate, 4 ... Transparent member, 10 ... Light receiving element, 21 ... Filter, 30 ... Adhesive, 40, 41 ... Light shielding resin film, t ...
Pixel pitch

Continuation of the front page (72) Inventor Satoshi Noda 2274 Hongo, Ebina-shi, Kanagawa Prefecture Fuji Xerox Co., Ltd. Ebina Works (58) Field surveyed (Int.Cl. ⁶ , DB name) H04N 1/028

Claims (1)

(57) [Claims] A sensor substrate is formed by arranging a light-transmitting substrate on which a filter is laminated on the light-receiving element side on an insulating substrate on which a large number of light-receiving elements are formed, and forming an outer end of the sensor substrate on the insulating substrate. A contact-type image sensor, wherein a light-shielding film is formed on the sensor substrate at least one pixel pitch from the outermost end of the light-receiving element and at least one pixel pitch from the outermost end of the light-receiving element. .