JP2806107B2 - Variable semiconductor element transfer chute - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a variable semiconductor element transport chute.

[0002]

2. Description of the Related Art As shown in FIG. 7, a conventional IC transport chute is formed by integrally processing a guide sandwiching a large external dimension IC11 and a rail portion supporting the large external dimension IC11.
As shown in FIG. 10, the IC transport chute 10 moves the IC 1 housed in the inclined magazine tube 14 downward through the IC transport chute 10. Above IC1 stopped by IC cutting cylinder 16, I
C1 is continuously stacked, and the IC holding cylinder 15 holds the second IC 20 and the cutting cylinder 16 moves upward, whereby one IC1 is cut out. In this manner, ICs are sequentially cut out and separated into individual pieces.
At this time, as shown in FIGS. 8 and 9, when the outer dimensions of the IC 1 change like the middle outer dimensions IC12 and the small outer dimensions IC13, the inner dimensions of the IC transport chute 10 must also be changed.

In the example shown in FIG. 11 in which the conventional marking device 17 is mounted and stamped, the IC 1 sent from the magazine tube 14 into the IC transport chute 10 by the pusher 18 or the like is stamped while being fed at a constant pitch. Is done. The stamped IC 1 is stored in the magazine tube 14 by the pusher 18 or the like.

[0004]

In the conventional IC transport chute, every time the external dimensions of the IC are different, a transport chute matching the external dimensions must be prepared and replaced. I needed it. Therefore, there has been a problem that an apparatus such as a sorting handler can usually flow only a single type of IC. Further, in the stamping device, there is a problem that the IC jumps in a gap between the IC and the transfer chute in the transfer chute during the constant pitch transfer or the stamping, and the stamp is displaced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a variable semiconductor element transport chute which can handle ICs having different external dimensions.

[0006]

According to the present invention, there is provided a variable semiconductor element transport chute comprising:
A pair of left-handed screws and right-handed screws attached to the left and right opening / closing pawls for moving the left / right opening and closing claws left and right, a rotation motor for rotating the pair of screws, and a product receiving rail supporting the IC A vertical movement screw for moving the product receiving rail up and down, a vertical drive motor for rotating the vertical movement screw, and a motor control unit for controlling the vertical drive motor and the rotation motor. .

[0007]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view schematically showing the structure of a first embodiment of the present invention.

In the first embodiment, as shown in FIG. 1, an IC 1 taken out of a magazine tube (not shown) has a space sandwiched between a left opening claw 2, a right opening claw 3, and a product receiving rail 8. It moves while being guided by.

FIG. 2 is a sectional view for explaining a method of transporting a small-sized IC in the embodiment of FIG.

As shown in FIG. 2, when the IC is small, the motor control unit 19 instructs the motor control unit 19 to form a gap corresponding to the external size of the small external size IC 13 and controls the rotation motor 6 by the set number of pulses. Rotate. With this rotation, the left screw 4,
The right screw 5 is moved to the center, so that a gap corresponding to the size of the small external dimension IC 13 can be secured between the left and right opening claws 2 and 3. Further, the vertical drive motor 7 connected to the product receiving rail 8 is rotated by the number of pulses corresponding to the external size of the small external size IC 13, thereby raising the product receiving rail 8 and setting the small external size IC 13 and the opening / closing claw 2. , 3 can be made constant.

FIG. 3 is a sectional view showing a state in which the IC of FIG. 1 is fixed and held by left and right open / close claws.

As shown in FIG. 3, after transporting IC1,
When stamping C1, when pushing the IC1 with the pusher 18 shown in FIG. 11, the rotation motor 6 is held so as to form the gap shown in FIG. The motor 6 is rotated by the number of pulses instructed by the motor control unit 19, the left and right open / close claws 2 and 3 are closed, and
1 is fixedly held.

FIG. 4 is a sectional view schematically showing the structure of a second embodiment of the present invention, and FIG.
FIG. 4 is a cross-sectional view illustrating a method of transporting the hologram.

In the second embodiment, as shown in FIG. 4, the left and right opening claws 2 and 3 are disposed on the left and right opening claw base 9.
It has a structure that can move left and right horizontally. The IC 1 is guided and moved in a space between the left and right opening / closing claws 2 and 3 and the product receiving rail 8.

In the case of the small external dimension IC 13, as shown in FIG. 5, the rotating motor 6 makes a gap corresponding to the external dimension of the small external dimension IC 13, so that the rotation is performed by the number of pulses specified by the motor control unit 19. Then, the left and right opening claws 2 and 3 are moved to the center, and the vertical driving motor 7
, The right and left open / close claws 2 and 3 move downward, and automatically adjust the gap with the small external dimension IC 13.

FIG. 6 is a sectional view showing a state in which the IC of FIG. 4 is fixed and held by left and right open / close claws.

As shown in FIG. 6, after the IC 1 is pushed out of the magazine tube 14 shown in FIG. 11 by the pusher 18, the rotation motor 6 is rotated by the number of pulses according to the external dimensions of the IC 1 to open and close the right and left. IC with nails 2 and 3
1 is fixedly held.

[0019]

According to the present invention, even if the external dimensions of the IC change, the movable open / close claw and the movable product receiving rail make it possible to obtain one IC.
There is an effect that all types of transport rails can be used for ICs of all dimensions.

Further, there is an effect that the IC can be stably transported or held by a mechanism for sandwiching the IC between the left and right opening and closing claws.

[Brief description of the drawings]

FIG. 1 is a sectional view schematically showing the configuration of a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a method of transporting a small external size IC in the embodiment of FIG.

FIG. 3 is a sectional view showing a state in which the IC of FIG. 1 is fixed and held by left and right open / close claws.

FIG. 4 is a sectional view schematically showing the configuration of a second embodiment of the present invention.

FIG. 5 is a cross-sectional view for explaining a method of conveying a small external size IC in the embodiment of FIG.

6 is a cross-sectional view showing a state where the IC of FIG. 4 is fixed and held by left and right open / close claws.

FIG. 7 is a perspective view of an example of a conventional IC transport chute having a large external dimension.

FIG. 8 is a perspective view of an example of a conventional IC transport chute having a medium external size.

FIG. 9 is a perspective view of an example of a conventional small-size IC transport chute.

FIG. 10 is a cross-sectional view of an IC transport chute illustrating a conventional IC cutting mechanism.

FIG. 11 is a cross-sectional view of an example of an IC transport chute illustrating a conventional marking mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC 2 Left opening claw 3 Right opening claw 4 Left screw 5 Right screw 6 Rotation motor 7 Vertical drive motor 8 Product receiving rail 9 Left and right opening and closing claw base 10 IC transport chute 11 Large external dimensions IC 12 Medium external dimensions IC 13 Small external dimensions IC 14 Magazine tube 15 IC holding cylinder 16 IC cutting cylinder 17 Marking device 18 IC pusher 19 Motor control unit 20 Second IC

Claims (1)

(57) [Claims] 1. A pair of left and right screws, which are attached to the left and right opening claw and move the left and right opening and closing claw to the left and right, and a pair of screws. A rotating motor for rotating, a product receiving rail supporting the IC, a vertical moving screw for moving the product receiving rail up and down, a vertical driving motor for rotating the vertical moving screw, and the vertical driving motor; A variable semiconductor element transport chute, comprising: a motor control unit for controlling the rotation motor.