JP2896458B2 - Flat panel display - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [0001] The present invention relates to a flat panel display.
The connection structure of the display device
The present invention relates to a connection structure of a flat panel display device used. [0002] 2. Description of the Related Art Liquid crystal displays, fluorescent displays, elects
B. Luminescence display, plasma display, etc.
In rat panel display devices, high definition and large capacity
In addition to the problem of electrode formation,
It has become a major problem and various connection methods have been proposed.
I have. [0003] One method uses rubber elasticity.
There is a type using a press-contact type connector. This crimp type connector
Data can be roughly classified into three types. First, conductive rubber
It has conductivity and the function of a spring. No.
No. 2 does not use conductive rubber and uses metal,
Binder and support using carbon fiber, carbon fiber, etc.
Insulating rubber as a material can function as a spring
It is. Third, current flows only in the thickness direction,
Anisotropic conductive rubber that does not flow in the right angle direction. [0004] These press-connecting connectors are used for watches, calculators and the like.
It is used for small liquid crystal displays. But this kind of
The current connection accuracy of IDC connectors is about 2 / mm
High-definition, large-capacity flat panel display device
Not applicable to Therefore, a high-definition and large-capacity flat panel
As an effective connection method to the
A method for melting the solder has been proposed. Connection method of this method
The degree is about 4 / mm. [0006] However, in this method, the infrared radiation causes
Heat, solder shape, connected object
It is difficult to determine connection conditions such as elongation,
There was a disadvantage that electrode formation was complicated. [0007] SUMMARY OF THE INVENTION Under such circumstances,
Easy connection of high-definition and large-capacity flat panel display
Japanese Patent Publication No. 58-56996 and Japanese Patent Publication No. 59-2
No. 179, JP-A-51-20941, JP-A-52-41648
JP, JP-A-51-114439, JP-A-51-119732
JP, JP-A-51-135938, JP-A-51-21192
Heat seal connectors as described in the
That is, heat is applied to the polymer film in which the conductive material is dispersed in the adhesive layer.
And a thermo-compression type connector that connects by applying pressure.
Have been proposed. [0008] Connection structure using heat seal connector
Is characterized in that the conductive material is dispersed in the adhesive layer. So
Conductive materials include Cu, solder, Ni, carbon, etc.
Is used. Connection using heat seal connector
The big factor that determines the connection accuracy of the connection method is conductive materials
Shape and size. Connection method using heat seal connector
According to the method, the electrodes are pressed against each other via a conductive material.
Thus, the electrode material is not limited, and the electrode can be easily formed. However, a heat seal connector is used.
In the connection method, several tens of kg per unit area with heat applied
To apply electrical pressure between adjacent terminals.
Contact failures such as short-circuiting and displacement between adjacent terminals
It becomes easy to grow. In addition, connection conditions and flatness of the thermocompression bonding equipment
The problem is that contact resistance varies depending on
Was. An object of the present invention is to eliminate misalignment and poor connection.
This flat without any flat panel terminals without causing
Easy connection to the terminal of the circuit that supplies signals to the panel
To provide a flat panel display device comprising
It is. [0012] The present invention achieves the above object.
To achieveA display unit in which a plurality of electrodes are arranged, and
Flat panel having terminals for supplying signals to a plurality of electrodes
Conductors connected to the terminals of the panel display and terminals
A synthetic resin adhesive and metal particles
Conductors are connected to terminals by polymer
In a flat panel display device connected to the body
Between the terminal pitch Lp of the terminal and the conductor and the terminal
The gap Lg is 0.5Lp <Lg <Lp And the particle size of the metal particles dispersed in the adhesive
Is the thickness of the terminal, the thickness of the conductor and the polymer in the connected state
We offer flat panel displays that are less than the sum of the film thickness
Plan. [0013]The substrate is a flexible substrate
Can be. [0014]A plurality of electrodes of the flat panel display unit
Is at least one of a scanning electrode and a signal electrode. [0015]The metal particles in the polymer film are nickel
Metal, copper, or solder. [0016]Terminal pitch Lp and end of the terminal and conductor
The relationship of the child gap Lg further includes: Lg ≦ 0.6Lp May be weighted. In the present invention, the end of the terminal portion of the display element is used.
The child pitch Lp and the inter-terminal gap Lg have the following relationship:
So,0.5Lp <Lg <Lp Energizes a relatively large current, such as a thermal writing liquid crystal display
Also in flat panel display devices, when performing thermocompression bonding,
Without the metal particles dispersed between the contact terminals being crushed,
The original particle size can be maintained. Therefore, the adjacent terminal
Metal particles dispersed between the adjacent terminals electrically
Short-circuit between adjacent terminalsDoes not occur. [0018] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, referring to FIGS.
Implementation of connection structure of flat panel display device according to the present invention
An example will be described. FIG. 4 shows an anisotropic conductive film according to the present invention.
Micrograph showing the dispersion of metal particles in the polymer film
FIG. 5 shows a connection method using a polymer film according to the present invention.
It is a figure which shows typically. 4 and 5, an anisotropic conductive film is used.
A certain polymer film 1 is made of a polyolefin-based material having an adhesive function.
Mixture of rubber and synthetic resin and melting with conductive function
Metal 2. Polymer that is an anisotropic conductive film
The thickness of the film 1 is about 30 μm,
The particle size is on the order of 20 microns. In addition, the polymer film 1
Has a curing temperature of 170 ° C., and the melting point of the molten metal 2 is
190 ° C. In this embodiment, the conductivity of the polymer film 1
The reason for using molten metal 2 as the material is that the contact area is large.
Contact resistance at the time of connection
A relatively large current can be passed. In this embodiment, the molten metal 2 is used.
However, in carrying out the present invention, carbon, car
Of carbon fiber, nickel particles, copper particles, solder particles, etc.
If the air resistance is low and the particle size is small,
Can be used as a conductive material. The polymer film 1 shown in FIG. 4 has a thickness of about 30 microns.
In the synthetic resin adhesive of the degree, as metal particles, diameter 2
This is a dispersion of solder particles 2 of about 0 μm. FIG. 5 shows, more specifically, as a terminal connection.
Thermo-electricity of smectic A phase liquid crystal under relatively severe conditions
The present invention is applied to a thermally-written liquid crystal display device utilizing the magneto-optical effect.
It is a figure which shows the applied connection method typically. here,
Connection terminal of liquid crystal display element 3 and FPC, that is, flexible
The polymer film 1 shown in FIG.
The pinch, heat and pressure are simultaneously applied to the liquid crystal display element 3
The connection terminal and the connection terminal of the FPC 4 are connected. FIG. 1 shows a liquid crystal display to be connected according to the present invention.
The outline of the device structure is shown together with the polymer film according to the present invention.
FIG. Thermo-electro-optic effect of smectic A phase liquid crystal
The electrodes of the thermal writing display element used heat the liquid crystal layer
Therefore, the scanning electrode 6 is formed of a resistor, and the signal electrode 7 is
It is composed of a transparent conductor. The scanning electrode 6 is 85% A
1-10% Si-5% Cu alloy with a film thickness of 1 μm,
Sheet resistance is 0.17Ω / sq., Diffuse reflectance is 68%
(λ = 400 nm). On the other hand, the signal electrode 7 is
Indium, thickness 1000 Å, sheet resistance 30 Ω
/ Sq ·, transmittance is 90%. On the scanning electrode 6 and the signal electrode 7, a liquid crystal 8
An alignment film 9 for controlling the alignment state of
The scanning electrode substrate 10 and the signal electrode substrate 11
8. Note that the sealant 12
And disperse the coating material 13 to the portion corresponding to the display surface.
Also disperses the support material 13, controls the thickness of the liquid crystal layer 8,
It is uniform. The liquid crystal 8 of this embodiment is an acyloxy type liquid crystal.
And a pair of the following structural formulas (1) and (2) and (3)
The mixture was mixed at a weight ratio of 1. [0027] Embedded imageFrom the liquid crystal 8 solid to the smectic A phase
Has a phase transition temperature Tcs of 10 ° C.
Transition temperature T to nematic phase_SNIs 45 ° C.
Phase transition temperature T from matic phase to liquid_N1Is at 47 ° C
You. Also, the relative dielectric constant of the liquid crystal molecules in the minor axis direction at 25 ° C.
Rate ε₁Is 6.59, and the relative dielectric constant ε in the major axis direction is₁₁Is
16.76, the relative dielectric constant ε in the major axis direction.₁₁And short axis direction
Relative permittivity ε₁Is 10.17, which is
Relative permittivity ε₁₁And relative permittivity ε in the minor axis direction₁And the ratio ε₁₁
/ Ε₁Is 2.54. The alignment film 9 for controlling the alignment state of the liquid crystal 8 includes
Shin-Etsu Chemical Model LP-8 Fluorine Silane C₈F₁₇(CH_Two)
_TwoSi (OCH_Three)_TwoCH_ThreeAnd silanol oligomer made by Tokyo Ohka
[Product name Si film (Model No. 59000)]
And their mixing ratio is 100 parts of polyetheramide.
On the other hand, a mixture of fluorine-based silane and Si film
1.8 parts. Liquid crystal 8 and alignment for carrying out the present invention
The film 9 is not limited to the above embodiment. That is, the used ring
Change each mixing ratio according to the environment, driving conditions, etc.
And optimal values for phase transition temperature, relative permittivity, orientation control force, etc.
Can be set to The liquid crystal 8 of this embodiment has a positive display.
Mixed with a black dichroic dye,
It was a strike type liquid crystal. This black dichroic dye is
LSR-310, LSY-108, LSB-31
8, LSB-278
The mixing ratio was as follows: SLR-310: 40 parts, LSY-10
8: 80 parts, LSB 318: 80 parts, LSB-278:
100 copies. The liquid crystal 8 is the smectic A phase liquid crystal.
1.7 parts of the above-mentioned black pigment is used for 100 parts. The scanning electrode substrate 10 and the signal electrode substrate 11
Uses 1.1 mm thick soda glass and sealant 1
An epoxy-based material was used for 2 and the
Support material 13 dispersed and support dispersed on the display surface
The material has a glass phage of 12 μm in diameter and 80 μm in length.
Iva was used. FIG. 2 is a diagram showing a connection between the polymer films of the present invention.
The state of the terminals and electrodes of the liquid crystal display element for thermal writing
FIG. 3 is a perspective view showing a state before connection in FIG.
It is. According to the embodiment shown in FIGS.
Connection method using polymer film for embedded LCD
Electrical short between adjacent terminals and the terminal of the display element
With PC terminalCan prevent misalignment,And the contact resistance
It is small and the current carrying capacity can be increased. The detailed reason
Will be described later with reference to FIGS. In FIG. 3, a flexible printed circuit board is shown.
4 has an electrode 15 on a base film 14 and a liquid crystal display.
On the rigid substrate 19 on the display element 3 side, a circuit conductor 20 is provided.
It is bare. Connect the electrode 15 and the circuit conductor 20
To continue, the circuit implementation is similar to that already described in FIG.
The polymer film 18 is placed on the body 20 and flexible printed.
The circuit board 20 is overlapped with the circuit conductor 20 and the electrode 15 is aligned.
And apply heat and pressure. The structure shown in FIG. 2 is for heating the liquid crystal layer.
Terminal of the scanning electrode and FP for supplying a relatively large current to the
It is a structure suitable for connection with C,Terminal pitch
Lp: 250 μm (definition: 4 lines / mm), energizing current: 1
A, The target specification is a contact resistance of 1Ω or less. in this way
Scan electrode 6 and FPC 4 formed on scan electrode substrate 10
Between the electrode 15 formed on the base film 14 of FIG.
A polymer film 18 composed of an adhesive 16 and metal particles 17
To connect optimally by applying heat and pressure,
The thickness obtained by adding the thickness of the electrode 15 of the PC and the thickness of the scanning electrode 6.
And the size of the metal particles 17 dispersed in the polymer film
The person in charge is important. Furthermore, to prevent short circuit between adjacent terminals
Is between the scanning electrodes 6Terminal gap LgSize is also an important factor
Becomes FIG. 6 shows the size of the metal particles 17 of the polymer film 18.
The diameter of the conductor is the thickness of the scanning electrode 6 and the conductor electrode 15 of the FPC 4.
Condition before connection of a failure example that is larger than the thickness plus the film thickness
FIG. 7 shows the state after connection of the failure example in FIG.
FIG. Size of metal particles 17 of polymer film 18
Is the thickness of the scanning electrode 6 and the thickness of the electrode 15 of the FPC 4.
If more than the added thickness, metal dispersed between adjacent terminals
The particles 17 are crushed and spread, causing a short circuit between adjacent terminals.
Poor contact occurs. In the state before the connection shown in FIG.
14andElectrode conductor 15Consists ofFPC and glass substrate 1
0andScanning electrode 6Consists ofScan electrode substrateBetweenContact
A polymer film 18 composed of an adhesive 16 and metal particles 17 is sandwiched.
Connect with heat and pressure. In the state after the connection shown in FIG.
Metal than the thickness obtained by adding the thickness of the scan electrode 6 to the thickness of the scan electrode 6
Due to the large particle size of the particles 17, gold dispersed between adjacent terminals
The metal particles 17 are crushed and spread, and the FPC conductor 15
The metal particles 17 that conduct between the scanning electrode 6 and the
Crushed metal that spreads and crushes between adjacent conductors
As a result of melting and being integrated with the particles 17, a short circuit between adjacent conductors
Occurs. FIG. 8 shows that the particle diameter of the metal particles of the polymer film varies.
Thickness obtained by adding the thickness of the test electrode and the thickness of the conductor electrode of the FPC
It is a diagram showing a state before connection of a preferred example smaller than,
FIG. 9 is a diagram showing a state after connection in the preferred example of FIG.
You. In the state before connection in FIG. 8, the base film
FPC 4 consisting of 14 and electrode conductor 15 and glass substrate
Adhesion between rigid substrates consisting of 10 and scanning electrodes 6
Sandwiching a polymer film 18 composed of an agent 16 and metal particles 17,
Connect by applying heat and pressure. In the state after the connection shown in FIG.
15 higher than the sum of the thickness of the scan electrode 6 and the thickness of the scan electrode 6
Since the particle diameter of the metal particles 17 of the molecular film is small,
The metal particles 17 dispersed in the
Can be maintained. Therefore, originallyend
Child gap LgIs smaller than that of the metal particles 17
From the so-called neighbor, which electrically connects adjacent terminals
No short circuit occurs between the contact terminals. As described above, the heat seal connector is used.
The connection method used in the
The connection size depends on the particle size of the material and the thickness of the electrode to be connected.
The electrode thickness of the conductive material of the heat seal connector
Should be larger than the diameter. However, the thickness of the electrode to be connected is simply increased by heating.
・ Make it larger than the particle size of the conductive material of the seal connector
Alone does not provide a good connection just by lowering the adhesive strength.
No. To obtain a good connection, the thickness of the electrode to be connected
Between particle diameter of conductive material and heat seal connector
Need to be considered. The heat-writing liquid crystal display element has electrodesTerminal pin
Chi LpIs 250 μm, 500 scanning electrodes, signal electrodes
Are 720 lines, and the display screen is the size of the A5 size.
The signal electrodes are structured so that the terminals are drawn out on both sides.
Terminal electrodeTerminal pitch LpIs 500 μm (fine
Fineness: 2 lines / mm) However, the scanning electrode has a terminal for flowing current.
Part electrodeTerminal pitch LpAlso 250 μm (definition: 4
/ Mm), and a strict connection with 500 connection terminals
Pitch. The specification required for connection is
Current capacity is 1A and the contact resistance at the connection is 1Ω or less.
It is a new condition. Using such a thermal writing liquid crystal display element,
Of the scanning electrodeTerminal pitch Lp, terminal gap Lg, and terminal
Of width Lw (= Lp−Lg)After finding the optimal relationship,
The relationship shown in FIG. 10 was obtained. FIG.Terminal
Chi LpIs 250 μmTerminal gapLgShort circuit
It is a figure which shows the relationship with an occurrence frequency. As shown in FIG.
Sea urchinTerminal gap LgIs larger than 150 μm,
It became clear that no short circuit occurred between the terminals. However
In this embodiment, the thickness of the scanning electrode 6 is 1 μm,
The thickness of the conductor electrode 15 is 18 μm, and the thickness of the polymer film 18 is
30 μm, the particle diameter of the solder particles 17 of the polymer film 18 is 2
0 μm. Further, heat and pressure are applied to the polymer film 18.
Optimal conditions were used. From this result, it can be seen that the scanning electrode 6Terminal pitch L
pFor 250 μm,Terminal width LwIs 100 μm,Between terminals
Gap LgWas set to 150 μm. Conductor electrode 15 of FPC4
Terminal pitch Lp, terminal width Lw, terminal gap LgIs running
The same as the inspection electrode 6 was used. The thickness of the conductor electrode 15 of the FPC 4 is 18 μm.
Was decided to form 500 electrodes with a definition of 4 lines / mm.
Based on the constraint that For high-definition electrodes
As the thickness of the conductor electrode 15 of the FPC 4 decreases,
It is clear that good electrodes cannot be formed if
Was. FIG. 11 shows the terminal electrode thickness and the terminal contact resistance.
FIG. From the results shown in FIG.end
Child width Lw100 μm,Terminal gap Lg150μm electrode
With the configuration, the thickness of the conductor electrode 15 of the FPC 4 is set to 18 μm.
When the thickness of the electrode at the terminal of the scanning electrode 6 is changed
The relationship between the contact resistances was examined. From the characteristics of FIG.
When the thickness of the terminal portion of the inspection electrode 6 is increased, the contact resistance is reduced.
It turned out to be. An aluminum electrode is used for the scanning electrode 6
When the terminal part is thin, heat and pressure
, The aluminum electrode is oxidized and the contact resistance is reduced.
It is considered that this is due to the rapid increase. From these results, it was found that the conductor thickness of the FPC was 18 μm.
m, the terminal portion of the scanning electrode 6 has a thickness of 1.4.
It becomes clear that the contact resistance is reduced above μm
Was. That is, the film thickness of the conductor 15 of the FPC 4 and the scan electrode 6
Thickness of 19.4 μm or more, including the thickness of the terminal
In the range, it is possible to satisfy the target specification of contact resistance of 1Ω or less.
Came. FIG. 12 shows the thickness of the terminal of the scanning electrode 6 in contact with the thickness.
It is a figure which shows the relationship with the adhesive strength of a continuation part. Smell
Therefore, the adhesive strength is such that the thickness of the terminal portion is 1.4 μm to 2.5 μm.
It turned out to be the largest in the range. FIG. 13 shows the film thickness and the thickness of the terminal portion of the scanning electrode 6.
And the contact resistance and contact thickness of the conductor electrode 15 of the FPC 4
It is a figure which shows the relationship with a wearing strength. As the connection method of the terminal
Must satisfy both the characteristics of contact resistance and adhesive strength at the same time.
I have to. From the results of FIG. 11 and FIG.
Of the connection part in the thermal writing liquid crystal display
Specifications are as follows: contact resistance 1Ω or less, adhesive strength 500g / cm^Two Less than
Because the upper part is stricter, the range of A part shown in FIG.
And the thickness dt of the terminal portion at that time is
The range is from 1.4 μm to 2.5 μm. With a resolution of 4 lines / mm or more and a large screen
Heat and seal connectors for display devices that carry large currents
When applying the Kuta method, use it for heat seal connectors.
The diameter of the metal particles 17 is about 20 μm due to manufacturing technology.
Near the minimum particle size, the thickness dc of the conductor 15 of the FPC 4 is
The maximum thickness is about 18μm due to restrictions on conductor formation of FPC4
Therefore, the thickness dc of the conductor 15 and the thickness of the terminal portion
The total film thickness with dt is 1.4 μm to 18 μm.
Is the optimum value when dc + dt = 19.4 to 20.5 μm is added.
And the relationship with the particle diameter dm of the metal particles 17 is 0.97dm≤dc + dt≤1.025dm Is represented by A special type of supplying a relatively large current to the connection portion
In such cases, the relationship represented by the above equation should be satisfied.
However, in general, a field effect type liquid crystal display device, a fluorescent display device,
Electroluminescence display, plasma display
In such a case, a large current is not supplied to the connection portion. Therefore,
It is necessary to supply a large current like a thermal writing liquid crystal display
No problem if the contact resistance is about 100Ω or less
There is no. In addition, the adhesive strength has little heat generation at the terminals.
Therefore, 400g / cm^Two With the above, there is no practical problem. From this, a general flat panel table
In the case of application to the display device, the range of the portion B shown in FIG.
And the terminals of the scanning electrode 6 at that time can be used.
The film thickness dt is in the range of dt = 0.5 to 2.8 μm.
The thickness d of the conductor electrode 15 of the PC 4 plus d = 18 μm is added.
The optimum range is c + dt = 18.5 to 20.8 μm. I
Therefore, the particle size of the metal particles of the heat seal connector
The relationship with dm is 0.925dm≤dc + dt≤1.04dm It is represented as As described above, when the definition is 4 lines / mm or less,
If a large current flows with a large capacity, the scanning electrode
6 and the thickness of the conductor electrode 15 of the FPC 4
The relation with dc is dc + dt = 19.4 to 20.5 μm.
is there. In this embodiment, dc = 18.0 μm.
However, when the value of dc is changed, naturally, dc + dt =
The thickness of the terminal portion so as to be in the range of 19.4 to 20.5 μm.
dt may be changed. It is to be noted that a display device which does not require a large current to flow is used.
In this case, the practical range of the adhesive strength is 400 g / cm.^Two that's all
When you select, from FIG. 0.905dm≤dc + dt≤1.04dm Is obtained. FIG.Terminal width LwAnd the maximum carrying current and
FIG. 4 is a diagram showing a relationship between the frequency and the frequency of occurrence of short circuits. General display
In the case of adapting to the device, as in the above,
When it is changed, the terminal part film thickness dt is set so as to be within the optimum value range.
Needless to say, change. [0059]In FIG.Terminal part thickness dt is 5000 mm
At the timeTerminal width LwAnd maximum pulse width when pulse width is 10ms
The relationship with the electric current is shown. As shown in FIG.
1A or more for the current value of embedded LCD
And no short circuit between adjacent terminalsTerminal width Lw
Is only in the shaded area,Lw= 100-125μ
m. Therefore,Terminal gap LgOptimal range of
The area is Lg = 125 to 150 μm, and the terminal pin at the end is
The optimal relationship between the switch Lp and the inter-terminal gap Lg is given by the following equation: 0.5Lp ≦ Lg ≦ 0.6Lp Is represented by [0061]However, when the terminal part thickness dt is 1 μm,
In FIG. 10 showing the characteristics of the case, the inter-terminal gap Lg = 125 μm
At m, the location of the short circuit is not completely zero
In consideration of this, a higher short-circuit prevention effect can be assured.
To keep 0.5Lp <Lg <Lp It is desirable that That is, the inter-terminal gap Lg is
Should be wider than at least half of the terminal pitch Lp
You. On the other hand, the upper limit of the inter-terminal gap Lg is Lg = Lp -Lw
It is clear from the relationship that
It is regulated by the determined terminal width Lw. Therefore, more
From the main purpose of the present invention to secure a high short circuit prevention effect
Then, the relationship between the terminal pitch Lp and the inter-terminal gap Lg is
as mentioned above, 0.5Lp <Lg <Lp Is defined. [0062]until now,The thickness d of the terminal portion of the scanning electrode 6
t and the thickness dc of the conductor electrode 15 of the FPC 4 and the heat
The particle diameter dm of the metal particles dispersed in the seal connector
And the relationship between the terminal pitch Lp and the terminal gap Lg.
However, the display device and the connection that allow a larger current to flow are actually used.
When the embodiment is applied, the film thickness dt of the terminal portion of the scanning electrode 6 is used.
Should be made thicker. The inter-terminal gap Lg is set to a small value outside the above range.
If used in a different direction, short-circuits will occur between adjacent terminals
However, if a pulse current is applied to the short-circuit, the terminal may be damaged.
The short circuit can be blown out without any
Has been established in conjunction with this short-circuit correction method.
If used, the optimum terminal gap Lg and terminal pitch Lp
Can be used in places that are slightly out of relationship. In this embodiment, the heat using the polymer film 18 was used.
Heat and pressure applied to heat seal connector
Did not elaborate. Of the heat, high
The optimum value is determined from the characteristics of the adhesive 16 used for the molecular film 18.
Decide and with regard to pressureTerminal pitch Lp,Terminal width Lw,
The optimum value is determined from the thickness of the polymer film. From the results in this example, it was found that the polymer film
Connection method that applies heat and pressure to the
When a relatively large current is applied to the
Has a specific resistance or sheet resistance smaller than that of
It is an important condition to select the terminal electrode material
It became clear. FIG. 15 shows a flat connected according to the invention.
Shows the state of metal particles in the connection structure of the panel display device
It is a microscope picture. From FIG. 15, the solder on the scanning electrode 6 is shown.
The particles 17 are crushed and spread well, and the scanning electrodes 6 and
It is understood that the contact area with the electrode 15 has increased.
It is. On the other hand, other than between the scanning electrode 6 and the electrode 15
Terminal gap LgPart of the solder particles 17
And maintain almost the same particle size as the neighboring scanning electrodes.
6 between the scanning electrodes that electrically connect the
It is clear at a glance that they are not. As described above, the scanning electrode 6 to be connected is
The thickness obtained by adding the thickness of the electrode 15 and the thickness of the electrode 15 is referred to as a solder particle.
Adhesive strength equal to or larger than the particle size of 17
Without lowering contact resistance and low contact resistance
It became clear that a very large current could be passed. By the way,Terminal gap LgPlace where
In this case, a short-circuit condition occurs.
A method to eliminate the short-circuit condition by applying a pulsed current
Established. In the above embodiment, the display element
Connection structure between the scanning electrode on the side and the conductor electrode on the printed circuit board
Although the present invention has been described, the present invention is
It can be applied to the connection structure with the conductor electrode on the lint board side.
It will be clear. [0071] According to the present invention, misalignment and poor contact can be prevented.
This flat without any flat panel terminals without causing
Easy connection to the terminal of the circuit that supplies signals to the panel
The flat panel display device provided with the above means is obtained.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram schematically showing a structure of a liquid crystal display element to be connected according to the present invention, together with a polymer film according to the present invention. FIG. 2 is a diagram showing states of terminals and electrodes connected by a polymer film of the present invention. FIG. 3 is a perspective view showing a state before connection of the electrodes of FIG. 2; FIG. 4 is a micrograph showing a state of dispersion of metal particles in a polymer film as an anisotropic conductive film according to the present invention. FIG. 5 is a diagram schematically showing a connection method using a polymer film according to the present invention. FIG. 6 is a diagram illustrating a state before connection in a failure example in which the particle diameter of metal particles of a polymer film is larger than the thickness obtained by adding the film thickness of the scanning electrode and the film thickness of the conductor electrode of the FPC. FIG. 7 is a diagram showing a state after connection in the failure example of FIG. 6; FIG. 8 is a diagram showing a state before connection in a preferred example in which the particle diameter of the metal particles of the polymer film is smaller than the thickness obtained by adding the thickness of the scanning electrode and the thickness of the conductor electrode of the FPC. FIG. 9 is a diagram showing a state after connection in the preferred example of FIG. 8; FIG. 10 is an end when the terminal pitch Lp is 250 μm.
It is a figure which shows the relationship between the child gap Lg and the frequency of occurrence of short circuits. FIG. 11 is a diagram showing a relationship between a film thickness of a terminal electrode and a terminal contact resistance. FIG. 12 is a diagram showing the relationship between the thickness of a terminal electrode and the adhesive strength of a connection portion. FIG. 13 is a diagram showing the relationship between the thickness of a terminal electrode, the thickness of an FPC conductor, contact resistance, and adhesive strength. FIG. 14 is a diagram illustrating a relationship between a terminal width Lw , a maximum energizing current, and a frequency of occurrence of short circuit. FIG. 15 is a micrograph showing a state of metal particles in a connection structure of a flat panel display device connected according to the present invention. [Description of Signs] 1 Polymer film 2 Molten metal 3 Liquid crystal display element 4 Flexible printed circuit board (FPC) 6 Scan electrode 7 Signal electrode 8 Liquid crystal 9 Alignment film 10 Scan electrode substrate 11 Signal electrode substrate 12 Sealant 13 Support material 14 Base Film 15 Electrode 16 Adhesive 17 Metal particles 18 Polymer film 19 Rigid substrate 20 Circuit conductor Lp Terminal pitch Lg Inter - terminal gap Lw = Lp-Lg Terminal width

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) G09F 9/00

Claims (1)

(57) [Claims] A display unit in which a plurality of electrodes are arranged and the plurality of electrodes
Panel display having a terminal for supplying a signal to the display
And conductors respectively connected to the terminals of the terminal portion.
Substrate, and contains a synthetic resin adhesive and metal particles.
The terminal and the
In flat panel display devices connected to conductors
Te, terminal pitch Lp between terminals gap between the terminals and the conductors
Lg and 0.5Lp <Lg <Lp , and the particle size of the metal particles dispersed in the adhesive is
The thickness of the terminal, the thickness of the conductor and the connection state
Characterized in that the thickness is not more than the sum of the thickness of the polymer film and
Panel display. 2. The flat panel display device according to claim 1, wherein the substrate is a flexible substrate . 3. The flat panel display device according to claim 1.
In the above, the plurality of electrodes of the flat panel display section may include a scanning electrode
And at least one of signal electrodes
Flat panel display. 4. The flat according to any one of claims 1 to 3.
In the panel display device, the metal particles in the polymer film may include nickel, copper, and solder.
Flat panel table characterized by one of the following:
Indicating device. 5. A flat according to any one of claims 1 to 4.
In the panel display device, the terminal pitch Lp of the terminal and the conductor and the inter-terminal gap
Lg and is a flat panel display instrumentation, characterized in that a relationship of Lg ≦ 0.6Lp
Place.