JP2879062B2 - Rigid molded flat circuit body and its manufacturing method - Google Patents
Rigid molded flat circuit body and its manufacturing methodInfo
- Publication number
- JP2879062B2 JP2879062B2 JP1235577A JP23557789A JP2879062B2 JP 2879062 B2 JP2879062 B2 JP 2879062B2 JP 1235577 A JP1235577 A JP 1235577A JP 23557789 A JP23557789 A JP 23557789A JP 2879062 B2 JP2879062 B2 JP 2879062B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit body
- flat circuit
- flat
- rigid
- rigid molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000004020 conductor Substances 0.000 claims description 16
- 238000005452 bending Methods 0.000 claims description 11
- 239000012212 insulator Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 description 9
- 230000001012 protector Effects 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
Landscapes
- Insulated Conductors (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、フレキシブルフラット回路体にプレス成形
を行って剛性を付与させ、配索部に適合する形状とした
リジッド成形フラット回路体に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a rigid molded flat circuit body which is formed by press-molding a flexible flat circuit body to impart rigidity and has a shape adapted to a wiring part. is there.
第５図は、従来のリジッド成形フラット回路体を示す
ものである。FIG. 5 shows a conventional rigid molded flat circuit body.
該リジッド成形フラット回路体17は、フレキシブル絶
縁基板２上にフラット導体３を貼着し、その上に絶縁被
覆４を被着してなるフレキシブルフラット回路体１に対
し、合成樹脂製の成形プロテクタ18を該絶縁基板２の外
側から貼着して成るものである。The rigid molded flat circuit body 17 is a flexible flat circuit body 1 in which a flat conductor 3 is adhered onto a flexible insulating substrate 2 and an insulating coating 4 is applied thereon. Is adhered from the outside of the insulating substrate 2.
該成形プロテクタ18は、該フラット回路体１の配索ス
ペースに合わせてその形状を設定したものであり、他部
品との干渉を防止したり、配索作業をしやすくするため
に用いられる。The shape protector 18 has its shape set in accordance with the wiring space of the flat circuit body 1, and is used to prevent interference with other parts and to facilitate the wiring work.
しかしながら、上記従来のリジッド成形フラット回路
体17にあっては、成形プロテクタ18を用いる関係で、製
品コストが高くなると共に、重量が増加し、さらに、成
形プロテクタ18の取付が面倒なことや、成形プロテクタ
18のためにフラット回路体１の放熱性が悪くなるといっ
た問題があった。However, in the conventional rigid molded flat circuit body 17, the use of the molded protector 18 increases the product cost, increases the weight, and further complicates the mounting of the molded protector 18, Protector
Therefore, there is a problem that heat dissipation of the flat circuit body 1 is deteriorated.
本発明は、上記した点に鑑み、成形プロテクタに起因
するコストアップや重量増加並びに放熱性の劣化を解消
することのできるリジッド成形フラット回路体及びその
製造方法を提供することを目的とする。In view of the above, it is an object of the present invention to provide a rigid molded flat circuit body capable of eliminating cost increase, weight increase, and deterioration of heat radiation caused by a molded protector, and a method of manufacturing the same.
上記目的を達成するために、本発明は、フラット導体
をフレキシブル絶縁体で被覆してなるフラット回路体に
対し、該フラット導体を断面折曲形状に成形する成形部
を該フラット導体の長手方向に形成すると共に、該フラ
ット回路体を該成形部の中間部より折曲形成して成る構
造、並びに、前記成形部の成形と、前記フラット回路体
の折曲成形とを熱プレス金型により同時に行う方法を採
用する。In order to achieve the above object, the present invention provides a flat circuit body in which a flat conductor is covered with a flexible insulator, and a forming portion for forming the flat conductor into a bent cross section in a longitudinal direction of the flat conductor. Forming and bending the flat circuit body from an intermediate portion of the forming section, and simultaneously forming the forming section and bending the flat circuit body using a hot press mold. Adopt the method.
フラット導体を断面折曲形状に成形するから、フラッ
ト回路体の曲げ剛性が増し、該フラット回路体をこの成
形部の中間部で折曲することにより、リジッドな成形が
可能となる。そして、これらの成形を熱プレス金型で同
時に行うことにより、効率的にリジッド成形フラット回
路体を得ることができる。Since the cross section of the flat conductor is formed in a bent shape, the bending rigidity of the flat circuit body is increased, and the flat circuit body is bent at an intermediate portion of the formed portion, thereby enabling rigid forming. By performing these moldings simultaneously with a hot press mold, a rigid molded flat circuit body can be efficiently obtained.
第１図〜第３図は、本発明に係るリジッド成形フラッ
ト回路体の一実施例を工程順に示すものである。1 to 3 show an embodiment of a rigid molded flat circuit body according to the present invention in the order of steps.
第１図は、フレキシブルフラット回路体を示す。該フ
レキシブルフラット回路体１は、厚さ50〜100μｍ程度
のポリエステルフィルム等のフレキシブル絶縁基板２に
対し、厚さ75〜100μｍ程度の圧延銅のフラット導体３
を複数貼着し、その上から該フレキシブル絶縁基板２と
同様の絶縁被覆４を被着して成るものである。FIG. 1 shows a flexible flat circuit body. The flexible flat circuit body 1 is made of a rolled copper flat conductor 3 having a thickness of about 75 to 100 μm on a flexible insulating substrate 2 such as a polyester film having a thickness of about 50 to 100 μm.
Are adhered, and an insulating coating 4 similar to the flexible insulating substrate 2 is applied thereon.
第２図は、第１図のフレキシブルフラット回路体１を
熱プレス金型5,6により成形する状態を示すものであ
る。ここで該熱プレス金型の雌型５には、フレキシブル
フラット回路体１に対して、後述する成形部を膨出する
ための凸条部７を複数突設し、雄型６には、該凸条部７
に対する凹条部８を刻設してある。また、熱プレス金型
5,6の形状は、フラット回路体９の配索スペースの形状
によって設定される。本実施例の場合、加圧力は10kg程
度、加熱温度は160℃以上に設定する。FIG. 2 shows a state in which the flexible flat circuit body 1 of FIG. 1 is formed by hot press dies 5 and 6. Here, the female mold 5 of the hot press mold is provided with a plurality of protruding ridges 7 for swelling a molded portion described later with respect to the flexible flat circuit body 1, and the male mold 6 has Ridge 7
The concave ridge portion 8 is engraved. Also hot press mold
The shapes 5 and 6 are set according to the shape of the wiring space of the flat circuit body 9. In the case of this embodiment, the pressing force is set to about 10 kg, and the heating temperature is set to 160 ° C. or more.
第３図（ａ）は、第２図によって成形されたリジッド
成形フラット回路体、（ｂ）は、（ａ）のＡ−Ａ断面を
示す。FIG. 3 (a) shows a rigid molded flat circuit body molded according to FIG. 2, and FIG. 3 (b) shows an AA cross section of (a).
該リジッド成形フラット回路体９は、絶縁被覆４の上
からフラット導体３に対し、該フラット導体３の長手方
向に断面折曲形状3aの突条成形部10を複数形成して、絶
縁基板２の外側に該突条成形部10を膨出させると共に、
フラット回路体9aを該突条成形部10の中間部11より折曲
成形して成ることを特徴とするものである。The rigid molded flat circuit body 9 is formed with a plurality of ridges 10 having a cross-sectional bent shape 3a in the longitudinal direction of the flat conductor 3 with respect to the flat conductor 3 from above the insulating coating 4. While bulging the ridge forming portion 10 to the outside,
The flat circuit body 9a is characterized by being formed by bending the intermediate portion 11 of the ridge forming portion 10.
ここで該フラット導体３は、突条成形部10において、
絶縁体（絶縁被覆４及び絶縁基板２）と共に断面ほぼ円
弧上3aに折曲成形されているから、高い曲げ剛性を有す
ると共に、その表面積を増加させているために放熱性に
優れ、通電時の加熱を防止することができる。また、該
突条成形部10は、複数のフラット導体３に対して交互に
別々のパターンで形成し、フラット回路体３の長手方向
に絶え間なく配設されているから、フラット回路体9aを
該突条成形部10の中間部11で折曲成形することにより、
リジッドなフラット回路体９を得ることができるのであ
る。Here, the flat conductor 3 is
It has a high bending rigidity because it is bent along a substantially circular cross section 3a together with the insulators (insulating coating 4 and insulating substrate 2). Heating can be prevented. Further, the ridge forming portion 10 is formed alternately and separately in a plurality of patterns on the plurality of flat conductors 3 and is arranged continuously in the longitudinal direction of the flat circuit body 3. By bending at the intermediate part 11 of the ridge forming part 10,
Thus, a rigid flat circuit body 9 can be obtained.
尚、図中、12は、端末補強板を示し、図示しないコネ
クタ等の相手接続側に接続しやすくするためのものであ
る。In the figure, reference numeral 12 denotes a terminal reinforcing plate for facilitating connection to a mating connection side such as a connector (not shown).
第４図（ａ）は、本発明に係るリジッド成形フラット
回路体の他の実施例を示し、（ｂ）は、（ａ）のＢ−Ｂ
断面図である。FIG. 4 (a) shows another embodiment of the rigid molded flat circuit body according to the present invention, and FIG. 4 (b) shows BB of FIG.
It is sectional drawing.
該リジッド成形フラット回路体13は、前記実施例と同
様に熱プレス金型（図示せず）を用いて、フレキシブル
フラット回路体１に対し、その長手方向に断面矩形状の
形成部14を形成し、フラット回路体13aを該成形部14の
中間部15で折曲成形したものであり、該成形部14の両側
端16には、夫々フラット導体３を位置させ、該フラット
導体３を長手方向に断面折曲形状3bに形成することによ
り、フラット回路体13aの曲げ剛性を高めているのであ
る。The rigid molded flat circuit body 13 forms a forming section 14 having a rectangular cross section in the longitudinal direction of the flexible flat circuit body 1 using a hot press mold (not shown) in the same manner as in the above embodiment. The flat circuit body 13a is formed by bending at the intermediate portion 15 of the molding portion 14, and the flat conductors 3 are located on both side ends 16 of the molding portion 14, respectively. By forming the cross section into the bent shape 3b, the bending rigidity of the flat circuit body 13a is increased.
以上の如くに、本発明によれば、フラット導体を断面
折曲形状に成形してフラット回路体の曲げ剛性を増し、
リジッド成形を可能としたから、従来の成形プロテクタ
を廃止でき、成形プロテクタに起因するコストアップや
重量増加並びに放熱性の劣化を解消することができる。
また、フラット回路体に成形部を突設しているから、放
熱性が向上し、通電時の加熱を防止することができる。
さらに、成形を熱プレス金型で行うことにより、簡単か
つ効率的にリジッド成形フラット回路体を得ることがで
きる。As described above, according to the present invention, the bending rigidity of the flat circuit body is increased by forming the flat conductor into a bent cross section,
Since the rigid molding is enabled, the conventional molding protector can be abolished, and the cost increase, weight increase and deterioration of heat radiation caused by the molding protector can be eliminated.
In addition, since the molded portion protrudes from the flat circuit body, heat dissipation is improved, and heating during energization can be prevented.
Furthermore, by performing molding with a hot press die, a rigid molded flat circuit body can be obtained simply and efficiently.
第１図〜第３図は本発明の一実施例を工程順に示し、第
１図はフレキシブルフラット回路体を示す斜視図、第２
図は成形方法を示す正面図、第３図（ａ）はリジッド成
形フラット回路体を示す斜視図、（ｂ）は（ａ）のＡ−
Ａ断面図、 第４図（ａ）は他の実施例を示す斜視図、（ｂ）は
（ａ）のＢ−Ｂ断面図、 第５図は従来例を示す斜視図である。 １…フレキシブルフラット回路体、２…絶縁基板、３…
導体、3a,3b…断面折曲形状、４…絶縁被覆、5,6…熱プ
レス金型、9,13…リジッド成形フラット回路体、9a…フ
ラット回路体、10,14…成形部、11,15…中間部。1 to 3 show one embodiment of the present invention in the order of steps, FIG. 1 is a perspective view showing a flexible flat circuit body, and FIG.
FIG. 3 is a front view showing a molding method, FIG. 3A is a perspective view showing a rigid molded flat circuit body, and FIG.
A sectional view, FIG. 4 (a) is a perspective view showing another embodiment, (b) is a BB sectional view of (a), and FIG. 5 is a perspective view showing a conventional example. DESCRIPTION OF SYMBOLS 1 ... Flexible flat circuit body, 2 ... Insulating board, 3 ...
Conductors, 3a, 3b: Bent cross section, 4: Insulation coating, 5, 6: Hot press mold, 9, 13: Rigid molded flat circuit body, 9a: Flat circuit body, 10, 14: Molded part, 11, 15 ... middle part.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−205010（ＪＰ，Ａ) 特開 昭63−128628（ＪＰ，Ａ) 特開 平２−94211（ＪＰ，Ａ) 特開 平２−94212（ＪＰ，Ａ) 特開 平１−307109（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01B 7/08 H01B 7/00 301 H01B 13/00 525 ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-63-205010 (JP, A) JP-A-63-128628 (JP, A) JP-A-2-94211 (JP, A) JP-A-2- 94212 (JP, A) JP-A-1-307109 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) H01B 7/08 H01B 7/00 301 H01B 13/00 525
Claims (2)
してなるフラット回路体に対し、該フラット導体を断面
折曲形状に成形する成形部を該フラット導体の長手方向
に形成すると共に、該フラット回路体を該成形部の中間
部より折曲形成して成ることを特徴とするリジッド成形
フラット回路体。1. A flat circuit body formed by covering a flat conductor with a flexible insulator, a forming portion for forming the flat conductor into a bent cross section is formed in the longitudinal direction of the flat conductor, and A rigid molded flat circuit body, wherein the rigid body is formed by bending a body from an intermediate portion of the molded portion.
の折曲成形とを熱プレス金型により同時に行うことを特
徴とするリジッド成形フラット回路体の製造方法。2. A method of manufacturing a rigid-formed flat circuit body, wherein the forming of the formed portion and the bending of the flat circuit body are simultaneously performed by a hot press mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1235577A JP2879062B2 (en) | 1989-09-13 | 1989-09-13 | Rigid molded flat circuit body and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1235577A JP2879062B2 (en) | 1989-09-13 | 1989-09-13 | Rigid molded flat circuit body and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03101008A JPH03101008A (en) | 1991-04-25 |
| JP2879062B2 true JP2879062B2 (en) | 1999-04-05 |
Family
ID=16988054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1235577A Expired - Fee Related JP2879062B2 (en) | 1989-09-13 | 1989-09-13 | Rigid molded flat circuit body and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2879062B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2735854B1 (en) * | 1995-06-22 | 1997-08-01 | Valeo Thermique Moteur Sa | DEVICE FOR ELECTRICALLY CONNECTING A MOTOR-FAN FOR A MOTOR VEHICLE HEAT EXCHANGER |
| JP2000207944A (en) * | 1999-01-12 | 2000-07-28 | Yazaki Corp | Circuit, manufacturing method of molded circuit, and mounting structure of circuit |
| JP5938777B2 (en) | 2010-07-12 | 2016-06-22 | 矢崎総業株式会社 | Wire harness, method of conveying wire harness and device, and method of connecting between devices using wire harness |
| JP5781289B2 (en) | 2010-10-15 | 2015-09-16 | 矢崎総業株式会社 | Wire harness wiring structure |
-
1989
- 1989-09-13 JP JP1235577A patent/JP2879062B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03101008A (en) | 1991-04-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |