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JP2795730B2 - Ultrasonic wire bonding method of coated wire and external lead for ultrasonic wire bonding of coated wire - Google Patents

Ultrasonic wire bonding method of coated wire and external lead for ultrasonic wire bonding of coated wire

Info

Publication number
JP2795730B2
JP2795730B2 JP2137559A JP13755990A JP2795730B2 JP 2795730 B2 JP2795730 B2 JP 2795730B2 JP 2137559 A JP2137559 A JP 2137559A JP 13755990 A JP13755990 A JP 13755990A JP 2795730 B2 JP2795730 B2 JP 2795730B2
Authority
JP
Japan
Prior art keywords
wire
ultrasonic
bonding
rough surface
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2137559A
Other languages
Japanese (ja)
Other versions
JPH0430546A (en
Inventor
英行 秋元
光一郎 向山
信一 花田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP2137559A priority Critical patent/JP2795730B2/en
Publication of JPH0430546A publication Critical patent/JPH0430546A/en
Application granted granted Critical
Publication of JP2795730B2 publication Critical patent/JP2795730B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
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    • H01L2224/4554—Coating
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は超音波ボンディング装置を利用して被覆線の
芯線をパッケージの外部リードに接続する被覆線の超音
波ワイヤボンディング方法及び被覆線の超音波ワイヤボ
ンディング用外部リードに関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an ultrasonic wire bonding method for a coated wire, in which a core wire of the coated wire is connected to an external lead of a package by using an ultrasonic bonding apparatus, and a method for bonding the coated wire. The present invention relates to an external lead for sonic wire bonding.

〈従来の技術〉 従来、この種の被覆線の超音波ワイヤボンディング方
法として例えば特開昭61−29142号公報に開示される如
く外部リードの平滑な上面に段差を形成し、被覆線をボ
ンディングとは異なる位置で外部リードの上面に圧接
し、そのまま該段差上を通過させてボンディング位置ま
で摺動することにより、被覆膜の摺接部が段差に引っ掛
って削り取られ芯線を露出して外部リードに接合させる
ものがあり、又特開昭63−248578号公報に開示される如
く外部リードの表面に粗面を形成し、この粗面に被覆線
を圧接させ超音波振動を与えることにより、被覆膜の接
触面が削り取られ芯線を露出して外部リードに接合させ
るものがある。<Prior Art> Conventionally, as an ultrasonic wire bonding method of this kind of covered wire, for example, a step is formed on a smooth upper surface of an external lead as disclosed in JP-A-61-29142, and the covered wire is bonded. Is pressed against the upper surface of the external lead at a different position, passes through the step as it is, and slides to the bonding position, so that the sliding contact portion of the coating film is caught by the step and is scraped off, exposing the core wire to the outside. Some are bonded to the lead, and a rough surface is formed on the surface of the external lead as disclosed in JP-A-63-248578, and the coated wire is pressed against the rough surface to give ultrasonic vibration, In some cases, the contact surface of the coating film is scraped off to expose the core wire and join it to an external lead.

〈発明が解決しようとする課題〉 しかし乍ら、このような従来の被覆線の超音波ワイヤ
ボンディング方法では前者の場合、被覆線が段差を一度
しか通過しないため、被覆膜を完全に除去できないこと
があり、特に段差の高さが被覆膜厚より小さい時には芯
線を確実に露出させることができず、残留した被覆膜が
ボンディングの邪魔となって接合強度が低く接触不良や
リードはがれ等の原因となるという問題がある。<Problems to be Solved by the Invention> However, in the former method of ultrasonic wire bonding of a covered wire, in the former case, since the covered wire passes through a step only once, the covering film cannot be completely removed. In particular, when the height of the step is smaller than the coating thickness, the core wire cannot be reliably exposed, and the remaining coating film hinders bonding, resulting in low bonding strength and poor contact or lead peeling. There is a problem that causes.

また後者の場合には削り取られた被覆膜が外部リード
上のボンディング位置に残留するため、ボンディングの
邪魔となり、特に粗面の表面粗さが被覆膜厚より小さい
時には加振開始直後に被覆膜が粗面の凹部に詰まって被
覆膜を完全に除去できず芯線を確実に露出させることは
できないという問題がある。In the latter case, the shaved coating film remains at the bonding position on the external lead, hindering the bonding. Particularly when the surface roughness of the rough surface is smaller than the coating film thickness, the coating film is immediately applied. There is a problem that the covering film is clogged in the concave portion of the rough surface, so that the covering film cannot be completely removed and the core wire cannot be reliably exposed.

これらの結果、外部リードに対する被覆線の加圧荷重
を大きくしたり超音波振動を長く与えて無理な接合をさ
せるために、外部リードのつぶれ厚さが薄くなって逆に
強度低下につながるという問題もある。As a result, in order to increase the pressing load of the coated wire against the external lead or to apply ultrasonic vibration for a long time to perform unreasonable bonding, the crushed thickness of the external lead becomes thinner, which in turn leads to a decrease in strength. There is also.

本発明は斯る従来事情に鑑み、被覆線の加圧荷重や超
音波振動による無理な接合をさせずに被覆膜を確実に除
去して接合強度を向上させることを目的とする。The present invention has been made in view of the above circumstances, and has as its object to improve the bonding strength by reliably removing a coating film without forcibly bonding a coated wire by a pressing load or ultrasonic vibration.

〈課題を解決するための手段〉 上記課題を解決するために本発明が講ずる技術的手段
は、外部リードの表面を被覆線の被覆膜厚と同程度又は
それ以上の表面粗さの粗面に形成し、この粗面に被覆線
を圧接させ超音波振動を与えて接合したことを特徴とす
る方法である。<Means for Solving the Problems> In order to solve the above problems, the technical measures taken by the present invention are as follows: the surface of the external lead is made to have a rough surface having a surface roughness equal to or greater than the coating film thickness of the coated wire. This method is characterized in that a coated wire is pressed against the rough surface and ultrasonic vibration is applied to join the coated wires.

そして被覆線を粗面に圧接させる前の時点で加熱する
方法が好ましく、更に被覆線をボンディング位置とは異
なる位置で粗面に圧接し、ボンディング位置まで摺動さ
せてから超音波振動を与える方法が好ましい。A method in which the coated wire is heated before being pressed against the rough surface is preferable. Further, a method in which the coated wire is pressed against the rough surface at a position different from the bonding position and is slid to the bonding position and then subjected to ultrasonic vibration Is preferred.

また被覆線との接触面を被覆線の被覆膜厚と同程度又
はそれ以上の表面粗さの粗面に形成したことを特徴とす
るものである。Further, the contact surface with the coated wire is formed on a rough surface having a surface roughness equal to or greater than the coating thickness of the coated wire.

〈作用〉 本発明は上記技術的手段によれば、被覆線をその被覆
膜と同程度又はそれ以上の表面粗さの粗面に圧接して超
音波振動を与えることにより、被覆膜の接触部が削り取
られて粗面の凹部内に入り込み芯線が露出して粗面の凸
部頂点と接合するものである。<Function> According to the above technical means, the present invention provides an ultrasonic vibration by pressing a coated wire against a rough surface having a surface roughness equal to or more than that of the coated film, thereby applying an ultrasonic vibration to the coated film. The contact portion is scraped off, enters the concave portion of the rough surface, exposes the core wire, and joins with the vertex of the convex portion of the rough surface.

そして粗面に圧接させる前の時点で被覆線を加熱する
ことにより、被覆膜が軟化して粗面との加圧・加振時に
剥離し易くなるものである。When the coated wire is heated before being pressed against the rough surface, the coated film is softened, so that the coated film is easily peeled off at the time of pressurization and vibration with the rough surface.

更に被覆膜をボンディング位置とは異なる位置で粗面
に圧接し、ボンディング位置まで摺動させてから超音波
振動を与えることにより、ボンディング位置に到達する
までの間に被覆膜の摺接部の大半が削り取られてボンデ
ィング位置に到達した時の被覆膜の摺接部の残留量を少
なくするものである。Further, the coating film is pressed against the rough surface at a position different from the bonding position, and is slid to the bonding position, and then subjected to ultrasonic vibration. Is reduced to reduce the residual amount of the sliding contact portion of the coating film when most of the coating film is scraped off and reaches the bonding position.

〈実施例〉 以下、本発明の一実施例を図面に基づいて説明する。<Example> An example of the present invention will be described below with reference to the drawings.

この実施例は第１図に示す如くボンディングツールと
してキャピラリ４を使用し、キャピラリヒータで被覆線
１を加熱しながら半導体チップ３の上面に形成される電
極3aに被覆線１の先端をボンディングした後、被覆線１
のループを形成し、外部リード２上のボンディング位置
P1とは異なる半導体チップ３寄りの位置P2に被覆線１を
着地させて圧接すると共に、そのまま被覆線１をボンデ
ィング位置P1まで摺動してから超音波振動を与える場合
を示すものである。In this embodiment, a capillary 4 is used as a bonding tool as shown in FIG. , Covered wire 1
And the bonding position on the external lead 2
This shows a case in which the covered wire 1 is landed and pressed against a position P 2 near the semiconductor chip 3 different from P 1, and the covered wire 1 is slid to the bonding position P 1 and then ultrasonic vibration is applied. is there.

被覆線１は例えばAu,Al−Si合金,Cu等からなる芯線1a
の外周面に例えば耐熱ポリウレタン，ホルマール等の熱
硬化性樹脂からなる被覆材を略均一に被覆して被覆膜1b
が形成される。The coated wire 1 is a core wire 1a made of, for example, Au, Al-Si alloy, Cu, or the like.
The outer peripheral surface is covered with a coating material made of a thermosetting resin such as heat-resistant polyurethane or formal, for example, in a substantially uniform manner.
Is formed.

外部リード２は例えばCu,Fe等からなるリード本体2a
の表面に例えばAg,Au等からなる導電部2bをメッキして
形成され、その上面にはボンディング位置P1から半導体
チップ３寄りの位置P2に亙って図示せる如く平滑なリー
ド本体2aの上面にメッキ加工して上記被覆膜1bの膜厚と
同程度又はそれ以上の表面粗さの粗面2cを形成するか、
或いはリード本体2aの上面にプレス加工等の機械的な加
工により目の細かい凹凸を設けてからメッキ加工して、
被覆膜1bの膜厚と同程度又はそれ以上の表面粗さの粗面
2cを形成する。The external lead 2 is a lead body 2a made of, for example, Cu, Fe, or the like.
Surface, for example, of Ag, is formed by plating a conductive portion 2b made of Au or the like, on its upper surface a smooth lead body 2a as shown, for over from the bonding position P 1 to position P 2 of the semiconductor chip 3 toward Forming a rough surface 2c with a surface roughness equal to or greater than the thickness of the coating film 1b by plating on the upper surface,
Alternatively, plating is performed after providing fine irregularities by mechanical processing such as pressing on the upper surface of the lead body 2a,
A rough surface having a surface roughness equal to or greater than the thickness of the coating film 1b
Form 2c.

キャピラリ４はその基部に伝達部材を介して超音波発
振器と電気的に接続する振動子が連設されると共に、XY
テーブル上に立設したボンディングヘッドが立設され、
これら超音波発生器及びXYテーブルを電気的に制御する
ことにより、被覆線１が粗面2c上に着地してからボンデ
ィング位置P1へ向けて所定長さ例えば30μ以上水平移動
させ、その後に超音波振動を与えるようにしている。A vibrator electrically connected to the ultrasonic oscillator via a transmission member is continuously provided at the base of the capillary 4, and XY
A bonding head standing on the table is set up,
By controlling these ultrasonic generator and the XY table electrically, it is horizontally moved by a predetermined length for example 30μ or more toward the bonding position P 1 from the landing to the covered wire 1 is rough on 2c, followed by ultra Sound wave vibration is given.

従って、本実施例によれば、被覆線１は粗面2cに圧接
する前の時点で加熱され被覆膜1bが軟化して芯線1aより
剥離し易くなると共に、粗面2cに着地して熱圧接されて
からボンディング位置P1に到達するまでの間に被覆膜1b
の摺接部の大半が削り取られて粗面2cの凹部2c1内に入
り込み、該摺接部の残留量が少なくなり、その後超音波
振動が与えられると芯線1aが完全に露出して粗面2cの凸
部2c2頂点と接合される。Therefore, according to the present embodiment, the coated wire 1 is heated before being pressed against the rough surface 2c, the coating film 1b is softened and easily separated from the core wire 1a, and the coated wire 1 lands on the rough surface 2c and becomes hot. coating film 1b between after being pressed to reach the bonding position P 1
Most of the sliding contact portion is scraped off and enters the concave portion 2c 1 of the rough surface 2c, the residual amount of the sliding contact portion decreases, and when ultrasonic vibration is applied thereafter, the core wire 1a is completely exposed and the rough surface is exposed. The protrusion 2c of 2c is joined to two vertices.

而して上記被覆膜1bの膜厚が異なる線径30μの被覆線
１を複数種類設けると共に、粗面2cの表面粗さの異なる
外部リード２を複数種類設け、これらをキャピラリ４の
加熱温度200℃で超音波併用熱圧着ワイヤボンディング
してプルテストした結果を次表に示す。Thus, a plurality of types of coated wires 1 having a wire diameter of 30 μm having different thicknesses of the coating film 1b are provided, and a plurality of types of external leads 2 having different surface roughnesses of the rough surface 2c are provided. The following table shows the results of a pull test performed by thermocompression wire bonding with ultrasonic waves at 200 ° C.

表に示されたプルテストによる引張り強度の測定結果
により粗面2cの表面粗さが被覆膜1bの膜厚より小さいも
のに比べ、粗面2cの表面粗さが被覆膜1bの膜厚と同程度
又はそれ以上になると、接合強度が増強されたことが理
解される。 The surface roughness of the rough surface 2c is smaller than the film thickness of the coating film 1b as compared with the surface roughness of the rough surface 2c according to the tensile strength measurement result by the pull test shown in the table. It can be understood that the bonding strength is enhanced when the strength is equal to or more than that.

尚、前示実施例においては被覆線１を外部リード２の
ボンディング位置P1とは異なる位置P2に着地させて圧接
した後にボンディング位置P1まで摺動してから超音波振
動を与えたが、これに限定されず、被覆線１を直接ボン
ディング位置P1に着地させて圧接した後に超音波振動を
与えるようにしても良い。Although applying ultrasonic vibration from the slide up to the bonding position P 1 was pressed by landing at different positions P 2 is the covered wire 1 and the bonding position P 1 of the outer lead 2 in the previous shows examples , not limited to this, and it is landed coated wire 1 directly to the bonding position P 1 be given ultrasonic vibrations after pressure welding.

また、キャピラリヒータにより被覆線１を粗面2cに圧
接させる前の時点で加熱したが、これも限定されず被覆
線１を加熱せず常温のまま粗面2cに圧接させても良い。In addition, although the coated wire 1 is heated before being pressed against the rough surface 2c by the capillary heater, the heating is not limited thereto, and the coated wire 1 may be pressed against the rough surface 2c at room temperature without heating.

〈発明の効果〉 本発明は上記の構成であるから、以下の利点を有す
る。<Effect of the Invention> Since the present invention has the above configuration, it has the following advantages.

被覆線をその被覆膜と同程度又はそれ以上の表面粗
さの粗面に圧接して超音波振動を与えることにより、被
覆膜の接触部が削り取られて粗面の凹部内に入り込み芯
線が露出して粗面の凸部頂点と接合するので、被覆線の
加圧荷重や超音波振動による無理な接合をさせずに被覆
膜を確実に除去して接合強度を向上させることができ
る。The coated wire is pressed against a rough surface having a surface roughness equal to or greater than that of the coating film, and ultrasonic vibration is applied, so that the contact portion of the coating film is cut off and enters the concave portion of the rough surface to insert the core wire. Is exposed and joined to the top of the convex part of the rough surface, so that the coating film can be surely removed without forcible joining by pressurizing load of the covering wire or ultrasonic vibration to improve the joining strength. .

従って、接触不良やリードはがれ等が発生せず、外部
リードのつぶれ厚さが薄くなることもなく確実に超音波
ボンディングできる。Therefore, ultrasonic bonding can be reliably performed without occurrence of contact failure, lead peeling, etc., and without reducing the collapsed thickness of the external lead.

粗面に圧接させる前の時点で被覆線を加熱すれば、
被覆膜が軟化して粗面との加圧・加振時に剥離し易くな
るので、ボンディング位置に残留する被覆材が更に減っ
て接合強度が向上する。If the coated wire is heated before it is pressed against the rough surface,
Since the coating film is softened and easily peeled off when pressed and vibrated with the rough surface, the coating material remaining at the bonding position is further reduced, and the bonding strength is improved.

被覆線をボンディング位置とは異なる位置で粗面に
圧接し、ボンディング位置まで摺動させてから超音波振
動を与えれば、ボンディング位置に到達するまでの間に
被覆膜の摺接部の大半が削り取られてボンディング位置
に到達した時の被覆膜の摺接部の残留量を少なくするの
で、接合強度が更に向上する。If the coated wire is pressed against the rough surface at a position different from the bonding position, and is slid to the bonding position and then subjected to ultrasonic vibration, most of the sliding contact portion of the coating film will arrive before reaching the bonding position. Since the remaining amount of the slidable portion of the coating film when it is scraped off and reaches the bonding position is reduced, the bonding strength is further improved.

【図面の簡単な説明】[Brief description of the drawings]

第１図は本発明の一実施例を示す被覆線の超音波ワイヤ
ボンディング方法及び被覆線の超音波ワイヤボンディン
グ用外部リードの部分縦断面図で被覆線が外部リード上
に着地した状態を示し、第２図は超音波振動を与える状
態を示す部分縦断面図である。 P1……ボンディング位置 P2……ボンディング位置とは異なる位置 １……被覆線 1b……被覆膜 ２……外部リード 2c……粗面FIG. 1 is a partial longitudinal sectional view of an ultrasonic wire bonding method of a covered wire and an external lead for ultrasonic wire bonding of the covered wire showing a state where the covered wire lands on the external lead, showing one embodiment of the present invention, FIG. 2 is a partial longitudinal sectional view showing a state in which ultrasonic vibration is applied. P 1 ...... bonding position P 2 ...... position 1 ...... covered wire 1b ...... coating film 2 ...... outer lead 2c ...... rough surface that is different from the bonding position

フロントページの続き (56)参考文献 特開 昭62−256444（ＪＰ，Ａ) 特開 昭57−160138（ＪＰ，Ａ) 特開 昭60−70736（ＪＰ，Ａ) 実開 昭58−89932（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 21/607 H01L 21/60 301Continuation of the front page (56) References JP-A-62-256444 (JP, A) JP-A-57-160138 (JP, A) JP-A-60-70736 (JP, A) , U) (58) Field surveyed (Int. Cl. 6 , DB name) H01L 21/607 H01L 21/60 301

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】外部リードの表面を被覆線の被覆膜厚と同
程度又はそれ以上の表面粗さの粗面に形成し、この粗面
に被覆線を圧接させ超音波振動を与えて接合したことを
特徴とする被覆線の超音波ワイヤボンディング方法。1. The surface of an external lead is formed on a rough surface having a surface roughness approximately equal to or greater than the coating thickness of a coated wire, and the coated wire is pressed against the rough surface to apply ultrasonic vibration to join. An ultrasonic wire bonding method for a covered wire, characterized in that: 【請求項２】被覆線を粗面に圧接させる前の時点で加熱
した請求項１記載の被覆線の超音波ワイヤボンディング
方法。2. The method according to claim 1, wherein the heating is performed before the coated wire is pressed against the rough surface. 【請求項３】被覆線をボンディング位置とは異なる位置
で粗面に圧接し、ボンディング位置まで摺動させてから
超音波振動を与えた請求項１又は２記載の被覆線の超音
波ワイヤボンディング方法。3. The method according to claim 1, wherein the coated wire is pressed against the rough surface at a position different from the bonding position, and is slid to the bonding position and then subjected to ultrasonic vibration. . 【請求項４】被覆線との接触面を被覆線の被覆膜厚と同
程度又はそれ以上の表面粗さの粗面に形成したことを特
徴とする被覆線の超音波ワイヤボンディング用外部リー
ド。4. An external lead for ultrasonic wire bonding of a covered wire, wherein a contact surface with the covered wire is formed on a rough surface having a surface roughness approximately equal to or greater than a coating film thickness of the covered wire. .
JP2137559A 1990-05-28 1990-05-28 Ultrasonic wire bonding method of coated wire and external lead for ultrasonic wire bonding of coated wire Expired - Lifetime JP2795730B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2137559A JP2795730B2 (en) 1990-05-28 1990-05-28 Ultrasonic wire bonding method of coated wire and external lead for ultrasonic wire bonding of coated wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2137559A JP2795730B2 (en) 1990-05-28 1990-05-28 Ultrasonic wire bonding method of coated wire and external lead for ultrasonic wire bonding of coated wire

Publications (2)

Publication Number Publication Date
JPH0430546A JPH0430546A (en) 1992-02-03
JP2795730B2 true JP2795730B2 (en) 1998-09-10

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Country Link
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5561565A (en) * 1992-04-22 1996-10-01 Canon Kabushiki Kaisha Magnetic tape recording and/or reproducing apparatus with detecting means
US7261230B2 (en) * 2003-08-29 2007-08-28 Freescale Semiconductor, Inc. Wirebonding insulated wire and capillary therefor
JP2007173363A (en) * 2005-12-20 2007-07-05 Fujitsu Ltd Flying lead joining method
JP5935025B2 (en) * 2011-06-21 2016-06-15 精電舎電子工業株式会社 Ultrasonic metal bonding equipment

Also Published As

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