JP2613901B2 - Reduction projection type exposure equipment - Google Patents
Reduction projection type exposure equipmentInfo
- Publication number
- JP2613901B2 JP2613901B2 JP62319245A JP31924587A JP2613901B2 JP 2613901 B2 JP2613901 B2 JP 2613901B2 JP 62319245 A JP62319245 A JP 62319245A JP 31924587 A JP31924587 A JP 31924587A JP 2613901 B2 JP2613901 B2 JP 2613901B2
- Authority
- JP
- Japan
- Prior art keywords
- reticle
- reduction projection
- holding mechanism
- projection type
- type exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体製造プロセスの中のフォトレジスト塗
布後の目合せ露光工程で使用される縮小投影型露光装置
（以後ステッパと称す）に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reduction projection type exposure apparatus (hereinafter referred to as a stepper) used in a aligning exposure step after a photoresist is applied in a semiconductor manufacturing process. is there.
従来、この種のステッパは、水平に設置された半導体
基板（以下、ウェハーという）の真上にレチクルを平行
に配設し、該レチクルに光を真上から入射、透過させ、
該レチクルに形成された回路パターンをウェハーに転写
する構造のものであった。Conventionally, a stepper of this type has a reticle disposed in parallel directly above a horizontally placed semiconductor substrate (hereinafter, referred to as a wafer), and allows light to enter and pass through the reticle from directly above,
The structure was such that a circuit pattern formed on the reticle was transferred to a wafer.
上述した従来のステッパは、レチクルが水平姿勢に保
持されているので、レチクルへゴミが付着しやすく、ま
た、レチクルの固定部が縮小レンズの真上にあるため、
該固定部より発生するゴミがレンズのディストーション
に悪影響を及ぼすという欠点がある。In the conventional stepper described above, since the reticle is held in a horizontal posture, dust easily adheres to the reticle, and since the fixed portion of the reticle is directly above the reduction lens,
There is a drawback that dust generated from the fixing portion adversely affects the distortion of the lens.
本発明の目的は前記問題点を解消した縮小投影型露光
装置を提供することにある。An object of the present invention is to provide a reduction projection type exposure apparatus which solves the above-mentioned problems.
前記目的を達成するため、本発明に係る縮小投影型露
光装置は、レチクル保持機構と、スライダと、光学系と
を有し、レチクルに光を入射，透過させ、該レチクル上
に形成された回路パターンを、水平に設置された半導体
基板に転写する縮小投影型露光装置であって、 レチクル保持機構は、レチクルを立て掛けて垂直姿勢
に保持するものであり、 スライダは、レチクルの半導体基板に転写する回路パ
ターンより下の部分でレチクルを保持し、該レチクルを
レチクル保持機構に出入れするものであり、 光学系は、レチクル保持機構に垂直姿勢に保持された
レチクルに光を直角に入射させ、その透過光を半導体基
板に向けて下向きに直角に屈折させるものである。In order to achieve the above object, a reduction projection type exposure apparatus according to the present invention has a reticle holding mechanism, a slider, and an optical system, and allows light to enter and pass through a reticle, thereby forming a circuit formed on the reticle. A reduction projection type exposure apparatus for transferring a pattern onto a horizontally disposed semiconductor substrate, wherein the reticle holding mechanism holds the reticle in a vertical position by holding the reticle, and the slider transfers the reticle to the semiconductor substrate on the reticle. The reticle is held in a portion below the circuit pattern, and the reticle is moved in and out of the reticle holding mechanism.The optical system makes light incident on the reticle held in a vertical posture by the reticle holding mechanism at a right angle. The transmitted light is refracted downward at a right angle toward the semiconductor substrate.
以下、本発明の一実施例を図により説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
第１図において、９はウェハーステージ部であり、該
ウェハーステージ部９上にウェハー８が水平に設置さ
れ、その真上に縮小投影レンズ７が設置されている。In FIG. 1, reference numeral 9 denotes a wafer stage, on which a wafer 8 is placed horizontally and a reduction projection lens 7 is placed just above the wafer.
本発明は、レチクル５を立て掛けて垂直姿勢に保持す
るレチクル保持機構４と、該レチクル保持機構４に垂直
姿勢に保持されたレチクル５に光を直角に入射させ、そ
の透過光をウェハー８に向けて下向きに直角に屈折させ
る光学系Ｌを有する。The present invention provides a reticle holding mechanism 4 for holding a reticle 5 in a vertical position by leaning the reticle 5 on the reticle 5 held in a vertical position by the reticle 5 and directing the light at right angles to the wafer 8. And has an optical system L for refracting downward at right angles.
前記光学系Ｌは、光を下方に出射するレジスト感光用
光源１と、該光源１からの光を水平方向に直角に屈折さ
せて紙置きのレチクル５に直角に入射させる対熱型光学
ミラー２と、コンデンサレンズ３と、レチクル５を透過
した光を下向きに直角に屈折させ縮小投影レンズ７に入
射させる対熱型光学ミラー６とを有する。The optical system L includes a resist exposure light source 1 for emitting light downward, and a thermal optical mirror 2 for refracting the light from the light source 1 at right angles in the horizontal direction so as to be incident on the reticle 5 on paper at right angles. And a condenser lens 3, and a thermal optical mirror 6 that refracts the light transmitted through the reticle 5 downward at a right angle and makes it incident on the reduction projection lens 7.
一方、前記レチクル保持機構４は、光学系Ｌの光学ミ
ラー２にて反射した光の光軸L1に平行な支持軸16aのま
わりに角回転する基台16と、該基台16上に設置され光軸
L1と直交方向に向けてモータ14により往復駆動されるＹ
軸ステージ161と、該Ｙ軸ステージ161に設置され上下方
向に向けてモータ13により上下駆動されるＺ軸ステージ
162と、Ｚ軸ステージ162上に光軸L1に対し垂直に立設さ
れ前後方向に開閉する対をなすレチクル保持枠11,11
と、レチクル保持枠11の中央部に開口された光の透過窓
11aと、保持枠11を固定する固定ネジ12と、対をなすレ
チクル保持枠11,11間にレチクル５を爪10aにて保持し出
し入れするスライダ10と、レチクル保持枠11のローテー
ションの補正を行うモータ15とを有する。Meanwhile, the reticle holding mechanism 4 includes a base 16 that angular rotation around parallel support shaft 16a in the optical axis L 1 of the light reflected by the optical mirror 2 of the optical system L, mounted on the base stand 16 The optical axis
Y reciprocatingly driven by the motor 14 toward the L 1 direction perpendicular
The axis stage 16 1, the upper and lower driven Z-axis stage by a motor 13 toward the installed vertically on the Y-axis stage 16 1
And 16 2, the reticle support frame 11, 11 a pair of opening and closing in the longitudinal direction are erected perpendicular to the optical axis L 1 on the Z axis stage 16 2
And a light transmission window opened at the center of the reticle holding frame 11.
11a, a fixing screw 12 for fixing the holding frame 11, a slider 10 for holding the reticle 5 between the pair of reticle holding frames 11 and 11 with the claw 10a, and a rotation of the reticle holding frame 11 are corrected. And a motor 15.
実施例において、対をなすレチクル保持枠11,11を前
後に開き、その間にスライダ10によりレチクル５を搬入
し、該レチクル５をレチクル保持枠11,11にて垂直姿勢
に立て掛けて保持し、該レチクル５に形成された回路パ
ターン部をレチクル保持11の透過窓11a内に配置し、保
持枠11を固定ネジ12により固定する。この状態でレチク
ル５のアライメントを行う。すなわち、モータ13により
ステージ162を上下方向に駆動してレチクル５の光軸L1
に対する上下方向の位置補正を行う。またモータ14によ
りステージ161を左右方向に駆動してレチクル５の光軸L
1に対する左右方向の位置補正を行う。さらにモータ15
によりレチクル保持枠11を光軸L1のまわりに角回転させ
てレチクル５のローテーションの補正を行う。In the embodiment, a pair of reticle holding frames 11 and 11 are opened back and forth, a reticle 5 is carried in by a slider 10 during the opening, and the reticle 5 is held upright on the reticle holding frames 11 and 11 in a vertical posture. The circuit pattern portion formed on the reticle 5 is arranged in the transmission window 11a of the reticle holding 11, and the holding frame 11 is fixed with the fixing screw 12. The reticle 5 is aligned in this state. That is, the stage 16 2 is driven in the up and down direction by the motor 13 to drive the optical axis L 1 of the reticle 5.
Is performed in the vertical direction. The optical axis L of the reticle 5 by driving the stage 16 1 in the lateral direction by the motor 14
Performs position correction for 1 in the left-right direction. Motor 15
Corrects the rotation of the reticle 5 by the reticle support frame 11 is angularly rotated about the optical axis L 1 by.
アライメント終了後、光源１からの光をミラー２にて
コンデンサレンズに通して垂直姿勢のレチクル５に直角
に入射させ、レチクル５を透過した光をミラー６により
縮小投影レンズ７に入射させてウェハー８のフォトレジ
スト上に照射し、レチクル５上の回路パターンをウェハ
ー８上に転写する。After the alignment is completed, the light from the light source 1 is passed through the condenser lens by the mirror 2 and is incident on the reticle 5 in the vertical position at a right angle. And the circuit pattern on the reticle 5 is transferred onto the wafer 8.
なお、以上実施例では第１図及び第２図に示した構造
を用いたが、本発明の特徴であるレチクル面をウェハー
面に対して垂直に位置させ、機械的にレチクルを固定す
る方式である限り、方法形状の如何は問わないものであ
る。In the above embodiment, the structure shown in FIGS. 1 and 2 is used. However, the reticle surface which is a feature of the present invention is positioned perpendicular to the wafer surface, and the reticle is mechanically fixed. As long as there is, the shape of the method does not matter.
以上説明したように本発明はレチクルを垂直に立て、
かつレチクルを押さえつける構造により、レチクルへの
ゴミの付着や、レチクル固定部のゴミ付着によるレンズ
ディストーションへの影響を防止できる効果がある。As described above, the present invention stands upright on the reticle,
In addition, the structure for holding down the reticle has an effect of preventing dust from adhering to the reticle and preventing lens adhesion from being attached to the reticle fixing portion.
第１図は本発明の一実施例を示す概念図、第２図は第１
図のレチクル保持機構の具体例を示す斜面図である。 １……レジスト感光用光源、2,6……光学ミラー ３……コンデンサレンズ、４……レチクル保持機構 ５……レチクル、７……縮小投影レンズ ８……ウェハー、10……スライダ 11……レチクル保持枠FIG. 1 is a conceptual diagram showing an embodiment of the present invention, and FIG.
FIG. 4 is a perspective view showing a specific example of the reticle holding mechanism shown in FIG. DESCRIPTION OF SYMBOLS 1 ... Light source for resist exposure, 2,6 ... Optical mirror 3 ... Condenser lens 4, ... Reticle holding mechanism 5 ... Reticle, 7 ... Reduction projection lens 8 ... Wafer, 10 ... Slider 11 ... Reticle holding frame
フロントページの続き (56)参考文献 特開 昭60−164325（ＪＰ，Ａ) 特開 昭64−42812（ＪＰ，Ａ) 実開 昭63−115213（ＪＰ，Ｕ)Continuation of front page (56) References JP-A-60-164325 (JP, A) JP-A-64-42812 (JP, A) JP-A-63-115213 (JP, U)
Claims (1)
とを有し、レチクルに光を入射，透過させ、該レチクル
上に形成された回路パターンを、水平に設置された半導
体基板に転写する縮小投影型露光装置であって、 レチクル保持機構は、レチクルを立て掛けて垂直姿勢に
保持するものであり、 スライダは、レチクルの半導体基板に転写する回路パタ
ーンより下の部分でレチクルを保持し、該レチクルをレ
チクル保持機構に出入れするものであり、 光学系は、レチクル保持機構に垂直姿勢に保持されたレ
チクルに光を直角に入射させ、その透過光を半導体基板
に向けて下向きに直角に屈折させるものであることを特
徴とする縮小投影型露光装置。An optical system includes a reticle holding mechanism, a slider, and an optical system. Light is incident on and transmitted through the reticle, and a circuit pattern formed on the reticle is transferred to a horizontally disposed semiconductor substrate. A reduction projection type exposure apparatus, wherein a reticle holding mechanism leans the reticle and holds the reticle in a vertical position, and a slider holds the reticle at a portion below a circuit pattern to be transferred to a semiconductor substrate of the reticle. The reticle is moved into and out of the reticle holding mechanism, and the optical system directs light at right angles to the reticle held in a vertical position by the reticle holding mechanism, and refracts the transmitted light downward at right angles toward the semiconductor substrate. A reduction projection type exposure apparatus characterized in that the exposure is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62319245A JP2613901B2 (en) | 1987-12-17 | 1987-12-17 | Reduction projection type exposure equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62319245A JP2613901B2 (en) | 1987-12-17 | 1987-12-17 | Reduction projection type exposure equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01160013A JPH01160013A (en) | 1989-06-22 |
| JP2613901B2 true JP2613901B2 (en) | 1997-05-28 |
Family
ID=18108033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62319245A Expired - Lifetime JP2613901B2 (en) | 1987-12-17 | 1987-12-17 | Reduction projection type exposure equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2613901B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018030060A1 (en) * | 2016-08-08 | 2018-02-15 | 株式会社ブイ・テクノロジー | Mask holding device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101116630B1 (en) | 2005-03-28 | 2012-03-07 | 엘지디스플레이 주식회사 | exposing apparatus for flat panel display device and substrate photolithography method using thereof |
| CN111367039B (en) * | 2016-07-07 | 2023-02-03 | 核心光电有限公司 | Linear ball guided voice coil motor for folded optical devices |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5779619A (en) * | 1980-11-06 | 1982-05-18 | Fujitsu Ltd | Mask cleansing device |
| DE3402178A1 (en) * | 1984-01-23 | 1985-07-25 | Werner Dr. Vaduz Tabarelli | DEVICE FOR PROJECT COPYING MASKS ONTO A WORKPIECE |
| JPH0530346Y2 (en) * | 1987-01-20 | 1993-08-03 | ||
| JPS6442812A (en) * | 1987-08-11 | 1989-02-15 | Nec Corp | Production lot number exposure device |
-
1987
- 1987-12-17 JP JP62319245A patent/JP2613901B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018030060A1 (en) * | 2016-08-08 | 2018-02-15 | 株式会社ブイ・テクノロジー | Mask holding device |
| TWI735630B (en) * | 2016-08-08 | 2021-08-11 | 日商Ｖ科技股份有限公司 | Mask holding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01160013A (en) | 1989-06-22 |
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