JP2675699B2 - Marking method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for marking a package.

[0002]

2. Description of the Related Art Currently, marking methods include a marking type marker method for marking with a rubber stamp and a laser marker method for marking with a laser.

The marking type marker method includes a method of hardening the ink by heating after printing with a rubber stamp and a method of hardening the ink by ultraviolet rays. Further, in the laser marker method, marking is performed by laser using a mark mask.

FIG. 5 shows a conventional marking mechanism for a semiconductor package which is continuous in a frame state. In FIG. 5, 1 is a package, 2 is a lead frame, 3 is a mark, 10 is a supply unit, 11 is a lead frame supply unit, 12
Is a magazine supply unit, 40 is a marking unit, 50 is a lead frame transport unit, 60 is a storage unit, 61 is a lead frame storage unit, and 62 is a magazine storage unit.

As shown in FIG. 5, in the marking type marker method, since the marking is made with a rubber stamp, the same pattern is marked on the package in the lead frame state, and in the laser marker method, the mark type is used. Change is usually done by converting the mark mask, and recently, it is possible to relatively easily change the model by reading the characters from the mask with dozens of characters by a signal, but the previous process Since there is no means for identifying the inspection result of 1), the same pattern is marked on the package in the lead frame state.

Further, in the case of marking individual packages based on the inspection result of the previous process, as shown in the conventional manufacturing flow of FIG. 4, after the individual packages are cut from the lead frame, the packages are collected by category and then marked. It is carried out.

[0007]

As described above, in the marking method, in order to make different markings for each package based on the result of the previous process, the rubber stamp must be changed every time the model is changed. In addition, the apparatus and operation become complicated, and in the laser marker method, there is no means for identifying the information of the inspection result of the previous process, so it is difficult to perform different marking for each package in the frame state.

Therefore, in the case of making different markings for each package based on the inspection result of the previous process, as shown in FIG. 4, after cutting each package from the lead frame, the packages are classified into categories and marking is performed. In other words, since individual products of the same category are stored in different trays, because one lot is divided into several lots, lot management that has been configured in lead frame units until now becomes package units, and there is no consistency in management. It gets complicated. Further, regarding the device, since the lead frame unit is changed to the package unit, it becomes difficult to handle the device, which causes a defect in the lead bending, which causes a problem in quality.

It is an object of the present invention to provide a method of marking different marks for each package in the lead frame state based on the inspection result of the previous process.

[0010]

The marking method of the present invention is a method for marking semiconductor packages that are continuous in a frame state. In the preceding step, the inspection result information of the semiconductor package mounted on the lead frame is attached to the lead frame. Is provided for each package, and in a subsequent step, the display is identified, and a mark corresponding to the result of the identification is attached to the package by a laser marking method. .

[0011]

By using the laser marker method, the display of the inspection result of the previous process can be identified, and different marks can be attached to each package in the lead frame state according to the identification result.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on one embodiment.

FIG. 1 is a block diagram of a marking device according to an embodiment of the present invention, FIG. 2 is a flow chart of a marking process when the present invention is used, and FIG. 3 is a plan view of a lead frame with an ID. 1 to 3, 1 is a package, 2 is a lead frame, 3 is a mark, 4 is an ID, and 5 is a feed hole. In addition, the marking device according to the present invention shown in FIG. 1 includes a supply unit 10 that supplies a magazine (not shown) and a lead frame 2 and an identification unit 20 that identifies an ID 4.
The storage unit 30 for storing the data of No. 4 and the marking unit 40 for marking the package 1 by changing the mark mask based on the model data sent from the storage unit 30, the transport unit 50 for transporting the lead frame 2, and the lead It is composed of a frame 2 and a storage unit 60 for storing a magazine (not shown). In addition, the supply unit 10 includes the lead frame 2
The lead frame supplying section 11 for supplying the carrier to the conveying section 50 and the magazine supplying section 12 for supplying a magazine (not shown) to the lead frame supplying section 11.

The identification unit 20 includes a sensing unit 21 for sensing the ID4 added to each package 1 on the lead frame 2 and a determination unit 22 for determining the sensing content of the sensing unit 21.

The storage unit 60 stores a lead frame storage unit 61 for storing the lead frame 2 sent from the transfer unit 50 and a magazine (not shown) filled with the lead frame 2 from the lead frame storage unit 61. It comprises a magazine storage unit 62 for storing.

Next, the marking process of one embodiment of the present invention will be described.

First, the ID 4 of each package 1 is added to the lead frame 2 based on the inspection result of the previous process.
For the ID 4, the presence or absence of a hole (FIG. 3A), a bar code (FIG. 3B), a colored sticker (FIG. 3C), etc. are used. When ID4 is indicated by the presence or absence of holes, the same number of sensors as the maximum number of holes are provided for identification, or image recognition is performed to collectively read and identify. I
When D4 is indicated by a barcode, it is identified by a barcode reader, and when it is indicated by a colored sticker, it is identified by a color difference determination sensor. The method of indicating ID4 is not limited to this embodiment. Next, a magazine (not shown) filled with the lead frame 2 with ID4 is set in the magazine supply unit 12, and the magazine (not shown) is supplied from the magazine supply unit 12 to the lead frame supply unit 11. Then, the lead frame supply unit 11 supplies the lead frames 2 one by one to the transport unit 50.

Next, the sensing section 21 senses the ID4 of the lead frame 2 being conveyed, and the result obtained by the sensing section 21 is sent to the discriminating section 22 and converted into ID information.

Next, from the ID data storage unit 31 and the discrimination unit 22 in which the data of ID4 is stored in advance,
The ID4 data and the ID information are sent to the matching unit 32 and matched, and the category of the package 1 having the ID4 is identified.

Next, the collating unit 3 in the marking unit 40.
The laser marker method is used to browse the required characters by the category signal from 2 to change the model of the mark 3 and mark the package 1.

Lead frame 2 with marking completed
Is stored in the lead frame storage 61, stores a magazine (not shown) filled with the lead frame 2 in the magazine storage 62, and supplies an empty magazine (not shown) to the lead frame storage 61. .

[0022]

As described in detail above, by using the present invention, it is possible to easily perform different marking for each package in the lead frame state based on the inspection result of the previous process. Therefore, according to the inspection result, a device effective for marking the IC in which each package is divided into categories can be obtained.

Further, when different markings are applied to each package, as shown in FIG. 2, since the lead frame state can be maintained until the marking step, management and handling of the device can be easily performed, and defects relating to lead bending occur. Can be suppressed.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a marking device according to an embodiment of the present invention.

FIG. 2 is a marking process flow chart according to the present invention.

FIG. 3 is a plan view of a lead frame with an ID.

FIG. 4 is a configuration diagram of a conventional marking device.

FIG. 5 is a flowchart of a conventional marking process.

[Explanation of symbols]

 1 Package 2 Lead frame 3 Mark 4 Identification display (ID) 5 Feeding hole 10 Supply section 11 Lead frame supply section 12 Magazine supply section 20 Identification section 21 Sensing section 22 Discrimination section 30 Storage section 31 ID data storage section 32 Collation section 40 Marking Part 50 Transport part 60 Storage part 61 Lead frame storage part 62 Magazine storage part

Claims (1)

(57) [Claims] 1. A method of marking semiconductor packages connected in a frame state, wherein in a previous step, a display of inspection result information of the semiconductor packages mounted on the lead frame is attached to each lead frame, And a step of identifying the display and attaching a mark corresponding to a result of the identification to a package by a laser marking method in a subsequent step.