JP2657031B2 - Optical disk drive - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical disk device,
The present invention relates to an optical disk device that can be used as a medium- replaceable storage device.

2. Description of the Related Art At present, a medium- replaceable storage medium device is required to be small and thin, and a large storage capacity is required for storing image information.

[0003] Although the IC memory card device is thin, it has a small storage capacity.

A 3.5-inch floppy disk drive is too large in shape and insufficient in storage capacity.

[0005] Therefore, it is desired to reduce the size and thickness of an optical disk device that uses an optical disk having a large storage capacity as an exchangeable medium so that the optical disk device can be used as a medium-replaceable device.

[0006]

2. Description of the Related Art In a conventional optical disk drive 1, as shown schematically in FIG.
It is configured to move linearly while being supported by.

The optical head device 2 is entirely composed of an optical disc 4
It is located underneath.

[0008]

Height H ₁ of the optical disc apparatus 1 [SUMMARY OF THE INVENTION] is a dimension height of H ₂ optical head device 2 is directly added to the thickness t ₁ of the optical disc 3.

For this reason, it has been difficult to reduce the thickness of the optical disk device 1.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an optical disk device which is thinned so that the optical disk can be accommodated in a portion corresponding to the height of the optical head device.

[0011]

According to a first aspect of the present invention, there is provided a spindle motor for rotating a mounted optical disk, and swinging in a plane parallel to a recording surface of the mounted optical disk so as to move the objective lens. more will swing type optical head apparatus is moved in the radial direction of the optical disc, the swing-type optical head apparatus, a head main body that is swingably supported by the bearings, drive that is pivoted to said head body movement more a means, the bearing, the site outside from the mounted optical disc, a且one drive means is provided to the site of the objective lens and the substantially opposite side with respect to the bearing, the shaft受及beauty drive motion means In this configuration, the height includes the thickness of the loaded optical disk.

According to a second aspect of the present invention, in the optical disk of the first aspect, the outer diameter is 1.8 inches or less.

According to a third aspect of the present invention, in the optical disk of the first aspect, the disk substrate has a thickness of 0.2 to 0.5 mm. According to a fourth aspect of the present invention, the head body according to the first aspect includes a main body near the swing center and an arm extending from the disk, and the objective lens is provided at a tip of the arm. The optical component is provided exclusively on the main body . The invention of claim 5 is
According to a fourth aspect of the invention, there is provided a head body having a case for sealing the plurality of optical components.

According to a sixth aspect of the present invention, in the swing type optical head device according to the first aspect, the objective lens and the drive coil which are displaceably provided on the head main body, and a magnetic flux which acts on the drive coil are generated. And a focusing actuator comprising a magnetic circuit fixedly provided outside the head body.

According to a seventh aspect of the present invention, the head body according to the sixth aspect further comprises a non-magnetic thin film covering the drive coil with respect to the magnetic circuit.

According to an eighth aspect of the present invention, the focusing actuator according to the sixth aspect is configured to further include a dynamic vibration absorber.

[0017] The invention of claim 9, the head body according to claim 4, in which a structure having a bearing for pivotably supported on the peripheral side surface of the body portion.

[0018] The invention of claim 10, drive motion means according to claim 1, and fixing the permanent magnet to the head body, in which a and becomes a configuration fixing a drive coil yoke.

According to an eleventh aspect of the present invention, in the focusing actuator according to the sixth aspect, there are provided two parallel-arranged leaf springs having the same shape. And a viscoelastic damping material.

According to a twelfth aspect of the present invention, there is provided a spindle motor for rotating a mounted optical disk, and a swinging movement in a plane parallel to a recording surface of the mounted optical disk to move an objective lens in a radial direction of the optical disk. A swing type optical head device, wherein the swing type optical head device comprises a main body portion and an arm portion extending from the main body portion,
A head body having an objective lens at the tip of the arm portion,
The head body is fixed to a portion outside the mounted optical disk, and comprises a swing center fixed shaft penetrating the center of the main body, and a bearing fitted to the fixed shaft, and the head main body can be swung. a pivot support means for supporting the, is provided with a portion of the objective lens and the substantially opposite side with respect to the rocking supporting means, more will drive motion means that is rocked to the head body,
And a semiconductor laser chip, a first optical component for directing a laser beam emitted from the semiconductor laser chip to the objective lens, and a laser beam reflected by the optical disk and returned to the photodetector in the main body. The optical path of the laser light emitted from the semiconductor laser chip toward the objective lens and the optical path of the laser light reflected from the optical disk and returned to the photodetector are:
Will be disposed so as to be formed so as to surround the fixed shaft is and that the configuration including the thickness of the swing support means及beauty height in the mounted optical disk in the drive unit.

According to a thirteenth aspect of the present invention, the optical disk according to the twelfth aspect has a configuration in which the outer diameter is 1.8 inches or less.

According to a fourteenth aspect of the present invention, in the optical disk of the twelfth aspect, the disk substrate has a thickness of 0.2 to 0.5 mm.

According to a fifteenth aspect of the present invention, the head body according to the twelfth aspect has an inverted U-shaped frame and a sheet covering the lower surface thereof.

According to a sixteenth aspect of the present invention, the main body of the thirteenth aspect has a hole through which the fixed shaft penetrates and in which the bearing is fitted. An optical component, a block portion having an optical component mounting portion for mounting the second optical component, the block portion is swingably supported by the fixed shaft, and the optical component mounting portion of the block portion has The semiconductor laser chip, the first optical component, and the second optical component are mounted.

According to a seventeenth aspect of the present invention, the head body according to the twelfth aspect is disposed above and below the arm portion in parallel with the arm portion, the base portion is fixed to the main body portion, and the head portion is mounted on the distal end side. This configuration further includes a parallel leaf spring mechanism including a pair of leaf springs to which a lens is attached.

The invention according to claim 18 has a rising mirror for raising the laser light emitted from the main body and directing the laser light toward the objective lens at the tip of the arm according to claim 12,
The rising mirror is fixed in an angle-adjusted state so that an error in the angle of incidence on the objective lens falls within an allowable range.

[0027]

[0028]

[0029]

[0030]

[0031]

[0032]

[0033]

[0034]

[0035]

[0036]

[0037]

According to the first aspect of the present invention, the optical head device is of a swing type, and the bearing of the optical head device is provided outside the optical disk, so that the optical disk does not cover the bearing portion of the head main body and is mounted. The optical disk acts so as to be included within the height of the bearing.

The structure arranged in the objective lens and the substantially opposite side with respect to the swing center of the drive means, it acts to not to apply the optical disc on the upper side of the drive hand stage, and in the height of the drive means mounted optical disk Acts to include.

[0039]

According to the second aspect of the present invention, the configuration in which the diameter of the optical disk is 1.8 inches acts so that the plane size of the optical disk device becomes the size of the IC memory card device.

According to the third aspect of the present invention, the configuration in which the thickness of the optical disk is set to 0.3 mm acts to make the optical components ultra-small.

The main body portion in the fourth aspect of the present invention acts as a mounting portion of the optical component, structure in which exclusively the main body portion of the optical component acts the inertia moment of the swing of the head body so that the small.

In the invention of claim 5, the case acts to protect the optical component.

According to the sixth aspect of the present invention, the configuration in which the magnetic circuit is provided outside the head main body acts to reduce the moment of inertia of the head main body.

In the invention of claim 7, the non-magnetic film is
It acts to pass the magnetic flux from the magnetic circuit and acts to protect the head body from dust.

In the eighth aspect of the present invention, the structure provided with the dynamic vibration absorber acts to suppress the mechanical higher-order resonance of the focusing actuator.

According to the ninth aspect of the present invention, the bearing supporting the peripheral side surface of the disk portion enhances the angular rigidity of the swing of the head body.

In the tenth aspect of the present invention, the configuration in which the permanent magnet is movable and the drive coil is fixed works so as to be advantageous in reducing the thickness.

In the eleventh aspect of the present invention, the damping material on one entire surface of the leaf spring acts to suppress the mechanical main resonance and higher-order resonance of the focusing actuator.

According to the twelfth aspect of the present invention, the optical head device is a swing type, and the swing center fixed shaft is outside the optical disk, so that the optical disk does not cover the swing center fixed shaft portion of the head body. And acts to include the loaded optical disk within the height of the bearing.

The structure arranged in the objective lens and the substantially opposite side with respect to the swinging supporting means drive means acts to the optical disk is not applied to the upper side of the drive means, and the height of the drive motion means the mounted optical disk Acts to be included.

The structure in which the center fixed shaft penetrates the main body acts to increase the rigidity of the swing of the head main body.

The configuration in which the optical component is disposed so that the optical path is formed so as to surround the center fixed shaft acts so as to allow the center fixed shaft to pass through the head body, and incorporates the optical component. It works to make the main body part to be small.

According to the thirteenth aspect of the present invention, the configuration in which the diameter of the optical disk is 1.8 inches or less acts so that the plane size of the optical disk device becomes the size of the IC memory card device.

In the fourteenth aspect of the present invention, the configuration in which the thickness of the optical disk is set to 0.2 to 0.5 mm acts to make the optical component ultra-small.

In the fifteenth aspect, the hollow structure of the inverted U-shaped frame and the sheet covering the lower surface of the frame acts so that a tracking actuator other than the oscillating means of the optical head device becomes unnecessary.

In the sixteenth aspect, the block portion having the optical component mounting portion functions to enable the optical component to be mounted easily and with high positional accuracy.

In the seventeenth aspect, the configuration in which the leaf springs are disposed on the upper and lower sides of the arm portion acts to separate the upper and lower leaf springs.

According to the eighteenth aspect of the present invention, the configuration for adjusting the rising mirror reduces the direction of position adjustment of the semiconductor laser chip by that amount, and the semiconductor laser chip operates so that only position adjustment in the optical axis direction is sufficient.

[0060]

[0061]

[0062]

[0063]

[0064]

[0065]

[0066]

[0067]

【Example】

[First Embodiment] FIGS. 1 and 2 show the overall configuration of an optical disk device 10 according to a first embodiment of the present invention.

The optical disk device 10 has a configuration in which a spindle motor 14 and a swing type optical head device 15 are incorporated in a housing 13 including a lower cover 11 and an upper cover 12. A rewritable phase-change optical disk 17 is mounted on a spindle 16 of the spindle motor 14 in such a manner that the optical disk 17 is magnetically attracted to a metal-type hub 18 and can be detached therefrom. This optical disc 17 has a diameter D of 1.8 inches and a thickness t of 0.3 mm or 0.6 mm when two discs are stuck together.

The optical disk device 10 has a length L of 75
mm, the width W is 48 mm, the height H ₃ 5 mm, a small and thin, it is slightly smaller size than the IC memory card.

Next, the oscillating optical head device 1 which contributes to making the optical disk device 10 thinner is possible.
5 will be described.

As shown in FIG. 3, reference numeral 20 denotes a head main body, which is composed of a disk portion 21 having a radius R ₁ (about 7 mm) and an arm portion 22 extending therefrom, and is hollow.
Has a sealed structure.

The head body 20 is pivotally supported on the peripheral side surface 21a of the disk portion 21 by a bearing 23 as described below.

On the peripheral side surface 21a, an arc-shaped rail 2 with a V-groove is provided.
4 and 25 are fixed, and form a movable inner ring portion of the bearing 23.

The lower cover 11 has an arc-shaped rail 2 with a V-shaped groove.
6 and 27 are fixed so as to face the rails 24 and 25, and form a fixed outer ring portion of the bearing 23.

Opposing V-grooves 24 of rails 24 and 26
As shown in FIG. 4, a plurality of small-diameter steel balls 28 are fitted into the a and 26a at a distance by a retainer 29. Similarly, opposed V-grooves 2 of rails 25 and 27
A hard sphere 28 is also fitted in 5a and 27a.

As a result, the head body 20 is supported by the bearing structure 23, and has arrows 32, 3 around a swing center axis 31 which is the Z axis passing through the center 30 of the disk portion 21.
It can swing in three directions.

The head body 20 swings in a plane parallel to the recording surface 17a of the loaded optical disc 17, and an objective lens 50 described later is moved in the radial direction of the loaded optical disc 17.

Here, as shown in FIG.
H_FourIs the thickness t of one rail 24 _TwoSmall corresponding to
It has dimensions and is thin.

Further, since the radius R ₁ is as large as about 7 mm, the angular rigidity of the bearing 23 is large. For this reason, the optical head device 15 is accurately positioned.

The bearing 23 is located outside the loaded optical disk 17 in a plan view.
The whole 1 is located outside the region 34 when the mounted optical disk 17 is projected onto the lower cover 11.

As shown in FIG. 2, the disk portion 21 and the optical disk 17
A relationship which falls within a range of a height H _5.

Therefore, the height H _{3 of the} optical disk device 10
Is Sadamari by the height H ₅ of the disc portion 21, the optical disk 1
7 is not affected by the thickness t ₁ , and the optical disk device 10 is thinner than before.

The rails 24 and 25 are connected to the disk portion 21.
Can also be provided integrally on the peripheral side surface of. This allows
The diameter of the bearing 23 can be reduced, and the optical disk device 10 can be further reduced in size.

A plurality of optical components are assembled inside the disk portion 21 as described later.

The arm 22 is mounted on the optical disc 1
7 is provided to extend below.

A flexible cable 35 is provided so as not to limit the swing of the head main body 20.

Next, the electromagnetic drive device 40 for swinging the head body 20 will be described with reference to FIGS.

The electromagnetic driving device 40 is a permanent magnet type motor, and the objective lens 5 to be described later is
It is arranged on the side opposite to 0, and is located outside the region 34 like the above-mentioned disc portion 21.

Reference numerals 41 and 42 denote plate-shaped permanent magnets, which are bonded and fixed to the disk portion 21, extend in the opposite direction to the arm portion 22, and are arranged in the circumferential direction of the disk portion 21. .

The permanent magnet 41 is magnetized in the positive direction of the Z axis.
The permanent magnet 42 is magnetized in the negative direction.

43 is a fixed yoke and is fixed to the lower cover 11.

Reference numeral 44 denotes a drive coil, which is bonded and fixed inside the fixed yoke 43 and faces the permanent magnets 41 and 42.

In the magnetic circuit composed of the permanent magnets 41 and 42 and the fixed yoke 43, a magnetic flux φ flows as shown in FIG.

When the drive coil 44 is energized, a force in the direction of the arrow X acts on the permanent magnets 41 and 42 due to the interaction between the magnetic flux and the current, the head body 20 is swung, and the objective lens 50 to be described later is moved to a desired track on the optical disk 17. Is positioned.

Here, the electromagnetic driving device 40 is provided not on the lower side of the loaded optical disk 17 but on a portion outside the optical disk 17 and the height H ₆
Is not restricted. Therefore, the height H ₆ can be sufficiently set, and the electromagnetic driving device 40 can generate a sufficient driving force, and has good driving characteristics.

The above-described device 40 has a structure in which the permanent magnets 41 and 42 are movable and the drive coil 44 is fixed. Compared with a structure in which the permanent magnet is fixed and the drive coil is movable, the device 40 can be configured to be thinner and advantageous. It is.

Next, the internal structure of the head main body 20 will be described with reference to FIGS.

The head main body 20 will be described below in a case 49 including a case main body 47 including a bottom plate 45 and a rising peripheral wall 46 along the peripheral edge thereof, and a top plate 48 covering the case main body 47. In this manner, various optical components are incorporated.

The case body 47 and the top plate 48 are made of aluminum alloy, ceramics or fiber reinforced resin and are light.

Reference numeral 50 denotes an objective lens, and reference numeral 63 denotes a rising reflecting mirror, which is provided at the tip end 12 of the arm 22.

The objective lens 50 is a single lens having both surfaces made aspherical, and is thinner than a general objective lens composed of a plurality of lenses.

The optical components other than the objective lens 50 and the reflecting mirror 63 are all disposed in the disk portion 21 and near the oscillation center axis 31 as described later.

Reference numeral 51 denotes a semiconductor laser chip, which is bonded on a silicon substrate 52. This silicon substrate 52
Is mounted on a heat sink 53 made of copper, and the heat sink 53 is bonded to the bottom plate 45.

The semiconductor laser chip 51 is not packaged, and the height from the substrate 54 to the semiconductor laser chip 51 is smaller than the height of the package when the semiconductor chip is packaged.

Numeral 55 denotes a collimating lens, which is a single lens having an aspherical surface.

Reference numeral 56 denotes a composite optical element, which includes a beam shaping prism 57, a deflecting beam splitter 58, and a prism 5.
It has a structure in which the 9, 1/4 wavelength plate 60 is integrated.

Reference numerals 61 and 62 denote photodetectors.

A tracking actuator 65 is provided at the base of the arm 22. A triangular prism-shaped reflecting mirror 66 is supported by a leaf spring 67, and its detailed structure will be described later.

At the tip of the arm 22, a movable portion 71 of the focusing actuator 70 is provided as shown in FIG.

In FIG. 7, a laser beam 80 emitted from a semiconductor laser chip 51 is converted into a parallel beam 81 through a lens 55, enters a prism 57, and is shaped into a perfect circle. Thereafter, the light passes through the polarization beam splitter 58 and the １ ／ wavelength wave 60, reaches the tracking actuator 65, is reflected by the reflecting mirror 66, and travels in the arm 22 toward the distal end as indicated by reference numeral 82. Then, as shown in FIG. 9, it is raised by the reflecting mirror 63, converged through the objective lens 50, and condensed on the optical disk 17.

The laser beam reflected by the optical disk 17 returns to the polarization beam splitter 58 by following the same path.
The light is reflected by the deflection beam splitter 58 and reaches the photodetectors 61 and 62 as indicated by reference numeral 83.

The outputs of the photodetectors 61 and 62 are appropriately calculated, and a reproduction signal, a tracking control signal, and a focus control signal are extracted.

As shown in FIG. 7, the heat sink 53, the composite optical element 56, and the tracking actuator 65
Since the head body 21 is arranged near the swing center axis 31, the moment of inertia of the head body 21 around the swing center axis 31 is small, and the access is performed at high speed.

Further, since there is no axis penetrating the disk portion, the degree of freedom of arrangement of the composite optical element 56 and the like is high, and the composite optical element 56 and the like are arranged closer to the swing center axis 31. I have.

At this point as well, the moment of inertia of the head body 21 about the swing center axis 31 is smaller, and the access is performed at a higher speed.

Although the semiconductor laser chip 51 is not packaged and is in a naked state, since the head body 20 has a sealed structure, the semiconductor laser chip 5
1 is assured of reliability.

Although the head body 20 has a sealed structure, the heat generated from the semiconductor laser chip 51 is transmitted to the bottom plate 45 through the heat sink 53 and is radiated well outside the head body 20.

Next, the tracking actuator 65 will be described with reference to FIG.

An L-shaped holder 90 is provided with a triangular prism-shaped reflecting mirror 6.
6 and the drive coil 91 are fixed.

The holder 90 is supported by the wall of the head main body 20 via a leaf spring 67.

The head body 20 has permanent magnets 92 and 93.
And a magnetic circuit structure 95 including a yoke 94 are fixed. The drive coil 91 is provided with a gap 96 of the magnetic circuit structure 95.

When a tracking control current is applied to the drive coil 91, a force Fa in the Y direction is generated in the coil 91.
The reflecting mirror 66 rotates around the Z-axis with the deflection of the leaf spring 67, and deflects light in the XY plane.

Thus, the spot on the optical disk 17 narrowed down by the objective lens 50 follows the minute fluctuation of the track, and the tracking control is performed.

The tracking actuator 65
Determines the position of the drive coil 91 as appropriate, and
However, the configuration acts on the position of the node of the secondary bending mode resonance of the leaf spring 67.

Therefore, the resonance of the secondary bending mode of the leaf spring 67 is suppressed, and the tracking actuator 64 has good mechanical vibration characteristics.

As the head body 20 swings, the movable portion of the tracking actuator 65 has a centrifugal force Fc and the swinging motion of the head body 20 in the circumferential direction, as shown in FIG. The inertial force Fi works. This force Fc, F
i acts as a disturbance. In the case of oscillating motion, generally Fi>
Fc.

Therefore, the leaf spring 67 is disposed in a direction in which the longitudinal direction having a large rigidity coincides with the circumferential direction of the oscillating movements 32 and 33 of the head main body 20.

Thus, even if the force Fi acts, the leaf spring 6
7, the tracking actuator 65 operates normally, and the tracking control is performed with high accuracy.

Next, the focusing actuator 70
Will be described with reference to FIGS.

As shown in FIGS. 9 and 10A, the objective lens 50 is attached to an L-shaped holder 100.

The holder 100 is fixed to the ends of two leaf springs 101 and 102 of the same shape arranged in parallel.

As shown in FIG. 10B, the leaf spring 10
Reference numerals 1 and 102 denote a vibration damping material 109b made of a silicon rubber-based viscoelastic material over the entire surface of one surface of the spring metal plate 109a.
And a thin and soft resin film 109c.

T ₁₁ is 30 μm, t ₁₂ is 50 μm, and t ₁₃ is 10 μm.

In this structure, the damping material 109b suppresses the mechanical main resonance generated at several tens Hz unique to the metal leaf spring. Further, it also works to suppress the peak value of mechanical higher-order resonance.

The resin film 109c is made of the vibration damping material 1
The adhesion of dust and the like due to the viscosity of 09b is prevented.

The bases of the leaf springs 101 and 102 are fixed to a part 103 of the arm 22 of the head body 20.

The distance a between the leaf springs 101 and 102 is set smaller than the thickness of the objective lens 50.

The drive coil 104 is fixed to the vertical portion of the holder 100 and has an open window 105 at the tip of the arm 22.
Facing.

Reference numeral 106 denotes a thin resin film, and the arm 2
2 covers the opening window 105 at the tip. This resin film 10
6 allows the magnetic flux to pass through but not the dust as described later.

Also, the opening 10 around the objective lens 50
7 is covered with a soft resin film 108. The soft resin material 108 does not limit the displacement of the objective lens 50 for focus control, but limits the intrusion of dust.

Reference numeral 110 denotes a fixed magnetic circuit, which has an elongated shape, and is located near the tip of the arm 22 and moves downward along the movement locus of the tip of the arm 22 when the head body 20 swings. It is fixed on the cover 11.

As shown in FIG. 11, the fixed magnetic circuit 110 includes two permanent magnets 111 and 112 and one yoke 113.

The permanent magnets 111 and 112 have different polarities, and the magnetic flux φf flows as shown in FIG. The magnetic flux φf passes through the resin film 106 and reaches the drive coil 104.

The magnetic flux φf flows from the front surface of the fixed magnetic circuit 110 over the entire length thereof, and acts on the drive coil 104 regardless of the rotational position of the head main body 20.

When the focus control current is supplied to the drive coil 104, the current interlinks with the magnetic flux φf, and a force Fb in the Z-axis direction is generated in the drive coil 104.

Thus, the objective lens 50 is displaced in the Z-axis direction with the deflection of the leaf springs 101 and 102, and the focus is controlled.

Here, since the magnetic circuit 110 having a large mass is fixed to the lower cover 11, the weight of the tip of the arm portion 22 is kept small, and the weight of the head body 20 around the swing center axis 31 of the head body 20 is reduced. The moment of inertia is small.

The focusing actuator 70
Are provided with dynamic vibration absorbers 120 and 121, as shown in FIG.

The dynamic vibration absorber 120 has a structure in which an upper end is fixed to a part of the holder 100 and a minute movable mass 123 is fixed to a free end which is a lower end of a leaf spring 122 extending in the Z-axis direction. .

Another dynamic suction device 121 also has a leaf spring 124.
And a minute movable mass 125.

The dynamic vibration absorbers 120 and 121 are
Are provided on both sides.

Each of the dynamic vibration absorbers 120 and 121 is set so that the main resonance frequency coincides with a later-described higher-order mechanical resonance frequency of the movable portion of the focus actuator 70.

Next, the operation and effects of the dynamic vibration absorbers 120 and 121 will be described.

As shown in FIG. 13, the center of gravity of the movable part of the focusing actuator 70
The inertia force Fd due to the movement of the movable part acts on the position of the optical axis 50a of the objective lens 50. On the other hand, the driving force Fb acts on the coil 104, and the driving force Fb and the inertia force F
The point where d acts is off.

As a result, a couple M about the X axis acts on the holder 100, and this couple
A high order mechanical resonance occurs at zero. This vibration mode is a rotation mode vibration around the X axis as shown in FIG. Therefore, when the above mechanical higher-order resonance occurs,
The tilting vibration of the optical axis of the objective lens occurs, and the focus control is disturbed.

When the vibration characteristic (angular displacement around the X-axis due to the driving force Fb) of the objective lens optical axis 50a of the focusing actuator without the dynamic vibration absorber is measured, the gain is as shown in FIG. The phase is as shown by the line I in FIG. 15B. About 3k
At Hz, a gain peak 126 appears and the phase changes by 180 degrees. Therefore, if the frequency exceeds 3 kHz, focus control becomes impossible.

However, as shown in FIG.
When the movable actuators 20 and 121 are provided, when higher-order resonance occurs in the movable portion of the focusing actuator 70, the dynamic vibration absorbers 120 and 121 resonate in a phase opposite to the phase of the higher-order resonance, and the higher-order resonance is generated. Be suppressed.

When the gain of the vibration of the optical axis 50a of the objective lens 50 around the X axis was measured, the characteristic shown by the line III in FIG. 16A was obtained.

As can be seen from the figure, the peak 126 appearing at 3 kHz is suppressed as indicated by reference numeral 127.

The phase was as shown by the line IV in FIG. 16 (B).

As can be seen from the figure, the area around the phase is small as indicated by reference numeral 128, and no phase inversion occurs.

Therefore, the focus control is performed stably over a sufficiently wide frequency band.

Finally, in order to facilitate understanding of the present invention, in the optical disk device 10 having the above-described configuration, the configuration of the optical disk device 10 which can be made thinner and the rotation of the head main body 20 around the swing center axis 31 of the head body 20 for high-speed access are provided. The main components that make it possible to reduce the moment of inertia are listed.

(1) Configuration of Thinning Configuration The optical head device 15 is a swing type, and the disk portion 21 and the electromagnetic driving device 40 are arranged outside the photographing area 34 of the optical disk (FIGS. 1 and 2). Bearing 23 that supports the periphery of plate 21 (FIG. 3) Single objective lens 50 structure (FIG. 9) Semiconductor laser packageless structure (FIG. 7) (2) Configuration for reducing moment of inertia of head body Oscillation center Is a disk portion 21 and an optical component is disposed here (FIG. 7). Magnetic circuit 11 of focusing actuator 70
0 is fixed to the lower cover 11 and is not mounted on the head main body 20 (FIG. 1) [Second Embodiment] Next, a second embodiment of the optical disk apparatus of the present invention will be described.

FIG. 17 and FIG.
0 shows the overall configuration.

In each figure, the same reference numerals are given to the components corresponding to those shown in FIG.

The size of the optical disk device 150 is the same as that of the optical disk device 10 shown in FIG.

First, the swing type optical head device 151 incorporated in the device 150 will be described.

As shown in FIGS. 19 and 20, the oscillating optical head device 151 includes a head main body 152, an oscillating support mechanism 153, an electromagnetic driving device 154, and the like.
The head body 152 is swingably supported by a swing support mechanism 153, and arrows 32 and 3 are driven by an electromagnetic drive device 154.
It is configured to swing in three directions.

The head main body 152 includes a thin, substantially rectangular main body 156 and an arm 1 extending from the main body 156.
57 and a parallel leaf spring mechanism 158.

The main body 156 and the arm 157 are the same as those shown in FIG.
As shown in FIG. 2 and FIG. 27, a hollow sealed structure including an inverted U-shaped frame 159 composed of a top plate and side walls on both sides, and a sheet 160 covering the lower surface.

In the main body 156, a block 161 shown in FIG.

For convenience of explanation, the swing support mechanism 153 is used here.
Will be described with reference to FIG.

Reference numeral 162 denotes a swing center fixed shaft, which is located at a position outside the loaded optical disk 17 in the plan view of FIG.

The fixed shaft 162 extends through the through hole 163 of the main body 156 (block 161), and has an upper end fixed to the chassis 164 and a lower end connected to the chassis 16
Support member 1 screwed to the lower surface of screw 4 by screw 165
66, and is fixed above and below the main body 156.

The main body 156 is swingably supported by the fixed shaft 162 by a ball bearing 168 fitted into the hole 167 on the upper surface and a ball bearing 170 fitted into the hole 169 on the lower surface. I have.

Reference numeral 171 denotes a preload spring, which is elastically deformed like an umbrella and preloads the ball bearings 168 and 170.

172 and 173 are oil seals.

Reference numeral 174 denotes a concave portion formed on the bottom surface side of the chassis 164, in which the main body 156 is accommodated.

As described above, the main body 156 passes through the main body 156, and the upper and lower ends of the main body 156 are fixed to the fixed shaft 162 fixed to the chassis 164. The ball bearing 168 on which the preload is acting
And 170.

Therefore, the chassis 1 of the head body 152
The rigidity with respect to the head body 152 is high, the head main body 152 is stable against mechanical disturbance, and swings with high accuracy to be positioned with high accuracy.

Since the fixed shaft 162 penetrates the main body 156, the optical components are arranged so that the optical path is formed so as to surround the fixed shaft 162 as described later.

Also, as shown in FIG.
The whole is located outside the area 34 when the mounted optical disk 17 is projected onto the lower cover 11.

Next, the electromagnetic driving device 154 will be described with reference to FIG.
7, FIG. 18 and FIG.

The electromagnetic driving device 154 is a voice coil type motor, and is provided on the opposite side of the fixed shaft 162 from the arm portion 157.

This device 154 has a configuration in which a drive coil 180 fixed to a main body 156 and a permanent magnet 181 arranged opposite thereto are provided.

The head body 152 is an inverted U-shaped frame 1.
Because of its small size and light weight, small inertia moment, and high rigidity with respect to the chassis 164, tracking can be performed only by the electromagnetic drive device 154 without using a tracking actuator.

Incidentally, the electromagnetic drive device may be a movable magnet type as in the above-described embodiment.

Next, the head main body 152 will be described.

First, the optical system will be described.

In FIG. 23, a line 190 is a longitudinal center line of the head main body 152 passing through the center of the fixed shaft 162,
The line 191 is a line passing through the center of the fixed shaft 162 and orthogonal to the line 190.

Reference numeral 192 denotes a first quadrant area, 193 denotes a second quadrant area, 194 denotes a third quadrant area, and 195 denotes a fourth quadrant area.

Reference numeral 196 denotes a semiconductor laser chip, reference numeral 197 denotes a collimator lens, and reference numeral 198 denotes a monitor detector, both of which are provided in the second area 193.

Reference numeral 200 denotes a composite optical element, which is provided over the second area 193 and the third area 194.

This composite optical element 200 has a structure in which a beam shaping prism 201, a polarizing beam splitter 202, a return optical path deflection prism 203 and a quarter-wave plate 204 are integrated.

A plano-convex condensing lens 205 is provided in the third area 194.

Reference numeral 206 denotes a beam splitter (half mirror); 207, a first photodetector;
5.

Reference numeral 208 denotes a second photodetector, which is provided in the first area 192.

P emitted from the semiconductor laser chip 196
Optical path 2 until polarized laser light 210 passes through collimating lens 197 and enters beam shaping prism 201
11 is formed obliquely in the second region 193.

Laser light 212 that has exited quarter-wave plate 204
20 is directed toward the distal end in the arm 157, is raised by the rising mirror 213 as shown in FIG. 20, is converged by the objective lens 50, and is condensed on the optical disk 17.

The laser light reflected by the optical disk 17 passes through the objective lens 50, is reflected by the mirror 213, and returns inside the arm 157.

The laser beam 214 returning to the composite optical element 200 passes through the quarter-wave plate 204 to become an S-polarized laser beam 215, is reflected by the polarization beam splitter 202, is reflected again by the prism 203, and is reflected again by the prism 203.
Then, the light is condensed through the lens 205 and travels to the beam splitter 206.

[0203] The laser beam 215 is polarized beam splitter 2
An optical path 216 from the reflection by the light source 02 to the beam splitter 206 is formed in the third region 193.

The laser beam 215 is applied to the beam splitter 206
Is transmitted through the optical path 217 to the first photodetector 207.
It is formed in the fourth region 195.

The laser beam 215 is applied to the beam splitter 206.
218 reflected by the optical path toward the second photodetector 208
Are formed over the fourth region 195 and the first region 192.

As described above, the optical paths 211, 216, 21
7 and 218 are formed so as not to cross the fixed shaft 162 but to surround the fixed shaft 162.

Therefore, although the fixed shaft 162 has a structure penetrating the main body 156, the optical path is formed normally.

Here, the semiconductor laser chip 196, the collimator lens 197, the composite optical element 200, the condenser lens 205, the beam splitter 206, and the first photodetector 20
7 and the second photodetector 208 are connected to the swing center fixed shaft 16.
The first moment about the axis is balanced because it is arranged with a good weight balance around 2.

[0209] For this reason, there is no particular need to add a balancer or the like. Spectroscopic head device 15 without adding balancer etc.
1 is lightweight.

Each of the above optical components is provided with a fixed shaft 162.
, The moment of inertia around the fixed shaft 162 of the head main body 152 is small, and the access of the optical head device 151 is performed at high speed.

Note that a complementary spot size detection method is used for focus error signal detection, a push-pull method is used for tracking error signal detection, and a reflected light amount change method is used for RF signal detection.

In the prism 203, a portion 203a indicated by a two-dot chain line is a line 19a to avoid the fixed shaft 162.
The optical path 216 is provided at a position shifted by a dimension A from 0.

The portion 201a of the prism 201 indicated by a two-dot chain line is provided for attachment.

Next, the mounting structure of each optical component will be described.

In the block 161 shown in FIG.
The semiconductor laser chip mounting portion 220 is formed in a concave shape, and the collimating lens mounting portion 221, the composite optical element mounting portion 222, and the condenser lens mounting portion 22 are provided on the peripheral side surface side.
The third and beam splitter mounting portions 224 are formed in a substantially concave shape.

As shown in FIG. 23, a semiconductor laser chip 196 is formed by using a method disclosed in Japanese Patent Application No. 4-276305 proposed by the present applicant.
The semiconductor laser device is mounted on the mounting portion 220 by the structure shown in “Semiconductor Laser Device”.

The collimating lens 197 is
1 and fitted and positioned.

The condensing lens 205 is positioned and mounted by fitting to the mounting portion 223.

[0219] The beam splitter 206 is
4 and fitted and positioned.

For this reason, the components 196, 197,
200, 205, and 206 are arranged with a high degree of positional accuracy by a relatively simple mounting operation.

Here, the surface 221a of the mounting portion 221 and the surface 222a of the mounting portion 222 are formed in parallel. It is relatively easy to accurately determine the surface 222a in parallel with the surface 221a. The adjacent surface 201b and the surface 201c of the prism 201 of the composite optical element 200 have a predetermined angle α (see FIG. 29). It is relatively easy to determine the angle α with high accuracy.

The collimating lens 197 is positioned on the surface 221a, the composite optical element 200 is positioned on the surface 222a, and the collimating lens 197 and the surface 201c on which laser light emitted from the collimating lens 197 is positioned in a predetermined positional relationship. Well defined.

The above-mentioned block section 161 has the structure shown in FIG.
As shown in FIG. 1, tunnels 225 and 226 are formed.

[0224] As shown in FIG.
This is for guiding the laser light 210. Another tunnel 226 is for forming an optical path 218.

Next, the configuration of the arm 157 and the parallel leaf spring mechanism 158 will be described mainly with reference to FIGS. 19 and 20.

The tip surface 230 of the frame 159 is inclined at 45 degrees. Here, the position of the rising mirror 213 is adjusted and bonded and fixed as described later.

Reference numeral 231 denotes a hole through which the laser light 232 raised by the mirror 213 passes.

In the U-shaped focus actuator holder 232 shown in FIG. 24, the hole 232a is fitted into the arm 157, and the upper plate 232b and the lower plate 232c are connected to the main body 156.
Is attached to the main body 156 with the.

An upper leaf spring 233 and a lower leaf spring 234 have a substantially triangular shape, and have a base fixed to the upper plate 232b and the lower plate 232c of the holder 232. The arm 157 extends in the distal direction.

An objective lens holder 235 shown in FIG. 25 is fixed to the tip of each of the leaf springs 233 and 234.
The tip of 34 is restrained.

The plate springs 233 and 234 and the objective lens holder 235 constitute a parallel plate spring mechanism 158.

The objective lens 50 is fixed to the holder 235.

A focusing actuator 236 is provided on the distal end side of the arm 157.

The focusing actuator 236 is
This is substantially the same as the above embodiment, and includes a drive coil 237 fixed to the tip end surface of the holder 235 and a fixed magnetic circuit 238 fixed to the chassis 164.

The fixed magnetic circuit 238 has a structure in which two permanent magnets 240 and 241 are fixed to a yoke 239.

The interval B between the leaf springs 233 and 234 is several mm.
Therefore, the objective lens 50 moves up and down while keeping the optical axis vertical, and the focus control is stably performed.

Although the gaps 242 and 243 between the holder 235 and the arm 157 are located above and below, the gaps 242 and 243 may be as small as about 0.3 mm. No problem.

In the gap 242, the same material as the soft resin film 108 of the embodiment shown in FIG.
5 and the arm 157, it is possible to maintain the hermetically sealed structure of the head main body 152 even by opening the hole 231. Thus, the displacement of the objective lens 50 for focus control is not limited, and Intrusion can be restricted.

In the head main body 152, the position adjustment of the optical components is performed separately for the semiconductor laser chip 196 and the rising mirror 213.

That is, the semiconductor laser chip 196 has a configuration in which the laser light is finely moved only in the optical axis direction indicated by an arrow 245 in FIG. 23 so that the laser light is properly focused on the recording surface of the optical disk 17.

The adjustment so that the incident angle to the objective lens 50 is within an allowable range of about 0.1 degree is performed by using the tables 250 and 2 shown in FIG.
The adjustment is performed by using an adjustment device 253 including a hand mechanism 251 fixed to 50 and an autocollimator 252 integrated with the base 250.

The hand mechanism 251 moves the hand 254 around the axes 255, 256 orthogonal to each other by arrows 257,
This is a configuration that can rotate in two directions indicated by reference numeral 258.

That is, the head body 154 is set on the table 250, and the rising mirror 213 is held by suction on the hand 254, and the autocollimator 254 is observed while the ultraviolet curing adhesive 259 is applied. Meanwhile, the hand mechanism 251 is appropriately moved to adjust the mounting angle of the mirror 213, and in a state where the error in the autocollimator 254 is reduced to zero, the hand mechanism 251 is stopped, ultraviolet light is irradiated, and the adhesive 259 is cured. Mirror 213
To the tip of the arm 157.

The semiconductor laser chip 196 only needs to be adjusted in one direction, and can be adjusted accurately and easily.

FIGS. 28, 29 and 30 show mainly the heights of the optical components incorporated in the head body 152 and the heights between the components. The unit is mm.

In FIG. 28, the portion of the collimator lens 197 indicated by reference numeral 197a is an optically unused portion, which has been cut away to reduce the height of the device 150.

As can be seen from FIG. 28, the composite optical element 2
The height from 00 to the optical disk 17 is as small as 3.4 mm.

Next, the structure of the spindle motor 14 in FIG. 17 will be described with reference to FIG.

The turntable 270 is supported on a shaft 274 by ball bearings 272 and 273 preloaded by a spring 271.

Reference numeral 275 denotes a rotor magnet, 276 denotes a rotor yoke, and 277 denotes a stator coil.

This spindle motor 14 has a height of 4 mm.
It is.

A clamp magnet 278 is fixed at the center of the turntable 270.

The optical disk 17 includes a magnetic plate 27 for clamping.
9 is attracted by the magnet 278 and the turntable 2
70.

FIG. 32 shows a swing type optical head device 151A which is a modification of the swing type optical head device of FIG.

In place of the parallel leaf spring mechanism, the objective lens holder 235 is supported by four wires 290, 291, and 292 (the other wire is not shown) disposed substantially in parallel. The objective lens holder 235 is not limited to the vertical direction,
It can also move left and right.

A magnet 295 for truck is fixed to the left and right sides of the arm 157.

The magnet 2 is attached to the objective lens holder 235.
A truck coil 296 is provided so as to oppose 95.

A magnet 295 and a coil 296 constitute a tracking actuator 297.

In the optical head device 151A,
The objective lens 50 moves in the vertical and horizontal directions independently of the head body 152, and focus control and tracking control are performed.

[Third Embodiment] The third embodiment and the following fourth to sixth embodiments are all described by the Japan Electronics Industry Development Association (hereinafter referred to as JEIDA) or PC MEMO.
RY CARD (ARD INTERNATIONA
It has a configuration that can be replaced with 32 IC memory card type III or IC memory card type II specified by L ASSCIATION (hereinafter, PCMCIA).

Hereinafter, JEIDA or PCMCIA is omitted and simply referred to as IC memory card type III or IC memory card type II.

Optical Disk Device 300 According to Third Embodiment
Has a housing 301 on the lower side as shown in FIGS. 33, 35 and 36, on which the optical disk device mechanism 3 is mounted.
02, and a socket connector 303 is provided at one end in the longitudinal direction of the housing 301 so as to be exposed.

It should be noted that although not shown in FIG. 33 because it is shadowed, as shown in the side view of FIG.
01 protrudes below the lower surface of the socket connector 303, and its thickness is
3 is within 2.5 mm from the center line in the thickness direction.

The size is the same as that of the optical disk drive mechanism 302 in the upper part of the housing 310.

The optical disk device mechanism 302 has substantially the same structure as the optical disk device 150 shown in FIG. 17, and the corresponding parts are denoted by the same reference numerals and description thereof will be omitted.

A printed board assembly 304 shown in FIG. 37 is housed in the housing 301.

The printed board assembly 304 includes the printed board 3
In this configuration, a large number of surface-mounted resin-molded electronic components 306 are mounted on the upper surface and the lower surface of the electronic device 05. A plurality of electronic components 306 constitute the circuit of FIG.

This printed board assembly 304 is similar to that shown in FIG.
(A) and (B), a region 307 indicated by cross hatching
Occupy.

Further, in FIG. 37, the socket connector 303
Electronic components indicated by reference numeral 306a located near the interface circuit 310 in FIG. 34 constitute the interface circuit 310 in FIG.

The printed board assembly 304 is located below the optical disk drive mechanism 302, and both are shown in FIG.
Are electrically connected via a terminal portion 308 shown in FIG.

The socket connector 303 is electrically connected to the electronic component 306a, and the printed circuit board 3 is electrically connected to the electronic component 306a.
It is fixed to the end of 05.

Now, the circuit will be described with reference to FIG.

The interface circuit 310 transmits a recording / reproducing signal, a control signal, an address signal, power, and a status signal.

The spindle motor drive circuit 311 outputs drive power and receives a position signal to control the drive of the spindle motor 14 in a closed loop.

The optical head drive circuit 312 supplies drive power to the optical head device 151 (the electromagnetic drive device 15 in FIG. 17).
Output to 4).

Focus actuator drive circuit 313
Outputs the driving power to the optical head device 151 (the focusing actuator 236 in FIG. 17).

In connection with the optical head device 151,
A recording / reproducing circuit 314, a servo signal processing circuit 315, and a laser emission control circuit 316 are provided.

The optical disk control circuit 317 sends control signals to the circuits 311 to 315 to control the whole.

Next, the features of the optical disk device 300 will be described.

As shown in FIGS. 35 and 36, the overall shape of the optical disk device is 85.6 mm in length and 5 in width.
4.0 mm, thickness 10.5 mm.

The socket connector 303 is a JEID
The configuration satisfies the specifications defined in the IC memory card guidelines proposed by A.

This means that the socket connector 303
This also satisfies the specifications of the socket connector proposed by PCMCIA.

As shown in FIGS. 35 and 36, the socket connector 303 has a length of 10 mm, a width of 54.0 mm,
The thickness is 3.3 mm.

As shown in FIG.
The optical disk device 300 can be detached freely by removing the cover 318, and the optical disk device 300 may be in a state in which the optical disk 17 is still detached and the optical disk 17 is not mounted.

Accordingly, as shown in FIG. 34, an optical disk detector 319 is provided in the optical disk device mechanism 302. The optical disk detector 319 is a reflection type optical sensor, and detects whether the optical disk 17 is mounted.

An optical disk loading / unloading determination circuit 320 for determining whether or not the optical disk 17 is loaded is provided based on a signal from the optical disk detector 319.

The interface circuit 31 in FIG.
0 is a configuration that satisfies the electrical and interface specifications defined in the IC memory card line proposed by JEIDA (this also satisfies the electrical and interface specifications of the IC memory card proposed by PCMCIA), Further, the configuration has a function of transmitting a status signal from the circuit 320 to an information device.

With the above-described features, the optical disk device 300 has the same external dimensions and electrical characteristics as the IC memory card type III, and can be handled in the same manner as the IC memory card type III.
In other words, it can be inserted in the IC memory card type III for the slot of the information device, and also allows exchange of information between the information equipment.

Therefore, after the preparation work in which the optical disk 17 is mounted and the cover 318 is mounted, similarly to the IC memory card type III, the IC memory card type of the information equipment is used.
When inserted into the slot for III, information can be recorded and reproduced.

Further, according to the above configuration, even when the optical disk device 300 is inserted into the slot for the IC memory card type III of the information equipment and the optical disk device 17 is used by mistake while the optical disk 17 is not mounted, the optical disk 17 is not mounted on the user. Can be transmitted, and malfunctions can be prevented beforehand.

The optical disk device 300 can be used in the same manner as the IC memory card type III.
The user has the advantage that the economic burden is significantly reduced because the 7 is detachable.

That is, in the case of the IC memory card type III, as shown in FIG. 39 (B), it is necessary to prepare the IC memory card type III 321 in a number corresponding to the information amount. One IC memory card is expensive at several tens of thousands of yen, and if any of them are prepared, the economic burden is heavy.

On the other hand, in the case of the optical disk device 300, as shown in FIG.
Basically, it is sufficient to prepare one unit.
It suffices to prepare 7 as many as will cover the amount of information.

The optical disk 17 costs several thousands of yen , has a recording capacity of about 100 MB, which is about several tens of times that of an IC memory card, and requires a small number of sheets. Therefore, the economic burden on the user is considerably reduced as compared with the case of the IC memory card.

In FIG. 39, 322 is an information device, and 323 is an IC.
This is a memory card type slot.

[Fourth Embodiment] In the drawings showing the fourth and fifth embodiments, the same reference numerals are given to components corresponding to the components shown in FIGS. 33 to 38, and the description thereof will be omitted.

As shown in FIG. 40, FIG. 41 and FIG. 42, the optical disk device 330 is provided with a printed board assembly 331 shown in FIG. Printed board assembly 33 on both sides
1 has a housing 332 which covers a part of the housing 1, and a socket connector 303 is provided to be exposed at one end in the longitudinal direction.

Although not shown in FIG. 40 because it is shadowed, as shown in the side view of FIG. 42, the bottom surface of the housing 332 projects below the lower surface of the socket connector 303, and Saha socket connector 30
3 is within 2.5 mm from the center line in the thickness direction.

The size is the same as that of the upper part of the housing 332 and is symmetric with respect to the center plane of the socket connector 303 in the thickness direction.

As shown in FIG. 43, the printed board assembly 331 has bare chips 33 on the upper and lower surfaces of the printed board 333.
4 is a configuration in which it is mounted. By using the bare chip 334, the printed board assembly 331 is thinner than the printed board assembly 304 of FIG. Printed board assembly 3
Due to the thinness and smallness of 31, it is incorporated in the height range of the mechanism 302 and in a space not used by the mechanism 302.

The group of bare chips constitutes the circuit shown in FIG.

The interface circuit 310 is provided in the bare chip 334a.

Reference numeral 335 denotes a substantially U-shaped notch, which is formed to avoid the spindle motor 14, the optical head device 151, and the like.

The above-mentioned printed board assembly 331 is similar to the one shown in FIG.
In (A) and (B), a region 336 occupied by cross hatching is occupied.

As shown in FIGS. 41 and 42, the optical disk device 330 has a length of 85.6 mm and a width of 55.4 mm.
0 mm, thickness 5.0 mm, socket connector 3
03 is located at the center in the thickness direction, the length is 10 mm, the width is 54.0 mm, and the thickness is 3.3 mm.

Therefore, the optical disk device 330 is the same as the IC memory card type II in terms of external form and electrical, and can be handled similarly to the IC memory card type II. That is, the optical disk device 330 is
Insert it into the slot for C memory card type II,
Information can be transferred to and from information devices by recording and reproducing information.

Since the optical disk 17 is replaceable, the IC memory card type II is used in the same manner as in the third embodiment.
Is more economically advantageous than

[Fifth Embodiment] Optical disc apparatus 3 shown in FIG.
Reference numeral 40 denotes a configuration in which a cartridge loading mechanism is added to the optical disk device 300 shown in FIG.

For convenience of explanation, the above optical disk device 34
FIG. 4 shows an optical disk cartridge applicable to
This will be described with reference to FIG.

The optical disk cartridge 341 includes a first cartridge half 342 and an integral frame 343.
And a second cartridge half 344 fitted in the frame 343 and slidable in the X ₁ and X ₂ directions.

The optical disc 17 has a frame portion 343 having a diameter of 46.
1/3 in the radial direction by fitting into the opening 345
And the other part is accommodated in the second half 344.

The state where the half body 344 is in contact with the first half body 342 (see FIG. 54A) is "closed". At this time, the cartridge 341 has a length of 50 mm and a width of 48 mm.
mm and a thickness of 1.6 mm.

The state where the second half 344 is separated from the first half 342 as shown in FIG. 46 is "open", and the length at this time is 67 mm.

The second half 344 is temporarily held in the closed position or the open position by the hook 346 and the concave portion 347.

The optical disk cartridge 341 is stored and handled in the closed state, and the optical disk 17 is protected from dust adhesion and external impact.

Next, the loading mechanism will be described with reference to FIG.

Numeral 350 denotes a cartridge holder, which is shown in FIG.
As shown in FIG. 7, the lower surface side is an opening 351 and is fitted to the guide rail 352.

As shown in FIGS. 48 and 49, the vertical movement mechanism 355 includes a coil 356 and an upper yoke 357a.
And a lower yoke 357b, a yoke 357, a permanent magnet 358, an arm 359, and the like.

[0319] The arm 359 is supported on the shaft 360 at the base side, and the pin 361 at the tip is connected to the elongated hole 350 of the holder 350.
b.

[0320] arm 359 by the spring 361 back shown in FIG. 51 (A) is rotated in the arrow A ₁ direction, the cartridge holder 350 is located at a high position.

From the vicinity of the tip of the arm 359, the arm 3
62 extend sideways, and upper and lower yokes 357a, 357
b.

[0322] Opposite to the distal end side of the arm portion 362,
A lock mechanism 363 shown in FIG. 50 is provided.

The lock mechanism 363 includes a lock arm 36.
51, a magnetic piece 366 at the tip, a coil 367 facing the magnetic piece 366, a yoke 368, and FIG.
A return spring 369 shown in FIG.

[0324] When the coil 356 is temporarily energized, the permanent magnet 358 is attracted to the lower yoke portion 357b, is rotated in the arrow A ₂ direction against the arm 359 spring 361, the holder 350 is moved downward Is done.

The arm 359 is locked at the position shown by the two-dot chain line in FIG. 49 by locking the tip of the arm portion 362 by the lock claw 365a at the tip of the lock arm 365. Further, when the coil 367 is temporarily energized, it is temporarily rotated in the arrow B ₁ direction against the locking arm 365 spring 369. Thus, the lock is released, it is rotated in the arrow A ₁ direction by the arm 359 spring 361, the holder 350 is moved upward.

Next, the cartridge opening / closing mechanism 370 will be described with reference to FIG.

As shown in FIG. 52A, 371 is a coil.

Reference numeral 372 denotes a rod, on which a permanent magnet 3
73, and a portion of the permanent magnet 373 passes through the coil 371.

At one end of the rod 372, a cartridge opening / closing claw 374 is provided. The pawl 374 is fitted to the notch on 350a of the holder 350 of Figure 47, engages the notch 344a in FIG. 46.

When the coil 371 is energized, the rod 37
When one moves X _2, cartridge is opened, the rod 371 in reverse to move the X ₁ direction, the cartridge is closed.

[0331] As shown in FIG.
Are provided with the grooves 372a and the lock portions 375a,
75b, and is temporarily held at the sliding position.

The vertical movement mechanism 355, the lock mechanism 363, and the cartridge opening / closing mechanism 370 having the above structure are the same as those shown in FIG.
(A) and (B) are incorporated in a region 376 with hatching.

Next, the mounting and removing operation of the optical disk cartridge 341 will be described with reference to FIG.

(A) to (C) show the mounting operation, and (D) to (F) show the detaching operation.

The optical disk cartridge 341 is manually inserted into the holder 350 (FIG. 17A).

When the cartridge 341 is inserted into the holder 350, the cartridge fixing pin 377 engages with a hole (not shown) of the first half 342, and
There are fixed and subsequently operates the cartridge opening and closing mechanism 370, the rod 372 is moved in the X ₂ direction, the second half 34
5 is moved in the same direction by the claw 374, the cartridge 341 is closed, and the central portion of the optical disk is exposed (FIG. 13B).

Next, the vertical movement mechanism 355 operates, the holder 350 is lowered by about 0.3 to 0.5 mm, and the optical disk 17 is mounted on the turntable 378 (FIG. 17C).

The detachment of the cartridge is performed in the reverse order.

That is, first, the holder 350 moves upward as shown in FIG. (D), and then the cartridge is closed as shown in FIG. Finally, 370 operates in the same manner as in FIG. At this time, the first half 3
42 is detached from the pin 377, the mechanism 37
The cartridge 341 is partially ejected by the operation 0 (FIG. 9F).

When the cartridge 341 is pulled out by hand, the pin 377 is moved upward and set, and the state shown in FIG.

[Sixth Embodiment] The optical disk device 3 shown in FIG.
Reference numeral 80 denotes a configuration obtained by adding a cartridge loading mechanism to the optical disk device 330 of FIG.

The vertical movement mechanism 355A and the cartridge opening / closing mechanism 370A are substantially the same as those in the above-described embodiment, and the description thereof is omitted.

The mechanisms 355A and 370A are the same as those shown in FIG.
In (A) and (B), it is incorporated in a hatched area 381.

The optical disk cartridge 341 shown in FIG. 46 is used, and is mounted and demounted as shown in FIG.

Hereinafter, a modified example will be described.

[0346] the optical disc 17 is not limited to the phase change scheme, or magneto-optical manner. In this case, it is possible to cope by partially changing the configuration of the optical component. In addition to a rewritable type, a read-only type and a write-once type can be used as they are.

The outer shape of the optical disk 17 is not limited to 1.8 inches, but may be smaller than this, for example, 1.3 inches.

The thickness of the optical disk 17 is not limited to 0.3 mm, but may be in the range of 0.2 to 0.5 mm.

The optical disk 17 is not a single plate but a 2
A configuration in which the sheets are bonded to each other may be used.

The thickness of the cartridge device 341 is 1.6
mm, it can be in the range of 1.3 to 1.9 mm.

The block 161 in FIG. 21 has a shape in which a portion for attaching the photodetectors 207 and 208 is additionally provided, and the photodetectors 207 and 208 are attached to the block in addition to the above-mentioned optical components. It can also be configured.

[0352]

As described above, according to the first aspect of the present invention, the optical disk can be accommodated within the height of the oscillating optical head, whereby the optical disk device can be adjusted to the height of the optical head. It is not a dimension that adds the thickness of the optical disk,
The optical disk is substantially determined by the height of the optical head, so that the optical disk can be configured not to increase in height, and can be made thinner than before.

Further, the swing of the head main body can be stabilized.

According to the second aspect of the present invention, the planar size of the optical disk device can be reduced to the same size as an IC memory card.

According to the third aspect of the present invention, the thickness of the optical disk device can be reduced.

According to the invention of claim 4, the access operation can be performed at high speed and stably.

According to the fifth aspect of the present invention, the optical head device itself can have a dust-proof structure, and is effective when applied to an optical disk device which does not have a sealed structure in view of enabling replacement of the optical disk.

According to the invention of claim 6, access can be performed at high speed.

According to the seventh aspect of the present invention, the head main body can have a dustproof structure.

According to the eighth aspect of the invention, focus control can be stably performed over a sufficiently wide frequency band.

According to the ninth aspect, the swing of the head body can be stabilized.

According to the tenth aspect, it is possible to reduce the thickness of the driving means as compared with a configuration in which the driving coil is movable.

According to the eleventh aspect, focus control can be stabilized.

According to the twelfth aspect of the present invention, it is possible to reduce the thickness, to increase the rigidity of the swing, and to increase the access speed and accuracy.

According to the thirteenth aspect of the present invention, the plane size of the optical disk device can be reduced to the same size as an IC memory card.

According to the fourteenth aspect, the thickness of the optical disk device can be reduced.

According to the fifteenth aspect, a dedicated tracking actuator can be dispensed with.

According to the sixteenth aspect, the optical component can be positioned accurately and easily.

According to the seventeenth aspect, during the focus control operation, the objective lens can be moved without tilting its optical axis, and the focus control can be stably performed.

According to the eighteenth aspect of the present invention, the adjustment of the semiconductor laser chip only in the direction of the optical axis is required, the adjustment is easy, and the head body is easy to assemble.

[0371]

[0372]

[0373]

[0374]

[0375]

[0376]

[0377]

[0378]

[0379]

[0380]

[0381]

[0382]

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of an optical disk device of the present invention with an upper cover removed.

FIG. 2 is a side view of the optical disk device of FIG.

FIG. 3 is a perspective view of the swing type optical head device in FIG. 1;

FIG. 4 is a view showing a bearing structure in FIG. 3;

FIG. 5 is a partially cut-away view showing an electromagnetic drive device for swinging the head body.

FIG. 6 is a sectional view taken along line VI-VI in FIG.

FIG. 7 is a diagram showing an internal structure of a head main body.

FIG. 8 is a diagram showing a tracking actuator.

FIG. 9 is a diagram showing a focusing actuator.

FIG. 10 is a diagram illustrating a focusing actuator taken out of FIG. 9;

FIG. 11 is a diagram illustrating a relationship between a fixed magnetic circuit and a drive coil in FIG. 9;

FIG. 12 is a diagram showing a configuration of a distal end portion of a focusing actuator.

FIG. 13 is a diagram illustrating the action of a force on a focusing actuator.

FIG. 14 is a diagram illustrating a vibration mode at the time of mechanical resonance of the focusing actuator.

FIG. 15 is a diagram showing characteristics of a focusing actuator provided with a dynamic vibration absorber.

16 is a diagram showing characteristics of the focusing actuator having the configuration shown in FIG.

FIG. 17 is a perspective view showing another embodiment of the optical disk device of the present invention with an upper cover removed.

FIG. 18 is a plan view of the device of FIG. 17;

19 is a partially cutaway perspective view of the swinging optical head device in FIG. 17;

FIG. 20 is a sectional view taken along line XX-XX in FIG.

FIG. 21 is a diagram showing a block portion taken out from FIG. 19;

FIG. 22 shows a swing support mechanism.
It is an expanded sectional view which follows a line.

FIG. 23 is a diagram showing an arrangement of an optical component group in a main body.

FIG. 24 is a view showing a focus actuator holder in FIG. 20;

FIG. 25 is a diagram showing an objective lens holder in FIG.

FIG. 26 is a diagram illustrating adjustment of a mounting position of a rising mirror.

FIG. 27 is an enlarged view showing a mirror mounting portion in FIG. 26;

FIG. 28 is a side view of an optical component group in an optical path from a semiconductor laser chip to an objective lens.

FIG. 29 is a perspective view of the optical component group of FIG. 28.

FIG. 30 is a perspective view showing an optical component group in an optical path from a condenser lens to a photodetector.

FIG. 31 is a sectional view of the spindle motor in FIG. 17;

FIG. 32 is a diagram showing a main part of a modified example of the oscillating optical head device of FIG. 19;

FIG. 33 is a perspective view showing a third embodiment of the optical disk device of the present invention with a cover removed.

34 is a block diagram of a circuit in the optical disk device of FIG.

35 is a plan view of the optical disc device of FIG.

36 is a side view of the optical disc device of FIG.

FIG. 37 is a perspective view showing a printed board assembly and a socket.

FIG. 38 is a diagram showing an area occupied by a printed board assembly in the optical disk device of FIG. 33.

FIG. 39 is a diagram showing an economic advantage of an optical disk device when compared to an IC memory card.

FIG. 40 is a perspective view showing a fourth embodiment of the optical disk device of the present invention with a cover removed.

FIG. 41 is a plan view of the optical disc device of FIG. 40.

FIG. 42 is a side view of the optical disc device of FIG. 40.

FIG. 43 is a perspective view of a printed board assembly.

FIG. 44 is a diagram showing an area occupied by a printed board assembly in the optical disk device of FIG. 40;

FIG. 45 is a partially cutaway perspective view of a fifth embodiment of the optical disk device of the present invention.

FIG. 46 is a partially cutaway perspective view of the optical disc cartridge in an open state.

FIG. 47 is a view showing a cartridge holder.

FIG. 48 is a view showing a vertical movement mechanism.

FIG. 49 is a diagram illustrating a relationship between an arm and a cartridge holder.

FIG. 50 is a view showing a lock mechanism.

FIG. 51 is a view showing a return spring.

FIG. 52 is a diagram illustrating a cartridge opening / closing mechanism.

FIG. 53 is a diagram illustrating a portion occupied by a vertical movement mechanism and a cartridge opening / closing mechanism.

FIG. 54 is a diagram illustrating the mounting and detaching operations of the optical disk cartridge.

FIG. 55 is a partially cutaway perspective view of a sixth embodiment of the optical disk device of the present invention.

FIG. 56 is a diagram illustrating a portion occupying a vertical movement mechanism and a cartridge opening / closing mechanism.

FIG. 57 is a diagram showing an example of a conventional optical disk device.

[Explanation of symbols]

10, 150 Optical disk drive 11 Lower cover 12 Upper cover 13 Housing 14 Spindle motor 15, 151 Swing type optical head 16 Spindle 17 Optical disk 17a Recording surface 18 Metal hub 20, 152 Head main body 21 Disk part 21a Peripheral side surface 22 , 157 Arm part 23 Bearing 24, 25, 26, 27 V-groove arc-shaped rail 24 a, 25 a, 26 a, 27 a V-groove 28 Steel ball 29 Retainer 30 Center 31 Swing center axis 32, 33 Arrow indicating swing direction 34 Optical disk Projection area on lower cover 40,154 Electromagnetic drive 41,42,92,98,111,112,181,2
40,241 Permanent magnet 43 Fixed yoke 44 Drive coil 45 Bottom plate 46 Peripheral wall 47 Case body 48 Top plate 49 Case 50 Objective lens 50a Optical axis 51 Semiconductor laser chip 52 Silicon substrate 53 Heat sink 54 Substrate 56 Composite optical element 57 Beam shaping prism 58 Polarizing beam splitter 59 Prism 60 Quarter wave plate 61, 62 Photodetector 65 Tracking actuator 66 Triangular prism mirror 67 Leaf spring 70 Focusing actuator 71 Moving part 80 Laser light 90 L-shaped holder 91 Drive coil 94 Yoke 95 Magnetic Circuit structure 96 Air gap 100 Holder 101, 102 Leaf spring 103 Part of arm 22 104 Driving coil 105 Open window 106 Thin resin film 107 Opening 108 Soft resin film 109a Metal plate 10 b Vibration damping material made of viscoelastic material 109c Resin film 110,238 Fixed magnetic circuit 113 Yoke 120,121 Dynamic vibration absorber 122,124 Leaf spring 123,125 Micro movable mass 153 Swing support mechanism 156 Main body 158 Parallel leaf spring mechanism 159 Frame 160 Seat 161 Block portion 162 Oscillating center fixed shaft 163 Through hole 164 Chassis 165 Screw 166 Support member 167, 169, 231, 231a Hole 168, 170 Ball bearing 171 Preload spring 172, 173 Oil seal 174 Body unit recess 180 Movable drive coil 190, 191 line 192 First quadrant area 193 Second quadrant area 194 Third quadrant area 195 Fourth quadrant area 196 Semiconductor laser chip 197 Collimating lens 198 Monitor detector 200 Composite optical element Reference Signs List 201 beam shaping prism 201a mounting part 201b, 201b surface 202 polarizing beam splitter 203 return light path deflecting prism 203a part for shifting optical path 204 1/4 wavelength plate 205 condensing lens 206 beam splitter 207 first light detection Device 208 Second photodetector 210, 212 Laser beam 211, 216, 217, 218 Optical path 213 Rising mirror 214 Returned laser beam 215 S-polarized laser beam 220 Semiconductor laser chip mounting section 221 Collimating lens mounting section 222 Composite Optical element mounting part 223 Condensing lens mounting part 224 Beam splitter mounting part 225, 226 Tunnel 230 Tip surface 232 Focus actuator holder 232b Upper plate 232c Lower plate 233 Upper leaf spring 234 Lower Leaf spring 235 Object lens holder 236 Focusing actuator 237 Drive coil 239 Yoke 242, 243 Clearance 250 Units 251 Hand mechanism 252 Autocollimator 253 Adjustment device 254 Hand 255, 256 Axis 259 Ultraviolet curing adhesive 270 Turntable 271 Spring 272, 273 Ball Bearing 274 Shaft 275 Rotor magnet 276 Rotor yoke 277 Stator coil 278 Clamp magnet 279 Clamp magnetic plate 290,291,292 Wire 295 Track magnet 296 Track coil 297 Tracking actuator 300 Optical disk device 301 Housing 302 Optical disk device mechanism 303 JEIDA specification Socket connector 304 satisfying the requirements 05 Printed board 306 Electronic component 307 Area occupied by printed board assembly 308 Terminal section 310 Interface circuit satisfying JEIDA specification 311 Spindle motor drive circuit 312 Focus actuator drive circuit 314 Recording / reproduction circuit 315 Servo signal processing circuit 316 Laser emission control circuit 317 Optical disk control circuit 318 Cover 319 Optical disk detector 320 Optical disk loading presence / absence determination circuit 321 IC memory card type III 322 Information equipment 323 IC memory card type III slot 330 Optical disk device 331 Print assembly 332 Housing 334 Bear chip 335 Notch 336 Print board assembly Area occupied by 340 optical disk device 341 optical disk cartridge 342 first cartridge half 343 Frame part 344 Second cartridge half 345 Opening 346 Hook 347 Depression 350 Cartridge holder 351 Opening 352 Guide rail 355 Vertical movement mechanism 356 Coil 357 Yoke 357a Upper yoke 357b Lower yoke 358 Permanent magnet 359 Arm 360 Shaft 361 Pin 36 Return spring 362 Arm portion 363 Lock mechanism 365 Lock arm 365a Lock claw 366 Magnetic piece 367 Coil 368 Yoke 369 Return spring 370 Cartridge opening / closing mechanism 371 Coil 372 Rod 373 Permanent magnet 374 Cartridge opening / closing claw 375 Plate spring 375a, 375b Lock section 376 Area 377 in which moving mechanism and the like are arranged 377 Cartridge fixing pin 378 Turntable 380 Optical disk device 381 Vertical movement mechanism and the like are arranged The area

Continuation of front page (56) References JP-A-61-264563 (JP, A) JP-A-2-310825 (JP, A) JP-A-63-23278 (JP, A)

Claims (18)

(57) [Claims] 1. A spindle motor (14) for rotating a loaded optical disc (17); and a recording surface (17a) of the loaded optical disc (17).
Swung in a plane parallel with, becomes more and oscillating optical head device for moving the objective lens (50) in the radial direction of the optical disc (15), the swing-type optical head apparatus, the bearings (23 ) by a swingably supported head body (20), more becomes Ru drive means to swing (40) of said head body, said bearing (23), a site outside from the mounted optical disk the mounted且one drive motion means, in the objective lens (50) provided at a site substantially opposite the bearing (23)及beauty drive motion means (40) in height with respect to the bearing (23) An optical disk device characterized in that it has a configuration including the thickness of a formed optical disk. 2. The optical disk according to claim 1, wherein the outer diameter is 1.8.
An optical disk device characterized by having a configuration of inches or less. 3. The optical disk device according to claim 1, wherein the thickness of the disk substrate is 0.2 to 0.5 mm. Head body 4. The method of claim 1, the body portion in the vicinity of the swing center (21), more become an arm portion extending from the body portion (22), above the tip of the arm part Providing an objective lens (50),
An optical disk device characterized in that optical components (55, 56) are exclusively provided in the main body . 5. The optical disk device according to claim 4, wherein the head body has a case for sealing the plurality of optical components. 6. The oscillating optical head device according to claim 1, wherein the objective lens (5) provided to be displaceable on the head body.
0) and a driving coil (104), and a focusing actuator (70) including a magnetic circuit (110) fixedly provided outside the head body to generate a magnetic flux acting on the driving coil. An optical disc device characterized by the above-mentioned. 7. The head body according to claim 6, wherein the drive coil further comprises a non-magnetic thin film covering the magnetic circuit. Optical disk device. 8. An optical disk apparatus according to claim 6, wherein said focusing actuator further comprises a dynamic vibration absorber (120, 121). 9. The head main body according to claim 4, wherein the main body (2)
An optical disc device, characterized in that the peripheral side surface of (1) is provided with a bearing (23) for swinging support. 10. The driving means according to claim 1, wherein permanent magnets (41, 42) are fixed to the head main body, and a driving coil (44) is fixed to the yoke (43). Optical disk device. 11. A focusing actuator (70) according to claim 6, comprising two parallel-arranged leaf springs (101, 102) having the same shape. An optical disc device characterized by having a structure having a vibration damping material (109b) made of a viscoelastic body over the entire surface of the optical disc. 12. A spindle motor (14) for rotating a loaded optical disc (17), and a recording surface (17a) of the loaded optical disc (17).
And an oscillating optical head device (151) for oscillating the objective lens (50) in the radial direction of the optical disc by oscillating in a plane parallel to the optical disk. 156) and an arm (157) extending from the body, a head body (152) having an objective lens (50) at the tip of the arm, and a portion outside the mounted optical disk. A swing center fixed shaft (162) penetrating the center of the main body,
Swing support means (153), comprising a bearing (168, 170) fitted to the fixed shaft, for swingably supporting the head body; and substantially opposite to the objective lens with respect to the swing support means. is provided with a portion of the side, be more with the head that is pivoted to the body drive motion means (154), and, within the body portion, the semiconductor laser chip (19
6) first optical components (197, 2) for directing laser light emitted from the semiconductor laser chip to the objective lens;
00), a second optical component (200, 205, 206) for guiding a laser beam reflected by the optical disk and returned to the photodetector (207, 208) from the semiconductor laser chip and the objective lens Laser light (21)
0) and an optical path (216, 217, 218) of the laser beam reflected from the optical disk and returned to the photodetectors (207, 208) so as to surround the fixed axis. arranged to be in as formed, and the swing support means (153)及beauty driving means (15
An optical disc apparatus characterized in that the height of the optical disc is included within the height of 4). 13. An optical disk device according to claim 12, wherein the optical disk has an outer diameter of 1.8 inches or less. 14. The optical disk device according to claim 12, wherein the thickness of the disk substrate is 0.2 to 0.5 mm. 15. The head body (152) according to claim 12, wherein:
An optical disk device comprising: an inverted U-shaped frame (159); and a sheet (160) covering the lower surface of the frame. 16. The main body according to claim 13, wherein the fixed shaft (162) penetrates the center and the bearings (168, 17).
0) has a hole (163) in which the semiconductor laser chip, the first optical component, and the second optical component are mounted.
22, (223, 224)
The block (161) is swingably supported by the fixed shaft (162), and the semiconductor laser is mounted on the optical component mounting portions (220, 221, 222, 223, 224) of the block. Chip (196), first optical component (1
97, 200), the second optical component (200, 205, 2)
06) is attached. 17. The head main body according to claim 12, wherein the head body is disposed on upper and lower sides of the arm section in parallel with the arm section,
An optical disc device further comprising a parallel leaf spring mechanism (158) comprising a pair of leaf springs (233, 234) fixed to the main body and having the objective lens attached to the distal end side. 18. A rising mirror (213) for raising a laser beam emitted from the main body and directing the laser light toward the objective lens at a tip of the arm portion according to claim 12, wherein the rising mirror is: An optical disk device characterized in that the angle is fixed and fixed so that the error of the incident angle to the objective lens falls within an allowable range.