JP2518664Y2 - Radiation fin mounting structure - Google Patents
Radiation fin mounting structureInfo
- Publication number
- JP2518664Y2 JP2518664Y2 JP763691U JP763691U JP2518664Y2 JP 2518664 Y2 JP2518664 Y2 JP 2518664Y2 JP 763691 U JP763691 U JP 763691U JP 763691 U JP763691 U JP 763691U JP 2518664 Y2 JP2518664 Y2 JP 2518664Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- radiation fin
- support
- generating component
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
[考案の目的] [Purpose of device]
【0001】[0001]
【産業上の利用分野】本考案は、発熱部品の冷却用に用
いられる放熱フィンの取付構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for a radiation fin used for cooling a heat generating component.
【0002】[0002]
【従来の技術】プラグインタイプのプリント配線板に実
装された発熱部品の冷却用に用いられる放熱フィンにあ
っては、機器筐体に対してプリント配線板を自在に挿抜
し得るように、放熱フィンを着脱自在な状態で発熱部品
に取り付ける構成とする場合がある。2. Description of the Related Art A radiation fin used for cooling a heat-generating component mounted on a plug-in type printed wiring board is designed to radiate heat so that the printed wiring board can be freely inserted into and removed from the equipment casing. In some cases, the fin may be detachably attached to the heat-generating component.
【0003】図3及び図4にこの種の従来の放熱フィン
の取付構造を示す。3 and 4 show a conventional heat dissipating fin mounting structure of this type.
【0004】電子機器の筐体1に装着されたプラグイン
タイプのプリント配線板2には、IC(発熱部品)3が
実装されている。このIC3は、IC本体部4と放熱板
部5とで構成されており、放熱フィン7はその基面8が
放熱板部5に押し付けられた状態で筐体1の開口部10近
傍に取り付けられている。この放熱フィン7の取付構造
は以下のような構成となっている。An IC (heat generating component) 3 is mounted on a plug-in type printed wiring board 2 mounted on a housing 1 of an electronic device. The IC 3 is composed of an IC body 4 and a heat radiating plate 5, and the heat radiating fin 7 is attached near the opening 10 of the housing 1 with its base surface 8 pressed against the heat radiating plate 5. ing. The mounting structure of the radiation fin 7 has the following configuration.
【0005】放熱フィン7の長手方向両端部側の両側面
11,11には、夫々、穴部12が設けられており、この両端
部に配置された支持金具13,13の「コ」の字形の腕部14
に捩じ込まれた雄ねじ15の軸部16が穴部12に挿入されて
いる。Both sides of the radiation fin 7 on both sides in the longitudinal direction
Each of the holes 11 and 11 is provided with a hole 12, and the "U" -shaped arms 14 of the support fittings 13 and 13 arranged at both ends of the hole 12, respectively.
The shaft portion 16 of the male screw 15 screwed in is inserted into the hole portion 12.
【0006】一方、筐体1の開口部10周縁には一対の保
持金具18,18がねじ止めされている。夫々の保持金具1
8,18にはおねじ19のの軸20が設けられている。支持金
具13,13はIC3に近接離間する方向へスライド自在に
なるよう軸20に保持され、かつ、放熱フィン7の基面8
がIC3と対向するように位置付けられている。また、
軸20にはスプリング22が設けられており、夫々の支持金
具13,13はIC3に向けて常時押圧されている。On the other hand, a pair of holding metal fittings 18, 18 are screwed to the periphery of the opening 10 of the housing 1. Retaining bracket 1
8 and 18 are provided with a shaft 20 of a male screw 19. The support fittings 13 and 13 are held by the shaft 20 so as to be slidable in the direction of approaching and separating from the IC 3, and the base surface 8 of the heat radiation fin 7 is supported.
Are positioned to face IC3. Also,
A spring 22 is provided on the shaft 20, and the respective support fittings 13, 13 are constantly pressed toward the IC 3.
【0007】この従来の取付構造によると、放熱フィン
7の両端部を支持する支持金具13,13がスプリング22に
よりIC3に向けて付勢されており、かつ夫々の支持金
具13は放熱フィン7の長手方向の傾きに対して自由度を
もたせて保持しているので、放熱フィン7の基面8を、
IC3の放熱面に平行な状態で押し付けることができ
る。According to this conventional mounting structure, the support fittings 13, 13 for supporting both ends of the radiation fin 7 are biased toward the IC 3 by the spring 22, and each support fitting 13 is attached to the radiation fin 7. Since the radiating fins 7 are held with a degree of freedom with respect to the inclination in the longitudinal direction,
It can be pressed in parallel with the heat dissipation surface of the IC 3.
【0008】ところが、IC3の放熱板部5に対して放
熱フィン7の幅方向(両側面11,11の方向)に基面8が
傾いた状態で放熱フィン7が支持金具13,13に取り付け
られていると、放熱フィン7は基面8が放熱板部5に対
して傾いた状態でIC3に押し付けられることになり、
基面8をIC3に確実に密着させることが困難であっ
た。また、支持金具13が雄ねじ15を中心として回転する
ので、スプリング22の押圧力が放熱フィン7に確実に伝
達されず、IC3に対して放熱フィン7が十分に押し付
けられていない場合があった。However, the radiating fins 7 are attached to the support fittings 13 and 13 with the base surface 8 inclined with respect to the radiating plate portion 5 of the IC 3 in the width direction of the radiating fins 7 (direction of both side surfaces 11 and 11). Then, the radiation fin 7 is pressed against the IC 3 with the base surface 8 inclined with respect to the radiation plate portion 5,
It was difficult to surely bring the base surface 8 into close contact with the IC 3. Further, since the support fitting 13 rotates about the male screw 15, the pressing force of the spring 22 is not reliably transmitted to the heat radiation fin 7, and the heat radiation fin 7 may not be sufficiently pressed against the IC 3.
【0009】[0009]
【考案が解決しようとする課題】上述の如く、上記放熱
構造では発熱部品に対して放熱フィンの幅方向には自由
度がないため基面を密着させるのが困難であり、また、
スプリングの付勢力により支持金具が回転してしまい付
勢力が全てICに伝えられないので良好な放熱ができな
かった。As described above, in the above heat dissipation structure, it is difficult to closely attach the base surface to the heat-generating component because there is no degree of freedom in the width direction of the heat dissipation fins.
The support metal was rotated by the urging force of the spring, and the urging force could not be entirely transmitted to the IC, so good heat dissipation could not be achieved.
【0010】本考案はこのような従来の欠点に鑑みてな
されたものであり、放熱フィンを発熱部品に十分に押し
付け密着させることができる放熱フィンの取付構造を提
供することを目的とする。 [考案の構成]The present invention has been made in view of the above-mentioned conventional drawbacks, and an object of the present invention is to provide a mounting structure of a heat radiation fin which can be sufficiently pressed and closely contacted with a heat generating component. [Device configuration]
【0011】[0011]
【課題を解決するための手段】本考案では、基板に実装
された発熱部品に放熱フィンの基面が密着させられて放
熱フィンが取り付けられる放熱フィンの取付構造におい
て、前記基面に直交する前記放熱フィンの相対向する端
面の一方を支軸を介して回動自在に支持する第1の支持
具及び他方を支軸を介して回動自在に支持する第2の支
持具と、前記放熱フィンの前記基面が前記発熱部品と対
向しかつ前記第1及び第2の支持具が前記発熱部品に対
して近接離間する方向にスライド自在な状態で前記第1
及び第2の支持具を保持する保持具と、前記第1の支持
具と前記保持具との間に設けられ前記第1の支持具を前
記発熱部品に向けて付勢する第1の付勢手段及び前記第
2の支持具と前記保持具との間に設けられ前記第2の支
持具を前記発熱部品に向けて付勢する第2の付勢手段と
を具備して構成される。According to the present invention, in a mounting structure of a heat radiating fin in which a heat radiating fin has a base surface closely attached to a heat generating component mounted on a substrate and the heat radiating fin is mounted, the heat radiating fin mounting structure is orthogonal to the base surface. A first support tool that rotatably supports one of the opposite end surfaces of the heat radiation fin via a support shaft, and a second support tool that supports the other end of the heat release fin via a support shaft in a rotatable manner; The first base in a state where the base surface faces the heat-generating component and is slidable in a direction in which the first and second support members approach and separate from the heat-generating component.
And a holder for holding the second support, and a first biasing provided between the first support and the holder for biasing the first support toward the heat-generating component. And a second urging means that is provided between the second supporting tool and the holding tool and urges the second supporting tool toward the heat-generating component.
【0012】[0012]
【作用】本考案では、放熱フィンの相対向する端面の一
方は支軸を介して第1の支持具に回動自在に支持され他
方は支軸を介して第2の支持具に回動自在に支持され、
かつ、第1及び第2の支持具は、夫々、付勢手段により
発熱部品に向けて押し付けられているので、放熱フィン
の両端部は第1及び第2の支持具により発熱部品に押し
付けられ、また、放熱フィンが支軸を中心として発熱部
品に対して傾き放熱フィンの端面と交差する縁部のうち
一方の縁部が先に発熱部品に当接しても、この一方の縁
部と対向する他方の縁部は支軸により発熱部品に当接す
る方向へ回転させられる。In the present invention, one of the opposing end faces of the heat radiation fin is rotatably supported by the first support through the support shaft, and the other end is rotatably supported by the second support through the support shaft. Supported by
Moreover, since the first and second support members are respectively pressed toward the heat-generating component by the biasing means, both ends of the heat radiation fin are pressed against the heat-generating component by the first and second support members, Further, even if one of the edge portions of the edge portion of the heat radiation fin which is inclined with respect to the spindle and tilts with respect to the heat generating component and intersects the end surface of the heat radiation fin comes into contact with the heat generating component first, it opposes the one edge portion. The other edge is rotated by the support shaft in the direction of coming into contact with the heat generating component.
【0013】[0013]
【実施例】以下、本考案の一実施例を図1及び図2を参
照して詳述する。図1は放熱フィンの取付構造を説明す
る平面図、図2は図1のA−A線断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to FIGS. FIG. 1 is a plan view for explaining the mounting structure of the radiation fin, and FIG. 2 is a sectional view taken along the line AA of FIG.
【0014】従来例と同様、電子機器の筐体1に装着さ
れたプラグインタイプのプリント配線板(基板)2に
は、発熱部品であるところのIC3が実装されている。
また、IC3は、IC本体部4と放熱板部5とで構成さ
れており、本考案に係る放熱フィン30はその基面31が放
熱板部5に押し付けられた状態で筐体1の開口部10近傍
に取り付けられている。以下に、この放熱フィン30の取
付構造につき説明する。As in the conventional example, an IC 3 which is a heat-generating component is mounted on a plug-in type printed wiring board (board) 2 mounted on a housing 1 of an electronic device.
Further, the IC 3 is composed of an IC body 4 and a heat dissipation plate 5, and the heat dissipation fin 30 according to the present invention has an opening portion of the housing 1 with its base surface 31 pressed against the heat dissipation plate 5. It is installed near 10. The mounting structure of the heat radiation fin 30 will be described below.
【0015】放熱フィン30の長手方向の両端面33a ,33
b には、夫々、穴部34が設けられている。一方の端面33
a の穴部34には、「L」字形の支持金具(第1の支持
具)36a に捩じ込まれた雄ねじ37の軸部(支軸)38が挿
入されている。同様に、他方の端面33b の穴部34には、
「L」字形の支持金具(第2の支持具)36b に捩じ込ま
れた雄ねじ37の軸部38が挿入されている。Both end faces 33a, 33 in the longitudinal direction of the radiation fin 30
Each b is provided with a hole 34. One end face 33
A shaft portion (support shaft) 38 of a male screw 37 screwed into an "L" -shaped support fitting (first support tool) 36a is inserted into the hole 34 of a. Similarly, in the hole 34 of the other end face 33b,
The shaft portion 38 of the male screw 37 screwed into the "L" -shaped support fitting (second support tool) 36b is inserted.
【0016】一方、筐体1の開口部10周縁には一対の保
持金具(保持具)40a ,40b がねじ止めされている。そ
して、支持金具36a ,36b は保持金具40a ,40b に設け
られたおねじ42の軸部43にIC3に対して近接離間する
方向にスライド自在に保持されており、かつ放熱フィン
30の基面31がIC3と対向するように位置付けられてい
る。また、保持金具40a と支持金具36a との間にはスプ
リング(第1の付勢手段)45a が設けられ、同様に保持
金具40b と支持金具36b との間にはスプリング(第2の
付勢手段)45b が設けられ、支持金具36a ,36b はこれ
らのスプリング45a ,45b によって図1に示す矢印方向
に押圧されている。On the other hand, a pair of holding metal fittings (holding tools) 40a, 40b are screwed to the periphery of the opening 10 of the housing 1. The support fittings 36a and 36b are slidably held by the shaft portion 43 of the male screw 42 provided on the holding fittings 40a and 40b in the direction of approaching and separating from the IC 3, and the heat radiation fins.
The base surface 31 of 30 is positioned so as to face the IC 3. A spring (first urging means) 45a is provided between the holding metal fitting 40a and the support metal fitting 36a, and a spring (second urging means) is similarly provided between the holding metal fitting 40b and the support metal fitting 36b. ) 45b, and the support fittings 36a, 36b are pressed in the direction of the arrow shown in FIG. 1 by these springs 45a, 45b.
【0017】次に上記取付構造の作用につき説明する。Next, the operation of the above mounting structure will be described.
【0018】放熱フィン30の両端面33a ,33b は支持金
具36a ,36b で支持されており、夫々の支持金具36a ,
36b はスプリング45a ,45b の作用により常時IC3に
向けて押圧されている。従って、図1に示す如く、端面
33a 側の放熱フィン30の端部は支持金具36a によりIC
3に押し付けられ、同様に、端面33b 側の放熱フィン30
の端部は支持金具36b によりIC3に押し付けられるの
で、放熱フィン30の長手方向の両端部はIC3に確実に
押し付けられる。また、支持金具36a ,36b は支軸38を
介して回動自在な状態で両端面33a ,33b を支持してい
る。従って、図2の一点鎖線で示す如く、基面31がIC
3に対して傾いた状態で放熱フィン30が支持され基面31
の一方の縁部47a が先にIC3に当接しても、この一方
の縁部47a と対向する他方の縁部47b は支軸38を介して
作用するスプリング45a ,45bの押圧力により矢印方向
へ回転させられ、縁部47b も確実にIC3に当接する。
従って、放熱フィン30の基面31はIC3に確実に密着
し、スプリング45a ,45bの適度な押圧力でIC3に押
し付けられる。Both end faces 33a and 33b of the radiation fin 30 are supported by support fittings 36a and 36b, respectively.
36b is constantly pressed toward IC3 by the action of springs 45a and 45b. Therefore, as shown in FIG.
The end of the radiation fin 30 on the 33a side is attached to the IC by the support metal fitting 36a.
3 is pressed against the end face 33b side of the heat dissipation fin 30
Since the ends of the heat radiating fins 30 are pressed against the IC 3 by the support fittings 36b, both ends of the heat radiation fin 30 in the longitudinal direction are pressed against the IC 3 without fail. Further, the support fittings 36a, 36b support both end faces 33a, 33b in a rotatable state via a support shaft 38. Therefore, as shown by the alternate long and short dash line in FIG.
The heat dissipating fins 30 are supported in a state of being inclined with respect to the base surface 31.
Even if one of the edge portions 47a comes into contact with the IC 3 first, the other edge portion 47b opposite to the one edge portion 47a is moved in the arrow direction by the pressing force of the springs 45a and 45b acting via the support shaft 38. The edge 47b is rotated and surely contacts the IC3.
Therefore, the base surface 31 of the radiating fin 30 surely comes into close contact with the IC 3, and is pressed against the IC 3 by an appropriate pressing force of the springs 45a and 45b.
【0019】尚、本例では保持具40a ,40b を筐体1に
取り付けて支持具36a ,36b を保持させているが、これ
に限定されるものではなく、筐体1自体を保持具として
用い、筐体1に直接支持具を保持させても良い。In this embodiment, the holders 40a and 40b are attached to the housing 1 to hold the supports 36a and 36b, but the present invention is not limited to this, and the housing 1 itself is used as a holder. Alternatively, the support may be held directly on the housing 1.
【0020】[0020]
【考案の効果】以上説明したように本考案では、放熱フ
ィンの両端部は発熱部品に向けて付勢された第1及び第
2の支持具により発熱部品に押し付けられ、また、放熱
フィンが発熱部品に対して傾き放熱フィンの端面と交差
する縁部のうち一方の縁部が先に発熱部品に当接して
も、この一方の縁部と対向する他方の縁部は支軸の作用
により発熱部品に当接する方向へ回転させられる。従っ
て、放熱フィンを発熱部品に適度な押圧力で密着させる
ことができる。As described above, according to the present invention, both ends of the heat radiation fin are pressed against the heat generation component by the first and second support members biased toward the heat generation component, and the heat radiation fin generates heat. Even if one edge of the edges intersecting the end face of the heat radiation fin and tilting against the component comes into contact with the heat-generating component first, the other edge facing this one edge generates heat due to the action of the spindle. It is rotated in the direction of abutting the part. Therefore, the heat radiation fin can be brought into close contact with the heat generating component with an appropriate pressing force.
【図1】本考案の放熱フィンの取付構造を説明する平面
図。FIG. 1 is a plan view illustrating a mounting structure of a radiation fin of the present invention.
【図2】図1のA−A線断面図。FIG. 2 is a sectional view taken along line AA of FIG.
【図3】従来の放熱フィンの取付構造を説明する平面
図。FIG. 3 is a plan view illustrating a conventional radiation fin mounting structure.
【図4】上記取付構造の側面図。FIG. 4 is a side view of the mounting structure.
2 …基板 3 …発熱部品 30 …放熱フィン 31 …基面 33a …一方の端面 33b …他方の端面 36a …第1の支持具 36b …第2の支持具 38 …支軸 40a ,40b …保持具 45a …第1の付勢手段 45b …第2の付勢手段 2 ... Substrate 3 ... Heat-generating component 30 ... Radiating fin 31 ... Base surface 33a ... One end surface 33b ... Other end surface 36a ... First support tool 36b ... Second support tool 38 ... Spindles 40a, 40b ... Holding tool 45a ... first biasing means 45b ... second biasing means
Claims (1)
の基面が密着させられて放熱フィンが取り付けられる放
熱フィンの取付構造において、前記基面に直交する前記
放熱フィンの相対向する端面の一方を支軸を介して回動
自在に支持する第1の支持具及び他方を支軸を介して回
動自在に支持する第2の支持具と、前記放熱フィンの前
記基面が前記発熱部品と対向しかつ前記第1及び第2の
支持具が前記発熱部品に対して近接離間する方向にスラ
イド自在な状態で前記第1及び第2の支持具を保持する
保持具と、前記第1の支持具と前記保持具との間に設け
られ前記第1の支持具を前記発熱部品に向けて付勢する
第1の付勢手段及び前記第2の支持具と前記保持具との
間に設けられ前記第2の支持具を前記発熱部品に向けて
付勢する第2の付勢手段とを具備することを特徴とする
放熱フィンの取付構造。1. In a mounting structure of a radiation fin, wherein a radiation fin has a base surface closely attached to a heat-generating component mounted on a substrate so that the radiation fin is mounted. A first support tool that rotatably supports one through a support shaft, a second support tool that rotatably supports the other through a support shaft, and the base surface of the heat radiation fin is the heat generating component. A holder that holds the first and second supports in a state of facing each other and slidable in a direction in which the first and second supports approach and separate from the heat generating component; First urging means provided between a supporting tool and the holding tool for urging the first supporting tool toward the heat generating component, and provided between the second supporting tool and the holding tool. Second biasing means for biasing the second support tool toward the heat generating component And a mounting structure for a radiation fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP763691U JP2518664Y2 (en) | 1991-02-21 | 1991-02-21 | Radiation fin mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP763691U JP2518664Y2 (en) | 1991-02-21 | 1991-02-21 | Radiation fin mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04105595U JPH04105595U (en) | 1992-09-10 |
| JP2518664Y2 true JP2518664Y2 (en) | 1996-11-27 |
Family
ID=31899207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP763691U Expired - Lifetime JP2518664Y2 (en) | 1991-02-21 | 1991-02-21 | Radiation fin mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2518664Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5899473B2 (en) * | 2011-02-03 | 2016-04-06 | パナソニックIpマネジメント株式会社 | Electronic equipment cooling structure |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5260249B2 (en) * | 2008-12-08 | 2013-08-14 | 東芝シュネデール・インバータ株式会社 | Semiconductor equipment heatsink |
| JP5998890B2 (en) * | 2012-12-06 | 2016-09-28 | 富士通株式会社 | Spring washers and fixtures |
-
1991
- 1991-02-21 JP JP763691U patent/JP2518664Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5899473B2 (en) * | 2011-02-03 | 2016-04-06 | パナソニックIpマネジメント株式会社 | Electronic equipment cooling structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04105595U (en) | 1992-09-10 |
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