JP2570861B2 - Inverter device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention comprises a main circuit component including a converter unit and an inverter unit, a control component for controlling the main circuit component, a power supply circuit, a base drive circuit, and the like. It relates to an inverter device.

[Conventional technology]

FIG. 6 is a circuit diagram of a general inverter device, and FIG. 7 is a sectional view of a conventional inverter device.

In FIG. 6, a main circuit component 3 including a converter section 1a and an inverter section 1b is provided with a control component 4 for controlling them.
Is connected. The control component 4 is a digital circuit including a CPU, an LSI, a ROM, a RAM, and the like. A power supply circuit 5 and a base drive circuit 6 are connected between the main circuit component 3 and the control component 4, and in addition, the capacitor 2 is provided between the converter 1a and the inverter 1b. V / F converter 7,
The operation unit 8 and the like are connected.

FIG. 7 shows the structure of each component based on the circuit diagram. A cooling surface 11c of a cooling body 11 composed of a fin 11a and a base 11b, which is integrally extruded with an aluminum alloy, is provided with a converter 2a, a module 12 having an inverter 1b as a power module, and a condenser 2 to be cooled. You.
The control component 4 is mounted on a printed board 14 which is printed and wired on a glass epoxy board provided on a mounting base 13. The power supply circuit 5 and the base drive circuit 6 include, for example, about 100 capacitors, resistors, transistors, photocouplers, and the like.
Since each of the individual components is formed, it is printed on the printed board 14. The main circuit components on the cooling body 11 are connected to the control component 4, the power supply circuit 5, and the base drive circuit 6 on the printed board 14 by a number of cables and connectors (not shown). The entire circuit is drawn out to the outside by terminal blocks 15 (15a, 15b) provided on the cooling body 11 and the printed board 14, and the entire device is covered with a case 16 to form a fully closed structure.

[Problems to be solved by the invention]

In the above-mentioned conventional example, the module of the main circuit that generates a large amount of heat
12 is well cooled by the cooling body 11, but also radiates heat to the space surrounded by the case 16. The power supply circuit 5 and the base drive circuit 6 generate a large amount of heat, although not as much as the main circuit. However, since the number of components constituting both components is large, it is mounted on the printed board 14 to overcome the complexity of the circuit network.

Therefore, the remaining heat amount due to the cooling of the cooling body 11 of the module 12 of the main circuit and the power supply circuit 5 and the base drive circuit 6
Is generated in the case 16. For this reason, the ambient temperature of the control component 4 having a relatively small amount of heat generation becomes high, which causes a problem of heat resistance and a problem that the space inside the case 16 is increased and the entire device becomes large. There is also a problem that the number of wires and connectors for connection between the main circuit component 3 and the printed board 14 is large.

An object of the present invention is to provide an inverter device, particularly an inverter device that promotes cooling of a power supply circuit and a drive circuit, lowers the ambient temperature of a control component, and also enables wiring by wires and connectors to be printed as much as possible. is there.

[Means for solving the problem]

According to a first aspect of the present invention, an inverter device includes a main circuit component including a converter unit and an inverter unit, a control component for controlling the main circuit component, a power supply circuit, and a base drive circuit. The printed circuit board mounted on a metal printed circuit board, the metal printed circuit board and the main circuit components are brought into close contact with the cooling surface of the cooling body exposed to the outside air of the box of the inverter device, and the printed circuit board on which the control components are mounted is mounted on the inverter. Place in the box of the device.

According to a second aspect of the present invention, an inverter device includes a main circuit component including a converter unit and an inverter unit, a control component for controlling the main circuit component, a power supply circuit, and a base drive circuit. The drive circuit is mounted on a metal printed circuit board, and the metal printed circuit board and the main circuit components are brought into close contact with the cooling surface of the cooling body exposed to the outside air of the box of the inverter device.

According to a third aspect of the invention, an inverter device includes a main circuit component including a converter unit and an inverter unit, a control component for controlling the main circuit component, a power supply circuit, and a base drive circuit. The power supply circuit and the base drive circuit are mounted on a metal printed board, and the metal printed board is brought into close contact with a cooling surface of a cooling body exposed to the outside air of the box of the inverter device.

According to a fourth aspect of the present invention, an inverter device includes a main circuit component including a converter unit and an inverter unit, a control component for controlling the main circuit component, a power supply circuit, and a base drive circuit. A base drive circuit is mounted on a metal printed circuit board, and the metal printed circuit board is brought into close contact with a cooling surface of a cooling body exposed to the outside air of the box of the inverter device, and a printed circuit board on which control components are mounted is mounted on the inverter. Place in the box of the device.

According to a fifth aspect of the present invention, an inverter device includes a main circuit component including a converter unit and an inverter unit, a control component for controlling the main circuit component, a power supply circuit, and a base drive circuit. A pattern made of conductive material is formed on a thin insulating layer fixed to the cooling surface of the cooling body exposed to the outside air, and the main circuit components, power supply circuit, base drive circuit, and control components are mounted on this pattern. The printed circuit board is placed in the box of the inverter device.

According to a sixth aspect of the present invention, in any one of the first, fourth, and fifth aspects, the main circuit components, the power supply circuit, and the base drive circuit are covered with a heat insulating cover, and the printed circuit board on which the control components are mounted is mounted on the inverter device. Placed outside the heat-insulating cover in the box body.

[Action]

In the present invention, the power supply circuit and the base drive circuit, which have a relatively large amount of heat and are composed of a large number of components, are mounted on a metal printed board so that the wiring between the large number of components is printed, and the metal circuit is made of metal. It is cooled from the cooling surface via the printed circuit board.

Also, if control components or main circuit components are also mounted on a metal printed circuit board, most components of the circuit will be printed wiring and cooling will be good.

〔Example〕

1 is a sectional view of a first embodiment of an inverter device, FIG. 2 is a sectional view of a second embodiment, FIG. 3 is a sectional view of a third embodiment, and FIG. FIG. 5 is a partial sectional view of the IV section up to FIG. 3, FIG. 5 is a sectional view of the fourth embodiment, and FIG. 8 is a sectional view of the fifth embodiment. A structure based on the drawing and having the same reference numerals as in FIG. 7 has approximately the same functions.

FIG. 1 relates to the first embodiment, and a module of a main circuit component is mounted on a cooling surface 11c of a cooling body 11 composed of a fin 11a and a substrate 11b and integrally formed by die casting or the like and cooled by a fan 21. . The control component 4 is mounted on a printed board 14 that is printed and wired on a glass epoxy board provided on the mounting base 13. The condenser 2 is a cooling body 11
Is installed in a space without the fins 11 a on the outer surface of the fan and is cooled by the fan 21.

A metal printed board 22 is attached to the cooling surface 11c in close contact therewith. A power supply circuit 5 and a base drive circuit 6 having relatively large amounts of heat are surface-mounted on the metal printed board 22 at a distance from the control component 4.

As shown in FIG. 4, the structure of the metal printed board 22 is such that a pattern 22c made of a conductive material such as copper is formed on a thin insulating layer 22b such as an epoxy resin fixed to a metal plate 22a such as an aluminum plate. Form. Electronic components such as semiconductor chips and capacitors are surface-mounted on the pattern 22c by soldering or bumps (protruding electrodes). Crossover wiring 22d is also possible, under resist 22e, cover resist 22f
Should be applied. When mounting the metal printed circuit board 22 on the cooling surface 11c of the cooling body 11, it is screwed using a thermal compound or the like.

According to the structure of FIG. 1, wiring by electric wires is required between the printed board 14 and the metal printed board 22,
Power supply circuit 5 and base drive circuit 6 that generate a relatively large amount of heat
The printed circuit is internally printed, the cooling is particularly improved, the problem of the heat resistance of the control component 4 is solved, and the case 16 is not excessively large.

As a modification of FIG. 1, the control component 4 is also surface-mounted on the metal printed circuit board 22 so that not only the printed board 14 can be omitted, but also the electric wire between the control component 4 and the power supply circuit 5 and the base drive circuit 6. This eliminates the need for wiring.

FIG. 2 relates to a second embodiment and relates to a cooling surface 11c of the cooling body 11.
The electronic components surface-mounted on the metal printed circuit board 22 which is attached in close contact with the control unit 4, the power supply circuit 5, and the base drive circuit 6, as well as the converter 1a, which is a component of the main circuit component 3, and the inverter The semiconductor chip 23 (23a, 23b, 23c) of the portion 1b is included. That is, the module 12 is not used for the main circuit, but is printed and wired as a chip together with other electronic components. The semiconductor chip 23 is connected to a metal printed board 22 by bonding wires 24.

According to the structure of FIG. 2, all the electronic components of the control component 4, the power supply circuit 5, and the base drive circuit 6, including the large number of semiconductor chips 23 constituting the main circuit, are mounted on a single metal printed circuit board 22. Therefore, all of these electronic components are printed and wired, and wiring by wires is almost eliminated. In addition, the semiconductor chip 23 of the main circuit does not need to be modularized as an intermediate component, and can be mounted simultaneously with other electronic components. In particular, since there is no resin sealing for the module and the semiconductor chip 23 is directly mounted on the metal printed board 22 and cooled by the cooling body 11, the cooling is further improved and the case 16 is further reduced.

FIG. 3 relates to a third embodiment, in which a metal printed circuit board 22 is used.
The module 12 of the main circuit component 3 is mounted together with the power supply circuit 5 and the base drive circuit 6. The control component 4 is mounted on the printed board 14, but the control component 4 may be mounted on the metal printed board 22 without using the printed board 14.

In the embodiment shown in FIGS. 1 to 3, the cooling body 11 may be a simple flat plate having no fin 11a.

FIG. 5 relates to a fourth embodiment, in which a part of a box body 61 for accommodating an inverter device is used as a metal cooling surface 62 and fins 62a are integrally formed on the outside thereof, and the metal surface is directly formed on the cooling surface 62. Form a printed circuit board. That is, an insulating layer (not shown) of a thin film such as an epoxy resin is fixed to the cooling surface 62 which is a part of the box 61, and a pattern (not shown) made of a conductive material is formed thereon. If Fig. 4 is adopted, the metal plate of Fig. 4
22a is the cooling surface 62 having the fins 62a of FIG.

In FIG. 5, components denoted by the same reference numerals as those in FIGS. 1 to 3 have approximately the same functions, and the module 12 is mounted on the insulating layer and the pattern of the cooling surface 62, and the power supply circuit 5 and the base drive circuit 6 are mounted on the surface. Implement. The control component 4 is mounted on the printed board 14, but if the control component 4 is mounted on the cooling surface 62 together with other components, the printed board 14 can be omitted. Further, the module 12 may be mounted as a semiconductor chip 23.

FIG. 8 relates to a fifth embodiment, in which a cooling circuit 11 composed of fins 11a and a substrate 11b and integrally formed by die-casting or the like has a cooling surface 11c to which a main circuit component module 12 is attached. The power supply circuit 5 and the base drive circuit 6 are attached in close contact with the cooling body 11 via a metal printed board 22.

The module 12, the power supply circuit 5, and the base drive circuit 6 are covered with a heat insulating cover 71 made of foam resin or the like in the box 16,
The control component 4 and the terminal block 15b inside the box 16 and outside the heat insulating cover 71
A printed board 14 to which the like is attached is arranged. The terminal block 15a for the main circuit components and the like passes through the heat insulating cover 71 while keeping the air tightness so as not to impair the heat insulating property of the heat insulating cover 71.

As a modification of FIG. 8, the module 12 is mounted on the cooling body 11 as a semiconductor chip, the cooling body 11 itself is a metal printed board provided with fins, and the inside of the heat insulating cover 71 is further connected to the main circuit component side and other parts. A heat insulating partition may be provided on the circuit side.

〔The invention's effect〕

According to the present invention, the power supply circuit and the base drive circuit, which generate a relatively large amount of heat, are satisfactorily cooled from the cooling surface of the box via the metal printed circuit board. Also, since the power supply circuit and the base drive circuit are mounted on a metal printed circuit board and the wiring between many components is printed, the size of the case, that is, the entire inverter device can be reduced.

Furthermore, if control components or main circuit components are also mounted on a metal printed circuit board, most components of the circuit are printed and wired, and cooling is improved.

[Brief description of the drawings]

FIG. 1 is a sectional view of a first embodiment of an inverter device, and FIG.
FIG. 3 is a cross-sectional view of the second embodiment, FIG. 3 is a cross-sectional view of the third embodiment, FIG. 4 is a partial cross-sectional view of the IV section from FIG. 1 to FIG. 3, and FIG. FIG. 6 is a circuit diagram of a general inverter device, FIG. 7 is a cross-sectional view of a conventional inverter device, and FIG. 8 is a cross-sectional view of a fifth embodiment. 1a converter part, 1b inverter part, two capacitors, three main circuit components, four control components, five power supply circuits, six base drive circuits, 11a, 62a cooling fins , 11b ... base, 11c, 62 ... cooling surface, 11 ... cooling body, 1
2… Module, 14… Printed board, 22… Metal printed board, 23a, 23b, 23c… Semiconductor chip, 71… Insulated cover.

Claims (6)

(57) [Claims] 1. A main circuit component comprising a converter unit and an inverter unit, a control component for controlling the main circuit component,
The power supply circuit and the base drive circuit constitute an inverter device, the power supply circuit and the base drive circuit are mounted on a metal printed board, and the metal printed board and the main circuit components are exposed to the outside air of the box of the inverter device. An inverter device, wherein a printed board on which a control component is mounted is disposed in a box of the inverter device while being closely attached to a cooling surface of a cooling body. 2. A main circuit component comprising a converter unit and an inverter unit, a control component for controlling the main circuit component,
An inverter device is composed of the power supply circuit and the base drive circuit. The control component, the power supply circuit and the base drive circuit are mounted on a metal printed circuit board, and the metal printed circuit board and the main circuit component are mounted on the outside of the box of the inverter device. An inverter device, which is brought into close contact with a cooling surface of a cooling body exposed to air. 3. A main circuit component comprising a converter unit and an inverter unit, a control component for controlling the main circuit component,
The power supply circuit and the base drive circuit constitute an inverter device. The main circuit components, control components, the power supply circuit and the base drive circuit are mounted on a metal printed circuit board, and the metal printed circuit board is mounted on the outside of the box of the inverter device. An inverter device, which is brought into close contact with a cooling surface of a cooling body exposed to air. 4. A main circuit component comprising a converter unit and an inverter unit, a control component for controlling the main circuit component,
The power supply circuit and the base drive circuit constitute an inverter device. The main circuit components, the power supply circuit and the base drive circuit are mounted on a metal printed circuit board, and the metal printed circuit board is exposed to the outside air of the box of the inverter device. An inverter device, wherein a printed board on which a control component is mounted is disposed in a box of the inverter device while being closely attached to a cooling surface of a cooling body. 5. A main circuit component comprising a converter unit and an inverter unit, a control component for controlling the main circuit component,
A power supply circuit and a base drive circuit constitute an inverter device, and a pattern made of a conductive material is formed on a thin insulating layer fixed to a cooling surface of a cooling body exposed to the outside air of the box of the inverter device. An inverter device comprising a main circuit component, a power supply circuit, and a base drive circuit mounted on a pattern, and a printed circuit board on which control components are mounted is disposed in a box of the inverter device. 6. The inverter device according to claim 1, wherein a main circuit component, a power supply circuit, and a base drive circuit are covered with a heat insulating cover, and a printed board on which control components are mounted is mounted on the inverter. An inverter device disposed outside the heat-insulating cover in a box of the device.