JP2026005111A - Mounting Equipment - Google Patents

Abstract

A mounting device capable of efficiently mounting a plurality of electronic components is provided.
[Solution] The mounting device 1 includes a plurality of supply modules 102A, 102B that supply electronic components 14A, 14B, a mounting module 101 that mounts the electronic components 14A, 14B on a substrate 41, and a transport mechanism 120 that has at least one transport unit configured to transport the electronic components 14A, 14B from each of the plurality of supply modules 102A, 102B to the mounting module 101, and that is configured to extend across the plurality of supply modules 102A, 102B and the mounting module 101 in a first direction in a planar view.
[Selected Figure] Figure 1

Description

The present invention relates to a mounting device.

Flip-chip bonding is a widely known method for mounting semiconductor chips to substrates. In this method, a semiconductor chip is first picked up from a semiconductor wafer, flipped over, and the surface opposite the connection terminals of the semiconductor chip is placed over a bonding tool and attached. The bonding tool then thermally welds the connection terminals of the semiconductor chip to the electrode pads of the substrate, thereby mounting the semiconductor chip to the substrate.

Patent No. 3567896

For example, when supplying multiple semiconductor chips from multiple semiconductor wafers and mounting them on a single board, there are two ways to do it: prepare a mounting device for each semiconductor wafer and move the board between the mounting devices, or replace the semiconductor wafer during mounting. In the former case, mounting defects may occur due to misalignment between the board and the semiconductor chip. In the latter case, because it takes time to replace the semiconductor wafer, the solder flux may dry out during mounting, causing mounting defects.

The present invention was made in light of these circumstances, and aims to provide a mounting device that can efficiently mount multiple electronic components.

A mounting device according to one aspect of the present invention includes a plurality of supply modules that supply electronic components, a mounting module that mounts the electronic components on a substrate, and a transport mechanism that has at least one transport unit configured to transport electronic components from each of the plurality of supply modules to the mounting module, and that extends across the plurality of supply modules and mounting modules in a first direction in a plan view.

The present invention provides a mounting device that can efficiently mount multiple electronic components.

FIG. 1 is a plan view showing a mounting apparatus according to an embodiment of the present invention. FIG. 2 is a side view showing the mounting apparatus according to the present embodiment. FIG. 1 is a front view showing a mounting device according to an embodiment of the present invention.

Embodiments of the present invention are described below. In the following description of the drawings, identical or similar components are represented by identical or similar reference numerals. The drawings are illustrative, and the dimensions and shapes of each part are schematic. The technical scope of the present invention should not be interpreted as being limited to the embodiments described.

The mounting device 1 is a flip-chip bonder that mounts semiconductor dies 14A and 14B on a circuit board 41. The semiconductor dies 14A and 14B are an example of electronic components, such as semiconductor chips having integrated circuits. The circuit board 41 is an example of a substrate, such as a printed circuit board (PCB) or a flexible printed circuit (FPC).

Note that the electronic components and substrates are not limited to those described above. The electronic components may be, for example, various active or passive components. The substrate may be, for example, a lead frame, a ceramic substrate, a semiconductor substrate, or an electronic component. The electronic components may be mounted directly on the substrate, or may be indirectly mounted on the substrate by being mounted on other electronic components mounted on the substrate.

The mounting device 1 comprises a mounting module 101, multiple supply modules 102A and 102B, and a transport mechanism 120. The mounting module 101, supply module 102A, and supply module 102B are aligned in this order in the X-axis direction. Supply module 102A is adjacent to the mounting module 101 on the negative side of the X-axis, and supply module 102B is adjacent to the mounting module 101 on the negative side of the X-axis, with supply module 102A being located between the mounting module 101 and supply module 102B. Supply module 102A is connected to the mounting module 101, and supply module 102B is connected to supply module 102A.

The mounting module 101 transports the semiconductor dies 14A and 14B in the Y-axis direction and mounts the semiconductor dies 14A and 14B on the circuit board 41. The mounting module 101 is provided with a stand 11.

As shown in FIG. 1, a mounting stage 40 is provided on the upper surface of the mount 11. The mounting stage 40 adsorbs a circuit board 41 on which semiconductor dies 14A and 14B are mounted, and heats the circuit board 41 using a built-in heater. A transport rail 42 is connected to the mounting stage 40. The transport rail 42 supplies the circuit board 41 from a board supply module (not shown) to the mounting stage 40, and also supplies the circuit board 41 on which semiconductor dies 14A and 14B are mounted to a product recovery module (not shown). The transport rail 42 is configured by connecting rails provided on the mounting module 101 and supply modules 102A and 102B, and extends in the X-axis direction across the mounting module 101 and supply modules 102A and 102B.

As shown in FIG. 1, a pair of guide rails 43 extending in the X-axis direction are provided on the top surface of the platform 11. Sliders 44A and 44B are attached to each of the pair of guide rails 43. Sliders 44A and 44B are configured to be movable in the X-axis direction by a drive motor (not shown).

Gantry frame 45A is attached to slider 44A, and gantry frame 45B is attached to slider 44B. Gantry frames 45A and 45B are gate-shaped frames extending in the Y-axis direction, with the legs of gantry frame 45A fixed to slider 44A and the legs of gantry frame 45B fixed to slider 44B. Gantry frame 45A is configured to be movable in the X-axis direction as slider 44A moves along guide rail 43. Similarly, gantry frame 45B is configured to be movable in the X-axis direction as slider 44B moves along guide rail 43.

Mounting head 46A is attached to gantry frame 45A, and mounting head 46B is attached to gantry frame 45B. Mounting head 46A has a mounting nozzle 47A, and mounting head 46B has a mounting nozzle 47B. Mounting heads 46A and 46B are configured to be movable in the Y-axis direction by a drive motor (not shown). Mounting head 46A picks up and transports the semiconductor die 14A received from the transport mechanism 120 to mount it on the circuit board 41. Mounting head 46B picks up and transports the semiconductor die 14B received from the transport mechanism 120 to mount it on the circuit board 41. Mounting head 46A and mounting head 46B are configured to be movable independently of each other.

Mounting head 46A is configured to be able to pick up and transport both semiconductor dies 14A and 14B, and mounting head 46B is similarly configured to be able to pick up and transport both semiconductor dies 14A and 14B. Therefore, the combinations of mounting heads 46A and 46B with semiconductor dies 14A and 14B are not limited to those described above. Mounting head 46A may mount semiconductor die 14B on circuit board 41, or may mount both semiconductor dies 14A and 14B on circuit board 41. Similarly, mounting head 46B may mount semiconductor die 14A on circuit board 41, or may mount both semiconductor dies 14A and 14B on circuit board 41.

As shown in FIG. 2, the mounting nozzle 47A includes, for example, a motor 50, a base 51, a ball screw 52, a pulse heater 53, and a mounting tool 54. The motor 50 is fixed to the mounting head 46A. The base 51 is attached to the mounting head 46A so as to be movable in the Z direction. The ball screw 52 rotates based on the driving force from the motor 50, thereby moving the base 51 in the Z direction. The pulse heater 53 is attached to the base 51, and the mounting tool 54 is attached below it. The mounting tool 54 is configured to be able to adsorb a semiconductor chip 14 to its tip surface. When the base 51 is moved in the Z direction by the motor 50, the mounting tool 54 moves in the Z-axis direction together with the base 51. Although not shown, the mounting nozzle 47B also includes a motor, a base, a ball screw, a pulse heater, and a mounting tool, just like the mounting nozzle 47A.

Supply module 102A supplies semiconductor dies 14A, and supply module 102B supplies semiconductor dies 14B. Supply module 102A is provided with wafer holder 12A, and supply module 102B is provided with wafer holder 12B. Wafer holder 12A is annular and holds diced semiconductor wafer 13A. Wafer holder 12B similarly holds diced semiconductor wafer 13B. Wafer holders 12A and 12B are moved in the Y-axis direction by a drive motor (not shown). Wafer holders 12A and 12B are configured not to move in the X-axis direction.

A push-up unit 15 is provided below wafer holders 12A and 12B. As shown in FIG. 3, push-up unit 15 is configured to be movable between supply module 102A and supply module 102B, and pushes semiconductor die 14A upward from diced semiconductor wafer 13A, and also pushes semiconductor die 14B upward from diced semiconductor wafer 13B.

In addition, a first push-up unit that pushes up semiconductor die 14A from semiconductor wafer 13A and a second push-up unit that pushes up semiconductor die 14B from semiconductor wafer 13B may be provided separately. In this case, the first push-up unit may be provided in supply module 102A and configured so that it cannot move to supply module 102B, and the second push-up unit may be provided in supply module 102B and configured so that it cannot move to supply module 102A.

A pickup camera 16 is provided in each of supply modules 102A and 102B. As shown in FIG. 3, pickup camera 16 is configured to be movable between supply module 102A and supply module 102B, and captures an image of semiconductor die 14A in semiconductor wafer 13A for position recognition, and also captures an image of semiconductor die 14B in semiconductor wafer 13B for position recognition.

In addition, a first pickup camera that captures images of semiconductor die 14A in semiconductor wafer 13A and a second pickup that captures images of semiconductor die 14B in semiconductor wafer 13B may be provided separately. In this case, the first pickup camera may be provided in supply module 102A and configured so that it cannot move to supply module 102B, and the second pickup camera may be provided in supply module 102B and configured so that it cannot move to supply module 102A.

The transport mechanism 120 is configured to extend in the X-axis direction across the mounting module 101 and the supply modules 102A and 102B. The transport mechanism 120 is equipped with two transport units 20A and 20B. The transport unit 20A is configured to be able to transport the semiconductor dies 14A and 14B from each of the supply modules 102A and 102B to the mounting module 101. The transport unit 20B is configured to be able to transport the semiconductor dies 14A and 14B from each of the supply modules 102A and 102B to the mounting module 101. For example, the transport unit 20A picks up the semiconductor die 14A from the wafer holder 12A, inverts the picked-up semiconductor die 14A, and transfers the inverted semiconductor die 14A to the mounting head 46A. The transfer unit 20B picks up the semiconductor die 14B from the wafer holder 12B, inverts the picked-up semiconductor die 14B, and transfers the inverted semiconductor die 14B to the mounting head 46B.

As shown in FIG. 2, the transport unit 20A includes, for example, a guide rail 21A, a slider 22A, a carriage 23A, a rotation shaft 24A, and a transport head 25A.

The guide rail 21A is fixed to a recess 11A formed on the top surface of the frame 11. The recess 11A has the shape of a long groove extending in the X direction. The guide rail 21A is configured by connecting rails provided on the mounting module 101 and the supply modules 102A and 102B, and extends in the X-axis direction across the mounting module 101 and the supply modules 102A and 102B. A slider 22A is attached to the guide rail 21A. The slider 22A is configured to be movable in the X-axis direction by a drive motor (not shown). A carriage 23A is attached to the slider 22A. The carriage 23A is configured to be movable in the X-axis direction by the slider 22A moving along the guide rail 21A. A rotation shaft 24A is attached to the carriage 23A. The mounting arm of the rotation shaft 24A extends in a direction that intersects obliquely with the center line of the rotation shaft 24A. A transport head 25A is attached to the tip of the mounting arm of the rotating shaft 24A. A stepping motor (not shown) rotates the rotating shaft 24A, causing the transport head 25A to rotate in reverse.

The transport head 25A transports, for example, a semiconductor die 14A from the supply module 102A to the mounting module 101. The transport head 25A includes a base 27A and a pickup nozzle 28A. The base 27A is plate-shaped and is fixed to the tip of the mounting arm of the rotation shaft 24A. The pickup nozzle 28A is fixed to the base 27A. The pickup nozzle 28A includes, for example, a casing 29A, a suction head 30A, and an electromagnetic coil 31A. The casing 29A is annular and houses the electromagnetic coil 31A in its annular portion. A through-hole extending in the longitudinal direction of the casing 29A is formed in the center of the casing 29A. The suction head 30A is configured to be able to suction a semiconductor die 14A onto its tip surface. The suction head 30A is housed in the through-hole of the casing 29A. By energizing the electromagnetic coil 31A, the suction head 30A moves through the through-hole in the casing 29A, and the amount of extension from the end face of the casing 29A can be adjusted.

Like transport unit 20A, transport unit 20B is equipped with guide rail 21B, slider 22B, carriage 23B, rotation shaft 24B, and transport head 25B. Guide rail 21B is arranged parallel to guide rail 21A. Guide rail 21B is fixed to the portion of recess 11A facing guide rail 21A. Transport head 25A and transport head 25B are configured to be able to move independently of each other and can pass each other.

Transport head 25B, for example, transports semiconductor die 14B from supply module 102B to mounting module 101. Like transport head 25A, transport head 25B includes a base 27B and a pickup nozzle 28B, which includes a casing 29B, a suction head 30B, and an electromagnetic coil 31B.

Transport head 25A is configured to be able to adsorb and transport both semiconductor dies 14A and 14B, and transport head 25B is similarly configured to be able to adsorb and transport both semiconductor dies 14A and 14B. Therefore, the combinations of transport heads 25A and 25B with semiconductor dies 14A and 14B are not limited to those described above. Transport head 25A may transport semiconductor die 14B, or may transport both semiconductor dies 14A and 14B. Similarly, transport head 25B may transport semiconductor die 14A, or may transport both semiconductor dies 14A and 14B. Furthermore, the mounting device may be equipped with a single transport head, and this single transport head may transport both semiconductor dies 14A and 14B.

Next, we will explain the operations from supplying the semiconductor die 14A to mounting it.

First, the pickup camera 16 captures an image of the semiconductor die 14A on the semiconductor wafer 13A to confirm the position of the semiconductor die 14A. The semiconductor die 14A is pushed up from the semiconductor wafer 13A held by the wafer holder 12A by the push-up unit 15. The pushed-up semiconductor die 14A is then adsorbed onto the transport head 25A, and the semiconductor die 14A is transferred from the wafer holder 12A of the supply module 102A to the transport unit 20A of the transport mechanism 120. The transport unit 20A transports the adsorbed semiconductor die 14A from the supply module 102A to the mounting module 101.

The semiconductor die 14A transported to the mounting module 101 is inverted together with the transport head 25A by the rotating shaft 24A. The mounting head 46A moves above the inverted semiconductor die 14A, and the motor 50 of the mounting nozzle 47A rotates the ball screw 52, causing the base 51, pulse heater 53, and mounting tool 54 to descend. The mounting tool 54, which has descended to the position of the semiconductor die 14A, picks up the inverted semiconductor die 14A. This transfers the semiconductor die 14A from the transport head 25A to the mounting head 46A. The mounting tool 54, which has picked up the semiconductor die 14A, is raised by the ball screw 52, which is rotated by the driving force of the motor 50, and is transported by the mounting head 46A along the gantry frame 45A to above the mounting stage 40. At this point, the motor 50 of the mounting nozzle 47A rotates the ball screw 52, causing the base 51, pulse heater 53, and mounting tool 54 to descend, pressing the semiconductor die 14A against the circuit board 41. At this time, the semiconductor die 14A is heated by the pulse heater 53 and is mounted on the circuit board 41. The mounting tool 54 releases the semiconductor die 14A from suction, and after releasing the semiconductor die 14A mounted on the circuit board 41, the mounting tool 54 rises due to the ball screw 52 rotating with the driving force of the motor 50, and moves above the semiconductor die 14A that has been sucked onto the inverted transfer head 25A to receive the next semiconductor die 14A.

While the transport head 25A is transporting the semiconductor die 14A, the pickup camera 16 and push-up unit 15 move from the supply module 102A to the supply module 102B. Then, in the supply module 102B, as in the supply module 102A, the semiconductor die 14B is transferred from the wafer holder 12B of the supply module 102B to the transport unit 20B of the transport mechanism 120. The transport unit 20B then transports the adsorbed semiconductor die 14B from the supply module 102B to the mounting module 101. The transported semiconductor die 14B is then transferred from the transport head 25B to the mounting head 46B, which then mounts the semiconductor die 14B on the circuit board 41. In this way, the semiconductor die 14A and the semiconductor die 14B are mounted on the circuit board 41 alternately or simultaneously.

As described above, in the mounting device 1 of this embodiment, the mounting module 101, supply module 102A, and supply module 102B are arranged in this order in the X-axis direction, and the transport mechanism 120 has multiple transport units 20A, 20B configured to be able to transport multiple semiconductor dies 14A, 14B from each of the multiple supply modules 102A, 102B, and is configured to extend in the X-axis direction across the mounting module 101 and the multiple supply modules 102A, 102B.

This makes it less likely for the semiconductor dies to become misaligned with the circuit board than in an apparatus that mounts multiple semiconductor dies supplied from multiple semiconductor wafers onto a single circuit board by preparing a mounting device for each semiconductor wafer and moving a single circuit board between the mounting devices. This reduces the occurrence of mounting defects due to misalignment. Furthermore, compared to an apparatus that mounts multiple semiconductor dies supplied from multiple semiconductor wafers onto a single circuit board by replacing the semiconductor wafer during mounting using a single mounting device, this shortens the mounting time, thereby reducing the drying of flux in the solder that joins the circuit board and the semiconductor dies. This reduces the occurrence of mounting defects due to drying of flux. Therefore, it is possible to provide a mounting apparatus 1 that can efficiently mount multiple semiconductor dies 14A, 14B onto a single circuit board 41.

Furthermore, in this embodiment, the mounting apparatus 1 has a supply module 102A that supplies semiconductor die 14A and a supply module 102B that supplies semiconductor die 14B, and the semiconductor die 14A and the semiconductor die 14B are different types.

This allows two types of semiconductor dies 14A and 14B to be efficiently mounted on a single circuit board 41.

In addition, in this embodiment, wafer holder 12A of supply module 102A and wafer holder 12B of supply module 102B are configured to be movable in the Y-axis direction. The Y-axis direction, which is the direction of movement of each of the multiple wafer holders 12A, 12B, intersects, for example, is perpendicular to, the X-axis direction, which is the direction of movement of each of the multiple transport units 20A, 20B.

As a result, even if each of the multiple wafer holders 12A, 12B does not move in the X-axis direction, the multiple transport units 20A, 20B can pick up semiconductor dies 14A from the entire area of the semiconductor wafer 13A and can pick up semiconductor dies 14B from the entire area of the semiconductor wafer 13B. Therefore, the mounting device 1 can be made smaller than when the wafer holders are configured to be movable in the X-axis direction as well.

In addition, in this embodiment, the mounting module 101 has multiple mounting heads 46A, 46B that receive semiconductor dies 14A, 14B from multiple transport units 20A, 20B and mount them on the circuit board 41. The multiple mounting heads 46A, 46B are configured to be able to move independently of each other.

This improves the mounting efficiency of multiple semiconductor dies 14A and 14B in the mounting module 101.

In this embodiment, the mounting apparatus 1 further includes a push-up unit 15. The push-up unit 15 is configured to be movable between the multiple supply modules 102A and 102B, and pushes up the semiconductor die 14A from the semiconductor wafer 13A and delivers it to the transport unit 20A, and pushes up the semiconductor die 14B from the semiconductor wafer 13B and delivers it to the transport unit 20B.

In this embodiment, one push-up unit 15 can be shared by the two supply modules 102A and 102B, which simplifies the configuration of the mounting device 1 and reduces the manufacturing and maintenance costs of the mounting device 1 compared to when each supply module has its own push-up unit.

In this embodiment, the mounting apparatus 1 further includes a pickup camera 16. The pickup camera 16 is configured to be movable between the multiple supply modules 102A and 102B, and recognizes the position of the semiconductor die 4A in the supply module 102A and the position of the semiconductor die 14B in the supply module 102B.

In this embodiment, one pickup camera 16 can be shared by two supply modules 102A and 102B, which simplifies the configuration of the mounting device 1 compared to when each supply module has its own pickup camera, thereby reducing the manufacturing and maintenance costs of the mounting device 1.

In this embodiment, the mounting device 1 is equipped with two supply modules 102A and 102B, but a mounting device according to one embodiment of the present invention may be equipped with three or more supply modules. When increasing the variety of semiconductor dies to be mounted onto the circuit board 41 from the mounting device 1, an additional supply module can be connected to the side of supply module 102B opposite supply module 102A, and the transport mechanism 120 can be extended to cover the additional supply module. This makes it easy to add more types of semiconductor dies to be mounted, and prevents the dimensions of the mounting device from increasing when the variety of semiconductor dies to be mounted is increased.

The following describes some or all of the embodiments of the present invention. Please note that the present invention is not limited to the following descriptions.

[Appendix 1]
a plurality of supply modules for supplying electronic components;
a mounting module that mounts the electronic component on a substrate;
a transport mechanism including at least one transport unit configured to be able to transport the electronic components from each of the plurality of supply modules to the mounting module, and configured to extend across the plurality of supply modules and the mounting module in a first direction in a plan view;
Mounting equipment.

[Appendix 2]
the mounting module transports the electronic component in a second direction intersecting the first direction;
The mounting device described in [Supplementary Note 1].

[Appendix 3]
the plurality of supply modules include a first supply module that supplies a first electronic component and a second supply module that supplies a second electronic component of a different type from the first electronic component;
The mounting device according to [Supplementary Note 1] or [Supplementary Note 2].

[Appendix 4]
each of the plurality of supply modules supplies a semiconductor die as the electronic component from a semiconductor wafer;
each of the plurality of supply modules has a wafer holder for holding the semiconductor wafer;
the wafer holder is configured to be movable in a second direction intersecting the first direction in a plan view.
A mounting device according to any one of [Supplementary Note 1] to [Supplementary Note 3].

[Appendix 5]
the at least one transport unit includes a plurality of transport heads;
The plurality of transport heads are configured to be movable independently of each other.
A mounting device according to any one of [Supplementary Note 1] to [Supplementary Note 4].

[Appendix 6]
the mounting module has a plurality of mounting heads that receive the electronic components from the at least one transport head and mount them on the substrate;
The plurality of mounting heads are configured to be movable independently of one another.
A mounting device according to any one of [Supplementary Note 1] to [Supplementary Note 5].

[Appendix 7]
each of the plurality of supply modules supplies a semiconductor die as the electronic component from a semiconductor wafer;
a push-up unit that pushes up the semiconductor die from the semiconductor wafer and transfers the semiconductor die to the at least one transfer unit,
The push-up unit is configured to be movable between the plurality of supply modules.
A mounting device according to any one of [Supplementary Note 1] to [Supplementary Note 6].

[Appendix 8]
a pickup camera for detecting the position of the electronic component in the plurality of supply modules;
The pickup camera is configured to be movable between the plurality of supply modules.
A mounting device according to any one of [Supplementary Note 1] to [Supplementary Note 7].

As described above, one embodiment of the present invention provides a mounting device that can efficiently mount multiple electronic components.

The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the scope of the present invention. The elements of the embodiments, as well as their arrangement, materials, conditions, shape, size, etc., are not limited to those illustrated and can be modified as appropriate. Furthermore, configurations shown in different embodiments can be partially substituted or combined.

REFERENCE SIGNS LIST 1... Mounting device 101... Mounting module 11... Stand 40... Mounting stage 41... Circuit board 42... Transport rail 43... Guide rail 44A, 44B... Slider 45A, 45B... Gantry frame 46A, 46B... Mounting head 47A, 47B... Mounting nozzle 50... Motor 51... Base part 52... Ball screw 53... Pulse heater 54... Mounting tool 102A, 102B... Supply module 12A, 12B... Wafer holder 13A, 13B... Semiconductor wafer 14A, 14B... Semiconductor die 15... Push-up unit 16... Pickup camera 120... Transport mechanism 20A, 20B... Transport unit 21A, 21B... Guide rail 22A, 22B... Slider 23A, 23B... Carriage 24A, 24B... Rotation axis 25A, 25B... Transfer heads 27A, 27B... Bases 28A, 28B... Pick-up nozzles 29A, 29B... Casings 30A, 30B... Suction heads 31A, 31B... Electromagnetic coils

Claims (8)

a plurality of supply modules for supplying electronic components;
a mounting module that mounts the electronic component on a substrate;
a transport mechanism including at least one transport unit configured to be able to transport the electronic components from each of the plurality of supply modules to the mounting module, and configured to extend across the plurality of supply modules and the mounting module in a first direction in a plan view;
Mounting equipment. the mounting module transports the electronic component in a second direction intersecting the first direction;
The mounting device according to claim 1 . the plurality of supply modules include a first supply module that supplies a first electronic component and a second supply module that supplies a second electronic component of a different type from the first electronic component;
The mounting device according to claim 1 . each of the plurality of supply modules supplies a semiconductor die as the electronic component from a semiconductor wafer;
each of the plurality of supply modules has a wafer holder for holding the semiconductor wafer;
The wafer holder is configured to be movable in a first direction.
The mounting device according to claim 1 . the at least one transport unit includes a plurality of transport heads;
The plurality of transport heads are configured to be movable independently of each other.
The mounting device according to claim 1 . the mounting module has a plurality of mounting heads that receive the electronic components from the at least one transport unit and mount them on the board;
The plurality of mounting heads are configured to be movable independently of one another.
The mounting device according to claim 1 . each of the plurality of supply modules supplies a semiconductor die as the electronic component from a semiconductor wafer;
a push-up unit that pushes up the semiconductor die from the semiconductor wafer and transfers the semiconductor die to the at least one transfer unit,
The push-up unit is configured to be movable between the plurality of supply modules.
The mounting device according to claim 1 . a pickup camera for detecting the position of the electronic component in the plurality of supply modules;
The pickup camera is configured to be movable between the plurality of supply modules.
The mounting device according to claim 1 .