JP2024090925A - SUBSTRATE PROCESSING APPARATUS AND METHOD FOR PRODUCING ARTICLE - Google Patents

Abstract

To reduce unevenness in the drying rate of a solvent contained in a solution arranged on a substrate, and improve the drying rate.SOLUTION: A substrate treatment device comprises: an airtight container; a decompressing mechanism for decompressing the inside of the airtight container; a substrate holding part arranged inside the airtight container, and capable of holding a substrate; and a rotating member arranged at a position opposed to the substrate held by the substrate holding part inside the airtight container, and capable of rotating with respect to the substrate holding part.SELECTED DRAWING: Figure 1

Description

This disclosure relates to a drying technique for a solution film disposed on a substrate.

When manufacturing articles such as panels (organic EL panels) having OLEDs (organic light emitting diodes), which are organic EL (electro luminescence) elements, a method is known in which a solution film is applied to a desired location on a substrate using an inkjet device. A solution film is a film composed of a solution containing a solute and a solvent. A film (layer) is formed on the substrate by drying the solution film applied on the substrate. A reduced pressure drying device, which is a substrate processing device, is used to dry the solution film.

Patent Document 1 discloses a reduced pressure drying device that includes a substrate holder, an enclosure wall that is disposed to the side of the substrate held by the substrate holder and surrounds the side of the substrate, and a baffle plate that is disposed above the substrate holder and moves in the vertical direction.

JP 2022-38284 A

When adjusting the unevenness of the drying speed by using the enclosure wall and the straightening plate disclosed in Patent Document 1, the solvent evaporated by drying remains in the space surrounded by the enclosure wall and the straightening plate. The solvent remaining as vapor in the space surrounded by the enclosure wall and the straightening plate may increase the solvent partial pressure around the substrate, causing changes over time such as a decrease in the drying speed of the solution film. In addition, the solvent remaining as vapor in the space surrounded by the enclosure wall and the straightening plate may be adsorbed onto the enclosure wall or the straightening plate. The solvent adsorbed onto the enclosure wall or the straightening plate may evaporate again into the space surrounded by the enclosure wall and the straightening plate, causing changes over time such as a decrease in the drying speed of the solution film by increasing the solvent partial pressure around the substrate.

The present disclosure aims to reduce unevenness in the drying speed of a solvent contained in a solution placed on a substrate and improve the drying speed.

A first aspect of the present disclosure is a substrate processing apparatus comprising: an airtight container; a decompression mechanism for decompressing the inside of the airtight container; a substrate holding part disposed inside the airtight container and capable of holding a substrate; and a rotating member disposed inside the airtight container at a position facing the substrate held by the substrate holding part and capable of rotating relative to the substrate holding part.

A second aspect of the present disclosure is a method for manufacturing an article, which comprises: placing a substrate having a solution applied onto a main surface thereof on a substrate holder disposed inside an airtight container; reducing the pressure inside the airtight container to a first pressure higher than the vapor pressure of a solvent contained in the solution to evaporate the solvent; and rotating a rotating member disposed opposite the substrate while reducing the pressure inside the airtight container from the first pressure to a second pressure lower than the vapor pressure of the solvent, or while the pressure inside the airtight container is reduced to the second pressure.

According to the present disclosure, the unevenness of the drying speed of the solvent contained in the solution placed on the substrate is reduced and the drying speed is improved.

1 is a schematic cross-sectional view showing a configuration of a reduced-pressure drying apparatus as an example of a substrate processing apparatus according to a first embodiment. 1A is a top view of a part of the configuration of the reduced pressure drying apparatus according to the first embodiment, and FIG. 1B is a side view of a rotating member according to the first embodiment. 1A is a top view of a part of the configuration of a reduced pressure drying apparatus according to a modified example of the first embodiment, and FIG. 1B is a side view of a rotating member according to the modified example of the first embodiment. 4 is a graph showing the drying speed versus the amount of solvent according to the first embodiment. 2 is a flowchart of a method for manufacturing an article according to the first embodiment. 6 is a graph showing an example of pressure control in the drying process according to the first embodiment. 4A to 4C are explanatory views of a drying process according to the first embodiment. 8A is an explanatory diagram of a cover unit of a reduced pressure drying apparatus according to a second embodiment, FIG. 8B is a cross-sectional view of a rotating member according to the second embodiment, and FIG. 8C is a plan view of the rotating member according to the second embodiment as viewed in the direction of an arrow VIIIC. 13A to 13D are explanatory views of a drying process according to a second embodiment. 13A to 13C are explanatory views of a drying process according to a third embodiment. 13A to 13C are explanatory views of a drying process according to a fourth embodiment. FIG. 13 is an explanatory diagram of a cover unit of the reduced pressure drying apparatus according to the fifth embodiment. 13A and 13B are explanatory views of a cover unit of a reduced pressure drying apparatus according to a sixth embodiment. 13A and 13B are explanatory views of a portion of the configuration of a reduced-pressure drying apparatus according to a seventh embodiment. 13A is an explanatory diagram of a cover unit of a reduced pressure drying apparatus according to an eighth embodiment, and FIG. 13B is an explanatory diagram of a cover unit according to a modified example of the eighth embodiment.

Below, exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same components are given the same reference numbers, and duplicated descriptions will be omitted. In the following embodiments, directions are indicated by the XYZ coordinate system, which is an orthogonal coordinate system. In the XYZ coordinate system, the XY plane is the horizontal plane, and the negative direction of the Z axis is the vertical direction (direction of gravity).

First Embodiment
1 is a schematic cross-sectional view showing the configuration of a reduced-pressure drying apparatus 100, which is an example of a substrate processing apparatus according to the first embodiment. The reduced-pressure drying apparatus 100 is used in a part of a process for manufacturing an organic EL panel having an OLED, which is an organic EL element. That is, the reduced-pressure drying apparatus 100 forms an organic film on the substrate S by performing a drying process for drying a solution film F applied to the substrate S.

The solution film F is composed of, for example, a solution containing a solute and a solvent for forming an organic film. The solvent contained in the solution film F preferably has a property that facilitates evaporation in a reduced pressure environment lower than atmospheric pressure. The evaporation of the solvent is preferably facilitated, for example, at a temperature higher than room temperature (25°C).

The solvent is preferably an organic solvent. The solvent contains at least one type of organic solvent. Examples of organic solvents include N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, diethylene glycol monomethyl ether, cyclohexanone, N,N-dimethylisobutyramide, N-methylformamide, N-methylacetamide, N-diethylformamide, cyclohexanol, ethylene glycol, ethylene glycol diglycidyl ether, 1,3-octylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, 1,3-butanediol, and 1,4-butanediol. , propylene glycol, hexylene glycol, propylene glycol monomethyl ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diacetone alcohol, γ-butyrolactone, ethyl lactate, N-hexyl acetate, ethyl cellosolve acetate, etc.

The organic film is an organic layer, for example, any one of the hole injection layer, hole transport layer, light emitting layer, electron transport layer, and electron injection layer of an OLED. The manufacture of an organic EL element includes the steps of forming each of the organic films, the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, and the electron injection layer, on a substrate S. The solution film F is applied to the required locations on the substrate S by a coating device before the substrate S is transported into the reduced pressure drying device 100.

The reduced pressure drying apparatus 100 includes an airtight container 10, a reduced pressure mechanism 30 that reduces the pressure inside the airtight container 10, and a substrate holding unit 20 that is disposed inside the airtight container 10 and is capable of holding a substrate S. The reduced pressure drying apparatus 100 also includes a cover unit 40 that is disposed inside the airtight container 10 at a position that surrounds the substrate S held by the substrate holding unit 20. The cover unit 40 is disposed at a position that does not contact the substrate S held by the substrate holding unit 20.

The pressure of the external environment of the airtight container 10 is atmospheric pressure. The airtight container 10 is a member that defines an internal space SP0. The internal space SP0 includes a space SP2 surrounded by the cover unit 40, and a space SP1 other than the space SP2. In the first embodiment, the space SP2 is a space surrounded by the substrate holding part 20 and the cover unit 40. The space SP2 inside the cover unit 40 and the space SP1 outside are connected to each other, but by surrounding the substrate S with the cover unit 40, the pressure distribution in the space SP2 is adjusted to be as uniform as possible.

The reduced pressure drying apparatus 100 also includes a gate valve 12 provided in the airtight container 10. The substrate S coated with the solution film F to be dried is transferred from the external space of the airtight container 10 to the internal space SP0 through the gate valve 12. After the drying process, the substrate S is transferred from the internal space SP0 to the external space through the gate valve 12.

The pressure reduction mechanism 30 includes at least one pump, for example, multiple pumps. The multiple pumps include, for example, at least one of a dry pump and a diaphragm vacuum pump. The multiple pumps may also include, for example, at least one of a turbomolecular pump, a cryopump, a sorption pump, an oil diffusion pump, a mechanical booster pump, an ejector pump, and an oil rotary vacuum pump.

The reduced pressure drying apparatus 100 further includes a temperature control unit 70. The temperature control unit 70 controls the temperature of the substrate S or the solution film F on the substrate S by controlling the temperature of the substrate holding unit 20. The temperature control unit 70 preferably includes a heater that heats the substrate holding unit 20.

The temperature control unit 70 may also include a cooler that cools the substrate holding unit 20. The temperature control unit 70 controls the temperature of the substrate holding unit 20 by performing at least one of heating and cooling on the substrate holding unit 20.

The temperature control unit 70 controls the multiple regions of the substrate holding unit 20 to the same temperature or different temperatures so that the substrate S has a uniform temperature distribution. Preferably, the temperature control unit 70 controls the temperature difference between the multiple regions of the substrate S held by the substrate holding unit 20 to within 10 degrees. More preferably, the temperature control unit 70 controls the temperature difference between the multiple regions of the substrate S held by the substrate holding unit 20 to within 5 degrees. The temperature control unit 70 controls the temperature of the substrate holding unit 20 so that the temperature of the substrate S becomes a predetermined temperature within the range of 0 degrees to 100 degrees. By heating the substrate holding unit 20, the drying speed of the solution film F applied on the substrate S can be improved.

The cover unit 40 is disposed on the substrate holder 20. The main material of the cover unit 40 is preferably a metal, such as stainless steel. The stainless steel is preferably an austenitic stainless steel containing, for example, 0.045% or less phosphorus and 0.030% or less sulfur (i.e., stainless steel designated as SUS304 in the Japanese Industrial Standards: JIS).

Figure 2(a) is a top view of a portion of the configuration of the reduced pressure drying apparatus 100 according to the first embodiment. Figure 2(a) shows a top view of the cover unit 40 and the members around the cover unit 40 when the cover unit 40 is viewed in the Z direction. The cover unit 40 includes an enclosure wall 41, which is an example of a wall member, and the substrate holder 20, i.e., a plurality of rotating members that can rotate relative to the enclosure wall 41, for example, five rotating members 42-1, 42-2, 42-3, 42-4, and 42-5. The plurality of rotating members 42-1 to 42-5 are supported directly by the enclosure wall 41 or indirectly via another member. Figure 2(b) is a side view of the rotating members 42-1 to 42-5 according to the first embodiment when the rotating members 42-1 to 42-5 are viewed in the X direction.

As shown in FIG. 1, the reduced pressure drying apparatus 100 includes a gas introduction section 51 that introduces an inert gas into the space SP1, and a gas introduction section 52 that introduces an inert gas into the space SP2. The gas introduction sections 51 and 52 are preferably flexible tubes, for example. A valve 53 is disposed in the gas introduction section 51. A valve 54 is disposed in the gas introduction section 52.

The gas inlet 51 is provided so as to penetrate the airtight container 10, and is configured so as to be able to supply an inert gas to the space SP1. The gas inlet 52 is provided so as to penetrate the airtight container 10 and the surrounding wall 41 of the cover unit 40, and is configured so as to be able to supply an inert gas to the space SP2.

The inert gas is, for example, nitrogen. In the first embodiment, the gas supplied to the inside of the airtight container 10 from the gas inlet parts 51 and 52 is preferably an inert gas, but any gas other than an inert gas may be used as long as it has a composition different from that of the solvent of the solution film F, for example, clean dry air.

The pressure in the internal space SP0 of the airtight container 10, particularly the pressure in space SP1, is adjusted by supplying gas to space SP1 via the gas introduction part 51. The pressure in the internal space SP0 of the airtight container 10, particularly the pressure in space SP2, is adjusted by supplying gas to space SP2 via the gas introduction part 52.

The reduced pressure drying apparatus 100 further includes a gas analyzer 55 that detects a specific gas in the space SP2. The gas in the space SP2 is introduced into the gas analyzer 55 via a connecting member 56. The gas analyzer 55 is, for example, a residual gas analyzer (RGA) such as a mass spectrometer. The specific gas detected by the gas analyzer 55 is the solvent vapor (gas) that evaporates from the solution film F on the substrate S. The connecting member 56 may be a flexible tube, for example, a glass fiber tube, or a bellows.

The reduced pressure drying apparatus 100 also includes a pressure gauge 57 that detects the pressure in the internal space SP0 of the airtight container 10. The pressure gauge 57 may be disposed in the space SP1, but it is preferable to detect the pressure in the space SP2, and in the first embodiment, it is disposed in the space SP2.

The substrate holding unit 20 has a planar region 21 on which the substrate S is placed. The region 21 is, for example, a horizontal plane, i.e., a plane parallel to the XY plane. That is, the region 21 can also be said to be a substrate placement surface. The surrounding wall 41 is a wall member extending in the Z direction. The surrounding wall 41 is disposed in a position facing the side surface SS of the substrate S disposed on the region 21. The surrounding wall 41 is formed in a shape that surrounds the side surface SS of the substrate S disposed on the region 21. In this way, the surrounding wall 41 is disposed to the side of the region 21. The surrounding wall 41 has an opening (not shown) for carrying in and carrying out the substrate S. The opening (not shown) is opened and closed by a shutter (not shown). The surrounding wall 41 is erected on the substrate holding unit 20, but is not limited to this and may be erected on another member.

Of the multiple rotating members 42, two or more rotating members are arranged at positions facing the substrate S arranged on the region 21 in a direction perpendicular to the region 21, i.e., in the Z direction. In the first embodiment, the two or more rotating members are rotating members 42-1 to 42-5. That is, the rotating members 42-1 to 42-5 are arranged at positions facing the substrate S arranged on the region 21 in the Z direction. Specifically, the rotating members 42-1 to 42-5 are arranged at positions facing the main surface (substrate main surface) MS of the substrate S arranged on the region 21, i.e., the solution film F applied on the main surface MS, in the Z direction. In this way, the rotating members 42-1 to 42-5 are arranged above the region 21. The rotating members 42-1 to 42-5 are arranged at intervals from each other so as not to contact each other.

Each of the rotating members 42-1 to 42-5 is referred to as a rotating member 42. The rotating member 42 is rotatable around the rotation axis L, and includes a flat plate member 421 extending in the longitudinal direction (e.g., the X direction) along the rotation axis L, and a pair of rotating shafts 422 disposed at both ends of the plate member 421 in the longitudinal direction. It is preferable that the thickness of the plate member 421 is 10 mm or less.

A driving source 44 is connected to one of the pair of rotating shafts 422. The driving source 44 includes, for example, a motor, and can drive the rotating member 42 to rotate around the rotation axis L. The multiple rotating members 42 are each driven to rotate individually by the multiple driving sources 44. In the first embodiment, a driving mechanism 45 is configured with the multiple driving sources 44. The driving mechanism 45 is configured to rotate the rotating members 42-1 to 42-5 individually, but is not limited to this, and the driving mechanism 45 may be configured to rotate the rotating members 42-1 to 42-5 collectively.

The plate member 421 has two main surfaces 4211 and 4212. The main surface 4212 is the main surface opposite to the main surface 4211. By rotating the rotating member 42, one of the main surfaces 4211 and 4212 can be made to face the solution film F on the main surface MS of the substrate S. In the example of FIG. 1, the main surface 4211 is made to face the solution film F on the main surface MS of the substrate S.

The rotation axis L of each of the rotating members 42-1 to 42-5 extends parallel to the X direction along the region 21. The rotating members 42-1 to 42-5 are arranged side by side at intervals from each other in the Y direction that intersects with the X direction along the region 21. In each of the rotating members 42-1 to 42-5, the X direction is an example of the first direction, and the Y direction is an example of the second direction. In the first embodiment, the Y direction is perpendicular to the X direction.

Each of the rotating members 42-1 to 42-5 has a plurality of openings 43. Each opening 43 is a through hole. The shape of the openings 43 may be round or linear, such as a slit. The arrangement and dimensions of the openings 43 are determined so that the solution film F applied to the substrate S is dried uniformly. For example, by making the area of the openings 43 facing the part of the solution film F on the substrate S where the drying speed is high smaller than the area of the other openings 43, the drying speed of the solution film F can be adjusted to eliminate unevenness in the drying speed.

The opening area per unit area in the cover unit 40 is called the opening ratio. The area of each opening 43 in the cover unit 40 is adjusted so that the opening ratio near the periphery of the substrate S is smaller than the opening ratio near the center of the substrate S. For example, the opening ratio of the portion of the cover unit 40 facing the center of the substrate S may be set to 40-70%, and the opening ratio of the portion facing the periphery of the substrate S may be set to 20-50%. Note that the cover unit 40 does not necessarily have to have an opening 43, as long as it has a configuration that allows the space SP2 and the space SP1 to communicate with each other.

The reduced pressure drying apparatus 100 also includes a control device 90 that controls each part of the entire apparatus. The control device 90 is, for example, a computer. The control device 90 includes a CPU, which is an example of a processor, a RAM, which is a temporary storage device, a ROM and SSD, which are non-temporary storage devices (recording media), and an I/O, which is an interface. The non-temporary storage device stores a control program that causes the CPU of the control device 90 to control each part of the entire apparatus in the manufacturing process described below. The control device 90 controls the pressure inside the airtight container 10 by controlling the decompression mechanism 30, and controls the rotation of the rotating members 42-1 to 42-5 by controlling the drive mechanism 45, i.e., the drive source 44. The control device 90 also controls the supply and stop of gas and the flow rate of gas by controlling the valves 53 and 54.

Note that, although the above description has been given with the example of the case where the directions of the rotation axes L of the rotating members 42-1 to 42-5 are all aligned in the X direction, the present invention is not limited to this. FIG. 3(a) is a top view of a portion of the configuration of a reduced pressure drying device according to a modified example of the first embodiment. FIG. 3(a) shows a top view of the cover unit 40A and the members surrounding the cover unit 40A according to the modified example of the first embodiment, as viewed in the Z direction. FIG. 3(b) is a side view of the rotating members 42-1 to 42-5 according to the modified example of the first embodiment, as viewed in the X direction.

The cover unit 40A has seven rotating members 42-1 to 42-7 as the multiple rotating members. The multiple rotating members 42-1 to 42-7 are supported directly on the surrounding wall 41 or indirectly via another member. The direction of the rotation axis L of each of the rotating members 42-1 to 42-5 is the X direction. The direction of the rotation axis L of each of the rotating members 42-6 and 42-7 is the Y direction. In other words, the direction of the rotation axis L of each of the rotating members 42-6 and 42-7 is different from the direction of the rotation axis L of each of the rotating members 42-1 to 42-5. The number of rotating members and the direction of the rotation axis of the rotating members may be determined according to the tendency of the drying speed of the solution film F.

Figure 4 is a graph showing the evaporation rate of the solvent from the solution film F applied to the substrate S, i.e., the drying rate of the solvent, relative to the amount of solvent adsorbed on the inner surface of the cover unit 40 on the space SP2 side in the first embodiment.

As shown in FIG. 4, the greater the amount of solvent adsorbed on the inner surface of the cover unit 40, the higher the solvent concentration, i.e., partial pressure, in the space SP2, and the slower the drying speed of the solution film F. On the other hand, the smaller the amount of solvent adsorbed on the inner surface of the cover unit 40, the lower the solvent concentration, i.e., partial pressure, in the space SP2, and the faster the drying speed of the solution film F. Furthermore, if there is unevenness in the drying speed of the solution film F, there is a risk of unevenness in the thickness of the film (layer) that is formed. In other words, to reduce unevenness in the thickness of the layer that is formed, it is important to make the drying speed of the solution film F on the substrate S uniform, and to increase the drying speed of the solution film F, it is important to reduce the amount of solvent adsorbed on the inner surface of the cover unit 40.

Below, some of the steps, including a drying step (drying process), out of the multiple steps in the method of manufacturing an organic EL panel, which is an example of an article, will be described. A solution film F is applied to necessary locations on the main surface MS of the substrate S by a coating device such as an inkjet device. The substrate S on which the solution film F has been applied is then carried into the space SP2 inside the cover unit 40 by a transport device (not shown). Then, under the control of the control device 90, a drying process is performed to dry (evaporate) the solvent in the solution film F on the substrate S.

Figure 5 is a flowchart of the method for manufacturing an article according to the first embodiment. In step S1, when the control device 90 is instructed to start processing the substrate S, the control device 90 controls the drive source 44 so that the rotating member 42 rotates in a predetermined position relative to the surrounding wall 41. That is, the control device 90 controls the rotation of the rotating member 42.

When the rotating member 42 is in a predetermined position relative to the surrounding wall 41, the process of step S1 is omitted. The predetermined position is set according to the type of solution film F and the drying conditions. For example, the predetermined position is a position in which the main surface 4211 or 4212 of the rotating member 42 can face the main surface MS of the substrate S, that is, a position in which the main surfaces 4211, 4212 of the rotating member 42 are parallel to a horizontal plane.

Next, in step S2, the control device 90 controls a transport device (not shown) to transport the substrate S coated with the solution film F into the substrate holding unit 20 arranged inside the airtight container 10. As a result, the substrate S is placed on the region 21 of the substrate holding unit 20.

The rotation of the rotating member 42 in step S1 is performed when there is no substrate S on the substrate holding unit 20, but it may be performed when there is a substrate S on the substrate holding unit 20. For example, by applying a multi-stage liquid O-ring using a magnetic fluid, dust generation due to the rotation of the rotating member 42 can be reduced, and a clean environment can be maintained inside the airtight container 10.

Next, in step S3, the control device 90 executes a drying process. The drying process in step S3 will be described in detail below. FIG. 6 is a graph showing an example of pressure control in the drying process according to the first embodiment. The horizontal axis in FIG. 6 is time, and the vertical axis is the pressure in the internal space SP0, i.e., the pressure in the space SP2. The control device 90 controls the pressure reduction mechanism 30 so that the pressure value detected by the pressure gauge 57 approaches the pressure command value. FIGS. 7(a) to 7(c) are explanatory diagrams of the drying process according to the first embodiment. FIG. 7(a) shows a cross section of the cover unit 40 and the members arranged around the cover unit 40.

First, the control device 90 controls the decompression mechanism 30 so that the pressure in the internal space SP0 of the airtight container 10, i.e., the pressure indicated by the pressure gauge 57, drops from atmospheric pressure to the first pressure P1 (drying process D1). As a result, the inside of the airtight container 10 is decompressed to the first pressure P1. The drying process D1 is a process of decompressing from atmospheric pressure to the first pressure P1. The first pressure P1 is a pressure lower than atmospheric pressure and higher than the vapor pressure of the solvent. The first pressure P1 depends on the vapor pressure of the solvent, but is, for example, 10 Pa. Then, after the pressure indicated by the pressure gauge 57 reaches the first pressure P1, the control device 90 controls the decompression mechanism 30 so that the pressure in the internal space SP0, i.e., the pressure indicated by the pressure gauge 57, is maintained at the first pressure P1 for a first time (drying process D2). The drying processes D1 and D2 correspond to the first process.

In the drying process D2, the control device 90 controls the supply of inert gas from the gas introduction part 51 to the space SP1 while operating the pressure reduction mechanism 30 so that the pressure indicated by the pressure gauge 57 exceeds the vapor pressure of the solvent, i.e., becomes the first pressure P1. Note that inert gas may be supplied from the gas introduction part 51 to the space SP1 not only in the drying process D1, but also in any of the other drying processes D1, D3, and D4, for example, in the drying process D4. Note that in the drying processes D1 and D2, the introduction of inert gas from the gas introduction part 52 is stopped.

In order to uniformly adjust the pressure distribution around the substrate S, i.e., to uniformly adjust the evaporation rate of the solution film F on the substrate S, in the first embodiment, the substrate S is surrounded by a cover unit 40. When the solvent evaporates from the solution film F, the solvent vapor G temporarily stays in the space SP2 surrounded by the cover unit 40. Then, the solvent vapor G flows from the space SP2 to the space SP1 through the gaps between the rotating members 42-1 to 42-5, the gap between the rotating member 42-1 and the surrounding wall 41, and the opening 43. In the space SP2, a portion of the solvent vapor G is adsorbed by the surrounding wall 41 and the rotating members 42-1 to 42-5.

In the drying process D2, the main surface 4211 of the rotating member 42 of the cover unit 40 faces the main surface MS of the substrate S, and the pressure in the space SP2 is maintained at the first pressure P1, so that the solution film F is dried uniformly. That is, the solution film F can be dried so that the thickness of the solution film F is uniform. Therefore, the surface of the solution film F can be made flat. In addition, a plurality of openings 43 are formed in the rotating member 42 of the cover unit 40. In the drying process D2, the size and number of the openings 43 are adjusted so that the pressure distribution in the space SP2 is uniform while the pressure in the space SP2 is maintained at a predetermined pressure. Therefore, the pressure in the space SP2 is finely adjusted, and the solution film F can be dried uniformly more effectively. The shape of the solution film F is roughly determined by the drying process D2.

After the first time has elapsed, that is, after the first process, the control device 90 controls the decompression mechanism 30 so that the pressure of the internal space SP0 of the airtight container 10, that is, the pressure indicated by the pressure gauge 57, drops from the first pressure P1 to the second pressure P2 (drying process D3). As a result, the inside of the airtight container 10 is decompressed to the second pressure P2. The drying process D3 is a process of decompressing from the first pressure P1 to the second pressure P2. The second pressure P2 is a pressure lower than the first pressure P1 and lower than the vapor pressure of the solvent. The second pressure P2 depends on the vapor pressure of the solvent, but is, for example, 10 ^-3 Pa. Then, after the pressure indicated by the pressure gauge 57 reaches the second pressure P2, the control device 90 controls the decompression mechanism 30 so that the pressure of the internal space SP0, that is, the pressure indicated by the pressure gauge 57, is maintained at the second pressure P2 for a second time (drying process D4). The drying processes D3 and D4 correspond to the second process.

After the drying process D3, the solution film F on the substrate S is further dried while the pressure inside the airtight container 10 is lowered to the second pressure P2. In particular, in the drying process D4, the solution film F on the substrate S is further dried while the pressure in the internal space SP0 is maintained at the second pressure P2.

Here, in the drying steps D1 and D2, as shown in Figures 7(a) and 7(b), when the solvent evaporates from the solution film F on the main surface MS of the substrate S, part of the solvent vapor G condenses on the inner surface of the cover unit 40 facing the space SP2, as shown in Figure 7(b), and is adsorbed as liquid solvent Ls. As the amount of solvent Ls adsorbed on the inner surface of the cover unit 40 increases, the solvent partial pressure in the space SP2 increases as the solvent Ls adsorbed on the inner surface of the cover unit 40 evaporates.

Therefore, in the first embodiment, after the drying step D3, i.e., in the drying step D3 or D4, preferably in the drying step D3, the control device 90 controls the rotating member 42 so that the rotating member 42 rotates around the rotation axis L by a predetermined angle from the state in the drying steps D1 and D2. Specifically, the control device 90 controls the driving mechanism 45 so that the driving source 44 of the driving mechanism 45 rotates the rotating member 42 by a predetermined angle.

In the first embodiment, the predetermined angle is 180 degrees. That is, by rotating the rotating member 42 half a turn, the main surface 4211 on which the solvent Ls is adsorbed faces the space SP1 side, and the clean main surface 4212 faces the space SP2 side. Therefore, the amount of solvent Ls adsorbed on the inner surface of the cover unit 40 facing the space SP2 can be reduced by rotating the rotating member 42 180 degrees. As a result, the amount of solvent Ls adsorbed on the inner surface of the cover unit 40 facing the space SP2 side can be maintained at a low level, the solvent contained in the solution film F can be dried stably and quickly, and a film can be formed stably. That is, the drying time of the solution film F can be shortened.

In the first embodiment, in the drying step D3 or D4, preferably in the drying step D3, all of the rotating members 42-1 to 42-5 facing the substrate S in the Z direction are rotated by the same predetermined angle, i.e., 180 degrees. This allows the solvent contained in the solution film F to be dried more stably and quickly, and a film can be formed more stably. In other words, the drying time of the solution film F can be further shortened.

In addition, since the main surface 4211 on which the solvent Ls is adsorbed faces the space SP1, the solvent Ls adsorbed on the main surface 4211 is desorbed in the space SP1, and the main surface 4211 becomes a clean surface. Therefore, since the solvent on the main surface 4211 can be desorbed at least in the drying process D4, there is no need to provide a separate process for desorbing the solvent Ls on the main surface 4211 after the drying process D4, and the tact time can be shortened.

In addition, in drying steps D3 and D4, the control device 90 introduces an inert gas into the space SP2 via the gas introduction section 52. This causes the inert gas to be sprayed onto the inner surface of the enclosure wall 41, and the solvent adsorbed on the inner surface of the enclosure wall 41 can be desorbed. This also promotes the drying of the solution film F, and further increases the drying speed.

The inert gas introduced from the gas introduction section 52 in the drying steps D3 and D4 also has the effect of discharging the solvent remaining in the space SP2 into the space SP1. This can further increase the drying speed of the solvent in the solution film F. The timing for starting the introduction of the inert gas may be before the rotation of the rotating member 42, during the rotation of the rotating member 42, or after the rotation of the rotating member 42.

After the second time has elapsed, i.e., after the second process, the control device 90 controls the pressure in the internal space SP0 of the airtight container 10, i.e., the pressure indicated by the pressure gauge 57, to be atmospheric pressure. For example, the control device 90 can make the inside of the airtight container 10 atmospheric pressure by stopping the operation of the pressure reducing mechanism 30 and introducing an inert gas into the inside of the airtight container 10.

As described above, the drying process includes multiple drying steps D1 to D4, and the control device 90 controls the pressure reduction mechanism 30 to execute the multiple drying steps D1 to D4. Note that the number of drying steps is not limited to four.

As described above, the solution film F is dried through multiple drying steps D1 to D4, each with different pressure conditions. This allows the thickness of the film formed by drying the solution film F to be uniform, and also increases the drying speed.

If the pressure in the space SP2 is suddenly lowered to the second pressure P2 in the drying steps D1 and D2, the drying speed of the solvent increases, but the thickness of the solution film F may not be uniform due to the intense evaporation of the solvent. In the first embodiment, the shape of the film is roughly determined by drying the solution film F to a certain extent at the first pressure P1, so that the effect on the film thickness is mitigated even if the drying speed of the solvent is then increased at the second pressure P2. However, if the solvent adsorbed on the inner surface of the cover unit 40 increases the solvent concentration, i.e., the partial pressure, in the space SP2, the pressure reduction is hindered. In the first embodiment, the rotating member 42 is rotated half a turn to discharge the solvent adsorbed on the rotating member 42 outside the space SP2, i.e., into the space SP1. This allows the pressure in the space SP2 to be quickly lowered to the second pressure P2. In this way, by going through the drying process, i.e., the multiple drying steps D1 to D4, it is possible to reduce unevenness in the drying speed of the solution film F on the substrate S and also shorten the drying time of the solution film F.

In step S4, the control device 90 determines whether all drying steps have been completed, i.e., whether the drying process has been completed. Whether the drying process has been completed is determined based on the output value of the gas analyzer 55 or a preset processing time. Note that, if the drying process includes multiple drying steps, the control device 90 may perform the determination process of step S4 after the start of the last drying process among the multiple drying processes.

If step S4 is YES, i.e., the drying process is completed, the control device 90 executes the next step S5. If step S4 is NO, i.e., the drying process is not completed, the control device 90 returns to the process of step S3 and continues the drying process.

In step S5, the control device 90 controls a transport device (not shown) so that the substrate S held by the substrate holding unit 20 is transported outside the airtight container 10.

As described above, according to the first embodiment, the unevenness of the drying speed of the solvent contained in the solution film F applied to the substrate S is reduced, and the drying speed of the solvent contained in the solution film F is improved. This improves the productivity of the product, the organic EL panel.

In addition, according to the first embodiment, by rotating the flat rotating member 42 by 180 degrees, the amount of solvent adsorbed on the main surface 4211 or 4212 of the rotating member 42 facing the space SP2 can be kept at a low level, and the solution film F can be dried stably and quickly to form a film (layer).

Second Embodiment
A reduced pressure drying apparatus, which is an example of a substrate processing apparatus according to the second embodiment, will be described. FIG. 8(a) is an explanatory diagram of a cover unit 40B of the reduced pressure drying apparatus according to the second embodiment. FIG. 8(a) illustrates a cross section of the cover unit 40B and members arranged around the cover unit 40B. The reduced pressure drying apparatus according to the second embodiment is obtained by replacing the cover unit 40 with the cover unit 40B in the reduced pressure drying apparatus 100 according to the first embodiment. Therefore, the configuration of the reduced pressure drying apparatus (substrate processing apparatus) according to the second embodiment other than the cover unit 40B is the same as the configuration of the reduced pressure drying apparatus 100 according to the first embodiment other than the cover unit 40, and therefore the description thereof will be omitted.

The cover unit 40B is disposed inside the airtight container 10 (Fig. 1) at a position surrounding the substrate S held by the substrate holding part 20. The cover unit 40B is disposed at a position not in contact with the substrate S held by the substrate holding part 20. The cover unit 40B of the second embodiment is disposed above the substrate holding part 20. Space SP2 is a space surrounded by the substrate holding part 20 and the cover unit 40B. The space SP2 inside the cover unit 40B and the space SP1 outside are connected to each other, but by surrounding the substrate S with the cover unit 40B, the pressure distribution in the space SP2 is adjusted to be as uniform as possible.

The main material of the cover unit 40B is preferably a metal, such as stainless steel. For example, austenitic stainless steel containing 0.045% or less phosphorus and 0.030% or less sulfur (i.e., stainless steel designated as SUS304 in the Japanese Industrial Standards (JIS)) is preferable.

The cover unit 40B of the second embodiment includes an enclosing wall 41, which is an example of a wall member, and a plurality of rotating members, for example five rotating members 42B, which are rotatable relative to the substrate holding unit 20, i.e., the enclosing wall 41. That is, in the second embodiment, the rotating member 42 of the first embodiment is replaced with the rotating member 42B. The plurality of rotating members 42B are supported directly by the enclosing wall 41 or indirectly via a separate member.

Of the multiple rotating members 42B, two or more rotating members are arranged at positions facing region 21 in a direction perpendicular to region 21, i.e., in the Z direction. In the second embodiment, the two or more rotating members are five rotating members 42B. That is, the five rotating members 42B are arranged at positions facing the substrate S arranged on region 21 in the Z direction. Specifically, the five rotating members 42B are arranged at positions facing the main surface MS of the substrate S arranged on region 21, i.e., the solution film F, in the Z direction. In this way, the rotating members 42B are arranged above region 21.

The five rotating members 42B are spaced apart from one another so as not to come into contact with one another. The rotation axis L of each of the five rotating members 42B extends parallel to the X direction along the region 21. The five rotating members 42B are spaced apart from one another in the Y direction that intersects with the X direction along the region 21. In each of the five rotating members 42B, the X direction is an example of the first direction, and the Y direction is an example of the second direction. In the second embodiment, the Y direction is perpendicular to the X direction.

Fig. 8(b) is a cross-sectional view of a rotating member 42B according to the second embodiment, and Fig. 8(c) is a plan view of the rotating member 42B according to the second embodiment as viewed in the direction of arrow VIIIC. The rotating member 42B is rotatable about a rotation axis L. The rotating member 42B includes a column member 421B extending in the longitudinal direction along the rotation axis L, and a pair of rotating shafts 422 arranged on both sides of the column member 421B in the longitudinal direction. The longitudinal direction is the X direction in the example of Fig. 8(b). By including the column member 421B, the rotating member 42B has a higher rigidity than a plate member.

The pillar member 421B may be a circular cylinder or an elliptical cylinder, but is preferably a polygonal prism. That is, the pillar member 421B is preferably a polygonal prism member having three or more main surfaces (N). The polygonal prism is preferably a regular polygonal prism, and among regular polygonal prisms, a regular triangular prism or a regular square prism is preferable. In the second embodiment, the pillar member 421B is a regular triangular prism. That is, the pillar member 421B has three (N=3) main surfaces 4211B, 4212B, 4213B.

Furthermore, it is preferable that the rotating member 42B has a plurality of openings 43 formed in the column member 421B. The openings 43 are through holes or slits.

A driving source (not shown) is connected to one of the pair of rotating shafts 422 of the rotating member 42B. The driving source (not shown) may include, for example, a motor, and may rotate the rotating member 42B around the rotation axis L. The multiple rotating members 42B may be rotated individually by their own driving sources, or may be rotated collectively.

The method for manufacturing an organic EL panel, which is an article according to the second embodiment, is as shown in the flowchart of FIG. 5 described in the first embodiment, but the rotation angle of the rotating member 42B is different from that of the rotating member 42 in the first embodiment. In the first embodiment, the rotating member 42 is rotated 180 degrees around the rotation axis L as a predetermined angle in the drying process in step S3 of FIG. 5, but in the second embodiment, the rotating member 42 is rotated (360/N) degrees around the rotation axis L as a predetermined angle. That is, since N=3 in the second embodiment, the rotating member 42B is rotated 120 degrees around the rotation axis L in the drying process in step S3.

FIGS. 9(a) to 9(d) are explanatory diagrams of the drying process according to the second embodiment. FIGS. 9(a) to 9(d) show cross sections of the cover unit 40B and the members arranged around the cover unit 40B. Note that the drying process of the second embodiment includes the drying steps D1 to D4 shown in FIG. 6, similar to the drying process of the first embodiment.

As shown in FIG. 9(a), the control device 90 controls the pressure reduction mechanism 30 so that the pressure in the internal space SP0 of the airtight container 10, i.e., the pressure indicated by the pressure gauge 57, drops from atmospheric pressure to the first pressure P1 (drying process D1). As a result, the inside of the airtight container 10 is reduced to the first pressure P1. Then, as shown in FIG. 9(b), after the pressure indicated by the pressure gauge 57 reaches the first pressure P1, the control device 90 controls the pressure reduction mechanism 30 so that the pressure in the internal space SP0, i.e., the pressure indicated by the pressure gauge 57, is maintained at the first pressure P1 for a first time (drying process D2). The drying processes D1 and D2 correspond to the first process.

After the first time has elapsed, i.e., after the first process, as shown in FIG. 9(c), the control device 90 controls the pressure reduction mechanism 30 so that the pressure in the internal space SP0 of the airtight container 10, i.e., the pressure indicated by the pressure gauge 57, decreases from the first pressure P1 to the second pressure P2 (drying process D3). As a result, the inside of the airtight container 10 is reduced to the second pressure P2. Then, after the pressure indicated by the pressure gauge 57 reaches the second pressure P2, the control device 90 controls the pressure reduction mechanism 30 so that the pressure in the internal space SP0, i.e., the pressure indicated by the pressure gauge 57, is maintained at the second pressure P2 for a second time (drying process D4). The drying processes D3 and D4 correspond to the second process.

In the second embodiment, after the drying step D3, i.e., during the drying step D3 or D4, preferably during the drying step D3, the control device 90 controls the rotating member 42B so that the rotating member 42 rotates 120 degrees around the rotation axis L from the state in the drying steps D1 and D2. The rotating member 42B is controlled to rotate in one predetermined direction, counterclockwise in the example of FIG. 9(c).

When the rotating member 42B having the equilateral triangular prism member 421B is rotated 120 degrees, the main surface 4211B on which the solvent Ls is adsorbed and which faces the space SP2 can be directed toward the space SP1, and at the same time, one of the main surfaces 4212B, 4213B which faces the space SP1 can be directed toward the space SP2.

In this way, according to the second embodiment, the rotating member 42B has the pillar member 421B, which increases the rigidity of the rotating member 42B, and is advantageous when enlarging the cover unit 40B in response to an increase in the size of the substrate S.

In addition, the column member 421B, which is a polygonal column such as a triangular column, has a higher time ratio facing the space SP1, which is advantageous from the viewpoint of keeping the rotating member 42B clean. For example, if the column member 421B is a regular triangular column, the time facing the space SP2 is 1/3 and the time facing the space SP1 is 2/3. On the other hand, in the case of a flat plate member that is rotated 180 degrees, the time facing the space SP2 is 1/2 and the time facing the space SP1 is 1/2. In other words, the column member 421B can have a higher time ratio facing the space SP1 than a flat plate. The main surface 4211B of the rotating member 42B to which the solvent is adsorbed is directed toward the space SP1 in the drying steps D3 and D4, so that the solvent adsorbed on the main surface 4211B is desorbed into the space SP1, and the removal of the solvent from the rotating member 42B is promoted. For this reason, a high proportion of time directed toward space SP1 is also advantageous from the standpoint of maintaining the cleanliness of the rotating member 42B.

In the second embodiment, in the drying step D3 or D4, preferably in the drying step D3, all of the rotating members 42B facing the substrate S in the Z direction are rotated by the same predetermined angle, i.e., 120 degrees. This allows the solvent contained in the solution film F to be dried more stably and quickly, and a film can be formed more stably. In other words, the drying time of the solution film F can be further shortened.

Alternatively, as shown in FIG. 9(d), the rotating member 42B may be rotated 240 degrees counterclockwise, so that the rotating member 42B is effectively rotated 120 degrees clockwise.

Third Embodiment
A third embodiment will be described. The configuration of the reduced pressure drying apparatus of the third embodiment is similar to the configuration of the reduced pressure drying apparatus 100 of the first embodiment. Therefore, in the third embodiment, the same reference numerals as those in the first embodiment are used, and the description will be omitted.

FIGS. 10(a) to 10(c) are explanatory diagrams of the drying process according to the third embodiment. FIGS. 10(a) to 10(c) show cross sections of the cover unit 40 and the members arranged around the cover unit 40. In the third embodiment, the rotation control of the rotating member 42 differs from that of the first embodiment. The drying process D1 shown in FIG. 10(a) and the drying process D2 shown in FIG. 10(b) are as described in the first embodiment. In the drying process D3 or D4 shown in FIG. 10(c), the control device 90 rotates the rotating members 42-1 to 42-5 by 90 degrees around the rotation axis L.

In other words, after the film shape of the solution film F is roughly determined in the drying process D2, the rotating member 42 is rotated 90 degrees in the drying process D3 and thereafter, thereby accelerating the drying of the solvent and facilitating the discharge of the solvent remaining in the space SP2 into the space SP1.

In addition, in the drying steps D3 and D4, it is also effective to introduce an inert gas from the gas introduction part 52 into the space SP2 to guide the solvent outside the space SP2. In this case, by setting the main surface 4211 of the rotating member 42 at 90 degrees to the horizontal plane, a wide solvent discharge path can be secured. In other words, in the drying steps D1 to D2, the rotating member 42 is set in a closed position (rotation angle 0 degrees) to minimize the opening area so that the solution film F on the substrate S is dried uniformly, and in the drying step D3 and after, the rotating member 42 is rotated 90 degrees to expand the opening area, which increases the conductance of the solvent vapor G from the space SP2 to the space SP1, and the discharge of the solvent from the space SP2 to the space SP1 can be accelerated. This allows the solvent contained in the solution film F to be dried stably and quickly, and a film can be formed stably. In other words, the drying time of the solution film F can be shortened. In addition, the solvent Ls adsorbed on the rotating member 42 can also be desorbed.

In the third embodiment, in the drying step D3 or D4, preferably in the drying step D3, all of the rotating members 42-1 to 42-5 facing the substrate S in the Z direction are rotated by the same predetermined angle, i.e., 90 degrees. This allows the solvent contained in the solution film F to be dried more stably and quickly, and a film can be formed more stably. In other words, the drying time of the solution film F can be further shortened.

Fourth Embodiment
A fourth embodiment will be described. The configuration of the reduced pressure drying apparatus of the fourth embodiment is similar to the configuration of the reduced pressure drying apparatus 100 of the first embodiment. Therefore, in the fourth embodiment, the same reference numerals as those in the first embodiment are used, and the description will be omitted.

FIGS. 11(a) to 11(c) are explanatory diagrams of the drying process according to the fourth embodiment. FIGS. 11(a) to 11(c) show cross sections of the cover unit 40 and the members arranged around the cover unit 40. In the fourth embodiment, the rotation control of the rotating member 42 differs from that in the first to third embodiments. In the first to third embodiments, the control device 90 controls the rotation of all the rotating members facing the substrate by the same angle. In the fourth embodiment, the control device 90 individually sets the rotation angles of the rotating members 42 (42-1 to 42-5) facing the substrate S.

The drying process D1 shown in FIG. 11(a) and the drying process D2 shown in FIG. 11(b) are as described in the first embodiment. In the drying process D3 or D4 shown in FIG. 11(c), the control device 90 rotates each of the rotating members 42-1 to 42-5 individually around the rotation axis L at the rotation angle set for each of the rotating members 42-1 to 42-5.

In other words, the rotation angles of the rotating members 42-1 to 42-5 arranged opposite the substrate S in the Z direction are adjusted to the angles set individually. This adjusts the gap at the top of the cover unit 40.

The rotating members 42-1 to 42-5 include rotating members 42-1 and 42-5 located at the extreme ends in the Y direction, and rotating members 42-2 to 42-4 that are separate from rotating members 42-1 and 42-5. Either rotating member 42-1 or 42-5 is an example of a first rotating member, and either rotating member 42-2 to 42-4 is an example of a second rotating member. The following description focuses on rotating member 42-1 located at the extreme ends in the Y direction, and rotating member 42-3 located in the center in the Y direction.

The control device 90 controls the rotating member 42-1 so that the main surface 4211 of the rotating member 42-1 forms an angle θ1 with respect to the region 21, i.e., the XY plane which is a horizontal plane. The angle θ1 is an example of a first angle. The angle θ1 is an acute angle less than 90 degrees. The control device 90 controls the rotating member 42-3 so that the main surface 4211 of the rotating member 42-3 forms an angle θ2 greater than the angle θ1 with respect to the region 21, i.e., the XY plane which is a horizontal plane. The angle θ2 is an example of a second angle. The angle θ2 is 90 degrees, i.e., a right angle, or an acute angle less than 90 degrees. In other words, it is preferable that the angle of the main surface 4211 with respect to the horizontal plane is greater the closer the rotating member 42 is to the center of the substrate S.

In this way, by individually adjusting the rotation angle of each of the rotating members 42-1 to 42-5, the area of the opening that connects the space SP1 to the space SP2 can be individually adjusted, and the drying speed of the solvent can be adjusted for each part of the solution film F.

For example, when the substrate S is enlarged, if the conductance of the solvent vapor from space SP2 to space SP1 is the same, the drying speed tends to be slower near the center of the substrate S and faster near the edge of the substrate S. Therefore, in the fourth embodiment, the control device 90 rotates the rotating member 42-3 located above the center of the substrate S by 90 degrees to fully open it, thereby increasing the conductance of the solvent vapor G, and rotates the rotating member 42-1 located above the edge of the substrate S by, for example, 30 degrees to close it, thereby decreasing the conductance of the solvent vapor G. This makes it possible to make the drying speed uniform at each part of the substrate S even when the substrate S is enlarged. In addition, the solvent Ls adsorbed on the rotating member 42 can be desorbed.

Fifth Embodiment
A reduced pressure drying apparatus as an example of a substrate processing apparatus according to the fifth embodiment will be described. Fig. 12 is an explanatory diagram of a cover unit 40C of the reduced pressure drying apparatus according to the fifth embodiment. The reduced pressure drying apparatus according to the fifth embodiment is obtained by replacing the cover unit 40 with the cover unit 40C in the reduced pressure drying apparatus 100 according to the first embodiment. Therefore, the configuration of the reduced pressure drying apparatus (substrate processing apparatus) according to the fifth embodiment other than the cover unit 40C is the same as the configuration of the reduced pressure drying apparatus 100 according to the first embodiment other than the cover unit 40, and therefore the description thereof will be omitted.

The cover unit 40C is disposed inside the airtight container 10 (Fig. 1) so as to cover the substrate S held by the substrate holding part 20. The space SP2 is a space surrounded by the substrate holding part 20 and the cover unit 40C. The space SP2 inside the cover unit 40C and the space SP1 outside are connected to each other, but by surrounding the substrate S with the cover unit 40C, the pressure distribution in the space SP2 is adjusted to be as uniform as possible.

The cover unit 40C includes an enclosing wall 41, which is an example of a wall member, and two or more rotating members that can rotate relative to the enclosing wall 41. In the fifth embodiment, the two or more rotating members are four or more rotating members, for example, eleven rotating members 42-1 to 42-11. The rotating members 42-1 to 42-11 are supported directly by the enclosing wall 41 or indirectly via a separate member.

Group G1 is made up of at least two rotating members out of the four or more rotating members 42-1 to 42-11, for example, five rotating members 42-1 to 42-5, and group G2 is made up of at least two rotating members out of the four rotating members 42-1 to 42-11 other than rotating members 42-1 to 42-5, for example, six rotating members 42-6 to 42-11. Group G1 is an example of a first group, and group G2 is an example of a second group.

Group G2 is disposed at a position farther from region 21 than group G1 is disposed at a position. Specifically, group G1 is disposed above substrate holding portion 20, and group G2 is disposed above group G1. Thus, rotating members 42-1 to 42-11 included in groups G1 and G2 are disposed facing substrate S in the Z direction. Rotating members 42-1 to 42-5 are disposed at intervals from one another in the Y direction. Rotating members 42-6 to 42-11 are disposed at intervals from one another in the X direction.

When viewed in the Z direction, the rotation axis L2 of each of the rotating members 42-6 to 42-11 included in group G2 intersects with the rotation axis L1 of each of the rotating members 42-1 to 42-5 included in group G1. In the fifth embodiment, when viewed in the Z direction, the rotation axis L2 is perpendicular to the rotation axis L1. For example, the rotation axis L1 extends in the X direction, and the rotation axis L2 extends in the Y direction.

In the fifth embodiment, similarly to the fourth embodiment, the control device 90 individually sets the rotation angles of the rotating members 42-1 to 42-11 facing the substrate S. That is, the rotating members 42-1 to 42-11 are individually driven to rotate by a driving source (not shown), and the rotation angles of the rotating members 42-1 to 42-11 are adjusted to the individually set angles. By individually setting the rotation angles of the rotating members 42-1 to 42-11, the gaps between the rotating members 42-1 to 42-11, i.e., the opening areas, can be adjusted for each portion of the substrate S. This makes it possible to adjust the drying speed of the solution film F to be faster or slower for each portion on the substrate S.

In addition, since the cover unit 40C has groups G1 and G2, the drying speed of the solution film F can be adjusted more precisely for each part of the substrate S in the XY direction. Furthermore, the control device 90 can individually control the rotation angles of the rotating members included in each of the groups G1 and G2, making it possible to more effectively and precisely adjust the drying speed. For example, the control device 90 can control the rotating members included in group G1 in the same manner as in the fourth embodiment, and control the rotating members included in group G2 in the same manner as in the fourth embodiment, thereby making it possible to more precisely adjust the drying speed of the solution film F on the substrate S.

Note that while the cover unit 40C has been described as having two groups G1 and G2, this is not limited thereto and the cover unit 40C may have three or more groups.

In addition, the case where the rotation axis L1 and the rotation axis L2 are perpendicular to each other when viewed in the Z direction, i.e., the rotation axis L1 and the rotation axis L2 intersect at 90 degrees, has been described, but this is not limited to the case. When viewed in the Z direction, the rotation axis L1 and the rotation axis L2 may intersect at an angle in the range of 60 degrees to 120 degrees.

Sixth Embodiment
A reduced pressure drying apparatus as an example of a substrate processing apparatus according to the sixth embodiment will be described. FIGS. 13(a) and 13(b) are explanatory diagrams of a cover unit 40D of the reduced pressure drying apparatus according to the sixth embodiment. FIGS. 13(a) and 13(b) show cross sections of the cover unit 40D and members arranged around the cover unit 40D. The reduced pressure drying apparatus according to the fifth embodiment is obtained by replacing the cover unit 40 in the reduced pressure drying apparatus 100 according to the first embodiment with the cover unit 40D. Therefore, the configuration of the reduced pressure drying apparatus (substrate processing apparatus) according to the sixth embodiment other than the cover unit 40D is the same as the configuration of the reduced pressure drying apparatus 100 according to the first embodiment other than the cover unit 40, and therefore the description thereof will be omitted.

As shown in FIG. 13(a), the cover unit 40D includes an enclosing wall 41D and multiple rotating members, for example, seven rotating members 42-1 to 42-7, that are rotatable relative to the enclosing wall 41. The multiple rotating members 42-1 to 42-7 are supported directly by the enclosing wall 41 or indirectly via a separate member.

Of the multiple rotating members 42-1 to 42-7, two or more rotating members, in the sixth embodiment five rotating members 42-1 to 42-5, are positioned opposite region 21 in the Z direction, i.e., above region 21, as in the first embodiment.

Of the multiple rotating members 42-1 to 42-7, at least one rotating member other than the rotating members 42-1 to 42-5, in the sixth embodiment, the two rotating members 42-6 and 42-7, are arranged on the side of the region 21. In other words, the rotating members 42-6 and 42-7 are arranged in a position facing the side surface SS of the substrate S held by the substrate holding unit 20.

The control device 90 controls the rotation angles of the multiple rotating members 42-1 to 42-7. The timing for rotating the rotating members 42-1 to 42-7 is after the drying process D3, as shown in FIG. 13(b), similar to the first to fourth embodiments.

As in the fourth embodiment, the control device 90 individually sets the rotation angles of at least the rotating members 42-1 to 42-5 that face the substrate S. By individually setting the rotation angles of the rotating members 42-1 to 42-5, the gap between the rotating members 42-1 to 42-5, i.e., the opening area, can be adjusted for each part of the substrate S. Furthermore, by rotating the rotating members 42-6 and 42-7, the solvent near the edge of the substrate S is discharged from the side of the substrate S to the space SP1 as shown by the thick arrow in FIG. 13(b). This accelerates the discharge of the solvent near the edge of the substrate S, and increases the drying speed of the solution film F near the edge of the substrate S. The control device 90 may individually set the rotation angles of all the rotating members 42-1 to 42-7.

Seventh Embodiment
A reduced pressure drying apparatus as an example of a substrate processing apparatus according to the seventh embodiment will be described. The reduced pressure drying apparatus according to the seventh embodiment is the reduced pressure drying apparatus 100 according to the first embodiment, further including a drying auxiliary member to be described below. FIGS. 14(a) and 14(b) are explanatory diagrams of a part of the configuration of the reduced pressure drying apparatus according to the seventh embodiment. FIGS. 14(a) and 14(b) show cross sections of the rotating member 42. It is preferable that the drying auxiliary member is operated after the drying process D3. The solvent adsorbed on the rotating member 42 is directed to the space SP1 by the 180-degree rotation of the rotating member 42, and is removed by the drying auxiliary member. The removal of the solvent adsorbed on the rotating member 42 by the drying auxiliary member is performed while the main surface of the rotating member 42 on which the solvent is adsorbed, for example, the main surface 4211, faces the space SP1.

The drying assistant member includes at least one of the nozzle 61 shown in FIG. 14(a), the heating device 62 shown in FIG. 14(a), and the ultrasonic vibration device 63 shown in FIG. 14(b). In the seventh embodiment, the member includes the nozzle 61, the heating device 62, and the ultrasonic vibration device 63. By using the nozzle 61, the heating device 62, and the ultrasonic vibration device 63 in combination, the solvent adsorbed on the rotating member 42 can be effectively removed.

The nozzle 61 is a gas blow nozzle used to blow gas onto the rotating member 42. After the drying step D3 shown in FIG. 7(c), the rotating member 42 rotates 180 degrees, so that the main surface 4211 on which the solvent is adsorbed is directed toward the space SP1. The nozzle 61 is disposed in the space SP1 and blows gas onto the main surface 4211 of the rotating member 42. This allows the solvent adsorbed on the main surface 4211 of the rotating member 42 to be desorbed, and the solvent can be quickly removed from the rotating member 42. The gas is a trace amount of inert gas that does not destroy the reduced pressure environment of the airtight container 10. By blowing the inert gas onto the rotating member 42, the molecules of the solvent adsorbed on the main surface 4211 are desorbed, and the solvent molecules remaining in the space SP2 are discharged from the space SP2.

The heating device 62 is a device that heats the rotating member 42, and includes, for example, a heater 64 and a temperature control unit 65 that controls the temperature of the heater 64. The heater 64 is disposed inside the rotating member 42. The temperature control unit 65 controls the temperature of the heater 64 so as to heat the rotating member 42. When the rotating member 42 is heated, the solvent adsorbed on the rotating member 42 is heated.

The temperature control unit 65 controls the temperature of each region of the rotating member 42 to the same or different temperatures so that the rotating member 42 has a uniform temperature distribution. The temperature control unit 65 preferably controls the temperature difference in each region of the rotating member 42 to be within 10 degrees, and more preferably controls the temperature difference to be within 5 degrees. The temperature control unit 65 controls the heater 64 so that the temperature of the rotating member 42 becomes a predetermined temperature within the range of 0 degrees to 100 degrees. Note that the heating device 62 may have a light source that heats the rotating member 42 instead of or in addition to the heater 64. For example, the light source is arranged in the space SP1, and can heat the rotating member 42, i.e., the solvent adsorbed on the rotating member 42, by irradiating light to the main surface 4211 or the main surface 4212 of the rotating member 42 facing the space SP1.

The ultrasonic vibration device 63 is a device that applies ultrasonic vibrations to the rotating member 42, and has an ultrasonic transducer 66 such as a piezoelectric element, and an output control unit 67 that applies a voltage to the ultrasonic transducer 66. The ultrasonic transducer 66 is disposed inside the rotating member 42 and converts the applied voltage into vibration. The output control unit 67 applies a voltage to the ultrasonic transducer 66, causing the ultrasonic transducer 66 to generate ultrasonic waves. The solvent adsorbed on the rotating member 42 is desorbed from the rotating member 42 by the ultrasonic vibration of the rotating member 42.

The output control unit 67 controls the output power output to the ultrasonic transducer 66 so that ultrasonic waves can be applied uniformly to the rotating member 42. The output power is controlled to a predetermined power within the range of 20 to 600 W depending on the size of the rotating member 42.

Eighth Embodiment
A reduced pressure drying apparatus as an example of a substrate processing apparatus according to the eighth embodiment will be described. FIG. 15(a) is an explanatory diagram of a cover unit 40E of the reduced pressure drying apparatus according to the eighth embodiment. FIG. 15(a) illustrates a cross section of the cover unit 40E and members arranged around the cover unit 40E. The reduced pressure drying apparatus according to the eighth embodiment is obtained by replacing the cover unit 40 in the reduced pressure drying apparatus 100 according to the first embodiment with the cover unit 40E. Therefore, the configuration of the reduced pressure drying apparatus (substrate processing apparatus) according to the eighth embodiment other than the cover unit 40E is the same as the configuration of the reduced pressure drying apparatus 100 according to the first embodiment other than the cover unit 40, and therefore the description thereof will be omitted.

The cover unit 40E includes an enclosure wall 41E, which is an example of a wall member, and a plurality of rotating members, for example, five rotating members 42E, that are supported by the enclosure wall 41E and can rotate relative to the enclosure wall 41E. The five rotating members 42E are arranged in positions in the Z direction that face the substrate S held by the substrate holding unit 20, i.e., the region 21 of the substrate holding unit 20.

The cover unit 40E is the cover unit 40 described in the first embodiment that has been subjected to a surface treatment. Specifically, at least a portion of the surface of the rotating member 42E is formed of a liquid-repellent material 44E. The liquid-repellent material 44E is a material that has the property of repelling the solvent contained in the solution film F, i.e., the organic solvent described in the first embodiment.

The rotating member 42E includes a base member 46E and a liquid-repellent member 44E, which is a liquid-repellent film disposed on at least a portion of the surface of the base member 46E. That is, the surface of the base member 46E is coated with the liquid-repellent member 44E. The base member 46E has a configuration similar to that of the rotating member 42 of the first embodiment. The main material of the base member 46E is preferably a metal, such as stainless steel. The stainless steel is preferably an austenitic stainless steel containing, for example, 0.045% or less phosphorus and 0.030% or less sulfur (i.e., stainless steel designated as SUS304 in the Japanese Industrial Standards: JIS).

The rotating member 42E is rotatable about the rotation axis L. The rotating member 42E includes a plate member 421E extending in the longitudinal direction along the rotation axis L. In the eighth embodiment, at least the main surfaces 4211E, 4212E of the plate member 421E of the rotating member 42E are formed of a liquid-repellent material 44E. The main surface 4212E is the main surface opposite to the main surface 4211E. The liquid-repellent material 44E reduces the amount of solvent adsorbed to the rotating member 42E. This enables a faster drying process.

The solvent adsorption of the liquid-repellent member 44E in a vacuum environment correlates with the receding contact angle of the dynamic contact angle with pure water. The larger the receding contact angle of pure water on the liquid-repellent member 44E, the less solvent is adsorbed onto the cover unit 40E in a vacuum environment. Therefore, the receding contact angle is an index for evaluating the solvent adsorption force and solvent detachment force.

It is preferable that the receding contact angle of the liquid-repellent member 44E with respect to pure water is 90 degrees or more. This makes it more difficult for the solvent to be adsorbed onto the surface of the cover unit 40F, and even if the solvent is adsorbed onto the surface of the cover unit 40F, the solvent droplets adsorbed onto the surface of the cover unit 40F are more likely to detach, further shortening the drying process time. It is also preferable that the receding contact angle of the liquid-repellent member 44E with respect to pure water is 120 degrees or less.

The pure water used in the evaluation can be water with an electrical resistivity of 15 MΩ·cm or more, so-called ultrapure water. A microcontact angle meter (product name: DropMeasure, manufactured by Microjet Co., Ltd.) can be used to measure the receding contact angle. The receding contact angle is measured by forming a water droplet (liquid volume 2 μL) on the test piece and observing the receding contact angle as the droplet dries for about 20 minutes. This measurement method allows the receding contact angle to be evaluated.

The liquid-repellent member 44E preferably contains a fluororesin or a fluorine-containing compound as a main component. The fluororesin is preferably, for example, tetrafluoroethylene resin (PTFE), perfluoroalkoxy resin (PFA), fluorinated ethylene propylene resin (FEP), ethylene tetrafluoroethylene resin, or polychlorotrifluoroethylene resin. The fluorine-containing compound is preferably, for example, a fluorine-containing silane coupling agent. By using any of these materials, it is easy to realize a liquid-repellent member 44E with a receding contact angle of 90 degrees or more and 120 degrees or less.

化学構造式（１）～（４）中、ｎ１～ｎ４は、それぞれ１以上の整数を表す。 The main chain of the fluorine-containing compound preferably has perfluoropolyether (PFPE), which preferably has at least one chemical structure selected from the group consisting of the following chemical structural formulas (1) to (4).

In the chemical structural formulas (1) to (4), n1 to n4 each represent an integer of 1 or more.

In the eighth embodiment, it is preferable that the surface 43E that defines the opening of the rotating member 42E is also formed of the liquid-repellent material 44E. It is also preferable that the inner surface of the surrounding wall 41E is also formed of the liquid-repellent material 44E.

Although the rotating member 42E has a plate member 421E, the present invention is not limited to this. For example, the rotating member may have a pillar member.

Fig. 15(b) is an explanatory diagram of a cover unit 40F according to a modified example of the eighth embodiment. Fig. 15(b) illustrates a cross section of the cover unit 40F and the members arranged around the cover unit 40F. The cover unit 40F according to the modified example of the eighth embodiment includes an enclosure wall 41E and a rotating member 42F. The rotating member 42F has a pillar member 421F. As in the second embodiment, the pillar member 421F is, for example, a regular triangular prism member. At least a portion of the surface of the rotating member 42F is formed of a liquid-repellent member 44E.

<Embodiments of a method for manufacturing an article>
The method for manufacturing an article according to this embodiment is suitable for manufacturing an article such as an organic EL panel using an inkjet printing device. The method for manufacturing an article according to this embodiment includes a coating step of arranging or coating a solution film on a substrate by a printing method using an inkjet printing device or the like to obtain a coated substrate. The method also includes a drying step of drying the solution film on the coated substrate by the above-mentioned reduced pressure drying device to obtain a dry substrate on which a dry film is formed. Furthermore, the manufacturing method includes other well-known steps such as firing, cooling, dehumidification, dry cleaning, forming an electrode, or forming a sealing film. The method for manufacturing an article according to this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article.

The present disclosure is not limited to the embodiments described above, and many variations of the present embodiment are possible within the technical concept of the present disclosure. Furthermore, the effects described in the embodiments are merely a list of the most favorable effects resulting from the embodiments of the present disclosure, and the effects of the embodiments of the present disclosure are not limited to those described in the embodiments.

The disclosure of the above embodiments includes the following:

(Item 1)
An airtight container;
A pressure reducing mechanism for reducing the pressure inside the airtight container;
a substrate holder arranged inside the airtight container and capable of holding a substrate;
a rotating member that is disposed inside the airtight container at a position facing the substrate held by the substrate holding portion and is rotatable relative to the substrate holding portion;
The substrate processing apparatus according to claim 1,

(Item 2)
A control device that executes a first process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a first pressure, and a second process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a second pressure lower than the first pressure after the first process,
the control device controls the rotating member in the second process so that the rotating member rotates by a predetermined angle from a state of the first process.
2. The substrate processing apparatus according to item 1,

(Item 3)
The rotating member is rotatable about a rotation axis and includes a plate member extending in a longitudinal direction along the rotation axis.
3. The substrate processing apparatus according to item 2,

(Item 4)
The predetermined angle is 180 degrees.
4. The substrate processing apparatus according to item 2 or 3,

(Item 5)
The predetermined angle is 90 degrees.
4. The substrate processing apparatus according to item 2 or 3,

(Item 6)
The rotating member is rotatable about a rotation axis and includes a column member extending in a longitudinal direction along the rotation axis.
3. The substrate processing apparatus according to item 2,

(Item 7)
The pillar member is a polygonal pillar member having N main surfaces, which are three or more,
The predetermined angle is (360/N) degrees.
7. The substrate processing apparatus according to item 6,

(Item 8)
Two or more of the rotating members are provided.
8. The substrate processing apparatus according to any one of items 1 to 7,

(Item 9)
A control device that executes a first process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a first pressure, and a second process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a second pressure lower than the first pressure after the first process,
the control device controls the two or more rotating members in the second process so that the two or more rotating members rotate by the same predetermined angle from a state of the first process.
9. The substrate processing apparatus according to item 8,

(Item 10)
A control device that executes a first process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a first pressure, and a second process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a second pressure lower than the first pressure after the first process,
the control device controls the two or more rotating members in the second process so that the two or more rotating members rotate by angles individually set from a state of the first process.
9. The substrate processing apparatus according to item 8,

(Item 11)
the substrate holder has a planar area on which the substrate is placed,
Further comprising at least one rotating member other than the two or more rotating members, the rotating member being rotatable relative to the substrate holder;
The at least one rotating member is disposed laterally of the region.
11. The substrate processing apparatus according to any one of items 8 to 10,

(Item 12)
the substrate holder has a planar area on which the substrate is placed,
a rotation axis of each of the two or more rotational members extends parallel to a first direction along the region;
The two or more rotating members are arranged side by side in a second direction intersecting the first direction along the region.
12. The substrate processing apparatus according to any one of items 8 to 11,

(Item 13)
the substrate holder has a planar area on which the substrate is placed,
the two or more rotating members are four or more rotating members,
The four or more rotating members include a first group consisting of at least two rotating members, and a second group consisting of at least two rotating members other than the at least two rotating members, which is arranged at a position farther from the region than a position where the first group is arranged.
12. The substrate processing apparatus according to any one of items 8 to 11,

(Item 14)
the substrate holder has a planar area on which the substrate is placed,
a rotation axis of each of the two or more rotational members extends parallel to a first direction along the region;
The two or more rotating members are arranged side by side in a second direction intersecting the first direction along the region,
The two or more rotating members include a first rotating member located at an end of the second direction and a second rotating member different from the first rotating member,
The control device includes:
controlling the first rotating member such that a main surface of the first rotating member forms a first angle with respect to the region;
controlling the second rotating member such that a major surface of the second rotating member forms a second angle with respect to the region, the second angle being greater than the first angle;
11. The substrate processing apparatus according to item 10,

(Item 15)
The rotating member has at least one opening.
15. The substrate processing apparatus according to any one of items 1 to 14,

(Item 16)
Further comprising a nozzle for blowing gas onto the rotating member.
16. The substrate processing apparatus according to any one of items 1 to 15,

(Item 17)
The rotating member may further include a heating device for heating the rotating member.
17. The substrate processing apparatus according to any one of items 1 to 16,

(Item 18)
The rotating member may further include an ultrasonic vibration device that applies ultrasonic vibration to the rotating member.
18. The substrate processing apparatus according to any one of items 1 to 17,

(Item 19)
The rotating member has a liquid-repellent material on at least a part of its surface.
20. The substrate processing apparatus according to any one of items 1 to 18,

(Item 20)
The liquid-repellent member has a receding dynamic contact angle with respect to pure water of 90 degrees or more.
20. The substrate processing apparatus according to item 19,

(Item 21)
The liquid-repellent member has a receding dynamic contact angle with respect to pure water of 120 degrees or less.
21. The substrate processing apparatus according to item 19 or 20,

(Item 22)
22. A method for manufacturing an article, comprising the step of drying a solution film coated on a substrate by using the substrate processing apparatus according to any one of items 1 to 21.

(Item 23)
The substrate having the solution applied onto its main surface is placed on a substrate holder disposed inside an airtight container;
The inside of the airtight container is reduced in pressure to a first pressure higher than a vapor pressure of a solvent contained in the solution, thereby evaporating the solvent;
rotating a rotating member disposed at a position facing the substrate in a process of reducing the pressure inside the airtight container from the first pressure to a second pressure lower than the vapor pressure of the solvent, or in a state in which the pressure inside the airtight container is reduced to the second pressure;
A method for producing an article.

10... airtight container, 20... substrate holder, 30... pressure reduction mechanism, 42... rotating member, 100... reduced pressure drying device (substrate processing device)

Claims (23)

An airtight container;
A pressure reducing mechanism for reducing the pressure inside the airtight container;
a substrate holder arranged inside the airtight container and capable of holding a substrate;
a rotating member that is disposed inside the airtight container at a position facing the substrate held by the substrate holding portion and is rotatable relative to the substrate holding portion;
The substrate processing apparatus according to claim 1, A control device that executes a first process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a first pressure, and a second process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a second pressure lower than the first pressure after the first process,
the control device controls the rotating member in the second process so that the rotating member rotates by a predetermined angle from a state of the first process.
The substrate processing apparatus according to claim 1 . The rotating member is rotatable about a rotation axis and includes a plate member extending in a longitudinal direction along the rotation axis.
The substrate processing apparatus according to claim 2 . The predetermined angle is 180 degrees.
The substrate processing apparatus according to claim 2 . The predetermined angle is 90 degrees.
The substrate processing apparatus according to claim 2 . The rotating member is rotatable about a rotation axis and includes a column member extending in a longitudinal direction along the rotation axis.
The substrate processing apparatus according to claim 2 . The pillar member is a polygonal pillar member having N main surfaces, which are three or more,
The predetermined angle is (360/N) degrees.
The substrate processing apparatus according to claim 6 . Two or more of the rotating members are provided.
The substrate processing apparatus according to claim 1 . A control device that executes a first process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a first pressure, and a second process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a second pressure lower than the first pressure after the first process,
the control device controls the two or more rotating members in the second process so that the two or more rotating members rotate by the same predetermined angle from a state of the first process.
The substrate processing apparatus according to claim 8 . A control device that executes a first process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a first pressure, and a second process of controlling the decompression mechanism so as to decompress the inside of the airtight container to a second pressure lower than the first pressure after the first process,
the control device controls the two or more rotating members in the second process so that the two or more rotating members rotate by angles individually set from a state of the first process.
The substrate processing apparatus according to claim 8 . the substrate holder has a planar area on which the substrate is placed,
Further comprising at least one rotating member other than the two or more rotating members, the rotating member being rotatable relative to the substrate holder;
The at least one rotating member is disposed laterally of the region.
The substrate processing apparatus according to claim 8 . the substrate holder has a planar area on which the substrate is placed,
a rotation axis of each of the two or more rotational members extends parallel to a first direction along the region;
The two or more rotating members are arranged side by side in a second direction intersecting the first direction along the region.
The substrate processing apparatus according to any one of claims 8 to 11. the substrate holder has a planar area on which the substrate is placed,
the two or more rotating members are four or more rotating members,
The four or more rotating members include a first group consisting of at least two rotating members, and a second group consisting of at least two rotating members other than the at least two rotating members, which are arranged at a position farther from the region than a position where the first group is arranged.
The substrate processing apparatus according to any one of claims 8 to 11. the substrate holder has a planar area on which the substrate is placed,
a rotation axis of each of the two or more rotational members extends parallel to a first direction along the region;
The two or more rotating members are arranged side by side in a second direction intersecting the first direction along the region,
The two or more rotating members include a first rotating member located at an end of the second direction and a second rotating member different from the first rotating member,
The control device includes:
controlling the first rotating member such that a main surface of the first rotating member forms a first angle with respect to the region;
controlling the second rotating member such that a major surface of the second rotating member forms a second angle with respect to the region, the second angle being greater than the first angle;
The substrate processing apparatus according to claim 10 . The rotating member has at least one opening.
The substrate processing apparatus according to claim 1 . Further comprising a nozzle for blowing gas onto the rotating member.
The substrate processing apparatus according to claim 1 . The rotating member may further include a heating device for heating the rotating member.
The substrate processing apparatus according to claim 1 . The rotating member may further include an ultrasonic vibration device that applies ultrasonic vibration to the rotating member.
The substrate processing apparatus according to claim 1 . The rotating member has a liquid-repellent material on at least a part of its surface.
The substrate processing apparatus according to claim 1 . The liquid-repellent member has a receding dynamic contact angle with respect to pure water of 90 degrees or more.
The substrate processing apparatus according to claim 19 . The liquid-repellent member has a receding dynamic contact angle with respect to pure water of 120 degrees or less.
21. The substrate processing apparatus according to claim 19, wherein the substrate processing apparatus is a processing apparatus for processing a substrate. A method for manufacturing an article, comprising a step of drying a solution film applied to a substrate using the substrate processing apparatus according to claim 1. The substrate having the solution applied onto its main surface is placed on a substrate holder disposed inside an airtight container;
The inside of the airtight container is reduced in pressure to a first pressure higher than a vapor pressure of a solvent contained in the solution, thereby evaporating the solvent;
rotating a rotating member disposed at a position facing the substrate in a process of reducing the pressure inside the airtight container from the first pressure to a second pressure lower than the vapor pressure of the solvent, or in a state in which the pressure inside the airtight container is reduced to the second pressure;
A method for producing an article.

Images