JP2024090970A - Poly(ester)carbonate resin composition and molded article thereof - Google Patents

Abstract

The present invention provides a poly(ester)carbonate resin composition which has excellent resistance to moist heat, and when a molded article made therefrom has wavelength-selective absorption characteristics, the absorption characteristics also have excellent thermal stability and light stability, and a molded article made therefrom also has excellent thermal stability and light stability.
[Solution] The resin composition contains 100 parts by weight of (A) a poly(ester)carbonate resin (component A) containing a diol component represented by the following general formula [1] as a monomer component, (B) 0.001 to 0.2 parts by weight of a dye (component B) having an absorption maximum in the range of 650 to 750 nm, and (C) 0.001 to 0.4 parts by weight of at least one heat stabilizer (component C) selected from the group consisting of phosphite-based heat stabilizers and phenol-based heat stabilizers, and is characterized in that the average light transmittance in the thickness direction at 400 to 650 nm of a molded product molded to a thickness of 0.2 mm is 60% or more.
[Selection diagram] None

Description

The present invention relates to a poly(ester)carbonate resin composition that has excellent resistance to moist heat, and molded articles made therefrom have wavelength-selective absorption characteristics, and further have excellent thermal and light stability of the absorption characteristics, and to a molded article made therefrom.

In recent years, near-infrared light blocking has been required to improve image quality in lens units used in imaging devices such as smartphones and in-vehicle cameras. Near-infrared light blocking technology includes a method of applying a near-infrared light blocking coating to the surface, but due to the disadvantages of high cost and increased processing steps, there is a demand for the lens itself to be given a near-infrared light blocking function. In addition, there is a great demand for poly(ester)carbonate resin as a lens material, which has good transparency, excellent impact resistance and heat resistance, and whose refractive index can be adjusted by changing the chemical structure.

Studies on polycarbonate resins with wavelength selectivity have been conducted in the past. Of these, Patent Documents 1 and 2 use a general aromatic polycarbonate resin as the basic composition, and there is no description of the poly(ester)carbonate resin described in this specification. Similarly, Patent Documents 3, 4, and 5 also do not describe the poly(ester)carbonate resin described in this specification, nor do they describe technology for improving the thermal stability and light stability of the absorption characteristics of the resin.

Japanese Patent No. 4653027 JP 2021-25029 A JP 2017-129881 A JP 2017-115032 A JP 2020-172614 A

The object of the present invention is to provide a poly(ester)carbonate resin composition that has excellent resistance to moist heat, and in which molded articles made from the composition have wavelength-selective absorption characteristics, and further has excellent thermal and light stability of the absorption characteristics.

As a result of extensive research, the inventors have found that the above-mentioned problems can be solved by a resin composition in which a specific coloring agent and a heat stabilizer are added to a specific poly(ester)carbonate resin used for lenses. In other words, the inventors have found that the above-mentioned problems can be achieved by the following poly(ester)carbonate resin composition and molded products thereof.

1. A resin composition containing 100 parts by weight of (A) a poly(ester)carbonate resin (component A) containing a diol component represented by the following general formula [1] as a monomer component, (B) 0.001 to 0.2 parts by weight of a dye (component B) having an absorption maximum in the range of 650 to 750 nm, and (C) 0.001 to 0.4 parts by weight of at least one heat stabilizer (component C) selected from the group consisting of phosphite ester-based heat stabilizers and phenol-based heat stabilizers, wherein the resin composition has an average light transmittance in the thickness direction of 60% or more at 400 to 650 nm when molded to a thickness of 0.2 mm.

(In the above formula [1], ring Z represents an aromatic group or a condensed polycyclic aromatic group (which may be the same or different), R ^a and R ^b each independently represent a hydrogen atom, a halogen atom, or a hydrocarbon group having 1 to 12 or 1 to 20 carbon atoms which may contain an aromatic group, Ar ¹ and Ar ² each independently represent a hydrogen atom or an aromatic group having 6 to 10 carbon atoms which may contain a substituent, L ¹ and L ² each independently have a divalent linking group, and m and n each independently represent 0 or 1.)

2. The resin composition according to item 1 above, wherein component A is a poly(ester)carbonate resin containing 15% or more by molar ratio of a diol component represented by the above general formula [1].
3. The resin composition according to item 1 or 2 above, wherein component B is a dye containing at least one selected from the group consisting of an azo dye, an anthraquinone dye, a quinoline dye, a squarylium dye, a phthalocyanine dye, a perinone dye, a perylene dye, a methine dye, and a heterocyclic dye.
4. The resin composition according to item 3 above, wherein component B is a dye containing at least one selected from the group consisting of phthalocyanine dyes and perylene dyes.
5. The resin composition according to any one of items 1 to 4 above, wherein Component C is a phosphite-based heat stabilizer.
6. The resin composition according to any one of items 1 to 5 above, which contains 0.01 to 2 parts by weight of a benzotriazole-based ultraviolet absorber (D) (Component D) per 100 parts by weight of Component A.
7. A resin molded product made of the resin composition according to any one of items 1 to 6 above.
8. The resin molded article according to the above item 7, which is for a lens.

The resin composition of the present invention has excellent resistance to moist heat, and molded articles made from it have wavelength-selective absorption characteristics. In addition, the absorption characteristics have excellent thermal and optical stability, so it can contribute to improving image quality in imaging devices such as smartphones and in-vehicle cameras.

(Component A: Poly(ester)carbonate resin)
The component A of the present invention is a poly(ester)carbonate resin. The poly(ester)carbonate resin includes polyestercarbonate resins and polycarbonate resins.

<Monomer component (diol component)>
The poly(ester)carbonate resin used as component A in the present invention contains a diol component represented by the following general formula [1] as a monomer component.

(In the above formula [1], ring Z represents an aromatic group or a condensed polycyclic aromatic group (which may be the same or different), R ^a and R ^b each independently represent a hydrogen atom, a halogen atom, or a hydrocarbon group having 1 to 12 or 1 to 20 carbon atoms which may contain an aromatic group, Ar ¹ and Ar ² each independently represent a hydrogen atom or an aromatic group having 6 to 10 carbon atoms which may contain a substituent, L ¹ and L ² each independently have a divalent linking group, and m and n each independently represent 0 or 1.)

The compound represented by the above general formula [1] is preferably 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene (hereinafter sometimes abbreviated as BPEF) in which ^L1 and ^L2 are ethylene groups, m and n are 1, R ^a and R ^b are phenyl groups, Ar ¹ and Ar ² are hydrogen atoms, and Z is a benzene ring; 9,9-bis[4-(2-hydroxyethoxy)-3-phenylphenyl]fluorene (hereinafter sometimes abbreviated as OPBPEF) in which ^L1 and ^L2 are ethylene groups, m and n are 1, R ^a and R ^b are phenyl groups, Ar ¹ and Ar ² are hydrogen atoms, and Z is a benzene ring; or biscresolfluorene in which m and n are 0, R ^a and R ^b are methyl groups, Ar ¹ and Ar ² are hydrogen atoms, and Z is a benzene ring.

As the compound represented by the above formula [1], a compound represented by the following formula [1-1] is also preferably used.
(In the above formula [1-1], R ²¹ to R ³⁶ each independently represent a hydrogen atom, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, or a hydrocarbon group which may contain an aromatic group having 1 to 12 carbon atoms; among pairs of R ²⁹ and R ³⁰ , R ³⁰ and R ³¹ , R ³¹ and R ³² , R ³³ and R ³⁴ , R ³⁴ and R ³⁵ , and R ³⁵ and R ³⁶ , one pair is condensed with each other to form a ring; and L ¹ and L ² each independently represent a divalent linking group.)

Specifically, the diol represented by the above formula [1-1] includes 9,9-bis(4-(2-hydroxyethoxy)phenyl)-1,2-benzofluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-methylphenyl)-1,2-benzofluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-phenylphenyl)-1,2-benzofluorene, 9,9-bis(4-(2-hydroxyethoxy)phenyl)-2,3-benzofluorene, 9,9-bis(4-(2-hydroxyethoxy)phenyl)-2,3-benzofluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-methylphenyl)-2,3-benzofluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-phenylphenyl)-2,3-benzofluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-methylphenyl)-3,4-benzofluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-methylphenyl)-3,4-benzofluorene, and 9,9-bis(4-(2-hydroxyethoxy)-3-phenylphenyl)-3,4-benzofluorene. Among these, 9,9-bis(4-hydroxyphenyl)-1,2-benzofluorene, 9,9-bis(4-(2-hydroxyethoxy)phenyl)-2,3-benzofluorene, and 9,9-bis(4-hydroxyphenyl)-3,4-benzofluorene are preferred, and 9,9-bis(4-(2-hydroxyethoxy)phenyl)-2,3-benzofluorene is more preferred. These may be used alone or in combination of two or more.

As the compound represented by the above formula [1], a compound represented by the following formula [1-2] is also preferably used.
(In the above formula [1-2], ring Z (the same or different) represents an aromatic group, R ³⁷ and R ³⁸ each independently represent a hydrogen atom, a halogen atom, or a hydrocarbon group which may contain an aromatic group having 1 to 12 carbon atoms, Ar ¹ and Ar ² each independently represent a hydrogen atom or an aromatic group which may contain a substituent having 6 to 10 carbon atoms, L ¹ and L ² each independently represent a divalent linking group, j and k each independently represent an integer of 0 or greater, and m and n each independently represent 0 or 1.)

Furthermore, diols in which ring Z is a naphthalene ring and Ar ¹ and Ar ² are selected from the same chemical groups as R ³⁷ and R ³⁸ in the above formula [1-2] are also preferably used. Specifically, the fluorene-based diols represented by the above formula [1-2] include 9,9-bis(4-(2-hydroxyethoxy)phenyl)-1,8-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-methylphenyl)-1,8-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-phenylphenyl)-1,8-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-1-naphthyl)-1,8-diphenylfluorene, 9,9-bis (6-(2-hydroxyethoxy)-2-naphthyl)-1,8-diphenylfluorene, 9,9-bis(4-hydroxyphenyl)-1,8-diphenylfluorene, 9,9-bis(4-hydroxy-3-methylphenyl)-1,8-diphenylfluorene, 9,9-bis(4-hydroxy-3-phenylphenyl)-1,8-diphenylfluorene, 9,9-bis(4-hydroxy-1-naphthyl)-1,8-diphenylfluorene, 9,9-bis(6-hydroxy-2-naphthyl)-1,8-diphenyl Fluorene, 9,9-bis(4-(2-hydroxyethoxy)phenyl)-2,7-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-methylphenyl)-2,7-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-phenylphenyl)-2,7-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-1-naphthyl)-2,7-diphenylfluorene, 9,9-bis(6-(2-hydroxyethoxy)-2-naphthyl)-2,7 -diphenylfluorene, 9,9-bis(4-hydroxyphenyl)-2,7-diphenylfluorene, 9,9-bis(4-hydroxy-3-methylphenyl)-2,7-diphenylfluorene, 9,9-bis(4-hydroxy-3-phenylphenyl)-2,7-diphenylfluorene, 9,9-bis(4-hydroxy-1-naphthyl)-2,7-diphenylfluorene, 9,9-bis(6-hydroxy-2-naphthyl)-2,7-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy) phenyl)-3,6-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-methylphenyl)-3,6-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-phenylphenyl)-3,6-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-1-naphthyl)-3,6-diphenylfluorene, 9,9-bis(6-(2-hydroxyethoxy)-2-naphthyl)-3,6-diphenylfluorene, 9,9-bis(4-hydroxyphenyl nyl)-3,6-diphenylfluorene, 9,9-bis(4-hydroxy-3-methylphenyl)-3,6-diphenylfluorene, 9,9-bis(4-hydroxy-3-phenylphenyl)-3,6-diphenylfluorene, 9,9-bis(4-hydroxy-1-naphthyl)-3,6-diphenylfluorene, 9,9-bis(6-hydroxy-2-naphthyl)-3,6-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)phenyl)-4,5-diphenylfluorene, 9,9-bis( 4-(2-hydroxyethoxy)-3-methylphenyl)-4,5-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-phenylphenyl)-4,5-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-1-naphthyl)-4,5-diphenylfluorene, 9,9-bis(6-(2-hydroxyethoxy)-2-naphthyl)-4,5-diphenylfluorene, 9,9-bis(4-hydroxyphenyl)-4,5-diphenylfluorene, 9,9-bis(4- 9,9-bis(4-hydroxy-3-methylphenyl)-4,5-diphenylfluorene, 9,9-bis(4-hydroxy-3-phenylphenyl)-4,5-diphenylfluorene, 9,9-bis(4-hydroxy-1-naphthyl)-4,5-diphenylfluorene, 9,9-bis(6-hydroxy-2-naphthyl)-4,5-diphenylfluorene, 9,9-bis(4-(2-hydroxyethoxy)-1-naphthyl)fluorene, 9,9-bis(6-(2-hydroxyethoxy)-2-naphthyl)fluorene, and the like.

The component A may also contain a diol component represented by the following general formula [2].
(In the above formula [2], R ¹¹ and R ¹² each independently represent a hydrocarbon group having 1 to 10 carbon atoms which may contain an aromatic group, and o and p each independently represent an integer of 0 or greater. R ¹³ to R ²⁰ each independently represent a hydrogen atom, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, or a hydrocarbon group having 1 to 20 carbon atoms which may contain an aromatic group.)

R ¹³ to R ²⁰ are preferably each independently a hydrogen atom or a hydrocarbon group which may contain an aromatic group having 1 to 12 carbon atoms, and particularly preferably a hydrogen atom. The diol component represented by the above general formula [2] is more preferably 2,2'-bis(2-hydroxyethoxy)-1,1'-binaphthyl (hereinafter sometimes abbreviated as BHEB) in which R ¹¹ and R ¹² are ethylene groups, o and p are 1, and R ¹³ to R ²⁰ are hydrogen atoms, or 1,1'-bi-2-naphthol in which o and p are 0, and R ¹³ to R ²⁰ are hydrogen atoms.

The content of the diol component represented by the above general formula [1] in component A is preferably 15% or more, more preferably 20% or more, and even more preferably 25% or more, in terms of molar ratio. If the content is less than 15%, the refractive index of the resin may be lower than the refractive index required for the lens material. There is no particular upper limit to the content, but it is preferably 95% or less, and more preferably 85% or less.

These diols can be used not only in polymerization reactions with carbonate esters, but also to obtain intermediate products for the production of polyester carbonates.

<Monomer Component (Carbonate Ester)>
As the carbonate ester used in the method for producing a poly(ester)carbonate of the present invention, any carbonate ester commonly used in the production of poly(ester)carbonates can be used.

Examples of carbonate esters include esters of aryl groups having 6 to 10 carbon atoms, aralkyl groups, or alkyl groups having 1 to 4 carbon atoms, which may be substituted. Specific examples include diphenyl carbonate, ditolyl carbonate, bis(chlorophenyl) carbonate, m-cresyl carbonate, dinaphthyl carbonate, bis(diphenyl) carbonate, dimethyl carbonate, diethyl carbonate, and dibutyl carbonate, with diphenyl carbonate being preferred.

<Monomer (Dicarboxylic Acid or Ester-Forming Derivative Thereof)>
When the method for producing a poly(ester)carbonate of the present invention is a method for producing a polyestercarbonate, the dicarboxylic acid or an ester-forming derivative thereof used in the step of obtaining an intermediate product may be any dicarboxylic acid or an ester-forming derivative thereof known for producing an intermediate product commonly used in this field.

Examples of dicarboxylic acids include aliphatic dicarboxylic acids such as malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, methylmalonic acid, and ethylmalonic acid, monocyclic aromatic dicarboxylic acids such as phthalic acid, isophthalic acid, and terephthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,8-naphthalenedicarboxylic acid, anthracene dicarboxylic acid, phenanthrene dicarboxylic acid, 2,2'-bis(carboxymethoxy)-1,1'-binaphthyl, 9,9-bis(carboxymethyl)fluorene, 9,9-bis(2-carboxyethyl)fluorene, 9,9-bis(1-carboxyethyl)fluorene, and 9,9-bis(1-carboxypropyl)fluorene. Examples of the dicarboxylic acids include polycyclic aromatic dicarboxylic acids such as 9,9-bis(2-carboxypropyl)fluorene, 9,9-bis(2-carboxy-1-methylethyl)fluorene, 9,9-bis(2-carboxy-1-methylpropyl)fluorene, 9,9-bis(2-carboxybutyl)fluorene, 9,9-bis(2-carboxy-1-methylbutyl)fluorene, 9,9-bis(5-carboxypentyl)fluorene, and 9,9-bis(carboxycyclohexyl)fluorene; biphenyl dicarboxylic acids such as 2,2'-biphenyl dicarboxylic acid; alicyclic dicarboxylic acids such as 1,4-cyclohexane dicarboxylic acid and 2,6-decalin dicarboxylic acid; and isophthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, and 2,2'-bis(carboxymethoxy)-1,1'-binaphthyl are preferred. These may be used alone or in combination of two or more. In addition, as the ester-forming derivative, acid chlorides of the above carboxylic acids, and esters such as methyl esters, ethyl esters, and phenyl esters may be used.

As the dicarboxylic acid, for example, a compound represented by the following formula [3] is also preferably used.
(In the above formula [3], R ¹ and R ² each independently represent a hydrocarbon group having 1 to 10 carbon atoms which may contain an aromatic group, and n and m each independently represent an integer of 0 or more. R ³ to R ¹⁰ each independently represent a hydrogen atom, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, or a hydrocarbon group having 1 to 20 carbon atoms which may contain an aromatic group.)

Examples of the dicarboxylic acid represented by the above formula [3] or an ester-forming derivative thereof include 2,2'-dicarboxy-1,1'-binaphthyl, 2,2'-bis(carboxymethoxy)-1,1'-binaphthyl, 2,2'-bis(2-carboxyethoxy)-1,1'-binaphthyl, 2,2'-bis(3-carboxypropoxy)-1,1'-binaphthyl, and 2,2'-dimethoxycarbonyl-1,1'-binaphthyl. , 2,2'-bis(methoxycarbonylmethoxy)-1,1'-binaphthyl, 2,2'-bis(2-methoxycarbonylethoxy)-1,1'-binaphthyl, 2,2'-bis(3-methoxycarbonylpropoxy)-1,1'-binaphthyl, 2,2'-diethoxycarbonyl-1,1'-binaphthyl, 2,2'-bis(ethoxycarbonylmethoxy)-1,1'-binaphthyl, 2,2'-bis(2-ethoxycarbonylpropoxy)-1,1'-binaphthyl, 2,2'-bis(3-ethoxycarbonylpropoxy)-1,1'-binaphthyl, 2,2'-diphenoxycarbonyl-1,1'-binaphthyl, 2,2'-bis(phenoxycarbonylmethoxy)-1,1'-binaphthyl, 2,2'-bis(2-phenoxycarbonylethoxy)-1,1'-binaphthyl, 2,2'-bis(3-phenoxycarbonylpropoxy)-1,1'-binaphthyl, Examples of the tert-butoxycarbonyl-1,1'-binaphthyl include 2,2'-di-tert-butoxycarbonyl-1,1'-binaphthyl, 2,2'-bis(tert-butoxycarbonylmethoxy)-1,1'-binaphthyl, 2,2'-bis(2-tert-butoxycarbonylethoxy)-1,1'-binaphthyl, and 2,2'-bis(3-tert-butoxycarbonylpropoxy)-1,1'-binaphthyl. Among these, 2,2'-bis(carboxymethoxy)-1,1'-binaphthyl (hereinafter sometimes abbreviated as BCMB) in which R ¹ and R ² are methylene groups, m and n are 1, and R ³ to R ¹⁰ are hydrogen atoms, or an ester-forming derivative thereof is most preferred.

(Component B: a dye having one absorption maximum at 650 to 750 nm)
The dye used as component B in the present invention is a dye having one absorption maximum at 650 to 750 nm. The content of component B is 0.001 to 0.2 parts by weight, preferably 0.002 to 0.15 parts by weight, and more preferably 0.003 to 0.1 parts by weight, relative to 100 parts by weight of component A. If the content of component B is less than 0.001 parts by weight, the near-infrared light absorbency (absorbance) at 700 nm becomes insufficient at 0.2 mm thickness and 1.0 mm thickness. On the other hand, if the content exceeds 0.2 parts by weight, good visible light transmittance at 400 to 650 nm cannot be obtained for molded products having a thickness of 0.2 mm and 1.0 mm.

The colorant can be selected from dyes (organic, inorganic), pigments (organic, inorganic), etc., and is not particularly limited as long as the poly(ester)carbonate resin composition of the present invention can be obtained. As the colorant, it is preferable to use a dye, since dyes do not cause diffuse reflection of light on the particle surface. Examples of dye-based colorants include azo-based colorants, anthraquinone-based colorants, quinoline-based colorants, squarylium-based colorants, phthalocyanine-based colorants, perinone-based colorants, perylene-based colorants, methine-based colorants, and heterocyclic colorants. Among them, phthalocyanine-based colorants and perylene-based colorants are more preferable, since they have high heat resistance and little effect on visible light transmittance.

(Component C: Heat stabilizer)
The poly(ester)carbonate resin composition of the present invention contains at least one heat stabilizer selected from the group consisting of phosphite-based heat stabilizers and phenol-based heat stabilizers, and preferably contains a phosphite-based heat stabilizer. The phosphite-based heat stabilizer improves the heat stability during production or molding, and improves mechanical properties, color, and molding stability. It also has the effect of improving the heat stability and light stability of the absorption characteristics. Note that, when a phosphorus-based heat stabilizer other than the phosphite-based heat stabilizer is used, the effect of improving the heat stability and light stability of the absorption characteristics becomes insufficient.

Examples of phosphite ester-based heat stabilizers include phosphorous acid and its esters. Specific examples include triphenyl phosphite, tris(nonylphenyl)phosphite, tridecyl phosphite, trioctyl phosphite, trioctadecyl phosphite, didecyl monophenyl phosphite, dioctyl monophenyl phosphite, diisopropyl monophenyl phosphite, monobutyl diphenyl phosphite, monodecyl diphenyl phosphite, monooctyl diphenyl phosphite, 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite, tris(diethylphenyl)phosphite, tris(di-iso-propylphenyl)phosphite, tris(di-n-butylphenyl)phosphite, tris(2 ,4-di-tert-butylphenyl) phosphite, tris(2,6-di-tert-butylphenyl) phosphite, distearyl pentaerythritol diphosphite, bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-ethylphenyl) pentaerythritol diphosphite, phenyl bisphenol A pentaerythritol diphosphite, bis(nonylphenyl) pentaerythritol diphosphite, dicyclohexyl pentaerythritol diphosphite, etc. Furthermore, as other phosphite compounds, those which react with dihydric phenols to have a cyclic structure can also be used. For example, 2,2'-methylenebis(4,6-di-tert-butylphenyl)(2,4-di-tert-butylphenyl)phosphite, 2,2'-methylenebis(4,6-di-tert-butylphenyl)(2-tert-butyl-4-methylphenyl)phosphite, 2,2'-methylenebis(4-methyl-6-tert-butylphenyl)(2-tert-butyl-4-methylphenyl)phosphite, 2,2'-ethylidenebis(4-methyl-6-tert-butylphenyl)(2-tert-butyl-4-methylphenyl)phosphite, etc. can be mentioned.

The phenol-based heat stabilizer is not particularly limited as long as it has an antioxidant function, but examples thereof include n-octadecyl-3-(4'-hydroxy-3',5'-di-t-butylphenyl)propionate, tetrakis{methylene-3-(3',5'-di-t-butyl-4-hydroxyphenyl)propionate}methane, distearyl(4-hydroxy-3-methyl-5-t-butylbenzyl)malonate, triethylene glycol-bis{3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate}, 1,6-hexanediol-bis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, pentaerythrityl-tetrakis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, 2,2-thiodiethyl 2,2-thiobis(4-methyl-6-t-butylphenol), 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, tris(3,5-di-t-butyl-4-hydroxybenzyl)isocyanurate, 2,4-bis(octylthio) methyl}-o-cresol, isooctyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,5,7,8-tetramethyl-2(4',8',12'-trimethyltridecyl)chroman-6-ol, 3,3',3",5,5',5"-hexa-t-butyl-a,a',a"-(mesitylene-2,4,6-triyl)tri-p-cresol, etc.

Among these, n-octadecyl-3-(4'-hydroxy-3',5'-di-t-butylphenyl)propionate, pentaerythrityl-tetrakis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, 3,3',3",5,5',5"-hexa-t-butyl-a,a',a'-(mesitylene-2,4,6-triyl)tri-p-cresol, 2,2-thiodiethylenebis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, etc. are preferred.

The content of component C is 0.001 to 0.4 parts by weight, preferably 0.003 to 0.3 parts by weight, and more preferably 0.005 to 0.2 parts by weight, per 100 parts by weight of component A. If the content of component C is less than 0.001 part by weight, the thermal stability and light stability of the absorption characteristics deteriorate. On the other hand, if it exceeds 0.4 parts by weight, the moist heat resistance of the resin composition deteriorates.

(Component D: Benzotriazole-based UV absorber)
The poly(ester)carbonate resin composition of the present invention preferably contains a benzotriazole-based ultraviolet absorber. Examples of the benzotriazole-based ultraviolet absorber include 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-5-tert-octylphenyl)benzotriazole, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(2-hydroxy-3-tert-butyl-5-methylphenyl)-5-chlorobenzotriazole, 2,2'-methylenebiphenyl, and the like. 4-(1,1,3,3-tetramethylbutyl)-6-(2H-benzotriazol-2-yl)phenol, 2-(2-hydroxy-3,5-di-tert-butylphenyl)benzotriazole, 2-(2-hydroxy-3,5-di-tert-butylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3,5-di-tert-amylphenyl)benzotriazole, 2-(2-hydroxy-5-tert-octyl Examples of the copolymer include 2-hydroxyphenyl-2H-benzotriazole skeleton-containing polymers such as 2-(2-hydroxy-5-methacryloxyethylphenyl)-2H-benzotriazole, 2-(2-hydroxy-5-tert-butylphenyl)-benzotriazole, 2-(2-hydroxy-4-octoxyphenyl)-benzotriazole, 2,2'-methylenebis(4-cumyl-6-benzotriazolephenyl), 2,2'-p-phenylenebis(1,3-benzoxazin-4-one), and 2-[2-hydroxy-3-(3,4,5,6-tetrahydrophthalimidomethyl)-5-methylphenyl]benzotriazole, as well as copolymers of 2-(2'-hydroxy-5-methacryloxyethylphenyl)-2H-benzotriazole and vinyl monomers copolymerizable with the monomer, and copolymers of 2-(2'-hydroxy-5-acryloxyethylphenyl)-2H-benzotriazole and vinyl monomers copolymerizable with the monomer. Furthermore, the ultraviolet absorber may be a polymer-type ultraviolet absorber obtained by copolymerizing such an ultraviolet absorbing monomer and/or a light stable monomer with a monomer such as an alkyl (meth)acrylate by adopting a structure of a radically polymerizable monomer compound. Suitable examples of the ultraviolet absorbing monomer include compounds containing a benzotriazole skeleton in the ester substituent of a (meth)acrylic acid ester. Among them, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, as typified by Tinuvin 234 (BASF Japan Ltd.), and 2-(2-hydroxy-3-tert-butyl-5-methylphenyl)-5-chlorobenzotriazole, as typified by Tinuvin 326 (BASF Japan Ltd.), are more preferred.

The content of component D is preferably 0.01 to 2 parts by weight, more preferably 0.03 to 1 part by weight, and even more preferably 0.05 to 0.5 parts by weight, relative to 100 parts by weight of component A. If the content of component D is less than 0.01 part by weight, the effect of improving the light stability of the absorption characteristics may not be significant, while if it exceeds 2 parts by weight, the thermal stability of the resin composition may decrease.

(Other additives)
In order to improve the thermal stability and designability of the poly(ester)carbonate resin composition of the present invention, additives that are used to improve these properties can be advantageously used. These additives will be specifically described below.

(I) Heat Stabilizer Other Than Component C The poly(ester)carbonate resin composition of the present invention may also contain a heat stabilizer other than the above-mentioned phosphite-based heat stabilizer and phenol-based heat stabilizer. Examples of such heat stabilizers include phosphoric acid, phosphonous acid, phosphonic acid and their esters, and tertiary phosphines.

Specific examples of phosphate compounds include tributyl phosphate, trimethyl phosphate, tricresyl phosphate, triphenyl phosphate, trichlorophenyl phosphate, triethyl phosphate, diphenyl cresyl phosphate, diphenyl monoorthoxenyl phosphate, tributoxyethyl phosphate, dibutyl phosphate, dioctyl phosphate, and diisopropyl phosphate, with triphenyl phosphate and trimethyl phosphate being preferred.

Phosphonite compounds include tetrakis(2,4-di-tert-butylphenyl)-4,4'-biphenylene diphosphonite, tetrakis(2,4-di-tert-butylphenyl)-4,3'-biphenylene diphosphonite, tetrakis(2,4-di-tert-butylphenyl)-3,3'-biphenylene diphosphonite, tetrakis(2,6-di-tert-butylphenyl)-4,4'-biphenylene diphosphonite, tetrakis(2,6-di-tert-butylphenyl)-4,3'-biphenylene diphosphonite, tetrakis(2,6-di-tert-butylphenyl)-3,3'-biphenylene diphosphonite, bis(2,4-di-tert-butylphenyl)-4-phenyl-phenylphosphonite, bis Examples of the phosphonite include (2,4-di-tert-butylphenyl)-3-phenyl-phenyl phosphonite, bis(2,6-di-n-butylphenyl)-3-phenyl-phenyl phosphonite, bis(2,6-di-tert-butylphenyl)-4-phenyl-phenyl phosphonite, and bis(2,6-di-tert-butylphenyl)-3-phenyl-phenyl phosphonite. Tetrakis(di-tert-butylphenyl)-biphenylene diphosphonite and bis(di-tert-butylphenyl)-phenyl-phenyl phosphonite are preferred, and tetrakis(2,4-di-tert-butylphenyl)-biphenylene diphosphonite and bis(2,4-di-tert-butylphenyl)-phenyl-phenyl phosphonite are more preferred. Such phosphonite compounds can be used in combination with a phosphite compound having an aryl group substituted with two or more alkyl groups, and are therefore preferred. Examples of the phosphonate compound include dimethyl benzene phosphonate, diethyl benzene phosphonate, and dipropyl benzene phosphonate. Examples of tertiary phosphines include triethylphosphine, tripropylphosphine, tributylphosphine, trioctylphosphine, triamylphosphine, dimethylphenylphosphine, dibutylphenylphosphine, diphenylmethylphosphine, diphenyloctylphosphine, triphenylphosphine, tri-p-tolylphosphine, trinaphthylphosphine, and diphenylbenzylphosphine. A particularly preferred tertiary phosphine is triphenylphosphine. The phosphorus-based heat stabilizer can be used alone or in combination of two or more kinds. Among the phosphorus-based heat stabilizers, it is preferable to use an alkyl phosphate compound, such as trimethyl phosphate. It is also preferable to use such an alkyl phosphate compound in combination with a phosphite compound and/or a phosphonite compound.

Furthermore, as such a heat stabilizer, lactone-based stabilizers such as the reaction product of 3-hydroxy-5,7-di-tert-butyl-furan-2-one and o-xylene are also suitable examples. Details of such stabilizers are described in JP-A-7-233160. Such a compound is commercially available as Irganox HP-136 (trademark, manufactured by CIBA SPECIALTY CHEMICALS), and this compound can be used. Furthermore, stabilizers in which this compound is mixed with various phosphite compounds and hindered phenol compounds are commercially available. For example, Irganox HP-2921 manufactured by the same company is a suitable example. The content of the lactone-based stabilizer is preferably 0.0005 to 0.05 parts by weight, more preferably 0.001 to 0.03 parts by weight, per 100 parts by weight of component A. Examples of other stabilizers include sulfur-containing stabilizers such as pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tetrakis (3-laurylthiopropionate), and glycerol-3-stearylthiopropionate. The content of such sulfur-containing stabilizers is preferably 0.001 to 0.1 parts by weight, more preferably 0.01 to 0.08 parts by weight, based on 100 parts by weight of component A. An epoxy compound can be blended into the poly(ester)carbonate resin composition of the present invention as necessary. Such an epoxy compound is blended for the purpose of suppressing mold corrosion, and basically any compound having an epoxy functional group can be used. Specific examples of preferred epoxy compounds include 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylcarboxylate, 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, copolymer of methyl methacrylate and glycidyl methacrylate, copolymer of styrene and glycidyl methacrylate, etc. The content of such epoxy compounds is preferably 0.003 to 0.2 parts by weight, more preferably 0.004 to 0.15 parts by weight, and even more preferably 0.005 to 0.1 parts by weight, per 100 parts by weight of component A.

(II) Mold Release Agent In order to further improve releasability from a mold during melt molding, the poly(ester)carbonate resin composition of the present invention can also contain a mold release agent within a range that does not impair the object of the present invention.

Such release agents include higher fatty acid esters of monohydric or polyhydric alcohols, higher fatty acids, paraffin wax, beeswax, olefin waxes, olefin waxes containing carboxy groups and/or carboxylic anhydride groups, silicone oils, organopolysiloxanes, etc. As higher fatty acid esters, partial or complete esters of monohydric or polyhydric alcohols having 1 to 20 carbon atoms and saturated fatty acids having 10 to 30 carbon atoms are preferred. Examples of such partial or complete esters of monohydric or polyhydric alcohols and saturated fatty acids include monoglyceride stearic acid, diglyceride stearic acid, triglyceride stearic acid, monosorbitate stearic acid, stearyl stearate, monoglyceride behenic acid, behenyl behenate, pentaerythritol monostearate, pentaerythritol tetrastearate, pentaerythritol tetrapelargonate, propylene glycol monostearate, stearyl stearate, palmityl palmitate, butyl stearate, methyl laurate, isopropyl palmitate, biphenyl biphenate, sorbitan monostearate, and 2-ethylhexyl stearate. Among these, monoglyceride stearic acid, triglyceride stearic acid, pentaerythritol tetrastearate, and behenyl behenate are preferably used. As the higher fatty acid, a saturated fatty acid having 10 to 30 carbon atoms is preferred. Such fatty acids include myristic acid, lauric acid, palmitic acid, stearic acid, and behenic acid.

These release agents may be used alone or in combination of two or more. The content of such release agents is preferably 0.01 to 5 parts by weight per 100 parts by weight of component A.

<Method of producing resin composition>
Any method may be used to produce the poly(ester)carbonate resin composition of the present invention. For example, the components and optionally other components may be premixed, then melt-kneaded, and pelletized. Examples of premixing means include a Nauta mixer, a V-type blender, a Henschel mixer, a mechanochemical device, and an extrusion mixer. In premixing, granulation may be performed using an extrusion granulator or a briquetting machine. After premixing, the mixture is melt-kneaded using a melt kneader such as a vented twin-screw extruder, and pelletized using a pelletizer or other device. Other examples of the melt kneader include a Banbury mixer, a kneading roll, and a thermostatic stirring vessel, but a vented twin-screw extruder is preferred. Alternatively, the components and optionally other components may be fed independently to a melt kneader such as a twin-screw extruder without premixing.

<About molded products>
The poly(ester)carbonate resin composition of the present invention obtained as described above can be injection molded into various products. Furthermore, it is also possible to directly mold the resin melt-kneaded in an extruder into sheets, films, irregular extrusion molded products, and injection molded products without passing through pellets. In such injection molding, molded products can be obtained using not only ordinary molding methods but also injection molding methods such as injection compression molding, injection press molding, gas-assisted injection molding, foam molding (including injection of supercritical fluid), insert molding, in-mold coating molding, heat-insulating mold molding, rapid heating and cooling mold molding, two-color molding, sandwich molding, and ultra-high speed injection molding, depending on the purpose. The advantages of these various molding methods are already widely known. In addition, molding can be performed using either a cold runner method or a hot runner method. In addition, the resin composition of the present invention can be extrusion molded into various irregular extrusion molded products and sheets.

The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples. Note that "parts" are parts by weight unless otherwise specified. Evaluations were performed using the following methods.

[Evaluation of Resin Composition]
1. Absorbance at 700 nm For a continuous molded product having a thickness of 0.2 mm produced by the following method, the spectral light transmittance was measured in the range of 300 to 2500 nm using an ultraviolet-visible-near infrared spectrophotometer (V-770 manufactured by JASCO Corporation). From the obtained spectrum, the light transmittance T(0.2) at 700 nm was read. Furthermore, the absorbance Ai(0.2) was calculated from the following formula (1).
Absorbance(Ai(0.2))=-log10(T(0.2)/100) (1)

2. Thermal stability of absorption characteristics The absorbance Ai(1.0) of a continuous molded product with a thickness of 1.0 mm was calculated using the same method as for "absorbance at 1.700 nm". The absorbance Ar(1.0) of a retention molded product was calculated using the same method. When Ar(1.0)/Ai(1.0) was 0.9 or more, it was marked with ⊚, when it was 0.8 or more and less than 0.9, it was marked with ◯, and when it was less than 0.8, it was marked with ×.

3. Photostability of Absorption Characteristics The absorbance Ax(1.0) of a 1.0 mm thick light-exposed sample was calculated using the same method as for "absorbance at 1.700 nm." Ax(1.0)/Ai(1.0) of 0.9 or more was marked with ⊚, 0.8 or more but less than 0.9 was marked with ◯, and less than 0.8 was marked with ×.

4. Initial optical properties The spectral light transmittance was measured for continuous molded products having thicknesses of 0.2 mm and 1.0 mm using the same method as for "absorbance at 1.700 nm". From the obtained spectral spectra, the average light transmittances Ti(0.2) and Ti(1.0) at 400 to 650 nm for continuous molded products having thicknesses of 0.2 mm and 1.0 mm were calculated. The cases where Ti(0.2) ≧ 60 and Ai(0.2) ≧ 0.1 or Ti(1.0) ≧ 60 and Ai(1.0) ≧ 0.1 were satisfied were marked with ○, and the cases where they were not satisfied were marked with ×.

5. Wet heat resistance of resin composition (viscosity average molecular weight)
The viscosity average molecular weight (M _i ) of the resin pellets (untreated product) and the viscosity average molecular weight (M _h ) of the resin pellets (moisture heat treated product) prepared by the method described below were measured by the method described below. Cases where _{M 0} -M ₁ <1,000 was satisfied were marked with ◯, and cases where this was not satisfied were marked with ×.
The viscosity average molecular weight (M) was determined by first determining the specific viscosity (η _SP ) calculated by the following formula using an Ostwald viscometer from a solution prepared by dissolving 0.7 g of pellets in 100 ml of methylene chloride at 20° C.:
Specific viscosity (η _SP )=(t−t ₀ )/t ₀
[ _t0 is the number of seconds that methylene chloride falls, and t is the number of seconds that the sample solution falls]
From the determined specific viscosity (η _SP ), was calculated according to the following formula.
η _SP /c = [η] + 0.45 × [η] ² c (where [η] is the intrinsic viscosity)
[η] = 1.23 × 10 ⁻⁴ M ^0.83
c=0.7

[Examples 1 to 20, Comparative Examples 1 to 5]
[Preparation of resin pellets]
Based on the components and amounts shown in Tables 2 and 3, various compounding components were mixed using a tumbler and melt-kneaded at a cylinder temperature of 270°C using a twin-screw extruder (TEX30α, manufactured by The Japan Steel Works, Ltd.) to obtain various pellets. The components used are as follows:

[Production of molded products by injection molding]
The pellets obtained by the above method were dried in a hot air circulation dryer at 120°C for 5 hours, and then test pieces were molded using an injection molding machine (NEX140IV injection molding machine manufactured by Nissei Plastic Industrial Co., Ltd.) under conditions of a cylinder temperature of 300°C and a mold temperature of 120°C. Molding was performed continuously, and after injection was stopped for 10 minutes while resin was present in the cylinder, molding was performed again. Continuous molded products were those molded continuously without stopping injection midway, and retention molded products were those molded after injection was stopped for 10 minutes while resin was present in the cylinder.

[Light exposure treatment of molded products]
The continuous molded product obtained by the above method was subjected to light exposure treatment for 1000 hours using a xenon weather meter (NX75Z, Suga Test Instruments Co., Ltd.) under conditions of a black panel temperature of 63°C, a tank temperature of 50°C, a relative humidity of 50%, and an irradiation intensity of 0.35 W/ ^m2 (@340 nm). The molded product was used as a light-exposed product.

[Wet heat treatment of pellets]
The resin pellets obtained by the above method were subjected to a moist heat treatment for 1000 hours under conditions of a temperature of 80° C. and a humidity of 85% using a thermohygrostat (PR-3J, manufactured by Espec Corporation). The pellets were used as moist heat treated pellets.

(Component A)
A-1: Poly(ester)carbonate resin prepared by the following production method BPEF 30.00 kg, dimethyl terephthalate (DMT) 3.32 kg, diphenyl carbonate (DPC) 11.72 kg, titanium tetrabutoxide 2.9 g were charged into a stirring tank (first tank) with a rectification tower. After that, nitrogen replacement was performed three times, and the jacket was heated to 180 ° C. to melt the raw material. After complete dissolution, the pressure was reduced to 80 kPa over 20 minutes, and at the same time, the jacket was heated to 260 ° C. at a rate of 60 ° C. / hr to perform an ester exchange reaction. When the distillation amount of the by-product monohydroxy compound reached 7 L (67% of the theoretical amount), nitrogen was gradually sealed and pressurized to 0.15 MPa. Then, the prepolymer was sent from the first tank to a stirring tank (second tank) without a rectification tower. In the second tank, the pressure was reduced to 40 kPa over 20 minutes and further to 0.13 kPa over 100 minutes while the jacket was kept at 260° C., and a polymerization reaction was carried out for 30 minutes under the conditions of 260° C. and 0.13 kPa or less. After completion of the reaction, the produced poly(ester)carbonate resin was discharged while being pelletized.

A-2: Poly(ester)carbonate resin prepared by the following production method A poly(ester)carbonate resin was prepared in the same manner as in A-1, except that 30.00 kg of BPEF, 2.49 kg of DMT, 0.83 kg of dimethyl isophthalate (DMI), 11.72 kg of DPC, and 2.9 g of titanium tetrabutoxide were charged into a stirring tank equipped with a rectification column (first tank).

A-3: Poly(ester)carbonate resin prepared by the following production method. A poly(ester)carbonate resin was prepared in the same manner as in A-1, except that 30.00 kg of BPEF, 3.32 kg of DMT, 12.82 kg of DPC, and 2.9 g of titanium tetrabutoxide were charged into a stirring tank equipped with a rectification column (first tank).

A-4: Poly(ester)carbonate resin prepared by the following production method BPEF 14.66 kg, 3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane (SPG) 5.36 kg, 4,4'-(3,3,5-trimethylcyclohexylidene)bisphenol (BisTMC) 5.28 kg, DPC 15.15 kg, and 5.61 mL of sodium bicarbonate aqueous solution with a concentration of 60 mmol/L as a catalyst were heated to 180°C under a nitrogen atmosphere and melted. Then, the reduced pressure was adjusted to 20 kPa over 10 minutes. The temperature was raised to 250°C at a rate of 60°C/hr, and after the outflow amount of phenol reached 70%, the pressure inside the reactor was reduced to 133 Pa or less over 1 hour. The reaction was carried out for a total of 3.5 hours with stirring, and after completion of the reaction, the produced poly(ester)carbonate resin was discharged while being pelletized.

A-5: Poly(ester)carbonate resin prepared by the following production method A poly(ester)carbonate resin was prepared in the same manner as in A-4, except that the amounts of BPEF, SPG, and BisTMC were changed to 16.13 kg, 6.43 kg, and 3.17 kg, respectively.
The raw material composition ratio of the obtained component A and the content ratio (molar ratio) of the diol component represented by the general formula [1] are shown in Table 1.

(Component B)
B-1: Perylene dye Lumogen IR-765 (BASF Japan Ltd.)
B-2: Phthalocyanine dye FDR-003 (Yamada Chemical Co., Ltd.)
(Component C)
C-1: Phosphite-based heat stabilizer PEP36 (ADEKA Corporation)
C-2: Phenol-based heat stabilizer AO-50 (ADEKA Corporation)
C-3 (Comparative Example): Phosphate-based heat stabilizer AX-71 (ADEKA Corporation)
(Component D)
D-1: Benzotriazole-based UV absorber Seesorb 709 (Shipro Chemical Co., Ltd.)
D-2: Benzotriazole-based ultraviolet absorber Tinuvin 234 (BASF Japan Ltd.)
D-3: Benzotriazole-based ultraviolet absorber Tinuvin 326 (BASF Japan Ltd.)
(Other ingredients)
E: Release agent Rikemal S-100A (Riken Vitamin Co., Ltd.)

The resin compositions of the examples shown in Tables 2 and 3 all have excellent moist heat resistance, wavelength selection controllability, and excellent thermal and light stability of absorption characteristics, so they are expected to improve the image quality of lenses used in imaging devices such as smartphones and in-vehicle cameras.

Claims (8)

A resin composition comprising 100 parts by weight of (A) a poly(ester)carbonate resin (component A) containing, as a monomer component, a diol component represented by the following general formula [1], (B) 0.001 to 0.2 parts by weight of a dye (component B) having an absorption maximum in the range of 650 to 750 nm, and (C) 0.001 to 0.4 parts by weight of at least one heat stabilizer (component C) selected from the group consisting of phosphite-based heat stabilizers and phenol-based heat stabilizers, wherein the resin composition has an average light transmittance in the thickness direction at 400 to 650 nm of 60% or more when molded to a thickness of 0.2 mm:
(In the above formula [1], ring Z represents an aromatic group or a condensed polycyclic aromatic group (which may be the same or different), R ^a and R ^b each independently represent a hydrogen atom, a halogen atom, or a hydrocarbon group having 1 to 12 or 1 to 20 carbon atoms which may contain an aromatic group, Ar ¹ and Ar ² each independently represent a hydrogen atom or an aromatic group having 6 to 10 carbon atoms which may contain a substituent, L ¹ and L ² each independently have a divalent linking group, and m and n each independently represent 0 or 1.) The resin composition according to claim 1, characterized in that component A is a poly(ester)carbonate resin containing 15% or more by molar ratio of a diol component represented by the above general formula [1]. The resin composition according to claim 1 or 2, characterized in that component B is a dye containing at least one selected from the group consisting of azo dyes, anthraquinone dyes, quinoline dyes, squarylium dyes, phthalocyanine dyes, perinone dyes, perylene dyes, methine dyes and heterocyclic dyes. The resin composition according to claim 3, characterized in that component B is a dye containing at least one selected from the group consisting of phthalocyanine dyes and perylene dyes. The resin composition according to claim 1 or 2, characterized in that component C is a phosphite-based heat stabilizer. The resin composition according to claim 1 or 2, which contains 0.01 to 2 parts by weight of (D) a benzotriazole-based ultraviolet absorber (D component) per 100 parts by weight of A component. A resin molded product made of the resin composition according to claim 1 or 2. The resin molded product according to claim 7, which is for use in lenses.