JP2024066078A - Film forming apparatus, film forming apparatus driving method, and film forming method - Google Patents

Abstract

To provide a film deposition apparatus capable of adsorbing a substrate to an adsorption member in a stable state; a method for driving the same; and a film deposition method.SOLUTION: A film deposition apparatus includes an electrostatic chuck 31 for adsorbing a surface on the side opposite to a surface on the film deposition side of a substrate; a first support member 41 for supporting the periphery of the substrate at least before or after adsorbing the substrate by the electrostatic chuck 31; and a press member 71 configured to move in a first direction intersecting the surface on the film deposition side of the substrate and for pressing the periphery of the substrate from the side opposite to the surface on the film deposition side of the substrate. The press member 71 overlaps with the substrate when viewed in the first direction in a state separated from the substrate and is at a position distant from the substrate rather than the adsorption surface of the electrostatic chuck 31.SELECTED DRAWING: Figure 1

Description

The present invention relates to a film forming apparatus, a method for driving the film forming apparatus, and a film forming method.

Conventionally, a technique has been known in which a film forming apparatus is provided with an adsorption member that adsorbs the surface of the substrate opposite the film forming surface.

JP 2019-99910 A

In recent years, substrates have become larger, and if the substrate is significantly warped before it is attached to the attachment member, it can be difficult to attach the substrate to the attachment member properly.

The film forming apparatus of the present invention includes an adsorption member for adsorbing a surface of a substrate opposite to a film forming surface thereof;
a first support member that supports a peripheral edge of a surface of the substrate on a film formation side at least either before or after the substrate is attracted to the attraction member;
a pressing member configured to be movable in a first direction intersecting a surface of the substrate on a film-forming side, and pressing a peripheral edge of the substrate from an opposite side to the surface of the substrate on a film-forming side;
Equipped with
The pressing member, when separated from the substrate, overlaps the substrate when viewed in the first direction and is located farther from the substrate than the adsorption surface of the adsorption member.

As described above, according to the present invention, the substrate can be stably adsorbed to the adsorption member.

FIG. FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. FIG. 1 is an explanatory diagram of an organic EL display device.

The following describes in detail the embodiments of the present invention with reference to the drawings. However, unless otherwise specified, the dimensions, materials, shapes, and relative positions of the components described in the embodiments are not intended to limit the scope of the present invention.

(Example)
A film forming apparatus according to an embodiment of the present invention will be described with reference to Figures 1 to 12. In Figures 1 to 3 and 5 to 12, members that operate together are hatched in the same manner to make the operation of each member easier to understand. Although each member is shown in cross section in these figures, the fact that it is hatched does not necessarily mean that the cross section is shown, since each member may be located in different positions on the front and back sides of the paper.

<Configuration of Film Forming Apparatus>
In particular, the overall configuration of the film formation apparatus 1 will be described with reference to Fig. 1. Fig. 1 is a schematic diagram of the entire film formation apparatus. The film formation apparatus 1 includes a chamber 10 and a film formation source 20 provided in the chamber 10. The inside of the chamber 10 is configured so that a vacuum atmosphere or an inert gas atmosphere can be maintained. As the film formation source 20, in addition to an evaporation source that evaporates or sublimes a film formation material, a sputtering cathode for forming a film by sputtering, etc. can be used.

The upper part of the chamber 10 is provided with various mechanisms for aligning the substrate S, which is the target of film formation, with the mask M, which is placed on the surface of the substrate S on the film formation side in order to form a thin film of a desired pattern on the substrate S. In this embodiment, the chamber 10 in which the film formation source 20 is placed is provided with these various mechanisms, but a configuration in which a chamber for aligning the substrate S and the mask M and a chamber equipped with the film formation source are separately provided may be adopted. In this case, after the substrate S and the mask M are aligned in the alignment chamber, the substrate S and the mask M are transported to the chamber equipped with the film formation source and film formation is performed. In this embodiment, the various mechanisms described above are used to peel off the substrate S from the electrostatic chuck 31 as an adsorption member after film formation on the substrate S, but a configuration in which the mechanisms are provided in another chamber may also be adopted.

The various mechanisms for aligning the substrate S and mask M are described below. A base member 11 and a support plate 12 for supporting the various mechanisms are fixed to the ceiling of the chamber 10.

A first lifting mechanism 30 for raising and lowering the electrostatic chuck 31 in the vertical direction is attached to the base member 11. The first lifting mechanism 30 includes a holding member 32 for holding the electrostatic chuck 31, a shaft member 33 for raising and lowering the holding member 32, and a drive source 34 for raising and lowering the shaft member 33. The holding member 32 includes a lifting plate 32a perpendicular to the vertical direction. The specific configuration of the lifting mechanism may be various known technologies such as a ball screw mechanism, and detailed description thereof will be omitted. The electrostatic chuck 31 has an electrode 31a inside, and is configured to generate an electrostatic adsorption force when a voltage is applied to the electrode 31a. Note that various known methods such as a Coulomb force type, a Johnson-Rahbek force type, and a gradient force type may be used as a method for generating an electrostatic adsorption force. The electrostatic chuck 31 adsorbs the surface of the substrate S opposite to the surface on which the film is formed, and holds the substrate S.

The lift plate 32a of the holding member 32 in the first lift mechanism 30 is provided with a second lift mechanism 40 for vertically lifting the substrate S. The second lift mechanism 40 includes a first support member 41 for supporting the periphery of the surface of the substrate S on the film-forming side, a shaft member 42 for lifting the first support member 41, and a drive source 43 for lifting the shaft member 42. The specific configuration of the lift mechanism may be a ball screw mechanism or other known technology, and therefore a detailed description thereof will be omitted. When the lift plate 32a is lifted by the first lift mechanism 30 without operating the second lift mechanism 40, the electrostatic chuck 31 and the substrate S are lifted together. On the other hand, the substrate S can be lifted relative to the electrostatic chuck 31 by operating the second lift mechanism 40.

The film forming apparatus 1 also includes a mask adjustment mechanism 50 as a mask drive unit that adjusts the position of the mask M. The mask adjustment mechanism 50 includes a support part 51 fixed to the ceiling part of the chamber 10, a mask table support part 52 provided at the lower end of the support part 51, and a magnetic field generating coil box 53 fixed to the support part 51. A magnet 55 is provided on the periphery of the mask table 54 as a mask holder that holds the mask M. The mask table 54 is arranged so that the magnet 55 is disposed in the gap between the mask table support part 52 and the magnetic field generating coil box 53. The magnetic field generated by the magnetic field generating coil box 53 is controlled, and the horizontal position of the mask table 54 is adjusted while floating by magnetic levitation. In other words, if the directions perpendicular to the vertical direction and perpendicular to each other are defined as the X and Y directions, and the direction rotating around the vertical direction is defined as the θ direction, the position of the mask table 54 can be adjusted in the X, Y, and θ directions by controlling the magnetic field generated by the magnetic field generating coil box 53.

The mask adjustment mechanism 50 also has a third lifting mechanism for raising and lowering the mask M. This third lifting mechanism is attached to a support plate 12 fixed to the ceiling of the chamber 10, and includes a support member 56 for supporting the mask M, a shaft member 57 for raising and lowering the support member 56, and a drive source 58 for raising and lowering the shaft member 57. The specific configuration of the lifting mechanism can be various known techniques such as a ball screw mechanism, so a detailed description thereof will be omitted. This mask lifting mechanism is used to receive the mask M transported into the chamber 10 and place the mask M on the mask table 54. FIG. 1 shows the state in which the mask M is placed on the mask table 54.

In addition, a fourth lifting mechanism 60 is attached to the base member 11, which vertically raises and lowers a magnetic attraction member 61 that magnetically attracts the substrate S and the mask M via the electrostatic chuck 31 after aligning the substrate S and the mask M. This fourth lifting mechanism 60 includes a holding member 62 that holds the magnetic attraction member 61, and a drive source 63 that raises and lowers the holding member 62. The specific configuration of the lifting mechanism can employ various known techniques such as a ball screw mechanism, so a detailed description thereof will be omitted.

Furthermore, the film forming apparatus 1 according to this embodiment is configured to be movable in a first direction (vertical direction in this embodiment) intersecting the film forming side surface of the substrate S, and is provided with a pressing member 71 that presses the periphery of the substrate S from the side opposite to the film forming side surface of the substrate S. The film forming apparatus 1 also includes a fifth lifting mechanism 70 that raises and lowers the pressing member 71 in the vertical direction, which is the first direction. This fifth lifting mechanism 70 is attached to the lifting plate 32a of the holding member 32 in the first lifting mechanism 30. This fifth lifting mechanism 70 also includes the pressing member 71, a shaft member 72 for raising and lowering the pressing member 71, and a drive source 73 for raising and lowering the shaft member 72. The specific configuration of the lifting mechanism can be various known techniques such as a ball screw mechanism, so a detailed description thereof will be omitted.

When the substrate S is supported by the first support member 41, the pressing member 71 presses the periphery of the substrate S, so that the periphery of the substrate S is sandwiched between the first support member 41 and the pressing member 71. As a result, the periphery of the substrate S becomes horizontal, and the bending of the substrate S, which would have been bent so that the center curved vertically downward due to its own weight when it was only supported by the first support member 41, is eliminated or reduced.

When the pressing member 71 is separated from the substrate S, it overlaps with the substrate S when viewed in the first direction, and is located farther from the substrate S than the attraction surface of the electrostatic chuck 31 (see FIG. 2, for example). When viewed in the first direction, the shaft member 72 is disposed to the side of the electrostatic chuck 31 and outside the substrate S. The electrostatic chuck 31 is provided with a recess 31b into which the pressing member 71 retreats in order to move the pressing member 71 away from the substrate S.

The deposition apparatus 1 also includes a control device 90 for controlling the operation of the deposition source 20 and the various mechanisms described above. The control devices for controlling the various devices are well-known technologies, so detailed explanations will be omitted, but the control device 90 includes a processor such as a CPU, a storage device such as a semiconductor memory or a hard disk, and an input/output interface.

<Film formation method (method of driving film formation apparatus)>
In particular, a film formation method (method of driving the film formation apparatus) using the film formation apparatus 1 will be described with reference to Figures 2 to 12. Figures 2, 3, and 5 to 12 show a portion of Figure 1 in which various mechanisms are provided near the ceiling of the chamber 10. Figure 4 shows the positional relationship of the substrate S, the first support member 41, and the pressing member 71 as viewed from above in the order of operation.

First, the mask M is transported into the chamber 10, and the mask M is placed on the mask stage 54 by the third lifting mechanism. Then, the substrate S is transported into the chamber 10 by the hand unit 80 of the transport robot, and the substrate S is placed on the first support member 41 of the second lifting mechanism 40 (see FIG. 4(a)). As a result, the first support member 41 supports the periphery of the surface of the substrate S on the film formation side (see FIGS. 2 and 4(b)). This is the supporting process. At this time, the substrate S is bent such that its center is curved vertically downward due to its own weight.

After the supporting step, the fifth lifting mechanism 70 lowers the pressing member 71, and the pressing member 71 presses the periphery of the substrate S from the side opposite the film-forming side of the substrate S (pressing step). As a result, as shown in FIG. 3 and FIG. 4(c), the periphery of the substrate S is sandwiched between the first supporting member 41 and the pressing member 71. As a result, the periphery of the substrate S becomes horizontal, and the bending of the substrate S, which had been bent so that the center was curved vertically downward due to its own weight, is eliminated or reduced.

After the pressing process, a moving process is performed in which the substrate S is moved relatively to the position where it is attracted by the electrostatic chuck 31. In this embodiment, the lifting operation of the first support member 41 by the second lifting mechanism 40 and the lifting operation of the pressing member 71 by the fifth lifting mechanism 70 are performed in synchronization, so that the substrate S is lifted and comes into contact with the electrostatic chuck 31 (see FIG. 5).

After the moving step, a pressure release step is performed to release the pressure applied by the pressing member 71. Specifically, the fifth lifting mechanism 70 raises the pressing member 71, and the pressing member 71 retreats to the recess 31b provided in the electrostatic chuck 31 (see FIG. 6). After this pressure release step, the substrate S is attracted to the electrostatic chuck 31 (attraction step). That is, an attraction voltage is applied to the electrode 31a provided in the electrostatic chuck 31, and the substrate S is attracted to the electrostatic chuck 31 by the electrostatic attraction force. Note that after the moving step, a pressure release step may be performed to release the pressure applied by the pressing member 71 after the substrate S is attracted to the electrostatic chuck 31 (attraction step).

In this way, the first support member 41 supports the periphery of the substrate S at least either before or after the substrate S is attracted to the electrostatic chuck 31 as an attracting member. Then, the pressing member 71 presses the periphery of the substrate S from the side opposite the film-forming side of the substrate S, and after the deflection of the substrate S is eliminated or reduced, the substrate S is attracted to the electrostatic chuck 31.

Then, after the substrate S is attracted to the electrostatic chuck 31, an alignment operation is performed to align the substrate S and the mask M. Various known methods can be used for the alignment operation to align the substrate S and the mask M, but a representative example will be described here. Generally, in order to perform alignment, alignment marks (not shown) are provided on the substrate S and the mask M, respectively. Then, the marks on both are photographed by a camera C fixed to the chamber 10, and the amount of misalignment between the two is determined. Then, the horizontal position of at least one of the substrate S and the mask M is adjusted so that these misalignments are eliminated (usually, the amount of misalignment falls within a threshold value). In addition, in order to achieve high-precision alignment in a short time, rough alignment, which roughly aligns the substrates, and fine alignment, which highly aligns the substrates, are generally performed. In rough alignment, a low-resolution but wide-field-of-view camera C is used, and in fine alignment, a narrow-field-of-view but high-resolution camera C is used. Additionally, for the alignment marks mentioned above, separate marks are usually used for rough alignment and fine alignment.

Specifically, after the substrate S is attracted to the electrostatic chuck 31, the electrostatic chuck 31 and the substrate S are lowered together by the first lifting mechanism 30, so that the substrate S and the mask M come into contact with each other (see FIG. 7). In this state, the control device 90 determines the amount of misalignment between the substrate S and the mask M based on the photographic information obtained from the camera C. Then, the electrostatic chuck 31 and the substrate S are raised together by the first lifting mechanism 30, so that the substrate S is slightly separated from the mask M (see FIG. 8). In this state, rough alignment is performed. That is, in this embodiment, the mask adjustment mechanism 50 adjusts the horizontal direction (X, Y, θ directions) of the mask table 54 based on the amount of misalignment, thereby performing rough alignment between the substrate S and the mask M.

After the rough alignment is performed, the electrostatic chuck 31 and the substrate S are lowered together again by the first lifting mechanism 30, so that the substrate S is in contact with the mask M. Then, fine alignment is performed in the same order as the rough alignment. In general, fine alignment is repeated until the amount of misalignment between the substrate S and the mask M falls within a threshold range. Here, the case has been described in which the substrate S and the mask M are in contact with each other, the amount of misalignment between them is determined, and then the substrate S and the mask M are separated to perform rough alignment and fine alignment. However, the electrostatic chuck 31 and the substrate S can also be lowered together by the first lifting mechanism 30, so that the substrate S and the mask M are slightly separated from each other, the amount of misalignment between them is determined, and the rough alignment and fine alignment can be performed in this state.

After the fine alignment is completed, the magnetic attraction member 61 is lowered by the fourth lifting mechanism 60. As a result, the mask M is attracted to the magnetic attraction member 61 via the substrate S and the electrostatic chuck 31. As a result, the substrate S and the mask M are fixed in contact with each other (see FIG. 9). Thereafter, the film formation source 20 forms a thin film of the desired pattern (openings) formed on the mask M on the surface (film formation surface) of the substrate S. In this manner, the film formation process is performed in which a film is formed after the attraction process.

After the film formation process, the second lift mechanism 40 moves the first support member 41 relatively to a position supporting the substrate S (see FIG. 10), and then an adsorption release process is performed in which the electrostatic chuck 31 releases the substrate S from its adsorption. In the adsorption release process, a peeling voltage is applied to the electrode 31a provided on the electrostatic chuck 31. After this adsorption release process, the fifth lift mechanism 70 lowers the pressing member 71, and a post-film formation pressing process is performed in which the pressing member 71 presses the periphery of the substrate S (see FIG. 11).

In addition, after the film formation process, the second lift mechanism 40 moves the first support member 41 relatively to a position where the substrate S is supported (see FIG. 10), and then the fifth lift mechanism 70 lowers the pressing member 71 to press the peripheral edge of the substrate S (see FIG. 11). In this case, after the film formation process, an adsorption release process is performed in which the electrostatic chuck 31 releases the adsorption of the substrate S. When such a process is adopted, the electrostatic chuck 31 releases the adsorption of the substrate S after the peripheral edge of the substrate S is sandwiched between the first support member 41 and the pressing member 71. Therefore, when the adsorption of the substrate S is released, it is possible to further prevent the substrate S from falling or from cracking due to bending of the substrate S.

After these steps, the electrostatic chuck 31 is separated from the substrate S (see FIG. 12), and the substrate S after film formation is transported outside the chamber 10 by the hand unit 80 of the transport robot.

<Method of Manufacturing Electronic Device>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described below. The configuration of an organic EL display device will be shown as an example of an electronic device, and a method for manufacturing the organic EL display device will be illustrated.

First, the organic EL display device to be manufactured will be described. Figure 13(a) shows an overall view of the organic EL display device 150, and Figure 13(b) shows the cross-sectional structure of one pixel.

As shown in FIG. 13(a), a plurality of pixels 152 each including a plurality of light-emitting elements are arranged in a matrix in a display area 151 of an organic EL display device 150. Although details will be described later, each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel here refers to the smallest unit that allows a desired color to be displayed in the display area 151. In the case of the organic EL display device according to this embodiment, the pixel 152 is configured by a combination of a first light-emitting element 152R, a second light-emitting element 152G, and a third light-emitting element 152B that emit light different from each other. The pixel 152 is often configured by a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color.

Figure 13 (b) is a schematic partial cross-sectional view taken along line A-B in Figure 13 (a). Pixel 152 is made up of a plurality of light-emitting elements, and each light-emitting element has a first electrode (anode) 154, a hole transport layer 155, one of light-emitting layers 156R, 156G, and 156B, an electron transport layer 157, and a second electrode (cathode) 158 on a substrate 153. Of these, hole transport layer 155, light-emitting layers 156R, 156G, and 156B, and electron transport layer 157 are organic layers. In this embodiment, light-emitting layer 156R is an organic EL layer that emits red light, light-emitting layer 156G is an organic EL layer that emits green light, and light-emitting layer 156B is an organic EL layer that emits blue light. Light-emitting layers 156R, 156G, and 156B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. In addition, the first electrode 154 is formed separately for each light-emitting element. The hole transport layer 155, the electron transport layer 157, and the second electrode 158 may be formed in common for the multiple light-emitting elements 152R, 152G, and 152B, or may be formed for each light-emitting element. In order to prevent the first electrode 154 and the second electrode 158 from being shorted by foreign matter, an insulating layer 159 is provided between the first electrodes 154. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 140 is provided to protect the organic EL element from moisture and oxygen.

13B, the hole transport layer 155 and the electron transport layer 157 are shown as single layers, but depending on the structure of the organic EL display element, they may be formed of multiple layers including a hole blocking layer and an electron blocking layer.
A hole injection layer having an energy band structure capable of smoothly injecting holes from the second electrode 154 to the hole transport layer 155 can be formed. Similarly, an electron injection layer can be formed between the second electrode 158 and the electron transport layer 157.

Next, we will explain in detail an example of a manufacturing method for an organic EL display device.

First, a circuit (not shown) for driving the organic EL display device and a substrate 153 on which a first electrode 154 are formed are prepared.

Acrylic resin is formed by spin coating on the substrate 153 on which the first electrode 154 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the area where the first electrode 154 is formed, forming an insulating layer 159. This opening corresponds to the light-emitting area where the light-emitting element actually emits light.

The substrate 153 with the patterned insulating layer 159 is carried into a first organic material deposition apparatus, the substrate is held by a substrate support table and an electrostatic chuck, and a hole transport layer 155 is deposited as a common layer on the first electrode 154 in the display area. The hole transport layer 155 is deposited by vacuum deposition. In practice, the hole transport layer 155 is formed to be larger than the display area 151, so no high-resolution mask is required.

Next, the substrate 153 on which the hole transport layer 155 has been formed is carried into a second organic material deposition apparatus and held by a substrate support table and an electrostatic chuck. The substrate and the mask are aligned, the substrate is placed on the mask, and a red-emitting light-emitting layer 156R is deposited on the portion of the substrate 153 where the red-emitting element is to be located.

Similar to the deposition of the light-emitting layer 156R, the third organic material deposition apparatus deposits the light-emitting layer 156G that emits green light, and the fourth organic material deposition apparatus deposits the light-emitting layer 156B that emits blue light. After the deposition of the light-emitting layers 156R, 156G, and 156B is completed, the fifth deposition apparatus deposits the electron transport layer 157 over the entire display area 151. The electron transport layer 157 is formed as a layer common to the three light-emitting layers 156R, 156G, and 156B.

The substrate on which the electron transport layer 157 has been formed is moved by a metallic deposition material deposition device to deposit the second electrode 158.

Then, the substrate is transferred to a plasma CVD device to deposit a protective layer 140, completing the organic EL display device 150.

If the substrate 153 on which the insulating layer 159 is patterned is exposed to an atmosphere containing moisture or oxygen from the time it is carried into the film-forming apparatus until the formation of the protective layer 140 is completed, the light-emitting layer made of the organic EL material may be deteriorated by moisture or oxygen. Therefore, in this embodiment, the substrate is carried in and out of the film-forming apparatus in a vacuum atmosphere or an inert gas atmosphere.

<Advantages of the film forming apparatus according to this embodiment>
According to the film forming apparatus 1 of this embodiment, by providing the pressing member 71, it is possible to suppress bending of the substrate S before the substrate S is attracted to the electrostatic chuck 31. This makes it possible to attract the substrate S in a stable state to the electrostatic chuck 31. In other words, it is possible to suppress the substrate S from being attracted to the electrostatic chuck 31 in a wavy or partially deformed state.

1: Film forming apparatus 10: Chamber 11: Base member 12: Support plate 20: Film forming source 30: First lifting mechanism 31: Electrostatic chuck 31a: Electrode 31b: Recess 32: Holding member 32a: Lifting plate 33: Shaft member 34: Driving source 40: Second lifting mechanism 41: First supporting member 42: Shaft member 43: Driving source 50: Mask adjustment mechanism 51: Support portion 52: Mask table receiving portion 53: Magnetic field generating coil box 54: Mask table 55: Magnet 56: Support member 57: Shaft member 58: Driving source 60: Fourth lifting mechanism 61: Magnetic attraction member 62: Holding member 63: Driving source 70: Fifth lifting mechanism 71: Pressing member 72: Shaft member 73: Driving source 80: Hand portion 90: Control device C: Camera M: Mask S: Substrate

Claims (15)

an adsorption member for adsorbing a surface of the substrate opposite to a surface on which the film is formed;
a first support member that supports a peripheral edge of a surface of the substrate on a film formation side at least either before or after the substrate is attracted to the attraction member;
a pressing member configured to be movable in a first direction intersecting a surface of the substrate on a film-forming side, and pressing a peripheral edge of the substrate from an opposite side to the surface of the substrate on a film-forming side;
Equipped with
A film forming apparatus characterized in that, when separated from the substrate, the pressing member overlaps the substrate when viewed in the first direction and is located farther from the substrate than the adsorption surface of the adsorption member. The deposition apparatus according to claim 1, further comprising an axial member for moving the pressing member in the first direction, the axial member being disposed on the outside of the substrate and to the side of the adsorption member when viewed in the first direction. When the substrate is attracted to the attracting member,
3. The film forming apparatus according to claim 1, wherein the substrate is supported by the first support member and pressed by the pressing member at a peripheral edge thereof, the substrate moves relatively to a position where the substrate is attracted by the adsorption member, and after the pressure by the pressing member is released, the substrate is attracted to the adsorption member. When the substrate is attracted to the attracting member,
3. The film forming apparatus according to claim 1, wherein the substrate is supported by the first support member and pressed by the pressing member while the peripheral edge of the substrate is moved relatively to a position where the substrate is attracted to the adsorption member, and after the substrate is attracted to the adsorption member, the pressing force by the pressing member is released. When the suction of the substrate by the suction member is released,
3. The film forming apparatus according to claim 1, wherein while the substrate is adsorbed by the adsorption member, the first support member moves relatively to a position supporting the substrate, and after the adsorption member releases the substrate from adsorption, the substrate is pressed by the pressing member. When the suction of the substrate by the suction member is released,
3. The film forming apparatus according to claim 1, wherein, while the substrate is adsorbed by the adsorption member, the first support member moves relatively to a position supporting the substrate, the substrate is pressed by the pressing member, and then the adsorption of the substrate by the adsorption member is released. The deposition apparatus according to claim 1 or 2, characterized in that the adsorption member is provided with a recess into which the pressing member retreats in order to move the pressing member away from the substrate. The deposition apparatus according to claim 1 or 2, characterized in that the adsorption member has an electrode therein and is configured to generate an electrostatic adsorption force when a voltage is applied to the electrode. A mask holder that holds a mask;
a mask driving unit that moves the mask holding unit in a levitated state by magnetic levitation,
3. The film forming apparatus according to claim 1, wherein the mask driving unit moves the mask holding unit while the suction member suctions the substrate, thereby aligning the substrate and the mask. The film forming apparatus according to claim 1 or 2, further comprising a film forming source for forming a thin film on the substrate adsorbed by the adsorption member. an adsorption member for adsorbing a surface of the substrate opposite to a surface on which the film is formed;
a first support member that supports a peripheral edge of a surface of the substrate on which a film is to be formed;
a pressing member configured to be movable in a first direction intersecting a surface of the substrate on a film-forming side, and pressing a peripheral edge of the substrate from an opposite side to the surface of the substrate on a film-forming side;
A method for driving a film forming apparatus comprising:
a supporting step in which the first support member supports a peripheral edge of the substrate;
a pressing step of pressing a peripheral edge of the substrate by the pressing member after the supporting step;
a moving step of relatively moving the substrate to a suction position by the suction member after the pressing step;
a pressure releasing step of releasing the pressure applied by the pressing member after the moving step;
a suction step of suctioning the substrate by the suction member after the pressing release step;
a film formation step of forming a film after the adsorption step. an adsorption member for adsorbing a surface of the substrate opposite to a surface on which the film is formed;
a first support member that supports a peripheral edge of a surface of the substrate on which a film is to be formed;
a pressing member configured to be movable in a first direction intersecting a surface of the substrate on a film-forming side, and pressing a peripheral edge of the substrate from an opposite side to the surface of the substrate on a film-forming side;
A method for driving a film forming apparatus comprising:
a supporting step in which the first support member supports a peripheral edge of the substrate;
a pressing step of pressing a peripheral edge of the substrate by the pressing member after the supporting step;
a moving step of relatively moving the substrate to a suction position by the suction member after the pressing step;
a suction step of suctioning the substrate by the suction member after the moving step;
a pressure releasing step of releasing the pressure applied by the pressing member after the adsorption step;
a film forming step of forming a film after the pressure releasing step. a chucking release step of releasing the chucking of the substrate by the chucking member after the first support member moves relatively to a position where the first support member supports the substrate after the film forming step;
13. The method of driving a film deposition apparatus according to claim 11, further comprising a post-film deposition pressing step of pressing the peripheral edge of the substrate with the pressing member after the chucking release step. a post-film-deposition pressing step of pressing a peripheral edge of the substrate by the pressing member after the first supporting member moves relatively to a position supporting the substrate after the film-deposition step;
13. The method of driving a film formation apparatus according to claim 11, further comprising, after the post-film formation pressing step, a chucking release step of releasing the chucking of the substrate by the chucking member. A film forming method comprising forming a film on a substrate using the driving method for a film forming apparatus according to claim 11 or 12.

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