JP2023139964A - Ranging device and electronic device - Google Patents
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- 230000003287 optical effect Effects 0.000 claims abstract description 66
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- 239000007788 liquid Substances 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 21
- 229920005989 resin Polymers 0.000 description 21
- 238000005259 measurement Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
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- 238000005457 optimization Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C3/00—Measuring distances in line of sight; Optical rangefinders
- G01C3/02—Details
- G01C3/06—Use of electric means to obtain final indication
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
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Abstract
Description
本開示は、光学素子技術領域に係る。具体的に、測距装置及び電子機器に係る。 The present disclosure relates to the optical element technology area. Specifically, it relates to distance measuring devices and electronic equipment.
被写体の位置、形状の検出を目的とする測距装置は、一般に発光素子、投光光学系、受光素子、受光光学系を含む。ここで、投光光学系と受光光学系は、それぞれ単独に構成され、且つ近接に設置される。例えば、発光素子として、LED（Light Emitting Diode）、LD（Laser Diode）を採用し、受光素子として、PSD（Position Sensitive Detectors、位置検出素子)、CMOSを採用する測距装置がある。また、発光素子として、VCSEL(Vertical Cavity Surface Emitting Laser)を採用し、受光素子として、CMOSなどを採用し、発光と受光ともに、近赤外線であり、それぞれの光学系が、複数のレンズ、光学素子からなる測距装置などがある。これらの測距装置は工場の検査やロボットの位置検出、スマートフォンやタブレット端末等で採用されている。 A distance measuring device whose purpose is to detect the position and shape of a subject generally includes a light emitting element, a light projecting optical system, a light receiving element, and a light receiving optical system. Here, the light projecting optical system and the light receiving optical system are each configured independently and installed close to each other. For example, there are distance measuring devices that use LEDs (Light Emitting Diodes) and LDs (Laser Diodes) as light emitting elements, and PSDs (Position Sensitive Detectors) and CMOS as light receiving elements. In addition, a VCSEL (Vertical Cavity Surface Emitting Laser) is used as a light emitting element, and a CMOS or the like is used as a light receiving element.Both emitting and receiving light are near infrared rays, and each optical system has multiple lenses and optical elements. There are distance measuring devices that consist of These distance measuring devices are used for factory inspections, robot position detection, smartphones, tablets, etc.
測距装置の投光光学系、受光光学系のそれぞれを複数枚のレンズで構成する場合、例えば測距距離をより拡大しようとする場合、受光強度の確保の為に受光光学系のＦｎｏ（レンズの明るさを示す数値）をより明るくする必要があるが、この場合、レンズすなわち測距装置が大型化し、測距装置を搭載する製品サイズにも直結する。また、従来技術において、図１に示すように、投光光学系、受光光学系をそれぞれ独立の光学系として、レンズ１Ａ～３Ａを投光光学系の樹脂枠に取り付け配置し、レンズ１Ｂ～３Ｂを受光光学系の樹脂枠に取り付け配置する場合、装置の光軸方向だけでなく面積方向の小型化にも限界がある。 When each of the light emitting optical system and light receiving optical system of a distance measuring device is configured with multiple lenses, for example, when trying to further expand the distance measurement distance, the Fno (lens It is necessary to make the lens brighter (a numerical value indicating the brightness of the lens), but in this case, the lens, that is, the range finder, becomes larger, which directly affects the size of the product in which the range finder is mounted. In addition, in the prior art, as shown in FIG. 1, the light emitting optical system and the light receiving optical system are each independent optical system, and the lenses 1A to 3A are attached to the resin frame of the light emitting optical system, and the lenses 1B to 3B are arranged as independent optical systems. When mounting and arranging the light-receiving optical system on a resin frame, there is a limit to the miniaturization of the device not only in the optical axis direction but also in the area direction.
また、従来技術において、測距装置の光学系にメタレンズを採用する案も提案されているが、投光光学系のみに適用した案であり、受光光学系も含む測距装置全体としての小型化、高精度化、環境変化に対する信頼性向上、最適化に対しては更なる改善の余地がある。 In addition, in the prior art, a proposal has been made to adopt a metalens in the optical system of a distance measuring device, but this proposal is applied only to the light emitting optical system, and it is difficult to miniaturize the entire distance measuring device including the light receiving optical system. There is room for further improvement in terms of , higher precision, improved reliability against environmental changes, and optimization.
更に受光素子の結像点の間隔から距離を算出する測距装置の場合、発光素子と受光素子の相対的な位置と傾きの精度が測距精度に大きく影響を与える。例えば外部環境変化(温湿度変化)による樹脂枠の変形や樹脂枠の取り付け板の変形の影響で投光光学系、受光光学系の相対的なシフト・チルト変化が発生し、その変化が測距精度に大きく影響する問題がある。対策として煩雑なキャリブレーションや樹脂枠材料の線膨張係数を配慮して特殊な材料にする、発光素子を増やす等の対策が必要であった。
例えば、投光光学系と受光光学系の間が線膨張係数７０ppm/℃の樹脂で構成され、距離が５mmの場合、温度が３０℃変化すると、投光/受光系間隔変化が７０×１０－６×５×３０＝１０．５×１０‐３(mm)発生する。発光素子や受光素子の基板の線膨張係数は、樹脂枠の略1/10程度であり、温度変化時の結像点の位置ずれは、ほぼ上記の投光/受光系間隔変化量で決まる。
Furthermore, in the case of a distance measuring device that calculates distance from the interval between image points of light receiving elements, the accuracy of the relative position and inclination of the light emitting element and the light receiving element greatly influences the distance measuring accuracy. For example, relative shift/tilt changes in the light emitting optical system and light receiving optical system occur due to deformation of the resin frame due to changes in the external environment (changes in temperature and humidity) or deformation of the mounting plate of the resin frame, and these changes result in distance measurement. There is a problem that greatly affects accuracy. Countermeasures required included complicated calibration, using a special material with the linear expansion coefficient of the resin frame material in mind, and increasing the number of light emitting elements.
For example, if the distance between the light emitting optical system and the light receiving optical system is made of resin with a coefficient of linear expansion of 70 ppm/°C and the distance is 5 mm, if the temperature changes by 30°C, the distance between the light emitting and light receiving systems will change by 70 × 10 - 6 x 5 x 30 = 10.5 x 10 -3 (mm) occurs. The linear expansion coefficient of the substrate of the light emitting element and the light receiving element is about 1/10 of that of the resin frame, and the positional shift of the imaging point due to temperature change is determined approximately by the above-mentioned amount of change in the distance between the light emitting and light receiving systems.
上記の温度変化時の結像点の位置ずれが、そのまま測距誤差となり、環境変化時対象距離の検出誤差に直結する。 The above-mentioned positional shift of the imaging point when the temperature changes causes a distance measurement error, which is directly linked to a detection error of the target distance when the environment changes.
本開示の少なくともの一つの実施例は、測距装置の小型化及び／温湿度変化による測距精度低下を抑制できる測距装置及び電子機器を提供する。 At least one embodiment of the present disclosure provides a distance measuring device and an electronic device that can reduce the size of the distance measuring device and/or suppress a decrease in distance measuring accuracy due to changes in temperature and humidity.
上記の問題を解決するために、本開示は、以下のように実現される。
第一の態様として、本開示実施例は、測距装置であって、投光光学系と受光光学系を含み、
前記投光光学系は、第一の基板上に配置される第一のレンズユニットと前記第一の基板と異なる第三の基板上に配置される発光光源とを含み、
前記受光光学系は、第二の基板上に配置される第二のレンズユニットと前記第二の基板と異なる第四の基板上に配置される受光素子とを含み、
前記第一のレンズユニットと第二のレンズユニットとの参照波長は、同一である。
前記第１の基板と第２の基板は異なる樹脂枠を介在しないで接着固定される。
第一の態様として、本開示実施例は、電子機器であって、前記第一の態様の前記測距装置を含む。
In order to solve the above problems, the present disclosure is implemented as follows.
As a first aspect, an embodiment of the present disclosure is a distance measuring device including a light projecting optical system and a light receiving optical system,
The light projection optical system includes a first lens unit disposed on a first substrate and a light emitting source disposed on a third substrate different from the first substrate,
The light receiving optical system includes a second lens unit disposed on a second substrate and a light receiving element disposed on a fourth substrate different from the second substrate,
The reference wavelengths of the first lens unit and the second lens unit are the same.
The first substrate and the second substrate are adhesively fixed without intervening different resin frames.
As a first aspect, an embodiment of the present disclosure is an electronic device that includes the distance measuring device of the first aspect.
従来技術に比べて、本開示実施例に提供される測距装置及び電子機器は、投光用メタレンズと受光用メタレンズを異なる樹脂枠を介在しないで配置するため、光学系の光軸方向の厚みが大幅に減少されるのみではなく、光軸方向と垂直の断面積も小型化できる。また、本開示実施例は、温湿度変化による測距精度低下を抑制する。 Compared to the conventional technology, the distance measuring device and electronic device provided in the embodiments of the present disclosure have a light emitting metalens and a light receiving metalens arranged without intervening different resin frames, so that the thickness of the optical system in the optical axis direction is reduced. Not only is this significantly reduced, but the cross-sectional area perpendicular to the optical axis direction can also be made smaller. Further, the embodiments of the present disclosure suppress a decrease in distance measurement accuracy due to changes in temperature and humidity.
以下、本開示の実施例の図面とともに、本開示の実施例の技術手段を明確且つ完全的に記載する。明らかに、記載する実施例は、本開示の実施例の一部であり、全てではない。本開示の実施例に基づき、当業者が創造性のある作業をしなくても為しえる全ての他の実施例は、いずれも本開示の保護範囲に属するものである。 In the following, the technical means of the embodiments of the present disclosure will be clearly and completely described together with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments that can be made by those skilled in the art based on the embodiments of the present disclosure without any creative work shall fall within the protection scope of the present disclosure.
本開示の明細書及び特許請求の範囲における用語「第１」、「第２」などは、類似した対象を区別するためのものであり、必ずしも特定の順序又は優先順位を説明するためのものではない。ここで説明した本開示の実施例が、例えばここでの図示又は説明以外の順序でも実施できるように、このように使用されたデータは、適宜入れ替えてもよいと理解すべきである。尚且つ、用語「第１」、「第２」などにより区別される対象は、通常同種なものであり、対象な数を限定しない。例えば、第一対象は、一つでもよく、複数でもよい。なお、明細書及び特許請求の範囲における「及び／又は」は、接続対象の少なくとも１つを表す。文字「／」は、一般に、前後関連な対象が「或いは」の関係となることを示す。 The terms "first", "second", etc. in the specification and claims of the present disclosure are used to distinguish between similar objects and are not necessarily used to describe a particular order or priority. do not have. It is to be understood that the data so used may be interchanged where appropriate, such that the embodiments of the disclosure described herein may be practiced, for example, in an order other than as illustrated or described herein. In addition, the objects distinguished by the terms "first", "second", etc. are usually of the same type, and the number of objects is not limited. For example, there may be one or more first objects. Note that "and/or" in the specification and claims represents at least one connection target. The character "/" generally indicates that context-related objects have an "or" relationship.
本開示実施例による測距装置は、測距装置の小型化と温湿度変化による測距精度低下を抑制できる。投光・受光光学系のレンズの代わりに、光学系を提供する。具体的に、少なくとも１枚の透明基板にナノスケール（nano scale）の異なる微細構造の投光光学系と受光光学系のメタレンズを配置し、各光学系の光軸方向の厚みと断面積を小型化する。また、本開示実施例では、投光・受光レンズを異なる樹脂枠を介在しないで配置するため、温湿度変化による相対的なシフト・チルト誤差や画角変化、歪曲変化も抑制して、環境変化による測距精度低下を抑制する。例えは、通常の樹脂枠の線膨張係数７０ppm/℃程度に対して、透明基板を例えば光学ガラスのBK7にすると７．５ppm/℃程度となり、温度変化による投光・受光間隔変化を略1/10程度にすることが可能となる。 The distance measuring device according to the embodiment of the present disclosure can reduce the size of the distance measuring device and suppress a decrease in distance measuring accuracy due to changes in temperature and humidity. An optical system is provided in place of the lens of the light emitting/receiving optical system. Specifically, the metalens of the light emitting optical system and the light receiving optical system are arranged on at least one transparent substrate with different microstructures on the nano scale, and the thickness and cross-sectional area of each optical system in the optical axis direction are reduced. become In addition, in the disclosed embodiment, since the light emitting and light receiving lenses are arranged without intervening different resin frames, relative shift/tilt errors, changes in the angle of view, and distortion changes due to changes in temperature and humidity can be suppressed, and environmental changes can be suppressed. This suppresses the decrease in distance measurement accuracy due to For example, the linear expansion coefficient of a normal resin frame is about 70 ppm/℃, but if the transparent substrate is made of optical glass BK7, the coefficient of linear expansion is about 7.5 ppm/℃, which means that the change in the light emitting/light receiving interval due to temperature changes is approximately 1/2. It is possible to reduce the number to about 10.
本開示実施例による測距装置は、投光光学系と受光光学系を含む。ここで、前記投光光学系は、第一の基板上に配置される第一のレンズユニットを含み、前記受光光学系は、第二の基板上に配置される第二のレンズユニットを含む。 A distance measuring device according to an embodiment of the present disclosure includes a light projecting optical system and a light receiving optical system. Here, the light projecting optical system includes a first lens unit disposed on a first substrate, and the light receiving optical system includes a second lens unit disposed on a second substrate.
前記第一のレンズユニットと第二のレンズユニットとの参照波長は、同一である。前記第一の基板と第二の基板は、いずれも透明基板である。 The reference wavelengths of the first lens unit and the second lens unit are the same. Both the first substrate and the second substrate are transparent substrates.
また、前記第一の基板と第二の基板の線膨張係数は、一般に、所定の閾値より小さく、例えば、前記第一の基板と第二の基板の線膨張係数は一般に、いずれも樹脂材料より小さい値である。樹脂枠材の線膨張係数が一般に７×１０－５/℃程度なので、閾値として５×１０－５/℃を想定すればよい。オプションとして、前記第一の基板と第二の基板の線膨張係数は、一般に、いずれも３×１０－５/℃より小さければより好ましい。前記第一のレンズユニットと第二のレンズユニットが、それぞれ、複数の微細構造のレンズをそれぞれ含むことができる。このレンズは、具体的に、メタレンズ又は膜レンズ又は液体レンズ又は液晶レンズなどであってもよい。 Further, the linear expansion coefficients of the first substrate and the second substrate are generally smaller than a predetermined threshold value, for example, the linear expansion coefficients of the first substrate and the second substrate are generally both lower than the resin material. It is a small value. Since the linear expansion coefficient of the resin frame material is generally about 7×10 −5 /°C, 5×10 −5 /°C may be assumed as the threshold value. Optionally, it is generally more preferable that the linear expansion coefficients of the first substrate and the second substrate are both smaller than 3×10 −5 /° C. The first lens unit and the second lens unit may each include lenses with a plurality of microstructures. This lens may specifically be a metalens or a membrane lens or a liquid lens or a liquid crystal lens or the like.
前記投光光学系は、前記第一の基板と異なる第三の基板上に配置される発光光源を更に含む。前記受光光学系は、前記第二の基板と異なる第四の基板上に配置される受光素子を更に含む。 The light projection optical system further includes a light emitting source disposed on a third substrate different from the first substrate. The light receiving optical system further includes a light receiving element disposed on a fourth substrate different from the second substrate.
本開示実施例において、前記第一の基板と第二の基板は、同一なもの、或いは、異なるものであってもよい。前記第三の基板と第四の基板も、同一なもの、或いは、異なるものであってもよい。 In the embodiments of the present disclosure, the first substrate and the second substrate may be the same or different. The third substrate and the fourth substrate may also be the same or different.
図２は、前記第一の基板と第二の基板は、異なるものであり、且つ前記第三の基板と第四の基板も異なるものである場合を示す。このとき、第一の基板２１に投光用の第一のレンズユニット２５が配置され、前記第二の基板２２に受光用の第二のレンズユニット２６が配置され、前記第三の基板２３に発光光源が配置され、前記第四の基板２４に受光素子が配置される。また、前記第１の基板２１と第２の基板２２は異なる樹脂枠を介在しないで接着固定される。 FIG. 2 shows a case where the first substrate and the second substrate are different, and the third substrate and the fourth substrate are also different. At this time, a first lens unit 25 for projecting light is placed on the first substrate 21, a second lens unit 26 for receiving light is placed on the second substrate 22, and a second lens unit 26 for receiving light is placed on the third substrate 23. A light emitting source is arranged, and a light receiving element is arranged on the fourth substrate 24. Further, the first substrate 21 and the second substrate 22 are adhesively fixed without intervening different resin frames.
図３は、前記第一の基板と第二の基板は、同一なものであり、且つ前記第三の基板と第四の基板も同一なものである場合を示す。このとき、前記第一の基板と第二の基板は、それぞれ基板２０１の異なる部分である。例えば、基板２０１の第一部分に第一のレンズユニット２５が配置され、基板２０１の第二部分に第二のレンズユニット２６が配置される。前記第三の基板と第四の基板は、それぞれ基板２０３の異なる部分である。例えば、基板２０３の第一部分に発光光源が配置され、前記基板２０３の第二部分に受光素子が配置される。 FIG. 3 shows a case where the first substrate and the second substrate are the same, and the third substrate and the fourth substrate are also the same. At this time, the first substrate and the second substrate are different parts of the substrate 201, respectively. For example, the first lens unit 25 is arranged on the first part of the substrate 201, and the second lens unit 26 is arranged on the second part of the substrate 201. The third substrate and the fourth substrate are different parts of the substrate 203, respectively. For example, a light emitting source is disposed on a first portion of the substrate 203, and a light receiving element is disposed on a second portion of the substrate 203.
以上の実施例は、複数の微細構造を持つ投光用メタレンズと受光用メタレンズを同一或いは異なる透明基板に配置して、各メタレンズが同様な参照波長で設計されて、発光光源と受光素子を上記の透明基板と異なる基板に配置する。このように、本開示実施例の上記構造に、投光用メタレンズと受光用メタレンズを異なる保持枠を介さずに設置するため、光学系の光軸方向の厚みを大幅に削減するだけでなく、光軸方向に垂直の断面積も小型化できる。また、保持枠が樹脂製の場合、投光用レンズと受光用レンズの相対的な位置精度を向上させようとすると保持枠位置の調整等が必要だが、本開示実施例では、同一基板にメタレンズが配置されると、この相対的な位置精度は、メタレンズを作成する機器の精度によるため、調整なしで、超高精度を実現できる。 In the above embodiment, a light emitting metalens and a light receiving metalens having a plurality of microstructures are arranged on the same or different transparent substrates, each metalens is designed with a similar reference wavelength, and the light emitting light source and the light receiving element are connected to each other. The transparent substrate is placed on a different substrate. In this way, in the above structure of the embodiment of the present disclosure, the light emitting metalens and the light receiving metalens are installed without using different holding frames, which not only greatly reduces the thickness of the optical system in the optical axis direction, but also The cross-sectional area perpendicular to the optical axis direction can also be reduced. Furthermore, when the holding frame is made of resin, it is necessary to adjust the holding frame position in order to improve the relative positional accuracy of the light emitting lens and the light receiving lens. Once placed, this relative positional accuracy depends on the accuracy of the equipment that creates the metalens, so ultra-high precision can be achieved without any adjustment.
さらに、上記基板は、例えば、樹脂枠の線膨張係数より小さい基板を用いるため、温湿度変化による投光レンズ、受光レンズの相対的なシフト・チルトは、樹脂枠を介する場合に比べて、大幅に抑制される。
測距への不要な光の影響を削減するために、本開示実施例が、前記第二の基板と第四の基板の間に、所定の波長範囲の光線のみを透過させるバンドパスフィルタが設置される。例えば、図２において、第一の基板２２と第二の基板２４の間にバンドパスフィルタを配置し、図３において、基板２０１の第二の部分と基板２０３の第二の部分の間にバンドパスフィルタを配置することで、所定の波長範囲の光線のみがバンドパスフィルタを透過して受光素子に達する。
Furthermore, because the above-mentioned substrate uses a substrate whose coefficient of linear expansion is smaller than that of the resin frame, the relative shift and tilt of the light emitting lens and light receiving lens due to changes in temperature and humidity will be significantly greater than when using the resin frame. is suppressed.
In order to reduce the influence of unnecessary light on distance measurement, the disclosed embodiment includes a bandpass filter that transmits only light in a predetermined wavelength range between the second substrate and the fourth substrate. be done. For example, in FIG. 2, a bandpass filter is placed between the first substrate 22 and the second substrate 24, and in FIG. By arranging the pass filter, only light rays in a predetermined wavelength range pass through the band pass filter and reach the light receiving element.
別の実現方式として、第二のレンズユニットを配置する第二の基板は、所定の波長範囲の光線のみを透過させる。このとき、第二の基板も上記のバンドパスフィルタの機能を実現できる。図４に示すように、第二の基板２２は、所定の波長範囲の光線のみを透過させるバンドパスフィルタの機能を有する。図５に示すように、基板２０３は、所定の波長範囲の光線のみを透過させるバンドパスフィルタの機能を有する。当然のこと、ここで、基板２０３の第二の部分のみで上記のバンドパスフィルタの機能を実現してもよい。当然のこと、図４において、前記の第一の基板２１と第二の基板の少なくとも一つは、上記のバンドパスフィルタの機能を有する。 As another implementation, the second substrate on which the second lens unit is arranged only transmits light in a predetermined wavelength range. At this time, the second substrate can also realize the function of the bandpass filter described above. As shown in FIG. 4, the second substrate 22 has the function of a bandpass filter that transmits only light in a predetermined wavelength range. As shown in FIG. 5, the substrate 203 has the function of a bandpass filter that transmits only light in a predetermined wavelength range. Naturally, here, the function of the above-mentioned bandpass filter may be realized only by the second portion of the substrate 203. Naturally, in FIG. 4, at least one of the first substrate 21 and the second substrate has the function of the bandpass filter described above.
上記基板に特定の波長の光線のみを透過させる波長選択機能（バンドパスフィルタに相当する）を実現することで、本開示実施例は、測距への不要な光線の干渉を削減することができる。例えば、測距装置の発光光源は、通常、測距装置に隣接して配置される撮像カメラへの影響をなくすために特定の近赤外波長光源を採用するが、この場合、受光用メタレンズも特定の近赤外波長を参照波長として設計される。しかし、受光素子には発光光源からの近赤外光の被写体からの反射光だけではなく、通常の外部光も入射する。前記基板にこれらの外部光を除去させるバンドパスフィルタ機能を持たせることで、外部光による受光ノイズを抑制し、測距精度をより改善させることが可能となる。また、前記基板にフィルタ機能を持たせることで、図２或いは図３より１部品削減でき、コスト及び厚み方向のサイズダウンをより進めることが可能となる。 By implementing a wavelength selection function (corresponding to a bandpass filter) that allows only light beams of a specific wavelength to pass through the substrate, the disclosed embodiments can reduce interference of unnecessary light beams with distance measurement. . For example, the light emitting light source of a rangefinder usually uses a specific near-infrared wavelength light source to eliminate the effect on the imaging camera placed adjacent to the rangefinder, but in this case, the metalens for light reception is also used. Designed using a specific near-infrared wavelength as a reference wavelength. However, not only the near-infrared light from the light emitting source reflected from the subject but also normal external light enters the light receiving element. By providing the substrate with a band-pass filter function that removes these external lights, it becomes possible to suppress light reception noise due to external lights and further improve distance measurement accuracy. Furthermore, by providing the substrate with a filter function, the number of parts can be reduced by one compared to FIG. 2 or FIG. 3, making it possible to further reduce costs and size in the thickness direction.
投光光学系と受光光学系との間の光線干渉を削減するために、本開示実施例は、更に、少なくとも、前記第一の基板と第二の基板の境界部に遮光用マスクが貼り付けられるか、或いは、少なくとも、前記第一の基板と第二の基板の境界部に遮光材が塗布される。前記境界部は、前記第一のレンズユニットと第二のレンズユニットとの間に位置する。さらに、前記第三の基板の発光光源と前記第四の基板の受光素子の間に遮光用の壁が建てられてもよい。 In order to reduce light interference between the light emitting optical system and the light receiving optical system, the disclosed embodiment further includes a light shielding mask attached at least to the boundary between the first substrate and the second substrate. Alternatively, at least a light shielding material is applied to the boundary between the first substrate and the second substrate. The boundary portion is located between the first lens unit and the second lens unit. Furthermore, a light shielding wall may be built between the light emitting source of the third substrate and the light receiving element of the fourth substrate.
例えは、前記第一の基板と前記第二の基板が同一基板である場合に、図６に示すように、第一のレンズユニット２５と第二のレンズユニット２６が同一基板２０１に設置される。上記基板２０１は、第一のレンズユニット２５と第二のレンズユニット２６の境界部に遮光用マスク或いは塗布材が塗られて、基板２０３の受光素子と発光光源の間に、遮光用の壁が建てられている。具体的に、同一枠内に前記基板と発光光源と受光素子が配置されて、前記発光素子と受光素子の境界部に遮光用の壁が建てられている。 For example, when the first substrate and the second substrate are the same substrate, the first lens unit 25 and the second lens unit 26 are installed on the same substrate 201, as shown in FIG. . In the substrate 201, a light-shielding mask or coating material is applied to the boundary between the first lens unit 25 and the second lens unit 26, and a light-shielding wall is formed between the light-receiving element of the substrate 203 and the light-emitting light source. It is being built. Specifically, the substrate, the light emitting source, and the light receiving element are arranged in the same frame, and a light shielding wall is built at the boundary between the light emitting element and the light receiving element.
以上の実施例は、投光用メタレンズと受光用メタレンズを同一基板に配置して、１つの枠内に基板と発光光源と受光素子を配置してかつ、発光光源と受光光源を出来るだけ近接配置する場合、前記基板上に遮光用マスク或いは塗布材を塗り、想定画角外からの外部迷光が受光素子に入射するのを防ぐことで受光信号のノイズ成分を減らして測距精度をより向上することが可能となる。特に塗布材の塗位置精度は、マスクの貼り付け精度より高いため、遮光精度をより高めることが可能となる。また、発光素子と受光素子間に遮光用の壁を立てることで、発光光源からの光の迷光成分が受光素子に入射するのを防ぎ、測距精度の更なる改善が可能となる。 In the above embodiment, the light emitting metalens and the light receiving metalens are arranged on the same substrate, the substrate, the light emitting light source, and the light receiving element are arranged in one frame, and the light emitting light source and the light receiving light source are arranged as close as possible. In this case, a light shielding mask or coating material is applied on the substrate to prevent external stray light from entering the light receiving element from outside the expected angle of view, thereby reducing the noise component of the light receiving signal and further improving the ranging accuracy. becomes possible. In particular, since the coating position accuracy of the coating material is higher than the mask attachment accuracy, it is possible to further improve the light shielding accuracy. Further, by erecting a light-shielding wall between the light-emitting element and the light-receiving element, stray light components of light from the light-emitting light source are prevented from entering the light-receiving element, making it possible to further improve distance measurement accuracy.
図７に示すように、本開示実施例の第一の基板２１と第二の基板２２が異なる基板であってもよい。このとき、複数の微細構造を持つ投光用の第一のレンズユニット２５と受光用の第二のレンズユニット２６がそれぞれ各基板に作成され、前記第一の基板と第二の基板は、直接に接着され、且つ少なくとも、前記第一の基板２１と第二の基板２２の間の接着面に遮光用マスク或いは遮光材が配置される。このように、第一の基板と第二の基板は、枠を介せずに、直接接着され、各レンズは、同様な参照波長で設計されて、発光光源と受光素子を上記基板と異なる同一基板に配置する。 As shown in FIG. 7, the first substrate 21 and the second substrate 22 in the embodiment of the present disclosure may be different substrates. At this time, a first lens unit 25 for light emission and a second lens unit 26 for light reception, each having a plurality of fine structures, are created on each substrate, and the first substrate and the second substrate are directly connected to each other. A light-shielding mask or a light-shielding material is disposed at least on the adhesive surface between the first substrate 21 and the second substrate 22. In this way, the first substrate and the second substrate are directly bonded without using a frame, and each lens is designed with a similar reference wavelength, and the light emitting light source and light receiving element are the same and different from the above substrate. Place it on the board.
上記の構成によれば、本開示実施例の投光用レンズと受光用レンズを従来の様に異なる保持枠を介在させず直接に接着して配置するため、メタレンズを採用することによる光軸方向の厚みを大幅に削減するだけでなく、光軸に垂直な断面積も小型化することが出来る。また従来のように保持枠が樹脂製の場合、投光用レンズと受光用レンズの相対的な位置精度を向上させようとすると調整等が必要だが、レンズ基板どうしを直接接着配置する場合、その相対的な位置精度はレンズ単体の精度に依存するため、接着時の調整なしで極めて高精度配置を実現することが出来る。更に樹脂枠を介在する場合に比べて、温湿度変化による投光受光レンズの相対シフト・チルトも格段に抑制することが可能となる。また投光・受光光学系を近づけて配置すると、投光光学系からの迷光が受光光学系で受光し、それがノイズになる課題が出てくるが、本開示実施例が接着境界部にそれぞれ個別に遮光材塗布後に接着することで、特に境界付近で反射する迷光を抑制することが出来、測距精度を向上させることが可能となる。また、例えば受光用光学系と投光用光学系のどちらかのみにバンドパスフィルタが必要な場合、どちらかのレンズ基板にのみバンドパス機能を持たせることが可能となる。すなわち、前記第一の基盤２１および／または第二の基板２２に、所定の波長範囲の光線のみ透過させる。 According to the above configuration, since the light emitting lens and the light receiving lens of the embodiment of the present disclosure are directly bonded and arranged without intervening different holding frames as in the past, the optical axis direction by adopting a metalens is Not only can the thickness of the optical system be significantly reduced, but also the cross-sectional area perpendicular to the optical axis can be reduced. Furthermore, when the holding frame is made of resin as in the past, adjustments are required to improve the relative positional accuracy of the light emitting lens and the light receiving lens. Since the relative positional accuracy depends on the accuracy of the lens itself, extremely high-precision placement can be achieved without adjustment during bonding. Furthermore, compared to the case where a resin frame is interposed, the relative shift and tilt of the light emitting/receiving lens due to changes in temperature and humidity can be significantly suppressed. Furthermore, when the light emitting and light receiving optical systems are placed close together, there is a problem that stray light from the light emitting optical system is received by the light receiving optical system, which causes noise. By individually applying the light shielding material and then bonding it together, it is possible to suppress stray light reflected particularly near the boundary, and it is possible to improve distance measurement accuracy. Furthermore, for example, if a bandpass filter is required only in either the light-receiving optical system or the light-projecting optical system, it is possible to provide only one of the lens substrates with a bandpass function. That is, only light in a predetermined wavelength range is allowed to pass through the first substrate 21 and/or the second substrate 22.
以上の各実施例において、投光用レンズと受光用レンズの基板（例えば第一の基板と第二の基板）が、同一の枠（樹脂枠であってもよい）に設置できる。
以上の各実施例から分かるように、本開示実施例において、透明基板（上記の第一の基板と第二の基板）にメタレンズを配置する光学系を提案した。ここで、前記第一の基板と第二の基板は、異なるものであるか、もしくは、前記第一の基板と第二の基板は、同一基板の異なる部分である。しかし、透明基板上に配置することが可能であればメタレンズに限らず、例えば液体レンズや液晶レンズで構成することも可能である。更に基板は１枚に限らず、スペックにより２枚や３枚構成もありうる。
In each of the above embodiments, the substrates (for example, the first substrate and the second substrate) of the light projecting lens and the light receiving lens can be installed in the same frame (which may be a resin frame).
As can be seen from the above embodiments, in the embodiments of the present disclosure, an optical system in which metalens is arranged on transparent substrates (the first substrate and the second substrate described above) is proposed. Here, the first substrate and the second substrate are different, or the first substrate and the second substrate are different parts of the same substrate. However, if it is possible to arrange it on a transparent substrate, it is not limited to a metalens, and it is also possible to use a liquid lens or a liquid crystal lens, for example. Furthermore, the number of substrates is not limited to one, but may also include two or three substrates depending on specifications.
また、本開示実施例の透明基板の材料に関して特に規定はしないが、一般的なレンズ枠として使われる樹脂枠材の線膨張係数が７×１０－5/℃程度（例えば帝人製Ｌ－１２２５Ｙは７×１０－５/℃、ＤＮ５６１５Ｂは５×１０－５/℃)なので、温度信頼性を劇的に改善したい場合は、基板の線膨張係数が１．５×１０－５/℃以下の硝子などの透明体を用いることが好ましい。 Further, although there are no particular regulations regarding the material of the transparent substrate in the embodiments of the present disclosure, the coefficient of linear expansion of the resin frame material used as a general lens frame is approximately 7×10 −5 /°C (for example, Teijin L-1225Y is 7×10 -5 /℃, DN5615B is 5×10 -5 /℃), so if you want to dramatically improve temperature reliability, use glass with a linear expansion coefficient of 1.5×10 -5 /℃ or less for the substrate. It is preferable to use a transparent body such as.
更に、本開示実施例では測距装置内での受光光学系と投光光学系の一体化を提案しているが、例えばスマートフォンなどの測距装置の場合、メインカメラの撮像光学系も同一基板上に一体化することで、搭載製品の小型化をより進めることが可能となる。 Furthermore, although the disclosed embodiment proposes the integration of the light receiving optical system and the light emitting optical system within the distance measuring device, for example, in the case of a distance measuring device such as a smartphone, the imaging optical system of the main camera is also mounted on the same board. By integrating it onto the top, it becomes possible to further downsize the installed product.
更に本開示実施例では、ゴースト対策の為にマスクや塗布材、遮光用の壁等ハードウエア上の対策を採用したが、例えば発光と受光のタイミングをずらして、発光光源からの迷光対策をしてもよい。 Furthermore, in the embodiments of the present disclosure, hardware measures such as masks, coating materials, and light-shielding walls are adopted to prevent ghosting. You can.
更に、レンズ基板に特定の波長のみを透過させる場合、基板に薄膜を積層させてバンドパス機能を持たせる方式等が、現実的な方法の１つである。 Furthermore, in the case where only a specific wavelength is transmitted through a lens substrate, one practical method is to laminate a thin film on the substrate to provide a bandpass function.
本開示実施例では、同一基板上に投光系・受光系メタレンズを配置する構成を提案しているが、別枠構成と比べて、このように構成することで、小型化だけでなく、投光系と受光系の配置の調整が不要であり、不良発生時の部品交換等のリワーク効率も格段によくなる。測距装置は、その性質上、受光系レンズと投光系レンズの参照波長は同一となり、メタレンズはその性質上、微細構造の形状や高さが設計参照波長に依存するため、同一参照波長の受光系レンズと投光系レンズを同一基板に製造する場合、製造方法によっては、製造プロセスの劇的な簡略化が可能となる点もメリットと考える。また、メタレンズはその微細構造の為に、センサーなどと同じく半導体製造プロセスを用いて製造されるが、メタレンズと受光センサー、光源素子を同一の半導体工場で生産すれば、製造・組み立てプロセスがより効率化・自動化出来、組み立て時のごみ混入リスクなども減らせるメリットがある。 In the disclosed embodiment, a configuration is proposed in which the light emitting system and light receiving system metalens are arranged on the same substrate. Compared to a separate frame configuration, this configuration not only reduces the size of the light emitting system but also improves the light emitting system. There is no need to adjust the arrangement of the system and the light-receiving system, and rework efficiency such as parts replacement in the event of a defect is greatly improved. Due to the nature of distance measuring devices, the reference wavelengths of the light-receiving and light-emitting lenses are the same, and due to the nature of metalens, the shape and height of the microstructure depend on the design reference wavelength. If the light-receiving lens and the light-emitting lens are manufactured on the same substrate, depending on the manufacturing method, the manufacturing process can be dramatically simplified, which is an advantage. In addition, due to its fine structure, metalens is manufactured using the same semiconductor manufacturing process as sensors, but if the metalens, light receiving sensor, and light source element are manufactured in the same semiconductor factory, the manufacturing and assembly process becomes more efficient. It has the advantage of being able to be automated and reducing the risk of contamination with dust during assembly.
以上、図面とともに、本開示の実施例を説明したが、本開示は、上記の具体的な実施例に限らず、上記の具体的な実施例は、例示なものであり、制限されるものではない。本開示の示唆で、当業者は、本開示の主旨および請求項に保護される範囲を逸脱しなければ、さらに様々な方式をしてもよく、いずれも本開示の保護範囲内に含まれる。 Although the embodiments of the present disclosure have been described above with reference to the drawings, the present disclosure is not limited to the specific embodiments described above, and the specific embodiments described above are illustrative and are not intended to be limiting. do not have. With the suggestion of this disclosure, those skilled in the art may further take various forms without departing from the spirit of this disclosure and the scope protected by the claims, all of which will fall within the protection scope of this disclosure.
Claims (12)
前記投光光学系は、第一の基板上に配置される第一のレンズユニットと前記第一の基板と異なる第三の基板上に配置される発光光源とを含み
前記受光光学系は、第二の基板上に配置される第二のレンズユニットと前記第二の基板と異なる第四の基板上に配置される受光素子とを含み、
前記第一のレンズユニットと第二のレンズユニットとの参照波長は、同一であることを特徴とする測距装置。 A distance measuring device, including a light emitting optical system and a light receiving optical system,
The light emitting optical system includes a first lens unit disposed on a first substrate and a light emitting light source disposed on a third substrate different from the first substrate; a second lens unit disposed on a second substrate; and a light receiving element disposed on a fourth substrate different from the second substrate;
A distance measuring device characterized in that reference wavelengths of the first lens unit and the second lens unit are the same.
前記第三の基板と第四の基板は、同一のものであり、前記第一のレンズユニットと第二のレンズユニットは、それぞれメタレンズ又は膜レンズ又は液体レンズ又は、液晶レンズを含むことを特徴とする請求項１に記載の測距装置。 The first substrate and the second substrate are both transparent substrates,
The third substrate and the fourth substrate are the same, and the first lens unit and the second lens unit each include a metalens, a membrane lens, a liquid lens, or a liquid crystal lens. The distance measuring device according to claim 1.
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| JP2022045774A JP7344333B1 (en) | 2022-03-22 | 2022-03-22 | Distance measuring equipment and electronic equipment |
| PCT/CN2023/082761 WO2023179602A1 (en) | 2022-03-22 | 2023-03-21 | Ranging device and electronic device |
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| JP2022045774A JP7344333B1 (en) | 2022-03-22 | 2022-03-22 | Distance measuring equipment and electronic equipment |
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|---|---|---|---|---|
| JP2011043433A (en) * | 2009-08-21 | 2011-03-03 | Sharp Corp | Optical ranging sensor, and electronic device loaded therewith |
| JP2019111067A (en) * | 2017-12-22 | 2019-07-11 | 京セラ株式会社 | Optical sensor device |
| WO2021025759A1 (en) * | 2019-08-08 | 2021-02-11 | Massachusetts Institute Of Technology | Ultra-wide field-of-view flat optics |
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| JP4085517B2 (en) * | 1999-05-24 | 2008-05-14 | 松下電工株式会社 | Distance sensor and method for fixing the distance sensor |
| US10162047B2 (en) * | 2013-12-16 | 2018-12-25 | Kyocera Corporation | Light receiving/emitting element module and sensor device using same |
| US10374116B2 (en) * | 2015-04-27 | 2019-08-06 | Kyocera Corporation | Light receiving and emitting element module and sensor device |
| JP2019191018A (en) * | 2018-04-26 | 2019-10-31 | ソニー株式会社 | Ranging device and ranging module |
| EP3876257A4 (en) * | 2018-10-30 | 2022-08-17 | Kyocera Corporation | OPTICAL SENSING DEVICE |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011043433A (en) * | 2009-08-21 | 2011-03-03 | Sharp Corp | Optical ranging sensor, and electronic device loaded therewith |
| JP2019111067A (en) * | 2017-12-22 | 2019-07-11 | 京セラ株式会社 | Optical sensor device |
| WO2021025759A1 (en) * | 2019-08-08 | 2021-02-11 | Massachusetts Institute Of Technology | Ultra-wide field-of-view flat optics |
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