JP2022038139A - Coil component - Google Patents

Abstract

A coil component is provided in which the size of a wiring layer can be easily suppressed on one surface side of a substrate and the resistance value of the wiring layer can be easily suppressed on the other surface side. A coil part (3) in a coil component (1) includes a plurality of wiring layers laminated on a substrate (60). The plurality of wiring layers are a first wiring layer 10 wound on one surface side of the substrate 60 and a second wiring layer 10 wound on the other surface side of the substrate 60 rather than the first wiring layer 10 . and a wiring layer 20 . At least part of the second wiring layer 20 is wider than at least part of the first wiring layer 10 . [Selection drawing] Fig. 1

Description

The present disclosure relates to coil components.

As a technique for forming a coil on a substrate, a technique as in Patent Document 1 is disclosed. The vehicle substrate coil disclosed in Patent Document 1 includes a first coil portion and a second coil portion by a plurality of layers of conductor patterns.

Japanese Unexamined Patent Publication No. 2010-114195

In the technique of Patent Document 1, the coil is composed of a plurality of layers of conductor patterns, but this type of coil has a size for securing the required number of turns when the width of the conductor is increased in order to suppress the resistance value. Is relatively large. On the other hand, in this type of coil, if the width of the conductor is reduced in order to reduce the size, the resistance value becomes relatively large and heat generation is likely to occur. Therefore, when the conductors of a plurality of layers have the same width, it is necessary to select whether to set the width with priority given to the reduction of the resistance value or to set the width with priority given to the reduction of the size.

One object of the present disclosure is to provide a coil component in which the size of the wiring layer can be easily suppressed on one side of the substrate and the resistance value of the wiring layer can be easily suppressed on the other side.

The coil component, which is one of the disclosures, is
The coil part is a coil component provided on the board,
The coil portion includes a plurality of wiring layers laminated on the substrate, and the coil portion includes a plurality of wiring layers.
The plurality of wiring layers have a first wiring layer wound on one side of the substrate and a second wiring layer wound on the other side of the board with respect to the first wiring layer. With a wiring layer,
At least a part of the second wiring layer is wider than at least a part of the first wiring layer.

In the coil component which is one of the present disclosure, it is easy to suppress the size of the wiring layer on one side of the substrate, and it is easy to suppress the resistance value of the wiring layer on the other side.

FIG. 1 is a cross-sectional view conceptually illustrating a cross section of a coil component according to the first embodiment. FIG. 2 is an explanatory diagram conceptually showing the wiring layer of the first layer of the coil component according to the first embodiment. FIG. 3 is an explanatory diagram conceptually showing the wiring layer of the second layer of the coil component according to the first embodiment. FIG. 4 is an explanatory diagram conceptually showing the wiring layer of the third layer of the coil component according to the first embodiment. FIG. 5 is an explanatory diagram conceptually showing the wiring layer of the fourth layer of the coil component according to the first embodiment.

Hereinafter, embodiments of the present disclosure are listed and exemplified. The features [1] to [9] exemplified below may be combined in any way within a consistent range.

[1] The coil portion is a coil component provided on a substrate.
The coil portion includes a plurality of wiring layers laminated on the substrate, and the coil portion includes a plurality of wiring layers.
The plurality of wiring layers have a first wiring layer wound on one side of the substrate and a second wiring layer wound on the other side of the board with respect to the first wiring layer. With a wiring layer,
At least a part of the second wiring layer is a coil component having a width larger than at least a part of the first wiring layer.

[1] In the coil component, at least a part of the second wiring layer arranged on the other side of the substrate is wider than at least a part of the first wiring layer arranged on the one side of the substrate. Therefore, in this coil component, it is easy to suppress the size of the wiring layer on one side of the substrate, and it is easy to suppress the resistance value of the wiring layer on the other side.

The coil component of [2] has the following features in the coil component described in [1] above. The first wiring layer includes one or more first conductor patterns that continue with a constant width, and the second wiring layer includes one or more second conductor patterns that continue with a constant width. The constant width of any of the second conductor patterns in the second wiring layer is larger than the constant width of any first conductor pattern in the first wiring layer.

In the coil component of [2], the width of the second wiring layer arranged on the other side of the substrate is arranged on one side of the substrate in the portion of the first conductor pattern and the second conductor pattern that continue at least with a constant width. It can be secured larger than the width of the first wiring layer.

As for the coil component of [3], in the coil component according to [1] or [2], the first wiring layer has a larger number of turns than the second wiring layer.

In the coil component of [3], in the first wiring layer in which the width of the conductor is relatively suppressed, the number of turns can be relatively increased to increase the inductance, so that the wiring layer on one side of the substrate can be used. , The increase in inductance can be prioritized. On the other hand, since this coil component can increase the conductor width and suppress the resistance value in the second wiring layer having a relatively small number of turns, the resistance value is reduced in the wiring layer on the other side of the substrate. Can be prioritized.

The coil component of [4] is the coil component according to any one of [1] to [3], and one surface of the substrate is a surface supported by a heat radiating portion.

In the coil component of [4], since one surface of the substrate is a surface supported by the heat portion, heat dissipation can be promoted on one surface side of the substrate. In the configuration in which the first wiring layer is arranged on one side of the substrate, the size of the wiring layer can be easily suppressed on one side of the substrate, but on the other hand, there is a concern that heat is generated in the first wiring layer. On the other hand, since the coil component of [4] can promote heat dissipation on one side of the substrate, it is possible to suppress heat generation while suppressing the size of the wiring layer on one side of the substrate.

The coil component of [5] has the following characteristics in the coil component according to any one of [1] to [4]. In the coil component of [5], at least one of the first wiring layer and the second wiring layer is provided with a first annular pattern provided in an annular shape and an annular pattern outside the first annular pattern. It has a second annular pattern and a second ring pattern. At least a portion of the second annular pattern is wider than at least a portion of the first annular pattern.

The coil component of [5] can secure a wider width of the outer second annular pattern in which the path tends to be long, and can suppress the resistance value of the outer pattern in which the resistance value tends to be large.

The coil component of [6] has the following characteristics in the coil component according to any one of [1] to [5]. The plurality of wiring layers have another wiring layer having a wound configuration, and the other wiring layer is connected in parallel to at least one of the first wiring layer and the second wiring layer. It becomes.

In the coil component of [6], since other wiring layers are connected in parallel, the resistance value of the entire wiring layer connected in parallel can be suppressed.

The coil component of [7] has the following features in the coil component according to [6]. The other wiring layer includes a first other wiring layer connected in parallel to the first wiring layer and a second other wiring layer connected in parallel to the second wiring layer.

In the coil component of [7], the resistance value can be suppressed in each of the parallel connection portion including the first wiring layer and the parallel connection portion including the second wiring layer.

The coil component of [8] has the following characteristics in the coil component according to any one of [1] to [7]. The first wiring layer includes a plurality of first linear patterns formed linearly with a predetermined width, and the second wiring layer includes a plurality of second linear patterns formed linearly with a predetermined width. include. Each of the plurality of second linear patterns in the second wiring layer is wider than any of the plurality of first linear patterns in the first wiring layer.

In the coil component of [8], the size of the wiring layer can be further suppressed on one side of the substrate, and the resistance value of the wiring layer can be further suppressed on the other side.

The coil component of [9] is the coil component according to any one of [1] to [8], and the first wiring layer is in contact with the heat radiating portion.

The coil component of [9] can dissipate heat more effectively by directly contacting the heat radiating portion with the first wiring layer where heat generation is a concern.

<First Embodiment>
1. 1. Outline of Coil Parts The coil component 1 shown in FIG. 1 is a coil component for a vehicle mounted on a vehicle. The coil component 1 is used as a part of an in-vehicle electronic device. The coil component 1 may be, for example, a component that can function as a part of a power supply circuit (for example, a transformer, a filter, etc.) such as an in-vehicle DCDC converter, or a component that can function as a part of other in-vehicle devices. It may be.

As shown in FIG. 1, the coil component 1 includes a substrate 60. The board 60 includes a board main body 62, a wiring portion 61, mounting components (not shown), and the like. The substrate 60 is provided with a coil portion 3 which will be described later. The coil component 1 is configured as a substrate coil. The coil portion 3 is configured as a laminated coil.

In the present specification, the first plate surface 60A, which is the plate surface on one side in the thickness direction (plate thickness direction) of the substrate 60, corresponds to an example of one surface. The second plate surface 60B, which is the plate surface on the other side in the thickness direction (plate thickness direction) of the substrate 60, corresponds to an example of the other surface. The first plate surface 60A is an end surface of the substrate 60 on the heat radiating portion 80 side in the thickness direction. The second plate surface 60B is an end surface of the substrate 60 on the side opposite to the heat radiating portion 80 side in the thickness direction.

The heat radiating portion 80 is a portion that dissipates heat while supporting the substrate 60. The first plate surface 60A (one surface) of the substrate 60 is a surface that directly contacts the heat radiating portion 80 and is supported by the radiating portion 80. The heat radiating unit 80 has one or more heat radiating materials and functions to dissipate the heat accumulated in the substrate 60. In FIG. 1, the heat radiating unit 80 includes a first heat radiating material 81 and a second heat radiating material 82.

The second heat radiating material 82 is interposed between the substrate 60 and the first heat radiating material 81 while being sandwiched between the substrate 60 and the first heat radiating material 81. One surface of the second heat radiating material 82 contacts the other surface of the first heat radiating material 81. One surface of the second heat radiating material 82 comes into contact with the first plate surface 60A, which is one surface of the substrate 60. The second heat radiating material 82 may be, for example, a heat radiating material having fluidity such as grease, or may be a solid such as a heat radiating sheet. It is desirable that the second heat radiating material 82 has a higher thermal conductivity than the substrate main body 62.

The first heat radiating material 81 is a member that supports the substrate 60 via the second heat radiating material 82. The other side surface of the first heat radiating material 81 contacts the one side surface of the second heat radiating material 82. One surface of the first heat radiating material 81 may be exposed to a space in which a gas exists, may be in contact with a liquid, or may be in contact with a solid having heat dissipation. The first heat radiating material 81 is made of, for example, a metal material having high heat radiating properties, and functions as a heat sink. The first heat radiating material 81 may be provided with heat radiating fins or the like. It is desirable that the first heat radiating material 81 has a higher thermal conductivity than the substrate main body 62.

In the example of FIG. 1, the surface 80A (specifically, one surface of the first heat radiating material 81) on the side opposite to the substrate 60 in the heat radiating portion 80 is exposed to the space where the gas is present and is exposed to air or the like. It is said to be a surface exposed to gas. However, the present invention is not limited to this example, and the surface 80A may be a surface in contact with a liquid such as cooling water, or may be a surface in contact with a solid having heat dissipation. When the surface 80A is configured to be in contact with the cooling water, the surface 80A may form a part of the flow path through which the cooling water flows or a part of the storage portion in which the cooling water is stored.

The surface 80B on the substrate 60 side (specifically, the surface on the other side of the second heat radiating material 82) in the heat radiating unit 80 contacts the first plate surface 60A while facing the first plate surface 60A of the substrate 60. The first plate surface 60A may be in contact with the surface 80B via an adhesive medium such as an adhesive. Alternatively, the first plate surface 60A may be in direct contact with the surface 80B without the intervention of other members.

The coil portion 3 includes a plurality of wiring layers (first wiring layer 10, second wiring layer 20, intermediate wiring layers 30, 40) and insulating layers 64A, 64B, 66. The first wiring layer 10, the second wiring layer 20, and the intermediate wiring layers 30 and 40, which are a plurality of wiring layers, form a laminated structure on the substrate 60. The first wiring layer 10, the second wiring layer 20, and the intermediate wiring layers 30 and 40, which are a plurality of wiring layers, are all wiring patterns composed of conductor layers. The material of the first wiring layer 10, the second wiring layer 20, and the intermediate wiring layers 30 and 40 may be any material having conductivity.

The insulating layers 64A, 64B, 66 are plate-shaped insulating portions constituting the substrate main body 62. The insulating layer 66 is a plate-shaped portion made of an insulating material such as resin. The insulating layer 66 may be configured as, for example, a prepreg, or may have another configuration. The insulating layers 64A and 64B are coating layers that cover both sides of the insulating layer 66, respectively, and are layers made of an insulating material such as resin. The insulating layers 64A and 64B may be configured as, for example, a resist, or may have other configurations.

As shown in FIG. 1, the first wiring layer 10 is a wiring layer arranged on the first plate surface 60A (one surface) side of the second wiring layer 20 on the substrate 60. The first wiring layer 10 is the first among the plurality of wiring layers (first wiring layer 10, second wiring layer 20, intermediate wiring layers 30, 40) constituting the coil portion 3 in the thickness direction of the substrate 60. It is a wiring layer arranged on the plate surface 60A side. In the example of FIG. 1, the first wiring layer 10 is arranged on one surface of the insulating layer 66 and is embedded in the substrate main body 62 so as to be covered by the insulating layer 64A. In the present specification, the first wiring layer 10 is referred to as the first wiring layer.

FIG. 2 is an explanatory view (plan view) simply showing a configuration in which only the first wiring layer 10 of the coil components 1 is viewed from above. In FIG. 2, parts other than the first wiring layer 10 are omitted. In this specification, the thickness direction of the substrate 60 is the vertical direction. Then, in the substrate 60, the first plate surface 60A side is the lower side, and the second plate surface 60B side is the upper side.

As shown in FIG. 2, the first wiring layer 10 is a wiring layer having a configuration of being wound in a coil shape. The first wiring layer 10 is arranged on a predetermined virtual plane orthogonal to the thickness direction of the substrate 60, and is wound along the virtual plane.

The first wiring layer 10 includes a plurality of annular patterns 12A, 12B, 12C provided in an annular shape. In the example of FIG. 2, the first wiring layer 10 includes the annular patterns 12A, 12B, and 12C for three turns (three turns), and the number of the annular patterns (the number of turns) corresponds to the number of turns. That is, the number of turns (number of turns) of the first wiring layer 10 is 3. The number of turns of the first wiring layer 10 is larger than the number of turns of the second wiring layer 20 described later.

In the plurality of annular patterns 12A, 12B, 12C constituting the first wiring layer 10, the annular pattern 12A arranged on the innermost side corresponds to an example of the first annular pattern. The annular patterns 12B and 12C are provided in an annular shape on the outer side of the annular pattern 12A (first annular pattern). The annular patterns 12B and 12C correspond to an example of the second annular pattern. At least a portion of the annular patterns 12B, 12C (second annular pattern) is wider than at least a portion of the annular pattern 12A (first annular pattern). Specifically, the width of the plurality of annular patterns 12A, 12B, and 12C increases toward the outside.

The annular pattern 12A includes one or more first conductor patterns that continue with a constant width. Specifically, the annular pattern 12A includes a plurality of linear patterns 13A, 13B, 13C, 13D linearly configured with a predetermined width W1. The linear patterns 13A, 13B, 13C, and 13D correspond to an example of the first linear pattern, and correspond to an example of the first conductor pattern. The linear patterns 13A, 13B, 13C, and 13D are integral conductor patterns. In the annular pattern 12A, the linear patterns 13A, 13B, 13C, and 13D have a polygonal shape (specifically, a square shape) and a continuous frame shape.

The annular pattern 12B is a conductor pattern that continues from the end of the annular pattern 12A. The annular pattern 12B includes one or more first conductor patterns that continue with a constant width. Specifically, the annular pattern 12B includes a plurality of linear patterns 14A, 14B, 14C, 14D linearly configured with a predetermined width W2. The linear patterns 14A, 14B, 14C, and 14D correspond to an example of the first linear pattern, and correspond to an example of the first conductor pattern. The linear patterns 14A, 14B, 14C, and 14D are integral conductor patterns. In the annular pattern 12B, the linear patterns 14A, 14B, 14C, and 14D have a polygonal shape (specifically, a square shape) and a continuous frame shape. The annular pattern 12B is arranged outside the annular pattern 12A so as to surround the annular pattern 12A. The overall length of the annular pattern 12B is greater than the overall length of the annular pattern 12A. The total area of the annular pattern 12B is larger than the total area of the annular pattern 12A.

The annular pattern 12C is a conductor pattern that continues from the end of the annular pattern 12B. The annular pattern 12C includes one or more first conductor patterns that continue with a constant width. Specifically, the annular pattern 12C includes a plurality of linear patterns 15A, 15B, 15C, 15D linearly configured with a predetermined width W3. The linear patterns 15A, 15B, 15C, and 15D correspond to an example of the first linear pattern, and correspond to an example of the first conductor pattern. The linear patterns 15A, 15B, 15C, and 15D are integral conductor patterns. In the annular pattern 12C, the linear patterns 15A, 15B, 15C, and 15D have a polygonal shape (specifically, a quadrangular shape) and a continuous frame shape. The annular pattern 12C is arranged outside 12B of the annular pattern 12A so as to surround the annular patterns 12A and 12B. The overall length of the annular pattern 12C is greater than the overall length of the annular pattern 12B. The total area of the annular pattern 12C is larger than the total area of the annular pattern 12B.

In the first wiring layer 10, the relationship between the widths W1, W2, and W3 is W1 ≦ W2 ≦ W3, and it is more desirable that W1 <W2 <W3. The first wiring layer 10 includes a continuous portion 17 connected to an end portion of the annular pattern 12C.

As shown in FIG. 1, the intermediate wiring layer 30 is arranged on the first plate surface 60A (one surface) side of the second wiring layer 20 on the substrate 60, and is arranged on the second plate surface 60B (other) than the first wiring layer 10. It is a wiring layer arranged on the (direction) side. In the example of FIG. 1, the intermediate wiring layer 30 is embedded in the insulating layer 66. In the present specification, the intermediate wiring layer 30 is referred to as a second wiring layer. FIG. 3 is an explanatory view (plan view) simply showing a configuration in which only the intermediate wiring layer 30 of the coil components 1 is viewed from above. In FIG. 3, parts other than the intermediate wiring layer 30 are omitted.

As shown in FIG. 3, the intermediate wiring layer 30 is a wiring layer having a configuration of being wound in a coil shape. The intermediate wiring layer 30 is arranged on a predetermined virtual plane orthogonal to the thickness direction of the substrate 60, and is wound along the virtual plane. As shown in FIG. 3, the intermediate wiring layer 30 has the same shape as the first wiring layer 10 (FIG. 2).

The intermediate wiring layer 30 includes a plurality of annular patterns 32A, 32B, 32C provided in an annular shape. In the example of FIG. 3, the intermediate wiring layer 30 includes the annular patterns 32A, 32B, and 32C for three turns (three turns), and the number of the annular patterns (the number of turns) corresponds to the number of turns. The number of turns of the intermediate wiring layer 30 is larger than the number of turns of the second wiring layer 20 described later. In the plurality of annular patterns 32A, 32B, 32C constituting the intermediate wiring layer 30, the annular pattern 32A is arranged on the innermost side. The annular patterns 32B and 32C are provided in an annular shape on the outer side of the annular pattern 32A. At least a portion of the annular patterns 32B, 32C is wider than at least a portion of the annular pattern 32A.

The annular pattern 32A includes one or more conductor patterns that continue with a constant width. Specifically, the annular pattern 32A includes linear patterns 33A, 33B, 33C, 33D formed linearly with a predetermined width W11. The linear patterns 33A, 33B, 33C, 33D are integral conductor patterns. In the annular pattern 32A, the linear patterns 33A, 33B, 33C, 33D have a polygonal shape (specifically, a quadrangular shape) and a continuous frame shape.

The annular pattern 32B is a conductor pattern that continues from the end of the annular pattern 32A. The annular pattern 32B includes one or more conductor patterns that continue with a constant width. The annular pattern 32B includes linear patterns 34A, 34B, 34C, 34D formed linearly with a predetermined width W12. The linear patterns 34A, 34B, 34C, and 34D are integral conductor patterns. In the annular pattern 32B, the linear patterns 34A, 34B, 34C, and 34D have a polygonal shape (specifically, a square shape) and a continuous frame shape. The annular pattern 32B is arranged outside the annular pattern 32A so as to surround the annular pattern 32A. The overall length of the annular pattern 32B is greater than the overall length of the annular pattern 32A. The total area of the annular pattern 32B is larger than the total area of the annular pattern 32A.

The annular pattern 32C is a conductor pattern that continues from the end of the annular pattern 32B. The annular pattern 32C includes one or more conductor patterns that continue with a constant width. The annular pattern 32C includes linear patterns 35A, 35B, 35C, 35D configured linearly with a predetermined width W13. The linear patterns 35A, 35B, 35C, and 35D are integral conductor patterns. In the annular pattern 32C, the linear patterns 35A, 35B, 35C, and 35D have a polygonal shape (specifically, a square shape) and a continuous frame shape. The annular pattern 32C is arranged outside the annular patterns 32A and 32B so as to surround the annular patterns 32A and 32B. The overall length of the annular pattern 32C is greater than the overall length of the annular pattern 32B. The total area of the annular pattern 32C is larger than the total area of the annular pattern 32B.

In the intermediate wiring layer 30, the relationship between the widths W11, W12, and W13 is W11 ≦ W12 ≦ W13, and it is more desirable that W11 <W12 <W13. The relationship between the widths of the first wiring layer 10 and the intermediate wiring layer 30 is W1 = W11, W2 = W12, and W3 = W13.

The intermediate wiring layer 30 includes a continuous portion 37 continuous from the end portion of the annular pattern 32C arranged on the outermost side. The continuous portion 37 and the continuous portion 17 continuous from the end of the annular pattern 12C arranged on the outermost side of the first wiring layer 10 are electrically connected to each other by a via 18 which is a conductor portion provided between the layers. , Are configured to be equipotential with each other. In FIGS. 2 and 3, the via 18 is conceptually represented by a chain double-dashed line. On the other hand, the portion on the end side of the innermost annular pattern 12A in the first wiring layer 10 and the portion on the end side of the innermost annular pattern 32A in the intermediate wiring layer 30 are vias which are conductor portions provided between the layers. 19 are electrically connected to each other and are configured to have the same potential. In FIGS. 2 and 3, the via 19 is conceptually represented by a chain double-dashed line. That is, the first wiring layer 10 and the intermediate wiring layer 30 are connected in parallel between the via 18 and the via 19. Because of this configuration, both ends of the coiled first wiring layer 10 and both ends of the coiled intermediate wiring layer 30 are electrically connected to each other to form a coil structure connected in parallel. Nothing. The intermediate wiring layer 30 corresponds to an example of another wiring layer. Specifically, the intermediate wiring layer 30 corresponds to an example of the first other wiring layer connected in parallel to the first wiring layer 10.

As shown in FIG. 1, the second wiring layer 20 is a wiring layer arranged on the second plate surface 60B (the other surface) side of the first wiring layer 10 on the substrate 60. The second wiring layer 20 is arranged on the second plate surface 60B side of the plurality of wiring layers (first wiring layer 10, second wiring layer 20, intermediate wiring layers 30, 40) constituting the coil portion 3. .. In the example of FIG. 1, the second wiring layer 20 is arranged on the other side surface of the insulating layer 66 and is embedded in the substrate main body 62 so as to be covered by the insulating layer 64B. In the present specification, the second wiring layer 20 is referred to as a fourth wiring layer.

FIG. 5 is an explanatory view (plan view) simply showing a configuration in which only the second wiring layer 20 of the coil component 1 is viewed from above. In FIG. 5, parts other than the second wiring layer 20 are omitted. As shown in FIG. 5, the second wiring layer 20 is a wiring layer having a configuration of being wound in a coil shape. The second wiring layer 20 is arranged on a predetermined virtual plane orthogonal to the thickness direction of the substrate 60, and is wound along the virtual plane.

The second wiring layer 20 includes a plurality of annular patterns 22A and 22B provided in an annular shape. In the example of FIG. 5, the second wiring layer 20 includes the annular patterns 22A and 22B for two turns (two turns), and the number of the annular patterns (the number of turns) corresponds to the number of turns. That is, the number of turns (number of turns) of the second wiring layer 20 is 2. The number of turns of the second wiring layer 20 is smaller than the number of turns of the first wiring layer 10.

In the plurality of annular patterns 22A and 22B constituting the second wiring layer 20, the annular pattern 22A arranged on the innermost side corresponds to an example of the first annular pattern. The annular pattern 22B is provided in an annular shape on the outer side of the annular pattern 22A (first annular pattern). The annular pattern 22B corresponds to an example of the second annular pattern. At least a portion of the annular pattern 22B (second annular pattern) is wider than at least a portion of the annular pattern 22A (first annular pattern). Specifically, the width of the plurality of annular patterns 22A and 22B increases toward the outside.

The annular pattern 22A includes one or more second conductor patterns that continue with a constant width. Specifically, the annular pattern 22A includes a plurality of linear patterns 23A, 23B, 23C, 23D linearly configured with a predetermined width W4. The linear patterns 23A, 23B, 23C, and 23D correspond to an example of the second linear pattern, and correspond to an example of the second conductor pattern. The linear patterns 23A, 23B, 23C, and 23D are integral conductor patterns. In the annular pattern 22A, the linear patterns 23A, 23B, 23C, and 23D have a polygonal shape (specifically, a square shape) and a continuous frame shape.

The annular pattern 22B is a conductor pattern that continues from the end of the annular pattern 22A. The annular pattern 22B includes one or more first conductor patterns that continue with a constant width. Specifically, the annular pattern 22B includes a plurality of linear patterns 24A, 24B, 24C, 24D linearly configured with a predetermined width W5. The linear patterns 24A, 24B, 24C, and 24D correspond to an example of the second linear pattern, and correspond to an example of the second conductor pattern. The linear patterns 24A, 24B, 24C, and 24D are integral conductor patterns. In the annular pattern 22B, the linear patterns 24A, 24B, 24C, and 24D have a polygonal shape (specifically, a quadrangular shape) and a continuous frame shape. The annular pattern 22B is arranged outside the annular pattern 22A so as to surround the annular pattern 22A. The overall length of the annular pattern 22B is greater than the overall length of the annular pattern 22A. The total area of the annular pattern 22B is larger than the total area of the annular pattern 22A.

In the second wiring layer 20, the relationship between the widths W4 and W5 is W4 ≦ W5, and it is more desirable that W4 <W5. The second wiring layer 20 includes a continuous portion 27 connected to the end portion of the annular pattern 22B.

As shown in FIG. 1, the intermediate wiring layer 40 is arranged on the first plate surface 60A (one surface) side of the second wiring layer 20 on the substrate 60, and is arranged on the second plate surface 60B (other) than the first wiring layer 10. It is a wiring layer arranged on the (direction) side. The intermediate wiring layer 40 is arranged on the second plate surface 60B (the other surface) side of the intermediate wiring layer 30. In the example of FIG. 1, the intermediate wiring layer 40 is embedded in the insulating layer 66. In the present specification, the intermediate wiring layer 40 is referred to as a third wiring layer. FIG. 4 is an explanatory view (plan view) simply showing a configuration in which only the intermediate wiring layer 40 of the coil components 1 is viewed from above. In FIG. 4, parts other than the intermediate wiring layer 40 are omitted.

As shown in FIG. 4, the intermediate wiring layer 40 is a wiring layer having a configuration of being wound in a coil shape. The intermediate wiring layer 40 is arranged on a predetermined virtual plane orthogonal to the thickness direction of the substrate 60, and is wound along the virtual plane. As shown in FIG. 4, the intermediate wiring layer 40 has the same shape as the second wiring layer 20 (FIG. 5).

The intermediate wiring layer 40 includes a plurality of annular patterns 42A and 42B provided in an annular shape. In the example of FIG. 4, the intermediate wiring layer 40 includes the annular patterns 42A and 42B for two turns (two turns), and the number of the annular patterns (the number of turns) corresponds to the number of turns. The number of turns of the intermediate wiring layer 40 is smaller than the number of turns of the first wiring layer 10. In the plurality of annular patterns 42A and 42B constituting the intermediate wiring layer 40, the annular pattern 42A is arranged on the innermost side. The annular pattern 42B is provided in an annular shape on the outer side of the annular pattern 42A. At least a portion of the annular pattern 42B is wider than at least a portion of the annular pattern 42A.

The annular pattern 42A includes one or more conductor patterns that continue with a constant width. Specifically, the annular pattern 42A includes linear patterns 43A, 43B, 43C, 43D formed linearly with a predetermined width W14. The linear patterns 43A, 43B, 43C, 43D are integral conductor patterns. In the annular pattern 42A, the linear patterns 43A, 43B, 43C, and 43D have a polygonal shape (specifically, a square shape) and a continuous frame shape.

The annular pattern 42B is a conductor pattern that continues from the end of the annular pattern 42A. The annular pattern 42B includes one or more conductor patterns that continue with a constant width. The annular pattern 42B includes linear patterns 44A, 44B, 44C, 44D configured linearly with a predetermined width W15. The linear patterns 44A, 44B, 44C, 44D are integral conductor patterns. In the annular pattern 42B, the linear patterns 44A, 44B, 44C, and 44D have a polygonal shape (specifically, a square shape) and a continuous frame shape. The annular pattern 42B is arranged outside the annular pattern 42A so as to surround the annular pattern 42A. The overall length of the annular pattern 42B is greater than the overall length of the annular pattern 42A. The total area of the annular pattern 42B is larger than the total area of the annular pattern 42A.

In the intermediate wiring layer 40, the relationship between the widths W14 and W15 is W14 ≦ W15, and it is more desirable that W14 <W15. The relationship between the widths of the second wiring layer 20 and the intermediate wiring layer 40 is W4 = W14 and W5 = W15.

The intermediate wiring layer 40 includes a continuous portion 47 continuous from the end portion of the annular pattern 42B arranged on the outermost side. The continuous portion 47 and the continuous portion 27 continuous from the end of the annular pattern 22B arranged on the outermost side of the second wiring layer 20 are electrically connected to each other by a via 28 which is a conductor portion provided between the layers. , Are configured to be equipotential with each other. In FIGS. 4 and 5, the via 28 is conceptually represented by a chain double-dashed line. On the other hand, the portion on the end side of the innermost annular pattern 22A in the second wiring layer 20 and the portion on the end side of the innermost annular pattern 42A in the intermediate wiring layer 40 are vias which are conductor portions provided between the layers. 19 are electrically connected to each other and are configured to have the same potential. In FIGS. 4 and 5, the via 19 is conceptually represented by a chain double-dashed line. That is, the second wiring layer 20 and the intermediate wiring layer 40 are connected in parallel between the via 28 and the via 19. Due to this structure, both ends of the second wiring layer 20 formed in a coil shape and both ends of the intermediate wiring layer 40 formed in a coil shape are electrically connected to each other to form a coil structure connected in parallel. Nothing. The intermediate wiring layer 40 corresponds to an example of another wiring layer. Specifically, the intermediate wiring layer 40 corresponds to an example of another second wiring layer connected in parallel to the second wiring layer 20.

Further, an inner end side portion in the coiled portion of a plurality of layers in which the first wiring layer 10 (first layer) and the intermediate wiring layer 30 (second layer) are connected in parallel, and the second wiring layer 20 ( The inner end side portion of the coiled portion of the plurality of layers in which the fourth layer) and the intermediate wiring layer 40 (third layer) are connected in parallel is electrically connected by the via 19. The coil component 1 can easily reduce the size of the via 19 while ensuring the electrical connection of the four wiring layers.

In this configuration, at least a part of the second wiring layer 20 is wider than at least a part of the first wiring layer 10. Specifically, the width of each part of the second wiring layer 20 and the intermediate wiring layer 40 is larger than the width of each part of the first wiring layer 10 and the intermediate wiring layer 30. For example, the constant width of any second conductor pattern in the second wiring layer 20 is larger than the constant width of any first conductor pattern in the first wiring layer 10. More specifically, any of the plurality of second linear patterns (linear patterns 23A to 23D, 24A to 24D) in the second wiring layer 20 is a plurality of first linear patterns in the first wiring layer 10. The width is larger than any of the patterns (linear patterns 13A to 13D, 14A to 14D, 15A to 15D). Further, any of the plurality of second linear patterns (linear patterns 23A to 23D, 24A to 24D) in the second wiring layer 20 is a plurality in the intermediate wiring layer 30 connected in parallel to the first wiring layer 10. The width is larger than any of the linear patterns (linear patterns 33A to 33D, 34A to 34D, 35A to 35D). Further, any of the plurality of linear patterns (linear patterns 43A to 43D, 44A to 44D) in the intermediate wiring layer 40 connected in parallel to the second wiring layer 20 is a plurality of first wiring patterns in the first wiring layer 10. The width is larger than any of the linear patterns 1 (linear patterns 13A to 13D, 14A to 14D, 15A to 15D). Further, all of the plurality of linear patterns (linear patterns 43A to 43D, 44A to 44D) in the intermediate wiring layer 40 are a plurality of linear patterns in the intermediate wiring layer 30 connected in parallel to the first wiring layer 10. The width is larger than any of the patterns (linear patterns 33A to 33D, 34A to 34D, 35A to 35D). More specifically, the coil component 1 has W1 ≦ W2 ≦ W3 ≦ W4 ≦ W5, and preferably W1 <W2 <W3 <W4 <W5.

2. 2. Example of effect In the coil component 1, at least a part of the second wiring layer 20 arranged on the second plate surface 60B (the other surface) side of the substrate 60 is on the first plate surface 60A (one surface) side of the substrate 60. It is wider than at least a part of the arranged first wiring layer 10. Therefore, in this coil component 1, it is easy to suppress the size of the wiring layer per winding on the first plate surface 60A (one surface) side of the substrate 60, and the resistance value of the wiring layer on the second plate surface 60B (the other surface) side. Is easy to suppress.

The coil component 1 has the width of the second wiring layer 20 arranged on the second plate surface 60B (the other surface) side of the substrate 60 in the portions of the first conductor pattern and the second conductor pattern that continue at least with a constant width. It can be secured larger than the width of the first wiring layer 10 arranged on the first plate surface 60A (one surface) side of the 60.

In the coil component 1, the first wiring layer 10 has a larger number of turns than the second wiring layer 20. In the first wiring layer 10 in which the width of the conductor is relatively suppressed, the coil component 1 can have a relatively large number of turns to increase the inductance, so that the first plate surface 60A (one surface) of the substrate 60 can be increased. In the wiring layer on the) side, the increase in inductance can be prioritized. On the other hand, in the second wiring layer 20 having a relatively small number of turns, the coil component 1 can increase the conductor width and suppress the resistance value, so that the second plate surface 60B (the other surface) of the substrate 60 can be suppressed. In the wiring layer on the side, the reduction of the resistance value can be prioritized.

In the coil component 1, since the first plate surface 60A (one surface) of the substrate 60 is a surface supported by the heat radiating portion 80, heat dissipation can be promoted on the first plate surface 60A (one surface) side of the substrate 60. can. In the configuration in which the first wiring layer 10 is arranged on the first plate surface 60A side of the substrate 60, the size of the wiring layer can be easily suppressed on the first plate surface 60A side, but on the other hand, heat is generated in the first wiring layer 10. Is a concern. On the other hand, since the coil component 1 can promote heat dissipation on the first plate surface 60A (one surface) side, heat generation is also suppressed while suppressing the size of the wiring layer on the first plate surface 60A side of the substrate 60. be able to.

In the coil component 1, the first wiring layer 10 and the second wiring layer 20 have a first annular pattern provided in an annular shape and a second annular pattern provided in an annular shape outside the first annular pattern. And at least a part of the second annular pattern is wider than at least a part of the first annular pattern. The coil component 1 can secure a larger width of the outer second annular pattern in which the path tends to be long, and can suppress the resistance value of the outer pattern in which the resistance value tends to be large.

In the coil component 1, intermediate wiring layers 30 and 40 are provided as other wiring layers. The coil component 1 can suppress the resistance value in each of the coil-shaped parallel connection portion including the first wiring layer 10 and the coil-shaped parallel connection portion including the second wiring layer 20.

<Other embodiments>
The present disclosure is not limited to the embodiments described above with reference to the description and drawings. For example, the features of the embodiments described above or below can be combined in any combination within a consistent range. Further, any of the features of the above-mentioned or later-described embodiments may be omitted unless it is clearly stated as essential. Further, the above-described embodiment may be modified as follows.

In the above-described embodiment, the coil component 1 has a configuration in which the first plate surface 60A (one surface) of the substrate 60 is in direct contact with the heat radiating portion 80 and is supported by the radiating portion 80. The plate surface 60A (one surface) may be indirectly supported by the heat radiating portion 80 via the other member. The other member in this case may be a resin member, a metal member, or another material. In this case, the other member may be provided on the entire surface of the first plate surface 60A, or may be provided only on a part of the first plate surface 60A.

In the above-described embodiment, the insulating layer is interposed between the first wiring layer 10 and the heat radiating portion 80, but the configuration is not limited to this. For example, the first wiring layer 10 may be configured to be in direct contact with the heat radiating portion 80.

In the example of FIG. 5, the number of turns of the second wiring layer 20 is 2, but even when the number of turns of the second wiring layer is 3 or more, the plurality of annular patterns constituting the second wiring layer are outside. It is better that the width becomes larger as it becomes.

It should be noted that the embodiments disclosed this time are exemplary in all respects and are not restrictive. The scope of the present invention is not limited to the embodiments disclosed here, but includes all modifications within the scope indicated by the claims or within the scope equivalent to the claims. Is intended.

1: Coil component 3: Coil part 10: First wiring layer (wiring layer)
12A: Circular pattern (first annular pattern)
12B: Circular pattern (second annular pattern)
12C: Circular pattern (second annular pattern)
20: Second wiring layer (wiring layer)
22A: Circular pattern (first annular pattern)
22B: Circular pattern (second annular pattern)
30: Intermediate wiring layer (wiring layer, other wiring layer)
32A: Circular pattern 32B: Circular pattern 32C: Circular pattern 40: Intermediate wiring layer (wiring layer, other wiring layer)
42A: Circular pattern 42B: Circular pattern 60: Substrate 60A: First plate surface (one side)
60B: Second plate surface (other surface)
61: Wiring part 62: Board body 64A: Insulation layer 64B: Insulation layer 66: Insulation layer 80: Heat dissipation part 81: First heat dissipation material 82: Second heat dissipation material

Claims (6)

The coil part is a coil component provided on the board,
The coil portion includes a plurality of wiring layers laminated on the substrate, and the coil portion includes a plurality of wiring layers.
The plurality of wiring layers have a first wiring layer wound on one side of the substrate and a second wiring layer wound on the other side of the board with respect to the first wiring layer. With a wiring layer,
At least a part of the second wiring layer is a coil component having a width larger than at least a part of the first wiring layer. The first wiring layer includes one or more first conductor patterns that continue with a constant width.
The second wiring layer includes one or more second conductor patterns that continue with a constant width.
The coil component according to claim 1, wherein the constant width of any of the second conductor patterns in the second wiring layer is larger than the constant width of any of the first conductor patterns in the first wiring layer. The coil component according to claim 1 or 2, wherein the first wiring layer has a larger number of turns than the second wiring layer. The coil component according to any one of claims 1 to 3, wherein the one surface of the substrate is a surface supported by a heat radiating portion. At least one of the first wiring layer and the second wiring layer has a first annular pattern provided in an annular shape and a second annular pattern provided in an annular shape outside the first annular pattern. Have and
The coil component according to any one of claims 1 to 4, wherein at least a part of the second annular pattern is wider than at least a part of the first annular pattern. The plurality of wiring layers have other wiring layers forming a wound configuration.
The coil component according to any one of claims 1 to 5, wherein the other wiring layers are connected in parallel to at least one of the first wiring layer and the second wiring layer.

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