JP2022014690A - Holding member, transfer member, transfer member manufacturing method, and light emitting substrate manufacturing method - Google Patents

Abstract

A micro light emitting diode chip is easily and reliably transferred from a holding member to a circuit board. A holding member (30) holds a plurality of light emitting diode chips (50). The holding member 30 includes a base material 31 and a plurality of protrusions 33 regularly arranged two-dimensionally on one surface of the base material 31 . The tip surface 35 of the projecting portion 33 includes an adhesive portion 35a having adhesiveness and a non-adhesive portion 35b. The area of the adhesive portion 35a on the tip surface 35 of at least one protrusion 33 is smaller than the area of the adhesive portion 35a on the tip surface 35 of the other protrusions 33 . [Selection drawing] Fig. 7

Description

The present disclosure relates to a holding member, a transfer member having a holding member, a method for manufacturing the transfer member, and a method for manufacturing a light emitting substrate using the transfer member.

In recent years, a light emitting board in which a plurality of micro light emitting diode chips are arranged on a circuit board having a circuit has been proposed. Such a light emitting substrate is used in a display device as, for example, a so-called micro LED display. Micro LED displays are superior to liquid crystal displays and the like in terms of brightness, power consumption, response speed, reliability, etc., and are attracting attention as next-generation lightweight and thin displays.

Conventionally, when manufacturing a light emitting substrate used for a micro LED display, a plurality of micro light emitting diode chips formed by individualizing a wafer have been arranged one by one on a circuit board by a pick and place process. In such a method for manufacturing a light emitting board, the pick-and-place process is repeated millions of times or more, so that the process of arranging the micro light emitting diode chip on the circuit board takes time, and the manufacturing cost increases accordingly. Will end up. That is, the light emitting substrate can be manufactured only with low productivity.

Therefore, it has been considered to arrange a micro light emitting diode chip from a chip substrate such as a wafer to a circuit board by using a holding member such as an adhesive stamp described in Patent Document 1 or a temporary holding substrate described in Patent Document 2. .. Since a holding member such as these can hold a plurality of micro light emitting diode chips, the light emitting board can be transferred by transferring the plurality of micro light emitting diode chips from the holding member to the circuit board in one pick and place step. Can be manufactured. Therefore, the time required for the process of arranging the micro light emitting diode chip on the circuit board can be shortened, and the manufacturing cost of the light emitting board can be reduced.

Special Table 2017-531915 Gazette Japanese Unexamined Patent Publication No. 2002-314502

By the way, when these holding members have a weak adhesive force for holding the micro light emitting diode chip, the held micro light emitting diode chip may be unintentionally dropped from the holding member. The micro light emitting diode chip that has fallen off from the holding member is not placed at the desired position on the circuit board. Therefore, a portion that does not emit light is generated on the light emitting substrate. Further, if the dropped micro light emitting diode chip unintentionally enters the circuit board, a problem may occur in the light emitting board. Therefore, the holding member is required to have a strong adhesive force for holding the micro light emitting diode chip.

However, if the holding member has too strong an adhesive force to hold the micro light emitting diode chip, the micro light emitting diode chip is transferred to the circuit board when a plurality of micro light emitting diode chips are arranged on the circuit board by using the holding member. It may remain held by the holding member without being held. That is, the micro light emitting diode chip is not arranged at a desired position on the circuit board, and a portion that does not emit light is generated on the light emitting board. Further, if the micro light emitting diode chip is to be held again from the chip substrate while the micro light emitting diode chip remains in the holding member, the micro light emitting diode chip remaining in the holding member collides with the micro light emitting diode chip of the chip substrate. It ends up. As a result, there may be a problem that the micro light emitting diode chip is damaged.

The present disclosure has been made in consideration of such a point, and an object of the present invention is to easily and surely transfer a micro light emitting diode chip from a holding member to a circuit board.

The holding member of the present disclosure is a holding member that holds a plurality of light emitting diode chips.
With the base material
A plurality of protrusions, which are regularly arranged two-dimensionally on one surface of the substrate, are provided.
The tip surface of the protruding portion includes an adhesive portion having adhesiveness and a non-adhesive portion having no adhesiveness.
The area of the adhesive portion on the tip surface of the at least one protrusion is smaller than the area of the adhesive portion on the tip surface of the other protrusion.

In the holding member of the present disclosure, the non-adhesive portion may be formed by a recess provided on the tip surface.

In the holding member of the present disclosure, the non-adhesive portion may be surrounded by the adhesive portion.

In the holding member of the present disclosure, at least a part of the protruding portion has an area of the adhesive portion on the tip surface increasing from one side in the first direction along the sheet surface of the base material toward the other side. You may line up in.

In the holding member of the present disclosure, the plurality of the protrusions may be arranged so that the area of the adhesive portion on the tip surface becomes smaller as the area of the adhesive portion is separated from a certain point of the base material.

In the holding member of the present disclosure, the protruding portion located on the most unilateral side in the first direction along the sheet surface of the base material may have the smallest area of the adhesive portion on the tip surface.

In the holding member of the present disclosure, the protruding portion having the smallest area of the adhesive portion on the tip surface is the most one in the second direction along the sheet surface of the base material which is non-parallel to the first direction. It may be located on the side.

In the holding member of the present disclosure, the ratio of the adhesive portion per unit area on the tip surface of one protrusion is from one side in the first direction along the sheet surface of the base material toward the other side. It may be larger.

In the holding member of the present disclosure, the protruding portion may have an inclined side surface provided so as to be inclined with respect to the tip surface.

In the holding member of the present disclosure, the inclined side surface of at least a part of the protruding portion may be provided on one side in the first direction along the sheet surface of the base material.

In the holding member of the present disclosure, the angle of the inclined side surface with the tip surface may become smaller as it approaches the tip surface.

In the holding member of the present disclosure, the angle between the tip surface and the inclined side surface at the connecting portion between the tip surface and the inclined side surface may be 80 ° or less.

In the holding member of the present disclosure, the tip surface of the protruding portion may have a chamfered shape.

The holding member of the present disclosure is
Further provided with an elastic layer provided between the substrate and the protrusion,
The Young's modulus of the elastic layer may be smaller than the Young's modulus of the substrate and may be greater than or equal to the Young's modulus of the protrusion.

The transfer member of the present disclosure is
With any of the holding members mentioned above,
A plurality of light emitting diode chips held by the holding member in the protruding portion are provided.

In the transfer member of the present disclosure, the size of the tip surface may be smaller than the size of the holding surface of the light emitting diode chip held by the holding member.

In the transfer member of the present disclosure, the size of the protrusion projected toward the tip surface may be smaller than the size of the holding surface of the light emitting diode chip held by the holding member.

In the transfer member of the present disclosure, the distance between the surface of the substrate supporting the protrusion and the tip surface of the protrusion may be longer than the maximum thickness of the light emitting diode chip.

In the first method of manufacturing a transfer member of the present disclosure, a chip substrate having an individualized light emitting diode chip is brought into contact with any of the above-mentioned holding members, and a plurality of the light emitting diode chips are brought into contact with a plurality of the holding members. The step of holding the protrusion on the protrusion is provided.

The method for manufacturing the second transfer member of the present disclosure is as follows.
A step of bringing a chip substrate having an individualized light emitting diode chip into contact with any of the above-mentioned holding members to hold the plurality of the light emitting diode chips by the plurality of protrusions in the first region of the holding member. When,
The step of moving the holding member relative to the chip substrate and
The chip substrate is brought into contact with the holding member, and the plurality of other light emitting diode chips different from the plurality of light emitting diode chips are brought into contact with the holding member, and the plurality of said protrusions in a second region different from the first region of the holding member. It is provided with a process of holding the unit.

The first method for manufacturing a light emitting substrate of the present disclosure is as follows.
A step of positioning any of the above-mentioned transfer members so that the light emitting diode chip is electrically connected to the circuit of the circuit board.
A step of transferring a plurality of the light emitting diode chips from the holding member of the transfer member to the circuit board is provided.

The method for manufacturing the second light emitting substrate of the present disclosure is as follows.
A holding member having a base material and a plurality of protrusions regularly arranged two-dimensionally on one surface of the base material, and a plurality of light emitting diode chips held by the holding member in the protrusions. It is a method of manufacturing a light emitting board by transferring the light emitting diode chip from the transfer member to the circuit of the circuit board.
The tip surface of the protruding portion includes an adhesive portion having adhesiveness and a non-adhesive portion having lower adhesiveness than the adhesive portion.
At least a part of the protrusions are arranged so that the area of the adhesive portion of the tip surface increases from one side in the first direction along the sheet surface of the base material toward the other side.
At least a part of the light emitting diode chip is transferred to the circuit board from one side in the first direction to the other side.

In the method for manufacturing a second light emitting substrate of the present disclosure, the light emitting diode chip transferred from one side of the first direction to the other side of the circuit board may have a longitudinal direction in the first direction. ..

According to the present disclosure, the micro light emitting diode chip can be easily and surely transferred from the holding member to the circuit board.

FIG. 1 is an exploded perspective view showing a display device using a light emitting substrate having a micro light emitting diode chip. FIG. 2 is a plan view of the light emitting substrate. FIG. 3 is an enlarged view showing a part of the light emitting substrate of FIG. FIG. 4 is a vertical cross-sectional view of the light emitting substrate along the IV-IV line of FIG. FIG. 5 is a vertical sectional view of a transfer member having a micro light emitting diode chip. FIG. 6 is a vertical sectional view of a holding member that holds a micro light emitting diode chip. FIG. 7 is an enlarged cross-sectional view showing a protruding portion of the holding member. FIG. 8 is a plan view of the holding member. FIG. 9 is an enlarged plan view showing one of the protruding portions of the holding member. FIG. 10 is a plan view showing a chip substrate having an individualized micro light emitting diode chip. FIG. 11 is a diagram for explaining a process of holding a micro light emitting diode chip in an example of a holding member. FIG. 12 is a diagram for explaining a process of holding a micro light emitting diode chip in an example of a holding member. FIG. 13 is a diagram for explaining a process of holding a micro light emitting diode chip in an example of a holding member. FIG. 14 is a diagram for explaining a process of holding a micro light emitting diode chip in an example of a holding member. FIG. 15 is a diagram for explaining a process of holding a micro light emitting diode chip in another example of the holding member. FIG. 16 is a diagram for explaining a process of holding a micro light emitting diode chip in another example of the holding member. FIG. 17 is a diagram for explaining a process of holding a micro light emitting diode chip in another example of the holding member. FIG. 18 is a diagram for explaining a process of holding a micro light emitting diode chip in another example of the holding member. FIG. 19 is a diagram for explaining a process of holding a micro light emitting diode chip in another example of the holding member. FIG. 20 is a diagram for explaining a process of holding a micro light emitting diode chip in another example of the holding member. FIG. 21 is a diagram for explaining a process of holding a micro light emitting diode chip in another example of the holding member. FIG. 22 is a diagram for explaining a process of transferring a micro light emitting diode chip from a transfer member to a circuit board. FIG. 23 is a diagram for explaining a process of transferring a micro light emitting diode chip from a transfer member to a circuit board. FIG. 24 is a diagram for explaining a process of transferring a micro light emitting diode chip from a transfer member to a circuit board. FIG. 25 is a diagram for explaining a process of transferring a micro light emitting diode chip from a transfer member to a circuit board.

Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the drawings attached to the present specification, the scale and the aspect ratios are appropriately changed and exaggerated from those of the actual product for the convenience of illustration and comprehension.

In addition, in this specification, the terms "board", "sheet", and "film" are not distinguished from each other based only on the difference in names. For example, the "sheet-like member" is a concept including a member that can be called a plate or a film, and therefore, the "sheet-like member" is a "film-like member" or a "plate-like member". And, it cannot be distinguished only by the difference in the name.

Further, the "seat surface" refers to a surface that coincides with the plane direction of the target sheet-shaped member when the target sheet-shaped member is viewed as a whole and from a broad perspective.

Furthermore, as used herein, the terms such as "parallel", "orthogonal", and "identical" and the values of length and angle that specify the shape and geometric conditions and their degrees are strictly used. Without being bound by the meaning, we will interpret it including the range where similar functions can be expected.

FIG. 1 is an exploded perspective view schematically showing the display device 1. The display device 1 can display an image or the like on the display surface 5. In the example shown in FIG. 1, the display device 1 has a light emitting substrate 10 and a diffusion layer 7 arranged so as to face the light emitting substrate 10. In the illustrated example, the surface of the diffusion layer 7 opposite to the side facing the light emitting substrate 10 is the display surface 5 of the display device 1. The display device 1 is a so-called micro LED display that uses light emitted from one or a plurality of light emitting diode chips as one pixel. In the illustrated example, the light emitted by the light emitting substrate 10 is diffused by the diffusion layer 7. However, not limited to the illustrated example, the diffusion layer 7 may be omitted in the display device 1.

The light emitting substrate 10 emits light to form an image to be displayed on the display surface 5. 2 is a plan view showing a part of the light emitting substrate 10, FIG. 3 is an enlarged plan view showing a part of the light emitting board 10 of FIG. 2, and FIG. 4 is an enlarged plan view of IV-IV of FIG. It is a vertical sectional view which shows a part of a light emitting substrate 10 along a line. As shown in FIGS. 2 to 4, the light emitting board 10 includes a circuit board 11, a plurality of micro light emitting diode chips 50 regularly arranged two-dimensionally on the circuit board 11, and a light emitting diode chip 50. It has an anisotropic conductive adhesive layer 15 for adhering to the. Here, the two-dimensional array means that they are not only arranged side by side in one direction on the surface, but also arranged at positions deviated from one direction. In addition, in this specification, a micro light emitting diode chip is also simply referred to as a light emitting diode chip.

As shown in FIG. 3, the circuit board 11 has a circuit 13. The circuit board 11 connects the micro light emitting diode chip 50 to the circuit 13. The circuit board 11 is a thin plate-shaped member. The circuit board 11 is formed by arranging the wiring of the circuit 13 made of copper or the like on an insulator such as glass epoxy.

Further, the circuit board 11 has a positioning means for positioning the micro light emitting diode chip 50 with the transfer member 20 in the step of transferring the micro light emitting diode chip 50 from the transfer member 20 described later. In the example shown in FIG. 2, the positioning means is a plurality of cross-shaped positioning marks M1. However, the cross-shaped positioning mark M1 is merely an example, and various positioning marks M1 such as a quadrangle, a triangle, and a circle can be used. Further, the positioning means may be other than the positioning mark.

The anisotropic conductive adhesive layer 15 fixes the micro light emitting diode chip 50 to the circuit board 11. The anisotropic conductive adhesive layer 15 is formed at a position where the light emitting diode chip 50 of the circuit board 11 is arranged. The anisotropic conductive adhesive layer 15 is typically a layer of a thermosetting resin containing fine metal particles. Such an anisotropic conductive adhesive layer 15 is a layer that does not have conductivity in the initial state, but when thermocompression bonded, only the pressure-applied portion is connected to each other by the metal particles. It is a material that becomes conductive. As the anisotropic conductive adhesive layer 15, for example, an anisotropic conductive film, an anisotropic conductive paste, or an anisotropic conductive adhesive can be used.

Further, as shown in FIG. 4, each micro light emitting diode chip 50 has two electrodes 51. The micro light emitting diode chip 50 is electrically connected to the circuit 13 via the electrode 51. By controlling the current flowing through the circuit 13 and applying a voltage between the two electrodes 51, any micro light emitting diode chip 50 can emit light. The image displayed by the display device 1 can be formed by combining the light emission of the plurality of micro light emitting diode chips 50.

The wavelength of the light emitted from the micro light emitting diode chip 50 is determined by the semiconductor material or the like constituting the micro light emitting diode chip 50. The micro light emitting diode chip 50 includes, for example, a GaAs-based compound semiconductor, an InP-based compound semiconductor, a GaN-based compound semiconductor, and the like. The dimensions of the micro light emitting diode chip 50 in a plan view can be, for example, a rectangular shape having a side of 3 μm or more and 1000 μm or less, and it is particularly preferable to have a longitudinal direction. The thickness of the micro light emitting diode chip 50 can be, for example, 10 μm or more and 500 μm or less.

In the illustrated example, the micro light emitting diode chip 50 includes a first light emitting diode chip 50R that emits red light in a wavelength range of 620 nm to 680 nm and a second light emitting diode chip that emits green light in a wavelength range of 530 nm to 570 nm. It includes 50 G and a third light emitting diode chip 50B that emits blue light having a wavelength range of 440 nm to 480 nm. The first light emitting diode chip 50R, the second light emitting diode chip 50G, and the third light emitting diode chip 50B arranged in the vicinity of each other form one pixel of the display device 1. Therefore, the light emitting substrate 10 can emit light that forms an image to be displayed in full color.

The light emitting substrate 10 is manufactured by arranging the micro light emitting diode chip 50 via the anisotropic conductive adhesive layer 15 at the position where the circuit 13 of the circuit board 11 is formed. In order to manufacture a light emitting board 10 in which a plurality of micro light emitting diode chips 50 are arranged on a circuit board 11 with high productivity, a holding member 30 as shown in FIG. 5 and a transfer member 20 having the holding member 30 are used. .. As the holding member 30, it is possible to hold about several hundred micro light emitting diode chips 50, and by repeating the transfer of the micro light emitting diode chip 50 from the holding member 30 to the circuit board 11 about several hundred times, the circuit board 11 A micro light emitting diode chip 50 can be arranged as a whole, or a micro light emitting diode chip 50 of about tens of thousands can be held, and a micro light emitting diode from the holding member 30 to the circuit board 11 once or several times. There is a device in which the micro light emitting diode chip 50 is arranged on the entire circuit board 11 by the transfer of the chip 50.

Hereinafter, an embodiment of the holding member 30 and the transfer member 20 having the holding member 30 will be described.

FIG. 5 is a vertical sectional view showing a part of the transfer member 20. The transfer member 20 is a member that enables the plurality of micro light emitting diode chips 50 to be transferred to the circuit board 11. The transfer member 20 has a holding member 30 and a plurality of micro light emitting diode chips 50 held by the holding member 30. The plurality of micro light emitting diode chips 50 are arranged so as to be held in the transfer member 20 at a position corresponding to the position where the micro light emitting diode chip 50 of the circuit board 11 to which the micro light emitting diode chip 50 is transferred is arranged. ing. In other words, the arrangement spacing and arrangement pattern of the plurality of micro light emitting diode chips 50 in the transfer member 20 is an integral multiple of the arrangement spacing and arrangement pattern in which the plurality of micro light emitting diode chips 50 should be arranged on the circuit board 11. It is particularly preferable that they are the same. Further, in the illustrated example, the first light emitting diode chip 50R is held by the holding member 30 as the micro light emitting diode chip 50.

The holding member 30 is a member capable of holding a plurality of micro light emitting diode chips 50. The micro light emitting diode chip 50 is held by the holding member 30 by coming into contact with the holding member 30 on the holding surface 50a, which is one of the main surfaces. FIG. 6 is a vertical sectional view showing a part of the holding member 30 of the present disclosure, and FIG. 8 is a plan view showing a part of an example of the holding member 30. As shown in FIGS. 6 and 8, the holding member 30 has a base material 31 and a plurality of protrusions 33 provided on one surface of the base material 31. Further, in the illustrated example, the holding member 30 further has an elastic layer 32 provided between the base material 31 and the protrusion 33. However, the elastic layer 32 may be omitted.

When the holding member 30 holds several hundreds of micro light emitting diode chips 50, the dimensions in the plan view of the region where the protruding portion 33 of the holding member 30 is arranged are a plurality of individualized pieces described later. The size of the chip substrate 40 having the micro light emitting diode chip 50 or less, for example, 2 cm ² or more and 25 cm ² or less. On the other hand, when the holding member 30 holds tens of thousands of micro light emitting diode chips 50, the dimension of the holding member 30 in the plan view is equal to or larger than the dimension in the plan view of the circuit board 11, for example, 176 cm ² or more. ..

The base material 31 is a member that appropriately supports the plurality of protrusions 33. As shown in FIG. 8, the base material 31 is positioned for positioning the chip substrate 40 having the micro light emitting diode chip 50 and the holding member 30 in the step of holding the micro light emitting diode chip 50 in the holding member 30 described later. Have a means. In the example shown in FIG. 8, the positioning means is a cross-shaped positioning mark M2. However, the cross-shaped positioning mark M2 is merely an example, and various positioning marks M2 such as a quadrangle, a triangle, and a circle can be used. When the holding member 30 holds several hundreds of micro light emitting diode chips 50, one or several positioning marks M2 may be provided, but the holding member 30 may have about tens of thousands of micro light emittings. When holding the diode chip 50, a plurality of positioning marks M2 are provided on one or the other surface of the base material 31 for each region for partitioning the holding member 30 at regular intervals. Further, in order to facilitate observation of the positioning mark M2, it is preferable that the base material 31 is transparent.

In addition, "transparency" means having transparency to the extent that one side of the member can see through the other side through the member, for example, 30% or more, more preferably. It means that it has a visible light transmittance of 70% or more. The visible light transmittance is specified as an average value of the transmittance at each wavelength when measured in the range of the measurement wavelength of 380 nm to 780 nm using a spectrophotometer. As the spectrophotometer, for example, a UV-3100PC manufactured by Shimadzu Corporation, which is a JIS K 0115 compliant product, can be used.

The thickness of the base material 31 is preferably 0.2 mm or more and 3.0 mm or less in consideration of transparency, appropriate supportability of the protruding portion 33, and the like. Further, in order to prevent the base material 31 from being stretched in the manufacturing process of the light emitting substrate 10 described later, it is preferable that the base material 31 has high rigidity. However, it is preferable that the base material 31 can be bent. Examples of the material of such a base material 31 include quartz glass substrate, soda glass substrate, fluorite substrate, calcium fluoride substrate, magnesium fluoride substrate, barium borosilicate glass, aminoborosilicate glass, aluminosilicate glass and the like. Glass substrate such as non-alkali glass substrate; resin substrate such as polycarbonate substrate, polypropylene substrate, polyethylene substrate, polymethylmethacrylate substrate, polyethylene terephthalate substrate; The substrate and the like can be mentioned.

The elastic layer 32 is a thin-film member that supports the plurality of protrusions 33. The elastic layer 32 has appropriate elasticity in order to appropriately transfer the micro light emitting diode chip 50 to the circuit board 11. Specifically, the Young's modulus of the elastic layer 32 is smaller than the Young's modulus of the base material 31, and is equal to or higher than the Young's modulus of the protruding portion 33. More specifically, the Young's modulus of the elastic layer 32 is 0.1 GPa or more and 10 GPa or less, preferably 0.1 GPa or more and 5 GPa or less. Further, in order to facilitate observation of the positioning mark M2 provided on the base material 31, the elastic layer 32 is preferably transparent.

The thickness of the elastic layer 32 is preferably 0.1 mm or more and 1.0 mm or less in consideration of transparency, appropriate supportability of the protruding portion 33, and the like. Examples of the material of such an elastic layer 32 include a silicone resin and a polycarbonate resin. In particular, dimethylpolysiloxane can be used as the silicone resin. The elastic layer 32 may be a resin obtained by applying these resins onto the base material 31 and irradiating the substrate 31 with ultraviolet rays or the like to cure the elastic layer 32, or a film of these resins.

When a film-formed elastic layer 32 is used, the base material 31 and the elastic layer 32 may be adhered to each other by, for example, an acrylic transparent adhesive, or for example, the base material 31 and the elastic layer 32 may be adhered to each other. The interface may be bonded by irradiating the interface with ultraviolet rays or the like to activate the interface between the base material 31 and the elastic layer 32. In particular, when a film-formed silicone resin is used as the elastic layer 32, the base material 31 and the elastic layer 32 may be bonded with a transparent silicone-based, acrylic-based, or rubber-based adhesive.

The protrusion 33 is a portion that holds the micro light emitting diode chip 50. The protruding portion 33 extends so as to project in the normal direction of the sheet surface of the base material 31. The protrusion 33 is provided at a position on one surface of the base material 31 where the holding member 30 holds the micro light emitting diode chip 50. That is, the protruding portion 33 is provided at a position corresponding to the position where the micro light emitting diode chip 50 of the circuit board 11 is arranged. Since the plurality of micro light emitting diode chips 50 are regularly arranged two-dimensionally on the circuit board 11, the plurality of protrusions 33 are regularly arranged two-dimensionally on one surface of the base material 31. The arrangement spacing and arrangement pattern of the protrusions 33 are integral multiples of the arrangement spacing and arrangement pattern of the plurality of micro light emitting diode chips 50 to be arranged on the circuit board 11, and are particularly the same. Is preferable. As shown in FIG. 8, the protrusions 33 are arranged at a pitch p1x in the first direction d1 and at a pitch p1y in the second direction d2 nonparallel to the first direction d1. In the illustrated example, the first direction d1 and the second direction d2 are directions along the sheet surface of the base material 31, and the first direction d1 and the second direction d2 are orthogonal to each other. The pitches p1x and p1y are, for example, 50 μm or more and 870 μm or less.

FIG. 7 is an enlarged view of a part of the protrusions 33 arranged in the first direction d1 shown in FIG. As is well shown in FIG. 7, the projecting portion 33 has a front end surface 35 which is a plane farthest from the base material 31, and an inclined side surface 36 provided so as to be inclined with respect to the tip surface 35. is doing. The surface inclined with respect to the tip surface 35 means a surface that is not parallel to and not perpendicular to the tip surface 35. The tip surface 35 is preferably parallel to the sheet surface of the base material 31. The tip surface 35 of the protrusion 33 includes a sticky portion 35a and a non-adhesive non-adhesive portion 35b. The adhesiveness of the adhesive portion 35a may be imparted by a material forming the protruding portion 33, or may be imparted by providing a layer made of the adhesive material on the tip surface 35. The adhesiveness of the tip surface 35 may be reduced, for example, by heating, cooling or UV irradiation. In addition, in this specification, adhesiveness is a property of sticking, and is not distinguished from adhesiveness. In the example shown in FIG. 7, the non-adhesive portion 35b is formed by a recess 39 provided on the tip surface 35. That is, in the example shown in FIG. 7, the non-adhesive portion 35b is a portion of the tip surface 35 that does not come into contact with the micro light emitting diode chip 50.

Due to the adhesiveness of the adhesive portion 35a of the tip surface 35, the holding surface 50a of the micro light emitting diode chip 50 is brought into contact with the tip surface 35 of the protruding portion 33 of the holding member 30, so that the protruding portion 33 makes the micro light emitting diode chip 50. Can be retained. The size of the tip surface 35 is smaller than the size of the holding surface 50a of the micro light emitting diode chip 50. Further, it is preferable that the size of the protruding portion 33 projected in the direction of the tip surface 35, in other words, the size of the protruding portion in a plan view is smaller than the size of the holding surface 50a of the micro light emitting diode chip 50. Note that the size of one surface is smaller than the size of another surface means that one surface can completely cover the other surface when the surfaces are overlapped with each other. For example, if each dimension of one surface is smaller than each dimension of another surface, the size of one surface is smaller than the size of another surface.

As is well shown in FIG. 7, the area of the adhesive portion 35a of the tip surface 35 of at least one protrusion 33 is smaller than the area of the adhesive portion 35a of the tip surface 35 of the other protrusion 33. In other words, among the plurality of protruding portions 33, there is a protruding portion 33 having a different area of the adhesive portion 35a of the tip surface 35. In particular, as shown in FIG. 7, in at least a part of the protruding portions 33 among the plurality of protruding portions 33, the area of the adhesive portion 35a of the tip surface 35 increases from one side of the first direction d1 toward the other side. They are lined up like this. The fact that the areas are lined up so as to increase from one side to the other side in the first direction d1 means that the area not only keeps changing so as to increase in order from one side to the other side, but also one side. It means that it does not become smaller as it goes from one side to the other side. However, it is preferable that the area of the adhesive portion 35a of the tip surface 35 continues to change so as to increase in order from one side to the other. In particular, the protruding portions 33 are arranged so that the area of the adhesive portion 35a of the tip surface 35 from the protruding portion 33 on the most one side in the first direction d1 increases from one side of the first direction d1 toward the other side. Is preferable. That is, it is preferable that the protruding portion 33 located on the most unilateral side of the first direction d1 has the smallest area of the adhesive portion 35a on the tip surface 35.

The area of the adhesive portion 35a of the tip surface 35 may change in various ways along the first direction d1 and the second direction d2. As an example, in at least a part of the protruding portions 33 arranged in the first direction d1, the area of the adhesive portion 35a of the tip surface 35 increases from one side of the first direction d1 toward the other side, and the area of the adhesive portion 35a increases in the second direction. The protruding portions 33 arranged in d2 may have the same area of the adhesive portion 35a on the tip surface 35. That is, in the protruding portion 33, the area of the adhesive portion 35a on the tip surface 35 may change only in the first direction d1. In such a holding member 30, the areas of the adhesive portions 35a of the tip surfaces 35 of all the protruding portions 33 may be arranged so as to increase from one side to the other side in the first direction d1. Alternatively, the area of the adhesive portion 35a of the tip surface 35 of a part of the protrusions 33 is arranged so as to increase from one side of the first direction d1 toward the other side, and the tip surface 35 of the other protrusions 33. The areas of the adhesive portions 35a may be arranged so as to increase from the other side of the first direction d1 toward one side.

As another example, in at least a part of the protruding portions 33 arranged in the first direction d1, the area of the adhesive portion 35a of the tip surface 35 increases from one side of the first direction d1 toward the other side. At least a part of the protruding portions 33 arranged in the two directions d2 may have an area of the adhesive portion 35a of the tip surface 35 increasing from one side to the other side of the second direction d2. In particular, the protruding portions 33 are arranged so that the area of the adhesive portion 35a of the tip surface 35 increases from one side of the second direction d2 to the other side up to the protruding portion 33 on the most one side of the second direction d2. Is preferable. That is, it is preferable that the protruding portion 33 located on the most unilateral side of the second direction d2 has the smallest area of the adhesive portion 35a on the tip surface 35. In this case, the protruding portion 33 having the smallest area of the adhesive portion 35a on the tip surface 35 is located on the most unilateral side of the first direction d1 and the most unilateral side of the second direction d2. In such a holding member 30, the area of the adhesive portion 35a of the tip surface 35 of all the protruding portions 33 increases from one side to the other side in the first direction d1 and from one side to the other side in the second direction d2. They may be lined up so as to increase toward.

As yet another example, in some of the protruding portions 33 arranged in the first direction d1, the area of the adhesive portion 35a of the tip surface 35 increases from one side of the first direction d1 toward the other side, and the first In the other part of the protruding portions 33 arranged in the one direction d1, the area of the adhesive portion 35a of the tip surface 35 may be increased from the other side of the first direction d1 toward one side. Further, in some of the protruding portions 33 arranged in the second direction d2, the area of the adhesive portion 35a of the tip surface 35 increases from one side of the second direction d2 toward the other side, and the area of the adhesive portion 35a increases in the second direction d2. In the other part of the protruding portions 33 arranged side by side, the area of the adhesive portion 35a of the tip surface 35 may be increased from the other side to the one side in the second direction d2. In particular, for some of the protruding portions 33, the area of the adhesive portion 35a of the tip surface 35 up to the protruding portion 33 on the most one side of the second direction d2 increases from one side of the second direction d2 toward the other side. It is preferable that they are lined up. That is, it is preferable that the protruding portion 33 located on the most unilateral side of the second direction d2 has the smallest area of the adhesive portion 35a on the tip surface 35. Therefore, the protruding portion 33 having the smallest area of the adhesive portion 35a on the tip surface 35 is located on the most unilateral side of the first direction d1 and on the most unilateral side of the second direction d2. In such a holding member 30, the area of the adhesive portion 35a of the tip surface 35 of the protruding portion 33 located on one side of the first direction d1 from a certain point on the base material 31 is from one side to the other side of the first direction d1. The area of the adhesive portion 35a of the tip surface 35 of the protruding portion 33 located on the other side of the first direction d1 increases toward one side from the other side of the first direction d1. ing. Further, the area of the adhesive portion 35a of the tip surface 35 of the protruding portion 33 located on one side of the second direction d2 from the relevant point increases from one side of the second direction d2 toward the other side. The area of the adhesive portion 35a of the tip surface 35 of the protruding portion 33 located on the other side of the second direction d2 increases from the other side of the second direction d2 toward one side. That is, the plurality of projecting portions 33 are arranged so that the area of the adhesive portion 35a of the tip surface 35 becomes smaller as the area of the adhesive portion 35a is separated from a certain point of the base material 31. Such a point may be an arbitrary point on the base material 31, but is, for example, a center point on the base material 31.

FIG. 9 is an enlarged plan view showing one of the protrusions 33 shown in FIG. As described above, the size of the tip surface 35 is smaller than the size of the holding surface 50a of the micro light emitting diode chip 50. As is well shown in FIG. 9, the tip surface 35 has a shape in which the holding surface 50a of the micro light emitting diode chip 50 held in the tip surface 35 as a whole is reduced, but the ridge angle thereof is removed. That is, it has a chamfered shape. Further, as shown in FIG. 9, the non-adhesive portion 35b is formed by a plurality of recesses 39. Each non-adhesive portion 35b is surrounded by the adhesive portion 35a. In other words, the edge of the tip surface 35 is an adhesive portion 35a.

As shown in FIGS. 7 and 9, the ratio of the adhesive portion 35a per unit area to the tip surface 35 of one protruding portion 33 increases from one side of the first direction d1 toward the other side. ing. That is, in the tip surface 35 of one protrusion 33, the non-adhesive portion 35b occupies a large proportion on one side of the first direction d1, and the adhesive portion 35a occupies a large proportion toward the other side of the first direction d1. ing. The unit area is preferably set so as to include a plurality of recesses 39 provided at different positions in the first direction d1. Further, as shown in FIG. 9, the ratio of the adhesive portion 35a per unit area on the tip surface 35 of one protrusion 33 is the area of the recess 39 provided on the tip surface 35 in the first direction d1. It can be changed by changing the density.

The inclined side surface 36 of at least a part of the protruding portion 33 is provided on one side of the first direction d1. Such an inclined side surface 36 is provided at least on one side of the first direction d1 in the protruding portion 33 in which the area of the adhesive portion 35a of the tip surface 35 increases from one side of the first direction d1 toward the other side. In the protruding portion 33 in which the area of the adhesive portion 35a of the tip surface 35 increases from the other side of the first direction d1 toward one side, the adhesive portion 33 is provided at least on the other side of the first direction d1. Is preferable. In the example shown in FIGS. 7 and 9, the inclined side surface 36 of the protrusion 33 is provided on one side and the other side of the first direction d1. Further, as shown in FIG. 9, the inclined side surface 36 of the protrusion 33 is also provided on one side and the other side of the second direction d2. That is, each side surface of the protruding portion 33 is an inclined side surface 36 inclined with respect to the tip surface 35.

As shown in FIG. 7, the tip surface 35 and the inclined side surface 36 are connected at the connection portion 37. It is preferable that the smaller angle θ between the tip surface 35 and the inclined side surface 36 at the connecting portion 37 is smaller. Specifically, the angle θ formed by the tip surface 35 and the inclined side surface 36 in the connecting portion 37 is preferably 80 ° or less, more preferably 45 ° or less, and further preferably 10 ° or less. It is preferably 0 °, and most preferably 0 °. The angle θ formed by the tip surface 35 and the inclined side surface 36 at the connecting portion 37 is 0 °, which means that the tip surface 35 and the inclined side surface 36 are smoothly connected.

Further, it is preferable that the angle formed by the inclined side surface 36 with the tip surface 35 becomes smaller as it approaches the tip surface 35. In other words, as shown in FIG. 7, it is preferable that the inclined side surface 36 has a convex curved surface. It should be noted that the angle formed by the inclined side surface 36 with the tip surface 35 becomes smaller as it approaches the tip surface 35, that is, the angle formed by the tip surface 35 and the inclined side surface 36 is continuous according to the distance from the tip surface 35. Not only does it continue to change to, but it also means that it does not include a portion where the angle formed with the tip surface 35 increases as it approaches the tip surface 35. However, it is preferable that the angle formed by the inclined side surface 36 between the tip surface 35 and the inclined side surface 36 continuously changes according to the distance from the tip surface 35.

The distance between the surface supporting the protrusion 33 of the elastic layer 32 and the tip surface 35 of the protrusion, in other words, the length L of the protrusion 33 protruding from the elastic layer 32 shown in FIG. 5 is the micro light emitting diode chip. It is preferably longer than the maximum thickness of 50, for example, 0.1 μm or more and 100 μm or less. Further, the protruding portion 33 has flexibility. Specifically, the Young's modulus of the protruding portion 33 is preferably 10 GPa or less, and more preferably 5 GPa or less. Such a protrusion 33 is made of, for example, a silicone resin, and can be formed by using a photolithography technique or an imprint technique.

Next, an example of a method of causing the holding member 30 to hold the micro light emitting diode chip 50, that is, a method of manufacturing the transfer member 20, will be described. In the following description, as an example, a method of causing the holding member 30 to hold the first light emitting diode chip 50R will be described.

First, a method of holding the micro light emitting diode chip 50 held by the holding member 30 holding several hundreds of micro light emitting diode chips 50 will be described.

As shown in FIG. 10, a chip substrate 40 having a plurality of individualized micro light emitting diode chips 50 on one surface is prepared. Individualization means that the wafer is divided into a plurality of chips having a desired size by, for example, dicing or etching. In the illustrated example, the first light emitting diode chip 50R is shown as the micro light emitting diode chip 50. The chip substrate 40 may be the individualized wafer itself, or may be a substrate in which the micro light emitting diode chip 50 is temporarily transferred from the individualized wafer. The chip substrate 40 has a chip base material 41 and a plurality of micro light emitting diode chips 50 arranged on the chip base material 41. Further, the chip substrate 40 has a positioning means for positioning with the holding member 30. In the example shown in FIG. 10, the positioning means is a plurality of cross-shaped positioning marks M3. However, the cross-shaped positioning mark M3 is merely an example, and various positioning marks M3 such as a quadrangle, a triangle, and a circle can be used.

Each micro light emitting diode chip 50 has two electrodes 51 provided on the side of the chip base material 41. Further, the micro light emitting diode chips 50 are arranged on the chip base material 41 at a pitch p2x in the first direction d1 and at a pitch p2y in the second direction d2 nonparallel to the first direction d1. That is, the micro light emitting diode chip 50 is formed by disassembling the wafer in the first direction d1 and the second direction d2. The pitches p2x and p2y are, for example, 5 μm or more and 200 μm or less. Each of the individualized micro light emitting diode chips 50 may have a square shape in a plan view, but as shown in FIG. 10, it may have a rectangular shape having a longitudinal direction in the first direction d1. preferable.

Here, an integral multiple of the pitch p2x of the arrangement in the first direction d1 of the micro light emitting diode chip 50 of the chip substrate 40 is the pitch p1x of the arrangement in the first direction d1 of the plurality of protrusions 33 of the holding member 30. .. Similarly, an integral multiple of the pitch p2y of the arrangement in the second direction d2 of the micro light emitting diode chip 50 of the chip substrate 40 is the pitch p1y of the arrangement in the second direction d2 of the plurality of protrusions 33 of the holding member 30. .. Since the arrangement spacing and arrangement pattern of the protrusions 33 are the same as the arrangement spacing and arrangement pattern of the plurality of micro light emitting diode chips 50 arranged on the circuit board 11, the micro light emitting diode chip 50 of the chip substrate 40 has the same arrangement spacing and arrangement pattern. An integral multiple of the pitch p2x of the array in the one direction d1 is an integral multiple of the pitch of the array in the first direction d1 of the micro light emitting diode chip 50 having the circuit board 11, and the pitch p2y of the array in the second direction d2. The integral multiple is an integral multiple of the pitch of the array in the second direction d2 of the micro light emitting diode chip 50 having the circuit board 11.

Next, as shown in FIG. 11, the surface of the chip substrate 40 on the side where the micro light emitting diode chip 50 is arranged and the surface on which the protrusion 33 of the substrate 31 of the holding member 30 is arranged are arranged. , Face to face. After that, the chip substrate 40 and the holding member 30 are positioned. Positioning is performed based on the positioning means included in the base material 31 of the holding member 30 and the positioning means included in the chip substrate 40. As a specific example, positioning is performed by matching the positioning mark M2 of the base material 31 with the positioning mark M3 of the chip substrate 40 in the holding member 30. The coincidence of the positioning marks M2 and M3 can be confirmed, for example, by the camera 80 arranged on the side opposite to the surface on which the protrusions 33 of the holding member 30 are arranged. Since the base material 31 and the elastic layer 32 are transparent, the positioning marks M2 and M3 are confirmed via the base material 31 and the elastic layer 32 from the side opposite to the surface on which the protrusions 33 of the holding member 30 are arranged. It is possible.

The positioning of the chip substrate 40 and the holding member 30 may be performed by only one of the positioning means included in the base material 31 of the holding member 30 and the positioning means included in the chip substrate 40.

Next, as shown in FIG. 12, the chip substrate 40 and the holding member 30 are brought close to each other to bring the chip substrate 40 into contact with the holding member 30. When the chip substrate 40 comes into contact with the holding member 30, the micro light emitting diode chip 50 of the chip substrate 40 comes into contact with the tip surfaces 35 of the plurality of protrusions 33 of the holding member 30. When the micro light emitting diode chip 50 comes into contact with the adhesive tip surface 35, the plurality of protrusions 33 hold the micro light emitting diode chip 50. That is, the micro light emitting diode chip 50 of the chip substrate 40 is held on the plurality of protrusions 33 of the holding member 30.

Here, since the protruding portion 33 has flexibility, specifically, since the Young's modulus of the protruding portion 33 is 10 GPa or less, more preferably 5 GPa or less, when the chip substrate 40 comes into contact with the holding member 30, The protrusion 33 of the holding member 30 may be deformed in a direction perpendicular to the contact surface between the chip substrate 40 and the protrusion 33. Therefore, the contact pressure that brings the chip substrate 40 into contact with the protrusions 33 tends to be uniformly applied to each of the protrusions 33 that are in contact with the chip substrate 40. As a result, it is possible to prevent a part of the protruding portion 33 from coming into contact with the micro light emitting diode chip 50 of the chip substrate 40 at a high contact pressure. When a part of the protrusion 33 comes into contact with the micro light emitting diode chip 50 at a high contact pressure, the micro light emitting diode chip 50 may be destroyed by the high contact pressure. Therefore, it is preferable that a part of the protruding portion 33 does not come into contact with the micro light emitting diode chip 50 at a high contact pressure.

Further, since the protruding portion 33 has flexibility, specifically, the Young's modulus of the protruding portion 33 is 10 GPa or less, more preferably 5 GPa or less, so that when the chip substrate 40 comes into contact with the holding member 30, it protrudes. The tip surface 33a of the portion 33 may be deformed and expanded. Since the area where the protrusion 33 comes into contact with the micro light emitting diode chip 50 becomes large, the protrusion 33 can more reliably hold the micro light emitting diode chip 50 from the chip substrate 40.

FIG. 13 is a plan view showing a state in which the chip substrate 40 shown in FIG. 12 is in contact with a plurality of protruding portions 33 of the holding member 30. One protrusion because the chip substrate 40 and the holding member 30 are positioned and the size of the tip surface 35 of the protrusion 33 is smaller than the size of the holding surface 50a of the micro light emitting diode chip 50. One micro light emitting diode chip 50 can be appropriately held with respect to 33. Further, as shown in FIG. 13, the pitch p1x of the arrangement in the first direction d1 of the plurality of protrusions 33 of the holding member 30 is an integer of the pitch p2x of the arrangement in the first direction d1 of the micro light emitting diode chip 50 of the chip substrate 40. Since it is doubled, one micro light emitting diode chip 50 can be held for all the protrusions 33 in the first direction d1. In the illustrated example, the pitch p1x of the arrangement in the first direction d1 of the plurality of protrusions 33 is twice the pitch p2x of the arrangement in the first direction d1 of the micro light emitting diode chip 50 of the chip substrate 40. Similarly, since the pitch p1y of the arrangement in the second direction d2 of the plurality of protrusions 33 of the holding member 30 is an integral multiple of the pitch p2y of the arrangement in the second direction d2 of the micro light emitting diode chip 50 of the chip substrate 40. One micro light emitting diode chip 50 can be held for each of all the protrusions 33 in the second direction d2. In the illustrated example, the pitch p1y of the arrangement in the second direction d2 of the plurality of protrusions 33 of the holding member 30 is 6 times the pitch p2y of the arrangement in the second direction d2 of the micro light emitting diode chip 50 of the chip substrate 40. ing.

After that, as shown in FIG. 14, by separating the chip substrate 40 and the holding member 30, the light emitting diode chip 50 is transferred from the chip substrate 40 to the holding member 30, and the transfer member 20 is manufactured.

Next, a method of holding the micro light emitting diode chip 50 held by the holding member 30 holding the micro light emitting diode chips 50 of about tens of thousands will be described.

First, as in the method of holding the micro light emitting diode chip 50 held by the holding member 30 holding several hundreds of micro light emitting diode chips 50, the pieces are separated on one surface as shown in FIG. A chip substrate 40 having a plurality of micro light emitting diode chips 50 is prepared. In the illustrated example, the first light emitting diode chip 50R is shown as the micro light emitting diode chip 50. The chip substrate 40 is the same as the above-mentioned method of holding the micro light emitting diode chip 50 held by the holding member 30 holding several hundred micro light emitting diode chips 50.

Next, as shown in FIG. 15, a surface of the chip substrate 40 on the side where the micro light emitting diode chip 50 is arranged and a surface on which the protrusion 33 of the substrate 31 of the holding member 30 is arranged. , Face to face. After that, the chip substrate 40 and the first region R1 of the holding member 30 are positioned. Positioning is performed based on the positioning means of the base material 31 and the positioning means of the chip substrate 40 in the first region R1 of the holding member 30. As a specific example, positioning is performed by matching the positioning mark M2 of the base material 31 with the positioning mark M3 of the chip substrate 40 in the first region R1 of the holding member 30. The coincidence of the positioning marks M2 and M3 can be confirmed, for example, by the camera 80 arranged on the side opposite to the surface on which the protrusions 33 of the holding member 30 are arranged. Since the base material 31 and the elastic layer 32 are transparent, the positioning marks M2 and M3 are confirmed via the base material 31 and the elastic layer 32 from the side opposite to the surface on which the protrusions 33 of the holding member 30 are arranged. It is possible.

The positioning of the chip substrate 40 and the holding member 30 may be performed by only one of the positioning means included in the base material 31 of the holding member 30 and the positioning means included in the chip substrate 40.

Next, as shown in FIG. 16, the chip substrate 40 and the holding member 30 are brought close to each other to bring the chip substrate 40 into contact with the holding member 30. When the chip substrate 40 comes into contact with the holding member 30, the micro light emitting diode chip 50 of the chip substrate 40 comes into contact with the tip surfaces 35 of the plurality of protrusions 33 in the first region R1 of the holding member 30. When the micro light emitting diode chip 50 comes into contact with the adhesive tip surface 35, the plurality of protrusions 33 hold the micro light emitting diode chip 50. That is, the micro light emitting diode chip 50 is held from the chip substrate 40 on a plurality of protrusions 33 in the first region R1 of the holding member 30.

Here, since the protruding portion 33 has flexibility, specifically, since the Young's modulus of the protruding portion 33 is 10 GPa or less, more preferably 5 GPa or less, the circuit board 11 is subjected to the above-mentioned multiple transfers. Similar to the method for manufacturing the transfer member 20 in which the micro light emitting diode chip 50 is arranged as a whole, it is possible to prevent a part of the protruding portion 33 from coming into contact with the micro light emitting diode chip 50 of the chip substrate 40 at a high contact pressure. ..

FIG. 17 is a plan view showing a state in which the chip substrate 40 shown in FIG. 16 is in contact with a plurality of protrusions 33 in the first region R1 of the holding member 30. The first region R1 is due to the fact that the chip substrate 40 and the holding member 30 are positioned and the size of the tip surface 35 of the protruding portion 33 is smaller than the size of the holding surface 50a of the micro light emitting diode chip 50. One micro light emitting diode chip 50 can be appropriately held by one protrusion 33 of the inside. Further, as shown in FIG. 17, the pitch p1x of the arrangement in the first direction d1 of the plurality of protrusions 33 of the holding member 30 is an integer of the pitch p2x of the arrangement in the first direction d1 of the micro light emitting diode chip 50 of the chip substrate 40. Since it is doubled, one micro light emitting diode chip 50 can be held for all the protrusions 33 in the first region R1 in the first direction d1. In the illustrated example, the pitch p1x of the arrangement in the first direction d1 of the plurality of protrusions 33 of the holding member 30 is twice the pitch p2x of the arrangement in the first direction d1 of the micro light emitting diode chip 50 of the chip substrate 40. ing. Similarly, since the pitch p1y of the arrangement in the second direction d2 of the plurality of protrusions 33 of the holding member 30 is an integral multiple of the pitch p2y of the arrangement in the second direction d2 of the micro light emitting diode chip 50 of the chip substrate 40. One micro light emitting diode chip 50 can be held for each of all the protrusions 33 in the first region R1 in the second direction d2. In the illustrated example, the pitch p1y of the arrangement in the second direction d2 of the plurality of protrusions 33 of the holding member 30 is 6 times the pitch p2y of the arrangement in the second direction d2 of the micro light emitting diode chip 50 of the chip substrate 40. ing.

Then, as shown in FIG. 18, after separating the chip substrate 40 and the holding member 30, the holding member 30 is relatively moved with respect to the chip substrate 40. The position after the holding member 30 is relatively moved with respect to the chip substrate 40 is determined by the positioning means included in the base material 31 and the positioning means included in the chip substrate 40. For example, positioning is performed by matching the positioning mark M2 of the base material 31 with the positioning mark M3 of the chip substrate 40 in the second region R2 of the holding member. The second region R2 of the holding member 30 is a region different from the first region R1, and in the illustrated example, it is a region adjacent to the first region R1 in the first direction d1.

Next, as shown in FIG. 19, the chip substrate 40 and the holding member 30 are brought close to each other to bring the chip substrate 40 into contact with the holding member 30. Upon contact with the chip substrate 40 holding member 30, the micro light emitting diode chip 50 of the chip substrate 40 comes into contact with the tip surfaces 35 of the plurality of protrusions 33 in the second region R2 of the holding member 30. The micro light emitting diode chip 50 in contact with the tip surface 35 of the protrusion 33 in the second region R2 is different from the micro light emitting diode chip 50 in contact with the tip surface 35 in the first region R1. When the micro light emitting diode chip 50 comes into contact with the adhesive tip surface 35, the plurality of protrusions 33 hold the plurality of micro light emitting diode chips 50. That is, the micro light emitting diode chip 50 is held from the chip substrate 40 on a plurality of protrusions 33 in the second region R2 of the holding member 30.

FIG. 20 is a plan view showing a state in which the chip substrate 40 shown in FIG. 19 is in contact with a plurality of protrusions 33 in the second region R2 of the holding member 30. The chip substrate 40 and the holding member 30 are positioned, the size of the tip surface 35 of the protruding portion 33 is smaller than the size of the holding surface 50a of the micro light emitting diode chip 50, and the protrusion of the holding member 30. Since the pitches p1x and p1y of the arrangement of the portions 33 are integral multiples of the pitches p2x and p2y of the arrangement of the micro light emitting diode chips 50 of the chip substrate 40, 1 for all the protruding portions 33 in the second region R2, respectively. One micro light emitting diode chip 50 can be held.

By repeating the above steps of moving the holding member 30 relative to the chip substrate 40 and holding the micro light emitting diode chip 50 in the protruding portion 33 of a certain region, a plurality of holding members 30 are held. The micro light emitting diode chip 50 can be held in each protrusion 33 of the region. As shown in FIG. 21, by moving the holding member 30 relative to the chip substrate 40 in the first direction d1 and the second direction d2, the micro light emitting diode is formed in the protruding portion 33 over the entire region of the holding member 30. The chip 50 can be held. By the above steps, the transfer member 20 having the holding member 30 and the plurality of micro light emitting diode chips 50 is manufactured.

In the above-mentioned example, a method of holding the first light emitting diode chip 50R on the holding member 30 as the micro light emitting diode chip 50 has been described, but the second light emitting diode chip 50G and the third light emitting diode chip 50B are also subjected to the same process. Each can be held by a separate holding member 30.

Next, a method of arranging the micro light emitting diode chip 50 on the circuit board 11 using the transfer member 20, that is, a method of manufacturing the light emitting board 10 will be described. In the following description, as an example, a method of arranging the first light emitting diode chip 50R on the circuit board 11 will be described.

First, as shown in FIG. 22, the surface of the circuit board 11 on which the circuit 13 is formed and the surface of the transfer member 20 on which the micro light emitting diode chip 50 is held are made to face each other. After that, the circuit board 11 and the transfer member 20 are positioned. Positioning is performed based on, for example, a positioning means included in the circuit board 11 and a positioning means included in the transfer member 20. As a specific example, positioning is performed by matching the positioning mark M1 of the circuit board 11 with the positioning mark M2 of the base material 31 of the transfer member 20. The coincidence of the positioning marks M1 and M2 can be confirmed by the camera 90 arranged on the side opposite to the surface on which the micro light emitting diode chip 50 of the transfer member 20 is held. Since the base material 31 and the elastic layer 32 are transparent, the positioning marks M1 and M2 are placed via the base material 31 and the elastic layer 32 from the side opposite to the surface of the transfer member 20 where the micro light emitting diode chip 50 is held. You can check.

The positioning of the circuit board 11 and the transfer member 20 may be performed by only one of the positioning means of the circuit board 11 and the positioning means of the base material 31 of the holding member 30. Further, the positioning mark M2 included in the base material 31 used for positioning the circuit board 11 and the transfer member 20 may be the same as the positioning mark used for positioning the chip substrate 40 and the holding member 30. The positioning mark may be different from the positioning mark used for positioning the chip substrate 40 and the holding member 30.

Next, as shown in FIG. 23, the transfer member 20 is brought into contact with the circuit board 11. Since the circuit board 11 and the transfer member 20 are positioned, the micro light emitting diode chip 50 is brought into contact with the circuit 13 of the circuit board 11 by bringing the micro light emitting diode chip 50 into contact with the position where the circuit 13 of the circuit board 11 is provided. Can be electrically connected. An anisotropic conductive adhesive layer 15 for adhering the micro light emitting diode chip 50 to the circuit board 11 is formed at a position of the circuit board 11 where the micro light emitting diode chip 50 is arranged. For example, in the case of an anisotropic conductive film, the anisotropic conductive adhesive layer 15 is usually laminated by laminating, and in the case of an anisotropic conductive paste or an anisotropic conductive adhesive, it is usually applied as a coating film. It is laminated.

Here, since the protruding portion 33 has flexibility, specifically, the Young's modulus of the protruding portion 33 is 10 GPa or less, more preferably 5 GPa or less. Therefore, when the transfer member 20 is pressed against the circuit board 11, the transfer member 20 is pressed. The protrusion 33 of the holding member 30 may be deformed in a direction perpendicular to the pressing surface between the circuit board 11 and the protrusion 33. Therefore, the pressure for pressing the transfer member 20 against the circuit board 11 tends to be uniformly applied to the protruding portions 33 pressed against the circuit board 11. As a result, it is possible to prevent the micro light emitting diode chip 50 held by a part of the protrusion 33 from being pressed against the circuit board 11 with a high pressure. When the micro light emitting diode chip 50 held by a part of the protrusion 33 is pressed against the circuit board 11 with a high pressure, the micro light emitting diode chip 50 may be destroyed by the high pressure. Therefore, it is preferable that the micro light emitting diode chip 50 held by a part of the protrusion 33 is not pressed against the circuit board 11 with a high pressure.

The anisotropic conductive adhesive layer 15 is heated while the transfer member 20 is pressed against the circuit board 11. By thermocompression bonding the anisotropic conductive adhesive layer 15, the circuit board 11 and the micro light emitting diode chip 50 are adhered to each other. Further, according to the anisotropic conductive adhesive layer 15, conductivity can be exhibited in the pressing direction. Therefore, each electrode 51 of the micro light emitting diode chip 50 can be electrically connected to the circuit 13 facing in the pressing direction.

Then, as shown in FIG. 24, by bending the base material 31, the holding member 30 is separated from the circuit board 11 from one side to the other side of the first direction d1 in at least a part of the region. That is, at least a part of the micro light emitting diode chip 50 is transferred from the holding member 30 to the circuit board 11 from one side of the first direction d1 toward the other side. The area of the adhesive portion 35a of the tip surface 35 is transferred from the holding member 30 from one side to the other side of the first direction d1 to the circuit board 11, and the area of the adhesive portion 35a is larger from one side to the other side in the first direction. It is a micro light emitting diode chip 50 held by the protrusions 33 arranged so as to be. That is, the micro light emitting diode chips 50 held in the protruding portion 33 having a small area of the adhesive portion 35a on the tip surface 35 are transferred from the holding member 30 to the circuit board 11 in order.

After transferring all the micro light emitting diode chips 50 held by the holding member 30 to the circuit board 11, the holding member 30 is separated from the circuit board 11 and the holding member 30 is removed as shown in FIG. 25. Through the above steps, the plurality of micro light emitting diode chips 50 held by the holding member 30 of the transfer member 20 are electrically connected to the circuit 13 of the circuit board 11, and the holding member 30 of the transfer member 20 is connected to the circuit board. It is collectively transferred to 11.

When the holding member 30 holds tens of thousands of micro light emitting diode chips 50 and the micro light emitting diode chips 50 are arranged on the entire circuit board 11 by only one transfer, the light emitting board 10 is arranged by the above step. Can be manufactured. On the other hand, for example, when the holding member 30 holds several hundreds of micro light emitting diode chips 50 and the micro light emitting diode chips 50 are arranged on the entire circuit board 11 by a plurality of transfers, the above-mentioned holding member 30 is used. The micro light emitting diode chip 50 is placed on the entire circuit board 11 in the process of manufacturing the transfer member 20 by holding the micro light emitting diode chip 50 in the circuit board 11 and arranging the micro light emitting diode chip 50 on the circuit board 11 using the transfer member 20. The light emitting substrate 10 can be manufactured by repeating the process until it is arranged.

In the above-mentioned example, a method of transferring the first light emitting diode chip 50R to the circuit board 11 as the micro light emitting diode chip 50 has been described. By performing the same step as this step for another holding member 30 for holding the second light emitting diode chip 50G and another holding member 30 for holding the third light emitting diode chip 50B, three types are applied to the circuit board 11. A light emitting board 10 on which the micro light emitting diode chip 50 of the above is arranged is manufactured. That is, it is possible to obtain a light emitting substrate 10 capable of emitting light in full color.

The distance between the surface supporting the protruding portion 33 of the base material 31 and the tip surface 35 of the protruding portion 33, that is, the protruding length L of the protruding portion 33 of the holding member 30 is the thickness of the micro light emitting diode chip 50. It's bigger than that. Therefore, even when the first light emitting diode chip 50R is transferred to the circuit board 11 and then the second light emitting diode chip 50G is transferred to the circuit board 11 by using the transfer member 20, the transfer of the second light emitting diode chip 50G is performed. , It is not easily disturbed by the first light emitting diode chip 50R transferred to the circuit board 11.

By the way, as described above, when a plurality of micro light emitting diode chips held by the holding member are arranged on the circuit board, the micro light emitting diode chips are not transferred to the circuit board and remain held by the holding member. Sometimes. In this case, the micro light emitting diode chip is not arranged in the portion of the light emitting board where the micro light emitting diode chip should be arranged, and a portion that does not emit light is generated on the light emitting substrate. Further, if the micro light emitting diode chip is to be held again from the wafer while the micro light emitting diode chip remains in the holding member, the micro light emitting diode chip remaining in the holding member and the micro light emitting diode chip of the wafer collide with each other. .. As a result, there may be a problem that the micro light emitting diode chip is damaged. The damaged micro light emitting diode chip does not exhibit the light emitting function, and therefore, a portion that does not emit light is generated on the light emitting substrate. In order to avoid such a defect, it is required to reliably transfer the micro light emitting diode chip from the holding member to the circuit board. Further, from the viewpoint of improving the productivity of the light emitting substrate, it is desirable that the step of transferring the micro light emitting diode chip from the holding member to the circuit board is carried out easily and in a short time.

In the holding member 30 of the present embodiment, the area of the adhesive portion 35a of the tip surface 35 of at least one protruding portion 33 is smaller than the area of the adhesive portion 35a of the tip surface 35 of the other protruding portion 33. When the micro light emitting diode chip 50 held by such a holding member 30 is transferred to the circuit board 11, the micro light emitting diode chip 50 held by the protruding portion 33 having a small area of the adhesive portion 35a of the tip surface 35 is the tip surface. It is easy to peel off from 35, and therefore it is easy to be transferred to the circuit board 11. This is because when the micro light emitting diode chip 50 is transferred from the protruding portion 33, the length in the direction orthogonal to the peeling direction at the contact surface between the tip surface 33a of the protruding portion 33 and the micro light emitting diode chip 50 is shorter. It is considered that this is because it is easy to peel off. Then, the length of the contact surface between the tip surface 33a of the protruding portion 33 and the micro light emitting diode chip 50 in the direction orthogonal to the peeling direction is from the shortest to the longest, in other words, the micro light emitting diode chip 50 is easily peeled off. By doing so, it is considered that the micro light emitting diode chip 50 can be easily and surely transferred to the circuit board 11. However, the present embodiment is not limited to this speculation. As described above, according to the holding member 30 of the present embodiment, the micro light emitting from the holding member 30 to the circuit board 11 without complicating the step of transferring the micro light emitting diode chip 50 from the holding member 30 to the circuit board 11. The diode chip 50 can be easily transferred. That is, the micro light emitting diode chip 50 can be easily and surely transferred from the holding member 30 to the circuit board 11.

Further, the non-adhesive portion 35b is formed by a recess 39 provided in the tip surface 35. Since the recess 39 can be easily formed with an arbitrary size and density, the area of the non-adhesive portion 35b on the tip surface 35 can be easily adjusted. By adjusting the area of the non-adhesive portion 35b, the area of the adhesive portion 35a on the tip surface 35 can be easily adjusted.

Further, the non-adhesive portion 35b is surrounded by the adhesive portion 35a. Therefore, the edge of the tip surface 35 is the adhesive portion 35a. Therefore, the micro light emitting diode chip 50 easily comes into contact with the adhesive portion 35a. Even if the position of the chip substrate 40 having the micro light emitting diode chip 50 and the holding member 30 is slightly misaligned, the micro light emitting diode chip 50 appropriately contacts the protrusion 33 and is held by the holding member 30. Can be done. Since it is possible to allow a slight deviation in the alignment between the chip substrate 40 and the holding member 30, it is possible to simplify the alignment between the chip substrate 40 and the holding member 30.

Further, at least a part of the protruding portions 33 are arranged so that the area of the adhesive portion 35a of the tip surface 35 increases from one side of the first direction d1 toward the other side. That is, the micro light emitting diode chips 50 held by the protrusions 33 are easily transferred from the holding member 30 to the circuit board 11 in the order from one side of the first direction d1 to the other side. Therefore, by separating the holding member 30 from the circuit board 11 so that the micro light emitting diode chip 50 is transferred from the holding member 30 to the circuit board 11 so as to go from one side to the other side in the first direction d1, the holding member 30 The micro light emitting diode chip 50 can be easily and surely transferred to the circuit board 11.

Further, the plurality of protruding portions 33 are arranged so as to become smaller as the area of the adhesive portion 35a of the tip surface 35 is separated from a certain point. That is, the micro light emitting diode chip 50 held by the protrusion 33 separated from a certain point is easily transferred from the holding member 30 to the circuit board 11. Therefore, by separating the holding member 30 from the circuit board 11 so that the micro light emitting diode chip 50 is transferred from the holding member 30 toward the circuit board 11 from a position separated from a certain point, the holding member 30 is separated from the holding member 30. The micro light emitting diode chip 50 can be easily and surely transferred to the circuit board 11.

Further, the protruding portion 33 located on the most unilateral side of the first direction d1 has the smallest area of the adhesive portion 35a on the tip surface 35. That is, the micro light emitting diode chip 50 held by the protrusion 33 located on the most unilateral side of the first direction d1 is most likely to be transferred from the holding member 30 to the circuit board 11. Since the micro light emitting diode chip 50 most easily transferred is present on the most one side of the first direction d1, that is, at the end portion, the micro light emitting diode chip 50 is transferred from the holding member 30 to the circuit board 11 in order from the end portion. By separating the holding member 30 from the circuit board 11, the micro light emitting diode chip 50 can be more easily and surely transferred from the holding member 30 to the circuit board 11.

Further, the protruding portion 33 having the smallest area of the adhesive portion 35a on the tip surface 35 is located on the most one side in the second direction d2. That is, the micro light emitting diode chip 50 held by the protrusion 33 located on the most unilateral side of the first direction d1 and the most unilateral side of the second direction d2 is most likely to be transferred from the holding member 30 to the circuit board 11. Since the micro light emitting diode chip 50 most easily transferred is present on the most one side of the first direction d1 and the most one side of the second direction d2, that is, in the corner, the micro light emitting diode from the holding member 30 to the circuit board 11 in order from the corner. By separating the holding member 30 from the circuit board 11 so that the chip 50 is transferred, the micro light emitting diode chip 50 can be more easily and surely transferred from the holding member 30 to the circuit board 11.

The proportion of the adhesive portion 35a per unit area on the tip surface 35 of one protruding portion 33 increases from one side of the first direction d1 to the other side. That is, the micro light emitting diode chips 50 held by the protruding portion 33 are easily separated from the protruding portion 33 in the order from one side to the other side in the first direction d1. Therefore, the holding member 30 is separated from the circuit board 11 so that the micro light emitting diode chip 50 is transferred from the protrusion 33 to the circuit board 11 so as to go from one side to the other side in the first direction d1. The micro light emitting diode chip 50 can be easily and surely transferred from each of the protruding portions 33 to the circuit board 11.

Further, in the holding member 30 of the present embodiment, the protruding portion 33 has an inclined side surface 36 inclined with respect to the tip surface 35. In such a holding member 30, the angle between the tip surface 35 and the inclined side surface 36 at the connecting portion 37 between the tip surface 35 and the inclined side surface 36 is less than 90 °. The micro light emitting diode chip 50 held by the protrusion 33 is easily peeled off from the tip surface 35 at the connection portion 37 between the tip surface 35 and the inclined side surface 36, and is easily transferred to the circuit board 11. As described above, according to the holding member 30 of the present embodiment, the micro light emitting from the holding member 30 to the circuit board 11 without complicating the step of transferring the micro light emitting diode chip 50 from the holding member 30 to the circuit board 11. The diode chip 50 can be easily transferred. That is, the micro light emitting diode chip 50 can be easily and surely transferred from the holding member 30 to the circuit board 11.

In particular, the angle formed by the tip surface 35 and the inclined side surface 36 at the connecting portion 37 between the tip surface 35 and the inclined side surface 36 is 80 ° or less, preferably 45 ° or less, more preferably 10 ° or less, and most preferably 0 °. In this case, the micro light emitting diode chip 50 held by the protruding portion 33 is more easily peeled off from the tip surface 35 at the connection portion 37 between the tip surface 35 and the inclined side surface 36, and is easily transferred to the circuit board 11. Therefore, the micro light emitting diode chip 50 can be more easily and surely transferred from the holding member 30 to the circuit board 11.

Further, at least a part of the inclined side surface 36 of the protruding portion 33 is provided on one side of the first direction d1. That is, the micro light emitting diode chip 50 held by such a protrusion 33 is easily transferred from the holding member 30 to the circuit board 11 on one side of the first direction d1. Therefore, the micro light emitting diode chip 50 is mounted on the circuit board 11 from the holding member 30 so that the inclined side surface 36 is provided on one side of the first direction d1 so that the protruding portion 33 faces from one side of the first direction d1 to the other side. By separating the holding member 30 from the circuit board 11 so as to be transferred, the micro light emitting diode chip 50 can be easily and surely transferred from the holding member 30 to the circuit board 11.

Further, the angle between the inclined side surface 36 and the tip surface 35 becomes smaller as it approaches the tip surface 35. Such a protrusion 33 can stably hold the micro light emitting diode chip 50. Further, the angle formed by the tip surface 35 and the inclined side surface 36 at the connecting portion 37 between the tip surface 35 and the inclined side surface 36 can be reduced. The micro light emitting diode chip 50 held by the protrusion 33 is easily peeled off from the tip surface 35 at the connection portion 37 between the tip surface 35 and the inclined side surface 36, and the micro light emitting diode chip 50 is easily attached to the circuit board 11 from the holding member 30. And it can be reliably transferred.

The tip surface 35 has a chamfered shape. The micro light emitting diode chip 50 held by the projecting portion 33 is easily peeled off from the chamfered corner portion of the tip surface 35, and is easily transferred by the circuit board 11. Therefore, the micro light emitting diode chip 50 can be more easily and surely transferred from the holding member 30 to the circuit board 11.

Further, the Young's modulus of the elastic layer 32 is smaller than the Young's modulus of the base material 31, and is equal to or higher than the Young's modulus of the protruding portion 33. The holding member 30 is pressed against the circuit board 11 when the light emitting board 10 is manufactured. Since the Young's modulus of the elastic layer 32 is smaller than the Young's modulus of the base material 31, the pressure applied to the protrusions 33 is made uniform while the holding member 30 is pressed, and a high pressure is applied to some of the protrusions 33. It is possible to prevent the protruding portion 33 from being damaged. Further, when the Young's modulus of the elastic layer 32 is equal to or higher than the Young's modulus of the protruding portion 33, it is possible to prevent the holding member 30 from being deformed while the holding member 30 is being pressed, and to prevent the holding member 30 from being deformed. Can be prevented from slipping. That is, the micro light emitting diode chip 50 can be arranged at a predetermined position. In this way, the elastic layer 32 having appropriate elasticity makes it possible to accurately arrange the micro light emitting diode chip 50 at a predetermined position.

Further, the size of the tip surface 35 of the protrusion 33 is smaller than the size of the holding surface 50a of the micro light emitting diode chip 50 held by the holding member 30. Therefore, if one protruding portion 33 appropriately holds one micro light emitting diode chip 50, the other micro light emitting diode chips 50 and the tip surface 35 of the protruding portion 33 do not come into contact with each other. Therefore, the number of micro light emitting diode chips 50 held in one protrusion 33 can be one. Since the micro light emitting diode chip 50 can be appropriately held by the protrusion 33, the micro light emitting diode chip 50 can be easily and surely transferred to the circuit board 11.

Further, the size of the protruding portion 33 projected toward the tip surface 35 is preferably smaller than the size of the holding surface 50a of the micro light emitting diode chip 50 held by the holding member 30. Therefore, if one protruding portion 33 appropriately holds one micro light emitting diode chip 50, it is difficult for the other micro light emitting diode chips 50 to come into contact with the inclined side surface 36 of the protruding portion 33. Therefore, when the protruding portion 33 has adhesiveness, it is suppressed that the micro light emitting diode chip 50 is unintentionally held on the inclined side surface 36 of the protruding portion 33 of the holding member 30.

Further, the distance between the surface supporting the protrusion 33 of the base material 31 and the tip surface 35 of the protrusion 33, in other words, the height L of the protrusion 33 is longer than the maximum thickness of the micro light emitting diode chip 50. Therefore, even when the first light emitting diode chip 50R is transferred to the circuit board 11 and then the second light emitting diode chip 50G is transferred to the circuit board 11 by using the transfer member 20, the transfer of the second light emitting diode chip 50G is performed. , It is not easily disturbed by the first light emitting diode chip 50R transferred to the circuit board 11.

In the manufacturing process of the light emitting substrate 10, at least a part of the micro light emitting diode chips 50 are transferred to the circuit board from one side of the first direction d1 to the other side. At least a part of the protruding portions 33 are arranged so that the area of the adhesive portion 35a of the tip surface 35 increases from one side to the other side in the first direction d1. Therefore, the micro light emitting diode chip 50 held by the holding member 30 is easily transferred from one side of the first direction d1 toward the other side. By transferring at least a part of the micro light emitting diode chip 50 from one side of the first direction d1 to the circuit board, the micro light emitting diode chip 50 can be easily and surely transferred from the holding member 30 to the circuit board 11. Can be done.

Further, the micro light emitting diode chip 50 transferred from one side of the first direction d1 to the other side of the circuit board 11 has a longitudinal direction in the first direction d1. The micro light emitting diode chip 50 is transferred from the holding member 30 to the circuit board 11 from one side of the first direction d1 toward the other side. Therefore, the micro light emitting diode chip 50 is transferred along the longitudinal direction. The micro light emitting diode chip 50 can be more stably peeled off from the protrusion 33 in the longitudinal direction than in the lateral direction. Therefore, the micro light emitting diode chip 50 can be stably transferred from the holding member 30 to the circuit board 11.

As described above, the holding member 30 of the present embodiment is a holding member that holds a plurality of light emitting diode chips 50, and is regularly arranged two-dimensionally on one surface of the base material 31 and the base material 31. The protrusion 33 is provided with a plurality of protrusions 33, and the tip surface 35 of the protrusion 33 includes a sticky portion 35a and a non-adhesive non-adhesive portion 35b, and the protrusion portion 33 of at least one protrusion 33. The area of the adhesive portion 35a of the tip surface 35 is smaller than the area of the adhesive portion 35a of the tip surface 35 of the other protruding portion 33. According to such a holding member 30, the micro light emitting diode chip 50 held by the protruding portion 33 having a small area of the adhesive portion 35a of the tip surface 35 is easily peeled off from the tip surface 35 and is therefore easily transferred to the circuit board 11. .. When one micro light emitting diode chip 50 is transferred, the micro light emitting diode chip 50 held by the protrusion 33 around the micro light emitting diode chip 50 is also easily peeled off from the tip surface 35, and is easily transferred to the circuit board 11. The micro light emitting diode chip 50 can be easily transferred from the holding member 30 to the circuit board 11 without complicating the step of transferring the micro light emitting diode chip 50 from the holding member 30 to the circuit board 11. The micro light emitting diode chip 50 can be easily and surely transferred from the holding member 30 to the circuit board 11.

It is possible to make various changes to the above-described embodiment.

For example, in the above-described embodiment, the protrusion 33 is formed on the elastic layer 32 by using a photolithography technique or an imprint technique. However, the protrusion 33 may be integrally formed with the elastic layer 32. The protrusion 33 can be integrally formed with the elastic layer 32 by dry etching the material forming the elastic layer 32 or imprinting the same material as the elastic layer 32 on the elastic layer 32. .. When the protrusion 33 is integrally formed with the elastic layer 32, an interface is not formed between the protrusion 33 and the elastic layer 32, so that the separation between the protrusion 33 and the elastic layer 32 can be effectively suppressed. Can be done. Further, since the protruding portion 33 can be formed with the elastic layer 32, the cost of forming the protruding portion 33 can be reduced.

In addition to the display device 1, the above-mentioned light emitting substrate 10 may be used for any device that emits light, for example, a lighting device.

1 Display device 5 Display surface 7 Diffusion layer 10 Light emitting board 11 Circuit board 13 Circuit 15 Anisotropic conductive adhesive layer 20 Transfer member 30 Holding member 31 Base material 32 Elastic layer 33 Protruding part 35 Tip surface 35a Adhesive part 35b Non-adhesive part 36 Inclined side surface 37 Connection part 40 Chip substrate 50 Micro light emitting diode chip 50a Holding surface 50R 1st light emitting diode chip 50G 2nd light emitting diode chip 50B 3rd light emitting diode chip 51 Electrode R1 1st region R2 2nd region M1, M2, M3 Positioning marks P1x, P1y, P2x, P2y pitch

Claims (23)

A holding member that holds multiple light emitting diode chips.
With the base material
A plurality of protrusions, which are regularly arranged two-dimensionally on one surface of the substrate, are provided.
The tip surface of the protruding portion includes an adhesive portion having adhesiveness and a non-adhesive portion having no adhesiveness.
A holding member in which the area of the adhesive portion on the tip surface of at least one protrusion is smaller than the area of the adhesive portion on the tip surface of the other protrusion. The holding member according to claim 1, wherein the non-adhesive portion is formed by a concave portion provided on the tip surface. The holding member according to claim 1 or 2, wherein the non-adhesive portion is surrounded by the adhesive portion. Claimed that at least a part of the protrusions is arranged so that the area of the adhesive portion of the tip surface increases from one side in the first direction along the sheet surface of the base material toward the other side. The holding member according to any one of 1 to 3. The retention according to any one of claims 1 to 4, wherein the plurality of protrusions are arranged so that the area of the adhesive portion on the tip surface becomes smaller as the area of the adhesive portion on the tip surface becomes smaller from a certain point of the base material. Element. The aspect according to any one of claims 1 to 5, wherein the protruding portion located on the most unilateral side in the first direction along the sheet surface of the base material has the smallest area of the adhesive portion on the tip surface. Holding member. The protruding portion having the smallest area of the adhesive portion on the tip surface is located on the most unilateral side in the second direction along the sheet surface of the base material which is non-parallel to the first direction. The holding member according to claim 6. Claimed that the ratio of the adhesive portion per unit area on the tip surface of one of the protrusions increases from one side in the first direction along the sheet surface of the base material toward the other side. The holding member according to any one of 1 to 7. The holding member according to any one of claims 1 to 8, wherein the protruding portion has an inclined side surface provided so as to be inclined with respect to the tip surface. The holding member according to claim 9, wherein the inclined side surface of at least a part of the protrusion is provided on one side in the first direction along the sheet surface of the base material. The holding member according to claim 9 or 10, wherein the inclined side surface has an angle formed with the tip surface as it approaches the tip surface. The holding member according to any one of claims 9 to 11, wherein the angle formed by the tip surface and the inclined side surface at the connecting portion between the tip surface and the inclined side surface is 80 ° or less. The holding member according to any one of claims 1 to 12, wherein the tip surface of the protruding portion has a chamfered shape. Further provided with an elastic layer provided between the substrate and the protrusion,
The holding member according to any one of claims 1 to 13, wherein the Young's modulus of the elastic layer is smaller than the Young's modulus of the base material and equal to or higher than the Young's modulus of the protruding portion. The holding member according to any one of claims 1 to 14, and the holding member.
A transfer member comprising a plurality of light emitting diode chips held by the holding member at the protrusion. The transfer member according to claim 15, wherein the size of the tip surface is smaller than the size of the holding surface of the light emitting diode chip held by the holding member. The transfer member according to claim 15 or 16, wherein the size of the protrusion projected toward the tip surface is smaller than the size of the holding surface of the light emitting diode chip held by the holding member. The method according to any one of claims 15 to 17, wherein the distance between the surface of the base material that supports the protrusion and the tip surface of the protrusion is longer than the maximum thickness of the light emitting diode chip. Transfer member. The chip substrate having the individualized light emitting diode chips is brought into contact with the holding member according to any one of claims 1 to 14, and the plurality of the light emitting diode chips are brought into the plurality of protrusions of the holding member. A method for manufacturing a transfer member, comprising a step of holding the transfer member. A chip substrate having an individualized light emitting diode chip is brought into contact with the holding member according to any one of claims 1 to 14, and a plurality of the light emitting diode chips are brought into contact with a plurality of the light emitting diode chips in a first region of the holding member. And the process of holding it in the protruding part of the
The step of moving the holding member relative to the chip substrate and
The chip substrate is brought into contact with the holding member, and the plurality of other light emitting diode chips different from the plurality of light emitting diode chips are brought into contact with the holding member, and the plurality of said protrusions in a second region different from the first region of the holding member. A method for manufacturing a transfer member, comprising a step of holding the transfer member. A step of positioning the transfer member according to any one of claims 15 to 18 so that the light emitting diode chip is electrically connected to a circuit of a circuit board.
A method for manufacturing a light emitting substrate, comprising a step of transferring a plurality of the light emitting diode chips from the holding member of the transfer member to the circuit board. A holding member having a base material and a plurality of protrusions regularly arranged two-dimensionally on one surface of the base material, and a plurality of light emitting diode chips held by the holding member in the protrusions. It is a method of manufacturing a light emitting board by transferring the light emitting diode chip from the transfer member to the circuit of the circuit board.
The tip surface of the protruding portion includes an adhesive portion having adhesiveness and a non-adhesive portion having lower adhesiveness than the adhesive portion.
At least a part of the protrusions are arranged so that the area of the adhesive portion of the tip surface increases from one side in the first direction along the sheet surface of the base material toward the other side.
A method for manufacturing a light emitting board, wherein at least a part of the light emitting diode chip is transferred to the circuit board from one side in the first direction to the other side. 22. The method for manufacturing a light emitting substrate according to claim 22, wherein the light emitting diode chip transferred from one side to the other in the first direction onto the circuit board has a longitudinal direction in the first direction.

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