JP2022062290A - Laminated body forming device and laminated body forming method - Google Patents

Abstract

[Problem] To correct misalignment of substrates to be bonded. [Solution] A laminate forming device that bonds two substrates to form a laminate includes a deformation unit that deforms a substrate and a bonding unit that bonds the substrate deformed by the deformation unit to another substrate, and the deformation unit deforms at least one of the two substrates to be bonded using a second deformation amount obtained by correcting the first deformation amount by a correction amount whose absolute value is smaller than the absolute value of the misalignment amount that would occur if another substrate were bonded to a substrate deformed by the first deformation amount. [Selected Figure] Figure 27

Description

The present invention relates to a laminate forming apparatus and a laminate forming method.

There is a technique for forming a laminated semiconductor device by laminating substrates (see, for example, Patent Document 1).
Patent Document 1 Japanese Patent Application Laid-Open No. 2013-098186

Even if the substrates are joined after alignment, misalignment may remain.

In the first aspect of the present invention, it is a laminate forming apparatus that joins two substrates to form a laminate, and has a deformed portion that deforms the substrate, a substrate deformed by the deformed portion, and another substrate. The deformed portion is provided with a joint portion for joining, and the deformed portion is the first with a correction amount whose absolute value is smaller than the absolute value of the misalignment amount when another substrate is joined to the substrate deformed by the first deformation amount. A laminate forming apparatus is provided that deforms at least one of the two substrates to be joined by using the second deformation amount obtained by modifying the deformation amount.

In the second aspect of the present invention, it is a laminate forming apparatus that joins two substrates to form a laminate, and has a deformed portion that deforms the substrate, a substrate deformed by the deformed portion, and another substrate. The deformed portion is provided with a joint portion for joining the other substrates, and the deformed portion is formed by imitating the shape of the deformed substrate when the other substrate is bonded to the substrate deformed by the first deformation amount. The amount and the amount of deformation that occurs in the other substrate by following the shape of the deformed substrate when another substrate is joined to the substrate deformed by the second deformation amount obtained by modifying the first deformation amount. The absolute value of the difference is smaller than the absolute value of the amount of misalignment when another substrate is joined to the substrate deformed by the first deformation amount. A laminate forming apparatus that deforms at least one of them is provided.

A third aspect of the present invention is a method for forming a laminate by joining two substrates to form a laminate, in which a deformation step of deforming the substrate, a substrate deformed in the deformation stage, and another substrate are combined. The deformation step includes the joining step of joining, and the deformation step is the first deformation with a correction amount whose absolute value is smaller than the absolute value of the misalignment amount when another substrate is joined to the substrate deformed by the first deformation amount. A method for forming a laminate is provided in which at least one of the two substrates to be joined is deformed by using the second deformation amount modified by the amount.

A fourth aspect of the present invention is a method for forming a laminate by joining two substrates to form a laminate, in which a deformation step of deforming the substrate, a substrate deformed in the deformation stage, and another substrate are combined. The deformation step includes the joining step of joining, and the deformation step is the amount of deformation that occurs in the other substrate by following the shape of the deformed substrate when another substrate is joined to the substrate deformed by the first deformation amount. And the difference from the amount of deformation that occurs in the other substrate by following the shape of the deformed substrate when another substrate is joined to the substrate deformed by the second deformation amount obtained by modifying the first deformation amount. The absolute value of is smaller than the absolute value of the amount of misalignment when another substrate is joined to the substrate deformed by the first deformation amount. A method for forming a laminate that deforms one of them is provided.

In the fifth aspect of the present invention, it is a laminate forming apparatus that joins two substrates to form a laminate, in which a deformed portion that deforms one of the two substrates, and one substrate and the other. A joint portion for joining the substrates is provided, and the amount of deformation of one substrate by the deformed portion is a deformation amount determined according to the amount of deformation generated on the other substrate by following the shape of one substrate. A laminate forming apparatus is provided.

A sixth aspect of the present invention is a method for forming a laminate by joining two substrates to form a laminate, in which a deformation step of deforming one of the two substrates and a deformation step of one substrate and the other. The amount of deformation of one substrate in the deformation stage, including the joining step of joining the substrates, is a deformation amount determined according to the amount of deformation occurring in the other substrate by following the shape of one substrate. A method for forming a laminate is provided.

The outline of the above invention is not a list of all the features of the present invention. A subcombination of these feature groups can also be an invention.

It is a schematic diagram of the laminated body forming apparatus 100. It is a schematic plan view of the substrate 211 and 213. It is a schematic cross-sectional view of the substrate holder 221 which held the substrate 211. It is a flow chart which shows the joining procedure of the substrate 211 and 213. It is a schematic cross-sectional view of the joint part 300. It is a schematic cross-sectional view of the joint part 300. It is a schematic cross-sectional view of the joint part 300. It is a schematic cross-sectional view of the joint part 300. It is a schematic cross-sectional view of the joint part 300. It is a schematic diagram which shows the component of the deviation in the substrate 211. It is a schematic diagram which shows the component of the deviation in the substrate 211. It is a schematic diagram which shows the component of the deviation in the substrate 211. It is a partially enlarged view which shows the joining process of the substrate 211 and 213. It is a partially enlarged view which shows the joining process of the substrate 211 and 213. It is a partially enlarged view which shows the joining process of the substrate 211 and 213. It is a schematic cross-sectional view of the deformation part 601. It is a partially enlarged view which shows the joining process of the substrate 211 and 213. It is a schematic cross-sectional view of the deformed part 602. It is a schematic diagram which shows the layout of the actuator 412. It is a schematic diagram which shows the operation of the deformation part 602. It is a schematic diagram which shows the deformation process of a substrate 211. It is a schematic diagram which shows the deformation process of a substrate 211. It is a schematic diagram which shows the deformation process of a substrate 211. It is a schematic diagram which shows the deformation process of a substrate 211. It is a schematic diagram which shows the deformation process of a substrate 211. It is a schematic diagram which shows the deformation process of a substrate 211. It is a schematic diagram which shows the joining process of the substrate 211 and 213. It is a schematic diagram which shows the joining process of the substrate 211 and 213. It is a schematic diagram which shows the joining process of the substrate 211 and 213. It is a schematic diagram which shows the distribution of the deviation in the substrate 211. It is a schematic diagram explaining the operation of the deformation part 602. It is a schematic diagram which shows the component of the deviation in the substrate 211. It is a schematic cross-sectional view of the deformed part 603. It is a schematic diagram explaining the operation of the deformation part 603. It is a schematic cross-sectional view of the deformed part 604. It is a schematic plan view of the deformation part 604. It is a schematic diagram explaining the operation of the deformation part 604. It is a schematic sectional drawing of the pushing part 701.

Hereinafter, the present invention will be described through embodiments of the invention. The following embodiments do not limit the invention in the claims. Not all combinations of features described in the embodiments are essential to the solution of the invention.

FIG. 1 is a schematic plan view of the laminate forming apparatus 100. The laminate forming device 100 includes a housing 110, substrate cassettes 120 and 130 arranged outside the housing 110, and a control unit 150, and a transport unit 140, a joining unit 300, and a holder arranged inside the housing 110. It is equipped with a stocker 400 and a pre-aligner 500.

The substrate cassette 120 accommodates a plurality of substrates 211 and 213, including two substrates 211 and 213 to be joined. The other substrate cassette 130 accommodates the laminate 230 produced by joining the substrates 211 and 213. The board cassettes 120 and 130 can be individually attached to and detached from the housing 110.

Here, the substrates 211 and 213 may be, for example, a semiconductor wafer such as a silicon single crystal wafer or a compound semiconductor wafer, and may be a glass substrate, a sapphire substrate, or the like other than the semiconductor wafer. When joining such substrates, the same type of substrates may be joined or different types of substrates may be joined.

Further, the bonding of the substrates 211 and 213 means that the main surfaces of the plurality of substrates 211 and 213 are overlapped in parallel with each other and their relative positions are fixed by hydrogen bonds, van der Waals bonds, covalent bonds and the like. .. In the process of joining the boards 211 and 213, it may be described that the boards 211 and 213 are overlapped with each other so that the main surfaces of the boards are brought into contact with each other and not fixed.

The transport unit 140 is responsible for transport functions of the boards 211, 213 and the board holders 221, 223 inside the housing 110. The transport unit 140 transports a laminated body 230 manufactured by joining a single substrate 211, 213, a substrate holder 221 and 223, a substrate holder 221 and 223 holding the substrates 211 and 213, and a substrate 211 and 213.

The control unit 150 individually controls the operation of each part of the laminate forming device 100, and comprehensively controls the cooperation between the parts. Further, the control unit 150 may receive a user's instruction from the outside and instruct the joining unit 300 to perform a procedure for joining the boards 211, 213, and the like. Further, the control unit 150 may include a user interface such as a display unit that displays the operating state of the laminate forming device 100 to the outside.

Further, the illustrated laminate forming apparatus 100 may have a determination unit 151 provided in the control unit 150. As will be described later, the determination unit 151 determines the amount of deformation when the substrates 211 and 213 are deformed in the deformation unit (see FIGS. 18, 20, 24, 26, etc.) that deforms the substrates 211 and 213. The configuration in which the determination unit 151 is provided in the control unit 150 is only an example, and the determination unit 151 may be provided separately from the control unit 150, and the determination unit 151 may be provided outside the laminate forming device 100. Then, the laminate forming apparatus 100 may be configured to acquire the amount of change determined by the determination unit 151 from the outside and execute the deformation of the substrate.

Further, in the illustrated configuration, the control unit 150 of the laminate forming device 100 may further have an acquisition unit 152. The acquisition unit 152 may acquire information related to the amount of deformation of the substrate when correcting the magnification and the like of the substrates 211 and 213 to be joined from the outside or the inside of the laminate forming apparatus 100. Thereby, the determination unit 151 can predict the strain generated in at least one of the substrates 211 and 213 based on the information, and can determine the amount of deformation that cancels at least a part of the predicted strain. Further, the determination unit 151 can determine the amount of deformation that cancels at least a part of the positional deviation of the substrates 211 and 213 caused by the magnification distortion generated on at least one of the substrates 211 and 213.

Further, by deforming the substrate with the deformation amount determined in this way, the deformed portions 601 and 602 are deformed to offset the misalignment of the substrates 211 and 213 caused by the change in the magnification caused in at least one of the substrates 211 and 213. Can be generated on one of the substrates 211 and 213. Therefore, by appropriately determining the amount of misalignment, the misalignment that occurs between the substrates 211 and 213 can be made smaller than a predetermined threshold value.

The information acquired from the outside of the laminate forming apparatus 100 is, for example, the lot number of the substrates 211 and 213, the ID of the equipment used when processing the substrates 211 and 213 in the previous process, and the substrates 211 and 213 before joining. The history of the processing performed on the surface, the specifications of the boards 211 and 213, and the like. Further, the information acquired from the inside of the laminate forming apparatus 100 is, for example, recording of the amount of misalignment of the substrates 211 and 213 remaining in the previously manufactured laminate 230. The amount of misalignment of the laminated body 230 may be measured by an inspection device provided outside the laminated body forming device 100. In this case, the measurement result is transmitted from the inspection device to the laminate forming device 100.

The joining portion 300 forms a laminated body 230 by aligning a set of substrates 211 and 213 facing each other with each other and then bringing them into contact with each other to join them. Further, as will be described later, the joint portion 300 may be responsible for a part of deformation of the substrates 211 and 213 before joining.

The pre-liner 500 is used in cooperation with the transport unit 140 to hold the carried-in boards 211 and 213 in the board holders 221 and 223. The pre-aligner 500 is also used when the laminate 230 carried out from the joint portion 300 is separated from the substrate holders 221 and 223.

In the laminate forming apparatus 100, the substrates 211 and 213 may be handled while being held by the substrate holders 221 and 223. The substrate holders 221 and 223 are formed of a hard material such as alumina ceramics, and attract and hold the substrates 211 and 213 by an electrostatic chuck, a vacuum chuck, or the like.

When the manufactured laminate 230 is carried out from the laminate forming apparatus 100, the substrate holders 221 and 223 are separated from the laminate 230 and stay inside the laminate forming apparatus 100, and are repeatedly used for joining the substrates 211 and 213. Will be done. Further, the unused substrate holders 221 and 223 are housed in the holder stocker 400 and stored inside the laminate forming apparatus 100. Therefore, the substrate holders 221 and 223 can be considered to be a part of the laminate forming apparatus 100.

FIG. 2 is a schematic plan view of the substrates 211 and 213 to be joined in the laminate forming apparatus 100. The boards 211 and 213 have a notch 214 and a plurality of circuit areas 216 and a plurality of marks 218.

The notch 214 is formed on the peripheral edge of the substantially circular substrates 211 and 213 as a whole, and serves as an index indicating the crystal orientation of the substrates 211 and 213. Further, when handling the boards 211 and 213, the arrangement direction of the circuit areas 216 on the boards 211 and 213 can be known by detecting the position of the notch 214. Further, when circuit regions 216 including circuits different from each other are formed on one substrate 211 and 213, the circuit regions 216 can be distinguished with reference to the notch 214.

The circuit area 216 is periodically arranged on the surface of the boards 211 and 213 in the plane direction of the boards 211 and 213. Each of the circuit regions 216 is provided with a semiconductor device, wiring, protective film, etc. formed by photolithography technology or the like. Pads, bumps, and the like that serve as connection terminals when the boards 211 and 213 are electrically connected to other boards 211, 213, a lead frame, and the like are also arranged in the circuit area 216.

The mark 218 is an example of a structure formed on the surface of the substrates 211 and 213, and is arranged on the scribe line 212 arranged between the circuit regions 216, for example. The mark 218 is used as an index when aligning one substrate 211 with another substrate 213 to be joined. As the mark 218, in addition to the one formed exclusively for the mark 218, other structures such as wiring that can be observed from the surface of the substrates 211 and 213 can also be used.

FIG. 3 is a schematic cross section showing a state in which the substrate 213 is held by the substrate holder 223. Although the substrate 213 and the substrate holder 223 are shown as an example, the other substrate 211 and the substrate holder 221 can be integrated in the same manner.

The substrate holder 223 has a holding surface 225 having substantially the same area as the area of the substrate 213, and an edge portion arranged on the outside of the holding surface 225. A plurality of board holders 221 and 223 are prepared in the laminated body forming apparatus 100, and hold the carried-in boards 211 and 213 one by one.

FIG. 4 is a flow chart showing an example of a procedure for manufacturing the laminated body 230 by joining the substrates 211 and 213 in the laminated body forming apparatus 100. In the laminate forming apparatus 100, the control unit 150 first takes out the substrates 211 and 213 to be joined from the substrate cassette 120 by the transport unit 140 and holds them in the substrate holders 221 and 223 in the pre-aligner 500 (step S101).

Next, the control unit 150 sequentially carries the substrate holders 221 and 223, each of which holds the substrates 211 and 213, into the joint portion 300 by the transport unit 140 (step S102). Next, the control unit 150 operates the X-direction drive unit 331 and the Y-direction drive unit 333 to detect the positions of the marks 218 provided on each of the substrates 211 and 213 with the microscopes 324 and 334 (step S103).

Next, the control unit 150 detects the relative positions of the substrates 211 and 213 based on the positions of the marks 218 detected by the microscopes 324 and 334 (step S104). Subsequently, the control unit 150 corrects at least one of the substrates 211 and 213 in order to suppress the positional deviation that may remain in the laminated body 230 formed by joining (step S105). The boards 211 and 213 can be corrected by deforming at least one of the boards 211 and 213, which will be described later with reference to the other figures.

Next, the control unit 150 activates the joint surfaces of the pair of substrates 211 and 213 while recording the relative positions of the pair of substrates 211 and 213 (step S106), and then mutually attaches the substrates 211 and 213 to each other. Align (step S107). Next, the substrates 211 and 213 are brought close to each other and a part of the substrates 211 and 213 is brought into contact with each other to start joining the substrates 211 and 213 (step S108). Body 230 is formed (step S109).

Next, the control unit 150 separates the formed laminated body 230 from the substrate holders 221 and 223 after carrying it out from the joint portion 300, and accommodates the formed laminate 230 in the substrate cassette 130 (step S110). In this way, the laminated body 230 in which the substrates 211 and 213 are joined is manufactured.

FIG. 5 is a schematic cross-sectional view showing the structure of the joint portion 300 that executes the joint of the substrates 211 and 213. Further, FIG. 5 is also a diagram showing a state in which the substrates 211 and 213 held by the substrate holders 221 and 223 are carried into the joint portion 300 in step S102 shown in FIG. The joint portion 300 includes a frame body 310, an upper stage 322, and a lower stage 332.

The frame 310 has a bottom plate 312 and a top plate 316 parallel to the horizontal floor surface 301, and a plurality of columns 314 perpendicular to the floor plate. The bottom plate 312, the column 314, and the top plate 316 form a rectangular parallelepiped frame 310 that accommodates other members of the joint 300.

The upper stage 322 is fixed downward to the lower surface of the top plate 316 in the drawing. The upper stage 322 has a substrate holding function such as a vacuum chuck and an electrostatic chuck, and is a holding portion for holding one of the substrates 211 and 213. In the state shown in the figure, the board holder 223 holding the board 213 is held downward. A microscope 324 and an activator 326 are fixed to the top plate 316 on the side of the upper stage 322. Therefore, the relative positions of the upper stage 322 and the microscope 324 are fixed.

The lower stage 332 is mounted on the Y-direction drive unit 333 via the Z-direction drive unit 338 that moves up and down in the direction indicated by the arrow Z in the drawing. The lower stage 332 has a substrate holding function such as a vacuum chuck and an electrostatic chuck, and is a holding portion for holding the other of the substrates 211 and 213. In the illustrated state, the board holder 221 holding the board 211 is held upward.

Further, the microscope 334 and the activation device 336 are directly fixed on the Y-direction drive unit 333 and mounted on the side of the lower stage 332. Therefore, the horizontal relative positions of the lower stage 332 and the microscope 334 in the figure are fixed.

The Y-direction drive unit 333 is mounted on the bottom plate 312 of the frame body 310 on the X-direction drive unit 331 that can move in the X direction of the arrow in the drawing. The Y-direction drive unit 333 moves with respect to the X-direction drive unit 331 in the direction indicated by the arrow X in the drawing.

By combining the operations of the X-direction drive unit 331 and the Y-direction drive unit 333, the lower stage 332 moves two-dimensionally in parallel with the bottom plate 312. Further, when the lower stage 332 moves, the microscope 334 and the activation device 336 also move along with the lower stage 332. In the above-mentioned joint portion 300, for example, the lower stage 332 is moved up by controlling the amount of movement of the lower stage 332 using an interferometer or the like, with the position where the focal points of the microscopes 324 and 334 coincide with each other as the initial position. It can be moved relative to the stage 322 with high accuracy.

The joint portion 300 may further include a rotation drive unit that rotates the lower stage 332 around a rotation axis perpendicular to the bottom plate 312, and a swing drive unit that swings the lower stage 332. As a result, the lower stage 332 can be made parallel to the upper stage 322, and the substrate 211 held by the lower stage 332 can be rotated to improve the alignment accuracy of the substrates 211 and 213.

Further, the X-direction drive unit 331 and the Y-direction drive unit 333 may have a two-stage configuration of a coarse movement unit and a fine movement unit. As a result, both high-precision alignment and high throughput can be achieved, and the movement of the substrate 211 mounted on the lower stage 332 can be joined at high speed without deteriorating the control accuracy.

FIG. 6 is a diagram illustrating the operation of the joint portion 300 in step S103 shown in FIG. The control unit 150 detects the position of the mark 218 of the substrate 213 held by the upper stage 322 by moving the lower stage 332 to align the field of view of the lower microscope 334 with the mark 218 of the substrate 213. Further, the control unit 150 detects the position of the mark 218 of the substrate 211 held by the lower stage 332 by moving the lower stage 332 and aligning the field of view of the upper microscope 324 with the mark 218 of the substrate 211.

In this way, the relative positions of the substrates 211 and 213 can be calculated by detecting the positions of the marks 218 of the substrates 211 and 213 with the microscopes 324 and 334 whose relative positions are known (FIG. 4, step S104). Therefore, by moving the lower stage 332 to eliminate the calculated relative position difference, the positions of the substrates 211 and 213 can be aligned.

FIG. 7 is a diagram illustrating the operation of the joint portion 300 in step S106 shown in FIG. In the illustrated state, the control unit 150 chemically activates each joint surface of the substrates 211 and 213 while retaining the information of the relative position calculated for aligning the substrates 211 and 213. That is, the control unit 150 moves the lower stage 332 while generating plasma P in the upper activation device 326, thereby scanning the surface of the substrate 211 held by the lower stage 332 with plasma, and the substrate 213. Activates the surface.

Further, the control unit 150 moves the lower stage 332 while generating plasma P in the lower activation device 336, thereby scanning the surface of the substrate 213 held by the upper stage 322 with plasma, and the substrate 211. Activates the surface of the plasma. As a result, the substrates 211 and 213 are in a state of being autonomously adsorbed and joined only when they are close to each other.

The activation referred to here is that when the bonding surface of the substrates 211 and 213 comes into contact with the bonding surface of the other substrates 211 and 213, hydrogen bonds, van der Waals bonds, covalent bonds and the like are generated and melted. This includes the case where the bonding surface of at least one of the substrates is treated so as to be in a state of being bonded in a solid phase. That is, activation includes facilitating the formation of bonds by forming dangling bonds (unbonded hands) on the surfaces of the substrates 211 and 213.

More specifically, in the activating device 326 and the activating device 336, for example, oxygen gas, which is a processing gas, is excited to generate plasma in a reduced pressure atmosphere, and oxygen ions are transferred to the surface of each of the two substrates as a bonding surface. Irradiate. For example, when the substrate is a substrate having a SiO film formed on Si, the irradiation of oxygen ions breaks the bond of SiO on the surface of the substrate which becomes the bonding surface at the time of laminating, and the dangling bonds of Si and O are formed. It is formed. Forming such a dangling bond on the surface of the substrates 211 and 213 may be referred to as activation.

When a substrate in which a dangling bond is formed is exposed to the atmosphere, for example, moisture in the air binds to the dangling bond and the surface of the substrate is covered with a hydroxyl group (OH group). The surface of the substrate is in a state of being easily bonded to water molecules, that is, in a state of being hydrophilized. That is, the activation tends to make the surface of the substrate hydrophilic as a result. Further, in solid-phase bonding, the presence of impurities such as oxides at the bonding interface, defects at the bonding interface, and the like affect the bonding strength. Therefore, cleaning the joint surface may be regarded as part of the activation.

Examples of the method for activating the substrates 211 and 213 include radical irradiation with DC plasma, RF plasma, and MW excitation plasma, as well as irradiation with an inert gas, such as sputter etching, an ion beam, and a high-speed atomic beam. Further, activation by ultraviolet irradiation, ozone asher, etc. can also be exemplified. Further, a chemical cleaning treatment using a liquid or gas etchant can be exemplified.

Further, even if the surface of the substrates 211 and 213 is hydrophilized by applying pure water or the like to the surface to be the joint surface of the substrates 211 and 213 using a hydrophilic device (not shown), the substrates 211 and 213 can be activated. .. Due to this hydrophilization, the surface of the substrates 211 and 213 is in a state where OH groups are attached, that is, in a state where they are terminated by OH groups.

In the joint portion 300 shown in the figure, the activation device 326 and 336 radiate the plasma P in a direction away from the microscope 324 and 334. This prevents debris generated from the plasma-irradiated substrates 211 and 213 from contaminating the microscope 324.

Further, the illustrated joint portion 300 includes activation devices 326 and 336 for activating the substrates 211 and 213, but is activated in advance by using an activation device 326 and 326 provided separately from the joint portion 300. By carrying the substrates 211 and 213 into the joint portion 300, it is possible to form a structure in which the activation device 336 of the joint portion 300 is omitted.

FIG. 8 is a diagram illustrating the operation of the joint portion 300 in step S107 shown in FIG. The substrate 211 held by the lower stage 332 faces the substrate 213 held by the upper stage 322. Following the state shown in FIG. 7, the control unit 150 aligns the substrates 211 and 213 with each other based on the information regarding the relative positions of the substrates 211 and 213 calculated in step S104.

That is, by moving the lower stage 332, the control unit 150 shifts the horizontal position of the mark 218 of the substrate 213 held by the upper stage 322 and the horizontal position of the mark 218 of the substrate 211 held by the lower stage 332. The boards 211 and 213 are aligned and aligned. At this time, the alignment accuracy can be improved by measuring the amount of movement of the lower stage 332 by the X-direction drive unit 331 and the Y-direction drive unit 333 using an interferometer or the like.

FIG. 9 is a diagram illustrating the operation of the joint portion 300 in step S108 shown in FIG. The control unit 150 operates the Z-direction drive unit 338 to raise the lower stage 332 and bring a part of the substrates 211 and 213 into contact with each other. As a result, a part of the substrates 211 and 213 comes into contact with each other to start joining.

Since the surface of the substrates 211 and 213 is activated in step S106 described above, when a part of the substrates 211 and 213 comes into contact with each other, the surfaces of the substrates 211 and 213 are adjacent to the initially contacted region due to the intramolecular force between the substrates 211 and 213. Adsorption force acts on the area. Therefore, by opening the other substrate, for example, the substrate 213 held on the upper stage 322 while holding one of the substrates 211 and 213, the region to which the substrates 211 and 213 are joined is adjacent to the initially contacted portion. It begins to spread gradually to the area.

As a result, a bonding wave is generated in which the contacted region is sequentially expanded, and the bonding of the substrates 211 and 213 progresses. Eventually, the substrates 211 and 213 are joined over the entire surface, and the laminated body 230 formed by the joined substrates 211 and 213 is formed.

In addition, you may open the region other than the partial region while continuing to hold the partial region of the substrate 213 that is opened in the joining process. This prevents the substrate 213 from moving during joining due to opening. Further, in the process of expanding the contact area of the substrates 211 and 213 as described above, the control unit 150 may sequentially release the holding of the substrate 213 by the substrate holder 223. Further, the holding of the substrate holder 223 by the upper stage 322 may be released.

Further, the bonding of the substrates 211 and 213 may be advanced by opening the substrate 211 in the lower stage 332 without opening the substrate 213 in the upper stage 322. Further, the substrates 211 and 213 may be joined by bringing the upper stage 322 and the lower stage 332 closer to each other while holding the substrates 213 and 211 in both the upper stage 322 and the lower stage 332. The laminated body 230 thus formed is carried out from the joint portion 300 by the transport portion 140 (FIG. 4, step S110) and is housed in the substrate cassette 130.

At the stage of carrying out the laminated body 230 from the joint portion 300, the substrate holder 221 held in the lower stage 332 may still hold the substrate 211. Therefore, in such a case, the substrate holder 221 may be carried out together with the laminate 230, the laminate 230 and the substrate holder 221 may be separated by the pre-aligner 500, and then the laminate 230 may be conveyed to the substrate cassette 130.

When the substrates 211 and 213 are joined to manufacture the laminated body 230 as described above, the laminated body 230 can be manufactured by aligning with high accuracy based on the mark 218. However, in the manufactured laminate 230, the misalignment of the substrates 211 and 213 may still remain. Further, even if the bonding is not actually performed, it may be predicted that the positional deviation remains in the laminated body 230 by analysis, simulation, or the like. Such a misalignment remaining in the laminated body 230 is a step of correcting the joining conditions (FIG. 4, step S105) before the step of joining the substrates 211 and 213 (FIG. 4, step S108) as illustrated below. ) Can be suppressed.

FIG. 10 is a diagram showing one of the components that can be contained in the positional deviation remaining between the substrates 211 and 213 in the laminated body 230 in which the substrates 211 and 213 are aligned and joined. This deviation component is a deviation component generated in a specific direction with the same size on the main surface of the laminated body 230, and is described here as a shift deviation component.

When correcting the shift shift component, the target position of the lower stage 332 may be shifted in the direction of canceling the shift shift component in the alignment step of the substrates 211 and 213 (FIG. 4, step S107). Therefore, in the correction step (FIG. 4, step S105), the determination unit 151 of the control unit 150 calculates the direction and amount of shifting the target position of the lower stage 332 according to the direction and magnitude of the shift shift component to be corrected. Therefore, the direction and the amount of movement of the X-direction drive unit 331 and the Y-direction drive unit 333 are corrected. As a result, it is possible to reduce the shift shift component of the positional shift of the substrates 211 and 213 in the laminated body 230.

FIG. 11 is a diagram showing other components that may be included in the positional deviation remaining between the substrates 211 and 213 in the laminated body 230 in which the substrates 211 and 213 are aligned and joined. This deviation component is a component in which a larger deviation amount occurs in the circumferential direction of the circle centered on one point on the main surface of the laminated body 230 as the distance from the center increases, and is described here as a rotational deviation component.

When correcting the rotation deviation component, the lower stage 332 may be rotated in the direction of canceling the rotation deviation component in the alignment step (FIG. 4, step S107) of the substrates 211 and 213. Therefore, in the correction step (FIG. 4, step S105), the determination unit 151 of the control unit 150 calculates and calculates the rotation amount of the lower stage 332 according to the rotation deviation component to be corrected acquired by the acquisition unit 152. The lower stage 332 is rotated by the amount of rotation. As a result, it is possible to reduce the rotation deviation component of the substrates 211 and 213 in the laminated body 230.

FIG. 12 is a diagram showing other components that may be included in the positional deviation remaining between the substrates 211 and 213 in the laminated body 230 in which the substrates 211 and 213 are aligned and joined. This deviation component is a component having a deviation amount that gradually increases radially from a certain point on the laminated body 230 in the plane direction, and is described here as a magnification deviation component.

The magnification deviation component may be generated in the joint portion 300 before joining the substrates 211 and 213, or may be generated by joining in the joint portion 300. The magnification deviation component generated before joining is described as the initial magnification deviation component because it occurs in the manufacturing process of the substrates 211 and 213 and already occurs when the substrate is carried into the laminate forming apparatus 100. As will be described next, the magnification deviation component generated in the joining process is not manifested in the stage before joining, and is generated in the joining process of the substrates 211 and 213. Therefore, it is described as the magnification deviation component in the joining process.

13 to 15 are diagrams illustrating the occurrence of magnification deviation that occurs in the process of joining the substrates 211 and 213. In each of FIGS. 13 to 17, in the process of progressing the joining at the joining portion 300, the region Q near the boundary between the region already joined and the region not yet joined on the substrates 211 and 213 is partially divided. Enlarged and shown.

As described above, as shown in FIG. 13, from the start of joining the substrates 211 and 213 at the joining portion 300 (FIG. 4, step S108) to the completion of the joining (FIG. 4, step S109). The boundary K between the region where the substrates 211 and 213 are joined to each other and the region where the substrates 211 and 213 are still separated and will be joined becomes the tip of the bonding wave, and the substrate 211 and 213 are from the center side to the outer peripheral side. Proceed towards.

Here, the substrate 211 on which the adsorption by the substrate holder 221 is maintained does not undergo any new deformation before and after the boundary K (left and right in the figure). However, the upper substrate 213 released from the holding by the substrate holder 223 is inevitably deformed before and after the boundary K. More specifically, at the boundary K, the substrate 213 extends on the lower surface side in the drawing of the substrate 213 and the substrate 213 contracts on the upper surface side in the drawing with respect to the central surface of the substrate 213 in the thickness direction.

FIG. 14 shows a state in which the boundary K has moved toward the outer peripheral side of the substrates 211 and 213 from the state shown in FIG. 13 from the same viewpoint as in FIG. The substrate 213 that has come into contact with the substrate 211 gradually expands the contact area from the central portion that initially contacts the substrate 211 toward the outer peripheral portion that was initially separated from the lower substrate 211.

Here, focusing on the joining surface of the substrates 211 and 213, the magnification on the joining surface of the upper substrate 213 is larger than the initial magnification before joining due to the above deformation that occurs in the joining process. Therefore, as shown by the deviation of the broken line of each substrate in the drawing, between the lower substrate 211 held by the substrate holder 221 and the upper substrate 213 released from the substrate holder 223. , There is a difference in magnification that did not exist before joining.

FIG. 15 shows a state in which the bonding of the substrate 213 to the substrate 211 further progresses from the state shown in FIG. 14, and the bonding of the substrates 211 and 213 is nearing completion. When the activated surfaces of the substrates 211 and 213 come into contact with each other, they are joined and integrated. Therefore, at the interface of joining, the positional deviation caused by the difference in magnification between the substrate 211 and the substrate 213 is fixed by joining.

The above-mentioned component of the magnification deviation in the joining process is not manifested between the substrates 211 and 213 before the start of joining. However, the component of the magnification deviation in the joining process is predicted based on the mechanical characteristics such as the thickness and rigidity of the substrates 211 and 213 and the environmental conditions such as the temperature, atmospheric pressure, and humidity of the atmosphere when the substrates 211 and 213 are joined. Therefore, in step S105 shown in FIG. 4, the bonding process magnification deviation component can be corrected. The initial magnification deviation component generated before joining can be acquired in advance through the acquisition unit 152 as the accuracy of the product with respect to the design specifications of the substrates 211 and 213.

Thereby, the determination unit 151 can determine the amount of deformation that cancels at least a part of the positional deviation of the substrates 211 and 213 due to the joining process magnification generated in at least one of the substrates 211 and 213. Therefore, the deformation units 601 and 602 that have acquired the amount of change determined by the determination unit 151 cancel out the deformation of the substrates 211 and 213 caused by the change in magnification that occurs in at least one of the substrates 211 and 213. It can occur in one of 213. Therefore, as described above, in the laminated body 230, the joint portion 300 is preliminarily set between the displacement caused by the strain already generated before the substrates 211 and 213 are contacted and the displacement caused by the strain generated after the substrates 211 and 213 are contacted. It can be corrected so as to be smaller than a predetermined threshold value.

However, as shown in FIG. 12, the magnification deviation component differs in the amount of positional deviation generated in each region when viewed along the radial direction of the substrates 211 and 213. It is difficult to correct such a magnification deviation component by the displacement or rotation of the substrate 211 like the shift deviation component and the rotation deviation component described above. However, such a magnification deviation component can be corrected by a method of joining the substrates 211 and 213 in a deformed state, as described below.

FIG. 16 is a diagram showing an example of a deformed portion 601 that can be used when the substrate 211 before joining is deformed by the deformed amount determined by the determined portion 151 for the purpose of suppressing the component of the magnification deviation in the joining process. The deformed portion 601 used here is a substrate holder 221 having a curved holding surface 225.

That is, the substrate holder 221 shown in FIG. 16 has a cross-sectional shape in which the thickness gradually increases from the peripheral portion to the central portion. As a result, the substrate holder 221 has a curved holding surface 225. Further, the substrate holder 221 incorporates a member that attracts the substrate 211, such as an electrostatic chuck and a vacuum chuck.

The substrate 211, which is attracted and held by the substrate holder 221, is in close contact with the holding surface 225 and is curved according to the shape of the holding surface 225. Therefore, when the surface of the holding surface forms a curved surface, for example, a cylindrical surface, a spherical surface, a parabolic surface, or the like, the adsorbed substrate 213 is also deformed to form such a curved surface.

In the substrate 211 which is attracted to and curved by the holding surface 225, the surface of the substrate 211 which is the upper surface in the drawing of the substrate 211 is compared with the center A in the thickness direction of the substrate 213 shown by the alternate long and short dash line in the figure. The surface is expanded and deformed in the plane direction from the center to the peripheral edge. Further, on the back surface, which is the lower surface in the drawing of the substrate 211, the surface surface of the substrate 211 is reduced and deformed in the plane direction from the center toward the peripheral edge portion.

By holding the substrate 211 in the substrate holder 221 in this way, the upper surface of the substrate 211 in the drawing is enlarged as compared with the flat state of the substrate 211, and the magnification deviation component can be corrected. If a plurality of substrate holders 221 having different curvatures of the curved holding surface 225 are prepared, the amount of deformation when correcting the magnification deviation component can be adjusted.

Further, in the above example, the holding surface 225 of the substrate holder 221 has a shape that rises in the center. However, by preparing the substrate holder 223 whose central portion is recessed with respect to the peripheral edge portion of the holding surface 225 and holding the substrate 211, the magnification deviation component on the surface of the substrate 211 can be reduced, and the circuit region 216 is designed. It is also possible to adjust the misalignment with respect to the specifications.

FIG. 17 is a diagram illustrating the relationship between the correction due to the deformation of the substrate 211 using the substrate holder 221 as described above and the bonding process magnification deviation component that occurs after the substrates 211 and 213 come into contact with each other. As described above, when the upper substrate 213 in the figure is released from the holding by the substrate holder 223 after the substrates 211 and 213 are in contact with each other, the substrates 211 and 213 gradually increase the contact area, and in the process, the substrate 213 is contacted. A new joining process causes a magnification shift component.

However, as described above, the substrate 211 on the lower side in the drawing is held by the substrate holder 221 having a protruding center, and is in a state of being corrected so that the magnification of the upper surface in the drawing is enlarged. Therefore, the magnification shift component due to the difference in magnification between the substrates 211 and 213 is reduced, and the position shift of the substrates 211 and 213 can be suppressed.

In this way, the substrate holder 221 may be used as a deforming portion, and the substrate 211 may be adsorbed on one holding surface selected from a plurality of holding surfaces having different shapes to deform the substrate 211. Further, when the laminated body 230 is manufactured by using the deformed portion 601 according to the shape of the substrate holder 221 as described above, a plurality of substrate holders 221 having different curved surface shapes as well as the curvature of the holding surface 225 are prepared. A substrate holder 221 having a holding surface 225 such that the amount of deformation determined by the determination unit 151 can be obtained on the substrate 211 may be selected to hold the substrate 211. This makes it possible to correct the substrate 211 having a deviation component other than the magnification deviation component.

FIG. 18 is a schematic cross-sectional view of another deformed portion 602. The deformed portion 602 can be incorporated into the lower stage 332 of the joint portion 300, and is used when the substrate 211 is deformed for the correction of step S105 shown in FIG.

The deforming portion 602 includes a base portion 411, a plurality of actuators 412, and a suction portion 413. The base portion 411 supports the suction portion 413 via the actuator 412.

The suction unit 413 has a suction mechanism such as a vacuum chuck and an electrostatic chuck, and forms the upper surface of the lower stage 332. The suction unit 413 integrates the substrate 211, the substrate holder 221 and the suction unit 413 by sucking and holding the carried-in substrate holder 221.

The actuator 412 is arranged between the base portion 411 and the suction portion 413. Further, the plurality of actuators 412 individually expand and contract by being supplied with a working fluid from the outside through the pump 415 and the valve 416 under the control of the control unit 150. Further, the actuator 412 expands and contracts according to the deformation amount so that the substrate 211 held by the suction portion 413 expands and contracts by the deformation amount determined by the determination unit 151. As a result, the plurality of actuators 412 expand and contract in the thickness direction of the lower stage 332 with different expansion and contraction amounts, and raise or lower the combined region of the suction portion 413.

Further, each of the plurality of actuators 412 is coupled to the suction portion 413 via a link. Further, the central portion of the suction portion 413 is coupled to the base portion 411 by the support column 414. When the actuator 412 operates in the deforming portion 602, the surface of the suction portion 413 is displaced in the height direction for each region to which the actuator 412 is connected. As a result, the deformed portion 602 deforms a holding surface that attracts and holds the substrate 211 by displacing a part of the substrate 211 with respect to the other part, and the substrate 213 of the substrate 211 that is attracted to the holding surface is deformed. The surface to be joined to is deformed by expanding and contracting in the direction of the surface.

FIG. 19 is a schematic plan view of the deformed portion 602, and is a diagram showing the layout of the actuator 412 in the deformed portion 601. In the deformed portion 602, the actuators 412 are arranged radially around the support column 414. Further, the arrangement of the actuators 412 is arranged along a concentric circle M centered on the support column 414. However, the arrangement of the actuators 412 is not limited to the one shown in the figure, and may be arranged in a grid pattern, a spiral pattern, or the like. As a result, the substrate 211 can be deformed into a concentric shape, a radial shape, a spiral shape, or the like.

FIG. 20 is a diagram illustrating the operation of the deformed portion 602. In the state shown in the figure, the amount of shortening of the actuator 412 increases as the distance from the support column 414 increases, and the suction portion 413 has a convex shape as a whole so that the central portion supported by the support column 414 is the highest and the peripheral portion is lower. .. As a result, the substrate 211 held on the suction portion 413 is also deformed into a shape with a raised center.

In the board 211 deformed as shown in the drawing, the surface of the board 211 is enlarged and deformed in the plane direction on the upper surface of the board 211 in the drawing. Further, in the above example, the suction portion 413 had a shape of being raised in the center. However, it is also possible to increase the operating amount of the actuator 412 at the peripheral edge portion of the suction portion 413, deform the substrate 211 into a shape in which the central portion is depressed with respect to the peripheral edge portion, and reduce the magnification on the surface of the substrate 211. ..

Here, the deforming portion 602 directly deforms the substrate holder 221. Therefore, the amount of deformation of the substrate 211 is the amount obtained by multiplying the amount of deformation of the substrate holder 221 by a coefficient corresponding to the thickness of the substrate holder 221. Therefore, the deformation of the substrate 211 by the deforming portion 602 is more efficient than the case of directly deforming the substrate 211.

In the joint portion 300, both the deformed portion 601 and the deformed portion 602 can be used at the same time. That is, the substrate was deformed by holding the substrate 211 on the substrate holder 221 as the deformed portion 601 shown in FIG. 16 and then holding the substrate holder 221 holding the substrate 211 on the lower stage 332 having the deformed portion 602. Deformation of the substrate 211 by adsorbing to the holding surface 225 and deformation of the substrate 211 by deforming the plane holding the substrate 211 can occur at the same time.

Further, one of the substrates 211 and 213 is deformed by adsorbing to the deformed holding surface 225, and the substrate holder holding the other of the substrates 211 and 213 is deformed to deform the holding surface of the substrate holder and the substrate. , And both the deformed portions 601 and 602 may be used as the entire joint portion 300. Further, the actuator 412 of the deforming portion 602 may be operated with at least one of the acting amounts X ₁ , X ₂ and X ₃ having different correction purposes, as will be described later.

Further, in the deformed substrate 211, when the center is the highest, the starting point of the joining is formed in the center when the lower stage 332 is raised in step S108 to start the joining. As described above, the joining of the substrates 211 and 213 expands from the region where the joining is started, but by expanding the region to be joined from the center of the substrates 211 and 213, the atmosphere sandwiched between the substrates 211 and 213 is efficiently created. It can be discharged to prevent the generation of voids.

In this way, from the viewpoint of preventing the generation of voids, when the substrate 211 is deformed, there is a gap between the substrates 211 and 213 so that the atmosphere between the substrates 211 and 213 is smoothly discharged in the process of joining. It is preferable to deform the substrate 211 while paying attention to the formation of the substrate 211. Further, by individually controlling the amount of action of the plurality of actuators 412, the substrate 211 may be deformed into a non-linear shape including a plurality of uneven portions in addition to a symmetrical shape such as a spherical surface and a cylindrical surface. As a result, the determination unit 151 determines the amount of deformation that cancels at least a part of the positional deviation of the substrates 211 and 213 caused by the non-linear distortion generated in at least one of the substrates 211 and 213, and the positional deviation distributed in a non-linear manner. Can also be corrected by deformation.

In general, the substrate 211 may undergo planar deformation and three-dimensional deformation. The planar deformation is a deformation in which a part of the substrate 211 is displaced in the plane direction with respect to the other part. Planar deformations further include linear and non-linear deformations. The linear deformation is a deformation in which the position of the structure on the substrate 211 displaced by the deformation can be represented by a linear transformation, and the non-linear deformation is a deformation in which the displacement cannot be represented by the linear transformation. Non-linear distortion is caused by the crystal anisotropy of the substrate 211, processing in the manufacturing process of the substrate 211, and the like.

On the other hand, each of the deformation portions 601 and 602 can intentionally cause non-linear deformation with respect to the substrates 211 and 213. In the case of the deforming portion 601, the substrate 211 can be non-linearly deformed by providing the substrate holder 221 with a non-linearly deformed holding surface 225 and adsorbing the substrate 211 to the holding surface 225.

For example, a substrate 211 in which a portion having a height position different from that of the other portions may be formed on a part of the holding surface 225. Further, in the case of the deformation unit 602, the substrate holder 221 and the substrate 211 can be deformed non-linearly by controlling the distribution of the acting amounts of the plurality of actuators 412 to be non-linear. As described above, the joint portion 300 can suppress the positional deviation caused in the laminated body 230 due to the non-linear distortion of the substrates 211 and 213 by using either the deformed portions 601 and 602 or both of the deformed portions 601 and 602. ..

21 to 25 are diagrams showing step by step a procedure for joining a set of substrates 211 and 213 in a joint portion 300 provided with deformed portions 601 and 602 while correcting a deviation due to a magnification difference. Is. As shown in FIG. 21, when the substrate 211 and the substrate holder 221 are carried into the joint portion 300, the actuator 412 of the deformed portion 602 is in the initial state, and the upper surface of the suction portion 413 is flat. Therefore, the substrate 211 is attracted to the holding surface 225 of the substrate holder 221.

The holding surface 225 of the substrate holder 221 which is also the deformed portion 601 has a convex holding surface 225 whose central portion is raised by _a height difference X1 from the peripheral portion. Therefore, when the substrate 211 is attracted to the holding surface 225 of the substrate holder 221, the substrate 211 is deformed along the curve of the holding surface 225 of the substrate holder 221. In this case, the height difference X ₁ of the substrate holder 221 is the action amount X ₁ of the substrate holder 221 as a deforming portion that deforms the substrate 211.

The substrate holder 221 is attracted to the flat suction portion 413 on the lower stage 332, and the entire flat lower surface is brought into close contact with the substrate holder 221. As a result, the substrate holder 221 and the suction portion 413 can be integrally deformed.

FIG. 22 shows a state in which the actuator 412 of the deforming unit 602 is operated under the control of the control unit 150. In the illustrated state, the amount of contraction of the actuator 412 is small near the center of the suction portion 413, and the amount of contraction of the actuator 412 is large near the peripheral portion of the suction portion 413. As a result, the suction portion 413 forms a curved surface on the surface thereof where a height difference occurs.

FIG. 23 is a diagram showing the next stage of correction of the substrate 211 using the deformed portions 601 and 602. The control unit 150 temporarily releases the holding of the substrate 211 by the substrate holder 221 while maintaining the state in which the suction portion 413 is bent by the actuator 412. That is, the adsorption of the substrate 211 to the substrate holder 221 by the electrostatic chuck or the like is stopped.

As a result, the substrate 211 is lifted from the substrate holder 221 due to its own elasticity, except for a part near the center surrounded by the alternate long and short dash line C. If the substrate 211 is difficult to lift from the substrate holder even after the adsorption is released, a hole may be formed in the substrate holder 221 and gas may be blown onto the substrate 211 through the hole. At this time, it is preferable to adjust the pressure and flow rate of the gas so as not to displace the substrate 211. Further, the substrate 211 may be deformed by blowing gas onto at least a part of the substrate 211.

In this way, the deformed portion 602 may deform the substrate 211 by releasing the deformation of the holding surface in a state where the substrate 211 is adsorbed on the holding surface deformed in advance. In the vicinity of the center of the substrate 211 surrounded by the alternate long and short dash line C, the substrate holder 221 may partially continue to hold the substrate 211. As a result, the relative position of the substrate 211 with respect to the substrate holder 221 does not change, and the validity of the information regarding the alignment of the substrate 211 is maintained.

FIG. 24 is a diagram showing the next stage of correction of the substrate 211 using the deformed portions 601 and 602. At the stage shown in the drawing, the control unit 150 operates the electrostatic chuck of the substrate holder 221 to re-adsorb the substrate 211 once released from the adsorption by the substrate holder 221 to the holding surface 225 of the substrate holder 221.

Here, the holding surface 225 of the substrate holder 221 which is the deformed portion 601 has a curved shape itself. Further, the suction portion 413 is maintained in a bent state until a height difference X ₂ corresponding to the acting amount X ₂ of the actuator 412 is generated. Therefore, at the stage of re-adsorbing the substrate 211, the holding surface 225 of the substrate holder 221 is curved with a different curvature than the initial shape.

By adsorbing the substrate 211 to the substrate holder 221 in this state, different deformations can be caused in the substrate 211, and the magnification of the circuit area 216 in the substrate 211 can be corrected. In this way, the deforming portion 602 may deform the substrate 211 by adsorbing the substrate 211 to the holding surface and imitating the shape of the holding surface.

The substrate 211 receives the suction force of the substrate holder 221 in a state of being separated from the substrate holder 221 and does not displace after coming into contact with the substrate holder 221. Therefore, in the above re-adsorption process, no frictional force acts on the substrate 211 from the substrate holder 221. When the magnification of the substrate 211 is corrected by the above procedure, the deformation amount Y ₁ of the circuit region 216 corresponding to the working amount X ₁ can be expressed by the following equation 1.
Y ₁ = 0.0375 ・ (X ₁ + X ₂ ) [ppm] ・ ・ ・ (Equation 1)

Here, the coefficient "0.0375" in the above formula 1 is that the substrate holder 221 and the adsorption portion 413 are both bent by the actuator 412 in a state where the substrate holder 221 is attracted to the suction portion 413, and then the substrate 211 is used as a substrate. When the substrate 211 is deformed without frictional force between the substrate holder 221 and the substrate holder 221 by being attracted to the holder 221, the amount of change _Y1 in the magnification of the substrate 211 and the holding surface 225 of the substrate holder 221 which is the deformed portion 601 This is an example of a coefficient α that defines the relationship between the height difference X ₁ and the height difference X ₂ of the suction portion 413 bent by the deformed portion 602. The unit of the amount of deformation Y ₁ is [ppm] (parts per million).

FIG. 25 is a diagram showing the next stage of correction of the substrate 211 by the deformed portions 601 and 602. At the stage shown in the figure, the control unit 150 operates the actuator 412 while maintaining the suction of the substrate holder 221 by the suction unit 413 and the suction of the substrate 211 by the substrate holder 221 to operate the substrate 211, the substrate holder 221 and the substrate holder 221. The suction portion 413 is integrally deformed. As a result, the surface of the suction portion 413 is bent until the height difference X3 _, which is the amount of action, is generated.

In this case, since the substrate 211 is still adsorbed on the substrate holder 221, friction continues to act between the substrate holder 221 and the substrate 211, and the substrate 211 is efficiently deformed. The amount of change Y ₂ in the magnification caused by the deformation of the holding surface corresponding to the amount of action X ₂ due to the operation of the deformed portion 602 can be expressed by the following equation 2.
Y ₂ = 0.29 · {(X ₁ + X ₃ )-(X ₁ + X ₂ )} [ppm] ... (Equation 2)

Here, the coefficient "0.29" in the above equation 2 is that the substrate 211, the substrate holder 221 and the adsorption portion 413 are bent by the actuator 412 in a state where the substrate holder 221 holding the substrate 211 is attracted to the suction portion 413. When the substrate 211 is deformed by the frictional force between the substrate holder 221 and the substrate 211, it is bent by the change amount Y ₂ of the magnification in the substrate 211, the height difference X ₁ of the holding surface 225 of the substrate holder 221 and the deformed portion 602. This is an example of the coefficient β that defines the relationship between the height difference X ₂ and X ₃ of the suction unit 413. The unit of the amount of change Y ₂ is [ppm].

In this way, the coefficient β for calculating the deformation amount Y ₂ when the substrate 211 once released from the adsorption by the substrate holder 221 is re-adsorbed to the substrate holder 221 strongly bent by the actuator 412 to change the magnification of the substrate 211. Has _a value different from the coefficient α indicating the relationship with the deformation amount Y1 when the substrate 211 is bent while being adsorbed on the holding surface 225 of the substrate holder 221.

26 to 29 show a part of the procedure for correcting the magnification of the substrate 211, and step by step the process of joining the substrate 211 held by the lower stage 332 to the substrate 213 held by the upper stage 322. It is also a diagram showing. As shown in FIG. 26, the substrate 211 held by the suction portion 413 in the lower stage 332 faces the substrate 213 held in the upper stage 322 in a aligned state.

Here, the substrate 211 in the lower stage 332 is in a state where the magnification is corrected by the curvature of the holding surface 225 of the substrate holder 221 which is the deformation portion 601 and the deformation of the suction portion 413 of the deformation portion 602. At least the vicinity of the center of the substrate 211 is in a deformed state in which the vicinity of the periphery is raised. On the other hand, the substrate 213 held on the upper stage 322 is held in a flat state on the flat upper stage 322 via the flat substrate holder 223.

Next, as shown in FIG. 27, as the lower stage 332 rises and approaches the upper stage 322, the substrate 211 held by the lower stage 332 and the substrate 213 held by the upper stage 322 become the most mutually exclusive. Contact in close regions initiates joining of the substrates 211 and 213. The ascent of the lower stage 332 is stopped at this point.

In the substrate 211 of the lower stage 332, a state in which the vicinity of the center is raised more than the vicinity of the peripheral edge is maintained. Therefore, the contact between the substrates 211 and 213 starts at one point near the center indicated by the alternate long and short dash line C. As a result, the atmosphere sandwiched between the substrates 211 and 213, for example, the atmosphere, was smoothly extruded from the inside to the outside in the process of expanding the contact area of the substrates 211 and 213, and was formed by joining the substrates 211 and 213. In the laminated body 230, the generation of voids in which air bubbles or the like remain between the substrates 211 and 213 is prevented.

In other words, in the process of joining the substrates 211 and 213, in order for the bubbles to smoothly escape from between the substrates 211 and 213, the bubbles move to the peripheral side of the substrates 211 and 213 when the contact is started. It is desirable that there is a gap that does not interfere with the above, or that there is a gap that does not allow the substrates 211, 213 to contact each other at two or more locations and that they contact each other at one location. Therefore, for the deformation of the substrate 211 by the deformation portion 601, it is preferable to select a deformation procedure in which a constant curvature remains at the stage of contacting the substrate 213 in step S108 (FIG. 4). If the curvature of the substrate 211 becomes small during the joining process and the above-mentioned gap cannot be secured, the holding surface 225 has a curvature as the substrate holder 223 for holding the substrate 213 held on the upper stage 322. The board holder 221 may be used, or the board holder 221 itself may be curved.

In this way, by joining at least one of the boards 211 and 213 in a state of being deformed so that the inside protrudes in the plane direction of the boards 211 and 213, the joining of the boards 211 and 213 is achieved by joining the boards 211 and 213. It progresses from the inside to the outside in the plane direction. This prevents air bubbles (voids) and the like from remaining inside the laminated body 230 formed by joining.

In the above example, the raised part of one of the deformed substrates 211 was brought into contact with the other substrate 213 to start joining the substrates 211 and 213. However, apart from the function of deforming the substrates 211 and 213 for the purpose of reducing the misalignment, the joint portion 300 has a function of bringing a part of the substrates 211 and 213 into contact when starting the joining of the substrates 211 and 213. It may be provided.

FIG. 38 is a schematic cross-sectional view of a pushing portion 701 in which a part of the substrates 211 and 213 is brought into contact with each other to start joining. The push unit 701 has a push member 710 and an actuator 720.

In the illustrated example, the pushing member 710 has a stem 711 and a pushing portion 712. The stem 711 penetrates the substrate holder 223 held by the upper stage 322 and the upper stage 322 in the thickness direction of the upper stage 322, and extends to the side opposite to the substrate holder 223 with respect to the upper stage 322. The pressing portion 712 is arranged at the tip of the stem 711 and is fixed to the stem 711. Therefore, when the stem 711 moves in the thickness direction of the upper stage 322, the pressing portion 712 also moves along with the stem 711.

The actuator 720 is arranged on the side opposite to the substrate holder 223 with respect to the upper stage 322, and moves the stem 711 in the thickness direction of the upper stage 322. Therefore, by moving the stem 711 downward in the drawing by the actuator 720, the pressing portion 712 pushes the substrate 213 held by the substrate holder 223 on the upper stage 322 from the back surface with respect to the joint surface, and the other substrate 211. Can be partially approached to.

The pressing portion 712 may be formed of an elastic member such as an elastomer. Further, the portion of the pressing portion 712 that abuts on the substrate 213 and pushes out the substrate 213 may have a shape that abuts along the direction in which the Young's modulus is low, depending on the distribution of the Young's modulus of the substrate 213. As a result, the substrate 213 is deformed in a direction in which it is difficult to be elastically deformed, the shape of the contact region of the substrate 213 with respect to the substrate 211 is brought close to a perfect circle, and the bonding proceeds uniformly in the circumferential direction of the substrates 211 and 213. Will be possible. In the illustrated example, the substrate holder 221 that holds the substrate 211 has a flat holding surface, but instead of this, for example, a cylindrical surface, a spherical surface, a paraboloid surface, or the like as shown in FIG. A substrate holder having a holding surface forming a curved surface may be used.

Next, as shown in FIG. 28, in step S109 (FIG. 4), the substrate holder 223 held on the upper stage 322 is released from holding the substrate 213. As a result, the contact area with respect to the lower substrate 211 of the upper substrate 213 gradually increases from the central side to the peripheral side of the substrates 211 and 213, and eventually the substrates 211 and 213 are joined over the entire surface.

As described above, the substrate 211 held on the lower stage 332 side has a shape with a raised center. Therefore, the upper substrate 213 bonded to the substrate 211 on the lower side in the drawing is deformed in the process of bonding, and the magnification in the circuit region 216 also changes. It is a change in the magnification that occurs in the substrate 211 in the process of such joining, and the deformation amount Y ₃ corresponding to the action amount X ₃ can be expressed by the following equation 3.
Y ₃ = 0.0375 ・ (X ₁ + X ₃ ) [ppm] ・ ・ ・ (Equation 3)

Here, the coefficient "0.0375" in the above equation 3 is open to the case where friction does not occur between the substrate 211 and the substrate holder 221, that is, to the curved shape of the holding surface 225 of the substrate holder 221. This is an example of a coefficient γ that defines the relationship between the amount of change Y ₃ that occurs in the magnification of the substrate surface and the height differences X ₁ and X ₃ when the substrate 211 is adsorbed. The unit of _Y3 is [ppm]. In this way, when the determination unit 151 determines the deformation amount Y ₃ , the deformation unit 602 and the like cancel out at least a part of the displacement caused by the deformation caused in the joining process of the substrates 211 and 213. It can occur on the other side of 211 and 213.

In this way, the deforming portion 601 can correct the magnification of the substrate 211 by combining the procedure of sucking or opening the substrate 211 by the board holder 221 and the procedure of deforming or opening the suction portion 413 by the actuator 412. Therefore, if the magnification of the circuit area 216 on the surface of the substrate 213 held on the upper stage 322 of the joint portion 300 to be bonded is different from the magnification of the circuit area 216 of the substrate 211, the circuit of the substrate 211 The magnification of the region 216 can be corrected by enlargement deformation or reduction deformation to improve the alignment accuracy of the substrates 211 and 213.

It should be noted that the misalignment can be suppressed by a simpler procedure than the above procedure described with reference to FIGS. 21 to 28. For example, the deformation of the substrate 211 due to the height difference X ₂ before contacting the substrate 213 is omitted [X ₂ = 0], and the substrate 211 is deformed exclusively by the height difference X ₃ after the substrate 211 and 213 are in contact with the substrate 211. By joining the 211 and 213, it is possible to omit the procedure of releasing the adsorption of the substrate 211 deformed by the height difference X ₂ .

Further, the substrate holder 221 may be deformed by the height difference X2 without holding the substrate ₂₁₁ , and then the substrate 211 may be held while maintaining the deformation to execute the subsequent joining procedure. In this case as well, the procedure of temporarily releasing the adsorption of the substrate can be omitted. However, by introducing a procedure for temporarily releasing the holding of the substrate 211 after the deformation due to the height difference X ₂ , it depends on the height difference X ₁ of the substrate holder 221 itself to be used and the correction amount related to the magnification of each substrate. The height difference (X ₃ + X ₁ ) at the time of joining the substrate holder 221 can be freely determined without any problem.

As described above, in the laminated body 230 to which the substrates 211 and 213 whose magnifications have been corrected in a plurality of steps are joined, the changes in magnification Y ₁ , Y ₂ , and Y ₃ are superimposed. Therefore, the amount of deformation Y (Y = Y ₁ + Y ₂ + Y ₃ ), which is the change in the overall magnification of the substrate 211 at the stage shown in the figure, can be expressed as follows.
Y ₁ + Y ₂ + Y ₃ = 0.0375 ・ (X ₁ + X ₃ ) +
0.29 ・ {(X ₁ + X ₃ )-(X ₁ + X ₂ )} +
0.0375 ・ (X ₁ + X ₃ )
= 0.0375 ・ (2X ₁ + X ₂ + X ₃ ) + 0.29 ・ (X ₃ -X ₂ )
... (Equation 4)

As shown in the above equation 4, the deformation amount Y (Y = Y ₁ + Y ₂ + Y ₃ ) can be calculated as a value obtained by multiplying each of the correction amounts X (X = X ₁ , X ₂ , X ₃ ) by a coefficient. .. Therefore, when making corrections to reduce or eliminate the positional deviation of the substrates 211 and 213 remaining in the laminated body 230, the correction amount corresponding to the deformation amount Y in which the positional deviation becomes zero or smaller than a predetermined value according to the above equation 4. X is obtained, and at least one of the substrates 211 and 213 is deformed by the deforming portions 601 and 602.

Even if the correction is performed with the ideal correction, that is, the deformation amount Y at which the positional deviation of the substrates 211 and 213 in the laminated body 230 becomes zero, the deformation amount Y acting on the substrate 211 is the deformation of the ideal correction. May make a difference to the amount. However, if the deformation amount Y is determined so that this difference falls within the allowable range, the misalignment accuracy of the substrates 211 and 213 in the laminated body 230 formed thereafter can be set within the allowable range.

In this way, the joining portion 300 deforms at least one of the substrates 211 and 213 to be joined by the deforming portions 601 and 602 with the deformation amount Y determined by the determining portion 151, and the positions of the substrates 211 and 213 remaining on the laminated body 230. The deviation can be corrected. (Step S105: FIG. 4) Further, the joint portion 300 holds at least one of the substrates 211 and 213 in a deformed state, and the other of the substrates 211 and 213 is brought into contact with one and then released from the holding to be joined. A laminated body 230 including the boards 211 and 213 is formed.

In this case, of the boards 211 and 213, the board to be deformed for correction is a board that is deformed to cause displacement, but is itself not deformed to cause slippage. You may. In either case, by deforming and bonding at least one of the substrates 211 and 213, it is possible to suppress the deviation in the manufactured laminate 230.

Further, when joining the substrates 211 and 213, when one of the substrates 211 and 213 is continuously held and the other is opened, the non-uniformity of the elongation amount predicted by the substrate 211 and 213 alone is larger. It is preferable to keep the one with higher complexity and the one with higher structural anisotropy, and open the other to join. As a result, the correction of the positional deviation of the circuit region 216 is easily reflected by the laminated body 230.

Further, when joining the substrates 211 and 213, the joint portion 300 may continue to hold the substrates 211 and 213 until the joining of the substrates 211 and 213 is completed. In this case, the boards 211 and 213 are pressed over the entire surface while maintaining the positioning of the boards 211 and 213 by the board holders 221 and 223 holding the boards 211 and 213 or the stage. The substrates 211 and 213 joined in this way become the laminated body 230. For the purpose of strengthening the bonding of the substrates 211 and 213, the bonded substrates 211 and 213 may be further subjected to processing such as heating and pressurization.

In the joining portion 300, the deforming portion 601 deforms the substrate 211 by the amount of deformation determined by the determining portion 151 prior to joining the substrates 211 and 213. The joint portion 300 forms the laminated body 230 by, for example, joining the substrate 213 to the deformed substrate 211. Here, the determination unit 151 joins by taking into account the amount of deformation that occurs in the substrate 213 by following the shape of the deformed substrate 211 in the process of joining the substrates 211 and 213 in order to form the laminated body 230. The amount of deformation of the substrate 211 at the time is determined. Here, in the determination unit 151, the amount of misalignment of the substrates 211 and 213 in the laminated body 230 due to the deformation occurring before joining to any of the substrates 211 and 213 is smaller than a predetermined threshold value. The amount of deformation may be determined so as to be. By joining the substrates 211 and 213 in this way, it is possible to suppress the positional deviation of the substrates 211 and 213 in the laminated body 230 obtained by the joining.

As described above, in the joining portion 300 provided with the deforming portion 601 when the substrate 211 is joined to another substrate 213, the deviation due to scaling or deformation with respect to the design specifications of the circuit area 216 on each surface of the substrates 211 and 213 is achieved. Can be corrected in the process of joining. Further, the deformed portion 601 suppresses the positional deviation that occurs after the contact of the substrates 211 and 213, which does not occur in the stage before the joining up to step S107 in FIG. can. Therefore, it is possible to manufacture the laminated body 230 that is accurately aligned by compensating for the difference in magnification due to variations, tolerances, etc. in the manufacturing process of the substrates 211 and 213 to be joined.

Further, when manufacturing a plurality of laminated bodies 230, for example, when joining a group of substrates 211 and 213 manufactured with the same specifications to manufacture a single lot of laminated body 230, the already manufactured laminated body 230 The residual D, which is the amount of misalignment remaining in, is measured, the deformation amount of the substrate 211 in step S105 is corrected so that the residual D becomes smaller, and thereafter, the corrected deformation amount is used. The laminated body 230 may be manufactured by deforming the substrate 211. As a result, the quality can be improved as the production amount of the laminated body 230 increases.

If the residual D increases for some reason while the substrates 211 and 213 are repeatedly joined, the amount of deformation of the substrate 213 in step S105 is adjusted so that the residual D does not exceed the predetermined threshold value Dth. It may be corrected. As a result, it is possible to prevent a decrease in the yield of the laminated body 230 in the lot.

The positional deviation that occurs in the laminated body 230 is a deviation between the corresponding marks 218 between the substrates 211 and 213 forming the laminated body 230, or between the connecting portions corresponding to each other, with respect to a predetermined relative position. be. When the amount of misalignment is larger than the threshold value, for example, electrical continuity between the substrates 211 and 213 may not be obtained because the connecting portions such as the corresponding contacts do not contact each other. In addition, the signal transmission as designed may not be possible due to contact or short circuit of the connection portion different from the planned combination.

The threshold Dth of the amount of misalignment allowed with respect to misalignment is, for example, in the laminate 230 formed by the substrates 211 and 213, the electrical electrical between the circuit of one substrate 211 and the circuit of the other substrate 213. It may be the maximum value of the amount of misalignment within the range in which the connection can be maintained. Further, the allowable misalignment threshold is, for example, in the laminated body 230 formed by the substrates 211 and 213, the joint portion of one substrate 211 is different from the joint portion originally connected in the other substrate 213. It may be the maximum value of the amount of misalignment in the range where it does not come into contact with the portion. Therefore, the threshold value of the allowable misalignment amount is determined, for example, depending on the size of the connection terminals formed on the substrates 211 and 213.

As described above, when the deformation amount of the substrate 213 in step S105 is corrected, the determination unit 151 of the control unit 150 determines the deformation amount in which the residual D of the positional deviation of the substrates 211 and 213 in the laminated body 230 becomes smaller. do. More specifically, it is preferable to determine the correction amount for the deformation amount as follows. Further, if the position shift of the substrates 211 and 213 still remains in the laminated body 230 formed by the first set of substrates 211 and 213 corrected and joined by deformation, the following will be described based on the residual D. As described above, by correcting the deformation amount with the correction amount α, the residual D of the laminated body 230 formed by the second set of substrates 211 and 213 joined thereafter can be corrected closer to the ideal. That is, the residual D can be brought close to zero.

As shown in FIG. 27, when the upper substrate 213 which is held and fixed by the substrate holder 221 is bonded to the upper substrate 213 which is released from the substrate holder 221, the substrate 213 is bonded to the lower substrate 211. The deformation component A in the joining process described with reference to FIGS. 13 to 15 and the deformation component B generated by joining along the shape of the fixed substrate 211 are carried into the laminate forming apparatus 100. Deformation that combines with the deformation component IU that has occurred from before occurs. On the other hand, since the substrate 211 is fixed from beginning to end through the joining process, the deformation component C1 generated by imitating the substrate holder 221 and the deformation component IL generated before being carried into the laminate forming apparatus ₁₀₀ There is a combined deformation.

Here, the lower substrate 211 is fixed in a convex shape with a raised center. Therefore, in the substrate 213, the deformation component B appears as a shrinkage of the joint surface of the substrate 213. Further, the deformation component A appears as an extension of the joint surface of the substrate 213 as described above. Further, in the substrate 211, the deformation component C appears as an extension of the joint surface of the substrate 211.

The residual D, which is the positional deviation remaining in the laminated body 230 when the above substrates 211 and 213 are joined, can be expressed as the following (Equation 5) by the amount of deformation of each of the above deformations.
D = A + B + IU- (C + IL) ... (Equation 5)

Here, in the above equation 5, the deformation amount B changes according to the shape of the lower substrate 211 at the time of joining. Further, the deformation amount C can be changed according to the action amount of the deformation portions 601 and 602. On the other hand, the deformation amounts A, IU, and IL in the above formula 5 do not change at the predetermined values at the stage of joining the substrates 211 and 213. Therefore, in the formula 5, the deformation amounts A, IU, and IL are put together into a constant K and expressed as the following formula 6.
D = (A + IU-IL) + BC
= K + BC ... (Equation 6)

Here, since the purpose of the deformation of the substrate 211 by the deformation portions 601 and 602 is to reduce the residual D, ideally D becomes zero. However, since the residual D may actually remain, when the bonding of the substrates 211 and 213 is repeated, the first set of the substrates 211 and 213 are joined to form a first layer than the laminate 230 previously formed. In the laminated body 230 formed by joining the second set of substrates 211 and 213 after the first set, the deformation amount C is corrected by the correction amount α so that the residual D becomes smaller. As such a correction amount α, the misalignment amount D of the substrates 211 and 213 remaining in the previously formed laminate 230, or the misalignment amount D calculated by analysis, simulation, etc. of the laminate 230 to be formed from the substrate 230 will be described later. It can be determined by modifying it as follows.

The deformation amount C to be corrected may be the deformation amount determined by the determination unit 151 when the substrates 211 and 213 joined before the substrates 211 and 213 to be joined are joined. Further, even in the first joining in which the correction value to be corrected does not exist, for example, the predicted value or the estimated value based on the results of the analysis, simulation, etc. executed in advance before the joining is corrected for the substrates 211 and 213 to be joined. It may be the initial value to be the target of.

Further, when joining many boards 211 and 213, first, one set of boards 211 and 213 is joined as the _first set without any deformation, and the residual D1 generated by the joining is reduced. The correction amount α to be used may be determined. Further, when joining the boards 211 and 213 of a new lot, the initial value to be corrected may be calculated based on the records of the lots that have been joined in the past and have similar characteristics to the boards 211 and 213. ..

Now, if the deformation amount before the correction is expressed as B ₁ and C ₁ , the deformation amount after the correction is expressed as B ₂ and C ₂ , and the correction amount is expressed as ΔB and ΔC, the substrate deformed by the deformation amount after the correction is expressed. When the residual D in the laminated body 230 created by joining the substrate 213 to 211 becomes zero, the following equation 7 is established.
0 = K + B ₂ -C ₂ ... (Equation 7)

Therefore, from the formulas 6 and 7, the correction amounts ΔB (= B2 _- B ₁ ) and ΔC (= C2 _- C ₁ ) of the deformation amounts B and C can be expressed as the following formula 8.
D =-(B ₂ -C ₂ ) + B ₁ -C ₁
=-(B ₂ -B ₁ ) + C ₂ -C ₁
= −ΔB + ΔC ... (Equation 8)

In the above equation 8, the residual D1 generated when the deformation amount for correction in step S105 (FIG. 4) is executed with the deformation amount _C before the correction is distributed to the correction amounts ΔB and ΔC. It means that it is possible to make the residual D zero. Further, the deformation amount C when the substrate 211 is deformed by being adsorbed on the substrate holder 221 having the convex holding surface 225 is the deformation amount B of the copy deformation generated in the substrate 213 bonded to the substrate 211 and the reference numeral. Is the opposite and the absolute values are equal.

Therefore, in the laminated body forming apparatus 100, the determination unit 151 can reduce the residual D by satisfying the following equation 9 when calculating the correction amount ΔC. The residual D can be made zero by setting the correction amount ΔB and the correction amount ΔC that can obtain the ideal deformation amount to half of the residual D, respectively. Further, if each of the correction amounts ΔB and ΔC does not satisfy the condition shown in the following equation 9, the result is overcorrection, and the residual D increases due to the correction.
| D ₁ |> | ΔC | ... (Equation 9)

As described above, the determination unit 151 is formed in the laminate 230 formed by joining the substrates 211 and 213 deformed by _a certain amount of deformation C1 by opening the holding of the other of the substrates 211 and 213. The deformation amount C ₁ is corrected by the correction amount α whose absolute value | α | is smaller than the absolute value | D ₁ | of the misalignment amount D ₁ of 211 and 213, that is, | α | is added to the deformation amount C ₁ . By adding or subtracting to determine the amount of deformation of the substrates 211 and 213 to be joined, the misalignment of the substrates 211 and 213 in the laminated body 230 can be further reduced.

On the other hand, when the substrate 211 and the substrate holder 221 are both deformed and the substrates 211 and 213 are joined while being attracted to the substrate holder 221, the absolute value of the deformation amount C of the substrate 211 that is deformed together with the substrate holder 221 is used. The absolute value of the deformation amount B of the substrate 213 differs from the absolute value according to the thickness of the substrate holder 221. In particular, after the substrate 211 is held in a state where the holding surface 225 of the substrate holder 221 is deformed in a concave shape, the holding surface 225 is deformed by reducing the concave curvature in the convex direction, and the holding surface 225 at the time of joining is concave. When the residual is reduced, the overcorrection of the deformation amount C is canceled by the deformation amount B. Therefore, the residual D of the misalignment is reduced even though the condition of the equation 9 is satisfied. The amount may not be available.

In such a case, the residual D can be reduced by determining the correction amount ΔB that satisfies the following formula 10 based on the above formula 8.
| D ₁ |> | ΔB | ... (Equation 10)

That is, when the other substrate 213 is joined to the one substrate 211 deformed by the deformation amount C ₁ to form the laminated body 230 having the residual D ₁ of the positional deviation of the substrates 211 and 213, the deformation amount C ₁ The deformation amount _BC1 is generated on the other substrate 213 by deforming according to the one substrate 211 deformed in. After that, when the deformation amount C ₁ is corrected by the correction amount α and the other boards 211 and 213 are joined, the deformation is made according to one of the boards 211 deformed by the corrected deformation amount C ₂ (= C ₁ + α). As a result, the amount of deformation _BC2 is generated on the other substrate 213.

Here, the absolute value ΔB (= | _{BC1 - BC2} |) of the difference between the deformation amounts _BC1 and _BC2 is larger _than the absolute value | D1 | of the residual D1 of the previously formed laminate 230. By determining the correction amount α so as to be small, the misalignment of the substrates 211 and 213 in the laminated body 230 can be further reduced. Therefore, the determination unit 151 may correct the deformation amount with a correction amount whose absolute value is smaller than the absolute value of the misalignment amount generated in the joining process. As a result, it is possible to prevent the amount of deformation from being excessively corrected and the amount of misalignment of the substrates 211 and 213 in the obtained laminated body 230 from increasing.

As described above, the phenomenon that the deformation amount A is generated in the joining process of the substrates 211 and 213 depends on the environmental conditions such as the temperature, atmospheric pressure, and humidity of the atmosphere when the substrates 211 and 213 are joined. Therefore, when predicting the residual D and determining the deformation amount C or the correction amount ΔC, it is preferable to consider the environmental conditions of the joining. Further, when the joining of the substrates 211 and 213 is repeated, the correction amount α of the deformation amount Y based on the residual D may be repeated every time or periodically depending on the required accuracy for the laminated body 230.

Further, in the determination unit 151, with respect to at least one of the substrates 211 and 213 constituting the laminate 230 to be formed, the individual differences in the deformations that have occurred in the individual substrates 211 and 213 before joining, and the deformed one substrate. The amount of deformation at the time of joining may be corrected by reflecting at least one individual difference of the individual difference of the deformation generated in the other board 213 in the process of joining the other substrate 213 to the 211.

FIG. 29 is a diagram showing the next stage of the substrates 211 and 213 joined after correcting the magnification deviation component of the positional deviation of the substrates 211 and 213 in the laminated body 230 in the joint portion 300. As shown in the figure, the substrates 211 and 213 bonded to each other are sandwiched between the substrate holders 221 and 223, and the substrate holders 221 and 223 are mechanically coupled by clips 227. As a result, the aligned state of the substrates 211 and 213 is ensured, and the substrate 300 can be easily carried out from the joint portion 300.

The clip 227 may be used to connect the substrate holders 221 and 223 with springs, screws, or the like. Further, the clip 227 may be one that connects the substrate holders 221 and 223 by magnetic force, electrostatic force, or the like. Further, if the substrates 211 and 213 are reliably joined in the joint portion 300, the laminated body 230 may be carried out from the joint portion 300 without using the clip 227.

Further, in the above example, the holding of the substrate 213 held on the upper stage in a flat state is released, and the substrate 211 held on the lower stage 332 in a state of being deformed and corrected by the deforming portions 601 and 602 is used. It was joined. However, there is no particular limitation as to which of the substrates 211 and 213 is deformed and corrected, and which of the substrates 211 and 213 are opened and joined. Further, both substrates 211 and 213 may be deformed, or the holding of both substrates 211 and 213 may be released in the process of joining.

FIG. 30 is a diagram schematically showing other misalignment components that can be corrected by using the deformation portions 601 and 602. As shown by the broken line R in the figure, the misalignment component in the illustrated laminated body 230 is an anisotropic misalignment component in which the region where the misalignment is distributed in the laminated body 230 forms a plurality of parallel rows.

The misalignment component as shown is due to the non-uniform distribution of the elongation amount in the bonding of the substrates 211 and 213. For example, the crystal orientation of the substrates 211 and 213 and the scribe lines formed on the substrates 211 and 213. It is caused by non-uniformity of physical properties due to the presence of 212 and the like. It is difficult to correct such a misalignment component by the displacement or rotation of the substrate 211 like the shift misalignment component and the rotation misalignment component described above. Such an anisotropic misalignment component can be reduced by a correction method in which at least one of the substrates 211 and 213 is joined in a deformed state by using the deformed portion 602 and the like.

FIG. 31 is a diagram schematically showing the deformation of the substrate 211 by the deformation portion 602, which is effective for correcting the anisotropic misalignment component. As shown in the figure, when correcting the misalignment component distributed in a specific direction in step S105 (FIG. 4), the actuators 412 arranged in a row are extended as shown by being surrounded by the broken line N in FIG. The suction portion 413 of the deforming portion 602 is deformed into a cylindrical shape.

Further, when the substrate 211 to be joined to the suction portion 413 deformed into a cylindrical shape is held, the center line of the cylinder formed by the suction portion 413 is a broken line indicating the distribution direction of the anisotropic misalignment component on the substrate 211. The substrates 211 and 213 are joined in a state where the substrate 211 is held by the suction portion 413 in a direction orthogonal to R. In FIG. 31, it can be seen that the notch of the substrate 211, which is deformed along the cylinder, is located at a position where it is lowered along the cylinder surface. By releasing the other substrate 213 from the holding and adsorbing it to the substrate 211 thus deformed, the anisotropic misalignment component in the laminated body 230 can be reduced.

When the deformation unit 602 is used, the deformation amount can be continuously changed according to the amount of the working fluid supplied to the actuator 412. However, when joining a large number of substrates 211 having the same correction method and deformation amount, a substrate holder 221 having a holding surface 225 having a curved surface reflecting the deformation amount may be manufactured and used as the deformation portion 601. ..

FIG. 32 is a diagram schematically showing other misalignment components that can be corrected by using the deformation portions 601 and 602. The misalignment component in the illustrated laminate 230 is an orthogonal misalignment component in which the direction of misalignment is reversed between one end and the other end in the plane direction of the laminate 230. When it is predicted that the orthogonal position component as described above remains in the laminated body 230, it is corrected by individually deforming one end and the other end of the suction surface provided on the lower stage 332 by using the deforming portion 602. can.

In the above example, the case where the deformed portion 601 is provided on the lower stage 332 has been described. However, the deformed portion 601 may be provided on the upper stage 322 to correct the upper substrate 213 in the drawing. Further, the deformation portion 601 may be provided on both the lower stage 332 and the upper stage 322, and the correction may be executed on both the substrates 211 and 213. Further, the above-mentioned correction method may be used in combination with the other correction method already described.

In the above example, the centers of the substrates 211 and 213 to be joined are first contacted, but if the substrates 211 and 213 can be prevented from contacting at multiple points at the same time to enclose the bubbles, the substrates 211 and 213 are contacted first. The contact of the substrates 211 and 213 may be started from other places such as the edge of the substrate. At this time, it is preferable that the crystal direction and the stress strain direction of the substrate from which the holding on the stage or the substrate holder is released are aligned with the traveling direction of the bonding wave. For example, in a silicon single crystal substrate, by aligning the 0 ° direction of the crystal orientation with the traveling direction of the bonding wave, the amount of elongation of the silicon single crystal substrate generated during the bonding wave becomes uniform. This makes it possible to reduce the difference in the amount of deformation in the silicon single crystal substrate due to the rigidity distribution.

Further, the surface direction shape of the boundary K that expands from the initial contact point as the joining progresses may be another shape such as a linear shape or an elliptical shape. Further, in the above example, although the explanation is given as if the existing boards 211 and 213 are corrected, non-uniformity does not occur in the mechanical specifications such as bending rigidity at the stage of designing and manufacturing the boards 211 and 213. You may consider it as such.

Further, in the above example, although the deformed portion 601 is incorporated in the lower stage 332 of the joint portion 300, the deformed portions 602 and 603 may be incorporated in the upper stage 322 to correct the substrate 213 in the upper stage 322. Further, the deformed portions 602 and 603 may be incorporated in both the upper stage 322 and the lower stage 332.

Further, the correction contents may be shared between the upper stage 322 and the lower stage 332, such as correction regarding the magnification in the upper stage 322 and correction of the deviation caused in the joining process in the lower stage 332. Further, regarding the magnification, the substrate 211 may be deformed and corrected as in the deformed portion 601 and the deviation caused in the joining process may be corrected by changing the correction method according to the correction contents such as the deformed portions 602 and 603. Further, in addition to the above example, another correction method such as changing the temperature of at least a part of the substrates 211 and 213 by temperature control to deform the substrate 211 by thermal expansion or contraction is further introduced. May be good.

Furthermore, in the above example, an example of correcting distortion mainly by mechanical operation is mainly described. However, for example, the substrates 211 and 213 may be corrected by temperature control by a heater embedded in the stage or the substrate holder, a Pelche effect element, or the like.

Further, the other correction method already described or the other correction method described below may be used in combination with the above correction method. Further, by incorporating the deformed portions 602 and 603 into the joint portion 300 and using the deformed portions 602, for example, the deformed portion 601 corrects the deviation due to the first distortion, and the deformed portion 602 corrects the deviation due to the second distortion. can.

FIG. 33 is a schematic cross-sectional view of another deformed portion 603 that can be used in the joint portion 300. The deformable portion 603 has a switch 434, an electrostatic chuck 436, and a voltage source 432, and can be incorporated into the substrate holders 221 and 223 used in the deformable joint portion 300.

In the deformed portion 603, the electrostatic chuck 436 is embedded in the substrate holders 221 and 223. Each of the electrostatic chucks 436 is coupled to a common voltage source 432 via a separate switch 434. As a result, each of the electrostatic chucks 436 generates an adsorption force on the surface of the substrate holders 221 and 223 when the switch 434 that opens and closes individually under the control of the determination unit 151 is closed, so that the substrates 211 and 213 are pressed. Adsorb.

Further, in the substrate holders 221 and 223, the electrostatic chucks 436 are arranged concentrically and radially on the entire holding surface for holding the substrate 213, similarly to the actuator 412 of the deformed portion 602 shown in FIG. As a result, the substrate holders 221 and 223 can individually interrupt the suction force in each region. When all the switches 434 are closed, all the electrostatic chucks 436 generate an attractive force, and the entire boards 211 and 213 are sucked and fixed to the board holders 221 and 223.

FIG. 34 is a diagram illustrating a correction operation of the deformed portion 603. In FIG. 34, a part of the substrates 211 and 213 in the process of joining is shown from the same viewpoint as in FIG.

In the joining process, the substrate 213 bonded to the substrate 211 is separated from the region already bonded to the substrate 211 and is to be bonded from now on, as described above with reference to FIGS. 22 to 24. At the boundary K with the region, the lower surface in the figure joined to the substrate 211 is deformed to extend. On the other hand, in the substrate holder 221 provided with the deformed portion 603, the voltage application to the electrostatic chuck 436 is locally cut off in the vicinity of the boundary K.

As a result, the holding of the substrate 211 is also partially released near the boundary K. A part of the substrate 211 released from the holding by the substrate holder 221 is peeled off from the substrate holder 221 by the suction force of the upper substrate 213, and the joint surface side is deformed to be extended like the substrate 213. As a result, the magnification deviation component generated in the joining process can be suppressed.

When the holding of the substrate 211 is partially released, the amount of deformation generated in the joining process can be changed by changing the holding force instead of completely eliminating the suction force. .. By adjusting the holding force of the board 211 by the board holder 221 in this way, the amount of deformation generated in the board 211 due to the release from the holding can be adjusted, and the accuracy of the misalignment correction can be improved.

By operating the deforming portion 603 in this way, it is possible to promote or suppress the elongation deformation of the substrates 211 and 213. Further, the electrostatic chucks 436 arranged on the entire substrate holders 221 and 223 can individually generate or cut off the suction force. Therefore, even when the non-uniformity of the elongation amount on the substrates 211 and 213 is complicatedly distributed, it can be corrected by the deformed portion 603.

In the above example, the substrate 211 held by the lower stage 332 is released from the holding of the substrate 213 by the upper stage 322 at once, so that the substrates 211 and 213 are joined by autonomous bonding of the substrate 213. However, by sequentially erasing the suction force of the electrostatic chuck 436 from the center of the substrate toward the outside in the plane direction of the upper stage 322, the autonomous bonding of the substrate 213 is suppressed, and the substrates 211 and 213 The extent of the joined region, that is, the degree of contact progress, may be controlled. As a result, the positional deviation is accumulated as it approaches the outer periphery, and it is possible to prevent the distribution of the positional deviation from becoming uneven.

Further, when the substrates 211 and 213 are joined by continuing to hold the substrate 213 by the upper stage 322 and releasing the holding of the substrate 211 by the lower stage 332, the deformed portion 603 is used in the same manner as described above. , The amount of elongation of the substrates 211 and 213 can be corrected.

In this way, the position of the circuit region 216 caused by the non-uniformity of the elongation amount on the boards 211 and 213 can be corrected both individually for the boards 211 and 213 and at the stage of joining the boards 211 and 213. The deviation can be suppressed or prevented. As a result, the laminated body 230 can be manufactured with a high yield.

Furthermore, the deformed portion 603 can also be used in combination with the deformed portions 601 and 602. Further, the deformed portion 603 can also be used as an electrostatic chuck used when the substrate holder 221 attracts the substrate 211.

FIG. 35 is a schematic cross-sectional view of another deformed portion 604 that can be used at the joint portion 300. The deformed portion 604 can be incorporated into the substrate holder 223 used in the upper stage 322 of the joint portion 300.

The deformed portion 604 has, for example, a plurality of openings 426 provided in the substrate holder 223 and opened toward the substrate 213 held in the substrate holder 223. Each end of the opening 426 communicates with the pressure source 422 through the valve 424 through the upper stage 322. The pressure source 422 is a pressurized fluid such as compressed dry air. The valve 424 opens and closes the valve 424 individually according to the amount of action instructed by the determination unit 151. When the valve 424 opens, a pressurized fluid is ejected through the corresponding opening 426.

FIG. 36 is a diagram showing the layout of the opening 426 in the deformed portion 604. The openings 426 are arranged radially and concentrically over the entire holding surface that holds the substrate 213 in the substrate holder 223. Therefore, the deformed portion 604 injects the pressurized fluid toward the substrate 213 at an arbitrary position on the holding surface of the substrate holder 223 by opening any of the valves 424.

The substrate holder 223 holds the substrate 213 by, for example, an electrostatic chuck. The electrostatic chuck can eliminate the adsorption force by shutting off the supply voltage, but a time lag occurs before the held substrate 213 is released due to residual charge or the like. Immediately after the power supply to the electrostatic chuck is cut off, the deforming portion 604 can inject a pressurized fluid from the opening 426 of the entire substrate holder 223 to immediately release the substrate 213 from the substrate holder 223.

FIG. 37 is a schematic view showing the correction operation of the deformed portion 604. In the figure, a part of the substrates 211 and 213 in the process of joining is shown from the same viewpoint as in FIG.

In the joining process at the joining portion 300, the substrate 213 bonded to the substrate 211 is separated from the region bonded to the substrate 211 and the substrate 211 as already described with reference to FIGS. 13 to 15. At the boundary K with the region to be joined, the lower surface in the figure to be joined to the substrate 211 is deformed to extend. Here, when the pressurized fluid 427 is injected from above in the figure by the deforming portion 604 into the region near the boundary K where the deformation occurs in the substrate 213, the substrate 213 is pushed toward the other substrate 211 and the amount of deformation is reduced. Decreases. As a result, it is possible to make a correction to make the elongation amount of the substrate 213 smaller at the portion where the pressurized fluid is sprayed.

As described above, since the deformation portion 604 operates, the elongation deformation in the substrate 213 can be suppressed, so that the positional deviation of the circuit region 216 due to the non-uniformity of the elongation amount can be corrected between the substrates 211 and 213. In the deformed portion 604, the opening portion 426 can individually inject a pressurized fluid. Therefore, even if the distribution of the elongation amount of the substrate 213 to be corrected is non-uniform, it can be corrected by deforming the substrate 213 with a different deformation amount for each region.

Therefore, in the joint portion 300 provided with the deformed portion 604, the non-uniformity of the rigidity is investigated in advance based on the information such as the crystal orientation of the substrate 213, the arrangement of the structures, and the distribution of the thickness. It is possible to correct the elongation amount of the substrate 213 by spraying the pressurized fluid from the opening 426 to the region where the bending rigidity is low and the region where the bending rigidity is high, whichever has the larger deviation amount. As a result, the positional deviation of the circuit region 216 in the laminated body 230 produced by joining the substrates 211 and 213 can be suppressed.

For example, when the deviation amount is larger in the region where the bending rigidity of the substrate 213 is high, when the convex amount or curvature of the deformed portion 604 is determined to correct the deviation amount in the region where the bending rigidity of the substrate 213 is low. By spraying a pressurized fluid on the high-rigidity region, the amount of displacement in the high-rigidity region can also be reduced.

In the above example, the case where the deformed portion 604 is provided on the upper stage 322 has been described. However, in the joint portion 300 having a structure in which the substrate 211 held in the lower stage 332 is deformed, the deformed portion 604 may be provided in the lower stage 332 to correct the elongation amount of the substrate 211 on the lower side in the drawing. Further, the deformation portion 602 may be provided on both the lower stage 332 and the upper stage 322, and the correction may be executed on both the boards 211 and 213.

As described above, the substrates 211 and 213 can be deformed by various methods, but the method of deforming the substrates 211 and 213 is not limited to the above method. For example, by changing the degree of activation of the substrates 211 and 213 to be bonded, the adsorption force between the substrates 211 and 213 can be changed to change the amount of deformation of the substrates 211 and 213 in the bonding process. .. Further, even if the degree of activation by the activating devices 326 and 336 is constant, the adsorptive force due to activation can be changed by changing the time interval between activation and joining.

Further, in the above example, although the example in which the laminate forming device 100 includes the determination unit 151 is shown, the determination unit 151 may be provided in an device other than the laminate forming device 100. In this case, the laminate forming device 100 acquires a signal indicating the amount of deformation determined by the determination unit 151 arranged externally from the external device through the acquisition unit 152, and the control unit 150 acquires the signal based on the acquired signal. The deformed portions 601 to 604 may be controlled.

Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various changes or improvements can be made to the above embodiments. It is clear from the claims that the form with such modifications or improvements may also be included in the technical scope of the invention.

The order of execution of each process such as operation, procedure, step, and step in the apparatus, system, program, and method shown in the claims, specification, and drawings is particularly "before" and "prior to". It should be noted that it can be realized in any order unless the output of the previous process is used in the subsequent process. Even if the scope of claims, the specification, and the operation flow in the drawings are explained using "first", "next", etc. for convenience, it means that it is essential to carry out in this order. It's not a thing.

100 Laminate Forming Device, 110 Housing, 120, 130 Board Cassette, 140 Transport Unit, 150 Control Unit, 151 Determination Unit, 152 Acquisition Unit, 211, 213 Board, 212 Scribly Line, 214 Notch, 216 Circuit Area, 218 Mark , 221 223 board holder, 225 holding surface, 227 clip, 426 opening, 230 laminate, 300 joint, 301 floor, 310 frame, 312 bottom plate, 314 columns, 316 top plate, 322 upper stage, 324, 334 Microscope, 326, 336 Activator, 331 X-direction drive unit, 332 lower stage, 333 Y-direction drive unit, 338 Z-direction drive unit, 400 holder stocker, 411 base, 412, 720 actuator, 413 suction unit, 414 columns 415 pumps, 416, 424 valves, 422 pressure sources, 427 pressurized fluids, 432 voltage sources, 434 switches, 436 electrostatic chucks, 500 pre-liners, 601 and 602, 603, 604 deformed parts, 701 push parts, 710 pushes. Moving member, 711 stem, 712 pressing part

Claims (19)

A laminate forming device that joins two substrates to form a laminate.
The deformed part that deforms the board and
A joint portion that joins a substrate deformed by the deformed portion to another substrate,
Equipped with
The deformed portion is a second modified amount in which the first deformation amount is modified by a correction amount whose absolute value is smaller than the absolute value of the misalignment amount when another substrate is joined to the substrate deformed by the first deformation amount. A laminate forming device that deforms at least one of the two substrates to be joined using the amount of deformation. A laminate forming device that joins two substrates to form a laminate.
The deformed part that deforms the board and
A joint portion that joins a substrate deformed by the deformed portion to another substrate,
Equipped with
The deformed portion includes the amount of deformation that occurs in the other substrate by following the shape of the deformed substrate when another substrate is joined to the substrate that has been deformed by the first deformation amount, and the first deformation amount. The absolute value of the difference from the amount of deformation that occurs in the other substrate by imitating the shape of the deformed substrate when another substrate is joined to the substrate deformed by the second deformation amount corrected in the above-mentioned first. Lamination that deforms at least one of the two substrates to be joined by using the second deformation amount, which is smaller than the absolute value of the amount of misalignment when another substrate is joined to the substrate deformed by the deformation amount of 1. Body forming device. The laminate forming apparatus according to claim 1 or 2, wherein the first deformation amount is a deformation amount when two substrates joined before the two boards to be joined are joined. The deformed portion is concerned with at least one of the deformation occurring before joining the two substrates to be joined and the deformation occurring on the other substrate in the process of joining the deformed one of the two substrates. The laminate formation according to any one of claims 1 to 3, wherein at least one of the two substrates is deformed by the second deformation amount determined by reflecting the individual difference of at least one of the two substrates. Device. Further, a first holding portion for holding one of the two substrates and a second holding portion for holding the other substrate facing the substrate held by the first holding portion are further provided.
One of claims 1 to 4, wherein the two substrates are joined by releasing the other substrate held by the second holding portion while the first holding portion holds the substrate. The laminate forming apparatus according to the above. The laminate forming apparatus according to claim 5, wherein the second holding portion opens a region other than the partial region while continuing to hold a partial region of the substrate. The laminate forming apparatus according to any one of claims 1 to 6, wherein the deformed portion deforms both of the two substrates to be joined. The laminate formation according to any one of claims 1 to 7, wherein the deformed portion displaces a part of the deformable substrate with respect to another part by an action amount corresponding to the second deformation amount. Device. The stacking according to any one of claims 1 to 8, wherein the second amount of deformation includes a component that offsets at least a part of the misalignment caused by the magnification strain generated in at least one of the two substrates to be joined. Body forming device. The second amount of deformation is any one of claims 1 to 9, which includes a component that causes the substrate to be deformed to offset at least a part of the positional deviation caused by the non-linear distortion in the plane direction in at least one of the two substrates. The laminate forming apparatus according to the section. The stacking according to any one of claims 1 to 10, wherein the second deformation amount includes a component that causes a deformation in the substrate that cancels at least a part of the misalignment that occurs in the process of joining the two substrates. Body forming device. The stacking according to any one of claims 1 to 11, wherein the second deformation amount includes a component that causes deformation in the substrate to cancel at least a part of the misalignment predicted based on the information about the two substrates. Body forming device. The deformed part is
A first deformed portion that causes a deformation in one of the two substrates to offset the misalignment caused by a change in magnification that occurs in at least one of the two substrates.
The invention according to any one of claims 1 to 12, which has a second deformation portion that causes a deformation that cancels at least a part of the misalignment that occurs in the process of joining the two substrates to the other of the two substrates. The laminate forming apparatus according to the above. The laminate forming apparatus according to claim 13, wherein the deformed portion changes the amount of deformation of the deformation generated in the joining process by changing the holding force with respect to the substrate. It is a method of forming a laminate by joining two substrates to form a laminate.
The deformation stage that deforms the board and
A joining step of joining a substrate deformed in the deformation step with another substrate,
Including
In the deformation step, the first deformation amount is corrected by a correction amount whose absolute value is smaller than the absolute value of the misalignment amount when another substrate is joined to the substrate deformed by the first deformation amount. A method for forming a laminate that deforms at least one of two substrates to be joined by using the amount of deformation. It is a method of forming a laminate by joining two substrates to form a laminate.
The deformation stage that deforms the board and
A joining step of joining a substrate deformed in the deformation step with another substrate,
Including
In the deformation step, when another substrate is joined to the substrate deformed by the first deformation amount, the amount of deformation that occurs in the other substrate by following the shape of the deformed substrate and the first deformation amount. The absolute value of the difference from the amount of deformation that occurs in the other substrate by imitating the shape of the deformed substrate when another substrate is joined to the substrate deformed by the second deformation amount corrected by the above-mentioned first. Lamination that deforms at least one of the two substrates to be joined by using the second deformation amount, which is smaller than the absolute value of the misalignment amount when another substrate is joined to the substrate deformed by the deformation amount of 1. Body formation method. The laminate forming method according to claim 15 or 16, further comprising a determination step of determining the first deformation amount so that the amount of misalignment between the two substrates to be joined is smaller than a predetermined threshold value. A laminate forming device that joins two substrates to form a laminate.
A deformed part that deforms one of the two boards,
A joint portion for joining the one substrate and the other substrate,
Equipped with
A laminate forming apparatus in which the amount of deformation of the one substrate by the deformed portion is a amount of deformation determined according to the amount of deformation occurring on the other substrate by following the shape of the one substrate. It is a method of forming a laminate by joining two substrates to form a laminate.
The deformation step of deforming one of the two boards,
The joining step of joining one substrate and the other substrate,
Including
A method for forming a laminate, wherein the amount of deformation of the one substrate at the deformation step is a deformation amount determined according to the amount of deformation occurring on the other substrate by following the shape of the one substrate.

Images