JP2021158035A - Lead wire holding structure and electric driven actuator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead wire holding structure which enables easy and short time for soldering a lead wire to a substrate.
SOLUTION: In a lead wire holding structure, a lead wire holding member that covers at least a part of the lead wire and holds the lead wire so that the conductor of the lead wire is exposed, and the conductor of the lead wire are electronic. A fixing portion for fixing the lead wire holding member is provided so as to be arranged on the surface of a substrate on which the component is mounted.
[Selection diagram] Fig. 6

Description

The present invention relates to a lead wire holding structure and an electric actuator using the lead wire holding structure.

A structure for soldering a lead wire to a circuit board is disclosed in, for example, Patent Document 1. In Patent Document 1, a connection terminal is attached to a circuit board, and a lead wire is soldered to the connection terminal. The lead wire is soldered to the circuit board via the connection terminal.

Japanese Unexamined Patent Publication No. 4-162377

However, in the structure of Patent Document 1, in order to solder the lead wire to the connection terminal, a hand for holding the lead wire, a hand for holding the solder, and a hand for holding the soldering iron are required. In addition, since soldering is performed while pressing the lead wires one by one, the soldering work requires a long time.

In view of the above problems, it is an object of the present invention to provide a lead wire holding structure that enables easy and short time for soldering lead wires to a substrate.

The lead wire holding structure according to one aspect of the present invention includes a lead wire holding member that covers at least a part of the lead wire and holds the lead wire so that the conductor of the lead wire is exposed, and the lead wire holding member. A fixing portion for fixing the lead wire holding member is provided so that the conductor is arranged on the surface of the substrate on which the electronic component is mounted.
In the lead wire holding structure of the present invention, the lead wire holding member is fixed so that the conductor of the lead wire is arranged on the substrate. Therefore, the lead wire can be held and fixed to the substrate in a state where the conductor (core wire) of the lead wire is exposed. Since the lead wire holding structure of the present invention holds the lead wire and can fix the lead wire at the soldering position, it is not necessary to hold the lead wire during the soldering operation. Therefore, the hands required for the soldering work are a hand holding the solder and a hand holding the soldering iron. Therefore, the work of soldering the lead wire to the substrate can be easily performed.

The lead wire holding member may have an overhanging portion that covers a part of the substrate. The overhanging portion may have a facing surface facing a part of the substrate. The lead wire may be sandwiched between a part of the substrate covered with the overhanging portion and the facing surface of the overhanging portion.
According to this configuration, at least a part of the substrate is covered by the overhanging portion of the lead wire holding member, so that there is a portion where the lead wire holding member and the substrate overlap. Therefore, the lead wire is sandwiched between the lead wire holding member and the substrate, and the lead wire can be firmly held. By maintaining the state of holding the lead wire, the soldering work of the lead wire to the substrate becomes easy.

The lead wire holding member may have a lead wire passage portion. The lead wire passage portion may have a portion extending parallel to the surface of the substrate.
According to this configuration, since the lead wire passage portion extends substantially parallel to the surface of the substrate, the lead wire extends parallel to the substrate in the lead wire holding member. Therefore, the height (dimension in the height direction) of the lead wire holding structure can be reduced, and the lead wire holding structure can be miniaturized.

The lead wire may consist of the conductor and a covering portion that covers the conductor. The lead passage portion may have a first passage portion having a predetermined diameter and a second passage portion having a diameter smaller than that of the first passage portion. The diameter of the second passage portion may be smaller than the diameter of the covering portion of the lead wire. Only the conductor of the lead wire may pass through the second passage.
According to this configuration, when the lead wire passes through the lead wire holding member, the covering portion (coating portion) cannot pass through the second passage portion. Only the lead conductors reach the substrate through the second passage. Therefore, the lead wire can be positioned in the lead wire holding member. Since the coating portion of the lead wire is not exposed (exposed) on the substrate, the coating portion of the lead wire is not mistakenly melted at the time of soldering.

The diameter of the first passage portion may be slightly smaller than the diameter of the covering portion of the lead wire.
According to this configuration, the diameter of the covering portion of the lead wire is smaller than the diameter of the first passage portion, so that the lead wire is press-fitted in the first passage portion. Therefore, the holding force of the lead wire is improved.

The lead wire holding member may have a lead wire outlet surface located on the substrate when the lead wire holding member is fixed to the substrate. The lead wire outlet surface may have a recess.
According to this configuration, when soldering, the solder can flow into the recess on the lead wire outlet surface, so that the solder does not flow to other places, and the soldering can be preferably performed.

The lead wire holding member may include a first lead wire holding member and a second lead wire holding member that is overlapped and fixed on the first lead wire holding member. The second lead wire holding member may have a first plane. The first lead wire holding member may come into contact with the first plane to form at least a part of the first passage portion.
According to this configuration, the second lead wire holding member is overlapped and fixed on the first lead wire holding member, and at least a part of the first passage through which the lead wire passes is the first lead wire holding member and the second lead wire holding member. Is formed by. Seen from below, the order is first lead wire holding member-lead wire-second lead wire holding member. Since the lead wire can be held up and down by the two holding members, the lead wire can be held firmly.

The second lead wire holding member may have a stepped portion at a portion overlapped with the first lead wire holding member. The first plane may be formed on the step portion. The first lead wire holding member may have a contact surface in contact with the first plane. The first passage portion may have a portion smaller than the outer diameter of the lead wire at a position where the contact surface contacts the first plane.
According to this configuration, when the second lead wire holding member is superposed on the first lead wire holding member, the cross section of the first passage portion becomes smaller than the diameter of the lead wire due to the contact surface of the first lead wire holding member. Therefore, pressure can be applied to the lead wire from the outside, and the lead wire is press-fitted. Therefore, the lead wire can be firmly held.

The substrate may have an opposite surface on the opposite side of the surface. The contact surface may come into contact with the first plane on the surface side of the substrate rather than on the opposite surface of the substrate.
According to this configuration, even a lead wire having a small wire diameter can be held. In addition, the height dimension of the lead wire holding structure can be reduced.

The first lead wire holding member may have a first fitting portion. The second lead wire holding member may have a second fitting portion that fits into the first fitting portion.
According to this configuration, the first lead wire holding member and the second lead wire holding member are fixed to each other by fitting. The fitting is, for example, snap fit or press fit. By fitting, the second lead wire holding member can be firmly fixed to the first lead wire holding member.

The first lead wire holding member may have a first horizontal plane portion and a first vertical plane portion rising from the first horizontal plane portion in the vicinity of the first fitting portion. The second lead wire holding member has a second horizontal surface portion corresponding to the first horizontal surface portion and a second vertical surface portion corresponding to the first vertical surface portion in the vicinity of the second fitting portion. May be good. At least one of the first connecting portion in which the first horizontal plane portion is connected to the first vertical plane portion and the second connecting portion in which the second horizontal plane portion is connected to the second vertical plane portion is the first connecting portion and the said. Non-interfering portions may be formed to prevent the second connecting portions from interfering with each other.
According to this configuration, a notch (for example, a chamfered portion) is formed in one of the corner portion of the first lead wire holding member and the corner portion of the second lead wire holding member, so that the two corners are formed. The corners do not interfere. Since the two corners do not interfere with each other, it is not necessary to increase the gap between the first lead wire holding member and the second lead wire holding member in the width direction of the first lead wire holding member, and the first lead wire holding member is held. It is possible to tightly fit the member and the second lead wire holding member. According to such a configuration, the rattling in the width direction can be reduced, so that the holding property of the lead wire is further improved, and the lead wire does not shift to the left or right at the time of soldering, and the workability is good. In addition, since there is little rattling, it has excellent vibration resistance and reliable quality.

The first lead wire holding member may have the fixing portion.
According to this configuration, the second lead wire holding member is overlapped and fixed to the first lead wire holding member, and the first lead wire holding member is fixed to the case (board housing) via the fixing portion to lead the lead. Since the wire passes through the lead wire holding member, the substrate, the lead wire, and the lead wire holding member as a whole are firmly fixed.

The second lead wire holding member may be removable from the first lead wire holding member.
According to this configuration, since the second lead wire holding member is unnecessary after the soldering work is completed, it can be removed from the first lead wire holding member.

The first lead wire holding member may be removable from the substrate.
According to this configuration, after the soldering work is completed, the first lead wire holding member is unnecessary and can be removed from the substrate.

The lead wire holding member may hold a plurality of lead wires.
According to this configuration, since a plurality of lead wires are held by one lead wire holding member, the efficiency of the soldering work is improved as compared with the case where the lead wires are held one by one.

The substrate may be housed in a substrate housing. The fixing portion may be fastened together with the substrate and fixed to the substrate housing by a fastening member.
According to this configuration, the fixing portion and the substrate are fixed to the substrate housing by a common fastening member.

An electric actuator according to another aspect of the present invention is connected to a substrate on which an electronic component is mounted, a lead wire holding structure described above, a lead wire soldered to the substrate using the lead wire holding structure, and the substrate. It is provided with an actuator unit that receives at least one of a signal and a power supply from the substrate.

According to the lead wire holding structure of the present invention, the lead wire soldering work to the substrate can be easily performed in a short time.

FIG. 1 is a schematic view showing a state in which an electric oil pump according to an embodiment of the present invention is attached to a transmission. FIG. 2 is a perspective view showing the appearance of the electric oil pump and the lead wire. FIG. 3 is a perspective view showing a state in which the pump mounting portion is removed from the state of FIG. FIG. 4 is a perspective view of the electric oil pump as viewed from the X-axis direction. FIG. 5 is a perspective view of the electric oil pump as viewed from the direction in which the lead wire outlet can be seen. FIG. 6 is a perspective view showing a state in which the lid portion is removed from the state of FIG. FIG. 7 is a perspective view showing a state in which the second housing is removed from the state of FIG. FIG. 8 is a perspective view showing a lead wire extending from the substrate and a lead wire holding member for fixing the lead wire to the substrate. FIG. 9 is a perspective view of the substrate, the lead wire, and the lead wire holding member in the state of FIG. 7 as viewed from below. FIG. 10 is a view seen from the X-axis direction with the second lead wire holding member removed from the state of FIG. FIG. 11 is a diagram showing the structure of the lead wire. FIG. 12 is a perspective view of the substrate and the lead wire holding member as viewed from below with the lead wires removed from the state of FIG. FIG. 13 is a perspective view of the first lead wire holding member. FIG. 14 is a perspective view of the substrate and the second lead wire holding member as viewed from below with the first lead wire holding member removed from the state of FIG. FIG. 15 is a perspective view of the second lead wire holding member as viewed from the X-axis direction. FIG. 16 is a view of the second lead wire holding member as viewed from the X-axis direction. FIG. 17 is a view of the second lead wire holding member as viewed from the Za direction. FIG. 18 is a diagram showing a state in which the second lead wire holding member of FIG. 17 is superposed on the first lead wire holding member. FIG. 19 is an enlarged view of the XIX portion of FIG. FIG. 20 is a perspective view of the substrate and the lead wire in the state of FIG. 8 as viewed from different angles. FIG. 21 is a perspective view of the lead wire outlet as viewed from the Z-axis direction. FIG. 22 is a diagram showing a state in which the lid member is removed from the lead wire outlet in the state of FIG. FIG. 23 is a perspective cross-sectional view taken along the line XXIII-XXIII of FIG. FIG. 24 is a perspective view of the seal member.

Hereinafter, the electric oil pump according to the embodiment of the present invention will be described with reference to the drawings. The scope of the present invention is not limited to the following embodiments, and can be arbitrarily changed within the scope of the technical idea of the present invention. Further, in the following drawings, the scale and the number of each structure may be different from the scale and the number of the actual structure in order to make each configuration easy to understand. As used herein, the term "parallel" includes not only perfectly parallel but also slightly slanted cases. The electric oil pump is an example of an electric actuator.

In the drawings, the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate. In the XYZ coordinate system, the Z-axis direction is the vertical direction. In FIGS. 1 and 2, the electric oil pump 100 is installed horizontally. The X-axis direction is a direction orthogonal to the Z-axis direction, and is a height direction (longitudinal direction) of the electric oil pump. The Y-axis direction is a direction orthogonal to both the X-axis direction and the Z-axis direction.

In the following description, the height direction (X-axis direction) of the electric oil pump is defined as the pump vertical direction. The positive side (+ X side) in the X-axis direction with respect to a certain object may be called "upper side", and the negative side (-X side) in the X-axis direction with respect to a certain object is called "lower side". In some cases (eg, the top and bottom of the substrate). The expressions such as the front-back direction, the front side, the rear side, the right side, and the left side are expressions used only for explanation and do not limit the actual positional relationship and direction.

FIG. 1 is a schematic view showing a state in which the electric oil pump 100 of the present embodiment is attached to the lower part of the transmission 200. The electric oil pump 100 is provided in an oil pan 300 that is long in the Z-axis direction. Oil 400 is stored in the oil pan 300. Reference numeral 400a is the oil level of the oil 400. The plurality of lead wires 1 extend from the electric oil pump 100 along the transmission 200 in the Z-axis direction. The plurality of lead wires 1 extend in the lead wire guide pipe 500. The upper end of the lead wire 1 is located above the oil level 400a. A connector 600 is provided at the upper end of the lead wire 1. The connector 600 is connected to a control device (not shown) that controls the transmission 200. In FIG. 1, the Z-axis direction is the direction in which the lead wire 1 extends.

FIG. 2 is a perspective view showing the appearance of the electric oil pump 100 and the lead wire 1 of the present embodiment. The electric oil pump 100 has a substantially cylindrical shape. The direction of the central axis (central axis) 51 of the electric oil pump 100 is the longitudinal direction (X-axis direction) of the electric oil pump 100. When viewed in the X-axis direction, the electric oil pump 100 has a first housing 56 in the center and a second housing 57 on the left side of the first housing 56. Further, the electric oil pump 100 has a pump housing 58 on the right side of the first housing 56. A motor (not shown) is provided in the first housing 56. Since the first housing 56 is a housing for accommodating the motor, it may be referred to as a motor housing. Since the second housing 57 is a housing for accommodating the substrate 4 (FIG. 6), it may be referred to as a substrate housing.
The electric oil pump 100 has a pump mounting portion 59 next to the pump housing 58. The electric oil pump 100 is attached to the transmission 200 via the pump attachment portion 59.

FIG. 3 shows a state in which the pump mounting portion 59 is removed from the state of FIG. As shown in FIG. 3, the pump housing 58 has a substantially square cross section perpendicular to the pump central axis 51 (X-axis direction). In the pump housing 58, a rotor 54a that rotates together with the shaft 52 and a stator 54b that surrounds the rotor 54a are provided. Oil can be pumped by the rotor 54a rotating eccentrically with respect to the stator 54b. The shaft 52 is rotated by a motor in the first housing 56. In the present embodiment, the rotor 54a, the stator 54b, and the pump housing 58 are collectively referred to as a pump unit 54. Further, the first housing 56, which is a motor housing, and the motor provided in the first housing 56 are collectively referred to as a motor unit 53.

FIG. 4 is a perspective view of the electric oil pump 100 as viewed in the −X axis direction. The second housing 57 has an inverted P-shaped lid portion 81 and a second housing main body 82 whose upper portion is closed by the lid portion 81. The second housing 57 has a lead wire outlet 70. The lead wire 1 extends from the lead wire outlet 70 in the Z-axis direction. The second housing body 75 has a substantially annular annular portion 63 and a lead wire lead-out portion 66 extending from the annular portion 63 in the Z-axis direction.
FIG. 5 is a perspective view of the electric oil pump 100 as viewed from the direction in which the lead wire outlet 70 can be seen. The lead wire 1 extends from the lead wire outlet 70 to the outside of the electric oil pump 100. The lead wire 1 includes a lead wire 1a having a small diameter and a lead wire 1b having a large diameter.

FIG. 6 shows a state in which the lid portion 81 of the second housing 57 is removed from the state of FIG. As shown in FIG. 6, the substrate 4 is provided in the second housing 57 (that is, in the second housing main body 82). The substrate 4 is fixed to the second housing body 82 by two bolts 33.
The second housing body 82 has a substantially annular side surface 60 extending in a direction parallel to the X axis and an extension side surface 64 extending linearly from the side surface 60 in the tangential direction (in a direction parallel to the Z axis). doing. The substantially annular side surface 60 forms the annular portion 63 (FIG. 4) of the second housing body 82. The substrate 4 is arranged in the annular portion 63 of the second housing main body 82. A lead wire 1a extends from the substrate 4 toward the lead wire outlet 70. The second housing main body 82 has a lead wire lead-out portion 66 that extends the lead wire 1 from the substrate 4 to the outside of the second housing 57 along the extension side surface 64. The extension side surface 64 is a part of the lead wire lead-out portion 66.

The second housing body 82 has a bottom portion 61 having substantially the same shape as the second housing lid portion 81. The second housing main body 82 has a predetermined height (depth) in the X-axis direction by the bottom portion 61 and the side surface 60, and houses the substrate 4. In the present embodiment, the substrate accommodating portion 62 is formed by the bottom portion 61 and the side surface 60. The lead wire lead-out portion 66 extends from the substrate accommodating portion 62 in the Z-axis direction.
The lead wire 1a is pulled out of the second housing 57 along the extension side surface 64. That is, the lead wire 1 does not extend radially outward (direction parallel to the Z axis) from the shaft central axis 51 of the electric oil pump 100, but is offset from the radial direction and parallel to the radial direction (in FIG. 6). Extends to (offset to the right). Therefore, even if there is an obstacle in the direction from the shaft central axis 51 to the outside in the radial direction (direction parallel to the Z axis) in the vicinity of the outside of the second housing 57, the lead wire 1a does not bypass the obstacle. You may. Therefore, the space at the installation location of the electric oil pump 100 can be effectively used.

FIG. 7 shows a state in which the second housing 57 is removed from the state of FIG. That is, FIG. 7 shows the first housing 56 (motor housing), the substrate 4 located above the first housing 56, the lead wire holding member 3, the lead wire 1a extending from the substrate 4, and the side of the substrate 4. The lead wire 1b through which the lead wire passes and the lead wire outlet holding portion 74 holding the lead wire 1 (1a, 1b) at the lead wire outlet 70 are shown. The lead wire outlet holding portion 74 includes a seal member 76 and a lid member 78. The lead wire 1 is attached to the substrate 4 by the lead wire holding member 3. The upper surface 55 of the first housing 56 is a surface perpendicular to the X-axis direction.

FIG. 8 shows a substrate 4, a lead wire 1a extending from the substrate 4, and a lead wire holding member 3 for fixing the lead wire 1a to the substrate 4. FIG. 9 is a perspective view of the substrate 4 and the lead wire 1 in the state of FIG. 7 as viewed from below. The lead wire holding member 3 has a first lead wire holding member 15 and a second lead wire holding member 16 that is superposed on the first lead wire holding member 15. FIG. 10 is a view seen from the X-axis direction with the second lead wire holding member 16 of the lead wire holding member 3 removed (while leaving the first lead wire holding member 15) from the state of FIG. As can be seen from FIG. 10, the substrate 4 and the first lead wire holding member 15 are fixed to the second housing 57 by bolts 33. By loosening the bolt 33, the first lead wire holding member 15 can be removed from the second housing 57. The substrate 4 has a side 4c on the side closer to the extension side surface 64. The substrate 4 and the first lead wire holding member 15 are fastened together by bolts 33 close to the sides 4c. The direction perpendicular to the side 4c is referred to as the Za direction in the present specification.

The side 4c is a portion of the substrate 4 that is closest to the lead wire lead-out portion 66. Since the lead wire 1a extends from the side of the substrate 4 closest to the lead wire lead-out portion 66 to the lead wire lead-out portion 66, the substrate accommodating portion 62 does not require a volume for routing the lead wire 1a. Therefore, the entire second housing 57 can be miniaturized.
FIG. 11 is a diagram showing the structure of the lead wire 1a. As shown in FIG. 11, the lead wire 1a includes a core wire 2 and a covering portion 10 that covers the core wire 2. The lead wire 1a has a diameter D2. The core wire 2 of the lead wire 1a is a conductor of the lead wire 1a. FIG. 12 is a perspective view of the substrate 4 and the lead wire holding member 3 as viewed from below with the lead wire 1a removed from the state of FIG. FIG. 13 is a perspective view of the first lead wire holding member 15. FIG. 14 is a perspective view of the substrate 4 and the second lead wire holding member 16 as viewed from below with the first lead wire holding member 15 removed from the state of FIG.

In FIG. 8, the direction in which the core wire 2 of the lead wire 1a extends from the lead wire holding member 3 toward the substrate 4 side is referred to as a −Za direction, and the opposite direction is referred to as a + Za direction. As shown in FIG. 8, the core wire 2 of the lead wire 1a extends from the lead wire holding member 3 in the −Za direction to the upper surface 4b of the substrate 4. That is, the lead wire holding member 3 covers a part of the lead wire 1a and holds the lead wire 1a so that the core wire (conductor) 2 of the lead wire 1a is exposed. The lead wire holding member 3 is provided along the side 4c of the substrate 4 (in FIG. 8, the side 4c is covered with the lead wire holding member 3). The direction along the side 4c is referred to as the longitudinal direction of the lead wire holding member 3.

In the present embodiment, the lead wire holding member 3 includes a first lead wire holding member 15 and a second lead wire holding member 16. The end portion 28 of the first lead wire holding member 15 in the longitudinal direction is erected in the X-axis direction, and the end portion 28 is formed with a rectangular hole 22. The second lead wire holding member 16 is superposed on the first lead wire holding member 15 from above and fixed to the first lead wire holding member 15. More specifically, when the second lead wire holding member 16 is superposed on the first lead wire holding member 15 from above, the claws 24 of both end portions 16a of the second lead wire holding member 16 become the first lead wire holding member 15. By fitting into the rectangular hole 22, the second lead wire holding member 16 is fixed to the first lead wire holding member 15. The second lead wire holding member 16 is provided so as to cover one side 4c of the substrate 4. It can be said that the rectangular hole 22 and the claw portion 24 are fitting portions, respectively. The fitting of the rectangular hole 22 and the claw portion 24 is a snap fit in this embodiment. Since the fitting of the rectangular hole 22 and the claw portion 24 is a snap fit, the second lead wire holding member 16 can be removed from the first lead wire holding member 15.

As shown in FIG. 12, the first lead wire holding member 15 is provided so as to cover the side 4c of the substrate 4 from below. The first lead wire holding member 15 has two fixing portions 5 extending in the −Za direction along the lower surface 4a of the substrate 4, and is fixed to the substrate 4 by the fixing portions 5. A plurality of electronic components 25 (for example, a hall sensor 25a, a resistor 25b, etc.) are mounted on the lower surface 4a of the substrate 4.

As shown in FIG. 13, the first lead wire holding member 15 has a base portion 21 extending in the longitudinal direction of the first lead wire holding member 15 and coming into contact with the lower surface 4a of the substrate 4. Further, at both ends of the base portion 21, horizontal plane portions 26 extending in a direction perpendicular to the longitudinal direction of the base portion 21 are formed. The horizontal surface portion 26 is located in the vicinity of the rectangular hole 22. A fixing portion 5 having a hole 5a is formed at an end portion of the horizontal surface portion 26 in the −Za direction. On the outer side of the horizontal surface portion 26, an end portion 28 that stands up from the end portion 28 is formed. The end portion 28 is a vertical surface portion of the first lead wire holding member 15. The hole 5a of the fixing portion 5 is a hole through which the fastening member (bolt 33) for fixing the first lead wire holding member 15 to the substrate 4 passes. The first lead wire holding member 15 has an inclined portion 23 extending obliquely upward in the + Za direction from the base portion 21. Two openings 23a are formed in the inclined portion 23. Since the first lead wire holding member 15 has an opening 23a, it has elasticity as compared with the case where there is no opening 23a. A flat surface portion 19 is provided at the upper end of the inclined portion 23.

As shown in FIG. The lower surface 4a of the substrate 4 and the lower surface 20 of the second lead wire holding member 16 are located on the same plane. The second lead wire holding member 16 has an overhanging portion 6 that covers a part of the substrate 4. The side 4c of the substrate 4 and its vicinity are covered with the overhanging portion 6. The second lead wire holding member 16 has a recessed portion 18 recessed upward (in the X-axis direction) from the lower surface 20. When the second lead wire holding member 16 is superposed on the first lead wire holding member 15, the recessed portion 18 comes into contact with the flat surface portion 19 of the first lead wire holding member 15. Since at least a part of the substrate 4 is covered by the overhanging portion 6 of the second lead wire holding member 16, there is a portion where the lead wire holding member 3 and the substrate 4 overlap. Therefore, the lead wire 1a is sandwiched between the lead wire holding member 3 and the substrate 4, and the lead wire 1a can be firmly held. By maintaining the state in which the lead wire 1a is held, the work of soldering the lead wire 1a to the substrate 4 becomes easy.

FIG. 15 is a perspective view of the second lead wire holding member 16 as viewed from the −X axis direction to the + X axis direction. FIG. 16 is a view seen from the same direction as FIG. 15, but is not a perspective view but a view seen in the X-axis direction. The surface of the second lead wire holding member 16 shown in FIG. 16 is referred to as the lower surface of the second lead wire holding member 16. FIG. 17 is a view of the second lead wire holding member 16 as viewed from the + Za direction to the −Za direction. As shown in FIGS. 15 and 16, the second lead wire holding member 16 has a linear main body portion 41 extending along the side 4c of the substrate 4 and end portions 42 formed at both ends of the main body portion 41. Have. The overhanging portion 6 is formed by the main body portion 41 and the end portion 42. A claw portion 24 is formed on the outer surface 42a of the end portion 42. The claw portion 24 projects outward from the outer surface 42a. The second lead wire holding member 16 is formed with a lead wire passage portion 8 extending in a direction perpendicular to the longitudinal direction of the main body portion 41. In this embodiment, five lead wire passage portions 8 are formed. Each lead wire passage portion 8 has a first passage portion 11 and a second passage portion 12. The first passage portion 11 has a portion 9 parallel to the upper surface 4b of the substrate 4. Since the first passage portion 11 extends substantially parallel to the upper surface (surface) 4b of the substrate 4, the lead wire 1a extends parallel to the substrate 4 in the lead wire holding member 3. Therefore, the height (dimension in the X-axis direction) of the lead wire holding structure 3 can be reduced, and the lead wire holding structure 3 can be miniaturized.

As shown in FIG. 17, the first passage portion 11 has a diameter D1. In this embodiment, the diameter D1 is slightly smaller than the diameter D2 of the lead wire 1a. That is, the lead wire 1a can pass through the first passage portion 11, but is in a tightly fitted state in the first passage portion 11. The diameter of the second passage portion 12 is substantially equal to the diameter of the core wire 2 of the lead wire 1a. The covering portion 10 of the lead wire 1a cannot pass through the second passage portion 12. The core wire 2 of the lead wire 1a passes through the second passage portion 12 and is exposed on the upper surface 4b of the substrate 4 as shown in FIG. On the upper surface 4b of the substrate 4, the region where the core wire 2 is exposed may be referred to as a substrate land 4d. In FIG. 16, the length of the first passage portion 11 is indicated by L1, and the length of the second passage portion 12 is indicated by reference numeral L2.
When the lead wire 1a passes through the lead wire holding member 3, the covering portion (coating portion) 10 of the lead wire 1a cannot pass through the second passage portion 12. Only the conductor 2 of the lead wire 1a reaches the substrate 4 through the second passage portion 12. Therefore, the lead wire 1a can be positioned in the lead wire holding member 3. Since the coating portion 10 of the lead wire 1a is not exposed (exposed) on the substrate 4, the coating portion 10 of the lead wire 1a is not mistakenly melted at the time of soldering.

As shown in FIG. 15, the second lead wire holding member 16 has an facing surface 7 that faces (contacts) the upper surface 4b of the substrate 4 above the lower surface 20. The lead wire 1a is sandwiched between the upper surface 4b of the substrate 4 and the facing surface 7 of the second lead wire holding member 16. On the upper side of the facing surface 7, the second lead wire holding member 16 has a lead wire outlet surface 13 as a surface on which the lead wire 1a is exposed. The lower half of the lead wire outlet surface 13 is a recess 14 recessed in the Za direction. The recess 14 is depicted as an inclined surface in FIG. When soldering, the solder can flow into the recess 14 of the lead wire outlet surface 13, so that the solder does not flow to other places, and the soldering can be preferably performed.

FIG. 18 shows a state in which the second lead wire holding member 16 is coupled to the first lead wire holding member 15 of FIG. In the state of FIG. 18, the surface 19 of the first lead wire holding member 15 comes into contact with the surface 17 (FIG. 14) of the second lead wire holding member 16. As a result, a part of D2 of the diameter of the first passage portion 11 is reduced by the surface 19 of the first lead wire holding member 15, and the opening dimension of the first passage portion 11 becomes D3 (D3 <D2). That is, the lead wire 1a passing through the first passage portion 11 is sandwiched between the first lead wire holding member 15 and the second lead wire holding member 16. Therefore, the lead wire 1a can be firmly held. According to this configuration, even a lead wire having a small wire diameter can be held. In addition, the height dimension of the lead wire holding structure can be reduced.

FIG. 19 is an enlarged view of the XIX portion of FIG. As shown in FIG. 19, the second lead wire holding member 16 has a horizontal plane portion 30 corresponding to the horizontal plane portion 26 of the first lead wire holding member 15 and a vertical portion 28 corresponding to the vertical plane portion 28 of the first lead wire holding member 15. It has a surface portion 32. The horizontal surface portion 30 is located in the vicinity of the claw portion 24. In the present embodiment, the first connecting portion 27 in which the horizontal surface portion 26 of the first lead wire holding member 15 is connected to the vertical surface portion 28 and the second connecting portion in which the horizontal surface portion 30 of the second lead wire holding member 16 is connected to the vertical surface portion 32. The second connecting portion 31 has a notched portion 40 in order to avoid interference with the 31. The cutout portion 40 is a non-interfering portion for preventing the first connecting portion 27 and the second connecting portion 31 from interfering with each other. The cutout portion 40 is, for example, a chamfered portion. The non-interfering portion may be provided in the first connecting portion 27. Alternatively, the non-interfering portion may be provided on both the first connecting portion 27 and the second connecting portion 31. The first connecting portion 27 and the second connecting portion 31 may be referred to as corner portions.

Since a notch 40 is formed in one of the corner portion 27 of the first lead wire holding member 15 and the corner portion 31 of the second lead wire holding member 16, the two corner portions 27 and 31 are formed. It does not interfere. Since the two corners 27 and 31 do not interfere with each other, it is not necessary to increase the gap between the first lead wire holding member 15 and the second lead wire holding member 16 in the longitudinal direction of the first lead wire holding member 15. The first lead wire holding member 15 and the second lead wire holding member 16 can be tightly fitted. According to this configuration, the rattling of the first lead wire holding member 15 in the longitudinal direction can be reduced, so that the holding property of the lead wire 1a is further improved, and the lead wire 1a becomes the first lead wire holding member 15 at the time of soldering. There is no deviation in the longitudinal direction, and workability (for example, workability when soldering is performed while the lead wire 1a is held by the lead wire holding member 3) is good. In addition, since there is little rattling, it has excellent vibration resistance during soldering work, and the reliability of soldering quality is high.

FIG. 20 is a perspective view of the state of FIG. 8 as viewed from another angle. The work of soldering the lead wire 1a to the upper surface 4b of the substrate 1 will be described with reference to FIG.
As shown in FIG. 20, the core wire (conductor) 2 of the lead wire 1a is held by the lead wire holding member 3 so as to be exposed on the upper surface 4b of the substrate 4. In this state, since the lead wire 1a is fixed to the substrate 4, when soldering the core wire 2 of the lead wire 1a to the upper surface 4b of the substrate 4, the soldering operator holds the lead wire 1a by his / her own hand. You don't have to hold it in. That is, by using the lead wire holding member 3 of the present embodiment, the lead wire 1a can be fixed in advance at a predetermined position with respect to the substrate 4. Therefore, the soldering operator can carry out the soldering operation of the lead wire 1a by holding the soldering iron and the solder in his / her hand. The solder is attached to the area of reference numeral S in FIG. At that time, the molten solder flows into the recess 14 of the second lead wire holding member 16. The recess 14 is a portion through which solder is released. Since the solder stays in the recess 14 during the soldering work, it is possible to prevent the solder from flowing to a place other than the area S. The recess 14 of the present embodiment is formed by a slope.

Next, the structure in the vicinity of the lead wire outlet 70 will be described in detail with reference to FIGS. 7 and 21 to 24.
FIG. 21 is a perspective view of the lead wire outlet 70 viewed from the + Z axis direction to the −Z axis direction. A lead wire outlet holding member 74 is provided at the lead wire outlet 70 of the second housing 57. As shown in FIG. 7, the lead wire outlet holding member 74 has a seal member 76 and a lid member 78. The lead wire outlet holding member 74 is fixed to the second housing 57 by a bolt (screw) 75.

FIG. 22 shows a state in which the lid member 78 is removed from the state of FIG. 21. The second housing 57 has a mounting surface (fixing surface) 73 for mounting the lid member 78 at the lead wire outlet 70. The mounting surface 73 is a surface perpendicular to the Z-axis direction. A female screw hole 75a into which the bolt 75 is screwed is formed on the mounting surface 73. Further, the mounting surface 73 is formed with an opening 73a into which the seal member 76 is inserted. In the present embodiment, the seal member 76 is an elastic resin member and is press-fitted into the opening 73a.

FIG. 23 is a perspective view of the second housing 57 cut along the line XXIII-XXIII of FIG. The opening 73a has a predetermined depth in the Z-axis direction, a convex portion that determines the depth of the opening 73a extends in a direction perpendicular to the Z-axis direction, and the seal member 76 contacts the convex portion. By doing so, it is positioned in the Z-axis direction. When viewed in a plane perpendicular to the Z-axis direction, the cross section of the opening 73a is slightly smaller than the cross section of the sealing member 76. Therefore, when the seal member 76 is inserted into the opening 73a, the seal member 76 is in a state of being press-fitted into the opening 73a.

FIG. 24 is a perspective view of the seal member 76. The seal member 76 has a rectangular parallelepiped shape. The seal member 76 has a hole 77 for passing the lead wire 1. More specifically, the seal member 76 has a hole 77a for passing the lead wire 1a and a hole 77b for passing the lead wire 1b. The diameter of the hole 77a is smaller than the diameter of the hole 77b. The seal member 76 has a protrusion 79 on the side surface 76a. The protrusion 79 projects in a direction perpendicular to the Z-axis direction. The protrusion 79 extends in an annular shape in the circumferential direction of the seal member 76. When the seal member 76 is press-fitted into the opening 73a, the protrusion 79 elastically deforms and comes into close contact with the wall of the opening 73a. It can be prevented from entering.

As described above, at the lead wire outlet 70 of the lead wire lead-out portion 66, the lead wire outlet holding member 74 is fixed by the bolt (fixing member) 75. Since the lead wire 1a is held by the lead wire outlet holding member 74, the posture of the lead wire 1a is maintained at a predetermined posture in the pull-out direction.
Further, since the seal member 76 is fitted to the inner wall of the opening 73a of the lead wire outlet 70, it is not necessary to newly secure a space for arranging the seal member 76. Therefore, the size of the second housing 57 (lead wire lead-out portion 66) can be reduced.

<Effect of embodiment>
In the present embodiment, the plurality of lead wires 1a can be held and the plurality of lead wires 1a can be fixed to the soldering position (board land 4d). Since a plurality of lead wires 1a can be held and fixed at the soldering position, it is not necessary to hold the lead wires 1a during the soldering operation. According to this embodiment, the hands required for the soldering work are a hand holding a solder and a hand holding a soldering iron.

Further, since the plurality of lead wires 1a can be held and fixed at the soldering position, the plurality of lead wires 1a can be soldered together. Therefore, according to the present embodiment, the efficiency of the soldering work is improved.
Further, according to the present embodiment, since the lead wire 1a is pressed by the lead wire holding member 3, the lead wire 1a is less likely to be peeled off from the soldered portion.
Since the second lead wire holding member 16 is removable from the first lead wire holding member 15, the second lead wire holding member 16 may be removed from the first lead wire holding member 15 after the soldering work is completed. When the second lead wire holding member 16 is removed from the first lead wire holding member 15, the result is as shown in FIG.

Since the first lead wire holding member 15 is removable from the substrate 4, the first lead wire holding member 15 may be removed from the substrate 4 after the soldering work is completed. The first lead wire holding member 15 is removed from the state shown in FIG. Even after the first lead wire holding member 15 is removed from the substrate 4, the substrate 4 can be fixed to the second housing 57 by bolts 33. That is, the fixing of the first lead wire holding member 15 (or the substrate holding member 3) to the second housing 57 and the fixing of the substrate 4 to the second housing 57 are independent, and the first from the second housing 57 to the first. Even if the lead wire holding member 15 is removed, the fixing of the substrate 4 to the second housing 57 can be maintained.

In the electric oil pump 100 described above, a signal is supplied to the substrate 4 via the lead wire 1. After that, the substrate 4 supplies a signal to the motor. The motor is driven (rotated) based on the signal, and when the motor rotates, the rotor rotates. When the rotor rotates, oil is supplied to the transmission 200. When the electric oil pump 100 is mounted on an automobile, for example, oil is supplied from the electric oil pump 100 to the transmission 200 immediately after idling stop.

The electric oil pump 100 described above may have the following configuration.
The fitting of the first lead wire holding member 15 and the second lead wire holding member 16 is assumed to be a snap fit, but the connection between the first lead wire holding member 15 and the second lead wire holding member 16 is other than that. May be fitted (or engaged). The structure may be such that the second lead wire holding member 16 can be removed from the first lead wire holding member 15.
Further, the hole 22 of the first lead wire holding member 15 may be a hole having a shape other than a rectangle. Alternatively, if the first lead wire holding member 15 has sufficient elasticity even without the holes 22, the holes 22 may not be provided.
It is assumed that the second lead wire holding member 16 is removable from the first lead wire holding member 15, but it is better to maintain the state in which the second lead wire holding member 16 is fixed to the first lead wire holding member 15. Is also possible. In that case, the connection between the second lead wire holding member 16 and the first lead wire holding member 15 may be an inseparable connection.
The configurations described above can be combined as appropriate within a range that does not contradict each other.

1, 1a, 1b ... Lead wire 2 ... Core wire (conductor)
3 ... Lead wire holding member 4 ... Substrate 4b ... Top surface 4c ... Side 5 ... Fixed part 6 ... Overhanging part 8 ... Lead wire passage part 10 ... Covering part 11 ... First passage part 12 ... Second passage part 25 ... Electronic component 100 … Electric oil pump

Claims (17)

A lead wire holding member that covers at least a part of the lead wire and holds the lead wire so that the conductor of the lead wire is exposed.
A fixing portion for fixing the lead wire holding member so that the conductor of the lead wire is arranged on the surface of a substrate on which an electronic component is mounted.
A lead wire holding structure characterized by being provided with. The lead wire holding member has an overhanging portion that covers a part of the substrate, and the overhanging portion has an facing surface that faces a part of the substrate.
The lead wire holding structure according to claim 1, wherein the lead wire is sandwiched between a part of the substrate covered with the overhanging portion and the facing surface of the overhanging portion. The lead wire holding structure according to claim 1 or 2, wherein the lead wire holding member has a lead wire passage portion, and the lead wire passage portion has a portion extending in parallel with the surface of the substrate. .. The lead wire comprises the conductor and a covering portion that covers the conductor.
The lead passage portion has a first passage portion having a predetermined diameter and a second passage portion having a diameter smaller than that of the first passage portion.
The lead wire holding structure according to claim 3, wherein the diameter of the second passage portion is smaller than the diameter of the covering portion of the lead wire, and only the conductor of the lead wire passes through the second passage portion. The lead wire holding structure according to claim 4, wherein the diameter of the first passage portion is slightly smaller than the diameter of the covering portion of the lead wire. The lead wire holding member has a lead wire outlet surface located on the substrate when the lead wire holding member is fixed to the substrate, and the lead wire outlet surface has a recess. The lead wire holding structure according to any one of claims 1 to 5. The lead wire holding member includes a first lead wire holding member and a second lead wire holding member that is overlapped and fixed on the first lead wire holding member.
The second lead wire holding member has a first plane and has a first plane.
The lead wire holding structure according to claim 4 or 5, wherein the first lead wire holding member comes into contact with the first plane to form at least a part of the first passage portion. The second lead wire holding member has a step portion in a portion overlapped with the first lead wire holding member, and the first plane surface is formed in the step portion.
The first lead wire holding member has a contact surface that comes into contact with the first plane.
The lead wire holding structure according to claim 7, wherein the first passage portion has a portion smaller than the outer diameter of the lead wire at a position where the contact surface contacts the first plane. 8. The eighth aspect of the present invention is characterized in that the substrate has an opposite surface on the opposite side of the surface, and the contact surface is in contact with the first plane on the surface side of the opposite surface of the substrate. The lead wire holding structure described. The first lead wire holding member has a first fitting portion and has a first fitting portion.
The lead wire holding structure according to any one of claims 7 to 9, wherein the second lead wire holding member has a second fitting portion that fits into the first fitting portion. The first lead wire holding member has a first horizontal plane portion and a first vertical plane portion rising from the first horizontal plane portion in the vicinity of the first fitting portion.
The second lead wire holding member has a second horizontal plane portion corresponding to the first horizontal plane portion and a second vertical surface portion corresponding to the first vertical plane portion in the vicinity of the second fitting portion.
At least one of the first connecting portion in which the first horizontal plane portion is connected to the first vertical plane portion and the second connecting portion in which the second horizontal plane portion is connected to the second vertical plane portion is the first connecting portion and the said. The lead wire holding structure according to claim 10, wherein a non-interfering portion is formed so that the second connecting portions do not interfere with each other. The lead wire holding structure according to any one of claims 7 to 11, wherein the first lead wire holding member has the fixing portion. The lead wire holding structure according to any one of claims 7 to 12, wherein the second lead wire holding member is removable from the first lead wire holding member. The lead wire holding structure according to any one of claims 7 to 13, wherein the first lead wire holding member is removable from the substrate. The lead wire holding structure according to any one of claims 1 to 14, wherein the lead wire holding member can hold a plurality of lead wires. The substrate is housed in a substrate housing.
The lead wire holding structure according to any one of claims 1 to 15, wherein the fixing portion is fastened together with the substrate and is fixed to the substrate housing by a fastening member. A board on which electronic components are mounted and
The lead wire holding structure according to any one of claims 1 to 16.
With the lead wire soldered to the substrate using the lead wire holding structure,
An actuator unit that is connected to the board and receives at least one of a signal and a power supply from the board.
An electric actuator characterized by being provided with.

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