JP2021008010A - Board cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate cutting apparatus capable of removing scraps from a stage to the outside of a stage in a short time after cutting a manufacturing substrate. SOLUTION: A substrate cutting device is used to fix a substrate to a stage, cut the substrate into a plurality of individual products and a plurality of scraps, release the fixing after the cutting is completed, and take out the plurality of individual products. The stage has an inclined surface portion in a part of the region overlapping the end material portion in a plan view, and after the fixing is released, the end material portion is naturally dropped along the inclined surface portion. The substrate cutting device is provided with a scrap material accommodating unit for accommodating the scrap material portion that naturally falls. [Selection diagram] Fig. 1

Description

The present invention relates to a substrate cutting device that is individually separated and used as a printed wiring board or the like.

At the time of manufacturing, products such as printed wiring boards are commercialized by cutting a manufacturing substrate on which a plurality of products are impositioned and arranging them into individual pieces. The four-sided ends of the manufacturing substrate are scraps that are not products. As described above, a substrate cutting device is used as a device for cutting a manufacturing substrate into individual substrates to be a product (for example, Patent Documents 1 and 2).

FIG. 7 is a schematic plan view (a) and a schematic cross-sectional view (b) illustrating a stage portion of a conventional general substrate cutting device. In the stage 50 of the conventional substrate cutting device, when the manufacturing substrate (not shown) is cut, the manufacturing substrate is fixed on the stage 50 so as not to shift. As this fixing method, an adsorption method using a vacuum system is generally used. After the cutting is completed, the space for adsorption (adsorption path) is evacuated and returned to atmospheric pressure.

For the above purpose, the stage 50 of the substrate cutting device has a suction hole 53p for sucking a portion of a manufacturing substrate as an individual product, a suction hole 53t for sucking a portion to be a scrap portion, and a cutting. A blade groove 52 for the purpose is provided. Reference numeral 54v indicates a suction path connecting the suction holes 53p and the suction holes 53t for simultaneously sucking or vacuum-breaking the individual product part and the scrap material part.

FIG. 8 is a schematic plan view (a) and a schematic cross-sectional view (b) illustrating a form in which a manufacturing substrate 51 is adsorbed on a stage 50 of a conventional substrate cutting device. Reference numeral 54v'means that the suction path 54v is in a reduced pressure state during suction.

FIG. 9 is a schematic plan view illustrating a mode in which a manufacturing substrate is cut by a conventional substrate cutting device. Here, reference numeral 51a means a manufacturing substrate being cut. In this way, the manufacturing substrate is cut into individual products and scraps by the blade unit 61. Reference numeral 62b means a cut portion of the manufacturing substrate. FIG. 10 is a schematic plan view illustrating a mode in which the cutting process is completed by the conventional substrate cutting device. Reference numeral 51b means a manufacturing substrate after cutting.

FIG. 11 is a schematic plan view (a) and a schematic cross-sectional view (b) illustrating a step of taking out an individual product 51p with a conventional substrate cutting device. After the cutting is completed, the suction path 54v is evacuated and returned to atmospheric pressure to release the suction, and the individual product 51p is taken out from the manufacturing substrate 51b after cutting by a pickup robot 58p equipped with an arm and placed in the storage tray 59p. Contain. Reference numeral 51p'means an individual product being picked up.

FIG. 12 is a schematic plan view (a) and a schematic cross-sectional view (b) illustrating a step of taking out a scrap portion 51t with a conventional substrate cutting device. In this way, the scrap portion 51t is taken out from the manufacturing substrate 51c after the individual product is taken out by the pickup robot 58t provided with the arm, and is stored in the storage tray 59t. Reference numeral 51t'means a scrap portion during pickup.

The scrap portion 51t needs to be removed from the stage 50 before the manufacturing substrate to be processed next is placed. As a method of eliminating the scrap portion 51t, if the scrap portion 51t is removed first after cutting, when the scrap portion 51t is removed, it comes into contact with the individual product and the position or orientation of the individual product on the stage 50 changes. Therefore, it becomes difficult to carry the pickup robot 58p thereafter. Therefore, it is better to remove the scrap portion 51t after finishing the pick-up work of the individual product so that the individual product can be picked up without failure.

However, in the above procedure, since it takes a long time to pick up the individual product, it is necessary to wait until the pick-up work is completed to remove the scrap portion 51t, and especially when trying to manually remove the scrap portion 51t. The waiting time was longer than the time, and the work efficiency was extremely poor.

In addition, if the cutting device is provided with a mechanism dedicated to the work of removing unnecessary scraps 51t, if the device configuration becomes complicated, the pick-up robot 58p that picks up individual products can also remove the scraps 51t. I was going. In any case, the removal of the scrap portion 51t, which is not a product, has been an inefficient operation.

Japanese Unexamined Patent Publication No. 2011-258899 International Publication No. 2016/125730 Pamphlet

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate cutting apparatus capable of removing scraps from the stage to the outside of the stage in a short time after cutting the manufacturing substrate.

As a means for solving the above problems, in the invention according to claim 1 of the present invention, a substrate is fixed to a stage, and the substrate is cut into a plurality of individual products and a plurality of scraps.
A substrate cutting device for releasing the fixing and taking out the plurality of individual products after the cutting is completed. The stage has an inclined surface portion in a part of a region overlapping the end material portion in a plan view.
Substrate cutting characterized by having a function of allowing the end material portion to fall naturally along the inclined surface portion after releasing the fixing, and providing an end material accommodating unit for accommodating the end material portion that naturally falls. It is a device.

According to the second aspect of the present invention, the fixing is performed by adsorption by decompression of the space formed by the substrate and the stage.
The substrate cutting device according to claim 1, wherein the fixing is released by returning the space to atmospheric pressure.

According to the third aspect of the present invention, the fixing and the release of the fixing can be performed individually in the region of the substrate to be the individual product and the region of the substrate to be the end material. The substrate cutting apparatus according to claim 2, wherein the substrate is cut.

The invention according to claim 4 is characterized by comprising a clamp that can be attached to and detached from the region to be the end material portion in order to fix and release the region to be the end material portion of the substrate. This is the substrate cutting device according to claim 1.

According to the present invention, it is possible to provide a substrate cutting apparatus capable of removing scraps from the stage to the outside of the stage after cutting the manufacturing substrate. Since the scraps can be discharged only by vacuum-breaking the suction mechanism for fixing the substrate, there is no need to provide a special dispensing mechanism, and there is an effect that the device specifications can be simplified. In addition, since the time required for payout is short, work efficiency can be improved.

It is (a) schematic plan view and (b) schematic sectional view which shows the structure of the substrate cutting apparatus of 1st Embodiment of this invention. It is a schematic cross-sectional view which shows the structure of the modification of the substrate cutting apparatus of 1st Embodiment of this invention. It is (a) schematic plan view and (b) schematic sectional view which shows the structure of the substrate cutting apparatus of 2nd Embodiment of this invention. It is a schematic cross-sectional view which shows the process of cutting a substrate using the substrate cutting apparatus of 1st Embodiment of this invention, and taking out a scrap part and an individual piece product in the order of a process. It is a schematic cross-sectional view which shows the process which cuts a substrate using the substrate cutting apparatus of 2nd Embodiment of this invention, and takes out an individual piece product and a scrap part in process order. It is a schematic plan view which illustrates the part where the substrate is cut in order to take out the individual piece product and the end material part by using the substrate cutting apparatus of 1st Embodiment of this invention. It is (a) schematic plan view and (b) schematic sectional view which illustrates the stage part of the conventional board cutting apparatus. It is (a) schematic plan view and (b) schematic cross-sectional view which illustrates the form which adsorbed the substrate on the stage of the conventional substrate cutting apparatus. It is a schematic plan view which illustrates the mode of cutting a substrate by a conventional substrate cutting apparatus. It is a schematic plan view which illustrates the mode that the cutting process was completed by the conventional substrate cutting apparatus. It is (a) schematic plan view and (b) schematic cross-sectional view which illustrates the process of taking out an individual product by a conventional substrate cutting apparatus. It is (a) schematic plan view and (b) schematic sectional view which illustrates the process of taking out a scrap part by a conventional substrate cutting apparatus.

Hereinafter, the substrate cutting apparatus according to the embodiment of the present invention will be described with reference to the drawings. The same components are labeled the same or similar unless there is a reason for convenience. In each drawing, the thickness and ratio of the components may be exaggerated for ease of viewing, and the number of components may be reduced. Further, the present invention is not limited to the following embodiments as they are, and can be embodied by appropriate combinations and modifications as long as the gist is not deviated.

FIG. 1 is a schematic plan view (a) and a schematic cross-sectional view (b) showing a configuration of a substrate cutting device according to a first embodiment of the present invention. The substrate cutting device 100 of the first embodiment includes a stage 10 and a scrap material accommodating unit 16. Similar to the conventional substrate cutting device, the stage 10 has an adsorption hole 13p for adsorbing a portion of a manufacturing substrate as an individual product, an adsorption hole 13t for adsorbing a portion of a scrap material, and a cutting device. A blade groove 12 for the purpose is provided. Reference numeral 14v in the cross-sectional view indicates a suction path connected to the suction hole 13p and the suction hole 13t for simultaneously sucking or vacuum-breaking the individual product part and the scrap part.

In addition to the above, the substrate cutting device 100 of the first embodiment has an inclined surface portion 10s on the outer peripheral portion of the stage 10, and the inclined surface portion 10s is partially formed in a plan view as described later in FIG. , It is formed so as to overlap with the end material portion of the manufacturing substrate (not shown in FIG. 1).

Since the substrate cutting device 100 of the first embodiment has the inclined surface portion 10s, as described in detail in FIG. 4, after the fixing of the end material portion of the manufacturing substrate is released, the end material portion is turned into the inclined surface portion 10s. It has a function to let it fall naturally along.

The substrate cutting device 100 of the first embodiment includes a scrap material accommodating unit 16 for accommodating the naturally falling end material portion. The outer shape of the scrap material accommodating unit 16 is composed of an outer wall 16a of the end material accommodating unit and an inner wall 16b of the end material accommodating unit. The unit 16 is formed in a frame shape so as to include four sides of the outer peripheral portion of the manufacturing substrate between the outer wall 16a of the end material accommodating unit and the inner wall 16b of the end material accommodating unit in a plan view. Although not shown, the stage 10 and the scrap material accommodating unit 16 are supported by a surface plate, a support rod, or the like.

FIG. 2 is a schematic cross-sectional view showing a configuration of a modified example of the substrate cutting device according to the first embodiment of the present invention. In the substrate cutting device 100 of the first embodiment of FIG. 1, the suction path is a suction path 14v for simultaneously adsorbing or vacuum-breaking the individual product part and the end material part, but the substrate cutting of the first embodiment. In the modified example 100'of the device, the suction path 14v1 of the individual product part and the suction path 14v2 of the scrap part are separated by the partition wall 15, and therefore the suction hole 13p and the suction hole 13t are not connected.

According to the configuration of the modification 100'of the substrate cutting device of the first embodiment of FIG. 2, the fixation and the release of the fixation are divided into a region to be an individual product of the manufacturing substrate and a region to be a scrap portion of the manufacturing substrate. Then, it becomes possible to perform the fixing and releasing of those regions individually, and it is possible to perform either region first so as to suit the processing conditions.

For example, if the process is performed in the order of de-adsorption of the individual product part → pick-up of the individual product → de-adsorption of the scrap material after the substrate division is completed, the adjacent individual product is temporarily contacted when the individual product is picked up. Even so, there is an advantage that the adjacent individual products are difficult to move because the scraps are still adsorbed.

FIG. 3 is a schematic plan view (a) and a schematic cross-sectional view (b) showing the configuration of the substrate cutting apparatus according to the second embodiment of the present invention. The difference between the substrate cutting device 200 of the second embodiment and the substrate cutting device 100 of the first embodiment of FIG. 1 is that it has a suction hole 13t for sucking a portion of a manufacturing substrate which is a scrap portion. Instead, it only has a clamp bar 27. The clamp bar 27 moves up and down to attach and detach to and from the end material portion, thereby fixing and releasing the end material portion.

By providing the clamp bar 27 instead of the suction hole 13t, even if the width of the end material portion is too small to form a suction hole, the end material portion can be placed on the stage by attaching and detaching the clamp bar 27. Can be fixed to or discharged to the outside of the stage. Although not shown, the clamp bar 27 can be supported by a movable arm, a support rod, or the like to control its movement.

FIG. 4 is a schematic cross-sectional view showing a process of cutting a substrate using the substrate cutting device 100 of the first embodiment of the present invention and taking out scraps and individual products in order of steps. In addition, except for FIG. 4C, the scrap material accommodating unit 16 is not shown.

The manufacturing substrate 11 is placed on the substrate cutting device 100 stage 10 of the first embodiment, and the suction path is depressurized to 14v', so that the manufacturing substrate 11 passes through the suction holes 13p and 13t connected to the suction path 14v'. 11 is fixed to the stage 10 (FIG. 4 (a)).

Next, the manufacturing substrate 11 is cut along the blade groove 12 by a blade unit (not shown here) to form the individual product 11p and the end material portion 11t shown in FIG. 4B.

Next, the suction path is evacuated and returned to atmospheric pressure to become 14v, so that the individual product 11p and the end material portion 11t are not fixed. As a result, the scrap portion naturally falls to the outside of the stage 10 due to gravity and is accommodated in the scrap accommodating unit 16 (FIG. 4 (c)).

At the time of the above, as shown in FIG. 4A, the center of gravity of the portion of the manufacturing substrate 11 to be the end material portion 11t is the center of gravity of the stage 10 so that the end material portion surely falls to the outside of the stage 10. The length ls1 from the start point of the inclined surface portion to the end of the end material portion 11t is longer than the length lv to the other end of the end material portion 11t so as to come outside the start point of the inclined surface portion. The manufacturing substrate 11 is placed and fixed on the stage 10.

Finally, as shown in FIG. 4 (d), the defixed individual product 11p'can be picked up and taken out in the same manner as before.

FIG. 5 is a schematic cross-sectional view showing a process of cutting a substrate using the substrate cutting device 200 of the second embodiment of the present invention and taking out individual products and scraps in order of process. In addition, except for FIG. 5D, the illustration of the scrap material accommodating unit 26 is omitted.

In the substrate cutting device 200 of the second embodiment, the individual product 21p is fixed and released in the same vacuum system as in the substrate cutting device 100 of the first embodiment, but the scrap bar 21t is fixed and released by the clamp bar. 27. Reference numeral 27'indicates a state in which the clamp bar holds and fixes the manufacturing substrate 21.

Also in the substrate cutting device 200 of the second embodiment, as in the modification 100'of the substrate cutting device of the first embodiment of FIG. 2, the fixing and the release of the fixing are performed on the area to be an individual product and the scrap portion. Since the regions can be individually fixed and released, either region may be fixed first. In the example of FIG. 5, the region to be the individual product is first released, and the individual product 21p'is picked up and taken out by the same method as before (FIG. 5 (c)).

In the example of FIG. 5, the region to be the end material portion is finally released, and the end material portion 21t is naturally dropped to the outside of the stage 20 by gravity and accommodated in the end material accommodating unit 26 (FIG. 5 (FIG. 5). d)).

At the time of the above, as shown in FIG. 5A, the center of gravity of the portion of the manufacturing substrate 21 that becomes the end material portion 21t is the center of the stage 20 so that the end material portion surely falls to the outside of the stage 20. The length ls2 from the start point of the inclined surface portion to the end of the end material portion 21t is longer than the length lc of the other end of the end material portion 21t so as to come outside the start point of the inclined surface portion. The manufacturing substrate 21 is placed and fixed on the stage 20.

Although the manufacturing substrate is cut using the substrate cutting apparatus of the present invention, it is not always necessary to cut the scraps in the same manner as the individual products. FIG. 6 is a schematic plan view illustrating a portion where the substrate is cut using the substrate cutting apparatus of the first embodiment, in which reference numeral 12 indicates a blade groove of the stage 10, but a portion where the manufacturing substrate 11 is cut is shown. The part indicated by the white reference numeral 12b is sufficient. If it is cut in this way, only four pieces of scraps are required, which makes the manufacturing process simpler. The same applies when the substrate cutting device of the second embodiment is used.

As described above, in the cutting apparatus of the present invention, a part of the stage, which overlaps with the end material portion of the manufacturing substrate in a plan view, has an inclined surface portion, and after the fixing is released, the end material portion is formed into the inclined surface portion. Since it has a function of spontaneously dropping along the stage, the scraps can be removed from the stage to the outside of the stage in a short time, improving work efficiency and cutting scraps adhering to the scraps inside the stage. Will not fall. Further, even when the width of the end material portion is too small to form a vacuum suction portion for fixing, the same effect can be obtained by attaching and detaching the clamp bar.

11, 21, 51 ... Manufacturing substrate 51a ..... Substrate under cutting 51b ..... Substrate after cutting 51c ..... Substrates after taking out individual products. 11p, 21p, 51p ... Individual pieces 11p', 21p', 51p' ... Individual pieces being picked up 11t, 21t, 51t ... Scraps 11t', 21t' ... Falling Scraps 51t'・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Scraps 100 during pickup ・ ・ ・ ・ ・ ・ ・ ・ Board cutting device 100 ′ of the first embodiment of the present invention. .. Modification 200 of the substrate cutting device of the first embodiment of the present invention ..... The substrate cutting device of the second embodiment of the present invention 10, 10', 20 ..... The substrate cutting device of the present invention. Stage 50 ・ ・ ・ ・ ・ ・ ・ ・ ・ Stages 10s, 20s of the conventional board cutting device ・ ・ ・ ・ Inclined surface (slope)
12, 22, 52 ... Blade groove 12b ..... Cut points 13p, 23p, 53p ... Suction holes (individual product part)
13p', 23p' ... Individual products 13t, 23t, 53t ... Suction holes (mill ends)
14v, 24v, 54v ... adsorption path (common to individual product parts and scraps, non-adsorption)
14v', 24v', 54v' ... adsorption path (at the time of adsorption)
14v1 ・ ・ ・ ・ ・ ・ Adsorption path (individual product part)
14v2 ・ ・ ・ ・ ・ ・ Adsorption path (mill ends)
15 ..... Adsorption path partition wall 16, 26 ..... Scrap material storage unit 16a, 26a ... Scrap material storage unit outer wall 16b, 26b ... Scrap material storage unit inner wall 27 ...・ ・ ・ ・ ・ Clamp bar (when not clamped)
27'・ ・ ・ ・ ・ ・ ・ ・ Clamp bar (when clamped)
58p ・ ・ ・ ・ ・ ・ ・ ・ ・ Pickup robot (for individual products)
58t ... Pickup robot (for scraps)
59p ・ ・ ・ ・ ・ ・ ・ ・ ・ Storage tray (for individual products)
59t ・ ・ ・ ・ ・ ・ ・ ・ ・ Storage tray (for scraps)
61 ・ ・ ・ ・ ・ ・ ・ ・ Blade unit 62b ・ ・ ・ ・ ・ ・ ・ Cut location P ・ ・ ・ ・ ・ ・ ・ ・ ・ Individual product area T ・ ・ ・ ・ ・ ・ ・ ・ ・ Scrap area

Claims (4)

The substrate is fixed to the stage, and the substrate is cut into a plurality of individual products and a plurality of scraps.
A substrate cutting device for releasing the fixing and taking out the plurality of individual products after the cutting is completed. The stage has an inclined surface portion in a part of a region overlapping the end material portion in a plan view.
After the fixing is released, the end material portion has a function of spontaneously dropping along the inclined surface portion, and includes an end material accommodating unit for accommodating the end material portion that naturally falls.
A board cutting device characterized by this. The fixing is performed by adsorption by decompression of the space formed by the substrate and the stage.
The release of the fixation is due to the return of the space to atmospheric pressure.
The substrate cutting apparatus according to claim 1. The fixing and the release of the fixing can be performed individually in the region of the substrate to be the individual product and the region of the substrate to be the end material.
The substrate cutting apparatus according to claim 2. A clamp that can be attached to and detached from the area to be the end material is provided in order to fix and release the area to be the end material of the substrate.
The substrate cutting apparatus according to claim 1.