JP2021061363A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a taking error in a processing apparatus provided with a reading unit for reading a recognition mark of a wafer. SOLUTION: A wafer temporary placement means 2 is arranged under a transfer path of a table 20 having a temporary placement surface and a wafer transfer means 4 below the temporary placement surface, and reads a recognition mark of the temporarily placed wafer. The transport means 4 supplies air to a suction pad 42 having an opening, a suction pipe 44 that communicates the opening with the suction source 49, a branch portion 440 that branches the suction pipe 44, and a branch portion 440. An air supply pipe 45 communicating with the source, a first valve 441 arranged between the branch portion 440 of the suction pipe 44 and the suction source 49, and a second valve 452 arranged in the air supply pipe 45. A first control unit 461 that positions the suction pad 42 above the reading unit 29 by the horizontal moving means 40, and a second control unit 462 that closes the first valve 441, opens the second valve 452, and injects air from the opening of the suction pad 42. 1. A processing device 1 for cleaning the reading unit 29 with the jet air. [Selection diagram] Fig. 2

Description

The present invention relates to a processing apparatus for processing a semiconductor wafer or the like.

The grinding device that grinds the wafer held on the holding surface of the chuck table with a grinding wheel temporarily places the wafer taken out from the wafer cassette by the robot on the temporary placement table, detects the center of the wafer on the temporary placement table, and detects the center of the wafer. The wafer ID (recognition mark), which is an individual identification number formed in, is read. After that, the conveying means sucks and holds the upper surface of the wafer temporarily placed on the temporary placement table with a suction pad, and conveys the wafer from the temporary placement table to the holding surface of the chuck table.

The ID is often printed on the outer peripheral portion where the device is not formed on the lower surface of the wafer held by the holding surface so that it can be read even after grinding, and the optical reading unit for reading the ID is temporarily placed. It is located below the temporary placement surface on which the wafer is temporarily placed on the table. The temporary placement table has a temporary placement surface having a diameter smaller than the diameter of the wafer, and is rotatable by a rotating means, and the reading unit is a temporary placement unit on the lower surface of the wafer rotated by the rotating means. The ID of the outer peripheral portion protruding from the placing surface can be read (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2015-099814

Since the reading unit for reading the ID is arranged at a position below the outer peripheral portion of the lower surface of the temporarily placed wafer in this way, when dust adheres to the wafer, the temporary placement table is temporarily placed. There is a problem that dust adhering to the placed wafer falls on the reading unit and the ID cannot be read.
Therefore, in a processing apparatus provided with a reading unit for reading the wafer ID, there is a problem in preventing an ID reading error from occurring.

In the present invention for solving the above problems, a temporary placement means for temporarily placing a wafer having a recognition mark on the lower surface on the temporary placement surface, a holding means for holding the wafer, and the wafer held by the holding means are provided. A processing device including a processing means for processing and a transfer means for transporting the wafer from the temporary placement means to the holding means, and the temporary placement means is capable of protruding the outer peripheral portion of the wafer. A temporary placement table provided with a surface, and a lower surface of the wafer that is arranged directly below the transfer path of the transfer means at a position below the temporary placement surface, is temporarily placed on the temporary placement surface, and protrudes from the temporary placement surface. The transport means includes a reading unit for reading the recognition mark, a suction pad having an opening formed on the lower surface, a suction pipe that communicates the opening with the suction source, and a branch portion that branches the suction pipe. An air supply pipe that communicates the branch portion with the air supply source, a first valve disposed between the branch portion of the suction pipe and the suction source, and a first valve arranged in the air supply pipe. Two valves, a horizontal moving means for horizontally moving the suction pad between the upper part of the temporary placing means and the upper part of the holding means, and a control for positioning the suction pad above the reading portion by the horizontal moving means. It is provided with a first control unit for performing the operation, a second control unit for closing the first valve, opening the second valve, and controlling the injection of air from the opening of the suction pad, and injecting air from the opening of the suction pad. This is a processing device that cleans the reading unit with air.

In the processing apparatus according to the present invention, the temporary placement means are arranged at a temporary placement table having a temporary placement surface capable of protruding the outer peripheral portion of the wafer and directly below the transfer path of the transfer means at a position below the temporary placement surface. A suction pad having an opening formed on the lower surface and a suction pad having an opening formed on the lower surface and an opening as a suction source are provided as a reading unit for reading the recognition mark on the lower surface of the wafer temporarily placed on the temporary placement surface and protruding from the temporary placement surface. A suction pipe that communicates, a branch portion that branches the suction pipe, an air supply pipe that communicates the branch portion to the air supply source, and a first valve arranged between the branch portion of the suction pipe and the suction source. A second valve arranged on the air supply pipe, a horizontal moving means for horizontally moving the suction pad between the upper part of the temporary placing means and the upper part of the holding means, and a suction pad above the reading unit by the horizontal moving means. By providing a first control unit that controls positioning and a second control unit that closes the first valve, opens the second valve, and controls to inject air from the opening of the suction pad, the air is injected from the opening of the suction pad. It is possible to clean the reading part with air. That is, for example, at the timing when the transfer means does not transfer the wafer and the wafer is not temporarily placed on the temporary placement table, the reading unit (camera) is washed with the air injected from the opening of the suction pad. By maintaining a clean state, it is possible to prevent the occurrence of reading errors of the recognition mark and prevent the occurrence of a situation in which wafer transfer etc. is stopped due to the occurrence of reading errors and the processing means is on standby. Become.

It is a perspective view which shows an example of a processing apparatus. It is an enlarged perspective view for demonstrating the temporary placement means, and the transport means. It is sectional drawing explaining the case where the recognition mark of the wafer placed on the temporary place table is read, the wafer is centered, and then the wafer is transferred from a temporary place table to a holding means. It is sectional drawing explaining the case where the reading part is cleaned by the air ejected from the opening of a suction pad.

The processing device 1 shown in FIG. 1 is a device for grinding the wafer W held on the holding means 30 by the processing means 16, and the front side (−Y direction side) of the processing device 1 on the device base 10 is held. It is an attachment / detachment region where the wafer W is attached / detached to / from the means 30, and the wafer W held on the holding means 30 by the processing means 16 is ground at the rear side (+ Y direction side) on the apparatus base 10. It is a processing area.
The processing apparatus according to the present invention is not limited to a single-axis grinding apparatus such as the processing apparatus 1, but includes a rough grinding means and a finish grinding means, and is a rotating turntable wafer. It may be a biaxial grinding device or the like in which W can be positioned below each grinding means. Further, the processing apparatus may be a polishing apparatus that polishes the wafer W by a processing means provided with a polishing pad.

The wafer W is, for example, a circular semiconductor wafer made of a silicon base material or the like, but is not limited to this, and may be made of gallium arsenide, sapphire, ceramics, resin, gallium nitride, silicon carbide, or the like.

The upper surface Wb facing the upper side (+ Z direction side) of the wafer W is the surface to be ground to be ground. The lower surface Wa, which is the opposite surface of the upper surface Wb, is provided with a device region Wa1 and an outer peripheral surplus region Wa2 surrounding the device region Wa1. The device region Wa1 is partitioned in a grid pattern by a plurality of streets S that are orthogonal to each other, and a device D such as an IC is formed in each region partitioned in a grid pattern. The lower surface Wa is protected by, for example, a protective tape (not shown) is attached. A recognition mark M indicating the material of the wafer W or the like is printed on the outer peripheral surplus area Wa2.
The wafer W may be a wafer on which the device D is not formed.

As shown in FIG. 1, a box-shaped device housing 11 is disposed on the device base 10 of the processing device 1, and the processing means 16 and the holding means 30 are arranged inside the device housing 11. ing.
For example, a touch panel 12 is provided on the front surface of the apparatus housing 11 on the −Y direction side for an operator to input the processing conditions of the wafer W to the processing apparatus 1.

A first cassette mounting portion 150 and a second cassette mounting portion 151 are provided on the front side (-Y direction side) of the apparatus base 10, and the first cassette mounting portion 150 is before processing. The first cassette 150a in which the wafer W is housed is mounted, and the second cassette 151a in which the processed wafer W is housed is placed in the second cassette mounting section 151.

Behind the opening of the first cassette 150a, a robot 155 that carries out the wafer W before processing from the first cassette 150a and carries the wafer W after processing into the second cassette 151a is arranged. Temporary storage means 2 is arranged at a position adjacent to the robot 155.

The temporary placement means 2 for temporarily placing the wafer W on the temporary placement surface 200 in a state where the lower surface Wa of the wafer W having the recognition mark M in the outer peripheral surplus region Wa2 of the lower surface Wa is in contact with the temporary placement surface 200 are shown in FIGS. As shown in the above, a temporary placement table 20 having a diameter smaller than that of the wafer W is provided, and the flat upper surface of the temporary placement table 20 is a temporary placement surface 200 on which the wafer W is temporarily placed while protruding the outer peripheral portion of the wafer W. Become. Around the temporary storage table 20, alignment pins 21 that can be moved so as to reduce or increase the diameter in the radial direction of the temporary storage table 20 are arranged in a plurality of annular rings at equal intervals. The wafer W temporarily placed on the placing table 20 is aligned (centered) at a predetermined position by the alignment pin 21 whose diameter is reduced, and the center thereof is grasped by a control means (not shown) of the processing apparatus 1.

For example, as shown in FIG. 3, the upper end side of the spindle 23 whose axial direction is the Z-axis direction is connected to the lower surface of the temporary storage table 20, and the lower end side of the spindle 23 is connected via the coupling 231. The rotary motor 24 is connected.
The spindle 23 for rotating the temporary table 20 is rotatably supported by the table base 203 arranged on the device base 10 via the bearing 230.

As shown in FIG. 2, the wafer W aligned by the temporary placing means 2 is sucked and held from the temporary placing means 2 to the holding means 30 by sucking and holding the upper surface Wb of the wafer W at a position adjacent to the temporary placing means 2. A conveying means 4 for conveying is arranged.
The transporting means 4 includes a horizontal moving means 40 that horizontally moves the suction pad 42 between the upper part of the temporary placing means 2 and the upper part of the holding means 30. The horizontal moving means 40 has an arm portion 400 extending parallel to the horizontal direction and having a suction pad 42 mounted on the lower surface side of the tip thereof, and an arm portion whose axial direction is the Z-axis direction and is connected to the root of the arm portion 400. It includes a swivel shaft portion 405 that swivels and moves the 400 in the horizontal direction. As shown in FIG. 3, the swivel shaft portion 405 can be rotated by the driving force generated by the rotary motor 405a, and can be vertically moved in the Z-axis direction by the shaft vertical movement means 47 such as an electric cylinder mechanism.

As shown in FIG. 2, the transport means 4 includes a suction pad 42 that sucks and holds the upper surface Wb of the wafer W, and the suction pad 42 is formed, for example, in a circular shape in a plan view, and the lower surface thereof is the wafer W. It becomes an adsorption surface that adsorbs. As shown in FIG. 3, an opening 421 is formed through the center of the lower surface of the suction pad 42 in the thickness direction, and the opening 421 communicates with a suction source 49 such as a vacuum generator or an ejector mechanism. A deformable rubber suction cup or the like may be arranged on the lower surface of the suction pad 42.

For example, a substantially columnar arm connecting portion 401 is attached to the upper surface of the suction pad 42, and the arm connecting portion 401 penetrates the arm portion 400 at the tip of the arm portion 400 in the thickness direction (Z-axis direction). It is loosely fitted in the through hole formed as described above. The upper part of the arm connecting portion 401 is a retaining portion 401a whose diameter is enlarged to a larger diameter than the through hole.

For example, a coil spring 402 is arranged between the lower surface of the arm portion 400 and the upper surface of the suction pad 42 in a state where the arm connecting portion 401 is inserted and sandwiched between the arm portion 400 and the suction pad 42. The impact when the suction pad 42 comes into contact with the wafer W is absorbed by the coil spring 402.

The suction pad 42 that sucks and holds the wafer W conveys the wafer W while forming a substantially arc-shaped transfer path L shown in FIG. 2 from the temporary placement means 2 to the holding means 30 by the arm portion 400 swirling and moving. ..

The temporary placement means 2 described above is arranged at a height below the temporary placement surface 200 of the temporary placement table 20 and directly below the transfer path L of the wafer W by the suction pad 42 of the transfer means 4, and is a temporary placement surface. It is provided with a reading unit 29 that is temporarily placed on the 200 and reads the recognition mark M of the lower surface Wa of the wafer W whose outer peripheral portion protrudes from the temporary placement surface 200.
In the present embodiment, for example, the reading unit 29 is arranged on the table base 203, and is an image pickup that outputs an optical system such as a lens that captures the reflected light from the wafer W and a subject image formed by the optical system. It is a camera composed of elements and the like, and can read the recognition mark M of the wafer W by performing image processing of the formed captured image. Further, for example, on the table base 203, light irradiation means (not shown) for irradiating the lower surface Wa of the wafer W temporarily placed on the temporary table 20 with visible light are arranged side by side in the reading unit 29.

As shown in FIGS. 2 and 3, one end of a suction pipe 44 that communicates the opening 420 with the suction source 49 communicates with the opening 420 of the suction pad 42 of the transport means 4 via an arm connecting portion 401. In the middle of the suction pipe 44 made of a flexible resin tube or the like, for example, a branch portion 440 such as a three-way pipe for branching the suction pipe 44 is arranged. One end of an air supply pipe 45 as a flow path branched from the suction pipe 44 communicates with the branch portion 440, and an air supply source 48 made of a compressor or the like communicates with the other end of the air supply pipe 45. ..

As shown in FIGS. 2 and 3, a first valve 441 is arranged between the branch portion 440 of the suction pipe 44 and the suction source 49. The first valve 441 is, for example, a solenoid valve, and a second control unit 462 that can switch between opening and closing by energizing the first valve 441 is electrically connected. The first valve 441 is not limited to the solenoid valve.

A second valve 452 is arranged between the air supply pipe 45 and the air supply source 48. The second valve 452 is, for example, a solenoid valve, and a second control unit 462 that can switch between opening and closing by energizing the second valve 452 is electrically connected. The second valve 452 is not limited to the solenoid valve.

The transport means 4 includes a first control unit 461 that controls the horizontal moving means 40 to position the suction pad 42 above the reading unit 29. The first control unit 461 is composed of a CPU or the like, and is electrically connected to the horizontal moving means 40.
As an example of operation control of the horizontal moving means 40 by the first control unit 461, for example, when the rotary motor 405a of the horizontal moving means 40 is a servomotor, the rotary encoder of the servomotor also has a function as a servo amplifier. It is connected to the first control unit 461, and after the operation signal is supplied from the first control unit 461 to the servomotor, the rotation speed of the servomotor is output to the first control unit 461 as an encoder signal. Then, the first control unit 461 that receives the encoder signal sequentially recognizes the rotation angle of the swivel shaft unit 405 from the origin position, in other words, the position of the suction pad 42 in the horizontal plane (in the X-axis Y-axis plane). While, the suction pad 42 can be positioned at a desired position.

The transport means 4 includes a second control unit 462 composed of a CPU or the like that controls the first valve 441 to be closed, the second valve 452 to be opened, and air to be injected from the opening 420 of the suction pad 42. Further, for example, the first control unit 461 and the second control unit 462 are electrically connected to each other so that information can be transmitted and received to each other.

As shown in FIG. 1, next to the transport means 4, a carry-out means 154 that swivels while holding the processed wafer W is provided. A single-wafer cleaning means 156 for cleaning the processed wafer W conveyed by the unloading means 154 is arranged at a position close to the unloading means 154. The cleaning means 156 holds the lower surface Wa facing downward of the wafer W on the spinner table 156a, and injects cleaning water onto the upper surface Wb of the wafer W from the cleaning nozzle 156b that moves above the held wafer W. The upper surface Wb is cleaned.

As shown in FIG. 1, a holding means 30 for sucking and holding the lower surface Wa of the wafer W is arranged within the moving range of the carrying-out means 154. The holding means 30 is, for example, a chuck table having a circular outer shape, and includes a holding surface 300 made of a porous member or the like and sucking and holding the wafer W. The holding means 30 is rotatable about a rotation axis whose axial direction is the Z-axis direction (vertical direction), is surrounded by a cover 39, is connected to the cover 39 and the cover 39, and is connected to the cover 39 in the Y-axis direction. A Y-axis direction moving means (not shown) arranged under the telescopic bellows cover 39a enables reciprocating movement on the device base 10 in the Y-axis direction.

A column 100 is erected on the rear side (+ Y direction side) on the device base 10, and a ball screw mechanism or the like for processing and feeding the processing means 16 in the Z-axis direction (vertical direction) is provided on the front surface of the column 100. The processing feed means 17 is arranged.

The processing means 16 for processing the upper surface Wb of the wafer W held by the holding means 30 makes the rotating shaft 160 and the rotating shaft 160 rotatable in the Z-axis direction whose axial direction is orthogonal to the holding surface 300 of the holding means 30. It includes a housing 161 that supports it, a motor 162 that rotationally drives the rotating shaft 160, a mount 163 attached to the lower end of the rotating shaft 160, and a processing tool 164 that is detachably connected to the mount 163. The processing tool 164 is a grinding wheel, and includes a wheel base and a plurality of annular grinding wheels having a substantially rectangular parallelepiped outer shape and arranged on the lower surface of the wheel base.

For example, a grinding water flow path (not shown) extending in the Z-axis direction is formed inside the rotating shaft 160, and a grinding water supply means (not shown) is communicated via a grinding water supply pipe 166 inserted into the grinding water flow path. doing. The grinding water supplied from the grinding water supply means to the rotary shaft 160 is ejected downward from the opening at the lower end of the grinding water flow path toward the machining tool 164 and reaches the contact portion between the machining tool 164 and the wafer W. ..

At a position adjacent to the holding means 30 positioned below the processing means 16, for example, a thickness measuring means 38 for contactally measuring the thickness of the wafer W held by the holding means 30 during grinding is provided. It is arranged.

The operation of the processing apparatus 1 when grinding the wafer W held by the holding means 30 in the processing apparatus 1 shown in FIG. 1 will be described below.
For example, first, the wafer W is carried out from the first cassette 150a by the robot 155, and the robot 155 moves the wafer W above the temporary placement means 2. Then, the robot 155 places the wafer W on the temporary placement surface 200 of the temporary placement table 20 with the lower surface Wa facing downward. The outer peripheral surplus region Wa2, which is the outer peripheral portion of the wafer W, protrudes from the temporary placement surface 200 of the temporary placement table 20.

For example, as shown in FIG. 3, as the temporary placement table 20 on which the wafer W is placed rotates at a low speed, the recognition mark M formed in the outer peripheral surplus region Wa2 of the lower surface Wa of the wafer W is read. By passing through the image pickup region of the unit 29, the image pickup image in which the recognition mark M is captured is formed by the reading unit 29. Then, the reading unit 29 executes image processing using the captured image to read the recognition mark M of the wafer W. As a result, the processing apparatus 1 recognizes the type and the like of the wafer W to be put into the holding means 30. In FIG. 3, the holding means 30 is shown in a simplified manner.

After the rotation of the temporary placement table 20 is stopped, the wafer W is moved horizontally on the temporary placement surface 200 by the alignment pin 21 whose diameter is reduced as shown in FIG. 2, and is aligned with a predetermined position (centering). Will be done.

Next, the transport means 4 shown in FIGS. 2 and 3 transports the centered wafer W to the holding means 30. Specifically, under the control of the first control unit 461, the center recognized by the centering of the upper surface Wb of the wafer W facing upward on the temporary table 20 and the center of the suction pad 42 substantially coincide with each other. Then, the suction pad 42 is horizontally moved by the horizontal moving means 40 and is positioned above the wafer W.

Next, the suction pad 42 is lowered by the shaft vertical movement means 47, and the lower surface of the suction pad 42, which is the suction surface, comes into contact with the upper surface Wb of the wafer W. Further, under the control of the second control unit 462, the first valve 441 shown in FIG. 3 is energized, the first valve 441 is opened, and the suction source 49 and the suction pipe 44 communicate with each other. The suction force generated by the operation of the suction source 49 is transmitted to the lower surface of the suction pad 42 through the suction pipe 44, the arm connecting portion 401, and the opening 420 of the suction pad 42. Then, the suction pad 42 sucks and holds the wafer W with the upper surface Wb facing upward. The second valve 452 is in a closed state.

The suction pad 42 that sucks and holds the wafer W rises, moves horizontally, and lowers, and the wafer W is conveyed to the holding means 30 by the conveying means 4. Then, the wafer W is placed on the holding surface 300 with the upper surface Wb facing upward so that the center of the holding surface 300 of the holding means 30 and the center of the already recognized wafer W substantially coincide with each other. Further, it is sucked and held by the holding surface 300.

Next, the holding means 30 shown in FIG. 1 holding the wafer W moves to the bottom of the processing means 16 in the + Y direction. The machining means 16 is fed in the −Z direction by the machining feed means 17, and the machining tool 164, which rotates with the rotation of the rotating shaft 160, comes into contact with the upper surface Wb of the wafer W to perform grinding. During grinding, as the holding means 30 rotates, the wafer W held on the holding surface 300 also rotates, so that the processing tool 164 grinds the entire surface of the upper surface Wb of the wafer W. Further, the grinding water is supplied to the contact portion between the grinding wheel and the wafer W, and the contact portion is cooled and cleaned.

After grinding the wafer W to a desired thickness, the machining means 16 is raised by the machining feed means 17 to separate it from the wafer W, and the holding means 30 is further moved in the −Y direction to be positioned in the vicinity of the carry-out means 154. .. Next, the wafer W whose upper surface Wb facing upward is sucked and held by the carrying-out means 154 is conveyed to the cleaning means 156. After the upper surface Wb of the wafer W is spinner-cleaned by the cleaning means 156, for example, air is ejected from the cleaning nozzle 156b to dry the wafer W.
The wafer W cleaned and dried by the cleaning means 156 is carried into the second cassette 151a by the robot 155.

In the processing apparatus 1, in order to improve the grinding throughput for the wafers W accommodated in the first cassette 150a in a shelf shape, for example, one wafer W is held and ground by the holding means 30. During this process, a new wafer W is pulled out from the first cassette 150a by the robot 155, and centering of the wafer W for grinding is performed in the same manner as described above.

However, since there is a timing when the transfer means 4 does not transfer the wafer W and the wafer W is not temporarily placed on the temporary placement table 20, air cleaning of the reading unit 29 is performed by the transfer means 4 at this timing. Is carried out by.

In order to carry out air cleaning, first, as shown in FIG. 4, the suction pad 42 that does not hold the wafer W by the horizontal moving means 40 moves horizontally (swivel movement) under the control of the first control unit 461. ), And positioned above the reading unit 29 arranged directly below the transport path L (see FIG. 2) of the suction pad 42 of the transport means 4 at a height position below the temporary placement surface 200 of the temporary placement table 20. Be done. Further, for example, the suction pad 42 is lowered by the shaft vertical movement means 47, and an appropriate gap in the Z-axis direction is formed between the suction pad 42 and the reading unit 29. Further, the first control unit 461 sends information to the second control unit 462 that the suction pad 42 is properly positioned with respect to the reading unit 29 in air cleaning.

Under the control of the second control unit 462, the first valve 441 is closed, the second valve 452 shown in FIG. 4 is energized, the second valve 452 is opened, and the air supply source 48 and the air supply pipe 45 are opened. And the suction pipe 44 on the downstream side of the branch portion 440 communicate with each other, and the compressed air sent out by the air supply source 48 passes through the air supply pipe 45, the suction pipe 44, and the arm connecting portion 401 from the opening 420 of the suction pad 42. It is ejected toward the reading unit 29. Then, the compressed air blows away dust that has fallen from the wafer W and adhered to a lens or the like (not shown) of the reading unit 29, and the reading unit 29 is cleaned.

When the reading unit 29 is cleaned for a predetermined time, the air delivery by the air supply source 48 is stopped, and the energization of the second valve 452 shown in FIG. 4 is cut off under the control of the second control unit 462. Then, the second valve 452 is closed, and the injection of air from the opening 420 is stopped.

The timing at which the reading unit 29 is cleaned is not limited to this embodiment, and for example, during the warm-up operation (idling) of the processing apparatus 1, a desired number of wafers W are ground. The cleaning may be performed before stopping the processing apparatus 1 that has been processed, before grinding the wafer W after the warm-up operation, and the like.

As described above, in the processing apparatus 1 according to the present invention, the temporary placing means 2 is conveyed at a position below the temporary placing surface 200 and the temporary placing table 20 having the temporary placing surface 200 capable of protruding the outer peripheral portion of the wafer W. The transport means 4 is provided with a reading unit 29 which is arranged directly under the transport path L of the means 4 and is temporarily placed on the temporary placement surface 200 and reads the recognition mark M of the lower surface Wa of the wafer W protruding from the temporary placement surface 200. Uses a suction pad 42 having an opening 420 formed on the lower surface, a suction pipe 44 that communicates the opening 420 with the suction source 49, a branch portion 440 that branches the suction pipe 44, and a branch portion 440 to the air supply source 48. The air supply pipe 45 that communicates with the air supply pipe 45, the first valve 441 that is arranged between the branch portion 440 of the suction pipe 44 and the suction source 49, the second valve 452 that is arranged in the air supply pipe 45, and the suction pad. A horizontal moving means 40 that horizontally moves the 42 between the upper part of the temporary placing means 2 and the upper part of the holding means 30, and a first control unit that controls the horizontal moving means 40 to position the suction pad 42 above the reading unit 29. By providing 461 and a second control unit 462 that closes the first valve 441, opens the second valve 452, and controls the injection of air from the opening 420 of the suction pad 42, for example, the transport means 4 transfers the wafer W. At the timing when the wafer W is not temporarily placed on the temporary placement table 20 and not being conveyed, the reading unit 29 is cleaned by the air injected from the opening 420 of the suction pad 42 to maintain a clean state. Next, the reading unit 29 of the recognition mark M of the wafer W placed on the temporary placement table 20 prevents the occurrence of a reading error, and the occurrence of the reading error stops the transfer of the wafer W and the like, so that the processing means 16 is used. It is possible to prevent the situation of waiting.

The processing apparatus 1 according to the present invention is not limited to the present embodiment, and the shape and the like of the configuration of the processing apparatus 1 shown in the attached drawings are not limited to this, and the effects of the present invention can be achieved. It can be changed as appropriate within the range that can be exhibited.

W: Wafer Wb: Upper surface of wafer Wa: Lower surface of wafer D: Device M: Recognition mark 1: Processing device 10: Device base 100: Column 11: Device housing 12: Touch panel 150a: First cassette 151a: Second Cassette 155: Robot 2: Temporary storage means 20: Temporary storage table 200: Temporary storage surface 203: Table base 23: Spindle 24: Rotating motor 29: Reading unit 4: Conveying means 40: Horizontal moving means 400: Arm unit 405: Swivel Shaft 405a: Rotating motor 401: Arm connecting 402: Coil spring 47: Shaft vertical movement means 42: Suction pad 420: Opening 44: Suction pipe 440: Branch 441: First valve 49: Suction source 45: Air supply pipe 452 : 2nd valve 48: Air supply source 461: 1st control unit 462: 2nd control unit 154: Carrying out means 156: Cleaning means 30: Holding means 300: Holding surface 16: Machining means 17: Machining feed means 38: Thickness measurement means

Claims (1)

From the temporary placing means for temporarily placing a wafer having a recognition mark on the lower surface on the temporary placing surface, the holding means for holding the wafer, the processing means for processing the wafer held by the holding means, and the temporary placing means. A processing device including a transporting means for transporting the wafer to the holding means.
The temporary placement means is provided with a temporary placement table provided with the temporary placement surface capable of protruding the outer peripheral portion of the wafer, and at a position below the temporary placement surface, directly below the transfer path of the transfer means. It is provided with a reading unit that is temporarily placed on the placing surface and reads the recognition mark on the lower surface of the wafer that protrudes from the temporarily placed surface.
The transport means includes a suction pad having an opening formed on the lower surface, a suction pipe that communicates the opening with the suction source, a branch portion that branches the suction pipe, and air that communicates the branch portion with the air supply source. The supply pipe, the first valve arranged between the branch portion of the suction pipe and the suction source, the second valve arranged in the air supply pipe, and the suction pad are temporarily placed as means. A horizontal moving means for horizontally moving between the upper part of the holding means and the upper part of the holding means, a first control unit for controlling the position of the suction pad above the reading unit by the horizontal moving means, and the first valve. A processing device including a second control unit that closes and opens the second valve and controls to inject air from the opening of the suction pad, and cleans the reading unit with air injected from the opening of the suction pad.

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