JP2020119740A - Illuminating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device capable of reducing the number of parts and reducing the size and weight. A lighting device 10 includes a long chassis 15 and a long light source unit 14. The light source unit 14 has a long substrate 20, a light emitting element 21 mounted on one surface 20a of the substrate 20, and a power supply circuit component 23 mounted on the other surface 20b of the substrate 20 to supply power to the light emitting element 21. , The power supply circuit component 23 is placed between the chassis 15 and the chassis 15 and attached to the chassis 15. The light emitting element 21 on one surface of the substrate 20 and the power supply circuit component 23 on the other surface of the substrate 20 are mounted at positions where they do not overlap each other with the substrate 20 interposed therebetween. The chassis 15 has a contact portion 33 that contacts the position of the other surface of the substrate 20 corresponding to the position where the light emitting element 21 on one surface of the substrate 20 is mounted. [Selection diagram] Fig. 1

Description

Embodiments of the present invention relate to a lighting device using a light emitting element.

In a conventional lighting device, a board on which a light emitting element is mounted and a power supply section for supplying lighting power to the light emitting element are separately configured, and the board and the power supply section on which the light emitting element is mounted are individually attached to the fixture body. Has been.

Since the substrate on which the light emitting element is mounted and the power supply unit are separately configured in this manner, parts for holding and housing each and parts for attaching to the instrument body are required, and parts for the lighting device. It has many points and is large and heavy.

JP, 2016-58266, A

An object of the present invention is to provide a lighting device that can be reduced in size and weight by reducing the number of parts.

The lighting device of the embodiment includes a long chassis and a long light source unit. The light source unit has a long board, a light emitting element mounted on one surface of the board, and a power supply circuit component mounted on the other surface of the board to supply power to the light emitting element. Placed on the chassis and attached to the chassis. The light emitting element on one surface of the board and the power supply circuit component on the other surface of the board are mounted at positions where they do not overlap each other with the board interposed therebetween. The chassis has a contact portion that comes into contact with a position on the other surface of the substrate corresponding to a position where the light emitting element is mounted on the one surface of the substrate.

According to the lighting device of the embodiment, it is expected that the number of parts is reduced, and the size and weight are reduced.

It is sectional drawing of the illuminating device which shows 1st Embodiment. It is a perspective view of an exploded state of an illuminating device same as the above. It is a perspective view of an exploded state of an illuminating device same as the above. It is a perspective view of an illuminating device same as the above. It is sectional drawing of the illuminating device which shows 2nd Embodiment.

Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 4.

The illuminating device 10 is a long illuminating device such as a base light which is provided in a long shape and whose light emitting region is continuous in a line along the longitudinal direction.

The lighting device 10 includes a long instrument body 11 installed on a surface to be installed such as a ceiling, and a long light source section 12 detachably attached to the lower surface side of the instrument body 11.

The light source unit 12 includes a light source unit 14, a chassis 15 to which the light source unit 14 is attached, and a cover 16 that covers the light source unit 14 and is attached to the chassis 15.

The light source unit 14 includes a plurality of power supply circuits that form a substrate 20, a light emitting element (semiconductor light emitting element) 21 mounted on one surface 20a of the substrate 20, and a power supply circuit 22 mounted on the other surface 20b of the substrate 20. It has a part 23.

As the substrate 20, a double-sided mounting substrate in which wiring patterns are formed on both surfaces of the one surface 20a and the other surface 20b is used. A wiring pattern for mounting the light emitting element 21 is formed on one surface 20a of the substrate 20, and a wiring pattern for forming the power circuit 22 and the power circuit component 23 is formed on the other surface 20b. The wiring pattern on one surface 20a of the substrate 20 and the wiring pattern on the other surface 20b are electrically connected by through holes or the like. The mounting area for mounting the light emitting element 21 on the one surface 20a of the substrate 20 is provided along the longitudinal direction of the substrate 20 at the center position in the width direction orthogonal to the longitudinal direction of the substrate 20. The mounting area for mounting the power supply circuit component 23 on the other surface 20b of the substrate 20 is a position displaced from the position of the other surface 20b of the substrate 20 corresponding to the mounting area on the one surface 20a of the substrate 20 where the light emitting element 21 is mounted. Thus, they are provided at positions displaced from the center position in the width direction of the substrate 20 to both sides in the width direction. That is, the mounting region of the light emitting element 21 on the one surface 20a of the substrate 20 and the mounting region of the power supply circuit component 23 on the other surface 20b of the substrate 20 are provided at positions that do not overlap each other with the substrate 20 interposed therebetween.

As the light emitting element 21, a surface mount type LED is used. A plurality of light emitting elements 21 are mounted in one row (or a plurality of rows) along the longitudinal direction of the board 20 at a central position in the width direction of the board 20. The light emitting element 21 is not limited to the LED as long as it is a surface mount type, and may be another element such as an organic EL.

The power supply circuit 22 converts an external power supply such as an AC power supply into a predetermined lighting power supply such as a DC power supply for lighting the light emitting element 21, and supplies the light emitting element 21 with a rectifying circuit that rectifies the external power supply. It is equipped with a power factor correction circuit that improves the power factor and a step-down chopper circuit that generates a lighting power supply. When one power supply circuit 22 is used for a plurality of light emitting elements 21, one power supply circuit 22 may be used for each predetermined number of light emitting elements 21. In this embodiment, a plurality of power supply circuits 22 are used.

A surface mount type component is used for the power supply circuit component 23. The power supply circuit component 23 includes a connector 24 for inputting an external power supply, a rectifier 25, various switching elements 26, various transformers 27, a control unit, and the like in order to configure each circuit of the power supply circuit 22 described above. There is. The power supply circuit 22 includes these power supply circuit components 23 as a set. The connector 24 is connected at one end of the board 20 to a power cable from the outside of the board 20 in the longitudinal direction from the instrument body 11 side.

The power supply circuit component 23 is located on the other surface 20b of the substrate 20 at a position displaced from the position of the other surface 20b of the substrate 20 corresponding to the position where the light emitting element 21 is mounted on the one surface 20a of the substrate 20. It is mounted at positions displaced from the center position in the width direction to both sides in the width direction. That is, the light emitting element 21 on the one surface 20a of the substrate 20 and the power supply circuit component 23 on the other surface 20b of the substrate 20 are mounted at positions that do not overlap each other with the substrate 20 interposed therebetween.

Then, the light emitting element 21 and the power supply circuit component 23 are mounted on the substrate 20 by reflow soldering and electrically connected.

Among the power supply circuit components 23, the transformer 27 and the like are heat generating components that have a high protruding height from the substrate 20 and generate a larger amount of heat than other power supply circuit components 23. The upper surface of the power supply circuit component 23, which is the heat generating component, is thermally connected to the chassis 15 via a heat conductive member 28 such as a heat conductive sheet.

The light source unit 14 is attached to the chassis 15 with the power supply circuit component 23 arranged between the light source unit 14 and the chassis 15. The light source unit 14 may be attached to the chassis 15 by any of a locking structure using claws and a screwing structure.

The chassis 15 is made of metal and is long. The chassis 15 includes a lower surface portion 30, side surface portions 31 that are erected from both sides of the lower surface portion 30 in the width direction, and a bent portion 32 that is bent outward from an upper end of the side surface portion 31.

The lower surface portion 30 is provided with a contact portion 33 that comes into contact with the position of the other surface 20b of the substrate 20 corresponding to the position where the light emitting element 21 is mounted on the one surface 20a of the substrate 20. The contact portion 33 is provided at the center position in the width direction of the lower surface portion 30 in parallel with the longitudinal direction of the substrate 20 (chassis 15), and is provided between the power circuit components 23 on both sides of the light source unit 14 in the width direction. The other surface 20b is directly connected without inclusions. The contact portion 33 has a length that is equivalent (same or substantially the same) as the length of the substrate 20 in the longitudinal direction.

On both sides of the lower surface portion 30 in the width direction, mounting surface portions 34 to which the both sides of the substrate 20 in the width direction are in contact and the cover 16 is attached are provided.

Enclosed portions 35 for accommodating the power supply circuit components 23 are provided between the contact portion 33 of the lower surface portion 30 and each mounting surface portion 34 at two positions between the lower surface portion 30 and the substrate 20. Each enclosing portion 35 is formed in a substantially U-shaped cross section having enclosing side surface portions 36 on both sides rising from the lower surface portion 30 and enclosing upper surface portions 37 provided between the upper ends of the enclosing side surface portions 36 on both sides. Inside the enclosing portion 35, an accommodating portion 38 for accommodating the power supply circuit component 23 is formed. A part of the power supply circuit component 23 is configured to be thermally connected to the lower surface of the enclosing upper surface portion 37 via the heat conducting member 28.

The chassis 15 is provided with a mounting spring mechanism, for example, and is removably mounted on the instrument body 11 by this mounting spring mechanism.

The cover 16 is made of, for example, a resin having a light-transmitting property and a diffusing property, and is provided in a long shape. The cover 16 includes a cover body 40 and end plates 41 that close both ends of the cover body 40. The center area of the cover body 40 in the width direction is curved so as to project downward, and both ends of the cover body 40 in the width direction are bent inward toward each other. At both ends of the cover body 40 in the width direction, mounting portions 42 are provided that are engaged with and attached to both sides of the chassis 15 in the width direction. The attachment portion 42 has an abutment portion 43 that abuts the attachment surface portion 34 of the chassis 15, and an engagement portion 44 that engages an outer side surface and an upper surface of the bent portion 32. The contact portion 43 is flush with the substrate 20, and has a structure that can be attached to the attachment surface portion 34 of the chassis 15 together with the substrate 20.

The end plate 41 may be non-translucent or translucent. The end plate 41 is attached to the end of the cover body 40 in the longitudinal direction.

Then, in order to assemble the light source unit 12, the integrally configured light source unit 14 is attached to the chassis 15 so that the power supply circuit component 23 is arranged between the chassis 15. At this time, the power supply circuit components 23 mounted on both sides of the other surface 20b of the board 20 in the width direction are inserted into the accommodating portions 38 of the enclosing portions 35 of the chassis 15, and the other surface 20b of the board 20 is attached to the chassis 15. The base plate 20 is attached to the chassis 15 by abutting against the lower surface portion 30 and by a locking structure using a claw or a mounting structure such as screwing.

By attaching the light source unit 14 to the chassis 15, the contact portion 33 comes into contact with the position of the other surface 20b of the substrate 20 corresponding to the position where the light emitting element 21 of the one surface 20a of the substrate 20 is mounted, and each power circuit component 23 is The power supply circuit component 23 is accommodated in each enclosing portion 35 of the chassis 15 and is thermally connected to the enclosing upper surface portion 37 of the chassis 15 via the heat conducting member 28. Further, the positions on the opposite sides of the other surface 20b of the board 20 in the width direction where the power supply circuit components 23 are not mounted contact the mounting surface portion 34 of the chassis 15.

After that, the mounting portions 42 on both sides in the width direction of the cover 16 formed integrally are engaged with and mounted on both sides of the chassis 15.

In the assembled state of the light source unit 12, the end of the enclosing portion 35 of the chassis 15 is open without being covered by the end plate 41, and the connector 24 of the light source unit 14 faces the opening of the end of the enclosing portion 35. Are arranged.

The light source unit 12 thus assembled is connected to the connector 24 of the light source unit 14 with the power cable from the instrument body 11 and attached to the instrument body 11 by the attachment spring mechanism provided in the chassis 15.

Further, when the external power source is supplied to the power source circuit 22 of the light source unit 14, the power source circuit 22 converts the external power source into a predetermined lighting power source and supplies it to the light emitting element 21, and the light emitting element 21 lights up. The light of the light emitting element 21 passes through the cover 16 and is applied to the illumination space.

At the time of lighting, part of the heat generated by the light emitting element 21 is transferred to the substrate 20 to be dissipated, and part of it is transferred to the air inside the cover 16 to be dissipated from the cover 16.

At the time of lighting, a part of the heat generated by the power supply circuit component 23 is transferred to the substrate 20 to be dissipated, and a part of the heat is transferred to the chassis 15 from the enclosure 35 that houses the power supply circuit component 23 to be dissipated. Among the power supply circuit parts 23, the power supply circuit parts 23 such as the transformer 27, which generates a larger amount of heat than other power supply circuit parts 23, are thermally connected to the enclosing portion 35, and thus are efficiently transmitted to the chassis 15. , Good heat dissipation.

In the illumination device 10 of the present embodiment configured in this way, since the light emitting element 21 is mounted on the one surface 20a of the substrate 20 and the power supply circuit component 23 is mounted on the other surface to be integrally configured, the number of components is small. It can be reduced in size and weight.

Since the light emitting element 21 on the one surface 20a of the substrate 20 and the power supply circuit component 23 on the other surface 20b of the substrate 20 are mounted at positions that do not overlap each other with the substrate 20 interposed therebetween, heat generated by each other interferes with each other. Can be reduced.

Since the contact portion 33 of the chassis 15 contacts the position of the other surface 20b of the substrate 20 corresponding to the position where the light emitting element 21 of the one surface 20a of the substrate 20 is mounted, the heat of the light emitting element 21 is efficiently transferred to the chassis 15. Therefore, the temperature rise of the light emitting element 21 can be suppressed.

Since the chassis 15 is provided with the enclosure 35 for accommodating the power supply circuit components 23 between the chassis 15 and the substrate 20, a special power supply case or the like is not required and the number of components can be reduced.

Further, when the power supply circuit component 23 is surface-mounted on the elongated substrate 20, there is a possibility that the power supply circuit component 23, the light emitting element 21, and the like may be removed due to the bending of the substrate 20 or the like. For example, in the case of an illuminating device having a separate power supply circuit board, the length of the power supply circuit board can be minimized, so that the power supply circuit board is less likely to bend. In the present embodiment, since the power supply circuit component 23 is also mounted on the long board 20 on which the light emitting element 21 is mounted, the long board 20 is easily bent in the longitudinal direction.

The chassis 15 of the present embodiment is not a flat plate, but is reinforced because it has a side surface portion 31, a surrounding portion 35, and the like, and is less likely to bend in the longitudinal direction than the substrate 20. A contact portion 33 is provided on the chassis 15 in parallel with the longitudinal direction of the substrate 20, and by making direct contact with the contact portion 33 and the substrate 20, the substrate 20 can be made to have a structure that is difficult to bend. Moreover, the contact portion 33 has a length equal to the length of the substrate 20 in the longitudinal direction, and by contacting both ends of the substrate 20, it is possible to make the structure more difficult to bend.

Further, if there is a gap between the substrate 20 and the cover 16 (abutting portion 43), insects or the like may enter from here, and it is preferable that the substrate 20 and the cover 16 are attached so that there is no gap. In the present embodiment, the mounting portions of the substrate 20 and the cover 16 (contact portion 43) are on the same plane, and the chassis 15 covers the gap so as to bridge the gap. With this structure, the gap can be filled without providing a member such as packing between the substrate 20 and the cover 16 and without providing a further step on the chassis 15.

Further, since the light source unit 14 is attached to the chassis 15, the chassis 15 has a length substantially equal to that of the light source unit 14. Further, the chassis 15 has a side surface portion 31 and has a structure that can be bent. In such a structure, if the chassis 15 has a large thickness (plate thickness), the mass of the chassis 15 is increased. Since the chassis 15 becomes heavy, the workability at the time of mounting the lighting device 10 is lowered, or the risk of dropping the lighting device 10 after mounting is increased. Therefore, it is desirable that the chassis 15 be thin (plate thickness). For example, the thickness (plate thickness) of the chassis 15 is preferably equal to or less than that of the substrate 20.

Next, FIG. 5 shows a second embodiment.

The light emitting elements 21 mounted on the one surface 20a of the substrate 20 of the light source unit 14 are mounted in two rows along the longitudinal direction of the substrate 20 at respective positions separated from each other with the center of the substrate 20 in the width direction as the center.

In this case, the power supply circuit component 23 is a position on the other surface 20b of the substrate 20, which is displaced from the position of the other surface 20b of the substrate 20 corresponding to the position where the light emitting element 21 of the one surface 20a of the substrate 20 is mounted, It is mounted at the center position of the board 20 in the width direction. That is, the light emitting elements 21 in each row on the one surface 20a of the substrate 20 and the power supply circuit component 23 on the other surface 20b of the substrate 20 are mounted at positions that do not overlap each other with the substrate 20 interposed therebetween.

Corresponding to the configuration of the light source unit 14, a contact portion 33 and a surrounding portion 35 of the chassis 15 are provided. That is, the contact portions 33 are provided at two positions separated from each other with the center in the width direction of the lower surface portion 30 as a center, and the substrate 20 corresponding to each position where the light emitting element 21 on the one surface 20a of the substrate 20 is mounted. It contacts each position of the other surface 20b. The enclosing portion 35 is provided at the center of the lower surface portion 30 in the width direction.

And also in this 2nd Embodiment, the effect similar to 1st Embodiment is acquired.

When the light emitting element 21 has high luminous efficiency and a small amount of heat generation, the substrate 20 is sandwiched between the light emitting elements 21 in each row of the one surface 20a of the substrate 20 and the power supply circuit component 23 of the other surface 20b of the substrate 20. You may mount in the position which overlaps with.

Further, the light source unit 12 of the lighting device 10 is detachably attached to a wiring duct (wiring rail) or the like via an attachment mechanism in addition to the fixture body 11 arranged on the ceiling.

In the conventional configuration, the power supply device having the width of the board is attached to the back side of the board (the side opposite to the side on which the light emitting elements are arranged). Since the power supply device is wider than the width of the wiring duct, it cannot be accommodated within the width of the wiring duct, and the mounting mechanism for the wiring duct needs to be mounted above the power supply device. Therefore, when the lighting device is mounted on the wiring duct, the lighting device is mounted in such a manner that the thickness corresponding to the mounting mechanism is generated.

When the power circuit components 23 are arranged separately on both sides in the width direction of the substrate 20 as in the first embodiment, the wiring duct mounting mechanism is disposed in the central region where the power circuit components 23 do not exist. The structure in which 23 is located outside the wiring duct can be provided, and the lighting device 10 can be attached to the wiring duct with a reduced thickness.

Even when the power supply circuit component 23 is arranged in the widthwise center of the substrate 20 as in the second embodiment, the power supply circuit component 23 is arranged in the widthwise center of the substrate 20 within a width of the wiring duct. By installing the power supply circuit component 23 in the wiring duct, the lighting device 10 can be attached to the wiring duct with a reduced thickness. In this case, for example, in the longitudinal direction of the lighting device 10, the power supply circuit component 23 is disposed in the central region and the wiring duct mounting mechanism is disposed at the end portion, or the mounting mechanism is disposed in the central region. It suffices to secure a place for disposing the mounting mechanism in the longitudinal direction of the lighting device 10, such as disposing the power supply circuit component 23 at the end.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the scope of equivalents thereof.

10 lighting equipment
14 Light source unit
15 chassis
20 substrates
20a One side
20b other side
21 Light emitting element
23 Power circuit components
33 Contact part

Claims (3)

Long chassis;
A long board, a light emitting element mounted on one surface of the board, and a power supply circuit component mounted on the other surface of the board to supply power to the light emitting element, and the power supply circuit component is connected to the chassis. An elongated light source unit that is disposed between and is attached to the chassis;
A long illuminating device comprising:
The light emitting element on one surface of the substrate and the power supply circuit component on the other surface of the substrate are mounted at positions that do not overlap each other with the substrate interposed therebetween.
The illuminating device, wherein the chassis has a contact portion that comes into contact with a position on the other surface of the substrate corresponding to a position where the light emitting element is mounted on the one surface of the substrate. The lighting device according to claim 1, wherein the contact portion is formed in parallel with a longitudinal direction of the substrate and is in direct contact with the substrate. The lighting device according to claim 1 or 2, wherein the contact portion has a length equivalent to a length of the substrate in the longitudinal direction.

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