JP2020161671A - Light emitting device - Google Patents

Abstract

A light-emitting device in which a light-reflecting member is appropriately arranged, a lead frame in which the light-reflecting member can be appropriately arranged, and a resin-coated lead frame are provided. In the light emitting device, the first resin portion constitutes the outer surface of the resin package and the inner surface of the recess, the second resin portion is positioned between the first lead and the second lead, and the recess is provided. A part of the upper surface of the first lead including the element mounting region 21r, a part of the upper surface of the second lead, and the upper surface of the second resin portion are located on the bottom surface of the third resin portion 33. In the surroundings, a resin package arranged with its upper surface positioned higher than the bottom surface of the recess, a light emitting element 41 arranged in the element mounting region, and positioned in the recess between the inner side surface and the third resin portion and a light reflective member. [Selection drawing] Fig. 2A

Description

The present disclosure relates to a light emitting device.

A light emitting device provided with a light reflecting member having a light reflecting surface extending from the vicinity of the light emitting element to the entire inside of the resin package so as to surround the light emitting element in order to efficiently take out the light emitted from the light emitting element to the outside. It has been known. For example, Patent Document 1 describes a resin package having a lead and a resin portion, a light emitting element arranged at the bottom of a recess of the resin package, a partition wall provided so as to surround the light emitting element at the bottom of the recess, and an inner wall of the recess. Discloses a light emitting device including a light reflecting member provided in the above. The partition wall is provided to prevent the uncured resin material serving as the light reflecting member from covering the side surface of the light emitting element.

JP-A-2014-158011

In one embodiment of the present disclosure, it is an object of the present invention to provide a light emitting device in which a light reflecting member is appropriately arranged, and a lead frame and a lead frame with a resin into which the light reflecting member can be appropriately arranged.

The light emitting device of the present disclosure has a plurality of leads including a first lead and a second lead, and a resin body including a first resin portion, a second resin portion, and a third resin portion, and a resin in which a recess is formed. In the package, the first resin portion constitutes an outer surface of the resin package and an inner surface of the recess, and the second resin portion is between the first lead and the second lead. On the bottom surface of the recess, a part of the upper surface of the first lead including the element mounting area, a part of the upper surface of the second lead, and the upper surface of the second resin portion are located in the third. The resin portion includes a resin package in which the upper surface of the third resin portion is arranged higher than the bottom surface of the recess around the element mounting region, and a light emitting element arranged in the element mounting region. A light-reflecting member located between the inner side surface and the third resin portion in the recess is provided, and the first lead has a groove structure located outside the element mounting region. The groove structure has a first groove having a first bottom surface and a second groove having an opening in the first bottom surface of the first groove, and a part of the third resin portion is said. It contacts the inner surfaces of the first groove and the second groove.

The lead frame of the present disclosure includes a plurality of units including a first lead portion having an upper surface including an element mounting region and a second lead portion separated from the first lead portion, and the first lead portion includes the first lead portion. The groove structure has a lower surface groove portion at the lower part of the side surface facing the second lead portion and a groove structure located outside the element mounting region, and the groove structure is the first groove having the first bottom surface. , The second groove having an opening in the first bottom surface of the first groove.

The lead frame with resin of the present disclosure includes the lead frame, a plurality of first portions, a plurality of second portions, and a resin member including a plurality of third portions, and the plurality of first portions of the resin member. Covers the side portions of the first lead portion and the second lead portion in the gap between the first lead portion and the second lead portion between the units of the lead frame, and the plurality of resin members. Each of the second portions is located in the gap between the first lead portion and the second lead portion of each unit of the lead frame, and each of the plurality of first portions, the plurality of second portions, and the lead frame. The unit forms a plurality of recesses, the plurality of first portions constitute an inner surface surface of each recess, and on the bottom surface of the plurality of recesses, the upper surface of the first lead portion including the element mounting region. A part, a part of the upper surface of the second lead and the upper surface of the second part are located, and each of the plurality of third parts is arranged around the element mounting area on the bottom surface of the recess. There is.

According to one embodiment of the present disclosure, it is possible to provide a light emitting device in which a light-reflecting member is appropriately arranged, and a lead frame and a lead frame with a resin in which the light-reflecting member can be appropriately arranged. ..

FIG. 1A is a schematic perspective view of the light emitting device of one embodiment as viewed from the upper surface side. FIG. 1B is a schematic perspective view of the light emitting device of one embodiment as viewed from the lower surface side. FIG. 1C is a schematic perspective view of a structure in which the sealing member is removed from the light emitting device of one embodiment as viewed from the upper surface side. FIG. 1D is a schematic perspective view of a structure in which the sealing member and the light reflecting member are removed from the light emitting device of one embodiment as viewed from the upper surface side. FIG. 2A is a schematic top view of a structure in which the sealing member and the light reflecting member are removed from the light emitting device of one embodiment. FIG. 2B is a schematic cross-sectional view of the light emitting device at the position shown by line 2B-2B in FIG. 2A. FIG. 2C is a schematic cross-sectional view of the light emitting device at the position shown by the line 2C-2C in FIG. 2A. FIG. 2D is a schematic cross-sectional view of the light emitting device at the position shown by the 2D-2D line of FIG. 2A. FIG. 3A is a schematic perspective view of the first lead and the second lead as viewed from the upper surface side. FIG. 3B is a schematic top view of the first lead and the second lead. FIG. 3C is a schematic bottom view of the first lead and the second lead. FIG. 3D is a schematic cross-sectional view taken along the line 3D-3D of the structure shown in FIG. 3B. FIG. 3E is a schematic cross-sectional view showing an enlarged groove structure. FIG. 4A is a schematic top view showing a part of the lead frame. FIG. 4B is a schematic top view showing a part of the lead frame with resin. FIG. 5A is a flowchart showing a lead frame manufacturing process. FIG. 5B is a flowchart showing a manufacturing process of the light emitting device. FIG. 6A is a schematic top view of the first lead and the second lead according to the modified example. FIG. 6B is a schematic top view of the first lead and the second lead according to the modified example. FIG. 6C is a schematic top view of the first lead and the second lead according to the modified example. FIG. 7A is a schematic perspective view showing another form of the resin package. FIG. 7B is a schematic plan view of the first lead and the second lead used in the resin package shown in FIG. 7A. FIG. 8 is a schematic perspective view showing another form of the resin package.

In a light emitting device provided with a partition wall that blocks the reflective layer, it is advantageous from the viewpoint of cost if the resin body and the partition wall constituting the resin package can be produced at the same time. For example, when a resin package is manufactured by a molding method, simultaneous formation is possible by connecting the space where the resin body is formed and the space where the partition wall around the light emitting element is formed in the mold. It becomes. However, when the partition wall is formed of a resin material, the bonding between the partition wall formed on the lead and the lead may be insufficient. In view of these points, the present disclosure provides a light emitting device having a novel structure, and a lead frame and a lead frame with a resin into which a light reflecting member can be appropriately arranged.

Hereinafter, the light emitting device, the lead frame, and the lead frame with resin of the present disclosure will be described in detail with reference to the drawings. The light emitting device and the like of the present disclosure are examples, and are not limited to the light emitting device and the like described below. In the following description, terms indicating a specific direction or position (for example, "top", "bottom" and other terms including those terms) may be used. These terms use relative orientations and positions in the referenced drawings for clarity only. In addition, the size and positional relationship of the components shown in the drawings may be exaggerated for the sake of clarity, and the size in the actual light emitting device or the size relationship between the components in the actual light emitting device may be exaggerated. It may not be reflected.

(Light emitting device 101)
A light emitting device 101, which is an embodiment of the light emitting device of the present disclosure, will be described. 1A and 1B are schematic perspective views of the light emitting device 101 viewed from the upper surface side and the lower surface side, respectively, and FIG. 1C is a schematic view of the structure in which the sealing member 75 is removed from the light emitting device 101 as viewed from the upper surface side. FIG. 1D is a schematic perspective view of a structure in which the sealing member 75 and the light reflecting member 50 are removed from the light emitting device 101, as viewed from the upper surface side. FIG. 2A is a schematic top view showing a state in which the sealing member 75 and the light reflecting member 50 are removed from the light emitting device 101. 2B, 2C and 2D are schematic cross-sectional views of the light emitting device 101 on the 2B-2B line, the 2C-2C line and the 2D-2D line of FIG. 2A, and the light reflecting member 50 and the sealing member 75 are also shown. These figures are shown.

The light emitting device 101 includes a resin package 10 having a recess 11, at least one light emitting element 41 arranged on the bottom surface of the recess 11, and a light reflecting member 50 arranged around the light emitting element 41. In the present embodiment, the light emitting device 101 includes one light emitting element 41. Further, the light emitting device 101 may include a sealing member 75 that covers the light emitting element in the recess 11. Hereinafter, each component will be described in detail.

[Resin package 10]
The resin package 10 is a housing and has a recess 11. The light emitting element 41 and the light reflecting member 50 are arranged in the recess 11. The resin package 10 includes a resin body 30 and a plurality of leads including the first lead 21 and the second lead 22. The resin body 30 is integrally formed with the first lead 21 and the second lead 22. The first lead 21 has an upper surface 21a and a lower surface 21b located on the opposite side of the upper surface 21a, and the second lead 22 has a lower surface 22a and a lower surface 22b located on the opposite side of the upper surface 22a. A second resin portion 32 of the resin body 30, which will be described later, is located between the first lead 21 and the second lead 22. The lower surface 21b of the first lead 21, the lower surface 22b of the second lead 22, and the lower surface of the second resin portion 32 are arranged so as to be located on substantially the same plane, for example.

The resin package 10 has an upper surface 10a and a lower surface 10b located on the opposite side of the upper surface 10a. In the present embodiment, the resin package 10 has a substantially quadrangular outer shape in a plan view. Therefore, the resin package 10 has four outer surfaces: an outer surface 10c, an outer surface 10d located on the opposite side of the outer surface 10c, an outer surface 10e, and an outer surface 10f located on the opposite side of the outer surface 10e. The outer shape of the resin package 10 in the top view is not limited to a quadrangle, and may have other shapes. Further, the resin package 10 may have an anode mark or a cathode mark having a shape such that one corner of the opening 11a is chamfered in a plan view. The anode mark or cathode mark functions as a mark indicating the polarity of the two leads.

The resin package 10 is provided with a recess 11 having an opening 11a on the upper surface 10a. A part of the upper surface 21a of the first lead 21 and a part of the upper surface 22a of the second lead 22 are located on the bottom surface 11b of the recess 11. The shape of the recess 11 will be described in detail when the resin body 30 is described. A part of the lower surface 21b of the first lead 21 and at least a part of the lower surface 22b of the second lead 22 are located on the lower surface 10b of the resin package 10.

[1st lead 21, 2nd lead 22]
The first lead 21 and the second lead 22 have conductivity and function as an electrode for supplying power to the light emitting element 41 or a heat radiating member having high thermal conductivity. In the present embodiment, as a plurality of leads, a first lead 21 and a second lead 22 that function as electrodes are provided. Further, the light emitting device 101 may include a third lead in addition to the first lead 21 and the second lead 22. In this case, the third lead may function as an electrode, or may not function as an electrode and may function only as a heat radiating member.

3A, 3B and 3C are a schematic perspective view, a schematic top view and a schematic bottom view of the first lead 21 and the second lead 22. FIG. 3D is a schematic cross-sectional view of the first lead 21 in line 3D-3D of FIG. 3B. The first lead 21 has side portions 21c, 21d, 21e, 21f. The side portion 21d faces the second lead 22. Further, the side portion 21c is located on the opposite side to the side portion 21d. The side portion 21e and the side portion 21f are located on opposite sides of each other and do not face the second lead 22.

The first lead 21 has a lower surface groove portion 21g (indicated by shaded hatching) on the lower surface 21b side of the side portions 21d, 21e, 21f along the side portions 21d, 21e, 21f. The lower surface groove portion 21g is recessed from the lower surface 21b toward the upper surface 21a. The lower surface groove portion 21g can be formed by etching or pressing. As will be described later, a part of the resin body 30 is arranged in the lower surface groove portion 21g. As a result, the adhesion between the resin body 30 and the plurality of leads is improved.

Stretched portions 21h are located on the side portions 21c, 21e, and 21f. In the present embodiment, one stretched portion 21h is located near the center of each of the side portions 21e and 21f, and two stretched portions 21h are located on the side portion 21c. The stretched portion 21h is a part of the first lead 21, and the end surface of the stretched portion 21h is exposed from the resin body 30 on the outer surfaces 10c, 10e, and 10f of the resin package 10 as shown in FIGS. 1A and 1B. There is. In FIGS. 1A and 1B, on the outer surfaces 10c, 10e, and 10f of the resin package 10, the end surface of the stretched portion 21h is substantially the same plane as the resin body 30. The stretched portion 21h is stretched from the main body portion of the first lead 21 toward the outer surfaces 10c, 10e, and 10f of the resin package 10. The main body portion refers to a portion of the first lead 21 having a substantially quadrangular outer shape in a top view excluding the stretched portion 21h. As shown in FIG. 3A, each stretched portion 21h has a curved portion 21hw bent toward the upper surface 21a between the main body portion and the end face. Each curved portion 21hw is embedded in the resin body 30 located between the outer surfaces 10c, 10e, 10f of the resin package 10 and the recess 11, and contributes to the adhesion between the resin body 30 and the first lead 21.

The first lead 21 includes a groove structure 21j provided on the upper surface 21a. The groove structure 21j is located outside the element mounting region 21r shown by the broken line in FIG. 3B. The element mounting region 21r is an region in which the light emitting element 41 is arranged. The groove structure 21j is preferably arranged so as to surround at least a part of the element mounting region 21r. In the present embodiment, the groove structure 21j is formed between the element mounting region 21r and the side portion 21c of the first lead 21, between the element mounting region 21r and the side portion 21e, and between the element mounting region 21r and the side portion. It is continuously provided between the 21f and the 21f. The groove structure 21j may be divided into a plurality of pieces. On the side portion 21d, that is, the side surface of the first lead 21 facing the second lead 22, the groove structure 21j has an opening in a top view.

FIG. 3E is a schematic cross-sectional view showing an enlarged groove structure of FIG. 3D. As shown in FIG. 3E, the groove structure 21j has a first groove 211j having a first bottom surface 211b and a second groove 212j having an opening in the first bottom surface 211b of the first groove 211j. That is, the groove structure 21j includes a two-stage groove structure. The width W2 of the second groove 212j is narrower than the width W1 of the first groove 211j. In the present embodiment, the cross section of the first groove 211j perpendicular to the extending direction is rectangular, and the cross section of the second groove 212j perpendicular to the extending direction is triangular. Since the first groove 211j has a rectangular shape in a cross-sectional view, the formation of the first groove 211j can be facilitated, and the width of the bottom surface of the first groove 211j can be largely secured. This facilitates the formation of the second groove 212j on the bottom surface of the first groove 211j. Further, in the cross-sectional view, the inclination angle formed by the side surface of the second groove 212j and the surface parallel to the upper surface of the lead is smaller than the inclination angle formed by the side surface of the first groove 211j and the surface parallel to the upper surface of the lead. Is preferable. This facilitates the formation of the second groove 212j. The inclination angle formed by the side surface of the first groove 211j and the surface parallel to the upper surface of the lead is, for example, 90 degrees (including an error of ± 5 degrees). Further, the inclination angle formed by the side surface of the second groove 212j and the surface parallel to the upper surface of the lead is, for example, 30 degrees to 75 degrees. The cross-sectional shapes of the first groove 211j and the second groove 212j are not limited to these, and may be other cross-sectional shapes. For example, the cross section of the second groove 212j may have a rectangular shape or a U-shape. Further, the groove structure 21j may include the above-mentioned two-stage groove structure, and includes a groove other than the two-stage groove structure, for example, a portion having only the first groove 211j or a portion having only the second groove 212j. You may be. The groove structure 21j may have a plurality of second grooves 212j on the first bottom surface 211b of the first groove 211j. Further, the groove structure 21j may have a groove structure having three or more stages. For example, the groove structure 21j can have an additional groove on the bottom surface of the second groove 212j. The groove structure 21j is filled with a part of the third resin portion 33 of the resin body 30, which will be described later.

The total depth of the first groove 211j and the second groove 212j is, for example, 0.11 to 0.3 and preferably 0.15 to 0.25 with respect to the thickness of the first lead 21. As a result, it is possible to sufficiently secure the depths of the first groove 211j and the second groove 212j while suppressing the deformation of the lead. The depth of the first groove 211j is, for example, 0.01 to 0.1 times the thickness of the first lead 21, and the depth of the second groove 212j is 0 with respect to the thickness of the first lead 21. .1 to 0.2 times.

The width of the first groove 211j is preferably 1.5 times or more, more preferably 2 times or more, and further preferably 2.5 times or more the width of the second groove 212j. Further, the width of the first groove 211j is 0.2 to 0.8, preferably 0.4 to 0.6, with respect to the thickness of the first lead 21. The width of the second groove 212j is 0.1 to 0.5, preferably 0.15 to 0.25, with respect to the thickness of the first lead 21. As a result, it is possible to sufficiently secure the widths of the first groove 211j and the second groove 212j while suppressing the deformation of the lead.

The first lead 21 may include at least one third groove provided on the upper surface 21a. In the present embodiment, the first lead 21 includes third grooves 21k, 21m, and 21n. The third grooves 21k, 21m, and 21n are located outside the groove structure 21j, respectively. As shown by the broken line in FIG. 2A, the third grooves 21k, 21m, and 21n are located in the vicinity of the outer periphery of the bottom surface 11b of the recess 11 of the resin package 10 in the present embodiment, and are the first of the resin body 30 described later. A part of the resin portion 31 is filled. As a result, the adhesion strength between the first lead 21 and the resin body 30 is improved.

The second lead 22 has side portions 22c, 22d, 22e, 22f. The second lead 22 has a lower surface groove portion 22 g (indicated by shaded hatching) along the side portions 22c, 22e, and 22f of the lower surface 22b. In the present embodiment, the stretched portion 22h is located near the center of the side portion 22d in the top view, and the two stretched portions 22h are located on the side portion 22d. The stretched portion 22h is a part of the second lead 22, and the end surface of the stretched portion 22h is exposed from the resin body 30 on the outer surface 10d of the resin package 10. The stretched portion 22h is stretched from the main body portion of the second lead 22 toward the outer surface 10d of the resin package 10. The main body portion refers to a portion of the second lead 22 having a substantially quadrangular outer shape in a top view excluding the stretched portion 22h. As shown in FIG. 3A, each stretched portion 22h has a curved portion 22hw bent toward the upper surface 22a between the main body portion and the end face. Each curved portion 22hw is embedded in the resin body 30 located between the outer surface 10d of the resin package 10 and the recess 11, and contributes to the adhesion between the resin body 30 and the second lead 21.

In the resin package 10, the first lead 21 and the second lead 22 are separated from each other through a predetermined gap. The side portion 21d of the first lead 21 faces the side portion 22c of the second lead 22.

In the present embodiment, the area of the first lead 21 is larger than the area of the second lead 22 in the top view. This is because the element mounting region 21r is provided on the first lead 21. However, the magnitude relationship between the first lead 21 and the second lead 22 in the top view is not limited to this. For example, when the element mounting region 21r is provided on the second lead, the area of the second lead 22 may be larger than the area of the first lead 21 in the top view. Further, the element mounting region 21r may be provided across the first lead 21 and the second lead. In this case, the areas of the first lead 21 and the second lead 22 may be substantially equal in the top view.

The stretched portions 21h and 22h are parts of the first connecting portion and the second connecting portion that connect the main body portions of the portions serving as the first lead 21 and the second lead 22 to the frame in the lead frame described later. The lead frame includes a frame, a plurality of connecting portions, a main body portion of a plurality of pairs of first leads 21 connected by the plurality of connecting portions, and a main body portion of a portion serving as a second lead 22. Then, the resin body 30 is integrally formed on the lead frame, and for example, the connecting portion is cut at the same time as the resin body 30 at the time of individualization. Therefore, the stretched portions 21h and 22h, which were a part of the connecting portion, are exposed on the outer surfaces 10c, 10d, 10e, and 10f of the resin package 10 in substantially the same plane as the resin body 30. After being individualized, it becomes the first lead 21 including the main body portion and the extending portion 21h of the first lead 21. The same applies to the second lead 22.

The first lead 21 and the second lead 22 each have a base material and a metal layer covering the base material. The base material is preferably a plate-shaped member. Substrates include, for example, copper, copper alloys, aluminum, gold, silver, iron, nickel, or metals such as alloys thereof, phosphor bronze, iron-containing copper. These may be a single layer or a laminated structure (for example, a clad material). In particular, it is preferable to use inexpensive copper or a copper alloy having high heat dissipation as the base material. The metal layer includes, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper, or alloys thereof. In addition, in the first lead 21 and the second lead 22, there may be a region where a metal layer is not provided. Further, in the first lead 21 and the second lead 22, the metal layers formed on the upper surfaces 21a and 22a and the metal layers formed on the lower surfaces 21b and 22b may be different. For example, the metal layers formed on the upper surfaces 21a and 22a are metal layers composed of a plurality of layers including a nickel metal layer, and the metal layers formed on the lower surfaces 21b and 22b are metal layers not containing the nickel metal layer. Is.

When a silver or silver alloy plating layer is formed on the outermost surfaces of the first lead 21 and the second lead 22, a protective layer such as silicon oxide may be provided on the surface of the silver or silver alloy plating layer. preferable. As a result, it is possible to suppress discoloration of the silver or silver alloy plating layer due to sulfur components in the atmosphere or the like. The protective layer can be formed by a vacuum process such as sputtering, but other known methods may be used.

[Resin body 30]
The resin body 30 is integrally formed with the first lead 21 and the second lead 22, and constitutes the resin package 10 together with the first lead 21 and the second lead 22. The resin body 30 includes a first resin portion 31, a second resin portion 32, and a third resin portion 33. The resin body 30 may further include a fourth resin portion 34 and a fifth resin portion 35.

The first resin portion 31 has inner side surfaces 31c, 31d, 31e, and 31f, and forms a recess 11 together with the first lead 21 and the second lead 22. The inner side surface 31c and the inner side surface 31d and the inner side surface 31e and the inner side surface 31f face each other.

The first resin portion 31 further constitutes the outer surfaces 10c, 10d, 10e, and 10f of the resin package 10. The outer side surfaces 10c, 10d, 10e, and 10f are located on opposite sides of the inner side surfaces 31c, 31d, 31e, and 31f, respectively.

As shown in FIG. 1D, of the inner surfaces 31c, 31d, 31e, and 31f, two adjacent ones are connected so as to form a curved surface, and a clear boundary between the inner surfaces is not formed. The opening 11a of the recess 11 has a substantially quadrangular outer shape when viewed from above, and has four rounded corners. In top view, the four corners of the outer edge of the bottom surface 11b are rounded to draw an arc with a larger radius than the four corners of the outer edge of the opening 11a.

As shown in FIG. 2B, a part of the first resin portion 31 is also arranged in the lower surface groove portion 21g provided on the lower surface 21b of the first lead 21 and the lower surface groove portion 22g provided on the lower surface 22b of the second lead 22. ing. As a result, the three side portions of the first lead 21 and the second lead 22 are sandwiched between the upper surfaces 21a and 22a and the lower surfaces 21b and 22b by the first resin portion 31 to hold the first lead 21 and the second lead 22. Is possible. Therefore, the adhesion between the first lead 21 and the second lead 22 and the resin body 30 can be improved.

Further, as shown in FIGS. 2A to 2C, a part of the first resin portion 31 is also arranged in the third grooves 21k, 21m, and 21n of the first lead 21. As a result, the contact area between the first resin portion 31 and the first lead 21 becomes wider, and in particular, the adhesion between the inner side surfaces 31c, 31e, 31f of the resin body 30 and the first lead 21 is enhanced. In the present embodiment, the third grooves 21k, 21m, and 21n are arranged along the edges of the inner side surfaces 31c, 31e, and 31f located on the bottom surface of the recess 11 in the top view.

The second resin portion 32 is a portion of the resin body 30 located between the first lead 21 and the second lead 22. The second resin portion 32 has an upper surface 32a and a lower surface 33b, and the upper surface 32a is located on the bottom surface 11b of the recess 11. The upper surface 32a is located at the same height as the upper surface 21a of the first lead 21 and the upper surface 22a of the second lead 22, and does not protrude from the upper surface 21a of the first lead 21 and the upper surface 22a of the second lead 22. The lower surface 33b is located on the lower surface 10b of the resin package 10. The second resin portion 32 is connected to a wall portion having an inner side surface 31e and an inner side surface 31f of the first resin portion 31.

The third resin portion 33 is located on the bottom surface 11b of the recess 11, and is arranged around the element mounting region 21r. The third resin portion 33 shown in FIGS. 2A to 2C defines the position of the inner edge of the light reflecting member 50, and prevents the light reflecting member 50 from covering the side surface of the light emitting element 41. By not directly covering the side surface of the light emitting element 41 with the light reflecting member 50, it is possible to prevent the light emitted to the side of the light emitting element 41 from being confined in the light reflecting member 50. As shown in FIGS. 2B to 2D, the third resin portion 33 is arranged in the groove structure 21j provided on the upper surface 21a, and is located below the plane including the upper surface 21a, and the second portion 33d. It includes a first portion 33c located above the portion 33d and above the plane including the top surface 21a. That is, a part of the third resin portion 33 is in contact with the inner surfaces of the first groove 211j and the second groove 212j. In the present embodiment, the first portion 33c of the third resin portion 33 has a height h1 from the upper surface 21a of the first lead 21, and has a ring shape that seamlessly surrounds the element mounting region 21r. That is, the upper surface of the third resin portion 33 is located higher than the bottom surface 11b of the recess.

A part of the first portion 33c is located on the upper surface 21a, and the other part is located on the second portion 33d in the groove structure 21j and on the upper surface 32a of the second resin portion 32. There is. As described above, since the groove structure 21j has a two-stage groove structure, the contact area between the second portion 33d and the first lead 21 is large. As a result, the contact area between the third resin portion 33 and the first lead 21 is increased, and it is possible to prevent the third resin portion 33 from being detached from the first lead 21 and the second lead 22 during manufacturing or the like. it can. As a result, the third resin portion 33 can be bonded to the first lead 21 with sufficient strength. Further, since the groove structure 21j has an opening in the side portion 21d, the second portion 33d of the third resin portion 33 is also connected to the second resin portion 32.

The height h1 from the upper surface 21a of the first portion 33c is preferably lower than the height h2 from the upper surface 21a of the light emitting element 41. As a result, the light emitted from the light emitting element 41 can be easily incident on the inclined surface 50s of the light reflecting member 50, and can be efficiently emitted to the outside from the opening 11a.

The fourth resin portion 34 is arranged on the upper surface 21a of the first lead 21, and is connected to the inner side surface 31e of the first resin portion 31 and the third resin portion 33. Similarly, the fifth resin portion 35 is arranged on the upper surface 21a of the first lead 21, and is connected to the inner side surface 31f of the first resin portion 31 and the third resin portion 33. A part of the fourth resin part 34 and a part of the fifth resin part 35 may be located on the upper surface 32a of the second resin part 32. When the resin body 30 includes the fourth resin portion 34 and the fifth resin portion 35, the third resin portion 33 is connected to the first resin portion 31 via the fourth resin portion 34 and the fifth resin portion 35. To. Therefore, the portion of the third resin portion 33 that is not in contact with the first resin portion 31 or the second resin portion 32 of the resin body 30 can be reduced, and the third resin portion 33 is removed from the first lead 21. It is possible to suppress the separation.

The fourth resin portion 34 is preferably not connected to the fifth resin portion 35, is outside the third resin portion 33, and is a first lead between the fourth resin portion 34 and the fifth resin portion 35. It is preferable that the upper surface 21a of 21 is exposed. As a result, a wire connection region of the wire connecting the electrode of the light emitting element 41 and the first lead 21 can be secured.

Further, the fourth resin portion 34 and the fifth resin portion 35 function as runners when a lead frame with resin in which a plurality of resin packages 10 are formed is manufactured by a method such as insert molding. Specifically, the third resin portion 33 is connected to the second resin portion 32, the fourth resin portion 34, and the fifth resin portion 35, and is connected to the second resin portion 32, the fourth resin portion 34, and the fifth resin portion 35. Each of the 5 resin portions 35 is connected to the first resin portion 31. Therefore, in the mold for forming the resin body 30, when a gate for introducing the raw material of the resin body 30 is formed in the space corresponding to the first resin portion 31, the raw material of the uncured resin body 30 is the first resin. It moves from the space corresponding to the portion 31 to the space corresponding to the third resin portion 33 via the space corresponding to the second resin portion 32, the fourth resin portion 34, and the fifth resin portion 35. Therefore, it is possible to introduce the raw material of the resin body 30 into the third resin portion 33 without separately providing a runner or a gate for introducing the resin into the space corresponding to the third resin portion 33 of the mold. is there.

For the resin body 30, a thermosetting resin, a thermoplastic resin, or the like can be used as the resin material as the base material. Specifically, an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition such as a silicone-modified epoxy resin, a modified silicone resin composition such as an epoxy-modified silicone resin, an unsaturated polyester resin, a saturated polyester resin, and a polyimide resin. Cured products such as compositions and modified polyimide resin compositions, resins such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, and PBT resin. Can be used. In particular, it is preferable to use a thermosetting resin of an epoxy resin composition or a modified silicone resin composition. As described above, since the first resin portion 31, the second resin portion 32, the third resin portion 33, the fourth resin portion 34, and the fifth resin portion 35 are integrally connected, they can be formed of the same resin material. The resin body 30 preferably has a viscosity of 10 pa · s to 40 pa · s in an uncured state, and more preferably 15 pa · s to 25 pa · s. As a result, even by the molding method using a mold, the raw materials to be the first resin part 31, the second resin part 32, the third resin part 33, the fourth resin part 34, and the fifth resin part 35 have good fluidity. Can be formed.

The resin body 30 is a reflective member (for example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, etc.) that is difficult to absorb light from a light emitting element and has a large difference in refractive index with respect to the base resin. It can contain light scattering particles such as aluminum oxide, aluminum nitride). As a result, the light from the light emitting element 41 can be efficiently reflected.

Further, as the resin body 30, in order to improve the contrast of the light emitting device, one having a low light reflectance with respect to the external light (in many cases, sunlight) of the light emitting device may be used. In this case, it is usually preferable that the color is black or a color similar thereto. As the filler at this time, carbon such as acetylene black, activated carbon and graphite, transition metal oxides such as iron oxide, manganese dioxide, cobalt oxide and molybdenum oxide, or colored organic pigments can be used depending on the purpose. it can.

[Light emitting element 41]
As the light emitting element 41, a semiconductor light emitting element such as a light emitting diode element can be used. In the present embodiment, the light emitting device 101 includes one light emitting element, but may include two or more light emitting elements. Emitting element 41, in particular, preferably includes a light emission capable nitride semiconductor of ultraviolet to visible range _{(In x Al y Ga 1-} x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1). For example, the light emitting element 41 may emit blue light and green light, respectively. When the light emitting device includes three light emitting elements, the three light emitting elements may emit blue light, green light, and red light, respectively.

The light emitting element 41 is located in the element mounting region 21r of the first lead 21, and is joined to the first lead 21 by a joining member. Examples of the joining member include a resin containing the resin material exemplified in the resin body 30, tin-bismuth-based, tin-copper-based, tin-silver-based, gold-tin-based solder, silver, gold, palladium and the like. A brazing material such as a sex paste, a bump, an anisotropic conductive material, or a low melting point metal can be used. In the present embodiment, the light emitting element 41 and the first lead 21 and the second lead 22 are electrically connected by wires 43a and 43b.

[Light reflective member 50]
The light reflecting member 50 reflects the light emitted from the light emitting element 41 toward the opening 11a. The light reflecting member 50 is located in a region surrounded (sandwiched) between the inner side surfaces 31c, 31d, 31e, 31f of the recess 11 and the third resin portion 33. Specifically, in the recess 11, the upper surface 21a of the first lead 21 and the upper surface 22a and the second resin portion of the second lead 22 located outside the inner side surfaces 31c, 31d, 31e, 31f and the third resin portion 33. It is formed so as to cover a part of the upper surface 32a of the 32. It is preferable that the light reflecting member 50 is not provided inside the third resin portion 33, that is, in the element mounting region 21r. As a result, the light emitting element 41 and the light reflecting member 50 can be easily separated from each other. A part of the light reflecting member 50 may be arranged inside the third resin portion 33.

As shown in FIGS. 2C and 2D, the light reflecting member 50 has an inclined surface 50s between the inner side surfaces 31c, 31d, 31e, 31f and the third resin portion 33. The inclined surface 50s is recessed on the bottom surface 11b side of the recess 11. The light-reflecting member 50 can reflect the light emitted from the light-emitting element 41 toward the opening 11a, and can improve the efficiency of external extraction of the light-emitting device 101.

The inclination angle formed by the straight line connecting the upper end portion and the lower end portion of the inclined surface 50s formed by the light reflecting member 50 and the bottom surface 11b of the recess 11 is the upper end portion of the inclined surface on the inner surface of the resin package 10. It can be made smaller than the inclination angle formed by the straight line connecting the lower end portion and the bottom surface 11b of the recess 11. This is because the light reflecting member 50 can be formed up to the vicinity of the light emitting element, whereby the light emitted from the light emitting element 41 can be efficiently reflected toward the opening 11a.

The light reflecting member 50 is preferably a member that is difficult to transmit or absorb light from a light emitting element, external light, or the like. The light reflecting member 50 preferably has a white color. For example, a thermosetting resin, a thermoplastic resin, or the like can be used as the base resin of the light-reflecting member 50, and more specifically, a phenol resin, an epoxy resin, a BT resin, a PPA, a silicone resin, or the like can be used. Can be used. Reflective members (for example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, nitride) that are difficult to absorb light from the light emitting element and have a large difference in refractive index with respect to the base resin. By dispersing light-scattering particles such as aluminum), light can be reflected efficiently. The viscosity of the light-reflecting member 50 in the uncured state is preferably lower than the viscosity of the resin body 30 in the uncured state. For example, the viscosity of the light reflecting member 50 in the uncured state is preferably 1 pa · s to 20 pa · s, and more preferably 5 pa · s to 15 pa · s. As a result, the light-reflecting member 50 can be well wetted and spread in the recess 11, and the possibility that the light-reflecting member 50 is insufficiently filled can be suppressed.

The light reflective member 50 preferably has a higher light reflectance than the resin body 30. For example, the content of the light-reflecting substance (for example, titanium oxide) contained in the light-reflecting member 50 is larger than the content of the light-reflecting substance contained in the resin body 30. Specifically, the content of the light-reflecting substance contained in the light-reflecting member 50 is preferably 1.5 times or more the content of the light-reflecting substance contained in the resin body 30. 2 It is more preferably twice or more, and further preferably 2.5 times or more. For example, the light-reflecting member 50 contains 30% by weight to 50% by weight of titanium oxide in the total weight of the uncured resin material, and the resin body 30 contains the total weight of the uncured resin material. Of this, titanium oxide is contained in an amount of 15% by weight to 20% by weight.

[Protective element 60]
The light emitting device 101 may include a protective element 60 in order to improve the electrostatic withstand voltage. As the protective element 60, various protective elements arranged in a general light emitting device can be used. For example, a Zener diode can be used as the protection element 60. In the light emitting device 101, the protection element 60 and the light emitting element 41 are connected in parallel.

The protective element 60 can be provided on the upper surface 22a of the second lead 22, for example, as shown by the broken line in FIG. 2B. The protective element 60 is embedded in the light reflecting member 50. As a result, it is possible to prevent the light from the light emitting element 41 from being absorbed by the protective element 60.

One of the two terminals of the protective element 60 is electrically connected to the upper surface 21a of the first lead 21 by a joining member. Examples of the joining member include tin-bismuth-based, tin-copper-based, tin-silver-based, gold-tin-based solder, silver, gold, palladium and other conductive pastes, bumps, anisotropic conductive materials, and low melting point. A brazing material such as metal can be used. Further, the other terminal of the protection element 60 is connected to the upper surface 21a of the first lead 21 by, for example, a wire 61.

[Sealing member 75]
The light emitting device 101 may include a sealing member 75. The sealing member 75 is located in the recess 51 formed by the inclined surface 50s of the light reflecting member 50 in the recess 11 and covers the light emitting element 41 located at the bottom of the recess 51. The sealing member 75 can protect the light emitting element 41 from external force, dust, moisture, and the like.

The sealing member 75 preferably transmits 60% or more of the light emitted from the light emitting element 41, and more preferably 90% or more. As the material of the sealing member 75, the resin material used in the resin body 30 can be used, and as the base resin, a thermosetting resin, a thermoplastic resin, or the like can be used, for example, a silicone resin or an epoxy resin. , Acrylic resin or a resin containing one or more of them can be used. The sealing member 75 can be formed from a single layer, but can also be formed from a plurality of layers. Further, light scattering particles such as titanium oxide, silicon oxide, zirconium oxide, and aluminum oxide may be dispersed in the sealing member 75.

The sealing member 75 may include a material (such as a phosphor) that converts the wavelength of light from the light emitting element 41. Specific examples of the phosphor include cerium-activated ittrium aluminum garnet, cerium-activated lutetium aluminum garnet, europium and / or chromium-activated nitrogen-containing calcium aluminate (one of calcium). The part can be replaced with strontium), europium-activated sialon, europium-activated silicate, europium-activated strontium aluminate, manganese-activated potassium fluoride, and the like can be used.

The content of the light scattering particles and / or the phosphor is preferably about 9 to 50% by weight based on the total weight of the sealing member 75, for example.

(Lead frame 201, lead frame with resin 301)
The light emitting device 101 is manufactured by using a lead frame 301 with a resin in which a plurality of resin packages 10 are integrally formed. The lead frame 201 with resin and the lead frame 201 used for the lead frame 301 with resin will be described. 4A and 4B are schematic top views showing a part of the lead frame 301 with resin and a part of the lead frame 201, respectively.

The lead frame 201 includes a plurality of units 250 including a first lead portion 221 and a second lead portion 222, respectively. In each unit 250, the first lead portion 221 and the second lead portion 222 are arranged apart from each other. The plurality of units 250 are arranged two-dimensionally in the x-direction and the y-direction, for example. In the y direction, the first lead portion 221 and the second lead portion 222 of each unit 250 are arranged in a row. In the x direction, the first lead portion 221 and the second lead portion 222 are alternately positioned to form a row.

The first lead portion 221 of each unit 250 is connected to each other by the first lead 221 and the first connecting portion 251 adjacent in the y direction. On the other hand, in the x direction, the first lead portion 221 and the second lead 222 of the unit 250 adjacent in the x direction are connected to each other by two second connecting portions 252.

The lead frame 201 further includes a holding portion 253 that connects a pair of first connecting portions 251 adjacent in the x direction. For example, when the positions of the plurality of first connecting portions 251 are indicated by (x, y) (x, y are integers of 0 or more, respectively), the holding portion 253 is not provided in even-numbered rows. Further, in the first connecting portion 251 of the odd-numbered row, the holding portion 253 holds the first connecting portion of (2m + 0,4n + 1) (m and n are integers of 0 or more, respectively) and the first connecting portion of (2m + 1,4n + 1). The holding portion 253 connects the first connecting portion 251 of (2m + 1,4n + 3) (m and n are integers of 0 or more, respectively) and the first connecting portion 251 of (2m + 2,4n + 3). In this way, by connecting only a part of the first connecting portion 251 with the holding portion 253, when stress is generated due to press working or the like, the stress is applied to the region of the unit or the like that is not connected to the holding portion 253. It can be relaxed. As a result, it is possible to provide the lead frame 201 in which the residual stress is suppressed while ensuring the strength of the lead frame. The position where the holding portion 253 is provided is not limited to the example shown in FIG. 4A. If there is a first connecting portion 251 that is not connected to the holding portion 253 among the plurality of first connecting portions 251, the above-mentioned effect can be obtained.

The holding portion 253 may be further connected to the second lead 222. When the holding portion 253 is connected to the second lead 222, the strength of the lead frame 201 can be further improved.

The first lead of the resin package 10 is the first lead of the resin package 10, except that the first lead portion 221 and the second lead portion 222 are connected to each other by the first connecting portion 251 and the second connecting portion 252 and are not individualized. It has substantially the same structure as the 21 and the second lead 22. The first connecting portion 251 becomes a stretched portion 21h by being cut. Further, the second connecting portion 252 becomes a stretched portion 21h and a stretched portion 22h by being cut.

As described above, the element mounting region 21r is located on the upper surface 21a of the first lead portion 221. Further, as shown in FIGS. 3A to 3D, a groove structure 21j including a first groove 211j and a second groove 212j is provided on the upper surface 21a of the first lead portion 221 (first lead 21). The lower surface 21b is provided with a lower surface groove portion 21g. The groove structure 21j has an opening on the end surface side of the first lead portion 221 facing the second lead portion 222 (second lead 22). Third grooves 21k, 21m, and 21n located outside the groove structure 21j are located on the upper surface 21a.

Such a lead frame 201 can be manufactured, for example, by press working. FIG. 5A is a flowchart showing an example of a method for manufacturing the lead frame 201. First, a metal plate made of the metal as the base material described as the base material of the first lead 21 and the second lead 22 is prepared, and the metal plate is punched by press working to punch out the first lead portion 221 and the second lead portion 222. , The outer shape of the first connecting portion 251 and the second connecting portion 252 is formed (S1). At this time, the first connecting portion 251 and the second connecting portion 252 are deformed so that the curved portion 21hw of the stretched portion 21h and the curved portion 22hw of the stretched portion 22h are formed at the same time. Further, the first groove 211j, the third groove 21k, 21m, 21n, and the lower surface groove portions 21g, 22g of the groove structure 21j are also formed at the same time by press working.

Next, the second groove 212j is formed by press working (S2). By forming the first groove 211j and the second groove 212j by different press working, strain can be suppressed and a deep groove structure 21j can be formed.

Then, a metal layer covering the base material is formed by plating (S3). As a result, the lead frame 201 is completed.

The lead frame 301 with resin includes the lead frame 201 described above and the resin member 300. The resin member 300 includes a plurality of first portions 331, a second portion 332, and a plurality of third portions 333. Further, the resin member 300 may include a plurality of fourth portion 334 and fifth portion 335. The resin member 300 has a shape in which the resin body 30 of the resin package 10 is integrally connected. In each unit 250, the resin member 300 has substantially the same structure as the resin body 30. That is, the first portion 331, the second portion 332, the third portion 333, the fourth portion 334, and the fifth portion 335 of the resin member 300 are the first resin portion 31, the second resin portion 32, and the second resin portion 335 of the resin body 30. It corresponds to 3 resin part 33, 4th resin part 34 and 5th resin part 35 respectively.

Specifically, the first portion 331 covers the side portions of the first lead portion 221 and the second lead portion 222 in the gap between the first lead portion 221 and the second lead portion 222 between the units 250. .. The second portion 332 is located in the gap between the first lead portion 221 and the second lead portion 222 of each unit 250. In each unit 250, the first portion 331, the second portion 332, the first lead portion 221 and the second lead portion 222 form a recess 11. As a result, the first portion 331 constitutes the inner side surfaces 11c to 11f of each recess. A part of the upper surface 21a of the first lead portion 221 including the element mounting region 10r, a part of the upper surface 22a of the second lead portion 222, and the upper surface 32a of the second portion 332 are located on the bottom surface 11b of the recess 11. .. Further, the third portion 333 is arranged around the element mounting region 10r on the bottom surface 11b of the recess 11.

The fourth portion 334 is arranged on the upper surface 21a of the first lead portion 221 in each unit 250, and is connected to the first portion 331 and the third portion 333. Similarly, the fifth portion 335 is arranged on the upper surface 21a of the first lead portion 221 in each unit 250 and is connected to the first portion 331 and the third portion 333.

The lead frame 301 with resin can be manufactured by using uncured materials of the lead frame 201 and the resin member 300, for example, by insert molding or the like.

(Manufacturing method of light emitting device 101)
The light emitting device 101 can be manufactured by using the above-mentioned lead frame 301 with resin. FIG. 5B is a flowchart showing an example of a manufacturing method of the light emitting device 101. First, the above-mentioned lead frame 301 with resin is prepared (S11), and in each unit 250 of the lead frame 301 with resin, the light emitting element 41 and the protective element 60 are arranged on the bottom surface 11b of the recess 11 to form an electrical connection. As a result, the light emitting element 41 and the protective element 60 are mounted (S12). After that, the uncured resin material of the light reflective member 50 is arranged around the element mounting region 10r in each recess 11 (S13). Then, the uncured resin material of the light-reflecting member 50 is cured by heat, light, or the like to form the light-reflecting member 50 in each unit 250. Further, the sealing member is filled and cured so as to cover the element mounting region 10r, the third resin portion 33, and the light reflecting member 50 (S14). As a result, a collective substrate having a plurality of light emitting devices 101 that are not individualized is completed. After that, the assembly substrate is cut by various methods such as a lead cut mold, cutting with a dicing saw, or cutting with a laser beam to individualize the assembly substrate to obtain a plurality of light emitting devices 101 (S15). ..

[effect]
According to the light emitting device 101, the second groove 212j is located in the first groove 211j, and the groove structure 21j is a deep groove as a whole, so that the bonding strength between the third resin portion 33 and the first lead 21 is high. It has been raised. Therefore, the third resin portion 33 is prevented from peeling from the first lead 21. As a result, it is possible to manufacture the light emitting device 101 in which the third resin portion 33 for separating the reflecting member from the side surface of the light emitting element is arranged with sufficient strength with a high yield. Further, by connecting the second resin portion 32 and the third resin portion 33, at least the third resin portion 33 and the second resin portion 32 can be integrally molded. As a result, the bonding strength at the bottom surface 11b of the recess 11 of the third resin portion 33 is further increased. Further, since the space for forming the second resin portion 32 serves as a runner to the third resin portion 33, the third resin portion 33 can be simultaneously formed by using the same material as the second resin portion 32 and the like. Is. Further, in this case, the resin material can be smoothly filled in the space serving as the third resin portion 33.

Further, the first lead portion 21 has third grooves 21k, 21m, and 21n, and these grooves are filled by the first resin portion 31, so that the bonding strength between the first resin portion 31 and the first lead 21 is strong. Is enhanced. If the resin body 30 further includes the fourth resin portion 34 and the fifth resin portion 35, it is possible to further suppress the peeling of the third resin portion 33. Further, when the resin package 10 is formed, it is possible to secure more flow paths of the resin material to the space forming the third resin portion 33 of the mold, and it is possible to suppress problems such as insufficient filling of the resin material.

(Modification example)
Various modifications can be made to the light emitting device of the present disclosure. For example, the groove structure formed on the first lead 21 is not limited to the structure described in the above embodiment, and the groove structure may include a structure other than the above embodiment. 6A to 6C are top views showing a modified example of the first lead and the second lead. In the first lead 421 shown in FIG. 6A, the groove structure 421j includes at least one first portion 421A and at least one second portion 421B. In the present embodiment, the groove structure 421j includes a plurality of first portions 421A and a plurality of second portions 42B, and the first portion 421A and the second portion 42B are alternately arranged so as to surround the element mounting region 21r. Has been done. The first portion 421A has a two-stage groove structure, and includes a first groove 211j and a second groove 212j having an opening in the first bottom surface 211b of the first groove 211j. The second portion 421B includes a second groove 212j having an opening in the upper surface 421a of the first lead 421.

The groove structure 521j shown in FIG. 6B surrounds only two directions of the element mounting region 21r in a top view. Specifically, the groove structure 521j includes a portion parallel to the side portion 21f and a portion parallel to the side portion 21c, and has an L-shape in a plan view. The groove structure 521j has a two-stage groove structure including the first groove 211j and the second groove 212j, as in the above embodiment.

The first lead 621 shown in FIG. 6C has a notched portion 621n on a side portion 621d facing the second lead 22. In the form shown in FIG. 6C, the cutout portion 621n has a triangular shape in a plan view, and is located at both end openings located on the side portions 621d of the groove structure 21j. The groove structure 21j has the same structure as that of the above embodiment.

The first leads 421, 521, and 621 shown in FIGS. 6A to 6C also have a two-stage groove structure as in the above embodiment, and the second portion 33d of the third resin portion 33 is filled. Therefore, the adhesion between the third resin portion 33 and the first leads 421, 521, 621 is improved, and peeling of the third resin portion 33 during manufacturing or the like is suppressed.

The light emitting device may include two or more light emitting elements. Further, the light emitting device does not have to be provided with a protective element. Further, as described above, the light emitting device may include three or more leads.

Further, the resin body of the resin package may be modified in various ways. The resin package 10'shown in FIG. 8 is different from the resin package 10 of the light emitting device 101 shown in FIG. 1D or the like in that the resin body 30 further includes the sixth resin portion 36 and the resin connecting portions 37 and 38. different. In the resin package 10', the sixth resin portion 34 is arranged on the upper surface 21a of the first lead 21, and is connected to the inner side surface 31c of the first resin portion 31 and the third resin portion 33.

The resin connecting portion 37 is an upper surface 21a of the first lead 21, is arranged between the fourth resin portion 34 and the sixth resin portion 36, and is arranged between the inner side surface 31c and / or 31e of the first resin portion 31 and the third. 3 It is connected to the resin portion 33. On the other hand, the resin connecting portion 37 is the upper surface 21a of the first lead 21, is arranged between the fifth resin portion 54 and the sixth resin portion 36, and is arranged on the inner side surface 31c and / or 31f of the first resin portion 31. Is connected to the third resin portion 33. The resin connecting portion 37 is connected to the fourth resin portion 34 and the sixth resin portion. Further, the resin connecting portion 38 is connected to the fifth resin portion 35 and the sixth resin portion.

The heights of the fourth resin portion 34, the fifth resin portion 35, the sixth resin portion 36, the resin connection portion 37, and the resin connection portion 38 from the upper surface 21a to the respective upper surfaces are set to h4, h5, h6, hc1 and hc2. And. Further, the height of the third resin portion 33 is h1. These heights have the following relationship.
h1> hc1
h1> hc2
hc1> h4
hc1> h6
hc2> h5
hc2> h6
h4, h5 and h6 may have the same value or different values. Further, hc1 and hc2 may have the same value or different values. That is, if the heights of the resin connecting portion 37 and the resin connecting portion 38 are smaller than the height of the third resin portion 33 and larger than the heights of the fourth resin portion 34, the fifth resin portion 35, and the sixth resin portion 36. Good.

The fifth resin portion 35 and the sixth resin portion 36 have an opening 35c and an opening 36c for arranging one end of a wire connected to the light emitting element 41 and the protection element 60, respectively. If the light emitting device does not include a protective element, the opening 36c may not be provided. The upper surface 21a of the first lead 21 is exposed in the opening 35c and the opening 36c. The openings 35c and 36c need only be large enough to connect one end of the wire. For example, the opening 35c and the opening 36c each have a circular shape with a diameter of 230 μm to 350 μm. In the present embodiment, the opening 35c and the opening 36c are not in contact with the third resin portion 33, nor are they in contact with the first resin portion 31.

The sixth resin portion 36 is the upper surface 21a of the first lead 21, and is surrounded by the resin connecting portion 37, the resin connecting portion 38, the third resin portion 33, and the inner side surface 31d of the first resin portion 31 except for the inside of the opening 36c. It covers the entire area. Further, in the upper surface 21a of the first lead 21, the region between the third resin portion 33 and the inner side surfaces 31c and 31e31f of the first resin portion 31 is the fourth resin portion 34 except for the openings 35c and 36c. , 5th resin part, 35, 6th resin part 36, resin connecting part 37 and resin connecting part 38.

The fourth resin portion 34, the fifth resin portion 35, the sixth resin portion, and the resin connecting portions 37, 38 are integrally continuous. Considering these as one resin portion (fourth resin portion) 34', the package 10'is the first between the third resin portion 33 and the inner side surfaces 31c, 31e, 31f of the first resin portion 31. A resin portion 34'that covers the entire upper surface 21a of the lead 21 and connects the first resin portion 31 and the third resin portion 33 is provided. The resin portion 34'has openings 35c and 36c and thick portions which are resin connecting portions 37 and 38.

FIG. 7B shows a plan view of the first lead 721 and the second lead 22 used in the resin package 10'. The first lead 721 is different from the first lead 21 of the resin package 10 in that the groove structure 721p and the groove structure 721q are further provided, and the third grooves 21m and 21k are not provided.

The groove structure 721p and the groove structure 721q each have a two-stage groove structure. The groove structure 721p is connected to the groove structure 21j and extends from the groove structure 21j toward the side portion 21c of the first lead 21 to the position of the inner side surface 31e of the first resin portion 31. The groove structure 721p includes a first groove 711p and a second groove 712p, similarly to the groove structure 21j. The groove structure 721q connects the groove structure 21j and the third groove 21n. The groove structure 721q also includes the first groove 711q and the second groove 712q, similarly to the second groove 21j.

In the resin package 10', the inner side surfaces 31c, 31e, 31f of the first resin portion 31 and the third resin portion 33 are connected to the fourth resin portion 34, the fifth resin portion 35, and the sixth resin portion 36. .. Similar to the above embodiment, since the third resin portion 33 is in contact with the inner surface of the two-stage groove structure 21j, the bonding strength between the third resin portion 33 and the first lead 21 is increased. Further, since the end portions of the inner side surfaces 31c, 31e, and 31f are the third resin portion 33, it is possible to prevent the first resin portion 31 from being easily peeled off at the end portions.

Further, the resin connecting portion 37 and the resin connecting portion 38 connect the first resin portion 31 and the third resin portion 33. Since the resin connecting portion 37 and the resin connecting portion 38 have a height larger than that of the fourth resin portion 34, the fifth resin portion 35, and the sixth resin portion 36, the resin connecting portion 37 is produced when the resin package 10'is manufactured. And the space of the mold for forming the resin connecting portion 38 functions as a runner for supplying the uncured resin material to the space of the mold forming the third resin portion 33. Therefore, the uncured resin material can be smoothly supplied to the space of the mold forming the third resin portion 33.

Further, the groove structure 21j is connected to the third groove 21n in contact with the second resin portion 32 by the groove structure 721q, and is connected to the first resin portion 31 by the groove structure 721p. These groove structures serve as spaces for supplying the resin to the groove structure 21j when the resin package 10'is manufactured, and after the uncured material of the resin body is filled, the contact area with the first lead 21 is expanded. Contribute to.

Due to these structures, the resin package 10'is excellent in supplying the material to the third resin portion 33 at the time of manufacturing. Therefore, it is possible to manufacture the resin package 10'in which the peeling of the third resin portion 33 is suppressed with a high yield.

FIG. 8 is a perspective view showing the resin package 10 ″. In the resin package 10'', the resin connecting portion (fourth resin portion) 39 is formed between the inner side surfaces 31c, 31e, 31f and the third resin portion 33 of the first resin portion 31, and the entire upper surface of the first lead 21 is formed. It is different from the resin package 10'in that the first resin portion 31 and the third resin portion 33 are connected to each other. The resin connecting portion 39 is arranged so as to overlap a part of the second resin portion 32 on the inner side surface 31d side.

The resin connecting portion 39 has openings 39c1 and 39c2 that expose the upper surface 21a of the first lead 21. Further, the resin connecting portion 39 has thin-walled portions 39d1 and 39d2. The thin-walled portion 39d1 is located between the opening 39c1 and the third resin portion 33, and the thin-walled portion 39d2 is located between the opening 39c2 and the end portion on the second resin portion 32 side.

The heights of the resin connecting portion 39 and the thin-walled portions 39d1 and 39d2 from the upper surface 21a to the respective upper surfaces are defined as hc3, hd1 and hd2. Further, the height of the third resin portion 33 is h1. These heights have the following relationship.
h1> hc3
hc3> hd1
hc3> hd2

Further, the height hc3 of the resin connecting portion 39 may be about the same as the heights hc1 and hc2 of the resin connecting portions 37 and 38 in the resin package 10'. The first lead 721 and the second lead 22 shown in FIG. 7B can be used for the resin package 10 ″.

In the resin package 10'', the inner side surfaces 31c, 31e, 31f of the first resin portion 31 and the third resin portion 33 are connected by a resin connecting portion 39 having a height larger than that of the fourth resin portion 34 and the like. There is. Therefore, when the resin package 10 ″ is manufactured, the uncured resin material can be more smoothly supplied to the space of the mold forming the third resin portion 33. Further, since the thin-walled portions 39d1 and 39d2 are arranged between the opening 39c1 and the third resin portion 33 and between the opening 39c2 and the end portion on the second resin portion 32 side, the wire is arranged on the first lead 21. When connecting to the upper surface 21a, it is possible to suppress interference with the resin connecting portion 39 and facilitate wire connection.

The light emitting device of the present disclosure can be used as a light source in various applications, and is suitably used for various types of lighting, backlights, in-vehicle lights, and the like.

10 Resin package 10a, 21a, 22a Top surface 10b, 21b, 22b, Bottom surface 10c-10f Outer side surface 10r Element mounting area 11 Recession 11a, 35c, 36c, 39c1, 39c2 Opening 11b Bottom surface 11c to 11f Inner surface surface 21, 421, 521 , 621 1st lead 21c ~ 21f, 22c ~ 22f Side part 21g, 22g Bottom groove part 21h, 22g Stretched part 21hw, 22hw Curved part 21j, 421j, 521j, 721j, 721p, 721q Groove structure 21k 3rd groove 21m 3rd groove 21n 3rd groove 21r Element mounting area 22 2nd lead 30 Resin body 31 1st resin part 31 1st resin 31c to 31f Inner side surface 32 2nd resin part 32a Upper surface 32j Groove structure 33 3rd resin part 33b Lower surface 33c 1st Part 33d 2nd part 34, 34'4th resin part 35 5th resin part 36 6th resin part 37, 38, 39 Resin connection part 39d1, 39d2 Thin wall part 41 Light emitting element 42B 2nd part 43a, 43b Wire 50 Light reflection Sex member 50s Inclined surface 51 Recession 60 Protective element 61 Wire 70 Protective layer 75 Sealing member 101 Light emitting device 201 Lead frame 211b First bottom surface 211j, 411j, 711p, 711q First groove 212j, 421j, 712p, 712q Second groove 221 1st lead part 222 2nd lead part 250 unit 251 1st connecting part 252 2nd connecting part 253 Holding part 300 Resin member 301 Lead frame with resin 331 1st part 332 2nd part 333 3rd part 334 4th part 335 5 part 421A 1st part 421B 2nd part 421a Top surface 621d Side part 621n Notch part h1 Height h2 Height

Claims (14)

A resin package having a plurality of leads including a first lead and a second lead, and a resin body including a first resin portion, a second resin portion, and a third resin portion, and having recesses formed therein. The 1 resin portion constitutes an outer surface of the resin package and an inner surface of the recess, and the second resin portion is located between the first lead and the second lead of the recess. On the bottom surface, a part of the upper surface of the first lead including the element mounting area, a part of the upper surface of the second lead, and the upper surface of the second resin portion are located, and the third resin portion is mounted on the element. A resin package in which the upper surface of the third resin portion is arranged higher than the bottom surface of the recess around the placement area, and
The light emitting element arranged in the element mounting area and
A light-reflecting member located between the inner side surface and the third resin portion in the recess,
With
The first lead has a groove structure located outside the element mounting region.
The groove structure has the first groove having a first bottom surface and the second groove having an opening in the first bottom surface of the first groove.
A light emitting device in which a part of the third resin portion is in contact with the inner surfaces of the first groove and the second groove. The light emitting device according to claim 1, wherein at least a part of the other portion of the third resin portion is connected to the second resin portion. The first lead has at least one third groove located outside the groove structure.
The light emitting device according to claim 1 or 2, wherein a part of the first resin portion is arranged in at least one third groove. The resin body further includes a fourth resin portion.
The light emitting device according to any one of claims 1 to 3, wherein the fourth resin portion is connected to the first resin portion and the third resin portion and is located on the upper surface of the first lead. The light emitting device according to claim 4, wherein the fourth resin portion is connected to the second resin portion. The resin body further includes a fifth resin portion.
The fifth resin portion is connected to the first resin portion and the third resin portion, is not connected to the fourth resin portion, and is located on the upper surface of the first lead. The light emitting device according to 4 or 5. The resin body further includes a fourth resin portion.
The fourth resin portion covers the entire upper surface of the first lead between the third resin portion and the inner surface of the first resin portion in the previous period, and connects the first resin portion and the third resin portion. And
The fourth resin portion includes an opening that exposes a part of the upper surface of the first lude for connecting one end of a wire electrically connected to the light emitting element, and the first resin portion and the third resin portion. Has a thick part to connect with
The light emitting device according to any one of claims 1 to 3, wherein in the fourth resin portion, the thickness of the thick portion is larger than the thickness of the other region. The resin body further includes a fourth resin portion.
The fourth resin portion covers the entire upper surface of the first lead between the third resin portion and the inner surface of the first resin portion in the previous period, and connects the first resin portion and the third resin portion. And
The fourth resin portion is between an opening that exposes a part of the upper surface of the first lude for connecting one end of a wire electrically connected to the light emitting element, and the opening and the three resin portions. Has a thin-walled part located in
The light emitting device according to any one of claims 1 to 3, wherein in the fourth resin portion, the thickness of the thin portion is smaller than the thickness of the other region. A plurality of units including a first lead portion having an upper surface including an element mounting region and a second lead portion separated from the first lead portion are provided.
The first lead portion has a lower surface groove portion at the lower part of a side surface facing the second lead portion and a groove structure located outside the element mounting region.
The groove structure is a lead frame having the first groove having a first bottom surface and the second groove having an opening in the first bottom surface of the first groove. 9. The first lead portion has at least one third groove located outside the groove structure, and the at least one third groove does not overlap with the lower surface groove portion in a plan view. The lead frame described in. The lead frame according to claim 9 and
A resin member including a plurality of first portions, a plurality of second portions, and a plurality of third portions.
It is a lead frame with resin equipped with
The plurality of first portions of the resin member form side portions of the first lead portion and the second lead portion in the gap between the first lead portion and the second lead portion between the units of the lead frame. Cover and
Each of the plurality of second portions of the resin member is located in the gap between the first lead portion and the second lead portion of each unit of the lead frame.
Each unit of the plurality of first portions, the plurality of second portions, and the lead frame forms a plurality of recesses.
The plurality of first portions constitute an inner surface surface of each recess, and on the bottom surface of the plurality of recesses, a part of the upper surface of the first lead portion including the element mounting region and the upper surface of the second lead. The upper surface of a part and the second part is located,
A lead frame with resin, each of the plurality of third portions being arranged around the element mounting region on the bottom surface of the recess. The resin member further includes a plurality of fourth portions.
The resin-containing lead frame according to claim 11, wherein in each unit, the fourth portion is connected to the first portion and the third portion and is located on the upper surface of the first lead portion. The lead frame with resin according to claim 12, wherein the fourth portion is connected to the second portion. The resin member further comprises a plurality of fifth portions.
In each unit, the fifth portion is connected to the first portion and the third portion, not to the fourth portion, and is located on the upper surface of the first lead portion. The lead frame with a resin according to claim 12 or 13.

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