JP2020012665A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

To provide a substrate processing apparatus capable of inspecting a substrate with high accuracy without lowering the production efficiency of substrates.SOLUTION: In a substrate processing apparatus 100, a plurality of substrates are sequentially processed by a processing unit. During processing of substrates in the processing unit, an inspection unit 130 operates in a pilot mode and an inspection mode. When the inspection unit 130 is in the pilot mode, a pilot data acquisition section 95 acquires data for determining the inspection condition as pilot data on the basis of a plurality of pieces of imaging information obtained by imaging the plurality of substrates to be processed by the processing unit. A recipe generation apparatus 200 generates an inspection recipe on the basis of the acquired pilot data. In a state where the inspection unit 130 is in the inspection mode, the substrates are inspected based on the image data of the plurality of substrates to be processed by the processing unit and the inspection recipe.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate and inspecting the substrate.

  In a manufacturing process of a semiconductor device, a liquid crystal display and the like, various processes are performed on a substrate such as a semiconductor wafer and a glass substrate. In addition, an inspection device is used to detect a substrate on which various processes have been performed. The inspection apparatus is provided in the substrate processing apparatus together with, for example, a plurality of processing units for processing the substrate. In the inspection apparatus described in Patent Literature 1, after an exposure process and a development process are sequentially performed on a substrate on which a resist film is formed, an appearance inspection of the substrate is performed. Specifically, surface image data (hereinafter, referred to as inspection image data) is obtained by imaging the surface of the substrate to be inspected by the imaging unit. On the other hand, a sample substrate having no appearance defect is prepared in advance, and surface image data (hereinafter, referred to as reference image data) of the sample substrate is obtained. Based on a comparison between the gradation value of each pixel of the inspection image data and the gradation value of each pixel of the reference image data, a defect of the inspection target substrate is detected.

JP-A-2006-206452

  In a series of processes on a substrate, for example, if a subsequent process is performed on a defective substrate generated in one process, the subsequent process is useless. Therefore, in each processing step, it is desired to detect at least a part of the defective substrate generated in the processing step. By collecting at least some of the detected defective substrates from the substrate production line, unnecessary processing for the defective substrates is reduced.

  In the above-described inspection apparatus, it is necessary to prepare a sample substrate for each type of die pattern formed on the substrate to be inspected and acquire reference image data.

  In a substrate processing apparatus provided with an inspection device together with a plurality of processing units, processing by a plurality of processing units and inspection by an inspection device are generally performed in a series of flows. Therefore, when the type of a substrate to be processed is changed, it is necessary to temporarily stop the processing of the substrate in the substrate processing apparatus and then acquire new reference image data in the inspection apparatus. In this case, the production efficiency of the substrate decreases.

  Further, depending on the individual difference of the sample substrate, appropriate reference image data may not be obtained. In this case, the detection accuracy of the defect by the inspection device is reduced. Therefore, it is desirable that the reference image data is created based on the surface image data after acquiring the surface image data of a large number of sample substrates, for example. However, in order to acquire surface image data of a large number of sample substrates, it is necessary to stop processing of the substrate in the substrate processing apparatus for a long time. As a result, the production efficiency of the substrate is further reduced.

  An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of inspecting a substrate with high accuracy without lowering the production efficiency of the substrate.

  (1) A substrate processing apparatus according to a first aspect of the invention includes a processing unit that sequentially processes a plurality of substrates, an inspection unit configured to be operable in a pilot mode and an inspection mode during processing of the substrate by the processing unit, and an inspection. A switching device for switching the operation mode of the unit, and an inspection recipe generation device for generating an inspection recipe indicating inspection conditions of the substrate, wherein the inspection unit images a plurality of substrates processed by the processing unit in the pilot mode. A pilot data acquisition unit that acquires data for determining inspection conditions based on a plurality of pieces of imaging information obtained as pilot data, and a plurality of substrates that are imaged by the processing unit in the inspection mode. An image data acquisition unit for acquiring image data, and an image data acquisition unit in the inspection mode. An inspection unit that inspects each board based on each image data acquired by the data acquisition unit and the inspection recipe generated by the inspection recipe generation device, wherein the inspection recipe generation device is acquired by the pilot data acquisition unit. An inspection recipe is generated based on the pilot data.

  In the substrate processing apparatus, the inspection unit operates in, for example, a pilot mode while the processing unit processes the substrate. In the pilot mode, a plurality of substrates processed by the processing unit are imaged, and pilot data is obtained based on a plurality of pieces of imaging information obtained by the imaging. An inspection recipe is generated based on the acquired pilot data.

  Thereafter, the operation mode of the inspection unit is switched from the pilot mode to the inspection mode. In the inspection mode, a plurality of substrates processed by the processing unit are imaged, and a plurality of image data is obtained. Each board is inspected based on the acquired image data and the generated inspection recipe.

  According to the above configuration, the inspection recipe is created during the processing of the substrate by the processing unit. Therefore, there is no need to stop processing the substrate to determine the inspection conditions. According to the above configuration, the inspection recipe is generated based on a plurality of pieces of imaging information of a plurality of substrates. As a result, an appropriate inspection recipe can be obtained as compared with an inspection recipe generated based on one piece of imaging information obtained from one substrate. Further, according to the above configuration, it is possible to detect a defective substrate generated in the processing unit when the inspection unit is in the inspection mode. Therefore, by collecting the detected defective substrate, it is possible to reduce unnecessary processing of the defective substrate. As a result, it is possible to inspect the substrate with high accuracy without lowering the production efficiency of the substrate.

  (2) The inspection recipe generation device includes: a pilot data storage unit that stores the pilot data obtained by the pilot data obtaining unit; and a pilot data storage unit that stores the pilot data based on a predetermined extraction condition. A pilot data extraction unit that extracts at least a portion of pilot data, and a representative data generation unit that generates representative data representing the pilot data extracted by the pilot data extraction unit based on a predetermined representative generation condition. A recipe generation unit that generates an inspection recipe based on the generated representative data.

  In this case, based on the extraction conditions, it is possible to exclude pilot data that is inappropriate for generating an inspection recipe from among the stored pilot data. Also, representative data can be generated from the extracted pilot data based on the representative generation conditions. Therefore, since a more appropriate inspection recipe can be obtained based on the representative data, it becomes possible to inspect the substrate with higher accuracy.

  (3) The inspection recipe generation device includes an end determination unit that determines whether or not the accumulation should be ended after the accumulation of the pilot data in the pilot data accumulation unit is started based on a predetermined accumulation condition. In addition, the recipe generation unit responds to the determination by the end determination unit that storage should be terminated, based on the pilot data stored during a period from the start to the end of the storage of the pilot data. And the switching device may switch the operation mode of the inspection unit from the pilot mode to the inspection mode in response to the termination determination unit determining that the accumulation should be terminated.

  In this case, when the pilot data necessary for generating the inspection recipe is stored based on the storage conditions, the inspection recipe is generated based on the stored pilot data. Further, the operation mode of the inspection unit is switched from the pilot mode to the inspection mode. Thus, after the end of the pilot mode, the inspection of the substrate based on the generated inspection recipe is started without requiring an instruction from the user.

  (4) The inspection recipe includes reference image data indicating an image serving as a reference with respect to the images of the plurality of substrates processed by the processing unit, and the pilot data acquisition unit performs the pilot mode based on the plurality of imaging information in the pilot mode. The image data of a plurality of substrates processed by the processing unit is acquired as pilot data, and the inspection recipe generation device generates reference image data based on the pilot data acquired by the pilot data acquisition unit in the pilot mode, and performs inspection. In the inspection mode, the unit may inspect the substrate based on each image data acquired by the image data acquisition unit and the reference image data generated by the inspection recipe generation device.

  In this case, appropriate reference image data is generated based on the image data of the plurality of substrates. Therefore, in the inspection mode, the substrate is inspected with high accuracy.

  (5) The inspection recipe includes judgment information indicating judgment conditions for judging the presence or absence of a defect in a plurality of substrates processed by the processing unit, and the pilot data acquiring unit performs the pilot mode based on the plurality of imaging information in the pilot mode. The inspection recipe generation device generates the determination information based on the pilot data obtained by the pilot data obtaining unit in the pilot mode, and the inspection unit performs the inspection. In the mode, the presence or absence of a defect on the substrate may be determined based on each image data obtained by the image data obtaining unit and the determination information generated by the inspection recipe generation device.

  In this case, appropriate determination information is generated based on a plurality of pieces of imaging information obtained by imaging a plurality of substrates. Therefore, in the inspection mode, the presence or absence of a defect on the substrate is determined with high accuracy.

  (6) The inspection recipe includes setting information on imaging conditions of a plurality of substrates by the image data acquiring unit, and the pilot data acquiring unit transmits data for determining the imaging conditions based on the plurality of imaging information in the pilot mode. Acquired as pilot data, the inspection recipe generation device generates the setting information based on the pilot data acquired by the pilot data acquisition unit in the pilot mode, and the image data acquisition unit is configured by the inspection recipe generation device in the inspection mode. Imaging conditions for a plurality of substrates may be set based on the generated setting information.

  In this case, appropriate setting information is generated based on a plurality of pieces of imaging information obtained by imaging a plurality of substrates. Therefore, in the inspection mode, the substrate to be inspected is imaged under appropriate imaging conditions. Thereby, it becomes possible to acquire image data appropriate for the inspection.

  (7) A substrate processing method according to a second aspect of the present invention includes a step of sequentially processing a plurality of substrates by a processing unit and an image of the plurality of substrates processed by the processing unit during processing of the substrate by the processing unit. Acquiring, as pilot data, data for determining an inspection condition based on the obtained plurality of pieces of imaging information; and an inspection indicating the inspection condition of the substrate based on the acquired pilot data during processing of the substrate by the processing unit. Generating a recipe, obtaining a plurality of image data by imaging a plurality of substrates processed by the processing unit during processing of the substrate by the processing unit and after generating the inspection recipe, During the processing of the inspection, each board is inspected based on the acquired image data and the generated inspection recipe. A and a step of performing.

  In the substrate processing method, during processing of the substrate by the processing unit, a plurality of substrates to be processed by the processing unit are imaged, and pilot data is acquired based on a plurality of pieces of imaging information obtained by the imaging. An inspection recipe is generated based on the acquired pilot data.

  Thereafter, a plurality of substrates processed by the processing unit are imaged, and a plurality of image data are obtained. Each board is inspected based on the acquired image data and the generated inspection recipe.

  According to the above method, the inspection recipe is created during the processing of the substrate by the processing unit. Therefore, there is no need to stop processing the substrate to determine the inspection conditions. According to the above method, the inspection recipe is generated based on a plurality of pieces of imaging information of a plurality of substrates. As a result, an appropriate inspection recipe can be obtained as compared with an inspection recipe generated based on one piece of imaging information obtained from one substrate. Further, according to the above method, a defective substrate generated in the processing unit can be detected at the time of inspecting the substrate based on the inspection recipe. Therefore, by collecting the detected defective substrate, it is possible to reduce unnecessary processing of the defective substrate. As a result, it is possible to inspect the substrate with high accuracy without lowering the production efficiency of the substrate.

  (8) The step of generating the inspection recipe includes the step of storing the acquired pilot data, and the step of extracting at least a part of the pilot data among the stored pilot data based on a predetermined extraction condition. The method may include a step of generating representative data representing the extracted pilot data based on predetermined representative generation conditions, and a step of generating an inspection recipe based on the generated representative data.

  In this case, based on the extraction conditions, it is possible to exclude pilot data that is inappropriate for generating an inspection recipe from among the stored pilot data. Also, representative data can be generated from the extracted pilot data based on the representative generation conditions. Therefore, since a more appropriate inspection recipe can be obtained based on the representative data, it becomes possible to inspect the substrate with higher accuracy.

  (9) The substrate processing method further includes a step of determining whether or not the accumulation should be terminated after the accumulation of the pilot data is started based on a predetermined accumulation condition, and a step of generating an inspection recipe. Includes a step of generating an inspection recipe based on pilot data accumulated from the start to the end of accumulation of pilot data in response to a determination that accumulation should be terminated, the method comprising: May further include ending the acquisition of the pilot data and starting the inspection of the substrate in response to the determination that the accumulation at the time of acquiring the pilot data should be terminated.

  In this case, when the pilot data necessary for generating the inspection recipe is stored based on the storage conditions, the inspection recipe is generated based on the stored pilot data. In addition, after the accumulation of the pilot data is completed, the inspection of the substrate based on the generated inspection recipe is started without requiring an instruction from the user.

  (10) The inspection recipe includes reference image data indicating an image serving as a reference for the images of the plurality of substrates processed by the processing unit, and the step of obtaining the pilot data includes processing the processing unit based on the plurality of imaging information. Obtaining the image data of the plurality of substrates processed by the method as pilot data, generating the inspection recipe includes generating reference image data based on the obtained pilot data, and performing the inspection. May include a step of inspecting the substrate based on each of the acquired image data and the generated reference image data.

  In this case, appropriate reference image data is generated based on the image data of the plurality of substrates. Therefore, the inspection of the substrate is performed with high accuracy.

  (11) The inspection recipe includes determination information indicating determination conditions for determining the presence or absence of a defect on a plurality of substrates processed by the processing unit, and the step of obtaining pilot data includes determining based on the plurality of imaging information. The method includes obtaining data for determining conditions as pilot data, generating an inspection recipe includes generating determination information based on the obtained pilot data, and performing the inspection includes obtaining the inspection recipe. Determining whether there is a defect on the substrate based on each of the image data thus generated and the generated determination information.

  In this case, appropriate determination information is generated based on a plurality of pieces of imaging information obtained by imaging a plurality of substrates. Therefore, the presence or absence of a defect on the substrate is determined with high accuracy.

  (12) The inspection recipe includes setting information relating to the imaging conditions of the plurality of substrates in the step of acquiring the plurality of image data, and the step of acquiring the pilot data includes determining the imaging condition based on the plurality of imaging information. Obtaining data as pilot data, generating an inspection recipe includes generating setting information based on the obtained pilot data, and obtaining a plurality of image data includes generating the generated setting data. The method may include a step of setting imaging conditions for a plurality of substrates based on the information.

  In this case, appropriate setting information is generated based on a plurality of pieces of imaging information obtained by imaging a plurality of substrates. Therefore, the substrate to be inspected is imaged under appropriate imaging conditions. Thereby, it becomes possible to acquire image data appropriate for the inspection.

It is a block diagram showing composition of a substrate processing system concerning one embodiment of the present invention. FIG. 2 is an external perspective view of the inspection unit in FIG. 1. FIG. 2 is a schematic side view illustrating an internal configuration of the inspection unit in FIG. 1. FIG. 2 is a block diagram illustrating a functional configuration of the substrate processing system of FIG. 1. It is a figure showing an example of composition of recipe generation information. 5 is a flowchart illustrating a pilot data acquisition process performed by the control unit in FIG. 4. 5 is a flowchart illustrating an inspection recipe generation process performed in the recipe generation device of FIG. 4.

  Hereinafter, a substrate processing apparatus and a substrate processing method according to an embodiment of the present invention will be described with reference to the drawings. In the following description, a substrate is a semiconductor substrate, a flat panel display (FPD) substrate such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, Photomask substrate, ceramic substrate, solar cell substrate, and the like.

  In the following description, a substrate processing system will be described as an example of the substrate processing apparatus of the present invention. In the substrate processing system of the present embodiment, after an inspection recipe indicating inspection conditions of the substrate is generated, an appearance inspection based on the inspection recipe generated for the substrate that has been subjected to the predetermined processing is performed. The substrate to be inspected has one surface (main surface) and the other surface (back surface), and a plurality of patterns for forming a plurality of chips to be products are two-dimensionally arranged on one surface. The plurality of patterns are periodically arranged according to the size of an area that can be exposed in one shot in an exposure apparatus that exposes the substrate. In the following description, one or a plurality of patterns formed in an area that can be exposed by one shot in the exposure apparatus is called a die pattern. The die pattern is composed of at least one film such as a resist film, an antireflection film, a resist cover film, and the like.

[1] Configuration of Substrate Processing System FIG. 1 is a block diagram showing a configuration of a substrate processing system according to one embodiment of the present invention. As shown in FIG. 1, the substrate processing system 500 includes one or more (two in this example) substrate processing apparatuses 100, a recipe generation apparatus 200, and one or more (one in this example) management apparatus 300. . The two substrate processing apparatuses 100, the recipe generation apparatus 200, and the management apparatus 300 are communicably connected to a network 510.

  Each substrate processing apparatus 100 includes a control device 110, one or more processing units 120, one or more inspection units 130, and one or more transfer devices (transfer robots) 140. In FIG. 1, one processing unit 120, one inspection unit 130, and one transfer device 140 are shown as the configuration of the substrate processing apparatus 100.

  The processing unit 120 performs a predetermined processing such as a processing liquid application processing, a temperature adjustment processing, or a development processing on the substrate. The inspection unit 130 is configured to be operable in the pilot mode and the inspection mode.

  The pilot mode is an operation mode for generating an inspection recipe. The inspection unit 130 in the pilot mode acquires, as pilot data, data for determining an inspection condition based on imaging information obtained by imaging the substrate.

  The inspection mode is an operation mode for performing a visual inspection of the substrate after processing by the processing unit 120 based on the inspection recipe. In the appearance inspection of the board, the presence or absence of a defect in the appearance of the board is determined. Details of the configuration and operation of the inspection unit 130 will be described later. The transfer device 140 transfers a substrate between the processing unit 120, the inspection unit 130, and an external device of the substrate processing apparatus 100.

  The control device 110 includes, for example, a CPU (Central Processing Unit) and a memory, or a microcomputer, and controls the operations of the processing unit 120, the inspection unit 130, and the transport device 140. Further, control device 110 gives a command given from management device 300 described later to control unit 90 (FIG. 2) of inspection unit 130. This command includes a command to switch the operation mode of the inspection unit 130.

  The recipe generation device 200 is, for example, a server and includes a CPU and a memory, or a microcomputer. The recipe generation device 200 accumulates pilot data acquired by the inspection unit 130 in the pilot mode. Further, the recipe generation device 200 generates an inspection recipe based on the accumulated pilot data and recipe generation information described later, and provides the generated inspection recipe to the inspection unit 130 that has acquired the pilot data. Details of the configuration and operation of the recipe generation device 200 will be described later.

  The management device 300 is, for example, a personal computer, includes a CPU and a memory, or a microcomputer, and includes a display unit 310 and an operation unit 320. The management device 300 gives recipe generation information to the recipe generation device 200 based on the operation of the operation unit 320 by the user. Further, the management device 300 instructs the inspection unit 130 of the substrate processing apparatus 100 to switch the operation mode based on the operation of the operation unit 320 by the user or the notification of the completion of the creation of the inspection recipe from the recipe generation device 200. Details of the configuration and operation of the management device 300 will be described later.

[2] Configuration of Inspection Unit 130 FIG. 2 is an external perspective view of the inspection unit 130 of FIG. 1, and FIG. 3 is a schematic side view showing an internal configuration of the inspection unit 130 of FIG. As shown in FIG. 2, the inspection unit 130 includes the housing 10, the light projecting unit 20, the reflecting unit 30, the imaging unit 40, the substrate holding device 50, the moving unit 60, the notch detecting unit 70, and the control unit 90.

  A slit-shaped opening 16 for transporting the substrate W is formed on the side of the housing 10. The light projecting unit 20, the reflecting unit 30, the imaging unit 40, the substrate holding device 50, the moving unit 60, and the notch detecting unit 70 are housed in the housing 10.

  The light projecting unit 20 includes, for example, one or a plurality of light sources, and emits strip-shaped light larger than the diameter of the substrate W obliquely downward. The reflection unit 30 includes, for example, a mirror. The imaging unit 40 includes an imaging element in which a plurality of pixels are arranged in a straight line, and one or a plurality of condenser lenses. In this example, a CCD (Charge Coupled Device) line sensor is used as an image sensor. Note that a CMOS (complementary metal oxide semiconductor) line sensor may be used as the image sensor.

  As shown in FIG. 3, the substrate holding device 50 is, for example, a spin chuck, and includes a driving device 51 and a rotation holding unit 52. The drive device 51 is, for example, an electric motor, and has a rotating shaft 51a. The rotation holding unit 52 is attached to the tip of the rotation shaft 51a of the driving device 51, and is rotated around a vertical axis while holding the substrate W to be inspected.

  The moving section 60 includes a pair of guide members 61 (FIG. 2) and a moving holding section 62. The pair of guide members 61 are provided so as to be adjacent to each other and extend in parallel with each other. The direction in which the pair of guide members 61 extend is orthogonal to the direction in which the plurality of pixels of the imaging unit 40 are arranged. The moving holding unit 62 is configured to be movable along the pair of guide members 61 while holding the substrate holding device 50. When the movable holding unit 62 moves along the pair of guide members 61 while the substrate holding device 50 holds the substrate W, the substrate W passes below the light projecting unit 20 and the reflecting unit 30.

  The notch detection unit 70 is, for example, a reflection type photoelectric sensor including a light emitting element and a light receiving element, and emits light toward the outer peripheral portion of the substrate W in a state where the substrate W to be inspected is rotated by the substrate holding device 50. And receives the reflected light from the substrate W. The notch detector 70 detects a notch on the substrate W based on the amount of light received from the substrate W. A transmission type photoelectric sensor may be used as the notch detection unit 70.

  The control unit 90 (FIG. 2) includes, for example, a CPU and a memory, or a microcomputer, and controls the light projecting unit 20, the imaging unit 40, the substrate holding device 50, the moving unit 60, and the notch detecting unit 70. Details of the control unit 90 will be described later.

  The inspection unit 130 performs an imaging operation of the substrate W in each of the pilot mode and the inspection mode. The imaging operation of the substrate W in the inspection mode will be described. The substrate W to be inspected is carried into the housing 10 through the opening 16 and held by the substrate holding device 50. Subsequently, while the substrate W is being rotated by the substrate holding device 50, light is emitted to the peripheral portion of the substrate W by the notch detection unit 70, and the reflected light is received by the notch detection unit 70. Thereby, the notch of the substrate W is detected, and the direction of the substrate W is determined. Thereafter, the rotational position of the substrate W is adjusted by the substrate holding device 50 so that the notch of the substrate W is directed in a fixed direction.

  Next, the substrate W is moved by the moving unit 60 so as to pass below the light projecting unit 20 while the belt-like light is emitted obliquely downward from the light projecting unit 20. The irradiation range of the light from the light projecting unit 20 is larger than the diameter of the substrate W. Thus, the light from the light projecting unit 20 is sequentially applied to the entire surface of the substrate W. The light reflected from the substrate W is further reflected by the reflection unit 30 and guided to the imaging unit 40. The imaging element of the imaging unit 40 sequentially captures a plurality of portions on one surface of the substrate W by receiving light reflected from one surface of the substrate W at a predetermined sampling cycle. Each pixel constituting the image sensor outputs pixel data indicating a value corresponding to the amount of received light. Image data representing an entire image on one surface of the substrate W is generated based on the plurality of pixel data output from the imaging unit 40. Then, the substrate W is returned to the position at the time of loading by the moving unit 60, and the substrate W is carried out of the housing 10 through the opening 16.

  The imaging operation of the substrate W in the pilot mode is the same as the imaging operation of the substrate W in the inspection mode except for the following points. In the pilot mode, after the substrate W is loaded into the housing 10 and the rotational position of the substrate W is adjusted, the brightness (output of light) emitted from the light projecting unit 20 is adjusted.

  Specifically, the moving unit 60 moves the substrate W below the light projecting unit 20 so that the band-like light emitted from the light projecting unit 20 is incident on a linear region passing through the center of the substrate W. . In this state, the light is emitted from the light projecting unit 20 to the substrate W, and the light reflected on one surface of the substrate W is received by the imaging element of the imaging unit 40.

  Therefore, the light of the light projecting unit 20 is set such that a value based on the plurality of pixel data output from the imaging element (for example, a total value or an average value of the plurality of pixel data) approaches a predetermined target value. Brightness is adjusted. This operation is performed in order to obtain image data indicating an appropriate pixel value when imaging the substrate W, that is, to adjust the brightness of the image of the substrate W obtained by imaging to an appropriate brightness.

  Then, the substrate W is moved by the moving unit 60 so as to pass below the light projecting unit 20 while emitting light of the adjusted brightness from the light projecting unit 20. Thereby, the light from the light projecting unit 20 is sequentially applied to the entire surface of the substrate W, and image data representing the entire image on the surface of the substrate W is generated.

  During the imaging operation of the substrate W in the pilot mode, the brightness of the light of the light projecting unit 20 adjusted for each substrate W and the image data generated for each substrate W are examples of the above-described imaging information.

[3] Functional Configuration of Substrate Processing System 500 FIG. 4 is a block diagram showing a functional configuration of the substrate processing system 500 of FIG. FIG. 4 shows a functional configuration of the management device 300 and the recipe generation device 200, as well as a functional configuration of the inspection unit 130 provided in the substrate processing apparatus 100.

  As shown in FIG. 4, management device 300 includes an operation mode command unit 350 and a generation information setting unit 360 as functional units. These functional units are realized by the CPU of the management device 300 executing a computer program stored in the memory. Note that part or all of the above configuration may be realized by hardware such as an electronic circuit.

  In the management apparatus 300, the substrate processing apparatus 100 and the inspection unit 130 for which an inspection recipe is to be generated are specified based on the operation of the operation unit 320 in FIG. 1 by the user. The operation mode command unit 350 gives a command to the designated substrate processing apparatus 100 to switch the designated operation mode of the inspection unit 130 to the pilot mode. Further, the operation mode command unit 350 receives from the recipe generation device 200 a notification of completion of creation of the inspection recipe corresponding to the specified inspection unit 130. In this case, the operation mode instruction unit 350 gives a switching instruction to switch the specified operation mode of the inspection unit 130 to the inspection mode to the specified substrate processing apparatus 100.

  The generation information setting unit 360 provides the recipe generation device 200 with recipe generation information for generating an inspection recipe based on the operation of the operation unit 320 in FIG. 1 by the user. A specific example of the recipe generation information will be described. FIG. 5 is a diagram illustrating an example of the configuration of the recipe generation information. As shown in FIG. 5, the recipe generation information of the present example includes data accumulation conditions, data extraction conditions, and representative generation conditions.

  The data accumulation condition is a condition for accumulating pilot data for generating an inspection recipe in the recipe generation device 200, and includes “end date / time or number of data”, “target substrate processing apparatus”, and “target Inspection unit "and" board information ".

  The “end date and time” is information indicating the date and time when accumulation of the pilot data should be completed after the accumulation of the pilot data is started in order to generate one inspection recipe. “Number of data” is information indicating the number of data to be accumulated as pilot data in order to generate one inspection recipe. “Target substrate processing apparatus” is identification information indicating the substrate processing apparatus 100 for which an inspection recipe is to be generated. “Target inspection unit” is identification information indicating the inspection unit 130 for which an inspection recipe is to be generated. “Substrate information” is information indicating the type and size of a die pattern formed on a substrate W to be inspected using an inspection recipe.

  The data extraction condition is information for extracting appropriate pilot data from a plurality of accumulated pilot data in order to generate one inspection recipe. Here, it is assumed that the plurality of pilot data accumulated according to the data accumulation conditions follow a normal distribution, the average of the plurality of pilot data is μ, and the standard deviation of the plurality of pilot data is σ. In this case, the section of the pilot data to be extracted is, for example, “1σ section from μ−σ to μ + σ”, “2σ section from μ−2σ to μ + 2σ”, or “3σ section from μ−3σ to μ + 3σ”. Either can be specified.

  The representative generation condition is information for generating representative data from a plurality of pilot data extracted based on the data extraction condition, and includes, for example, “average value”, “mode value”, “median value”, “maximum value”. , Or “minimum value”.

  In the substrate processing apparatus 100 of FIG. 4, the control device 110 gives an operation mode switching command given from the management device 300 to the control unit 90 of the inspection unit 130. The control unit 90 of the inspection unit 130 includes, as functional units, a control unit 90, a command reception unit 91, a movement control unit 92, a light adjustment unit 93, a brightness determination unit 94, a pilot data acquisition unit 95, an image data acquisition unit 96, It includes a defect determination unit 97 and an inspection recipe storage unit 98. These functional units are realized by the CPU of the control unit 90 executing a computer program stored in the memory. Note that part or all of the above configuration may be realized by hardware such as an electronic circuit.

  In the control unit 90, the command receiving unit 91 receives a switching command given from the management device 300. Each of the movement control unit 92, the light adjustment unit 93, the brightness determination unit 94, the pilot data acquisition unit 95, and the image data acquisition unit 96 receives an operation mode instructed based on the switching instruction received by the instruction reception unit 91. Perform the operation according to.

  The movement control unit 92 controls the movement unit 60 such that the center of the substrate W is positioned below the light projecting unit 20 when adjusting the brightness of the light projecting unit 20 in the pilot mode. The movement control unit 92 controls the movement unit 60 so that the entire surface of the substrate W moves below the light projecting unit 20 when the image data of the entire surface of the substrate W is generated in the pilot mode and the inspection mode. I do.

  The brightness determination unit 94 determines the brightness of light to be emitted from the light projecting unit 20 based on a plurality of pixel data output from the imaging unit 40 in the pilot mode. Further, in the inspection mode, the brightness determination unit 94 determines the brightness of the light to be emitted from the light projecting unit 20 during the appearance inspection of the substrate W based on the inspection recipe stored in the inspection recipe storage unit 98. The light adjusting unit 93 adjusts the brightness of the light projecting unit 20 so that light is emitted with the brightness determined by the brightness determining unit 94 in the pilot mode and the inspection mode.

  The image data acquisition unit 96 generates image data representing an entire image on one surface of the substrate W based on a plurality of pixel data output from the imaging unit 40 in the pilot mode and the inspection mode.

  The pilot data acquisition unit 95 acquires one or more types of pilot data in the pilot mode. Specifically, the pilot data acquisition unit 95 of the present example acquires, as pilot data, the brightness of the light projecting unit 20 determined for each substrate W by the brightness determination unit 94 in the pilot mode. In the following description, the pilot data of the brightness of the light projecting unit 20 is referred to as first pilot data.

  Further, in the pilot mode, the pilot data acquisition unit 95 of the present example acquires, as pilot data, the image data of the substrate W generated by the image data acquisition unit 96 in the pilot mode. In the following description, the pilot data of the image data is referred to as second pilot data.

  Further, in the pilot mode, the pilot data acquisition unit 95 performs the following processing on the image data of each substrate W generated by the image data acquisition unit 96 in the pilot mode.

  First, for each of a plurality of predetermined target pixels of the generated image data, the pilot data obtaining unit 95 sets a pixel value (a pixel value) between the target pixel and a plurality of pixels in a certain area including the target pixel. Of the pixel data). In the present embodiment, the plurality of target pixels are, for example, all pixels constituting the image data of the substrate W. Note that the plurality of target pixels may be pixels located at the center of the substrate W on which the die pattern is formed, or pixels located near the outer peripheral edge of the substrate W.

  Further, pilot data acquisition section 95 acquires the maximum value and the minimum value of the calculated plurality of difference values as pilot data. In the following description, pilot data indicating the maximum value of the plurality of difference values calculated for each image data is referred to as third pilot data, and pilot data indicating the minimum value of the plurality of difference values is referred to as fourth pilot data. Call.

  The inspection recipe storage unit 98 stores an inspection recipe provided from the recipe generation device 200. The inspection recipe according to the present embodiment includes the brightness of light to be emitted from the light projecting unit 20 during the appearance inspection of the substrate W. This brightness is generated based on a plurality of first pilot data obtained in the pilot mode.

  In addition, the inspection recipe according to the present embodiment includes reference image data used for the appearance inspection of the substrate W. Reference image data is generated based on a plurality of second pilot data obtained in the pilot mode. The reference image data is image data virtually representing image data of the substrate W having no defects in appearance.

  Further, the inspection recipe according to the present embodiment includes determination information for determining whether or not the substrate W to be inspected has a defect during the appearance inspection of the substrate W. The determination information is generated based on a plurality of third and fourth pilot data obtained in the pilot mode.

  In the inspection mode, the defect determination unit 97 determines a defect in the appearance of the substrate W based on the image data of the substrate W to be inspected generated by the image data acquisition unit 96, the reference image data of the inspection recipe, and the determination information. Is determined.

  Specifically, the defect determination unit 97 calculates a difference value between the pixel values of the image data of the substrate W to be inspected and the corresponding pixels of the reference image data. The defect determination unit 97 determines that there is no defect when the difference value is within a predetermined allowable range, and determines that there is a defect when the difference value is outside the predetermined allowable range. Is determined. This allowable range is the above determination information. The upper limit of the allowable range is determined based on the third pilot data, and the lower limit of the allowable range is determined based on the fourth pilot data.

  As shown in FIG. 4, the recipe generation device 200 includes, as functional units, an end determination unit 210, a pilot data accumulation unit 220, a data extraction unit 230, a representative data determination unit 240, an inspection recipe generation unit 250, and a generation information storage unit 260. including. These functional units are realized by the CPU of the recipe generation device 200 executing a computer program stored in the memory. Note that part or all of the above configuration may be realized by hardware such as an electronic circuit.

  The generation information storage unit 260 stores recipe generation information provided from the generation information setting unit 360 of the management device 300. The pilot data storage unit 220 stores a plurality of pilot data (a plurality of first to fourth pilot data in the above example) acquired by the pilot data acquisition unit 95 of the inspection unit 130.

  The termination determination unit 210 determines whether the accumulation of the pilot data should be terminated based on the data accumulation condition of the recipe generation information stored in the generation information storage unit 260. When the termination determination section 210 determines that the accumulation of pilot data should be terminated, the pilot data accumulation section 220 terminates the accumulation of pilot data.

  In this case, the data extraction unit 230 extracts pilot data based on the data extraction conditions for each type of the plurality of acquired pilot data. When image data including a plurality of pixel data is used as pilot data as in the above-described second pilot data, for example, the evaluation value of the image data (for example, the average of the pixel values of all the pixels) Values) are calculated, and then data extraction conditions are determined based on the evaluation values.

  The representative data determination unit 240 determines representative data based on representative generation conditions from the pilot data extracted by the data extraction unit 230 for each type of pilot data. Here, when the representative data based on the plurality of second pilot data is generated, for example, for the pixels corresponding to each other of the extracted plurality of second pilot data, a value according to the representative generation condition (such as an average value or a mode value) Is generated. Image data composed of the generated plurality of pixel data is determined as the representative data. The determined representative data becomes the reference image data.

  The inspection recipe generation unit 250 generates an inspection recipe including the various representative data determined by the representative data determination unit 240. When the inspection recipe is generated, the inspection recipe generation unit 250 gives the generated inspection recipe to the inspection recipe storage unit 98 of the target inspection unit 130. In addition, the inspection recipe generation unit 250 notifies the operation mode instruction unit 350 of the management device 300 of a signal indicating that the generation of the inspection recipe has been completed (notification of completion of generation of the inspection recipe). Therefore, the operation mode instruction unit 350 gives the substrate processing apparatus 100 a switching instruction to switch the operation mode of the inspection unit 130 to the inspection mode so that the appearance inspection is performed using the generated inspection recipe.

[4] Pilot Data Acquisition Process FIG. 6 is a flowchart showing the pilot data acquisition process performed in the control unit 90 of FIG. The process of acquiring pilot data is started, for example, in response to a command to switch to the pilot mode from the management device 300.

  When the process of acquiring pilot data is started, the movement control unit 92 in FIG. 4 performs a process of loading the substrate W (step S11). The loading process of the substrate W by the movement control unit 92 is a process of moving the movable holding unit 62 of FIG. 2 so that the substrate W loaded into the housing 10 of FIG.

  Thereafter, in a state where the substrate W is held by the substrate holding device 50, the pilot data acquiring unit in FIG. 4 acquires one or more types of pilot data predetermined for the substrate W, and Output to the recipe generation device 200 of FIG. 4 (step S12).

  Next, the movement control unit 92 in FIG. 4 performs the unloading process of the substrate W (Step S13). The unloading process of the substrate W by the movement control unit 92 is performed by moving the substrate W held by the substrate holding device 50 in the housing 10 of FIG. This is a process of moving the holding unit 62.

  Thereafter, the command receiving unit 91 of FIG. 4 determines whether or not there is a command to switch to the inspection mode from the management device 300 (Step S14). When receiving a command to switch to the inspection mode, command reception unit 91 switches the operation mode of inspection unit 130 from the pilot mode to the inspection mode, and ends the pilot data acquisition process. On the other hand, when there is no command to switch to the inspection mode, the command receiving unit 91 returns to the process of step S11.

[5] Inspection Recipe Generation Process FIG. 7 is a flowchart showing an inspection recipe generation process performed in the recipe generation device 200 of FIG. In this example, it is assumed that recipe generation information is stored in the generation information storage unit 260 of FIG. 4 in an initial state. The inspection recipe generation process is started when pilot data is input from the substrate processing apparatus 100.

  First, the pilot data storage unit 220 in FIG. 4 stores one or a plurality of input pilot data (step S21). Next, the termination determination unit 210 in FIG. 4 determines whether the accumulation of the pilot data should be terminated based on the data accumulation condition in the recipe generation information (Step S22).

  If the accumulation of the pilot data should not be ended, the pilot data accumulation unit 220 returns to the processing in step S21. On the other hand, when the accumulation of the pilot data is to be ended, the pilot data accumulation unit 220 ends the accumulation of the pilot data (step S23).

  4 extracts pilot data based on the data extraction condition (step S24). Thereafter, the representative data determination unit 240 in FIG. 4 generates representative data based on the representative generation condition and the extracted one or a plurality of pilot data (Step S25).

  Next, the inspection recipe generation unit 250 of FIG. 4 generates an inspection recipe based on the generated representative data (Step S26). In addition, the inspection recipe generation unit 250 gives the generated inspection recipe to the substrate processing apparatus 100, and notifies the management apparatus 300 that the generation of the inspection recipe has been completed (step S27). Thereafter, the inspection recipe generation unit 250 ends the inspection recipe generation processing.

[6] Effects (a) In the above-described substrate processing apparatus 100, the inspection unit 130 operates in, for example, a pilot mode while the processing unit 120 processes the substrate W. In the pilot mode, a plurality of substrates W processed by the inspection unit 130 are imaged, and pilot data is obtained based on a plurality of pieces of imaging information obtained by the imaging. An inspection recipe is generated based on the acquired pilot data.

  Thereafter, the inspection unit 130 is switched from the pilot mode to the inspection mode. In the inspection mode, a plurality of substrates W processed by the inspection unit 130 are imaged, and a plurality of image data are obtained. The inspection of each substrate W is performed based on each of the acquired image data and the generated inspection recipe.

  According to the above configuration, the inspection recipe is created during the processing of the plurality of substrates W by the processing unit 120. Therefore, there is no need to stop the processing of the substrate W to generate the inspection recipe. Further, according to the above configuration, the inspection recipe is generated based on a plurality of pieces of imaging information of a plurality of substrates W. As a result, an appropriate inspection recipe can be obtained as compared to an inspection recipe generated based on one piece of imaging information obtained from one substrate W. Further, according to the above configuration, it is possible to detect a defective board generated in the processing unit 120 when the inspection unit 130 is in the inspection mode. Therefore, by collecting the detected defective substrate, it is possible to reduce unnecessary processing of the defective substrate. As a result, it is possible to inspect the substrate W with high accuracy without lowering the production efficiency of the substrate W.

  (B) Further, according to the above configuration, even when an erroneous detection of a defect is confirmed during the inspection of the plurality of substrates W by the inspection unit 130, for example, the user refers to the recipe generation information set in the past. In addition, new recipe generation information can be generated. When the operation mode of the inspection unit 130 is switched to the pilot mode in a state where new recipe generation information is set in the recipe generation device 200, an appropriate inspection recipe is automatically created. Therefore, the user can easily acquire a more appropriate inspection recipe according to the inspection result.

  (C) In the above-described recipe generation device 200, pilot data is extracted based on data extraction conditions when an inspection recipe is generated. In this case, it is possible to exclude some of the plurality of accumulated pilot data that are inappropriate for generating the inspection recipe.

  Thereafter, representative data is generated from the extracted pilot data based on the representative generation condition. Therefore, since a more appropriate inspection recipe can be obtained based on the representative data, it becomes possible to inspect the substrate with higher accuracy.

  (D) In the above-described recipe generation device 200, when the pilot data necessary for generating the inspection recipe is stored based on the data storage conditions, the inspection recipe is generated based on the stored pilot data.

  By generating the inspection recipe, the movement mode of the inspection unit 130 is switched from the pilot mode to the inspection mode. Thus, after the end of the pilot mode, the inspection of the substrate W based on the generated inspection recipe is started smoothly without requiring a command from the user.

[7] Other Embodiments (a) In the above embodiment, each pixel provided in the imaging element of the imaging unit 40 is an R pixel that receives red light, a G pixel that receives green light, and a blue pixel that receives blue light. May be constituted by B pixels. In this case, in the pilot mode, the above-described third and fourth pilot data may be generated for each type of pixel. Thus, in the inspection recipe, an allowable range used in the appearance inspection can be determined for each type of pixel. Therefore, the inspection of the substrate W can be performed with higher accuracy.

  (B) In the above embodiment, the substrate processing apparatus 100, the recipe generation apparatus 200, and the management apparatus 300 are individually provided, but the present invention is not limited to this. The recipe generation device 200 and the management device 300 may be provided in one substrate processing device 100.

  (C) In the above-described substrate processing apparatus 100, instead of the control unit 90 of the inspection unit 130 being provided with various functional units for obtaining pilot data, the control unit 110 of the substrate processing apparatus 100 obtains pilot data. Various functional units may be provided.

[8] Correspondence between each component of the claims and each element of the embodiment Hereinafter, an example of correspondence between each component of the claims and each element of the embodiment will be described. It is not limited to.

  In the above embodiment, the substrate processing system 500 is an example of a substrate processing apparatus, the management apparatus 300 is an example of a switching apparatus, the recipe generation apparatus 200 is an example of an inspection recipe generation apparatus, and the pilot data acquisition unit 95 is This is an example of a pilot data acquisition unit, the image data acquisition unit is an example of an image data acquisition unit, the defect determination unit 97 is an example of an inspection unit, and the pilot data storage unit 220 is an example of a pilot data storage unit.

  Further, the data extraction unit 230 is an example of a pilot data extraction unit, the representative data determination unit 240 is an example of a representative data generation unit, the inspection recipe generation unit 250 is an example of a recipe generation unit, and the end determination unit 210 is This is an example of the end determination unit, and the brightness of light to be emitted from the light projecting unit 20 during the appearance inspection of the substrate W is an example of the setting information.

  Various other elements having the configuration or function described in the claims may be used as the constituent elements in the claims.

  DESCRIPTION OF SYMBOLS 10 ... housing | casing, 16 ... opening part, 20 ... light-emitting part, 30 ... reflection part, 40 ... imaging part, 50 ... board holding device, 51 ... drive device, 51a ... rotating shaft, 52 ... rotation holding part, 60 ... Moving section, 61 guide member, 62 moving holding section, 70 notch detecting section, 90 control section, 91 command receiving section, 92 moving control section, 93 light adjusting section, 94 brightness determining section, 95: Pilot data acquisition unit, 96: Image data acquisition unit, 97: Defect judgment unit, 98: Inspection recipe storage unit, 100: Substrate processing unit, 110: Control unit, 120: Processing unit, 130: Inspection unit, 140 ... Transfer device, 200: recipe generation device, 210: end determination unit, 220: pilot data storage unit, 230: data extraction unit, 240: representative data determination unit, 250: inspection recipe generation unit, 260: generation information storage unit, 00 ... management apparatus, 310 ... display unit, 320 ... operating unit, 350 ... operation mode instruction unit, 360 ... generation information setting unit, 500 ... substrate processing system, 510 ... network, W ... substrate

Claims (12)

A processing unit for sequentially processing a plurality of substrates;
An inspection unit configured to be operable in a pilot mode and an inspection mode during processing of a substrate by the processing unit;
A switching device for switching an operation mode of the inspection unit,
An inspection recipe generation device that generates an inspection recipe indicating inspection conditions of the substrate,
The inspection unit comprises:
In the pilot mode, a pilot data acquisition unit that acquires data for determining inspection conditions based on a plurality of imaging information obtained by imaging a plurality of substrates processed by the processing unit as pilot data,
In the inspection mode, an image data acquisition unit that acquires a plurality of image data by imaging a plurality of substrates processed by the processing unit,
In the inspection mode, including an inspection unit that inspects each substrate based on each image data acquired by the image data acquisition unit and the inspection recipe generated by the inspection recipe generation device,
The substrate processing apparatus, wherein the inspection recipe generation device generates the inspection recipe based on pilot data acquired by the pilot data acquisition unit. The inspection recipe generation device,
A pilot data storage unit for storing pilot data acquired by the pilot data acquisition unit,
Based on a predetermined extraction condition, a pilot data extraction unit that extracts at least a part of the pilot data among the pilot data stored in the pilot data storage unit,
A representative data generating unit that generates representative data representing the pilot data extracted by the pilot data extracting unit based on a predetermined representative generation condition;
The substrate processing apparatus according to claim 1, further comprising: a recipe generation unit configured to generate the inspection recipe based on the generated representative data. The inspection recipe generation device may further include, after accumulation of pilot data in the pilot data accumulation unit is started based on a predetermined accumulation condition, an end determination unit that determines whether to end the accumulation. Including
The recipe generation unit responds to the determination by the end determination unit that the accumulation should be terminated, based on the pilot data accumulated during a period from the start of the accumulation of the pilot data to the end thereof. Generate an inspection recipe,
The substrate processing apparatus according to claim 2, wherein the switching device switches an operation mode of the inspection unit from the pilot mode to the inspection mode in response to a determination that the accumulation should be terminated by the termination determination unit. The inspection recipe includes reference image data indicating an image serving as a reference for the images of the plurality of substrates processed by the processing unit,
The pilot data acquisition unit, in the pilot mode, acquires image data of a plurality of substrates processed by the processing unit based on the plurality of imaging information as the pilot data,
The inspection recipe generation device, in the pilot mode, generates the reference image data based on pilot data acquired by the pilot data acquisition unit,
The inspection unit, in the inspection mode, inspects a substrate based on each of the image data acquired by the image data acquisition unit and the reference image data generated by the inspection recipe generation device. 4. The substrate processing apparatus according to claim 3. The inspection recipe includes determination information indicating a determination condition for determining the presence or absence of a defect on a plurality of substrates processed by the processing unit,
The pilot data acquisition unit, in the pilot mode, acquires data for determining the determination condition based on the plurality of imaging information as the pilot data,
The inspection recipe generation device, in the pilot mode, generates the determination information based on pilot data acquired by the pilot data acquisition unit,
The inspection unit, in the inspection mode, determines the presence or absence of a defect on a substrate based on each image data acquired by the image data acquisition unit and the determination information generated by the inspection recipe generation device. Item 5. The substrate processing apparatus according to any one of items 1 to 4. The inspection recipe includes setting information on imaging conditions of a plurality of substrates by the image data acquisition unit,
The pilot data acquisition unit, in the pilot mode, acquires data for determining the imaging condition based on the plurality of imaging information as the pilot data,
The inspection recipe generation device, in the pilot mode, generates the setting information based on pilot data acquired by the pilot data acquisition unit,
The image data acquiring unit according to claim 1, wherein in the inspection mode, imaging conditions of a plurality of substrates are set based on the setting information generated by the inspection recipe generation device. Substrate processing equipment. Sequentially processing a plurality of substrates by the processing unit;
Obtaining data as pilot data for determining inspection conditions based on a plurality of pieces of imaging information obtained by imaging a plurality of substrates processed by the processing unit during processing of the substrate by the processing unit; and ,
During processing of the substrate by the processing unit, generating an inspection recipe indicating inspection conditions of the substrate based on the acquired pilot data,
During processing of the substrate by the processing unit and after the generation of the inspection recipe, obtaining a plurality of image data by imaging a plurality of substrates processed by the processing unit,
Performing a test of each substrate based on the acquired image data and the generated inspection recipe during processing of the substrate by the processing unit. Generating the inspection recipe,
Accumulating the obtained pilot data;
Extracting at least a part of the pilot data among the stored pilot data based on a predetermined extraction condition,
Generating representative data representing the extracted pilot data based on a predetermined representative generation condition;
Generating the inspection recipe based on the generated representative data. After the accumulation of the pilot data is started based on a predetermined accumulation condition, the method further includes a step of determining whether to end the accumulation,
The step of generating the inspection recipe includes, in response to the determination that the accumulation should be terminated, determining the inspection recipe based on the pilot data accumulated from the start of the accumulation of the pilot data to the end thereof. Generating a
The substrate processing method,
9. The substrate processing according to claim 7, further comprising a step of ending the acquisition of the pilot data and starting the inspection of the substrate in response to the determination that the accumulation should be terminated when acquiring the pilot data. Method. The inspection recipe includes reference image data indicating an image serving as a reference for the images of the plurality of substrates processed by the processing unit,
The step of acquiring the pilot data includes acquiring image data of a plurality of substrates processed by the processing unit based on the plurality of pieces of imaging information as the pilot data,
The step of generating the inspection recipe includes a step of generating the reference image data based on the obtained pilot data,
The substrate according to any one of claims 7 to 9, wherein the inspecting includes inspecting the substrate based on each of the acquired image data and the generated reference image data. Processing method. The inspection recipe includes determination information indicating a determination condition for determining the presence or absence of a defect on a plurality of substrates processed by the processing unit,
The step of acquiring the pilot data includes acquiring data for determining the determination condition based on the plurality of pieces of imaging information as the pilot data,
The step of generating the inspection recipe includes a step of generating the determination information based on the obtained pilot data,
The method according to any one of claims 7 to 10, wherein the step of performing the inspection includes a step of determining the presence or absence of a defect on a substrate based on each of the obtained image data and the generated determination information. The substrate processing method according to the above. The inspection recipe includes setting information regarding imaging conditions of a plurality of substrates in the step of acquiring the plurality of image data,
The step of obtaining the pilot data includes obtaining data for determining the imaging conditions based on the plurality of pieces of imaging information as the pilot data,
The step of generating the inspection recipe includes a step of generating the setting information based on the obtained pilot data,
The substrate processing method according to any one of claims 7 to 11, wherein acquiring the plurality of image data includes setting imaging conditions of a plurality of substrates based on the generated setting information. .

Images