JP2020098910A - Light-emitting device and integrated light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device capable of wide light distribution and emitting light of various emission colors.
SOLUTION: A base 101 having a conductor wiring 102, a light emitting element 105 mounted on the base and emitting a first light, and provided on an upper surface of the light emitting element, absorbing at least a part of the first light. The wavelength conversion member 106 that emits light having a longer wavelength than the first light, the light reflection film 107 provided on the upper surface of the wavelength conversion member, and the sealing member 110 that covers the light emitting element, the wavelength conversion member, and the light reflection film. And the ratio (H/W) of the height (H) to the width (W) of the sealing member is smaller than 0.5.
[Selection diagram] Figure 1A

Description

The present disclosure relates to a light emitting device and an integrated light emitting device.

In recent years, various electronic components have been proposed and put into practical use, and the performance required for them has been increasing. In particular, electronic components are required to maintain their performance for a long time even under severe operating environments. Such a requirement is not an exception for a light emitting device using a semiconductor light emitting element such as a light emitting diode (LED). That is, in general lighting fields and in-vehicle lighting fields, the performance required of the light emitting device is increasing day by day, and further higher output (higher brightness) and higher reliability are required. Further, it is required for the light emitting device to supply at a low price while maintaining these high performances.
For backlights and general lighting equipment used in LCD TVs, design-made products are considered important, and there are strong demands for thinner products.

For example, Patent Document 1 discloses a light emitting device that realizes a thin backlight by providing a reflector on the upper surface of a light emitting element flip-chip mounted on a submount.

JP, 2008-4948, A

However, the conventional backlight light source has not sufficiently met the demand for thinning.

The embodiment according to the present invention has been made in view of the above circumstances, and an object thereof is to provide a light emitting device that has a wide light distribution and can emit light of various emission colors.

The light emitting device according to the present embodiment includes a base having conductor wiring, a light emitting element mounted on the base to emit a first light, and at least one of the first light provided on an upper surface of the light emitting element. Wavelength converting member that absorbs light having a wavelength longer than that of the first light, a light reflecting film provided on the upper surface of the wavelength converting member, the light emitting element, the wavelength converting member, and a light reflecting film. And a sealing member that covers
The ratio (H/W) of the height (H) to the width (W) of the sealing member is smaller than 0.5.

According to the embodiment of the present invention, it is possible to provide a white light source with a wide light distribution without forming a phosphor sheet on the entire surface of the lamp or using a secondary lens. Accordingly, when the light emitting device according to the present embodiment is applied to a backlight light source, for example, a thin backlight light source can be realized.

It is sectional drawing which shows an example of the light-emitting device of 1st Embodiment. It is sectional drawing which shows an example of the light-emitting device of the modification of 1st Embodiment. It is sectional drawing which shows an example of the light-emitting device of 2nd Embodiment. It is sectional drawing which shows an example of the light-emitting device of 3rd Embodiment. 7 is a graph showing the transmittance of a dielectric multilayer film with respect to the incident angle. It is sectional drawing of the light emitting module 400 of 4th Embodiment. (A) is a top view of the plate-shaped member 410' which can be used for the light emitting module 400 of 4th Embodiment, (b) is an AA sectional view of (a).

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea, and the present invention is not limited to the following unless otherwise specified. In addition, the contents described in one embodiment and example can be applied to other embodiments and examples.
Further, in the following description, the same names and reference numerals indicate the same or similar members, and detailed description thereof will be appropriately omitted. Further, each element constituting the present invention may be configured such that a plurality of elements are configured by the same member and one member also serves as a plurality of elements, or conversely, the function of one member is performed by a plurality of members. It can be shared and realized.

[First Embodiment]
FIG. 1A is a schematic cross-sectional view showing the configuration of the light emitting device (light emitting device 100) of the first embodiment.
As shown in FIG. 1A, the present embodiment includes a base 101 having a conductor wiring 102 provided on the surface thereof, and a light emitting element 105 mounted on the base 101. The light emitting element 105 is flip-chip mounted via the connecting member 103 so as to straddle at least a pair of conductor wirings 102 provided on the surface of the base body 101. A wavelength conversion member 106, which is slightly larger than the light emitting element 105, is provided on the light extraction surface side of the light emitting element 105 (upper surface of the light emitting element 105), and a light reflection film 107 is formed on the light extraction surface side. Specifically, the area of the bottom surface of the wavelength converting member 106 facing the light emitting element 105 is larger than the area of the upper surface of the light emitting element 105, and the outer peripheral edge of the upper surface of the light emitting element 105 is the bottom surface of the wavelength converting member 106. The wavelength conversion member 106 is provided on the light emitting element 105 so as to be located inside the outer peripheral end of the light emitting element 105. The light reflecting film 107 is provided on almost the entire light extraction surface of the wavelength conversion member 106.
Further, the light emitting device 100 of the first embodiment includes a translucent sealing member 110 that covers the light emitting element 105 and the wavelength conversion member 106. An insulating member 104 may be provided on the conductor wiring 102 except at least a region to which the light emitting element 105 is electrically connected. In FIG. 1A, the reference numeral 112 is a light reflecting member provided as necessary, and may be configured as described in a fourth embodiment described later, or may be a side wall of the package. It may be constituted by.

The light reflection film 107 reflects, for example, 70% or more of the total light amount of the light emitted from the light emitting element 105 and the light wavelength-converted by the wavelength conversion member 106.
As a result, of the light emitted from the light emitting element 105 and the wavelength conversion member 106, most of the components in the vertical direction of the base body 101 (the upper surface of the light emitting element 105) are reflected by the light reflection film 107, and the components in the horizontal direction of the base body 101 are reflected. The ingredients increase.
With such a structure, the bat wing light distribution characteristic can be realized.
Here, the bat wing light distribution characteristic means that the first region having a light distribution angle of 90° or less has a first peak having an intensity higher than the intensity when the light distribution angle is 90°, and the light distribution angle is 90°. The above-mentioned light distribution characteristic has a second peak having an intensity larger than the intensity when the light distribution angle is 90° in the second region.

Further, in the light emitting device 100 of the first embodiment, as shown in FIG. 1A, the side surface of the light emitting element 105 is preferably covered with a white member 108 such as white resin. By doing so, almost all the light emitted from the light emitting element 105 passes through the wavelength conversion member 106.
Accordingly, almost all the light emitted from the light emitting device 100 is emitted from the wavelength conversion member 106, and color unevenness due to the orientation angle can be suppressed. When the side surface of the light emitting element 105 is not covered with the white resin, when the light emitting device 100 is observed from a wide orientation angle, the emission color of the light emitting element 105 is directly visible, and the color difference with the wavelength conversion member 106 in the upper stage is conspicuous. I will end up.
The light emitting element 105 and the wavelength conversion member 106 are covered with a translucent sealing member 110. The sealing member 110 protects the light emitting element 105 and the like from the external environment, and at the same time, optically controls the light output from the wavelength conversion member 106 and the like, so that the base member covers the light emitting element 105 and the wavelength conversion member 106. It is a member arranged above. The sealing member 110 is formed in a substantially dome shape, and in this embodiment, the wavelength conversion member 106 is directly covered with the sealing member 110.

The sealing member 110 is preferably formed so that its outer shape is circular or elliptical in a top view, and the height (H) of the sealing member in the optical axis direction is the diameter of the sealing member in a top view. It is formed with a ratio of (width: W) smaller than 0.5. In the case of an elliptical shape, the width has a major axis and a minor axis, but in this specification, the minor axis is the sealing diameter (W). The surface of the sealing member 110 is formed of, for example, a convex curved surface.
With such a configuration, the light emitted from the wavelength conversion member 106 is refracted at the interface between the sealing member 110 and the air, and the light distribution can be made wider.
Here, the height (H) of the sealing member refers to the maximum height from the mounting surface of the light emitting element 105, as shown in FIG. 1A. The width (W) of the sealing member refers to the diameter as described above when the shape of the bottom surface of the sealing member is circular, and is the shortest in the case of other shapes. Shall be pointed out.
In the light emitting device 100 of the first embodiment shown in FIG. 1A, the surface of the sealing member 110 has a convex curved surface, but in order to achieve a wider light distribution, the central portion of the sealing member 110 in the optical axis direction. Is preferably flat or concave. In particular, as shown in FIG. 1B, by making the central portion of the sealing member 110 in the optical axis direction a concave shape, it is possible to reduce the amount of light in the optical axis direction due to the lens effect, and to achieve a wider light distribution bat wing. Orientation can be realized.

Hereinafter, a preferable mode of the light emitting device 100 according to the present embodiment will be described.
(Base 101)
The base body 101 is a member for mounting the light emitting element 105. The base 101 has a conductor wiring 102 on its surface for supplying electric power to the light emitting element 105.
Examples of the material of the base 101 include resins such as ceramics, phenol resin, epoxy resin, polyimide resin, BT resin, polyphthalamide (PPA), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). Above all, it is preferable to select a resin as a material from the viewpoints of low cost and ease of molding. The thickness of the substrate can be appropriately selected, and may be either a flexible substrate that can be manufactured by a roll-to-roll method or a rigid substrate. The rigid substrate may be a bendable thin rigid substrate.

In order to obtain a light emitting device having excellent heat resistance and light resistance, it is preferable to select ceramics as the material of the base body 101. Examples of ceramics include alumina, mullite, forsterite, glass ceramics, nitride-based (for example, AlN), and carbide-based (for example, SiC). Among them, ceramics made of alumina or containing alumina as a main component is preferable.

When a resin is used as the material forming the base 101, glass fibers or an inorganic filler such as SiO ₂ , TiO ₂ , or Al ₂ O ₃ is mixed with the resin to improve the mechanical strength and reduce the coefficient of thermal expansion. It is also possible to improve the light reflectance and the like. The base 101 may be any one that can insulate and separate a pair of conductor wirings 102, and a so-called metal substrate in which an insulating layer is formed on a metal member may be used.

(Conductor wiring 102)
The conductor wiring 102 is a member that is electrically connected to the electrode of the light emitting element 105 and supplies a current (electric power) from the outside. That is, it plays a role as an electrode for energizing from the outside or a part thereof. Usually, it is formed so as to be separated into at least two of positive and negative.

The conductor wiring 102 is formed on at least the upper surface of the base body on which the light emitting element 105 is placed. The material of the conductor wiring 102 can be appropriately selected depending on the material used for the base body 101, the manufacturing method, and the like. For example, when ceramics is used as the material of the base 101, the material of the conductor wiring 102 is preferably a material having a high melting point that can withstand the firing temperature of the ceramic sheet, and for example, a metal having a high melting point such as tungsten or molybdenum. It is preferably used. Further, it may be coated with another metal material such as nickel, gold or silver by plating, sputtering, vapor deposition or the like.

When a glass epoxy resin is used as the material of the base 101, the material of the conductor wiring 102 is preferably a material that can be easily processed. When an injection-molded epoxy resin is used, the material of the conductor wiring 102 is preferably a member that can be easily processed by punching, etching, bending, etc. and has a relatively large mechanical strength. Specific examples thereof include metals such as copper, aluminum, gold, silver, tungsten, iron and nickel, metal layers such as iron-nickel alloy, phosphor bronze, copper containing iron and molybdenum, and lead frames. Further, the surface of the lead frame may be covered with another metal material different from that of the lead frame body. The material is not particularly limited, but may be, for example, only silver, an alloy of silver and copper, gold, aluminum, rhodium, or the like, or a multilayer film using these silver or each alloy. Further, as a method of coating the metal material, a sputtering method, a vapor deposition method, or the like can be used in addition to the plating method.

(Connecting member 103)
The connection member 103 is a member for fixing the light emitting element 105 to the base 101 or the conductor wiring 102. In the case of flip-chip mounting as in this embodiment, a conductive member is used. Specifically, Au-containing alloy, Ag-containing alloy, Pd-containing alloy, In-containing alloy, Pb-Pd-containing alloy, Au-Ga-containing alloy, Au-Sn-containing alloy, Sn-containing alloy, Sn-Cu-containing alloy, Sn- Examples include Cu-Ag-containing alloys, Au-Ge-containing alloys, Au-Si-containing alloys, Al-containing alloys, Cu-In-containing alloys, and mixtures of metals and fluxes.

As the connecting member 103, a liquid, paste, or solid (sheet, block, powder, or wire) material can be used, and can be appropriately selected depending on the composition, the shape of the substrate, and the like. .. Further, these connecting members 103 may be formed of a single member, or may be used in combination of several kinds.

(Insulating member 104)
It is preferable that the conductor wiring 102 is covered with an insulating member 104 except for a portion electrically connected to the light emitting element 105 or another material. That is, as shown in each drawing, a resist for insulatingly covering the conductor wiring 102 may be arranged on the substrate, and the insulating member 104 can function as a resist.

When the insulating member 104 is arranged, not only for the purpose of insulating the conductor wiring 102, but also by containing a white filler, light leakage and absorption are prevented, and the light extraction efficiency of the light emitting device 100 is improved. You can also
The material of the insulating member 104 is a material that absorbs less light from the light emitting element, and is not particularly limited as long as it is insulating. For example, epoxy, silicone, modified silicone, urethane resin, oxetane resin, acrylic, polycarbonate, polyimide or the like can be used.

(Light emitting element 105)
As the light emitting element 105 mounted on the base, a known element can be used. In this embodiment, it is preferable to use a light emitting diode as the light emitting element 105.
The light emitting element 105 can be selected to have an arbitrary wavelength. For example, the blue, the green light emitting element, ZnSe and nitride semiconductor _{(In x Al y Ga 1-} x-y N, 0 ≦ X
, 0≦Y, X+Y≦1), GaP can be used. A transparent sapphire substrate or the like can be used as the growth substrate. Further, GaAlAs, AlInGaP, or the like can be used as the red light emitting element. Furthermore, a semiconductor light emitting element made of a material other than this can also be used. The composition, emission color, size, number and the like of the light emitting element used can be appropriately selected according to the purpose.

Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal thereof. The light emitting element may have positive and negative electrodes on the same surface side or may have positive and negative electrodes on different surfaces so that flip chip mounting is possible.

The light-emitting element 105 of this embodiment has a light-transmitting substrate and a semiconductor layer stacked over the substrate. In this semiconductor layer, an n-type semiconductor layer, an active layer, and a p-type semiconductor layer are sequentially formed, an n-type electrode is formed in the n-type semiconductor layer, and a p-type electrode is formed in the p-type semiconductor layer. ing.

As shown in FIG. 1A and the like, the light emitting element 105 is flip-chip mounted on the conductor wiring 102 on the surface of the base body 101 via the connecting member 103, and the surface facing the surface on which the electrode is formed, that is, the light-transmitting property. The main surface of the substrate serves as the light extraction surface. However, in the present embodiment, since the light reflecting film 107 is formed on this light extraction surface, the side surface of the light emitting element 105 becomes a substantial light extraction surface. That is, a part of the light emitted from the light emitting element 105 and directed to the main surface side of the light emitting element 105 is returned to the inside of the light emitting element 105 by the light reflection film 107, and is repeatedly reflected inside the light emitting element 105 to emit light. The light is emitted from the side surface side of the element 105. Therefore, the light distribution characteristic of the light emitting device 100 (see the dotted line in FIG. 4) is a combination of the light transmitted through the light reflection film 107 and the light emitted from the side surface of the light emitting element 105.

The light emitting element 105 is arranged so as to straddle the two conductor wirings 102 that are positively and negatively insulated and separated, is electrically connected by a conductive connecting member 103, and is mechanically fixed. The mounting method of the light emitting element 105 may be a mounting method using a solder paste or a mounting method using bumps, for example. Further, as the light emitting element 105, a small packaged product in which the light emitting element is sealed with resin or the like can be used, and the shape and structure are not particularly limited.

As described later, when a light emitting device having a wavelength conversion member, its efficiency wavelength conversion member 106 may excitation can short wavelength capable of emitting nitride semiconductor _{(In x Al y Ga 1-} x-y N , 0≦X, 0≦Y, and X+Y≦1) are preferable.

Although an example of flip-chip mounting has been described, a mounting mode may be used in which the insulating substrate side of the light emitting element is used as the mounting surface and the electrodes and wires formed on the upper surface of the light emitting element are connected. In this case, the upper surface of the light emitting element is on the electrode formation surface side, and the reflection film is provided on the electrode formation surface side.

(Light reflection film 107)
The light reflection film 107 is formed on the light extraction surface side which is the main surface of the wavelength conversion member 106.
The material may be a metal or a resin containing a white filler, and is particularly a material that reflects at least the light emitted from the light emitting element 105 (first light) and the light emitted from the wavelength conversion member 106 (second light). Material is not specified.
Further, by using the dielectric multilayer film, it is possible to obtain a reflective film with little absorption.
As the material of the dielectric multilayer film, a metal oxide film material, a metal nitride film, an oxynitride film, or the like can be used. Further, an organic material such as silicone resin or fluororesin can be used, and the material is not particularly specified.

Further, the dielectric multilayer film has a high reflectance with respect to the light in the reflection band with respect to the light vertically incident on the dielectric multilayer film as shown in FIG. 4, and the transmittance becomes high as the incident angle becomes large. It has a reflection characteristic that depends on various incident angles. Therefore, in the light emitting device of the first embodiment, when the dielectric multilayer film is used as the light reflection film 107, the light emitted from the side surface of the wavelength conversion member 106 is larger than the upper surface of the light reflection film 107 with respect to the optical axis. Since the light emitted at an angle is added, it becomes possible to emit stronger light laterally from the light emitting device 100. This makes it possible to realize a bat wing light distribution characteristic in which the proportion of light emitted in the lateral direction from the light emitting device 100 is higher (more emphasized) than that of light emitted in the vertical direction. Here, in the present specification, the optical axis means an axis perpendicular to the light emitting surface of the light emitting element 105. In addition, the dielectric multi-layered film can be formed by changing the reflection characteristics (reflectance for vertically incident light and incident angle dependence of the reflectivity, etc.) of the material and the number of laminated dielectric films. It is possible to adjust. Therefore, in the light emitting device of the first embodiment, when the dielectric multilayer film is used as the light reflection film 107, the reflection characteristics of the dielectric multilayer film can be designed according to the light distribution characteristics required for the light emitting device. Therefore, it is possible to easily realize a desired light distribution characteristic.

(Wavelength conversion member 106)
The wavelength conversion member 106 is a member that absorbs at least a part of the first light emitted by the light emitting element 105 and emits light having a wavelength longer than that of the first light. For example, a phosphor and a translucent material are used. It is a plate-like or sheet-like member including.
As the translucent material, an inorganic material such as translucent resin or glass can be used. As the translucent resin, a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin or a phenol resin, a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin or a polynorbornene resin can be used. As the translucent resin, a silicone resin having excellent light resistance and heat resistance is particularly preferable. Examples of the inorganic material include borosilicate glass, quartz glass, sapphire glass, calcium fluoride glass, aluminoborosilicate glass, oxynitride glass, chalcogenide glass and the like.

The phosphor that can be excited by the light emitted from the light emitting element 105 is used. For example, as a phosphor that can be excited by a blue light emitting element or an ultraviolet light emitting element, a cerium-activated yttrium-aluminum-garnet-based phosphor (Ce:YAG); a cerium-activated lutetium-aluminum-garnet-based phosphor (Ce: LAG); europium and / or activated nitrogen containing calcium aluminosilicate phosphor chromium _{(CaO-Al 2 O 3 -SiO} 2); europium-activated silicates based phosphor ((Sr, Ba) ₂ SiO ₄ ); β-sialon phosphor, nitride phosphor such as CASN phosphor, SCASN phosphor; KSF phosphor (K ₂ SiF ₆ :Mn); sulfide phosphor, quantum dot phosphor And so on. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, a light emitting device of various colors (for example, a white light emitting device) can be manufactured.

In the wavelength conversion member 106, a quantum dot, an organic fluorescent material, an organic phosphorescent material, or the like may be used instead of the above phosphor.
Further, the phosphor materials and the like may be used alone or in combination.

(Sealing member 110)
As a material of the sealing member 110, an epoxy resin, a silicone resin, a resin obtained by mixing them, or a translucent material such as glass can be used. Of these, it is preferable to select a silicone resin in consideration of light resistance and ease of molding.

The sealing member 110 may contain a colorant in addition to the light diffusing material.
When the sealing member 110 contains these members, it is preferable to use a material that does not affect the light distribution characteristics as much as possible. For example, if the particle diameter of the contained member is 0.2 μm or less, the influence on the light distribution characteristics is small, which is preferable. In the present specification, the particle size refers to the average particle size, and the value of the average particle size is F.S. S. S. S. No (Fisher-SubSieve-Sizers-No.).

The sealing member 110 can be formed by compression molding or injection molding so as to cover the light emitting element 105 and the wavelength conversion member 106. In addition, it is also possible to optimize the viscosity of the material of the sealing member 110 and drop or draw on the wavelength conversion member 106 to control the shape by the surface tension of the material itself.

In the case of the latter forming method, the sealing member can be formed by a simpler method without using a mold. Further, as a means for adjusting the viscosity of the material of the sealing member by such a forming method, in addition to the original viscosity of the material, a desired viscosity using the light diffusing material, the wavelength converting member, and the colorant as described above. It can also be adjusted to.

[Second Embodiment]
FIG. 2 is a cross-sectional view of the light emitting device 200 of the second embodiment.
The light emitting device 200 of the second embodiment is different from that of the first embodiment in that the translucent member 109 is formed in a reverse taper shape on the side surface of the light emitting element 105 and the white member 108 is formed on the outer side thereof. Except for this, other configurations are the same as those in the first embodiment.
The points different from the first embodiment will be described below.

As described with respect to the light emitting device of the first embodiment, the area of the bottom surface of the wavelength conversion member 106 facing the light emitting element 105 is larger than the area of the upper surface of the light emitting element 105, and the outer circumference of the upper surface of the light emitting element 105. The wavelength converting member 106 is provided on the light emitting element 105 so that the end is located inside the outer peripheral edge of the bottom surface of the wavelength converting member 106. In the present specification and the following description, a portion of the bottom surface of the wavelength conversion member 106 that faces directly above the top surface of the light emitting element 105 is referred to as an inner bottom surface. The portion located outside the inner bottom surface is called the outer peripheral bottom surface.

The light emitting device 200 of the second embodiment has a translucent member 109 that covers the side surface of the light emitting element under the outer peripheral bottom surface. The surface of the translucent member 109 is an inclined surface that is inclined so as to approach the side surface of the light emitting element 105 as the distance from the wavelength conversion member 106 increases.

In the light emitting device 200 of the second embodiment having the translucent member 109 configured as described above, the light emitted from the side surface of the light emitting element 105 is reflected by the inclined surface of the translucent member 109, and the wavelength is efficiently converted. The light can be incident on the member 106, and the luminous efficiency is improved.
The translucent member 109 may be formed also at the interface between the light emitting element 105 and the wavelength conversion member 106 so as to function as an adhesive.

In the light emitting device 200 of the second embodiment, a member having a lower refractive index than the translucent member 109 may be formed outside the translucent member 109 instead of the white member 108, or the white member 108. A member having a lower refractive index than the transparent member 109 may be formed between the transparent member 109 and the transparent member 109. The member having a lower refractive index than the translucent member 109 includes, for example, a translucent member having a lower refractive index than the translucent member 109 and a white resin having a lower refractive index than the translucent member 109.
Here, the translucent member 109 can be formed of a translucent material such as translucent resin or glass. The light-transmitting resin is preferably a thermosetting light-transmitting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin. Since the translucent member 109 is in contact with the side surface of the light emitting element 105, it is easily affected by the heat generated in the light emitting element 105 during lighting. Since the thermosetting resin has excellent heat resistance, it is suitable for the translucent member 109. It is preferable that the translucent member 109 has a high light transmittance. Therefore, normally, it is preferable that no additive that reflects, absorbs, or scatters light is added to the translucent member 109. However, it may be preferable to add an additive to the translucent member 109 in order to impart desired characteristics. For example, various fillers may be added to adjust the refractive index of the transparent member 109 or to adjust the viscosity of the transparent member before curing.

[Third Embodiment]
FIG. 3 is a sectional view of a light emitting device 300 according to the third embodiment.
The light emitting device 300 of the third embodiment is different from that of the second embodiment in that an oil repellent material 111 is formed on the outer peripheral bottom surface of the lower surface of the wavelength conversion member 106, and other configurations are similar to those of the second embodiment.
The points different from the second embodiment will be described below.

In the light emitting device 300 of the third embodiment, the oil repellent material 111 is formed along the outer periphery of the outer peripheral bottom surface at a predetermined distance x from the inner bottom surface of the wavelength conversion member 106, and the oil repellent material 111 is formed on the outer peripheral bottom surface. A translucent member 109 that covers the side surface of the light emitting element 105 is provided below the outer peripheral bottom surface excluding the exposed portion. The surface of the translucent member 109 is an inclined surface that is inclined so as to approach the side surface of the light emitting element 105 as the distance from the wavelength conversion member 106 increases. As can be understood from the above description, the interval x between the inner peripheral edge of the oil repellent material 111 and the inner bottom surface of the wavelength conversion member 106 is such that the translucent member 109 having a desired cross-sectional shape is formed. Is set.

By providing the oil repellent material 111 configured as described above in the light emitting device 300 of the third embodiment, it is possible to prevent the white member 108 from climbing up to the side surface of the wavelength conversion member 106, and the alignment characteristics vary. Can be reduced.
In addition, when the translucent member 109 is used as an adhesive between the light emitting element 105 and the wavelength conversion member 106, the spread of the translucent member 109 is suppressed and the light emitting element 105 is aligned with the center of the wavelength conversion member 106. In addition, it is possible to reduce the variation in shape when the translucent member 109 is formed in the reverse taper shape.
The oil repellent material is not particularly limited, but a fluorine-based material or the like can be used.

According to the light emitting devices of the above first to third embodiments, it is possible to provide a light emitting device having a wide light distribution.
Further, in the light emitting device of the first to third embodiments, various combinations of phosphors contained in the light emitting element 105 and the wavelength conversion member 106 can provide a light emitting device capable of emitting various emission colors. ..
Therefore, according to the light emitting devices of the first to third embodiments, it is possible to provide a light emitting device that can emit light of various emission colors with a wide light distribution.

[Fourth Embodiment]
FIG. 5: is sectional drawing of the light emitting module 400 of 4th Embodiment.
In the light emitting module 400 of the fourth embodiment, a plurality of light emitting devices 100 configured as in the first embodiment are provided on a base 401, and a light reflecting member 410 is arranged between the light emitting devices 100 to form an integrated light emitting device. It is a device. A light diffusion plate 411 for diffusing light from the light emitting element 105 is arranged above the light emitting device 100 and the light reflecting member 410 so as to be substantially parallel to the upper surface of the light emitting element 105.

In the conventional integrated light emitting device, in general, the surface of the light diffusion plate 411 becomes smaller as the distance between the substrate and the light diffusion plate (hereinafter also referred to as optical distance: OD)/light emitting element interval (hereinafter also referred to as Pitch) becomes smaller. Above this, the amount of light between the light emitting elements 105 decreases and a dark portion is generated.
However, the light emitting module 400 of the fourth embodiment includes the plurality of light emitting devices 100 having the bat wing light distribution characteristics and the light reflecting member 410 arranged between the adjacent light emitting devices 100, and thus the light amount between the light emitting elements is increased. Since the light can be compensated by the reflected light from the light reflecting member 410, the uneven brightness on the surface of the light diffusion plate 411 can be reduced even with a smaller OD/Pitch.

In the light-emitting module 400 of the fourth embodiment, the light-reflecting surface of the light-reflecting member 410 is inclined with respect to the base 401, and the inclination angle? It is set so that the uneven brightness on the surface of the plate 411 is reduced. Further, the light distribution characteristics of the plurality of light emitting devices 100 arranged are defined by the direction perpendicular to the light emitting surface of the light emitting element in order to suppress the uneven brightness on the surface of the light diffusion plate 411 and realize the thin light emitting module 400. It is preferable to have a light distribution characteristic such that the amount of light becomes large in a region where the angle formed with the optical axis is large.

For example, when OD/Pitch is reduced to 0.2 or less, the light incident on the light reflecting member 410 is less than 22° in elevation angle with respect to the light emitting surface of the light emitting element 105. Therefore, when the low OD/Pitch is 0.2 or less, the light distribution characteristic of the light emitting device 100 is, for example, a light amount of an elevation angle of less than 20° with respect to the upper surface of the base in order to improve the reflection efficiency of light by the light reflection member 410. Is preferably increased. Specifically, it is preferable that the first and second peaks of the emission intensity are located within the range where the elevation angle is less than 20°. In other words, the light distribution characteristics of the light emitting device 100 are such that, when the light distribution angle of the base body 401 in the vertical direction is 90°, the first peak in the range of 90° to 0° is less than 20°. It is preferable that the second peak in the range of 90° to 180° is larger than the range of 160°. Further, the amount of light having a light distribution angle of less than 20° is preferably 30% or more, and more preferably 40% or more of the total amount of light.

(Light reflection member 410)
The light reflecting member 410 is installed between the adjacent light emitting devices 100 as described above.
The material is not particularly limited as long as it is a material that reflects at least light from the light emitting device 100. For example, a metal plate or a resin containing white filler can be preferably used.
Further, by using a dielectric multilayer film as the reflecting surface of the light reflecting member, it is possible to obtain a reflecting surface with little absorption. In addition, the reflectance can be arbitrarily adjusted by designing the film, and the reflectance can be controlled by the angle.

The height of the light reflecting member 410 and the inclination angle θ of the light reflecting surface with respect to the surface of the substrate 401 can take arbitrary values, and the reflecting surface may be a flat surface or a curved surface. It is possible to set the optimum inclination angle θ and the shape of the reflection surface so that the uneven brightness is reduced on the surface of the light diffusion plate 411. The height of the light reflecting member 410 is preferably 0.3 times or less, more preferably 0.2 times or less, the distance (Pitch) between the light emitting elements, which makes the light emission thin and reducing uneven brightness. A module 400 can be provided.

In addition, in the light emitting module 400 used in an environment where the operating temperature changes greatly, it is preferable that the light reflecting member 410 and the base 401 have similar linear expansion coefficients. If the linear expansion coefficient between the light reflecting member 410 and the base 401 is significantly different, the light emitting module 400 may be warped due to a temperature change, or the positional relationship between the constituent members, particularly the light emitting device 100 and the light reflecting member 410 may be displaced. This is because desired optical characteristics cannot be obtained. Further, the light reflection member 410 may be formed of a film molded product obtained by bending an elastically deformable film so that the entire light emitting module 400 does not warp even if the linear expansion coefficient is different. When the light reflection member 410 is formed of a film molded product, the deformation due to the difference in thermal expansion coefficient can be dispersed and absorbed in each portion, and the light emitting module 400 as a whole can be prevented from warping.

Further, the light reflecting members 410 are not individually molded or produced, but as shown in FIGS. 6A and 6B, a plurality of light reflecting members 410 are integrally molded to form one plate. It may be configured as a strip-shaped member 410'. 6A is a top view of the plate-shaped member 410', and FIG. 6B is a cross-sectional view taken along the line AA of FIG. 6A. The plate-shaped member 410 ′ has, for example, a plurality of through holes 413 corresponding to the positions where the light emitting device 100 is provided, and the light reflection member 410 is arranged around each of the through holes 413. As a result, when the plate member 410 ′ is placed on the base 401, a light reflecting surface having an inclination angle θ with respect to the surface of the base 401 is formed around the through hole 413. The light emitting device 100 may be mounted in the through hole 413 after the plate-shaped member 410 ′ is bonded on the base 401, or after the light emitting device 100 is mounted at a predetermined position on the base 401, each light emission is performed. The plate-shaped members 410 ′ may be bonded onto the base 401 so that the devices 100 are located in the corresponding through holes 413.

The plate member 410' can be formed by die molding, vacuum molding, pressure molding, press molding, or the like. Further, the light reflecting member 410 may be formed by a method of directly drawing a light reflecting resin on the base 401 instead of the plate member 410 ′. The height of the light reflecting member 410 is preferably 0.3 times or less the distance between the light emitting elements, and more preferably 0.2 times or less the distance between the light emitting elements.

The light emitting module 400 of the fourth embodiment configured as described above includes a plurality of light emitting devices 100 having a wide light distribution batwing light distribution characteristic and a light reflecting member 410 provided between adjacent light emitting devices 100. Since it is provided, a thin optical module for a backlight can be provided.

The light emitting module 400 of the fourth embodiment configured as described above is provided on the upper surface or the lower surface of the light diffusing plate 411 in the conventional light emitting module because each light emitting device 100 includes the wavelength conversion member 106. An optical module for a white backlight can be realized without providing a phosphor sheet. As a result, the amount of expensive phosphor used can be reduced, and a light emitting module for a backlight can be provided at low cost.

In the above description of the light emitting module 400 of the fourth embodiment, an example using the light emitting device 100 of the first embodiment has been described, but the light emitting device 200 of the second embodiment and the light emitting device 300 of the third embodiment are included. You may comprise using the light-emitting device of other wide light distribution.

INDUSTRIAL APPLICABILITY The light emitting device and the light emitting module of the present invention can be used for a backlight light source of a liquid crystal display, various lighting fixtures, and the like.

100, 200, 300 Light emitting device 101 Base body 102 Conductor wiring 103 Connection member 104 Insulation member 105 Light emitting element 106 Wavelength conversion member 107 Light reflection film 108 White member 109 Light transmissive member 110 Sealing member 111 Oil repellent material

Claims (15)

A base body having conductor wiring,
A light-emitting element mounted on the base and emitting a first light;
A wavelength conversion member which is provided on the upper surface of the light emitting element and absorbs at least a part of the first light to emit light having a longer wavelength than the first light;
A light reflection film provided on the upper surface of the wavelength conversion member,
A sealing member that covers the light emitting element, the wavelength conversion member, and a light reflection film,
A light emitting device in which the ratio (H/W) of the height (H) to the width (W) of the sealing member is smaller than 0.5. The light emitting device according to claim 1, wherein the surface of the sealing member is formed by a convex curved surface. The light emitting device according to claim 1, wherein the light reflecting film is formed of a dielectric multilayer film. The light emitting device according to claim 1, further comprising a white member that covers a side surface of the light emitting element. The area of the bottom surface of the wavelength conversion member on the light emitting element side is larger than the area of the top surface of the light emitting element, and the bottom surface of the wavelength conversion member on the light emitting element side is an inner bottom surface facing the top surface of the light emitting element. Has an outer peripheral bottom surface surrounding the inner bottom surface,
The light emitting device has a translucent member that covers a side surface of the light emitting element under the outer peripheral bottom surface, and a surface of the translucent member approaches a side surface of the light emitting element as the distance from the wavelength conversion member increases. The light emitting device according to any one of claims 1 to 3, wherein the light emitting device has an inclined surface. The light emitting device according to claim 5, further comprising a white member that covers the inclined surface. The light emitting device according to claim 5, further comprising a member that covers the inclined surface and has a lower refractive index than the translucent member. The light emitting device according to any one of claims 4 to 7, wherein an oil repellent material is formed along the outer periphery of the bottom surface of the wavelength conversion member. The light emitting device according to claim 1, wherein 30% or more of the total amount of light emitted by the light emitting device is emitted in a direction of an elevation angle of less than 20° with respect to the upper surface of the base. The light emitting device according to claim 1, wherein 40% or more of the total amount of light emitted by the light emitting device is emitted in a direction with an elevation angle of less than 20° with respect to the upper surface of the base. The light emitting device according to claim 1, wherein a ratio (H/W) of the height (H) to the width (W) of the sealing member is 0.3 or less. The light emitting device according to claim 1, wherein the light emitting element is flip-chip mounted. An integrated light emitting device comprising a plurality of the light emitting devices according to claim 1, wherein light reflecting members are arranged between the light emitting devices. 14. The integrated light emitting device according to claim 13, wherein the height of the light reflecting member is 0.3 times or less the distance between the light emitting devices. The integrated light emitting device according to claim 13, wherein the height of the light reflecting member is 0.2 times or less the distance between the light emitting devices.

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