JP2020098285A - Determination method, exposure method, exposure apparatus and method for manufacturing article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of determining a correction amount for alignment of two shot areas, which is advantageous in achieving both overlay accuracy of upper and lower layers and joint accuracy of adjacent shots. SOLUTION: A first position shift amount which is a position shift amount between overlay marks for overlaying upper and lower layers is obtained, and a connection position for aligning a first shot area and a second shot area. The second positional deviation amount, which is the positional deviation amount between the measurement marks, is obtained (S102), and the positional deviation amount obtained by adding a predetermined ratio of the second positional deviation amount to the first positional deviation amount is the first positional deviation amount. It is determined as the correction amount of the first image in the joint region where the shot region and the second shot region overlap, and the remaining ratio of the first position shift amount to the predetermined ratio of the second position shift amount is determined. The positional deviation amount obtained by the subtraction is determined as the correction amount of the second image in the joint area (S103). [Selection diagram] Fig. 3

Description

The present invention relates to a determination method, an exposure method, an exposure apparatus, and an article manufacturing method.

Semiconductors, liquid crystal panels, etc. are manufactured by a photolithography process. In the photolithography process, a scanning exposure apparatus is used which projects a pattern of an original plate (mask) onto a substrate (glass substrate or wafer) coated with a photosensitizer through a projection optical system while scanning the exposure area. There is. In recent years, a display such as a liquid crystal panel has been increased in size, and it is necessary to expose a glass substrate, for example, which exceeds 2 m square. In order to cope with such a large size of the substrate, the exposure region on the substrate is not exposed at once, but the exposure region on the substrate is divided into several shot regions for exposure. At this time, joint exposure is performed in which a part of the adjacent shot areas are overlapped and exposed.

In the joint exposure, if the overlay (overlay) error in the area where the adjacent shot areas overlap (joint area) becomes large, unevenness occurs in the joint area. Japanese Patent Application Laid-Open No. 2004-242242 discloses a correction amount for reducing the amount of misalignment, which is specialized for either the amount of misalignment between upper and lower layers or the amount of misalignment between adjacent shots in the joint area, and the correction amount The technique of using and exposing is disclosed. In addition, Patent Document 2 discloses a technique of correcting a shot position with a plurality of shots forming one device as one unit. The shot position is corrected so that the difference in overlay accuracy at the joining portion of a plurality of shots forming one device is minimized.

JP, 07-321026, A JP, 09-306818, A

When performing joint exposure, the positional deviation between adjacent shots is the most important index that determines the performance of the manufactured device. Nevertheless, in the conventional correction, only the amount of misalignment between the upper and lower layers is corrected and the misalignment between adjacent shots is not taken into consideration. The position shift of was not taken into consideration. On the other hand, a method (joint priority correction) for preferentially correcting the positional deviation between adjacent shots has also been proposed. According to this method, although the effect of correcting the positional deviation between the upper and lower layers is weakened, the accuracy required for the joint exposure up to now has been satisfied.

However, with the increase in the size of the substrate and the miniaturization of the pattern, there is an increasing demand for simultaneously guaranteeing both the overlay accuracy of the upper and lower layers and the connection accuracy of adjacent shots with high accuracy. That is, there is a demand for a method of correcting the displacement of upper and lower layers and the displacement of adjacent shots with high accuracy.

It is an object of the present invention to provide a joint exposure technique that is advantageous in achieving both the overlay accuracy of upper and lower layers and the joint accuracy of adjacent shots.

According to an aspect of the present invention, a first shot area of a substrate is exposed to form a first image, and a second shot area overlapping a part of the first shot area is exposed to a second image. Determining a correction amount for alignment of the first shot area and the second shot area for joint exposure to obtain an image obtained by joining the first image and the second image. A method for obtaining a first positional deviation amount, which is an amount of positional deviation between overlay marks for superposing upper and lower layers, and performing the positional alignment between the first shot area and the second shot area. The second positional deviation amount, which is the positional deviation amount between the joint position measurement marks, is obtained, and the positional deviation amount obtained by adding a predetermined ratio of the second positional deviation amount to the first positional deviation amount is defined as the first positional deviation amount. It is determined as the correction amount of the first image in the joint region where the one-shot region and the second shot region overlap, and the remaining ratio from the first positional deviation amount to the predetermined ratio of the second positional deviation amount. There is provided a determination method, characterized in that the amount of positional deviation obtained by subtracting is determined as the correction amount of the second image in the joint region.

According to the present invention, it is possible to provide a joint exposure technique that is advantageous in achieving both the overlay accuracy of upper and lower layers and the joint accuracy of adjacent shots.

FIG. 3 is a diagram showing a configuration of an exposure apparatus in the embodiment. The figure which shows the example of illuminance distribution at the time of joint exposure. 6 is a flowchart of processing for determining a correction amount and exposure processing. The figure which shows the example of the mark arrangement|positioning of the shot S1. The figure which shows the example of the mark arrangement|positioning of the shot S2. FIG. 5 is a diagram showing an example of an overlay mark and a joint position measurement mark in a joint area. The figure which shows the example of a connection position measurement mark. FIG. 6 is a diagram showing an example of virtual marks set in a connecting area. FIG. 6 is a diagram showing an example of virtual marks set in a connecting area.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<First Embodiment>
FIG. 1 shows a schematic configuration of the exposure apparatus in the embodiment. This exposure apparatus is, for example, a scanning type exposure apparatus that adopts a mirror projection method using a projection optical system. In this specification and the drawings, the directions are shown in an XYZ coordinate system in which the direction parallel to the substrate holding surface of the substrate stage is the XY plane. The directions parallel to the X axis, the Y axis, and the Z axis in the XYZ coordinate system are called the X direction, the Y direction, and the Z direction, respectively. Further, the scanning direction of the original plate and the substrate during exposure is set to the Y direction.

The exposure apparatus includes an original stage 31 on which an original 30 (mask) is mounted, a substrate stage 61 on which a substrate 60 (for example, a glass plate) is mounted, an illumination optical system 10 for illuminating the original 30, and a pattern of the original 30 on the substrate 60. Projection optical system 40 for projecting onto The original plate 30 and the substrate 60 are arranged at positions that are substantially conjugate with each other via the projection optical system 40 (the object plane and the image plane of the projection optical system 40). Between the illumination optical system 10 and the original stage 31, a slit imaging system 20 that shapes the exposure light is arranged. Further, when the substrate 60 is subjected to scanning exposure, the X light shielding plate 50 for sequentially exposing the images of the pattern of the original plate 30 on different regions of the surface of the substrate 60 by superposing them partially on each other is provided with the projection optical system 40 and the substrate. It is arranged between the stage 61 and the stage 61. The control unit 70 controls driving of each unit of the exposure apparatus.

The illumination optical system 10 may include a light source unit such as an ultra-high pressure mercury lamp, a wavelength selection filter, a lens group, and a shutter. The illumination optical system 10 irradiates the slit imaging system 20 with light having a wavelength suitable for exposure. The slit imaging system 20 has a slit (not shown), and shapes the incident light from the illumination optical system 10 into an exposure width that satisfies a necessary exposure amount at a constant stage scanning speed (for example, an upper limit value of the scanning speed). ..

The original stage 31 carrying the original 30 is scanned in the Y direction by a drive mechanism (not shown) under the control of the control unit 70. A plurality of reflecting mirrors 32 are arranged on the original stage 31. Each of the plurality of reflecting mirrors 32 reflects the measurement light from the interferometer 33 arranged outside the original stage 31. The interferometer 33 receives the reflected measurement light and constantly monitors and measures the position of the original stage 31. The control unit 70 controls the position and speed of the original stage 31 based on the measurement result of the interferometer 33.

The projection optical system 40 has a mirror and a lens, and reflects and refracts the exposure light to project the pattern formed on the original plate 30 onto the substrate 60. Further, the mirror and the lens are driven in the X, Y, and Z directions by a drive mechanism (not shown) under the control of the control unit 70 to generate an arbitrary magnification and shift.

In the exposure apparatus according to the present embodiment, the first shot area of the substrate is exposed to form a first image, and the second shot area overlapping a part of the first shot area is exposed to form a second image. Then, joint exposure is performed to obtain an image obtained by joining the first image and the second image. The exposure apparatus is provided with an X light shielding plate 50 for performing the joint exposure. In the following description, the “shot area” is also simply referred to as “shot”. The X light blocking plate 50 can be driven in the Y direction by a drive mechanism (not shown) under the control of the control unit 70. By moving the X light blocking plate 50 horizontally in the exposure light path to change the position at which the exposure light is blocked, the exposure light shaped by the slit imaging system 20 is blocked obliquely with respect to the scanning direction. The exposure amount integrated on the substrate is controlled. This makes it possible to control the joint exposure for the joint shot layout as shown in FIG. That is, as shown in FIG. 2B, the illuminance distribution in the non-joint area, which is an area outside the joint area in the shot S1 (first shot area), is set to 100%, and the illuminance distribution at each X position in the joint area is negative. And the inclination of. For example, the exposure amount (illuminance) is linearly attenuated from 100% to 0% from one end to the other end in the X direction of the joint region. Further, as shown in FIG. 2C, the illuminance distribution in the non-joint area of the shot S2 (second shot area) is 100%, and the illuminance distribution at each X position in the join area has a positive slope. For example, the exposure amount is linearly increased from 0% to 100% from one end to the other end in the X direction of the joint region. In this way, the exposure amount in the joint region is cross-faded between when the shot S1 is exposed and when the shot S2 is exposed. As a result, as shown in FIG. 2D, the integrated illuminance distribution for the joint region and the non-joint region is leveled at 100%.

The substrate stage 61 on which the substrate 60 is mounted is scanned in the X, Y, and Z directions by a drive mechanism (not shown) under the control of the control unit 70. A plurality of reflecting mirrors 62 are arranged on the substrate stage 61. Each of the plurality of reflecting mirrors 62 reflects the measurement light from the interferometer 63 arranged outside the substrate stage 61. The interferometer 63 receives the reflected measurement light and constantly monitors and measures the position of the substrate stage 61. The control unit 70 controls the position and speed of the substrate stage 61 based on the measurement result of the interferometer 63.

The alignment scope 80 detects the alignment mark on the substrate 60 via the original plate 30 and the projection optical system 40. On the other hand, the off-axis scope 81 is arranged below the projection optical system 40, and detects the alignment mark on the substrate 60 without going through the original plate 30 and the projection optical system 40.

The control unit 70 functions as a processing unit that performs a process of determining a correction amount related to the alignment of the shots S1 and S2, and also functions as a control unit that controls the joint exposure. The control unit 70 may include a data holding unit 71, a drive amount calculation unit 72, and a drive instruction unit 73 as its functional configuration. The data holding unit 71 is a drive parameter such as a shift amount in the X and Y directions of one or more points in a shot measured from a mark exposed on a substrate by an exposure device, a drive offset of each drive axis, and a sensitivity. , Holds various measurement data acquired by the exposure apparatus. The drive amount calculation unit 72 calculates various correction components such as position offsets, rotations, and magnifications in the X, Y, and Z directions from the data stored in the data storage unit 71 using a general statistical method. Further, the drive amount calculation unit 72 determines the drive instruction amount of each axis based on the drive parameter and the calculated correction component. The drive instruction unit 73 outputs a drive instruction to each drive mechanism using the drive instruction amount to each drive mechanism determined by the drive amount calculation unit 72. The control unit 70 can be configured as a hardware device thereof, for example, by a computer device including a CPU (central processing unit) and a memory. In this case, the data holding unit 71 can be realized by a memory, and the drive amount calculation unit 72 and the drive instruction unit 73 can be realized by a CPU.

(Example 1)
With reference to the flowchart of FIG. 3, an outline of a process of determining a correction amount regarding the alignment of the shots S1 and S2 for joint exposure and an exposure process performed based on the determined correction amount in the present embodiment will be described. To do. First, the first joint exposure is performed on the shots S1 and S2 (S101). The first joint exposure is an exposure for determining the correction amount. The substrate used at this time may be a production substrate or a test substrate. Next, the overlay error between the upper and lower layers and the positional deviation between the shots S1 and S2 (the positional deviation between the left and right shots) in the joint region are measured (S102). This measurement may be performed using a measuring device outside the exposure apparatus, or may be performed using the alignment scope 80 or the off-axis scope 81.

The control unit 70 calculates (determines) the correction amount based on the measurement result (S103). The calculated correction amount is stored in, for example, the data holding unit 71 as a correction parameter for exposure. The correction parameters include shot area shift, rotation, and magnification, and the exposure device control target includes control data such as the stage and optical system.The calculated correction amount is converted into a correction value that matches these parameters. Can be done.

After that, the second exposure (the next joint exposure) is performed. The second exposure here may be main exposure using a production substrate (S104). Here, the control unit 70 performs the joint exposure by reflecting the correction value.

Hereinafter, the determination method for determining the correction amount related to the alignment of the shot S1 and the shot S2 according to S101 to S103 described above will be described in detail. FIG. 4 is a schematic diagram of the shot S1 exposed in S101. In the present embodiment, the measurement for overlaying the upper and lower layers and the measurement for aligning the shots S1 and S2 are performed using, for example, a box-in-box mark. In FIG. 4, an outbox mark 91 (base mark) that constitutes an overlay mark has already been formed in the lower layer of the connecting region. When the shot S1 is exposed, an in-box mark 90 (first mark) for alignment with the out-box mark 91 is formed. Further, when the shot S1 is exposed, an out-box mark 92 (second mark) which is a joint position measurement mark for aligning the shot S1 and the shot S2 is also formed in the joint area.

As described above, in the shot S1, the exposure amount (illuminance) is linearly attenuated from 100% to 0% from one end to the other end in the X direction of the joint region. As shown in FIG. 4, it is assumed that the marks formed in the joint region are arranged at a predetermined position x1 in the direction of the overlapping width of the shots S1 and S2 (X direction), and the exposure at the position x1 is performed. The attenuation rate of the quantity is a%. An overlay error is detected from the difference in position between the outbox mark 91 formed on the lower layer and the inbox mark 90 formed on the upper layer. However, when the shot S1 is exposed, the illuminance at the position x1 is only (100-a)%, so the in-box mark 90 and the out-box mark 92 are not completely formed.

FIG. 5 is a schematic diagram of the shot S2 exposed in S101. At the time of exposure of the shot S2, an in-box mark 93 (third mark) is formed so as to overlap with the in-box mark 90 for alignment with the out-box mark 91 which is the base mark. Further, when the shot S2 is exposed, an in-box mark 94 (fourth mark) that is a joint position measurement mark for aligning the shot S1 and the shot S2 is also formed at a position overlapping the out-box mark 92. The overlay error can be detected from the difference in position between the outbox mark 91 formed on the lower layer and the inbox mark 93 formed on the upper layer. However, since the illuminance at the position x1 when the shot S2 is exposed is a%, the total illuminance with the in-box mark 90 in FIG. 4 having the same ideal position coordinates is (100−a)+a=100%. It is completely formed here. In this way, the in-box mark 90 and the in-box mark 93 are overlapped with each other to form a combined in-box mark 95 (combined mark) as shown in FIG. Therefore, the measured positional deviation amount of the composite inbox mark 95 with respect to the outbox mark 91 is the first positional deviation amount which is the positional deviation amount between the superposition marks (91, 95) for superposing upper and lower layers. Is required as.

Similarly, the illuminance of the in-box mark 94 formed by the shot S2 is not 100%. Since the out-box mark 92 in FIG. 4 and the in-box mark 94 in FIG. 5 have the same ideal position coordinates, these marks are formed in a sandwiched positional relationship. Therefore, the mark 96 shown in FIG. The second positional deviation amount, which is the positional deviation amount with respect to the shot S2, is measured. As the out-box mark 92 and the in-box mark 94, a graytone box-in-box mark as shown in FIG. 7 can be adopted. By devising the exposure light transmittance of each mark on the mask, the positional deviation amount between the shot S1 and the shot S2 can be accurately measured. The details of the graytone box-in-box mark are disclosed in, for example, JP-A-2018-10211.

The amount of positional deviation in the X direction with respect to the out-box mark 91, which is the overlay mark of the lower layer, which is the overlay mark of the in-box mark 90 (FIG. 4), is Δ1. That is, Δ2 represents the amount of positional deviation of the shot S1 with respect to the lower layer. Further, the positional shift amount in the X direction with respect to the outbox mark 91, which is the overlay mark of the lower layer and the inbox mark 93 (FIG. 5), which is the overlay mark of the upper layer, is Δ2. That is, Δ2 represents the amount of positional deviation of the shot S2 with respect to the lower layer. Then, in S102, the first positional shift amount M1 which is the shift amount in the X direction with respect to the outbox mark 91 of the lower layer of the composite inbox mark 95 of the upper layer whose total illuminance is 100% due to the joining of the left and right shots is , Is calculated by the following formula.

M1=((100-a)/100)・Δ1+(a/100)・Δ2 (1)

Further, the second positional deviation amount M2, which is the positional deviation amount (horizontal shot arrangement deviation amount) of the inbox mark 94 exposed in the shot S2 from the mark 96 with respect to the outbox mark 92 exposed in the shot S1, is It is calculated by the formula (S102).

M2=Δ1-Δ2 (2)

Here, in order to simplify the description, consider a case where the X position x1 where each mark is formed in the joint region is the center of the joint region (the center in the overlapping width direction of the shots S1 and S2). In this case, since a=50%, the equation (1) is as follows.

M1=(Δ1+Δ2)/2 (3)

From equations (2) and (3), Δ1 and Δ2 are as follows.

Δ1=M1+(M2/2) (4)
Δ2=M1-(M2/2) (5)

As a result, the positional deviation amount obtained by adding a predetermined ratio (for example, 50%) of the second positional deviation amount M2 to the first positional deviation amount M1 is used as the correction amount of the first image of the shot S1 in the joint region. You can decide. Further, the positional deviation amount obtained by subtracting the remaining ratio (for example, 100%-50%=50%) of the second positional deviation amount M2 from the above-mentioned predetermined ratio from the first positional deviation amount M1 is shot in the joint area. It can be determined as the correction amount of the second image in S2. The above description can be generalized when the X position x1 where each mark is formed in the connecting area is arbitrary.

Here, using the positional shift amount obtained from the result of the first exposure (S101), the correction amount of the X position x1 by the exposure of the shot S1 is
M1+(a/100)/M2 (6)
And Further, by using the positional deviation amount obtained from the first exposure result, the correction amount of the X position x1 by the exposure of the shot S2 is
M1-((100-a)/100)・M2 (7)
And

Then, the correction amount in the X direction of the upper and lower layers at the X position x1 is given by the following equation using the equations (6) and (7).

((100-a)/100)×(M1+(a/100)・M2)+(a/100)×(M1+((100-a)/100)・M2} (8)

Substituting equations (1) and (2) into equation (8) yields the following.

((100-a)/100)・{((100-a)/100)×Δ1+(a/100)×Δ2+a(Δ1-Δ2)/100}+(a/100)・{((100 -a)/100)×Δ1+(a/100)×Δ2-(100-a)(Δ1-Δ2)/100}
=(100-a)/100×Δ1+a/100×Δ2 (9)

Further, the correction amount in the X direction of the mark 96, which is the combined left and right shot array displacement measurement mark, is given by the following equation.

(M1+(a/100)/M2)-(M1-((100-a)/100)/M2)
=(((100-a)/100)・Δ1+(a/100)・Δ2+a(Δ1-Δ2)/100)
-(((100-a)/100)・Δ1+(a/100)・Δ2-(100-a)(Δ1-Δ2)/100)
=Δ1-Δ2 (10)

As an effect after the above correction, in the second exposure (S104), correction without a correction residual can be performed as follows.
・Overlay of upper and lower layers 1st exposure deviation: (100-a)/100) ・Δ1+(a/100) ・Δ2
Correction amount at the second exposure: (100-a)/100・Δ1+(a/100)・Δ2
⇒ Correction residual: 0
・Displacement of left and right shots Displacement amount of first exposure: Δ1-Δ2
Second exposure correction amount: Δ1-Δ2
⇒ Correction residual: 0

However, depending on the production characteristics such as the process characteristics and the mask manufacturing cost, it may not be possible to arrange the marks in the connecting region as in the first embodiment. At that time, the displacement of the upper and lower layers and the displacement of the left and right shots in the joint region cannot be directly detected from the mark measurement result. In the following second and third embodiments, the shift of the upper and lower layers and the left and right shot arrangement shift in the joint area are estimated based on the positional shift information detected from the marks outside the joint area, and the correction method of the first embodiment is used. An example of enabling the will be described.

(Example 2)
As shown in FIG. 8, the layout of the exposure shot is the same as that in the first embodiment. A mark C1 (joint position measurement mark on the first shot region side) capable of detecting a deviation of the absolute position of a specific location of the shot is formed at a position outside the joint region in the shot S1. Further, a mark B1 (overlay mark on the first shot area side) capable of detecting a relative positional deviation between upper and lower layers at a specific location is also formed at a position outside the connecting area in the shot S1. Similarly, a mark C2 (joint position measurement mark on the second shot area side) capable of detecting the deviation of the absolute position of the specific location of the shot is formed at a position outside the joint region in the shot S2. Further, a mark B2 (overlaying mark on the second shot area side) capable of detecting the relative positional deviation of the upper and lower layers at a specific location is also formed at a position outside the connecting area in the shot S2.

The positions of the marks C1 and C2 in the shot are adjusted so that the center positions of the ideal positions of the marks C1 and C2 formed after the joint exposure are within the joint region. At this center position, a virtual mark C3 (second virtual mark) is set for the purpose of detecting the relative positional deviation between the exposure results of the shots S1 and S2 at the center position.

Similarly, the positions of the marks B1 and B2 in the shot are adjusted so that the center position of the ideal position of the marks B1 and B2 formed after the joint exposure is within the joint region. At this center position, a virtual mark B3 (first virtual mark) is set for the purpose of detecting the joint composite exposure result of the shots S1 and S2 at the center position and the relative positional deviation of the lower layer.

If the detection amounts of the virtual mark C3 and the virtual mark B3 are obtained, the same correction method as in the first embodiment can be used. Detected amount Q _C3 virtual mark C3 is estimated from the detected amount Q _C2 detection quantity Q _C1 and mark C2 mark C1 by the following equation.

Q _C3 =Q _C1 −Q _C2

Similarly, the detection amount Q _B3 of the virtual mark B3 is estimated by the following equation from the detection amount Q _B1 of the mark _B1 and the detection amount Q _{B2 of the} mark B2.

Q _B3 = (Q _B1 + Q _B2 )/2

As described above, according to this embodiment, the first virtual mark is set at the position in the joint area between the overlay mark on the first shot area side and the overlay mark on the second shot area side. .. Then, the positional deviation amount of the first virtual mark is estimated based on the positional deviation amount between the overlay marks on the first shot area side and the positional deviation amount between the overlay marks on the second shot area side. The misaligned amount is obtained as the first misaligned amount. Further, the second virtual mark is set at a position in the joint area between the joint position measurement mark on the first shot area side and the joint position measurement mark on the second shot area side. Then, the positional deviation amount of the second virtual mark is estimated based on the positional deviation amount between the joint position measurement marks on the first shot area side and the positional deviation amount between the joint position measurement marks on the second shot area side. The estimated positional deviation amount is obtained as the second positional deviation amount.

In FIG. 8, a mark for detecting the absolute position shift of a specific portion of a shot and a mark for detecting the relative positional shift of the upper and lower layers of the specific portion are arranged in the vicinity of the joint area, and the same type of marks of different shots are arranged. They are arranged so as to be symmetrical with respect to the center line of the connecting area. However, the invention is not limited to this arrangement.

(Example 3)
Further, as shown in FIG. 9, when a plurality of marks for detecting the deviation of the absolute position of a specific portion of the shot are arranged on an arbitrary straight line in each shot of the shot S1 and the shot S2, the virtual marks are connected. It can be arranged at a straight line in the area. The distances from the marks C10, C11, C20, C21 to the virtual mark C30 are D10, D11, D20, D21, respectively. Further, the detected amounts of the marks C10, C11, C20, C21 are designated as Q _C10 , Q _C11 , Q _C20 , and Q _C21 , respectively. In this case, the detection amount Q _C30 of the virtual mark C30 is estimated by the following equation.

Q _C30 =
[((Q _C11 −Q _C10 )/(D11 −D10))×D11+Q _C11 ]−
[((Q _C21- Q _C20 )/(D21-D20))×D21+Q _C21 ]

Similarly, when a plurality of marks for detecting the relative positional deviation of the upper and lower layers at a specific position are arranged on an arbitrary straight line in each of the shots S1 and S2, the virtual mark is a straight line in the connecting area. It is possible to place it at the location. The distances from the marks B10, B11, B20, B21 to the virtual mark B30 are E10, E11, E20, E21, respectively. Further, the detected amounts of the marks B10, B11, B20, B21 are respectively set to _QB10 , _QB11 , _QB20 , _QB21 . In this case, the detection amount Q _B30 virtual marks B30 is estimated by the following equation.

Q _B30 =
{[(Q _B11 −Q _B10 )/(E11 −E10)×E11+Q _B11 ]+
[(Q _B21 −Q _B20 )/(E21 −E20)×E21+Q _B21 ]}/2

In the method shown in FIG. 9, the detection amount of the virtual mark is obtained by linear interpolation from the detection amount of the arranged marks, but the invention is not limited to this. It may be obtained by other general statistical methods.

In each of the above-described embodiments, one upper and lower layer detection mark or its virtual mark and one left and right shot arrangement shift detection mark or its virtual mark are arranged in the joint area, but the present invention is not limited to this. A plurality of upper and lower layer detection marks or virtual marks thereof and left and right shot arrangement shift detection marks or virtual marks thereof may be respectively arranged in the connecting region.

<Second Embodiment>
As shown in FIG. 1, the exposure apparatus in the embodiment includes an alignment scope 80 and an off-axis scope 81. In the present embodiment, both the alignment scope 80 and the off-axis scope 81 measure the marks exposed on the substrate and store the measurement data in the data holding unit 71. The alignment scope 80 and the off-axis scope 81 are calibrated by the control unit 70, and when measuring the same mark, the alignment scope 80 and the off-axis scope 81 are adjusted so that the measurement values are the same regardless of which scope is used for measurement. Here, by measuring the marks formed on the original plate 30 and the substrate 60 before exposure, it is possible to measure Δ1 and Δ2 described in the first embodiment. The example in the first embodiment can also be realized by using this method.

<Embodiment of article manufacturing method>
The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The method for manufacturing an article according to the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate using the above pattern forming method or a lithographic apparatus (a step of exposing the substrate), and a latent image pattern in the step. And processing (developing) the substrate on which is formed. Furthermore, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

(Other embodiments)
The present invention supplies a program that implements one or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and one or more processors in a computer of the system or apparatus read and execute the program. It can also be realized by the processing. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof.

10: illumination optical system, 20: slit imaging system, 30: original plate, 40: projection optical system, 60: substrate, 70: control unit

Claims (8)

Exposing a first shot area of the substrate to form a first image; exposing a second shot area overlapping a portion of the first shot area to form a second image; A determination method for determining a correction amount for alignment of the first shot area and the second shot area for joint exposure to obtain an image obtained by joining the first shot area and the second image,
The first displacement amount, which is the displacement amount between the overlay marks for overlaying the upper and lower layers, is calculated,
A second positional deviation amount, which is an amount of positional deviation between the joint position measurement marks for performing the alignment between the first shot area and the second shot area,
A positional deviation amount obtained by adding a predetermined ratio of the second positional deviation amount to the first positional deviation amount is used as the first positional deviation in the joint area where the first shot area and the second shot area overlap each other. Determined as the amount of image correction,
A position deviation amount obtained by subtracting the remaining ratio of the second position deviation amount with respect to the predetermined ratio from the first position deviation amount is determined as a correction amount of the second image in the joint region. Characterizing decision method. The first shot region is exposed to light, and the first shot region and the second shot are aligned in the joint region with a first mark for alignment with a base mark formed in a lower layer of the joint region. Forming a second mark for alignment with the region,
The second shot area is exposed to form a third mark so as to overlap with the first mark for alignment with the base mark, and at a position overlapping with the second mark in the joint area. Forming the fourth mark,
The positional deviation amount of the composite mark formed by superimposing the first mark and the third mark with respect to the base mark is obtained as the first positional deviation amount,
The determination method according to claim 1, wherein a positional deviation amount of the fourth mark with respect to the second mark is obtained as the second positional deviation amount. The overlay mark and the joint position measurement mark are respectively formed at a position outside the joint area in the first shot area and a position outside the joint area in the second shot area,
A first virtual mark is set at a position in the joint area between the overlay mark on the side of the first shot area and the overlay mark on the side of the second shot area, and the overlay mark on the side of the first shot area is set. The positional deviation amount of the first virtual mark based on the positional deviation amount and the positional deviation amount between the overlay marks on the second shot area side, and the estimated positional deviation amount is used as the first position. Calculated as the amount of deviation,
A second virtual mark is set at a position in the joint area between the joint position measurement mark on the first shot area side and the joint position measurement mark on the second shot area side, and the joint on the first shot area side is set. The position shift amount of the second virtual mark is estimated based on the position shift amount between the position measurement marks and the position shift amount between the joint position measurement marks on the second shot area side, and the estimated position shift amount is calculated. The determination method according to claim 1, wherein the determination is performed as the second positional deviation amount. Exposure in the joint region between when the first shot region is exposed and when the second shot region is exposed so that the illuminance distribution from the first shot region to the second shot region is leveled. The method according to claim 1, wherein the amounts are cross-faded. The predetermined ratio is a ratio according to the positions of the overlay mark and the joint position measurement mark in the overlapping width direction of the first shot area and the second shot area in the joint area. The determining method according to claim 4. A first step of exposing a first shot area of the substrate to form a first image;
A second step of exposing a second shot area overlapping a part of the first shot area to form a second image,
An exposure method for obtaining an image in which the first image and the second image are joined together,
In the first step, a joint that overlaps the second shot area of the first shot area with the correction amount of the first image determined by the determination method according to claim 1. Correcting the first image in the area,
In the second step, the second image in the joint region is corrected with the correction amount of the second image determined by the determination method according to any one of claims 1 to 5. Exposure method. Exposing a first shot area of the substrate to form a first image; exposing a second shot area overlapping a portion of the first shot area to form a second image; And an exposure device that performs joint exposure to obtain an image obtained by joining the second image and the second image,
A processing unit that performs a process of determining a correction amount related to alignment of the first shot area and the second shot area;
A control unit for controlling the joint exposure,
The processing unit is
The first displacement amount, which is the displacement amount between the overlay marks for overlaying the upper and lower layers, is calculated,
A second positional deviation amount, which is an amount of positional deviation between the joint position measurement marks for performing the alignment between the first shot area and the second shot area,
A positional deviation amount obtained by adding a predetermined ratio of the second positional deviation amount to the first positional deviation amount is used as the first positional deviation in the joint area where the first shot area and the second shot area overlap each other. Determined as the amount of image correction,
A positional deviation amount obtained by subtracting the remaining ratio of the second positional deviation amount with respect to the predetermined ratio from the first positional deviation amount is determined as a correction amount of the second image in the joint region,
The control unit is
The first image in the joint region is corrected with the determined correction amount of the first image, and the second image in the joint region is corrected with the determined correction amount of the second image. An exposure apparatus that corrects an image and executes the joint exposure. Exposing a substrate using the exposure method according to claim 6;
Developing the exposed substrate in the step,
Including,
An article manufacturing method comprising manufacturing an article from the developed substrate.