JP2020088303A - Light-emitting device - Google Patents

Abstract

To provide a light-emitting device in which the heat dissipation property is improved while securing a strength of the light-emitting device.SOLUTION: The present invention relates to a light-emitting device comprising a substrate and a light-emitting element. The substrate includes: a base material; a pair of first wires disposed on a top face of the base material; a pair of second wires disposed on a bottom face of the base material; and a pair of third wires in contact with the pair of first wires and the pair of second wires. The pair of first wires includes a pair of projections on a top face. The substrate also includes the top face, a bottom face positioned at an opposite side of the top face, and a first side face which is adjacent with the top face and orthogonal with the top face. The light-emitting element is disposed on the pair of projections. The substrate further includes a recess which is opened on the first side face and the bottom face. The third wires are positioned on an inner wall defining the recess. In a top face view, the projections have a first region which is overlapped with the recess, and a second region which is not overlapped with the recess.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a light emitting device.

Patent Document 1 discloses a light emitting device that includes a circuit board 11 having recessed electrodes 15a and 25a, and fixes the recessed electrodes 15a and 25a and the electrodes of a mother board by soldering, respectively.

JP 2012-124191 A

However, in the light emitting device of Patent Document 1, since the recessed electrodes 15a and 25a are provided on the side opposite to the mounting surface on which the light emitting element 13 is mounted, the strength of the light emitting device tends to decrease immediately below the light emitting element 13. There is. Therefore, when the light emitting device is externally stressed, the light emitting element 13 may be damaged. Further, in the light emitting device according to the embodiment shown in FIG. 7 and the like, the heat radiation path from the light emitting element 13 to the recessed electrodes 15a and 25a is long, and thus the heat generated by the light emitting element 13 may not be sufficiently radiated.

Therefore, it is an object of one embodiment of the present invention to provide a light emitting device having improved heat dissipation while ensuring the strength of the light emitting device.

A light emitting device according to an embodiment of the present invention includes a base material, a pair of first wirings arranged on an upper surface of the base material, a pair of second wirings arranged on a lower surface of the base material, and a pair of first wirings. And a pair of third wirings in contact with the pair of second wirings, the pair of first wirings having a pair of convex portions on the upper surface, the upper surface, the lower surface located on the opposite side of the upper surface, and the upper surface adjacent to the upper surface. And a light-emitting element disposed on the pair of convex portions, the substrate having a first side surface orthogonal to the upper surface, and the substrate having a recess opening to the first side surface and the lower surface. Is located on the inner wall that defines the depression, and in a top view, the protrusion has a first region that overlaps the depression and a second region that does not overlap the depression.

According to one embodiment of the present invention, it is possible to provide a light emitting device having improved heat dissipation while ensuring the strength of the light emitting device.

FIG. 3 is a schematic top view of the light emitting device according to the first embodiment. FIG. 3 is a schematic bottom view of the light emitting device according to the first embodiment. FIG. 3 is a schematic side view of the light emitting device according to the first embodiment. FIG. 3 is a schematic side view of the light emitting device according to the first embodiment. FIG. 3 is a schematic side view of the light emitting device according to the first embodiment. FIG. 3 is a schematic side view of the light emitting device according to the first embodiment. It is a schematic end view in the II-II line in FIG. 1A, and a schematic top view of only the corresponding substrate. It is a typical side view which shows the side surface of a light-emitting device. It is a schematic top view which shows only a mounting substrate. It is a typical top view when the light source device is seen from the upper surface side. It is a typical front view when the light source device is seen from the front side. 5 is a schematic end view of a light emitting device according to a second embodiment. FIG. It is the elements on larger scale which expanded the portion surrounded by the broken line of Drawing 5A. It is a figure which shows the formation method of a board|substrate. It is a figure which shows the formation method of a board|substrate. It is a figure which shows the formation method of a board|substrate. It is a figure which shows the formation method of a board|substrate. It is a figure which shows the formation method of a board|substrate.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The following embodiments are exemplifications, and the light emitting device according to the present disclosure is not limited to the following embodiments. For example, the numerical values, shapes, materials, etc. shown in the following embodiments are merely examples, and various modifications are possible as long as there is no technical contradiction.

The dimensions, shapes, and the like of the constituent elements shown in the drawings may be exaggerated for the sake of clarity, and may not reflect the dimensions, shapes, and size relationships between the constituent elements in an actual light emitting device. Further, in order to avoid making the drawings excessively complicated, some of the elements may not be shown.

In the following description, components having substantially the same function are designated by common reference numerals, and description thereof may be omitted. In the following description, a term indicating a particular direction or position (for example, “top”, “bottom”, “right”, “left” and another term including those terms) may be used. However, those terms are only used for the sake of clarity in terms of relative orientation or position in the referenced figures. In the drawings other than the present disclosure, the actual product, the manufacturing apparatus, etc., the same as the referenced drawings, as long as the relative directions or positions in terms of “upper”, “lower”, etc. in the referenced drawings are the same. It does not have to be arranged. In the present disclosure, “vertical” or “orthogonal” includes the case where two straight lines, sides, surfaces, etc. are in the range of about 90° to ±3° unless otherwise specified. In addition, terms such as top view may refer to a surface, a state, or a structure viewed from above when a member other than a target member is transmitted.

(Embodiment 1)
1A is a schematic top view of the light emitting device 100, FIG. 1B is a schematic bottom view of the light emitting device 100, and FIGS. 1C to 1F are schematic side views of the light emitting device 100. Further, in FIG. 2, the drawing on the upper side of the drawing is a schematic end view of the light emitting device 100 taken along the line II-II in FIG. 1A, and the drawing on the lower side is a schematic top view showing only the substrate 10. is there. In the diagram on the lower side of FIG. 2, line IIA-IIA corresponds to line II-II in FIG. 1A.

The light emitting device 100 includes a substrate 10 including a base material 11, a pair of first wirings 111, a pair of second wirings 112, and a pair of third wirings 113, and a light emitting element 20 arranged on the upper surface of the substrate 10. .. The light emitting device 100 according to the first embodiment further includes a translucent member 50 arranged on the upper surface of the light emitting element 20, a light guide member 40 arranged on the side surface of the light emitting element 20, and an outer surface of the light guide member 40. And a light-reflecting member 30 for covering.

The light emitting device 100 has a substrate 10. The substrate 10 is a member for disposing the light emitting element 20. The substrate 10 has an upper surface 10a, a lower surface 10b located on the opposite side of the upper surface 10a, and a first side surface 101 adjacent to the upper surface 10a and orthogonal to the upper surface 10a. In this specification, the upper surface 10a of the substrate 10 refers to the entire surface when the substrate 10 is viewed from above, and the lower surface 10b of the substrate 10 refers to the entire surface when the substrate 10 is viewed from below. The light emitting device 100 according to the first embodiment further includes a second side surface 102 located on the opposite side of the first side surface 101, a third side surface 103, and a fourth side surface 104 located on the opposite side of the third side surface 103. ..

The light emitting device 100 is a top-emission type (top view type) light emitting device in which the lower surface 10b of the substrate 10 and the mounting substrate face each other, and the first side surface 101 of the substrate 10 and the mounting substrate face each other. It may be any of the side-emitting type (side-view type) light emitting devices. In the light emitting device 100 according to the first embodiment, a case where the light emitting device 100 is a side surface light emitting device will be described as an example.

The substrate 10 includes a base material 11, a pair of first wirings 111 arranged on an upper surface of the base material 11, a pair of second wirings 112 arranged on a lower surface of the base material 11, a pair of first wirings 111, and A pair of third wirings 113 that are in contact with the pair of second wirings 112 are provided. For the base material 11, in order to efficiently dissipate the heat from the light emitting element 20, for example, an insulating member having a high heat dissipation property is used. As the base material 11, for example, a resin member such as fiber reinforced resin can be used. The first wiring 111 and the second wiring 112 have conductivity and function as electrodes for supplying power to the light emitting element 20. In addition, the third wiring 113 has a role of electrically connecting the first wiring 111 and the second wiring 112, and further transmitting heat from the light emitting element 20 from the first wiring 111 to the second wiring 112. For the first wiring 111, the second wiring 112, and the third wiring 113, for example, copper or copper alloy having high heat dissipation can be used as a base material.

As shown in FIG. 2, the pair of first wirings 111 has a pair of convex portions 111a on the upper surface. The light emitting element 20 is arranged on the pair of convex portions 111a. In the light emitting device 100 according to the first embodiment, the light emitting element 20 having the first electrode 20a and the second electrode 20b on one surface is flip-chip mounted on the pair of convex portions 111a. In other words, the light emitting element 20 is arranged such that the lower surface of the first electrode 20a and the lower surface of the second electrode 20b of the light emitting element 20 face the upper surfaces of the pair of convex portions 111a. The planar shape of the upper surfaces of the pair of convex portions 111a is preferably substantially the same as the planar shape of the lower surfaces of the first electrode 20a and the second electrode 20b. For example, in the planar shape of the convex portion 111a, the first electrode 20a, and the second electrode 20b, the corresponding sides have substantially the same length (the error is ±20% or less, preferably ±10% or less). It may have a rectangular shape. Thereby, when the light emitting element 20 is arranged on the pair of convex portions 111a via the conductive joining member (not shown), self-alignment effectively works on the light emitting element 20, and the mounting accuracy of the light emitting element 20 is improved. Can be improved. In addition, the convex portion 111a can include a base material having high heat dissipation such as copper or copper alloy, and a metal layer such as gold formed on the base material. Accordingly, it is possible to effectively suppress the deterioration of the base material while radiating the heat from the light emitting element 20.

The substrate 10 has a recess 16 that opens to the first side surface 101 and the lower surface 10b. A joint member is arranged inside the recess 16 when the light emitting device 100 is mounted on a mounting substrate described later. Since the substrate 10 has the depression 16, it is possible to improve the bonding strength between the light emitting device 100 and the mounting substrate, particularly on the first side surface 101 and the lower surface 10b of the light emitting device 100. The third wiring 113 is located on the inner wall of the recess 16. That is, when mounting the light emitting device 100 on the mounting substrate, the bonding member in the recess 16 and the third wiring 113 are in direct contact with each other. As a result, the current supplied from the mounting board is propagated from the third wiring 113 to the light emitting element 20 via the conductive joining member. Further, the third wiring 113 can radiate the heat generated by the light emitting element 20 to the mounting substrate side via the joining member. The light emitting device 100 and the mounting substrate can be joined together by using an adhesive member such as an epoxy resin described later in addition to a joining member such as solder.

The third wiring 113 is in contact with both the first wiring 111 and the second wiring 112, and electrically connects the first wiring 111 and the second wiring 112. The third wiring 113 may be located only on a part of the inner wall of the recess 16, or may be located on all of the inner wall of the recess 16. In the light emitting device 100 according to the first embodiment, the third wiring 113 is located on the entire inner wall of the recess 16. By arranging the third wiring 113 on all the inner walls of the recess 16, heat generated by the light emitting element 20 and the like from the third wiring 113 can be effectively radiated. The depression 16 is formed, for example, by forming a hole in the base material 11 by a known method such as a drill or a laser and providing a metal layer to be the third wiring 113 on the inner surface of the hole by a plating method or the like.

FIG. 3 is a schematic top view showing the state of only the substrate 10 and shows the positional relationship between the convex portions 111 a and the depressions 16. In FIG. 3, a portion with a broken line shows the depression 16, and a portion with hatching shows an area where the convex portion 111 a and the depression 16 overlap. The convex portion 111 a has a first region X that overlaps the recess 16 and a second region Y that does not overlap the recess 16 in a top view. In other words, the convex portion 111a and the recess 16 partially overlap each other in a top view.

Since the convex portion 111a has the second region Y that does not overlap the depression 16 and the convex portion 111a and the depression 16 do not completely overlap, it is possible to suppress a decrease in the strength of the light emitting device in the vicinity immediately below the convex portion 111a. it can. Accordingly, when stress is applied to the light emitting device from the outside, stress is easily concentrated on the light emitting element 20 arranged on the convex portion 111a, and the light emitting element 20 is easily prevented from being damaged. You can In addition, since the convex portion 111a has the first region X that overlaps with the depression 16, the distance between the light emitting element 20 arranged on the convex portion 111a and the depression 16 serving as a main emission port of heat dissipation can be reduced. Therefore, the heat radiation path for the heat generated by the light emitting element 20 can be shortened. Thereby, the heat dissipation of the light emitting device can be improved.

The area of the first region X is, for example, 1% or more, and preferably 3% or more, of the area of the convex portion 111a in a top view. Thereby, the heat generated by the light emitting element 20 can be effectively dissipated. In addition, the area of the first region X is, for example, 50% or less, and preferably 30% or less, of the area of the convex portion 111a in a top view. As a result, it is possible to effectively suppress a decrease in the strength of the light emitting device in the vicinity immediately below the convex portion 111a.

When the depression 16 has a top surface 16b described later, it is preferable that the convex portion 111a does not overlap the top surface 16b of the depression 16 in a top view. As a result, it is possible to prevent the strength of the substrate 10 located directly below the light emitting element 20 from being reduced, and for example, to reduce the possibility that the light emitting element 20 or the like will be damaged even if stress is applied to the light emitting element 20. You can

The recess 16 is preferably separated from the third side surface 103 and the fourth side surface 104. In other words, the recess 16 is preferably not opened on the third side surface 103 and the fourth side surface 104. When the recess 16 is open to the third side surface 103 and the fourth side surface 104, the joining member arranged in the recess 16 is also arranged outside the third side surface 103 and the fourth side surface 104, and includes the joining member. The mounting area of the light emitting device tends to be large. On the other hand, when the recess 16 is not opened on the third side surface 103 or the like, the joining member is not arranged outside the third side surface 103 or the like, so that the mounting area of the light emitting device including the joining member can be reduced. In particular, when a plurality of light emitting devices are arranged such that the third side surface 103 of one light emitting device and the fourth side surface 104 of another light emitting device adjacent to each other are arranged, the distance between the light emitting devices can be shortened. In addition, it is possible to reduce an area serving as a dark portion between the light emitting devices. Note that, for example, when the mounting area of the light emitting device on the mounting substrate can be sufficiently secured, the recess 16 may be opened in the third side surface 103 and the fourth side surface 104. As a result, stress that is pulled from the joining member in the first direction acts on both the third side surface 103 side and the fourth side surface 104 side, so that the positional accuracy of the light emitting device 100 can be improved.

In the light emitting device 100 according to the first embodiment, the recess 16 has the side surface 16a and the top surface 16b. As shown in FIG. 2, the side surface 16 a is inclined so as to spread from the top surface 16 b of the depression 16 toward the opening of the depression 16. In the cross section of the light emitting device 100 perpendicular to the upper surface 10a of the substrate 10, the recess 16 has a trapezoidal shape. Thereby, when the light emitting device 100 is stressed from the light emitting surface side, the joining member in the recess 16 is caught by the side surface 16a, so that the light emitting device 100 and the mounting substrate are kept fixed. As a result, it is possible to reduce defects such as the displacement of the convex portion 111a located near the recess 16 and the damage of the light emitting element 20 arranged on the convex portion 111a. As the stress from the light emitting surface side in the side surface light emitting device 100, for example, when the light emitting device 100 is used as a light source for an edge type backlight, a part of the end face of the light guide plate and the light emitting device 100 are used. The stress generated by contact with the upper surface is mentioned. The angle θ formed by the side surface 16a of the depression 16 and the top surface 16b is, for example, 92° to 120°, and preferably 94° to 104°.

Next, returning to FIG. 1B, the opening shape of the depression 16 in bottom view will be described. The opening diameter of the recess 16 has a width in a direction from the third side surface 103 to the fourth side surface 104 (hereinafter, referred to as a first direction P) in a bottom view as a direction from the first side surface 101 to the second side surface 102 (hereinafter, It is preferably longer than the depth in the second direction Q). The opening shape of the depression 16 shown in FIG. 1B is a rectangular shape that is long in the first direction P. As a result, the joining member arranged in the recess 16 has a larger area where it is joined to the inner wall extending in the first direction P than the inner wall extending in the second direction Q of the depression 16, so that a joining member such as solder is used. When the light emitting device 100 is mounted on a mounting substrate, a tombstone phenomenon may occur in the light emitting device 100, or the light emitting device 100 may be arranged with the upper surface 100a serving as the light emitting surface of the light emitting device 100 inclined. It can be reduced. The opening diameter in the first direction P is, for example, 1.1 times or more, and preferably 1.5 times or more, the opening diameter in the second direction Q.

Further, in the first direction P, the maximum width of the opening of the depression 16 is, for example, 0.1 times or more and 0.4 times or less, or 0.15 times or more and 0.25 times the width of the substrate 10. preferable. When the maximum width of the opening is 0.1 times or more the width of the substrate 10 in the first direction P, the amount of the bonding member arranged in the recess 16 can be increased, and the light emitting device 100 and the mounting substrate. It is possible to improve the bonding strength with. Further, in the first direction P, the maximum width of the opening is 0.4 times or less the width of the substrate 10, so that the strength reduction of the substrate 10 can be suppressed. The distance between the pair of depressions 16 is, for example, 0.3 mm or more, and preferably 0.5 mm or more. Thereby, an adhesive member described later can be easily arranged between the pair of depressions 16.

Further, in the second direction Q, the depth of the opening of the recess 16 is, for example, 0.2 times or more and 0.5 times or less, and 0.3 times or more and 0.4 times or less, that of the depth of the substrate 10. preferable. When the depth of the opening is 0.2 times or more the depth of the substrate 10 in the second direction Q, the amount of the joining member arranged in the recess 16 can be increased, and the light emitting device 100 and the mounting substrate can be separated from each other. The joint strength of can be improved. Further, in the second direction Q, the depth of the opening is 0.5 times or less the depth of the substrate 10, so that the strength reduction of the substrate 10 can be suppressed.

Further, as shown in FIG. 1C, in the third direction R which is a direction perpendicular to the first direction P and the second direction Q, the maximum depth of the recess 16 is 0.5 times or more the height of the substrate 10 or more. It is preferably 0.98 times or less. The height of the substrate 10 in the third direction R refers to the distance from the upper surface of the convex portion 111a to the lower surface of the second wiring 112. When the maximum depth of the recess 16 is 0.5 times or more the height of the substrate 10 in the third direction R, the amount of the bonding member disposed in the recess 16 can be increased, and the light emitting device 100. It is possible to improve the bonding strength between the and mounting substrate. Further, in the third direction R, the maximum depth of the recess 16 is 0.98 times or less the height of the substrate 10, so that the strength reduction of the substrate 10 can be suppressed. The recess 16 penetrates the base material 11 of the substrate 10 in the third direction R.

Further, it is preferable that the recessed portion of the base material 11 corresponding to the recessed portion 16 of the substrate 10 has minute unevenness on the surface. As a result, the contact area between the surface of the recessed portion of the base material 11 and the third wiring 113 formed on the surface of the recessed portion increases, and the adhesiveness between the base material 11 and the third wiring 113 improves. Such minute irregularities can be formed, for example, by forming a recess in the base material 11 and then subjecting the surface of the inner wall to a surface treatment using a solvent or the like. Examples of such surface processing include desmear processing and etching processing.

As shown in FIG. 2, the light emitting device 100 according to the first embodiment further includes a translucent member 50 arranged on the upper surface of the light emitting element 20 and a light guide member 40 arranged on the side surface of the light emitting element 20. And a light reflecting member 30 that covers the outer surface of the light guide member 40. Wavelength conversion particles can be contained in the translucent member 50.

The light guide member 40 covers the side surface of the light emitting element 20, and guides the light emitted from the side surface of the light emitting element 20 toward the upper surface of the light emitting device 100. By disposing the light guide member 40 on the side surface of the light emitting element 20, it is possible to prevent a part of the light reaching the side surface of the light emitting element 20 from being reflected by the side surface and being attenuated in the light emitting element 20. In the light emitting device 100 shown in FIG. 2, the light guide member 40 covers not only the side surface of the light emitting element 20 but also the upper surface thereof. The light guide member 40 is, for example, a member including a resin material as a base material. As the resin material, for example, a translucent resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin can be preferably used. The light guide member 40 preferably has a high light transmittance. Therefore, it is preferable that the light guide member 40 does not include a substance that reflects, absorbs, or scatters light. As the light guide member 40, a member having higher transmittance of light from the light emitting element 20 than the light reflective member 30 is selected.

The light reflective member 30 constitutes a part of the outer surface of the light emitting device 100. In the light emitting device 100 according to the first embodiment, the light reflecting member 30 is located on the upper surface 10a, the first side surface 101, the second side surface 102, the third side surface 103, and the fourth side surface 104. The light reflecting member 30 covers the outer surface of the light guide member 40 provided on the side surface of the light emitting element 20, a part of the side surface of the light emitting element 20, and the upper surface of the substrate 10. Since the light reflecting member 30 is located on the side of the light emitting element 20, the light traveling from the light emitting element 20 to the side of the light emitting element 20 can be reflected by the light reflecting member 30, and the light can be efficiently moved upward. The light can be extracted. It is preferable that the light reflecting member 30 also covers the lower surface of the light emitting element 20. Thereby, for example, the light emitted downward from the light emitting element 20 can be reflected upward. Further, by covering the lower surface of the light emitting element 20 with the light reflecting member 30, the adhesion strength between the light emitting element 20 and the light reflecting member 30 can be improved.

The light reflecting member 30 has, for example, a difference in thermal expansion coefficient between the light guide member 40 and the light emitting element 20 (this is referred to as “first difference in thermal expansion coefficient ΔT30”), and the light reflecting member 30 and the light emitting element 20. It is preferable to select the material of the light-reflecting member 30 so that ΔT40<ΔT30 when compared with the difference in thermal expansion coefficient between the two (referred to as “second thermal expansion coefficient difference ΔT40”). .. This can prevent the light guide member 40 from peeling off from the light emitting element 20.

In the light emitting device 100 according to the first embodiment, the light reflecting member 30 and the first side surface 101, the second side surface 102, the third side surface 103, and the fourth side surface 104 of the substrate 10 are substantially formed on the outer surface of the light emitting device 100. It is on the same plane. Accordingly, when the light emitting device 100 is mounted on the mounting board, the area occupied by the light emitting device 100 can be reduced.

Further, as shown in FIG. 3, the side surface 30 a of the light reflecting member 30 located on the first side surface 101 side is inclined inward of the light emitting device 100 in the direction from the first side surface 101 to the second side surface 102. Preferably. Accordingly, when mounting the light emitting device 100 on the mounting substrate, contact between the side surface 30a of the light reflecting member 30 and the mounting substrate is suppressed, and as a result, the mounting posture of the light emitting device 100 can be stabilized. Further, it is preferable that the side surface 30b of the light reflecting member 30 located on the second side surface 102 side is inclined inside the light emitting device 100 in the direction from the second side surface 102 to the first side surface 101. As a result, the contact with the suction nozzle (collet) becomes mainly the base material 11, and the contact between the suction nozzle and the side surface 30b of the light reflecting member 30 is suppressed, so that the light reflectivity when the light emitting device 100 is sucked is held. Damage to the member 30 can be suppressed. The angle θ formed by the side surface 30a or the side surface 30b of the light reflecting member 30 and the side surface of the substrate 10 can be appropriately selected, but is preferably 0.3° or more and 3° or less, and 0.5° or more. It is more preferably 2° or less, and further preferably 0.7° or more and 1.5° or less. Accordingly, it is possible to suppress the mounting stability of the light emitting device and the damage to the light reflecting member while suppressing the reduction in the strength of the light emitting device.

The light emitting device 100 may include the translucent member 50 on the upper surface of the light emitting element 20. By disposing the translucent member 50 on the upper surface of the light emitting element 20, the light emitting element 20 can be protected from external stress. When the light emitting device 100 includes the translucent member 50, the side surface of the translucent member 50 is preferably covered with the light reflective member 30. As a result, the contrast between the light emitting region and the non-light emitting region is increased, and a light emitting device having a good parting property can be obtained.

The translucent member 50 may include wavelength conversion particles 51. The wavelength conversion particle 51 is a member that absorbs at least a part of the primary light emitted from the light emitting element 20 and emits secondary light having a wavelength different from that of the primary light. By including the wavelength conversion particles 51 in the translucent member 50, it is possible to output mixed color light in which the primary light emitted by the light emitting element 20 and the secondary light emitted by the wavelength conversion particles 51 are mixed.

The wavelength conversion particles 51 may be uniformly dispersed in the translucent member 50, or the wavelength conversion particles 51 may be unevenly distributed near the light emitting element 20 rather than on the upper surface of the translucent member 50. By unevenly distributing the wavelength conversion particles 51 closer to the light emitting element 20 than the upper surface of the translucent member 50, the deterioration of the wavelength conversion particles 51, which are weak against water, due to water can be easily suppressed. Examples of the wavelength conversion particles 51 that are weak against water include manganese-activated fluoride-based phosphors. The manganese-activated fluoride-based phosphor is a preferable phosphor from the viewpoint of color reproducibility because it can emit light with a relatively narrow spectral line width. The wavelength conversion particles 51 may be one type of wavelength conversion particles or a plurality of types of wavelength conversion particles.

4A is a schematic top view showing only the mounting substrate 500, and FIG. 4B is a top view of the light source device 800 in which the light emitting device 100 is disposed on the mounting substrate 500 (from the second side surface 102 side of the light emitting device 100). FIG. 4C is a schematic front view when the light source device 800 is viewed from the front side (the upper surface 100a side of the light emitting device 100). In FIG. 4B and FIG. 4C, the portions of the joining member 6 and the adhesive member 7 that appear in appearance are hatched. Also in the light source device 800, the case where the light emitting device 100 is a side surface light emitting device will be described as an example. The light emitting device 100 is mounted on the mounting substrate 500 such that the first side surface 101 side of the substrate 10 is the mounting surface. In the light emitting device 100 shown in FIGS. 4B and 4C, the upper surface side of the substrate 10 is the front surface, the lower surface 10b side of the substrate 10 is the back surface, and the first side surface 101 side of the substrate 10 is the bottom surface. Therefore, in the light emitting device 100 shown in FIGS. 4B and 4C, the lower surface 10b of the substrate 10 may be referred to as the back surface 10b, and the first side surface 101 may be referred to as the bottom surface 101, for example.

As shown in FIG. 4A, the mounting board 500 has a base material and a wiring pattern 500a formed on the base material. The mounting substrate 500 is, for example, a long member having a longitudinal direction and a lateral direction. A plurality of light emitting devices 100 can be arranged on the mounting substrate 500, and the plurality of light emitting devices 100 are preferably arranged on the mounting substrate 500 along the longitudinal direction of the mounting substrate 500.

The light emitting device 100 and the mounting substrate 500 are mainly joined by the joining member 6 arranged in the recess 16 of the light emitting device 100. In FIG. 4B and FIG. 4C, the joining member 6 is arranged in the recess 16. The joining member 6 has conductivity and, for example, a member such as solder is used. Further, the light emitting device 100 and the mounting substrate 500 can be bonded to each other by using an adhesive member 7 in addition to the bonding member 6 arranged in the recess 16. In the light source device 800 shown in FIGS. 4B and 4C, the adhesive member 7 joins the first side surface 101 (bottom surface 101) of the substrate 10 and the upper surface of the mounting substrate 500. By using the adhesive member 7 in addition to the joining member 6, the joining strength between the light emitting device 100 and the mounting substrate 500 can be made stronger.

On the first side surface 101 (bottom surface 101) of the substrate 10, a region in contact with the adhesive member 7 is preferably located between the two recesses 16. Thereby, when a conductive bonding material is used as the bonding member 6 and an insulating adhesive material is used as the bonding member 7, for example, the bonding member 6 located in one recess 16 and the other recess 16 are positioned. It is possible to prevent unintentional contact with the joining member 6 located inside. That is, by disposing the insulating adhesive member 7 between the two recesses 16 on the first side surface 101 (bottom surface 101) of the substrate 10, it is possible to easily suppress an electrical short circuit of each terminal. Further, since the adhesive member 7 is not located outside the joining member 6, it is possible to prevent the adhesive member 7 from flowing into the outside of the third side surface 103 and the fourth side surface 104. In particular, it is particularly useful when the viscosity of the material forming the adhesive member 7 is lower than the viscosity of the material forming the joining member 6. As a result, the mounting area of the light emitting device 100 including the adhesive member 7 and the like can be reduced.

For the adhesive member 7, for example, a resin material such as epoxy resin can be used. By using the resin material as the adhesive member 7, for example, when the base material 11 of the substrate 10 is a member having high wettability with the resin material, the bonding strength between the adhesive member 7 and the substrate 10 can be increased. Further, on the first side surface 101 (bottom surface 101) of the substrate 10, the adhesive member 7 may be in contact with only the base material 11.

As an example of a joining method using the joining member 6 and the adhesive member 7, first, a material to be the two joining members 6 (hereinafter, simply referred to as a joining material) is arranged at a predetermined position on the mounting substrate 500 by a printing method or the like. .. The separation distance between the two bonding materials is set to be substantially equal to the separation distance between the two depressions 16 of the light emitting device 100. Next, when the mounting substrate 500 is viewed from above, a resin material to be the adhesive member 7 is placed between the two bonding materials by a dispenser or the like. One resin material may be arranged, or two or more resin materials may be arranged. Next, the light emitting device 100 is placed on the mounting substrate 500. The light emitting device 100 is arranged such that the bonding material is located in the recess 16. At this time, it is preferable that at least a part of the joining member 6 is located outside the recess 16 when the mounting substrate 500 is viewed from above. Thereby, the bonding strength between the light emitting device 100 and the mounting substrate 500 can be improved. The joining member 6 may be located only inside the recess 16. Accordingly, since the joining member 6 is not arranged outside the back surface 10b of the light emitting device 100, the mounting area of the light emitting device 100 including the joining member 6 can be reduced. Next, heat is applied to the bonding material and the resin material by reflow or the like. As a result, the light emitting device 100 and the mounting substrate 500 are firmly joined by the joining member 6 and the adhesive member 7.

Hereinafter, each component of the light emitting device 100 and the light source device 800 according to the embodiment of the present invention will be described.

(Substrate 10)
The substrate 10 is a member for mounting the light emitting element. The substrate 10 has a base material 11, a pair of first wirings 111, a pair of second wirings 112, a pair of third wirings 113, and a recess 16.

(Base material 11)
As the base material of the base material 11, an insulating member such as resin or fiber reinforced resin, ceramics, or glass can be used. Examples of the resin or fiber reinforced resin include epoxy resin, glass epoxy, bismaleimide triazine (BT), and polyimide. Examples of ceramics include aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride, and mixtures thereof. Of these materials, the base material 11 is preferably selected from materials having a linear expansion coefficient close to that of the light emitting element 20. The thickness of the base material 11 can be appropriately selected, but from the viewpoint of ensuring the strength of the base material 11, it is preferably 0.05 mm or more, and more preferably 0.2 mm or more. Further, the thickness of the base material 11 is preferably 0.5 mm or less, and more preferably 0.4 mm or less from the viewpoint of reducing the total thickness of the light emitting device.

(First wiring 111, second wiring 112, third wiring 113)
The first wiring 111 is disposed on the upper surface of the base material 11 and electrically connected to the light emitting element 20. The second wiring 112 is arranged on the lower surface of the base material 11. The third wiring 113 is in contact with the first wiring 111 and the second wiring 112, and electrically connects the respective wirings. The third wiring 113 is located on the inner wall of the recess 16. The first wiring 111, the second wiring 112, and the third wiring 113 can be formed of copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or an alloy thereof. Further, each wiring may be formed as a single layer of these metals or alloys, or may be formed as a multilayer of these metals or alloys. In particular, each wiring preferably contains copper or a copper alloy having good heat dissipation. Further, the first wiring 111 and/or the second wiring 112 are formed of silver, platinum, nickel, palladium, aluminum, rhodium, gold in order to improve the wettability, light reflectivity, sulfidation resistance, etc. of the conductive joining member. Alternatively, it may have a metal layer such as an alloy of these on its surface.

The first wiring 111 has a convex portion 111a on the upper surface. The light emitting element 20 is arranged on the convex portion 111a. The first wiring 111 may have a wiring body and a convex portion 111a. The wiring body and the convex portion 111a may be integrated or may be separate bodies. When the wiring main body and the convex portion 111a are separate bodies, for example, the convex portion 111a can be formed on the wiring main body in another step after the wiring main body is formed. The convex portion 111a preferably contains copper or a copper alloy having good heat dissipation. In addition, the convex portion 111a may have a metal layer such as silver, platinum, nickel, palladium, aluminum, rhodium, gold, or an alloy thereof on the surface in order to improve light reflectivity or sulfide resistance. ..

In particular, the first wiring 111 and the second wiring 112 including the convex portion 111a are formed of a base material containing copper or a copper alloy, nickel plating containing phosphorus formed on the base material, and palladium formed on the nickel plating. It is preferable to include plating, first gold plating formed on palladium plating, and second gold plating 120 formed on the first gold plating. Since the hardness of nickel is improved by containing phosphorus, the hardness of the first wiring 111 and the second wiring 112 is improved by providing the first wiring 111 and the second wiring 112 with nickel plating containing phosphorus. Thus, when the collective substrate including the plurality of light emitting devices 100 is divided into individual light emitting devices, cutting burrs are less likely to occur in the first wiring 111 and the like. Further, by laminating the above plating on the base material containing copper or copper alloy, it is possible to suppress the diffusion of the copper component contained in copper or copper alloy. As a result, it is possible to suppress a decrease in the adhesiveness of each plating layer. Further, since the gold plating is located on the outermost surface of the plating, it is possible to suppress corrosion such as oxidation and sulfidation on the surface of the first wiring 111 and the like. The first gold plating can be formed by an electroless plating method, and the second gold plating can be formed by an electrolytic plating method. By forming the second gold plating located on the outermost surface by the electrolytic plating method, it is possible to reduce the content of the catalyst poison such as sulfur in the second gold plating. Accordingly, when an addition reaction type silicone resin using a platinum-based catalyst is used as the light-reflecting member 30, it is possible to suppress reaction between platinum in the catalyst and sulfur in the second gold plating, and thus the platinum-based catalyst It is possible to suppress the curing failure of the addition reaction type silicone resin using the catalyst.

(Light emitting element 20)
The light emitting element 20 is, for example, an LED chip. Emitting element 20 is, for example, a semiconductor multilayer structure including a light emitting capable nitride semiconductor of ultraviolet to visible range _{(In x Al y Ga 1-} x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) Can have. The emission peak wavelength of the light emitting element 20 is preferably 400 nm or more and 530 nm or less, more preferably 420 nm or more and 490 nm or less, and more preferably 450 nm or more and 475 nm or less in consideration of the emission efficiency of the light emitting device, the excitation spectrum of the wavelength conversion particles, and the color mixing property. More preferable.

The number of light emitting elements may be one or two or more. When there are a plurality of light emitting elements, the plurality of light emitting elements may be, for example, a plurality of blue light emitting elements that emit blue light, three light emitting elements that emit blue light, green light and red light, or emit blue light. A combination of a light emitting element that emits light and a light emitting element that emits green light can be used. When the light emitting device 100 is used as a light source of a liquid crystal display device or the like, as a light emitting element, one light emitting element that emits blue light, two light emitting elements that emit blue light, and three or more light emitting elements that emit blue light, Alternatively, it is preferable to use a combination of a light emitting element which emits blue light and a light emitting element which emits green light. For the light emitting element that emits blue light and the light emitting element that emits green light, it is preferable to use a light emitting element having a half-value width of 40 nm or less, and it is more preferable to use a light emitting element having a half value width of 30 nm or less. Thereby, blue light and green light can easily have sharp peaks. As a result, for example, when the light emitting device is used as a light source of a liquid crystal display device or the like, the liquid crystal display device can achieve high color reproducibility. In addition, the plurality of light emitting elements can be electrically connected by a connection method in which serial, parallel, or serial and parallel are combined.

The planar shape of the light emitting element 20 is not particularly limited, but may be a square shape or a rectangular shape that is long in one direction. The planar shape of the light emitting element 20 may be a hexagonal shape or another polygonal shape. The light emitting element 20 has positive and negative electrodes of a first electrode 20a and a second electrode 20b. The positive and negative electrodes can be composed of gold, silver, copper, tin, platinum, rhodium, titanium, aluminum, tungsten, palladium, nickel or alloys thereof. The side surface of the light emitting element 20 may be perpendicular to the upper surface of the light emitting element 20, or may be inclined inward or outward.

(Translucent member 50)
The translucent member 50 is a member which is provided on the light emitting element 20 and protects the light emitting element 20. The translucent member 50 may be a single layer or a multilayer. When the translucent member 50 has a plurality of layers, the base material of each layer may be the same or different.

As the base material of the translucent member 50, a material having translucency to the light of the light emitting element 20 is used. In the present specification, having translucency means that the light transmittance of the light emitting element 20 at an emission peak wavelength is 60% or more, preferably 70% or more, and more preferably 80% or more. .. As the base material of the translucent member 50, for example, a silicone resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, or a modified resin thereof can be used. Further, the base material of the translucent member 50 may be glass. In particular, silicone resins and epoxy resins are preferably used because they have excellent heat resistance and light resistance. Examples of the silicone resin include dimethyl silicone resin, phenyl-methyl silicone resin, diphenyl silicone resin and the like. The modified resin in this specification includes a hybrid resin.

The transparent member 50 may contain light diffusing particles. Examples of the light diffusion particles include silicon oxide, aluminum oxide, zirconium oxide, zinc oxide and the like. The light-diffusing particles may be used alone or in combination of two or more of them. In particular, it is preferable to use silicon oxide having a small linear expansion coefficient as the light diffusion particles. Further, it is preferable to use nanoparticles as the light diffusion particles. As a result, the scattering of light emitted from the light emitting element is increased, and the amount of wavelength conversion particles used can be reduced. The nanoparticles are particles having a particle size of 1 nm or more and 100 nm or less. The particle size in the present specification is mainly defined by D50.

The translucent member 50 may include wavelength conversion particles 51. The wavelength conversion particle 51 is a member that absorbs at least a part of the primary light emitted from the light emitting element and emits secondary light having a wavelength different from that of the primary light. The wavelength conversion particles 51 may be used alone or in combination of two or more of the phosphors shown below.

The wavelength conversion particles 51 include yttrium-aluminum-garnet-based phosphors (for example, Y ₃ (Al,Ga) ₅ O ₁₂ :Ce), lutetium-aluminum-garnet-based phosphors (for example, Lu ₃ (Al,Ga) ₅ O). ₁₂ :Ce), terbium aluminum garnet-based phosphor (for example, Tb ₃ (Al,Ga) ₅ O ₁₂ :Ce), silicate-based phosphor (for example, (Ba,Sr) ₂ SiO ₄ :Eu), chlorosilicate-based phosphor. phosphor (e.g. _{Ca 8 Mg (SiO 4) 4} Cl 2: Eu), β -sialon-based phosphor (e.g. _{Si 6-z Al z O z} N 8-z: Eu (0 <z <4.2)), SGS-based phosphor (for example, SrGa ₂ S ₄ :Eu), alkaline earth aluminate-based phosphor (for example, (Ba,Sr,Ca)Mg _x Al ₁₀ O _17-x :Eu,Mn), α-sialon-based phosphor (For example, M _z (Si,Al) ₁₂ (O,N) ₁₆ (where 0<z≦2, M is Li, Mg, Ca, Y, and a lanthanide element excluding La and Ce), a nitrogen-containing alumino calcium silicate phosphor (e.g. _{(Sr, Ca) AlSiN 3:} Eu), manganese activated fluoride phosphor (general formula _{(I) A 2 [M 1} -a Mn a F 6] with a phosphor represented by ( However, in the general formula (I), A is at least one selected from the group consisting of K, Li, Na, Rb, Cs, and NH ₄ , and M is a Group 4 element or a Group 14 element. And at least one element selected from the group consisting of a, and a satisfies 0<a<0.2).) In the yttrium-aluminum-garnet-based phosphor, a part of Y is replaced with Gd. The emission peak wavelength can be shifted to the longer wavelength side by using a phosphorous substance of manganese activated potassium fluoride silicate (eg, K ₂ SiF ₆ :Mn). Be done.
The translucent member 50 may be a sintered body of the wavelength conversion particles 51 and an inorganic material such as alumina, or a plate crystal of the wavelength conversion particles 51.

(Light reflective member 30)
From the viewpoint of light extraction efficiency in the upper surface direction of the light emitting device 100, the light reflecting member 30 preferably has a light reflectance of 70% or more, and preferably 80% or more, at the emission peak wavelength of the light emitting element 20. Is more preferable, and 90% or more is further preferable. Further, the light reflecting member 30 is preferably white. The light-reflecting member 30 can include a light-reflecting substance in a resin material as a base material. The light reflecting member 30 can be obtained by solidifying a liquid resin material. The light reflecting member 30 can be formed by transfer molding, injection molding, compression molding, potting, or the like.

The light reflecting member 30 can include a resin material as a base material. A thermosetting resin, a thermoplastic resin, or the like can be used as the resin material as the base material. Specifically, modified epoxy resin such as epoxy resin, silicone resin, silicone modified epoxy resin, modified silicone resin such as epoxy modified silicone resin, modified silicone resin, unsaturated polyester resin, saturated polyester resin, polyimide resin, modified polyimide resin A cured product such as polyphthalamide (PPA), a polycarbonate resin, a polyphenylene sulfide (PPS), a liquid crystal polymer (LCP), an ABS resin, a phenol resin, an acrylic resin, or a PBT resin can be used. In particular, as the resin material of the light-reflecting member 30, it is preferable to use a thermosetting resin such as an epoxy resin or a silicone resin, which has excellent heat resistance and light resistance.

The light reflecting member 30 preferably contains a light reflecting substance in the resin material as the base material. As the light-reflecting substance, it is preferable to use a member that hardly absorbs light from the light emitting element and has a large difference in refractive index from the resin material as the base material. Such a light-reflecting substance is, for example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, aluminum nitride or the like.

(Light guide member 40)
The light guide member 40 covers the side surface of the light emitting element 20, and guides the light emitted from the side surface of the light emitting element 20 toward the upper surface of the light emitting device. That is, a part of the light reaching the side surface of the light emitting element 20 is reflected by the side surface and attenuated in the light emitting element 20, but the light guide member 40 can extract the light to the outside of the light emitting element 20 through the light guide member 40. it can. For the light guide member 40, the resin material exemplified for the light reflecting member 30 can be used. In particular, a thermosetting translucent resin such as silicone resin, silicone-modified resin, epoxy resin, or phenol resin is preferable. The light guide member 40 preferably has a high light transmittance. Therefore, it is usually preferable that the light guide member 40 does not substantially contain an additive that reflects, absorbs, or scatters light. The phrase “substantially free of additives” means that inclusion of additives inevitably is not excluded. The light guide member 40 may contain the same light diffusing particles and/or wavelength converting particles as the above-mentioned light transmissive member 50.

For the light reflecting member 30, the light guide member 40, and the light transmitting member 50, an epoxy resin can be selected as a resin material that is a base material. The strength of the light emitting device 100 can be improved by selecting an epoxy resin having higher strength than the silicone resin when solidified. Further, by forming the base material of each member with the same kind of resin material, the adhesion strength of each member can be improved. Moreover, when epoxy resin is selected as the adhesive member 7, the bonding strength between the adhesive member 7 and the light reflecting member 30 and the like can be improved.

(Mounting board 500)
The mounting substrate 500 includes a plate-shaped base material made of glass epoxy resin, ceramic, polyimide, or the like. Further, the mounting substrate 500 includes a land portion and a wiring pattern made of copper, gold, silver, nickel, palladium, tungsten, chromium, titanium, or an alloy thereof on the base material. The land portion and the wiring pattern are formed by using a method such as plating, lamination pressure bonding, attachment, sputtering, vapor deposition, and etching.

(Joining member 6)
For the joining member 6, any material known in the art can be used. Specifically, the joining member 6 is, for example, a tin-bismuth-based solder, a tin-copper-based solder, a tin-silver-based solder, a gold-tin-based solder (specifically, Ag, Cu, and Sn are main components. Alloys containing Cu, Sn as main components, alloys containing Bi and Sn as main components, eutectic alloys (alloys containing Au and Sn as main components, Au and Si as main components). Alloys, alloys containing Au and Ge as the main components), conductive pastes such as silver, gold and palladium, bumps, anisotropic conductive materials, and brazing materials such as low melting point metals.

(Adhesive member 7)
As the adhesive member 7, for example, a resin material such as the epoxy resin listed for the translucent member 50 or a member listed for the joining member 6 can be used. The joining member 6 and the adhesive member 7 may be the same member or different members. When the joining member 6 and the adhesive member 7 are different members, the joining member 6 can be selected from solder, which is a conductive material, and the adhesive member 7 can be selected from a resin material such as epoxy resin.

(Embodiment 2)
FIG. 5A is a schematic end view of the light emitting device 200 according to the second embodiment, and FIG. 5B is a partially enlarged view of a portion surrounded by a broken line in FIG. 5A. In the light emitting device 200, the wiring body of the first wiring 111 includes a plurality of wiring layers, and the top surface of the third wiring 113 is located at a height between the upper surface and the lower surface of the first wiring 111. The light transmissive member 50 mainly differs from the light emitting device 100 of the first embodiment in that the translucent member 50 includes the transparent layer 50b. Therefore, the first wiring 111, the third wiring 113, and the translucent member 50 will be mainly described.

In the light emitting device 200, the first wiring 111 includes a first upper surface wiring 111b arranged on the upper surface of the base material 11, a second upper surface wiring 111c arranged on the upper surface of the first upper surface wiring 111b, and a second upper surface. And a convex portion 111a arranged on the upper surface of the wiring 111c. Since the wiring main body of the first wiring 111 includes a plurality of wiring layers, the strength of the light emitting device 100 is improved. The convex portion 111a, the first upper surface wiring 111b, and the second upper surface wiring 111c can include the same heat-dissipating member made of copper or copper alloy.

The thickness of the convex portion 111a is preferably thicker than the thickness of each of the first upper surface wiring 111b and the second upper surface wiring 111c. By increasing the thickness of the convex portion 111a, for example, the strength of the substrate 10 near the light emitting element 20 can be increased, and the heat generated by the light emitting element 20 can be effectively dissipated. The first upper surface wiring 111b and the second upper surface wiring 111c may have the same thickness or different thicknesses. For example, the thickness of the first upper surface wiring 111b can be made larger than the thickness of the second upper surface wiring 111c.

The top surface of the third wiring 113 is located at a height between the upper surface and the lower surface of the first wiring 111 in the direction perpendicular to the upper surface of the base material 11. In the light emitting device 200 shown in FIGS. 5A and 5B, the top surface of the third wiring 113 is located at a height between the upper surface and the lower surface of the first upper surface wiring 111b. As a result, the area of contact between the first wiring 111 and the third wiring 113 increases, so that the bonding strength between the first wiring 111 and the third wiring 113 can be improved. As a result, it is possible to reduce the possibility that the wirings are separated from each other and an electrical failure occurs.

The pair of first wirings 111 is arranged on the upper surface of the base material 11, and the pair of second wirings 112 is arranged on the lower surface of the base material 11. In addition, the third wiring 113 is in contact with both the first wiring 111 and the second wiring 112, and electrically connects the first wiring 111 and the second wiring 112. In the light emitting device 100 according to the first embodiment, the third wiring 113 is located only inside the recess 16. However, in the light emitting device 200 according to the second embodiment, a part of the third wiring 113 is located outside the recess 16. The side surface and the lower surface of the second wiring 112 are further covered. Since the third wiring 113 covers both the side surface and the lower surface of the second wiring 112, the bonding strength between the second wiring 112 and the third wiring 113 is improved. As a result, it is possible to reduce the possibility that the wirings are separated from each other and an electrical failure occurs. In the light emitting device 200 according to the second embodiment, the third wiring 113 is located on the lowermost surface of the substrate 10.

The second upper surface wiring 111c and the third wiring 113 can be the same member. For example, the second upper surface wiring 111c and the third wiring 113 can be formed in the same process. As the substrate 10, for example, a substrate formed by the conformal via method can be used. The substrate 10 can be formed, for example, by the forming method shown in FIGS. 6A to 6E.

First, as shown in FIG. 6A, a first intermediate having a base material 11, a first upper surface wiring 111b arranged on the upper surface of the base material 11, and a second wiring 112 arranged on the lower surface of the base material 11. Prepare body 10A. The first upper surface wiring 111b and the second wiring 112 can be formed of the same member. Further, the first upper surface wiring 111b and the second wiring 112 can be formed in the same process. Thereby, the first upper surface wiring 111b and the second wiring 112 can be easily formed.

Next, as shown in FIG. 6B, a part of the second wiring 112 is removed to form the first recessed portion 3. As a method of forming the first recessed portion 3, a subtractive method, a semi-additive method, or the like can be used.

Next, as shown in FIG. 6C, the second recess 4 is formed in the region where the first recess 3 is formed. The second recess 4 reaches the first upper surface wiring 111b, and is preferably formed by removing a part of the lower surface of the first upper surface wiring 111b. Thereby, when the third wiring 113 is formed, the area of contact between the first upper surface wiring 111b and the third wiring 113 increases, and the bonding strength between the first wiring 111 and the third wiring 113 can be improved. By forming the first recessed portion 3 and the second recessed portion 4 in different steps, it is possible to reduce the load on the intermediate body that becomes the substrate 10. The first recessed portion 3 and the second recessed portion 4 may be simultaneously formed in one step. As a method of forming the second recessed portion 4, a UV laser, a CO ₂ laser, a drill, or the like can be used. Through the above steps, the second intermediate body 10B shown in FIG. 6C can be prepared.

Next, as shown in FIG. 6D, a metal layer is formed on the surface of the second intermediate body 10B. Specifically, the second upper surface wiring 111c is formed on the upper surface of the first upper surface wiring 111b, and the third wiring 113 is formed on the lower surface of the second wiring 112 and the surface of the second recessed portion 4. That is, the second upper surface wiring 111c and the third wiring 113 are formed of the same member. The second upper surface wiring 111c and the third wiring 113 are formed in the same process. Thus, the second upper surface wiring 111c and the third wiring 113 can be easily formed. Further, the recess 16 is formed by the step of forming the third wiring 113.

Next, as shown in FIG. 6E, the first upper surface wiring 111b, the second upper surface wiring 111c, the second wiring 112 and the third wiring 113 are partially removed to form a wiring pattern, and the upper surface of the second upper surface wiring 111c is formed. The convex portion 111a is formed on the upper side. The step of forming the convex portion 111a may be before or after the step of forming the wiring pattern. Then, for example, the substrate 10 can be prepared by forming a plating layer on the surface of the convex portion 111a.

The term "preparation" used in this specification means that, in addition to preparation by manufacturing, preparation may be performed by purchasing a product manufactured in advance.

The translucent member 50 includes a wavelength conversion layer 50a containing the wavelength conversion particles 51 and a transparent layer 50b containing substantially no wavelength conversion particles. By providing the transparent layer 50b on the upper surface of the wavelength conversion layer 50a, the transparent layer 50b can function as a protective layer and suppress the deterioration of the wavelength conversion particles 51 in the wavelength conversion layer 50a. In addition, when the wavelength conversion particles are not substantially contained, it means that the wavelength conversion particles are inevitably mixed, and the content rate of the wavelength conversion particles is, for example, 0.05% by weight or less.

100, 200 light emitting device 500 mounting substrate 800 light source device 3 first recessed portion 4 second recessed portion 6 joining member 7 adhesive member 10 substrate 10a upper surface 10b lower surface 10A first intermediate body 10B second intermediate body 101 first side surface 102 second Side surface 103 Third side surface 104 Fourth side surface 111 First wiring 111a Convex portion 111b First upper surface wiring 111c Second upper surface wiring 112 Second wiring 113 Third wiring 11 Base material 16 Recess 16a Side surface 16b Top surface 20 Light emitting element 20a First Electrode 20b Second electrode 30 Light reflective member 30a Side surface 30b Side surface 40 Light guide member 50 Light transmissive member 50a Wavelength conversion layer 50b Transparent layer 500a Wiring pattern 51 Wavelength conversion particle X First area Y Second area Z Adhesive member is in contact region

Claims (5)

A base material, a pair of first wirings arranged on the upper surface of the base material, a pair of second wirings arranged on the lower surface of the base material, the pair of first wirings and the pair of second wirings A pair of third wirings in contact with each other, wherein the pair of first wirings has a pair of convex portions on an upper surface, the upper surface, a lower surface located on the opposite side of the upper surface, and the upper surface adjacent to the upper surface. A substrate having a first side surface orthogonal to
A light emitting element disposed on the pair of convex portions,
The substrate includes a recess opening to the first side surface and the lower surface,
The third wiring is located on an inner wall defining the recess,
In a top view, the convex portion has a first region that overlaps the recess and a second region that does not overlap the recess. The depression has a side surface and a top surface,
The light emitting device according to claim 1, wherein a side surface of the recess is inclined so as to spread from a top surface of the recess toward an opening of the recess. The light emitting device according to claim 1 or 2, wherein an area of the first region is 3% or more of an area of the convex portion in a top view. The first wiring is disposed on the upper surface of the base material, the first upper surface wiring is disposed on the upper surface of the first upper surface wiring, and the second upper surface wiring is disposed on the upper surface of the second upper surface wiring. And the raised portion,
The highest part of the third wiring in a direction perpendicular to the upper surface of the base material is located between the upper surface and the lower surface of the first upper surface wiring, according to any one of claims 1 to 3. Light emitting device. The light emitting device according to claim 4, wherein the second upper surface wiring and the third wiring are made of the same member.

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