JP2020080428A - Determination method and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting machine 5 and a production line 1 having high mounting accuracy of electronic components P1 to P6. An electronic component mounting machine 5 includes an image pickup device 571 and a control device 50. The image pickup apparatus 571 images the sub-reference marks F1 to F3 and the main reference marks f1 to f4. When the main reference marks f1 to f4 can be read from the image captured by the image pickup device 571, the control device 50 determines the mounting positions of the electronic components P1 to P6 with respect to the substrate 8 with reference to the main reference marks f1 to f4. On the other hand, when the control device 50 cannot read the main reference marks f1 to f4 from the image due to printing defects of the main reference marks f1 to f4, the control device 50 is a reference source of the imaging position of the main reference marks f1 to f4. The mounting positions of the electronic components P1 to P6 with respect to the substrate 8 are determined with reference to F1 to F3. [Selection diagram] Fig. 4

Description

  The present invention relates to an electronic component mounter that mounts electronic components on a board, and a production line in which a plurality of electronic component mounters are arranged side by side.

  A wiring pattern is printed on the substrate. In addition, a solder portion is printed on the land portion of the wiring pattern. For example, as shown in Patent Document 1, the electronic component mounting machine may determine the mounting position of the electronic component based on the solder mark (solder portion). In this case, even if the solder portion is printed with a deviation from the land portion, the electronic component is mounted at the regular position with respect to the solder portion. During reflow, the electronic component flows toward the center of the land together with the molten solder. Therefore, after the reflow, as a result, the electronic component can be mounted at the proper position. In this way, when the mounting position of the electronic component is determined based on the solder mark, the electronic component can be mounted at the regular position by utilizing the self-alignment effect of the solder portion.

JP, 2013-58605, A

  However, the electronic component mounting machine may not be able to read the solder mark due to defective printing of the solder mark. In this case, the mounting position of the electronic component cannot be determined based on the solder mark. Therefore, conventionally, when the electronic component mounting machine cannot automatically read the solder mark, the operator manually specifies the solder mark of the printing defect while observing the image of the board. Then, the mounting position of the electronic component is determined based on the solder mark. However, in this case, if the skill level of the operator is low, the mounting accuracy of the electronic component is reduced. In addition, a solder portion having a shape similar to the solder mark may be printed on the board adjacent to the solder mark having the printing defect. In this case, if the skill level of the operator is low, the solder portion and the solder mark are erroneously recognized. Therefore, the mounting accuracy of the electronic component is reduced. Therefore, an object of the present invention is to provide an electronic component mounter and a production line in which mounting accuracy of electronic components is high.

  In order to solve the above-mentioned problems, an electronic component mounting machine of the present invention is an image pickup apparatus for picking up an image of a sub reference mark arranged on a substrate and a main reference mark whose image pickup position is determined with reference to the sub reference mark. When the main reference mark can be read from the image captured by the imaging device, the mounting position of the electronic component with respect to the substrate is determined with the main reference mark as a reference, and the image is caused due to a printing failure of the main reference mark. If the main reference mark cannot be read, the control device determines the mounting position based on the sub reference mark that is the reference source of the main reference mark. Here, the "printing defect" is a defect relating to a defect at the time of printing the main reference mark, such as fading, chipping, bleeding, and distortion.

  Further, in order to solve the above problems, the production line of the present invention is a production line in which a plurality of the electronic component mounting machines are juxtaposed from the upstream side to the downstream side in the transport direction of the substrate, The control device of the electronic component mounting machine at the upstream end in the transport direction, when the main reference mark cannot be read from the image, information about the unreadable main reference mark is transferred to the electronic component mounter at the downstream side in the transport direction. It is characterized by transmitting.

  According to the electronic component mounter of the present invention, the mounting position of the electronic component can be determined in principle based on the main reference mark and exceptionally based on the sub reference mark. That is, when the main reference mark cannot be read, the control device automatically uses the sub-reference mark that is the reference source of the main reference mark as a reference and the electronic component (specifically, the main reference mark that could not be read originally as a reference). The mounting position of the electronic component whose mounting position is determined) is determined. Therefore, even if the main reference mark cannot be read, it is possible to automatically continue the production of the substrate. Further, according to the electronic component mounter of the present invention, even when the control device cannot read the main reference mark from the image, the operator manually performs the work (the operation of identifying the main reference mark of the printing defect while observing the image). Does not intervene. Therefore, the mounting accuracy of electronic components is high.

  Further, according to the production line of the present invention, the electronic component mounting machine on the downstream side in the transport direction can recognize the unreadable main reference mark by transmitting the information from the electronic component mounting machine on the upstream end in the transport direction. Therefore, the electronic component mounting machine on the downstream side in the transport direction can skip the reading of the unreadable main reference mark. Therefore, the number of man-hours for reading the mark can be reduced in the electronic component mounting machine on the downstream side in the transport direction.

FIG. 1 is a schematic diagram of a production line according to an embodiment of the present invention. FIG. 2 is a top view of the electronic component mounter according to the embodiment of the present invention. FIG. 3A is a top view of the board before the solder printer is carried in. FIG. 3B is a top view of the substrate after the solder printer is carried out. FIG. 3C is a top view of the board after the electronic component mounting machine is carried out. FIG. 3D is a top view of the substrate after carrying out the reflow furnace. FIG. 4 is a flowchart of the mounting position determination method. FIG. 5A is a top view of the substrate after the solder printer is carried out. FIG. 5B is a top view of the board after carrying out the electronic component mounter at the upstream end in the carrying direction. FIG. 6 is a skip necessity inquiry screen.

  Embodiments of an electronic component mounter and a production line of the present invention will be described below.

<Production line configuration>
First, the configuration of the production line of this embodiment will be described. FIG. 1 shows a schematic diagram of the production line of this embodiment. As shown in FIG. 1, the production line 1 includes a solder printing machine 3, a solder printing inspection machine 4, and a plurality of electronic component mounting machines from the left side (upstream side in the transport direction) to the right side (downstream side in the transport direction). 5, a reflow furnace 6, and a board appearance inspection machine 7. These devices are communicatively connected.

  FIG. 2 shows a top view of the electronic component mounter of this embodiment. The configurations of the plurality of electronic component mounters 5 are the same. As shown in FIGS. 1 and 2, the electronic component mounter 5 includes a control device 50, a component supply device 51, a board transfer device 52, a pair of upper and lower X-axis guide rails 53, and an X-axis slide 54. A pair of left and right Y-axis guide rails 55, a Y-axis slide 56, and a mounting head 57 are provided.

  As shown in FIG. 2, the component supply device 51 includes a large number of tapes 510. The tape 510 contains electronic components. The substrate transfer device 52 includes a pair of front and rear conveyor belts 520. The substrate 8 is conveyed from the left side to the right side by a pair of front and rear conveyor belts 520. The pair of left and right Y-axis guide rails 55 are arranged on the upper wall of the housing (not shown) of the electronic component mounter 5. The Y-axis slide 56 is attached to the pair of left and right Y-axis guide rails 55 so as to be slidable in the front-rear direction. The pair of upper and lower X-axis guide rails 53 are arranged on the Y-axis slide 56. The X-axis slide 54 is attached to the pair of upper and lower X-axis guide rails 53 so as to be slidable in the left-right direction. The mounting head 57 is attached to the X-axis slide 54. Therefore, the mounting head 57 can move back and forth and left and right. The mounting head 57 includes a suction nozzle 570 and an imaging device 571. The suction nozzle 570 can convey electronic components from the component supply device 51 to the substrate 8. The image pickup device 571 is a CCD (Charge-Coupled Device) camera. The image pickup device 571 can pick up an image of the upper surface of the substrate 8.

  As shown in FIG. 1, the control device 50 includes a communication control circuit 500, an input/output interface 501, a computer 502, an image processing device 503, and a display device 505. The input/output interface 501 is connected to the communication control circuit 500, the computer 502, the image processing device 503, and the display device 505. The communication control circuit 500 is connected to another device that constitutes the production line 1. The computer 502 includes a calculation unit 502a and a storage unit 502b. The storage unit 502b stores in advance data regarding wiring patterns, board marks, solder portions, solder marks, positions and shapes of electronic components, which will be described later. The image processing device 503 is connected to the imaging device 571. The display device 505 is a touch screen (not shown). The operator can visually recognize the information displayed on the display device 505. Further, the worker can input an instruction on the display device 505.

<Substrate production method>
Next, a board production method executed by the production line of this embodiment will be described. FIG. 3A shows a top view of the substrate before the solder printer is carried in. FIG. 3B shows a top view of the board after the solder printer is carried out. FIG. 3C shows a top view of the board after the electronic component mounting machine is carried out. FIG. 3D shows a top view of the substrate after carrying out the reflow furnace. 3B to FIG. 3D show the case where the solder portion 82 of the solder printer 3 shown in FIG. 1 is in a good printing state.

  As shown in FIG. 3A, a plurality of wiring patterns 80 and a plurality of board marks F1 to F3 have already been printed on the board 8 before being carried into the solder printer 3 shown in FIG. There is. The wiring pattern 80 includes a land portion 800. The plurality of wiring patterns 80 and the plurality of substrate marks F1 to F3 are printed at the same time. Therefore, the plurality of wiring patterns 80 and the plurality of board marks F1 to F3 are arranged in the same coordinate system.

  As shown in FIG. 3B, a plurality of solder portions 82 are printed on the substrate 8 after being carried out from the solder printer 3 shown in FIG. The predetermined solder portion 82 among the plurality of solder portions 82 is used as the solder marks f1 to f4. The plurality of solder portions 82 are printed simultaneously by the same screen mask. Therefore, the plurality of solder portions 82 and the plurality of solder marks f1 to f4 are arranged in the same coordinate system. As exaggeratedly shown in FIG. 3B, the solder portion 82 (including the solder marks f1 to f4) is printed with a deviation from the land portion 800. However, the printed state of all the solder marks f1 to f4 is good.

  As shown in FIG. 3C, a plurality of electronic components P1 to P6 are mounted on the board 8 after passing through all the electronic component mounters 5 shown in FIG. The mounting positions of all the electronic components P1 to P6 are determined on the basis of the solder marks f1 to f4 that are in good printing condition. Therefore, the plurality of electronic components P1 to P6 are accurately mounted on the solder portion 82. On the other hand, the plurality of electronic components P1 to P6 and the solder portion 82 are displaced from the land portion 800.

  As shown in FIG. 3D, in the substrate 8 after being unloaded from the reflow furnace 6 shown in FIG. 1, due to the self-alignment effect described above, the plurality of electronic components P1 to P6 and the solder portion 82 with respect to the land portion 800 are formed. The gap has been resolved. That is, the plurality of electronic components P1 to P6 and the solder portion 82 are accurately arranged with respect to the land portion 800.

<How to determine the mounting position>
Next, a mounting position determination method executed in the board production method will be described. The mounting position determining method is executed when the mounting positions of the electronic components P1 to P6 shown in FIG. 3D are determined by the electronic component mounting machine 5 shown in FIG.

  FIG. 4 shows a flowchart of the mounting position determining method. FIG. 5A shows a top view of the substrate after the solder printer is carried out. FIG. 5B shows a top view of the board after carrying out the electronic component mounter at the upstream end in the carrying direction. FIG. 6 shows a skip necessity inquiry screen.

  Note that FIG. 5A corresponds to FIG. 3B, and FIG. 5B corresponds to FIG. 3C. FIG. 5A and FIG. 5B show the case where the printing state of the solder portion 82 in the solder printing machine 3 is poor.

  As shown in FIG. 4, the mounting position determining method includes a substrate mark reading step (S2 of FIG. 4 (step 2. The same applies hereinafter)), a skip flag confirmation step (S4 of FIG. 4), and a solder mark reading step (FIG. 4) and a skip necessity determination step (S9 to S11 in FIG. 4).

[In the case of an electronic component mounter at the upstream end (head) in the transport direction]
In the leading electronic component mounter 5, of the electronic components P1 to P6 shown in FIG. 3D, the electronic components P1 and P2 are mounted at predetermined positions on the substrate 8. As shown in FIG. 4, the imaging device 571 of the leading electronic component mounter 5 shown in FIG. 1 first images the board marks F1 to F3 after the automatic operation starts (S1 in FIG. 4). The image processing device 503 processes the images of the board marks F1 to F3. The computer 502 reads the board marks F1 to F3 from the processed image (S2 in FIG. 4).

  Next, the leading electronic component mounter 5 starts imaging and reading the solder marks f1 to f4 (S3 in FIG. 4). The solder portions 82 used as the solder marks f1 to f4 are determined in advance. The electronic component mounter 5 reads the solder marks f1 to f4 in a predetermined order (in this example, f1→f2→f3→f4).

  First, the computer 502 refers to the data in the storage unit 502b and confirms whether or not the skip flag is set for the solder mark f1 (S4 in FIG. 4). Here, it is the leading electronic component mounter 5 that sets the skip flag. Therefore, in the leading electronic component mounter 5, the solder marks f1 to f4 for which the skip flag is set are not confirmed.

  Subsequently, the imaging device 571 images the solder mark f1. The imaging positions of the solder marks f1 to f4 are determined with reference to the board marks F1 to F3 that have been read in the board mark reading step (S2 in FIG. 4).

  The image processing device 503 processes the image of the solder mark f1. The computer 502 reads the solder mark f1 from the processed image (S5 in FIG. 4). Then, the computer 502 determines whether or not the solder mark f1 has been read (S6 in FIG. 4). As shown in FIG. 5A, the printed state of the solder mark f1 is good. Therefore, the computer 502 can read the solder mark f1.

  In this case, the electronic component mounter 5 starts reading the solder mark f2, which is the next reading target (S7 and S3 in FIG. 4). Similarly to the solder mark f1, the electronic component mounter 5 confirms the skip flag of the solder mark f2 (S4 in FIG. 4), images the solder mark f2, and reads it (S5 in FIG. 4). Then, the computer 502 determines whether or not the solder mark f2 has been read (S6 in FIG. 4).

  Here, as indicated by the dotted line in FIG. 5A, the solder mark f2 is printed faintly. Print fading is included in the concept of "print failure" in the present invention. Therefore, the computer 502 cannot read the solder mark f2. In this case, as shown in FIG. 6, the display device 505 displays a skip necessity inquiry screen (S9 in FIG. 4). As shown in FIG. 6, an inquiry message 505b regarding skip necessity, a skip determination button 505c, and a skip cancel button 505d are displayed on the screen 505a of the display device 505.

  The operator who visually recognizes the inquiry message 505b confirms the image of the solder mark f2 via the screen of the display device 505. Here, if the worker determines that “the printing state of the solder mark f2 is good”, the worker corrects the data regarding the solder mark f2 via the screen of the display device 505. Then, the worker touches the skip cancel button 505d (S10 in FIG. 4). That is, when the computer 502 cannot read the solder mark f2 even though the printed state of the solder mark f2 is good, the data regarding the solder mark f2 in the storage unit 502b has some trouble (for example, an input error). ) Is assumed. Therefore, the operator checks the data, corrects the defect, and touches the skip cancel button 505d. The computer 502 reads the solder mark f2 again (S5 in FIG. 4).

  However, as shown by the dotted line in FIG. 5A, the solder mark f2 is faint in this example. Therefore, the operator who confirms the image of the solder mark f2 touches the skip determination button 505c (S10 in FIG. 4). The computer 502 sets a skip flag for the unreadable solder mark f2 (S11 in FIG. 4). The information (skip flag) regarding the solder mark f2 is transmitted to the control device 50 of the electronic component mounting machine 5 on the downstream side (subsequent) in the transport direction shown in FIG. The skip flag is stored in the storage unit 502b of the subsequent electronic component mounting machine 5.

  The electronic component mounter 5 subsequently reads the solder mark f3 (S7→S3→S4→S5→S6 in FIG. 4) and finally reads the solder mark f4 (S7→S3→in FIG. 4). S4→S5→S6). When all the solder marks f1 to f4 have been read (S7 in FIG. 4), the computer 502 of the leading electronic component mounter 5 mounts the electronic component mounter 5 as shown in FIG. 5B. The mounting positions of the electronic components P1 and P2 are determined (S8 in FIG. 4).

  The computer 502 basically determines the mounting position of the electronic component P1 based on the solder marks f1 and f3, and exceptionally based on the board marks F1 to F3. In addition, the mounting position of the electronic component P2 is basically determined based on the solder marks f2 and f4, and exceptionally based on the board marks F1 to F3.

  The method of determining the mounting position of the electronic component P1 will be described below as a representative. When all of the solder marks f1 and f3 have been read (S6 in FIG. 4), the computer 502 determines the mounting position of the electronic component P1 based on the two solder marks f1 and f3 in diagonal positions. That is, based on the deviation between the positions of the solder marks f1 and f3 stored in the storage unit 502b in advance and the positions of the actually read solder marks f1 and f3, the electronic components stored in the storage unit 502b in advance. Correct the mounting position of P1.

  On the other hand, when at least one of the solder marks f1 and f3 cannot be read (S6 in FIG. 4), the computer 502 determines the mounting position of the electronic component P1 to be the board mark which is the reference source of the imaging position of the solder marks f1 and f3. Determine based on F1 to F3. That is, based on the deviation between the positions of the board marks F1 to F3 stored in advance in the storage unit 502b and the positions of the actually read board marks F1 to F3, the electronic components stored in advance in the storage unit 502b. Correct the mounting position of P1. As described above, the computer 502 determines the mounting position of the electronic component P1 based on the solder marks f1 and f3 in principle and exceptionally based on the board marks F1 to F3. The same applies to the electronic component P2.

  In the case of this example, since the solder marks f1 and f3 have been read, the computer 502 determines the mounting position of the electronic component P1 based on the solder marks f1 and f3. On the other hand, since the solder mark f2 could not be read, the computer 502 determines the mounting position of the electronic component P2 with reference to the board marks F1 to F3.

  Then, the suction nozzle 570 shown in FIG. 2 mounts the electronic components P1 and P2 on the determined mounting coordinates. As shown in FIG. 5B, the electronic component P1 is accurately mounted on the solder portion 82. On the other hand, the electronic component P2 is accurately mounted on the land portion 800.

[For electronic component mounters on the downstream side (subsequent) in the transport direction]
The subsequent electronic component mounter 5 shown in FIG. 1 also executes the mounting position determination method shown in FIG. 4 as with the leading electronic component mounter 5. However, the skip flag has already been transmitted to the subsequent electronic component mounter 5 from the leading electronic component mounter 5 for the unreadable solder mark f2. The computer 502 of the subsequent electronic component mounter 5 confirms the skip flag in the skip flag confirmation step (S4 of FIG. 4). Therefore, the computer 502 skips the imaging and reading of the solder mark f2. That is, in the subsequent electronic component mounting machine 5, imaging and reading are performed in the order of the solder marks f1→f3→f4. The computer 502 of the subsequent electronic component mounter 5 determines the mounting position of the electronic component, which was supposed to be determined based on the solder mark f2, based on the board marks F1 to F3.

<Effect>
Next, the operation and effect of the electronic component mounter and the production line of this embodiment will be described. As shown in FIGS. 5A and 5B, according to the electronic component mounter 5 of the present embodiment, the mounting positions of the electronic components P1 and P2 are basically determined based on the solder marks f1 to f4. Exceptionally, it can be determined based on the substrate marks F1 to F3. That is, as shown in FIG. 4, when the solder mark f2 cannot be read, the control device 50 automatically sets the electronic component P2 (based on the board marks F1 to F3, which are the reference sources of the image pickup positions of the solder mark f2, as a reference. Specifically, the mounting position of the electronic component P2) whose mounting position is originally determined based on the unreadable solder mark f2 is determined. Therefore, even if the solder mark f2 cannot be read, the production of the substrate 8 can be automatically continued. Further, according to the electronic component mounter 5 of the present embodiment, even if the control device 50 cannot read the solder mark f2 from the image, the operator manually performs (the solder mark f2 of the printing defect is identified while observing the image. Work) does not intervene. Therefore, the mounting accuracy of the electronic component P2 is high.

  Further, as shown in FIG. 1, according to the production line 1 of the present embodiment, the information (skip flag) is transmitted from the leading electronic component mounter 5, so that the subsequent electronic component mounter 5 cannot read the unreadable solder. The mark f2 can be recognized. Therefore, the subsequent electronic component mounter 5 can skip the imaging and reading of the unreadable solder mark f2. Therefore, in the subsequent electronic component mounting machine 5, it is possible to reduce the man-hours for picking up marks and the man-hours for reading marks.

  Further, as shown in FIGS. 4 and 5, the display device 505 of the leading electronic component mounter 5 displays an inquiry message 505b when the control device 50 cannot read the solder mark f2. Therefore, the operator who visually recognizes the inquiry can check the reason why the solder mark f2 cannot be read. If the computer 502 cannot read the solder mark f2 even though the print state of the solder mark f2 is good, some trouble (for example, an input error, etc.) may be found in the data regarding the solder mark f2 in the storage unit 502b. ) Is assumed. In this respect, since the display device 505 displays the inquiry message 505b, the operator can easily find and correct the defect.

<Other>
The embodiments of the electronic component mounter and the production line of the present invention have been described above. However, the embodiment is not particularly limited to the above embodiment. It is also possible to implement in various modified forms and improved forms that can be performed by those skilled in the art.

  The solder marks f1 to f4 for mounting and positioning the electronic components P1 and P2 are not particularly limited. The mounting position of the electronic component P1 may be determined from at least one of the solder marks f1 to f4 on the substrate 8. The same applies to the electronic component P2. The solder marks f1 to f4 for mounting and positioning the plurality of electronic components P1 and P2 may be completely identical. Further, only part of them may match. It may also be completely different.

  The single solder marks f1 to f4 may be set based on the plurality of solder portions 82. For example, the center of gravity of a virtual quadrangle formed by connecting the outer edges of the four solder portions 82 at the left rear corner of FIG. 5A may be the solder mark f1. In this case, if at least one of the four solder portions 82 is defective in printing, the solder mark f1 (center of gravity) may be unreadable. If the center of gravity can be calculated, the solder mark f1 (center of gravity) may be read. As the solder marks f1 to f4, in addition to the solder part 82 for joining electronic components, a solder part 82 dedicated to the mark may be used. That is, the solder marks f1 to f4 may have the same coordinate system as the solder portion 82.

  The board marks F1 to F3 for image pickup positioning of the solder marks f1 to f4 are not particularly limited. The mounting position of the solder mark f1 may be determined from at least one of the board marks F1 to F3. The same applies to the solder marks f2 to f4. The board marks F1 to F3 for image pickup positioning of the plurality of solder marks f1 to f4 may be exactly the same. Further, only part of them may match. It may also be completely different. The land portion 800 may be used as the substrate marks F1 to F3. That is, the board marks F1 to F3 may have the same coordinate system as the wiring pattern 80.

  The types of marks for the main reference mark and the sub reference mark are not particularly limited. For example, it may be a character, a figure, a symbol, or a combination thereof. There is no particular limitation on the number of main reference marks and sub reference marks to be arranged and the arrangement positions. The type of main reference mark is not particularly limited. In addition to the solder marks f1 to f4, a component mark (for example, a mark on an electronic component used for mounting positioning when another electronic component is mounted on the upper surface of the electronic component) may be used.

  The type of substrate 8 is not particularly limited. For example, a plurality of dividable product substrates may be arranged on a single sheet substrate. In this case, the main reference mark may be arranged on at least one of the sheet substrate and the product substrate. The same applies to the sub reference mark.

  The type of the image pickup device 571 is not particularly limited. It may be a CMOS camera (Complementary Metal-Oxide Semiconductor) camera. The type, arrangement, and number of devices that make up the production line 1 are not particularly limited. For example, the solder printing inspection machine 4 may not be arranged.

  1: Production line, 3: Solder printing machine, 4: Solder printing inspection machine, 5: Electronic component mounting machine, 50: Control device, 500: Communication control circuit, 501: Input/output interface, 502: Computer, 502a: Arithmetic unit , 502b: storage unit, 503: image processing device, 505: display device, 505a: screen, 505b: inquiry message, 505c: skip decision button, 505d: skip cancel button, 51: component supply device, 510: tape, 52: Substrate transfer device, 520: conveyor belt, 53: X-axis guide rail, 54: X-axis slide, 55: Y-axis guide rail, 56: Y-axis slide, 57: mounting head, 570: suction nozzle, 571: imaging device, 6: Reflow furnace, 7: Board appearance inspection machine, 8: Board, 80: Wiring pattern, 800: Land part, 82: Solder part, F1 to F3: Board mark, P1 to P6: Electronic parts, f1 to f4: Solder mark

The present invention relates to a determining method for determining a mounting position of an electronic component on a board , and a mounting method for mounting an electronic component using the determining method.

However, the electronic component mounting machine may not be able to read the solder mark due to defective printing of the solder mark. In this case, the mounting position of the electronic component cannot be determined based on the solder mark. Therefore, conventionally, when the electronic component mounting machine cannot automatically read the solder mark, the operator manually specifies the solder mark of the printing defect while observing the image of the board. Then, the mounting position of the electronic component is determined based on the solder mark. However, in this case, if the skill level of the operator is low, the mounting accuracy of the electronic component is reduced. In addition, a solder portion having a shape similar to the solder mark may be printed on the substrate adjacent to the solder mark having the printing defect. In this case, if the skill level of the operator is low, the solder portion and the solder mark are erroneously recognized. Therefore, the mounting accuracy of the electronic component is reduced. Therefore, it is an object of the present invention to provide a method for determining a mounting position with high accuracy in mounting an electronic component, and a mounting method for mounting an electronic component using the determination method .

In order to solve the above problems, a determination method of the present invention is a determination method for determining a mounting position of an electronic component on a board, and a step of obtaining an image of a sub-reference mark arranged on the board, Processing the image of the sub-reference mark to read the sub-reference mark, obtaining the image of the main reference mark arranged on the substrate by referring to the read sub-reference mark, and obtaining A step of processing the image of the main reference mark thus formed to determine whether or not the main reference mark can be read, and if it is determined that the main reference mark can be read, the main reference mark is used as a reference for the substrate. When the mounting position of the electronic component is determined and it is determined that the main reference mark cannot be read, the mounting position is determined based on the sub-reference mark .

In order to solve the above problems, the mounting method of the present invention, using the determination method, a mounting method for mounting the electronic component to the substrate, several of the electronic component mounting machine, wherein from the upstream side in the transport direction of the substrate toward the downstream side, in juxtaposed the production line, the control device of the electronic component mounting apparatus in the transport direction upstream end, can not read the main reference mark from the image, information about the main reference mark unreadable, characterized by feeding heat to the electronic component mounting apparatus of the downstream side.

According to the determination method of the present invention, the mounting position of the electronic component can be determined based on the main reference mark in principle and exceptionally based on the sub reference mark. That is, if not read the main reference mark is automatically, based on the sub-reference mark which is the main reference mark of the reference source, electronic components (details originally mounted position relative to the main reference mark unreadable The mounting position of the electronic component) is determined. Therefore, even if the main reference mark cannot be read, it is possible to automatically continue the production of the substrate. Further, according to the determination method of the present invention, even if not read the main reference mark from images, operator's hand work industry not intervene. Therefore, the mounting accuracy of electronic components is high.

Further, according to the mounting method of the present invention, the electronic component mounting machine on the downstream side in the transport direction can recognize the unreadable main reference mark by transmitting information from the electronic component mounting machine on the upstream end in the transport direction. Therefore, the electronic component mounting machine on the downstream side in the transport direction can skip the reading of the unreadable main reference mark. Therefore, the number of man-hours for reading the mark can be reduced in the electronic component mounting machine on the downstream side in the transport direction.

Embodiments of an electronic component mounter and a production line using the determining method and mounting method of the present invention will be described below.

Here, as indicated by the dotted line in FIG. 5A, the solder mark f2 is printed faintly . For this reason, the computer 502 can not read the solder mark f2. In this case, as shown in FIG. 6, the display device 505 displays a skip necessity inquiry screen (S9 in FIG. 4). As shown in FIG. 6, an inquiry message 505b regarding skip necessity, a skip decision button 505c, and a skip cancel button 505d are displayed on the screen 505a of the display device 505.

<Other>
The embodiments of the electronic component mounter and the production line using the determining method and the mounting method of the present invention have been described above. However, the embodiment is not particularly limited to the above embodiment. It is also possible to implement in various modified forms and improved forms that can be performed by those skilled in the art.

The type of the image pickup device 571 is not particularly limited. It may be a CMOS camera (Complementary Metal-Oxide Semiconductor) camera. The type, arrangement, and number of devices that make up the production line 1 are not particularly limited. For example, the solder printing inspection machine 4 may not be arranged.
In addition, the electronic component mounter includes an imaging device that captures an image of a sub-reference mark that is arranged on a substrate and a main reference mark whose imaging position is determined with reference to the sub-reference mark, and the imaging device that captures the image. When the main reference mark can be read from the image, the mounting position of the electronic component with respect to the substrate is determined based on the main reference mark, and the main reference mark can be read from the image due to defective printing of the main reference mark. If not, an electronic component mounter including a control device that determines the mounting position based on the sub reference mark that is a reference source of the main reference mark”. Here, the "printing defect" is a defect relating to a defect at the time of printing the main reference mark, such as fading, chipping, bleeding, and distortion.
According to this electronic component mounter, the mounting position of the electronic component can be determined basically on the basis of the main reference mark and exceptionally on the basis of the sub reference mark. That is, when the main reference mark cannot be read, the control device automatically uses the sub-reference mark that is the reference source of the main reference mark as a reference and the electronic component (specifically, the main reference mark that could not be read originally as a reference). The mounting position of the electronic component whose mounting position is determined) is determined. Therefore, even if the main reference mark cannot be read, it is possible to automatically continue the production of the substrate. Further, according to this electronic component mounter, even when the control device cannot read the main reference mark from the image, the manual work of the operator (the work of identifying the main reference mark of the printing defect while looking at the image) intervenes. do not do. Therefore, the mounting accuracy of electronic components is high.
In addition, a production line is a production line in which a plurality of the electronic component mounting machines are juxtaposed from the upstream side to the downstream side in the transport direction of the substrate, and the electronic component mounting at the upstream end in the transport direction is performed. When the main reference mark cannot be read from the image, the control device of the machine may be a production line that transmits information about the unreadable main reference mark to the electronic component mounting machine on the downstream side in the transport direction. ..
According to this production line, the electronic component mounter on the downstream side in the transport direction can recognize the unreadable main reference mark by transmitting information from the electronic component mounter on the upstream end in the transport direction. Therefore, the electronic component mounting machine on the downstream side in the transport direction can skip the reading of the unreadable main reference mark. Therefore, it is possible to reduce the number of man-hours for reading the mark in the electronic component mounting machine on the downstream side in the transport direction.

Claims (4)

An image pickup device for picking up an image of a sub reference mark arranged on a substrate and a main reference mark whose image pickup position is determined with reference to the sub reference mark,
When the main reference mark can be read from the image captured by the imaging device, the mounting position of the electronic component on the substrate is determined with the main reference mark as a reference, and the main reference mark is printed from the image due to printing failure of the main reference mark. If the main reference mark cannot be read, a control device that determines the mounting position based on the sub reference mark that is a reference source of the main reference mark,
An electronic component mounter equipped with. The board has a land portion arranged on the board, a solder portion arranged on the land portion, a board mark having the same coordinate system as the land portion, and a solder mark having the same coordinate system as the solder portion. Has,
The sub-reference mark is the substrate mark,
The electronic component mounter according to claim 1, wherein the main reference mark is the solder mark. A production line in which the plurality of electronic component mounters according to claim 1 or 2 are juxtaposed from the upstream side to the downstream side in the transport direction of the substrate,
When the controller of the electronic component mounting machine at the upstream end in the transport direction cannot read the main reference mark from the image, the electronic component mounter at the downstream side in the transport direction provides information about the unreadable main reference mark. To the production line to be transmitted.   The electronic component mounting machine at the upstream end in the transport direction includes a display device that inquires of a worker whether or not to skip the reading work when the control device cannot read the main reference mark from the image. Production line.

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