JP2020079366A - Method of forming heat storage material - Google Patents

Abstract

To form a heat storage material having excellent shape followability.SOLUTION: A method of forming a heat storage material includes a step for disposing a curable composition 6 for thermal contact with a heat source 3 and curing the curable composition 6 to obtain a heat storage material 7.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat storage material forming method.

  The heat storage material is a material that can take out stored energy as heat as needed. This heat storage material is used in applications such as air conditioning equipment, floor heating equipment, refrigerators, electronic parts such as IC chips, automobile interior and exterior materials, automobile parts such as canisters, and heat insulation containers.

  As a method of storing heat, latent heat storage using a phase change of a substance is widely used in terms of the amount of heat. Water-ice is well known as a latent heat storage material. Water-ice is a substance having a large amount of heat, but its phase change temperature is limited to 0° C. in the atmosphere, so that its applicable range is also limited. Therefore, paraffin is used as a latent heat storage material having a phase change temperature of higher than 0°C and 100°C or lower. However, paraffin becomes a liquid when it undergoes a phase change due to heating, and there is a risk of ignition and ignition. Therefore, in order to use paraffin as a heat storage material, it should be stored in a closed container such as a bag. Must be prevented from leaking, and is subject to application field restrictions.

  For such a problem, a heat storage material in which a heat storage material is formed into microcapsules and the microcapsules are dispersed in a polymer or the like has been studied. For example, Patent Document 1 discloses a heat storage material including a thermoplastic polymer, a capsule core made of a latent heat storage material, and microcapsules having a polymer as a capsule wall.

Japanese Patent Publication No. 2014-500359

  By the way, in recent years, in electronic parts and the like to which the heat storage material is applied, the structure of the parts is complicated and the density is high, and it is necessary to arrange the heat storage material in a place having a complicated shape. Is required to be able to follow such a shape (excellent shape followability). However, when a heat storage material containing a thermoplastic polymer as disclosed in Patent Document 1 is used, a preformed heat storage material is arranged at a predetermined location, but that location has a complicated shape. If so, the heat storage material may not be able to follow its shape.

  Then, this invention aims at forming the heat storage material which is excellent in shape following property.

  One aspect of the present invention is a method for forming a heat storage material, including a step of disposing a curable composition so as to be in thermal contact with a heat source and curing the curable composition to obtain a heat storage material.

  In this method, a heat storage material is obtained by disposing a curable composition and curing it. That is, the composition for forming the heat storage material is placed in a predetermined position in an uncured state, and then the composition is cured. Therefore, even when the place has a complicated shape, at the time of arranging the composition, the composition in an uncured state has fluidity or flexibility to a degree suitable for following the shape. Therefore, the shape-following property of the heat storage material obtained by curing is also excellent.

  The curable composition may contain a curable component and a capsule containing a heat storage component, or may contain a component having heat storage properties and curability.

  The curable composition may be in the form of a sheet or a liquid. When the curable composition is liquid, the curable composition may be arranged and cured by mixing the first liquid and the second liquid.

  Curing of the curable composition may be carried out by heating the curable composition, may be carried out by irradiating the curable composition with light, or by reacting the curable composition with water. Alternatively, it may be performed by blocking oxygen contacting the curable composition.

  According to the present invention, it is possible to form a heat storage material having an excellent shape following property.

It is a schematic cross section which shows one Embodiment of the formation method of a heat storage material. It is a schematic cross section which shows other embodiment of the formation method of a heat storage material. It is a schematic cross section which shows other embodiment of the formation method of a heat storage material. It is a schematic cross section which shows other embodiment of the formation method of a heat storage material.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view showing an embodiment of a heat storage material forming method. In the heat storage material forming method (manufacturing method) of the present embodiment, first, as shown in FIG. 1A, an electronic component 1 is prepared as an article to be provided with the heat storage material. The electronic component 1 includes, for example, a substrate (for example, a circuit board) 2, a semiconductor chip (heat source) 3 provided on the substrate 2, and a plurality of connecting portions (for example, solder) 4 for connecting the semiconductor chip 3 to the substrate 2. Is equipped with. In this electronic component 1, the semiconductor chip 3 serves as a heat source. The plurality of connecting portions 4 are provided between the substrate 2 and the semiconductor chip 3 so as to be separated from each other. That is, there is a gap between the substrate 2 and the semiconductor chip 3 that separates the plurality of connecting portions 4 from each other.

  Subsequently, as shown in FIG. 1B, the curable composition 6 is filled between the substrate 2 and the semiconductor chip 3 using, for example, a syringe 5. Here, the curable composition means, for example, a composition curable by an external stimulus, and may be a completely uncured state or a partially cured state.

  In the present embodiment, the curable composition 6 is in liquid form. When the curable composition 6 is liquid at room temperature (for example, 25° C.), the curable composition 6 can be filled at room temperature. When the curable composition 6 is in a solid state at room temperature, the curable composition 6 can be heated to be in a liquid state and then filled.

  The curable composition 6 is preferably liquid at 90° C., more preferably 70° C., further preferably 50° C., particularly preferably 30° C. The viscosity of the curable composition 6 at 90° C. is preferably 100 Pa·s or less, more preferably 50 Pa·s or less, further preferably 20 Pa·s or less, and particularly preferably 10 Pa, from the viewpoint of further excellent fluidity and handleability.・S or less.

  By filling the curable composition 6 as described above, as shown in FIG. 1C, the curable composition 6 is provided in the above-mentioned gap existing between the substrate 2 and the semiconductor chip 3. 2. The semiconductor chip 3 and the connecting portion 4 are arranged so as to be in thermal contact with each other.

  Subsequently, the curable composition 6 is cured to form the heat storage material 7 in the above-described gap existing between the substrate 2 and the semiconductor chip 3 as shown in FIG. The method for curing the curable composition 6 is selected according to the composition of the curable composition, and may be, for example, any one of the curing methods described below or a combination of two or more thereof.

  In the curing method, in one embodiment (first embodiment), the curable composition 6 is arranged by mixing two liquids of a first liquid and a second liquid, and the curable composition 6 is cured. It may be a method of making. That is, in one embodiment, the curable composition 6 may be cured substantially at the same time as or immediately after the arrangement of the curable composition 6.

  In the first embodiment, for example, a first liquid containing a capsule containing a heat storage component (heat storage capsule) and a compound having an isocyanate group, and a second liquid containing a heat storage capsule and a curing agent may be used. it can. In this case, the compound having an isocyanate group and the curing agent constitute the curable component. The curing agent may be, for example, at least one selected from the group consisting of alcohol compounds, amine compounds and thiol compounds.

  The heat storage capsule has a heat storage component and an outer shell containing the heat storage component. The heat storage component may be a component capable of storing heat, and may be, for example, a component having heat storage properties associated with the phase transition.

  The heat storage component in the heat storage capsule is, for example, a chain saturated hydrocarbon compound (paraffin hydrocarbon compound), an organic compound such as natural wax, petroleum wax, polyethylene glycol, sugar alcohol, or a hydrate of an inorganic compound, It may be an inorganic compound such as an inorganic compound exhibiting a crystal structure change.

  As a material for forming the outer shell, a material having strength depending on the use of the heat storage material formed of the curable composition is appropriately selected. The outer shell may preferably be formed of melamine resin, acrylic resin, urethane resin, silica or the like.

  The compound having an isocyanate group may be a diisocyanate having two isocyanate groups in the molecule, and may be, for example, an aromatic diisocyanate, an aliphatic diisocyanate, an alicyclic diisocyanate or the like.

式中、Ｒ^１及びＲ^３はそれぞれ独立に水素原子又はメチル基を表し、Ｒ^２は炭素数１２〜３０のアルキル基、又はポリオキシアルキレン鎖を有する基を表し、Ｒ^４はイソシアネート基を有する有機基を表す。 The compound having an isocyanate group may be, for example, a polymer containing a structural unit represented by the following formula (1-1) and a structural unit represented by the following formula (1-2).

In the formula, R ¹ and R ³ each independently represent a hydrogen atom or a methyl group, R ² represents an alkyl group having 12 to 30 carbon atoms, or a group having a polyoxyalkylene chain, and R ⁴ has an isocyanate group. Represents an organic group.

  Since this polymer is a polymer having heat storage properties (heat storage polymer), the compound having an isocyanate group functions as a component having heat storage properties in addition to curability. When the compound having an isocyanate group is the heat storage polymer, the first liquid and the second liquid may not contain the heat storage capsule.

When R ² is an alkyl group, the alkyl group may be linear or branched. The alkyl group represented by R ² preferably has 12 to 28 carbon atoms.

式中、Ｒ^ａは水素原子又は炭素数１〜１８のアルキル基を表し、ｍは２〜４の整数を表し、ｎは２〜９０の整数を表し、＊は結合手を表す。Ｒ^２で表される基に複数存在する（ＣＨ_２）_ｍは、互いに同一でも異なっていてもよい。つまり、Ｒ^２で表されるポリオキシアルキレン鎖を有する基は、ポリオキシエチレン鎖、ポリオキシプロピレン鎖及びポリオキシブチレン鎖のいずれか一種のみを有していてよく、二種以上を有していてもよい。 When R ² is a group having a polyoxyalkylene chain, the group having a polyoxyalkylene chain is a group represented by the following formula (2), that is, a polyoxyethylene chain, a polyoxypropylene chain and a polyoxybutylene chain. It may be a group having at least one polyoxyalkylene chain selected from the group consisting of

In the formula, R ^a represents a hydrogen atom or an alkyl group having 1 to 18 carbon atoms, m represents an integer of 2 to 4, n represents an integer of 2 to 90, and * represents a bond. A plurality of (CH ₂ ) _m present in the group represented by R ² may be the same or different from each other. That is, the group having a polyoxyalkylene chain represented by R ² may have only one kind of polyoxyethylene chain, polyoxypropylene chain and polyoxybutylene chain, and has two or more kinds. You may.

  In the first embodiment, for example, the first liquid containing the heat storage capsule and the compound having an epoxy group and the second liquid containing the heat storage capsule and the curing agent can also be used. In this case, the compound having an epoxy group and the curing agent constitute the curable component. The curing agent may be, for example, at least one selected from the group consisting of thiol compounds and amine compounds.

  The compound having an epoxy group may be, for example, a compound having an epoxy group and an aromatic ring, wherein the amino group and the hydroxyl group of the compound having one or both of the amino group and the hydroxyl group and the aromatic ring are glycidylated. (Glycidyl compound) may be used.

  The compound having such an epoxy group is, for example, “jER (registered trademark) YX4000”, “jER604”, “jER630”, “jER828”, “jER807”, “jER152”, “YED216” (trade name, Mitsubishi Chemical Co., Ltd.), “ELM120”, “ELM100”, “ELM434” (above, trade name, manufactured by Sumitomo Chemical Co., Ltd.), “Araldite (registered trademark) MY720”, “Araldite MY721”, “Araldite MY722”. , "Araldite MY9512", "Araldite MY9612", "Araldite MY9634", "Araldite MY9663", "Araldite MY0500", "Araldite MY0510" (above, product name, manufactured by Huntsman Japan KK), "TGDAS". As mentioned above, trade name, manufactured by Konishi Chemical Industry Co., Ltd., "Epiclone (registered trademark) HP4700", "Epiclone HP4710", "Epiclone HP4770", "Epiclone N660", "Epiclone GP7200", (above, trade name, DIC) (Manufactured by Co., Ltd.) and the like.

  In the first embodiment, for example, the first liquid containing the heat storage capsule, the compound having a (meth)acryloyl group, and an oxidizing agent, the heat storage capsule described above, the compound having a (meth)acryloyl group, and A second liquid containing a reducing agent can also be used. In this case, radicals are generated when the first liquid and the second liquid are mixed, and the mixture containing (meth)acryloyl can be cured.

式中、Ｒ^７は水素原子又はメチル基を表し、Ｒ^８は有機基を表す。 The compound having a (meth)acryloyl group may include, for example, a compound represented by the following formula (3).

In the formula, R ⁷ represents a hydrogen atom or a methyl group, and R ⁸ represents an organic group.

The organic group represented by R ⁸ is, for example, a hydrocarbon group such as an alkyl group, a cycloalkyl group or an aromatic hydrocarbon group, a group having a polyoxyalkylene chain, a heterocycle-containing group or an oxygen atom such as an alkoxy group. It may be a group having a silicon atom such as a group having a silane group, a group having a siloxane bond, a group having a halogen atom such as a fluorine atom.

  The compound having a (meth)acryloyl group is a polyacrylic (meth)acrylate, a polyurethane (meth)acrylate, a polyester (meth)acrylate, a polyether (meth)acrylate, a polyepoxy (meth)acrylate, or a terminal (meth)acryl-modified. It may be polybutadiene or the like.

  The oxidizing agent is an organic peroxide such as hydroperoxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, diacyl peroxide, or AIBN (2,2′-azobisisobutyronitrile), It may be an azo compound such as V-65 (azobisdimethylvaleronitrile).

  The reducing agent is a tertiary amine such as triethylamine, tripropylamine, tributylamine, N,N-dimethylparatoluidine, 2-mercaptobenzimidazole, thiourea derivative such as methylthiourea, dibutylthiourea, tetramethylthiourea and ethylenethiourea. , Transition metal salts such as cobalt naphthenate, copper naphthenate, and vanadyl acetylacetonate.

  In another embodiment (second embodiment), the curing method may be a method (heat curing) of curing the curable composition 6 by heating the disposed curable composition 6.

  The heating temperature for heating the curable composition 6 is preferably 100° C. or higher, more preferably 105° C. or higher, further preferably 110° C. or higher, and further preferably from the viewpoint that the curable composition 6 is suitably cured. It may be 120°C or higher, for example, 250°C or lower, 220°C or lower, or 200°C or lower. The heating time for heating the curable composition 6 may be appropriately selected according to the composition of the curable composition 6 so that the curable composition 6 is appropriately cured.

式中、Ｒ^５は水素原子又はメチル基を表し、Ｒ^６は水素原子又は反応性基を有する有機基を表す。反応性基は、上記の硬化剤と反応し得る基である。 The curable composition 6 used in the second embodiment is, for example, a polymer containing a structural unit represented by the above formula (1-1) and a structural unit represented by the following formula (1-3), and a curing agent. Contains and. In this case, the polymer and the curing agent constitute the curable component. This polymer is a polymer having a heat storage property in addition to the curability (heat storage polymer).

In the formula, R ⁵ represents a hydrogen atom or a methyl group, and R ⁶ represents a hydrogen atom or an organic group having a reactive group. The reactive group is a group capable of reacting with the above curing agent.

The reactive group for R ⁶ is, for example, at least one group selected from the group consisting of a carboxyl group, a hydroxyl group, a blocked isocyanate group, an amino group and an epoxy group.

  The curing agent is appropriately selected according to the type of the reactive group in the heat storage polymer, for example, isocyanate curing agent, phenol curing agent, amine curing agent, imidazole curing agent, acid anhydride curing agent, carvone. It may be an acid-based curing agent or the like.

  The curable composition 6 used in the second embodiment is, for example, a compound having the (meth)acryloyl group, a compound having the epoxy group, or a compound having a blocked isocyanate group, a curing agent, and It may contain a heat storage capsule. In this case, the compound having a (meth)acryloyl group, the compound having an epoxy group, or the compound having a blocked isocyanate group and a curing agent constitute a curable component.

  When the curable composition 6 contains a compound having a (meth)acryloyl group, the curing agent may be a curing agent (polymerization initiator) that generates a radical by heat. Examples of the curing agent that generates radicals by heat include azo compounds such as azobisisobutyronitrile, azobis-4-methoxy-2,4-dimethylvaleronitrile, azobiscyclohexanone-1-carbonitrile, and azodibenzoyl. Benzoyl oxide, lauroyl peroxide, di-t-butylperoxyhexahydroterephthalate, t-butylperoxy-2-ethylhexanoate, 1,1-t-butylperoxy-3,3,5-trimethylcyclohexane, Examples thereof include organic peroxides such as t-butyl peroxyisopropyl carbonate.

  When the curable composition 6 contains a compound having an epoxy group, the curing agent may be a thermosetting agent that accelerates the curing reaction with the epoxy compound by heat. Examples of the thermosetting agent include phenol compounds such as bisphenol A, bisphenol F, bisphenol S, 4,4′-biphenylphenol, and tetramethylbisphenol A, diaminodiphenylmethane, diaminodiphenylsulfone, diaminodiphenylether, p-phenylenediamine, m-phenylene. Amine compounds such as diamines, phthalic anhydrides, trimellitic anhydrides, pyromellitic anhydrides, benzophenone tetracarboxylic anhydrides, acid anhydrides such as ethylene glycol trimellitic anhydrides, and 2-methylimidazole, 2 It may be at least one selected from the group consisting of imidazole compounds such as -ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, and 2-heptadecylimidazole.

  A compound having a blocked isocyanate group has an isocyanate group blocked (protected) by a blocking agent (protective group) that can be removed by heat. The compound having a blocked isocyanate group is a compound having an isocyanate group protected by a blocking agent in the above-mentioned compound having an isocyanate group. Examples of the blocking agent include oxime compounds such as formaldoxime, acetoaldoxime, acetoxime, methylethylketoxime, and cyclohexanone oxime; pyrazole compounds such as pyrazole, 3-methylpyrazole, and 3,5-dimethylpyrazole; ε-caprolactam, δ- Lactam compounds such as valerolactam, γ-butyrolactam and β-propiolactam; mercaptan compounds such as thiophenol, methylthiophenol and ethylthiophenol; acid amide compounds such as acetic acid amide and benzamide; succinimide and maleic imide Examples thereof include imide compounds.

  In another embodiment (third embodiment), the curing method may be a method of curing the curable composition 6 by irradiating the arranged curable composition 6 with light (photocuring). The irradiation light may be, for example, light (ultraviolet light) containing at least part of the wavelength of 200 to 400 nm. The irradiation energy and irradiation time for irradiating the curable composition 6 with light are appropriately selected according to the composition of the curable composition 6 so that the curable composition 6 is appropriately cured.

  The curable composition 6 used in the third embodiment includes, for example, the compound having the (meth)acryloyl group, a curing agent (polymerization initiator) that generates radicals by light, and the heat storage capsule. contains. In this case, the compound having a (meth)acryloyl group and the curing agent constitute the curable component.

  The curing agent that generates radicals by light is not particularly limited as long as it initiates photopolymerization, for example, a benzoin ether photopolymerization initiator, an acetophenone photopolymerization initiator, an α-ketol photopolymerization initiator, Aromatic sulfonyl chloride photopolymerization initiator, photoactive oxime photopolymerization initiator, benzoin photopolymerization initiator, benzyl photopolymerization initiator, benzophenone photopolymerization initiator, ketal photopolymerization initiator, thioxanthone photopolymerization It may be a polymerization initiator, an acylphosphine oxide-based photopolymerization initiator, or the like.

  The curing method may be a method of curing the curable composition 6 by reacting the disposed curable composition 6 with water in another embodiment (fourth embodiment), and more specifically, May be, for example, a method of curing the curable composition 6 by reacting the arranged curable composition 6 with moisture (humidity) in the air (moisture curing).

  The curable composition 6 used in the fourth embodiment contains, for example, the above compound having an isocyanate group and the above heat storage capsule. In this case, the compound having an isocyanate group constitutes the curable component. When the compound having an isocyanate group is a heat storage polymer containing the structural unit represented by the above formula (1-1) and the structural unit represented by the above formula (1-2), the curable composition 6 May not contain the heat storage capsule.

  In another embodiment (fifth embodiment), the curing method is a method (anaerobic curing) of curing the curable composition 6 by blocking oxygen contacting the disposed curable composition 6. Good.

  The curable composition 6 used in the fifth embodiment is, for example, a compound having the above (meth)acryloyl group, a curing agent (polymerization initiator) that generates radicals under anaerobic conditions, and the above heat storage capsule. Contains and. In this case, the compound having a (meth)acryloyl group and the curing agent constitute the curable component.

  The curing agent that generates radicals under anaerobic conditions is not particularly limited as long as it is a polymerization initiator used in an anaerobic curable composition, and examples thereof include cumene hydroperoxide and t-butyl hydroper. Hydroperoxide compounds such as oxide, p-methane hydroperoxide, methyl ethyl ketone peroxide, cyclohexane peroxide, dicumyl peroxide, diisopropylbenzene hydroperoxide, etc., other ketone peroxide compounds, diallyl peroxide compounds, peroxyester compounds Organic peroxides such as

  The curable composition 6 in each of the above-described embodiments may further contain other additives, if necessary. Other additives include, for example, a curing accelerator, an antioxidant, a colorant, a filler, a crystal nucleating agent, a heat stabilizer, a heat conductive material, a plasticizer, a foaming agent, a flame retardant, a vibration damping agent, a dehydrating agent, etc. Is mentioned.

  In the heat storage material forming method described above, the curable composition 6 for forming the heat storage material 7 is placed in an uncured state between the substrate 2 and the semiconductor chip 3, and then the curable composition 6 is placed. Is being cured. Therefore, even if the place where the curable composition 6 is arranged has a complicated shape (irregular shape) formed by the substrate 2, the semiconductor chip 3, and the connection portion 4, the curable composition 6 is arranged. At that time, since the curable composition 6 in an uncured state has fluidity that can appropriately follow the shape, the heat storage material 7 obtained by curing also has excellent shape followability. . Therefore, the heat generated in the semiconductor chip 3 which is a heat source and conducted to the connection portion 4 and the substrate 2 is also efficiently conducted to the heat storage material 7 and is preferably stored in the heat storage material 7.

  In the above-mentioned embodiment, the curable composition 6 is in a liquid form, but in another embodiment, the curable composition may be in a sheet form. FIG. 2 is a schematic cross-sectional view showing another embodiment of the heat storage material forming method. In the heat storage material forming method (manufacturing method) of the present embodiment, first, as shown in FIG. 2A, an electronic component 11 is prepared as an article to be provided with the heat storage material. The electronic component 11 includes, for example, a substrate 2 and a semiconductor chip (heat source) 3 provided on the substrate 2.

  Then, as shown in FIG. 2B, the sheet-shaped curable composition 16 is arranged on the substrate 2 and the semiconductor chip 3 so as to be in thermal contact with each of the substrate 2 and the semiconductor chip 3. The curable composition 16 is, for example, a composition that has been B-staged (semi-cured) by heat curing or light curing. That is, the heat storage material forming method of the present embodiment prepares the second curable composition (sheet-shaped curable composition 16) by converting the first curable composition into the B stage by thermosetting or photocuring. May be provided.

  The shear viscosity at 80° C. of the sheet-shaped curable composition 16 is preferably 11000 Pa·s or less, or 8000 Pa·s or less, more preferably 1000 Pa·s or less, from the viewpoint of further excellent shape following property. The shear viscosity is measured by using ARES (manufactured by Rheometric Scientific Co., Ltd.) while applying a strain of 5% to the curable composition in the form of a sheet while increasing the temperature at a rate of 5° C./min. Means a measured value.

  Subsequently, the curable composition 16 is cured to form the heat storage material 17 on the substrate 2 and the semiconductor chip 3 as shown in FIG. The curing method of the curable composition 16 may be at least one of the curing methods described above.

  Also in the method for forming the heat storage material of the present embodiment, the curable composition 16 for forming the heat storage material 17 is placed on the substrate 2 and the semiconductor chip 3 in a partially uncured state, and then cured. The composition 16 is cured. Therefore, even if the place where the curable composition 16 is arranged has a complicated shape (irregular shape) formed by the substrate 2 and the semiconductor chip 3, at the time when the curable composition 16 is arranged, Since the curable composition 6 in the uncured part has flexibility enough to follow the shape, the heat storage material 17 obtained by curing also has excellent shape followability. Therefore, the heat generated in the semiconductor chip 3 which is a heat source and conducted to the substrate 2 is also efficiently conducted to the heat storage material 7, and is suitably stored in the heat storage material 7. In addition, when the sheet-shaped curable composition 16 is a B-staged composition, for example, as compared with the case where a sheet-shaped thermoplastic composition containing a thermoplastic polymer is used instead of the curable composition 16, As a result, the adhesion to the substrate 2 and the semiconductor chip 3 is improved.

  In the above embodiment, the heat storage material is formed so as to cover the entire exposed surface of the heat source, but in another embodiment, the heat storage material may be arranged so as to cover a part of the exposed surface of the heat source. . FIG. 3 is a schematic cross-sectional view showing still another embodiment of the heat storage material forming method. In the heat storage material forming method (manufacturing method) of the present embodiment, first, as shown in FIG. 3A, an electronic component 11 is prepared as an article to be provided with the heat storage material. Hereinafter, the same components as those of the heat storage material forming method shown in FIG. 2 are denoted by the same reference numerals, and the description thereof will be omitted.

  Then, as shown in FIG. 3B, the sheet-shaped curable composition 16 is arranged on the substrate 2 and the semiconductor chip 3 so as to be in thermal contact with each of the substrate 2 and the semiconductor chip 3. In the present embodiment, the curable composition 16 is arranged in contact with (partially covering) a part of the exposed surface of the semiconductor chip (heat source) 3. The place where the curable composition 16 is arranged (the place where the curable composition 16 contacts the semiconductor chip 3) is the side surface portion of the semiconductor chip 3 in FIG. May be above.

  Subsequently, the curable composition 16 is cured to form the heat storage material 17 on the substrate 2 as shown in FIG.

  Also in the heat storage material forming method of the present embodiment, similarly to the above-described embodiment, the curable composition 16 for forming the heat storage material 17 is arranged on the substrate 2 in a partially uncured state. Thus, the curable composition 16 is cured. Therefore, the shape following property of the heat storage material 17 is excellent. Further, the adhesiveness of the curable composition 16 to the substrate 2 and the semiconductor chip 3 is improved. Further, in the heat storage material forming method of the present embodiment, the heat generated in the semiconductor chip 3 which is the heat source and the heat conducted from the semiconductor chip 3 to the substrate 2 are also efficiently conducted to the heat storage materials 7 and 17, The heat storage materials 7 and 17 are suitable for storage.

  In each of the above-described embodiments, the curable compositions 6 and 16 are arranged so as to be in direct contact with the semiconductor chip 3 which is the heat source, and the heat storage materials 7 and 17 are formed. However, the curable composition and the heat storage material are The heat source may be in thermal contact with the heat source, and in another embodiment, for example, the curable composition is arranged so as to be in thermal contact with the heat source via a thermally conductive member (heat dissipation member or the like), A heat storage material may be formed.

  FIG. 4 is a schematic cross-sectional view showing another embodiment of the heat storage material forming method. In the heat storage material forming method (manufacturing method) of the present embodiment, first, as shown in FIG. 4A, an electronic component 11 is prepared as an article to be provided with the heat storage material.

  Subsequently, as shown in FIG. 4B, the sheet-shaped curable composition 16 is arranged on the surface of the substrate 2 opposite to the surface on which the semiconductor chip 3 is provided. In the present embodiment, the curable composition 16 is not in direct contact with the semiconductor chip 3, but is in thermal contact with the semiconductor chip 3 via the substrate 2. The location where the curable composition 16 is arranged may be on any surface of the substrate 2 as long as it is in thermal contact with the semiconductor chip 3.

  Subsequently, the curable composition 16 is cured to form the heat storage material 17 on the substrate 2 as shown in FIG.

  Even in this case, since the curable composition 16 is disposed on the heat conductive member (substrate 2) in a partially uncured state, it is necessary to form a heat storage material that follows the shape of the heat conductive member. You can Therefore, the heat generated by the heat source is efficiently conducted to the heat storage material via the heat conductive member, and is suitably stored in the heat storage material.

  In each of the embodiments described with reference to FIGS. 2 to 4, the heat storage material 17 is formed using the B-staged sheet-like curable composition 16 as the curable composition. In an example, the curable composition may be a liquid curable composition. In this case, for example, a part or all of the exposed surface of the semiconductor chip (heat source) 3 or the surface of the substrate 2 opposite to the surface on which the semiconductor chip 3 is provided is coated with a liquid curable composition. Then, the heat storage material may be formed by curing.

  In each of the above embodiments, the heat source is the semiconductor chip 3, but in another embodiment, the heat source may be an electronic element other than the semiconductor chip, and may be an air conditioner in an automobile, a building, a public facility, an underground mall, or the like. It may be a heat source in equipment, a heat source in an engine of an automobile, or the like. Even in this case, the heat generated by each heat source is efficiently conducted to the heat storage material and is preferably stored in the heat storage material.

1, 11... Electronic parts, 2... Substrate, 3... Semiconductor chip (heat source), 4... Connection part, 5... Syringe, 6, 16... Curable composition, 7, 17... Heat storage material.

Claims (10)

  A method for forming a heat storage material, comprising the step of disposing a curable composition so as to be in thermal contact with a heat source and curing the curable composition to obtain a heat storage material.   The method for forming a heat storage material according to claim 1, wherein the curable composition contains a curable component and a capsule containing a heat storage component.   The method for forming a heat storage material according to claim 1 or 2, wherein the curable composition contains a component having heat storage properties and curability.   The method for forming a heat storage material according to claim 1, wherein the curable composition has a sheet shape.   The method for forming a heat storage material according to claim 1, wherein the curable composition is in a liquid state.   The method for forming a heat storage material according to claim 5, wherein the disposition and the curing of the curable composition are performed by mixing a first liquid and a second liquid.   The method for forming a heat storage material according to claim 1, wherein the curing is performed by heating the curable composition.   The method for forming a heat storage material according to claim 1, wherein the curing is performed by irradiating the curable composition with light.   The method for forming a heat storage material according to claim 1, wherein the curing is performed by reacting the curable composition with water. The heat storage material forming method according to any one of claims 1 to 5, wherein the curing is performed by blocking oxygen that contacts the curable composition.

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