JP2020060651A - Display device and manufacturing method thereof - Google Patents

Abstract

An object of the present invention is to prevent deterioration of sealing performance. A display device has an inner bank layer (60) surrounding a display circuitry layer (46) and an outer bank layer (62) surrounding the inner bank layer (60). The sealing layer 48 includes a first inorganic film 52 and a second inorganic film 54 and an organic film 50 interposed between the first inorganic film 52 and the second inorganic film 54 . The first inorganic film 52 and the second inorganic film 54 contact each other around the organic film 50 to seal the organic film 50 . The organic film 50 has a peripheral edge that does not extend beyond the inner bank layer 60 . The first inorganic membrane 52 and the second inorganic membrane 54 rest on the inner bank layer and have a peripheral edge on the outer bank layer 62 . The resin layer 56 covers the entire portion of the first inorganic membrane 52 and the second inorganic membrane 54 on the inner bank layer 60 and has a non-contact peripheral edge above the outer bank layer 62 . The outer bank layer 62 has a height equal to or greater than that of the inner bank layer 60 . [Selection drawing] Fig. 6

Description

  The present invention relates to a display device and a manufacturing method thereof.

  A light emitting element layer such as an organic electroluminescence layer is deteriorated by moisture absorption, and thus needs to be covered with a sealing layer to shield it from the atmosphere (References 1 to 5). For example, a structure is known in which a sealing layer having a multilayer structure in which an organic film is sandwiched by a pair of inorganic films is used for sealing a light emitting element layer. An overcoat layer is provided on the sealing layer.

  The organic film of the sealing layer is formed of liquid resin. The flow of the liquid resin is stopped by the first bank. The pair of inorganic films of the sealing layer are formed so as to extend over the first bank. The liquid resin for forming the overcoat layer is dammed by the second bank on the outside of the first bank. The overcoat layer is formed so as to cover the first bank and the pair of inorganic films, and has a small thickness above the first bank.

US Patent Application Publication No. 2015/228927 U.S. Patent Application Publication No. 2016/315284 U.S. Patent Application Publication No. 2016/307971 U.S. Patent Application Publication No. 2017/53973 JP, 2018-22322, A

  The pair of inorganic films are formed over a wide area and then etched using the overcoat layer as an etching mask. In the etching process, the overcoat layer thinned above the first bank may be scraped off as described above, and if the pair of inorganic films underneath is also scraped off, the sealing performance deteriorates.

  An object of the present invention is to prevent deterioration of sealing performance.

  A display device according to the present invention is a substrate, a display circuit layer laminated on the substrate for displaying an image by light emission, an inner bank layer surrounding the display circuit layer, and an outer bank layer surrounding the inner bank layer. And a sealing layer covering the display circuit layer and a resin layer laminated on the sealing layer, the sealing layer being interposed between the pair of inorganic films and the pair of inorganic films. An organic film, wherein the pair of inorganic films contact each other around the organic film to seal the organic film, and the organic film has a peripheral edge at a position not exceeding the inner bank layer. , The pair of inorganic membranes are mounted on the inner bank layer and have a peripheral edge on the outer bank layer, and the resin layer is the entire portion of the pair of inorganic membranes on the inner bank layer. And having a peripheral edge above the outer bank layer in a non-contact manner, the outer bank layer is the inner bank layer and And having a like or more in height.

  According to the present invention, the outer bank layer has a height equal to or higher than that of the inner bank layer, so that the resin layer protects the sealing layer without being thinned on the inner bank layer. As a result, it is possible to prevent the deterioration of the sealing performance.

  A display device according to the present invention is a substrate, a display circuit layer laminated on the substrate for displaying an image by light emission, an inner bank layer surrounding the display circuit layer, and an outer bank layer surrounding the inner bank layer. And a sealing layer covering the display circuit layer and a resin layer laminated on the sealing layer, the sealing layer being interposed between the pair of inorganic films and the pair of inorganic films. An organic film, wherein the pair of inorganic films contact each other around the organic film to seal the organic film, and the organic film has a peripheral edge at a position not exceeding the inner bank layer. , The pair of inorganic membranes are mounted on the inner bank layer and have a peripheral edge on the outer bank layer, and the resin layer is the entire portion of the pair of inorganic membranes on the inner bank layer. And has a non-contacting peripheral edge above the outer bank layer, and the underlying surface on which the sealing layer rests is the inner side. An inner region adjacent to a hand layer on the inner side; and an intermediate region between the inner bank layer and the outer bank layer, at least a part of the intermediate region having a height equal to or higher than the inner region. It is characterized by being in

  According to the present invention, at least a part of the intermediate region is at the same height as or higher than the inner region, so that the resin layer does not become thin on the inner bank layer and protects the sealing layer. As a result, it is possible to prevent the deterioration of the sealing performance.

  A method of manufacturing a display device according to the present invention, a display circuit layer for displaying an image by light emission, an inner bank layer surrounding the display circuit layer, and an outer bank layer surrounding the inner bank layer, a substrate having a. A step of preparing, a step of covering the display circuit layer, forming a first inorganic film on the inner bank layer and the outer bank layer and reaching the outside of the outer bank layer; and the display circuit layer A step of forming a liquid organic material on the first inorganic film so as to be dammed by the inner bank layer to form an organic film, and covering the display circuit layer and mounting the organic film on the organic film. Forming a second inorganic film so as to contact the first inorganic film on the outer side of the outer bank layer beyond the inner bank layer and the outer bank layer, and covering the display circuit layer. A weir in the outer bank layer on the second inorganic film And a step of etching the first inorganic film and the second inorganic film using the resin layer as a mask, the resin layer comprising: In the step of forming the resin layer, the liquid resin has a thickness above the inner bank layer so as not to expose the second inorganic film above the inner bank layer even if it is scraped in the etching step. It is characterized in that at least one of the height of the second inorganic film and the height of the inner bank layer between the inner bank layer and the outer bank layer is satisfied to such an extent that the inner bank layer stays at.

  According to the present invention, the height of the second inorganic film between the inner bank layer and the outer bank layer and the height of the inner bank layer are reduced to the extent that the liquid resin stays above the inner bank layer. Since it is filled, the resin layer does not become thin on the inner bank layer and protects the second inorganic film. As a result, it is possible to prevent the deterioration of the sealing performance.

FIG. 3 is a plan view of the display device according to the first embodiment. It is a schematic diagram showing a use state of a display. FIG. 3 is a schematic diagram of a cross section taken along line III-III of the display device shown in FIG. 2. FIG. 4 is a sectional view taken along line IV-IV of the display device shown in FIG. 1. FIG. 2 is a circuit diagram of the display device shown in FIG. 1. FIG. 6 is a cross-sectional view taken along the line VI-VI of the display device shown in FIG. 1. FIG. 7 is a sectional view taken along line VII-VII of the display device shown in FIG. 1. FIG. 6 is a diagram for explaining the manufacturing method for the display device according to the first embodiment. It is a figure which shows the modification of 1st Embodiment. It is sectional drawing of the display apparatus which concerns on 2nd Embodiment. It is another sectional view of the display concerning a 2nd embodiment. It is sectional drawing of the display apparatus which concerns on 3rd Embodiment. It is another sectional view of the display concerning a 3rd embodiment. It is sectional drawing of the display apparatus which concerns on 4th Embodiment. It is another sectional view of the display concerning a 4th embodiment. It is sectional drawing of the display apparatus which concerns on 5th Embodiment. It is another sectional view of the display concerning a 5th embodiment. It is sectional drawing of the display apparatus which concerns on 6th Embodiment. It is another sectional view of the display concerning a 6th embodiment. It is sectional drawing of the display apparatus which concerns on 7th Embodiment. It is another sectional view of the display concerning a 7th embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention can be carried out in various modes without departing from the scope of the invention, and is not construed as being limited to the description of the embodiments exemplified below.

  In order to make the description clearer, the drawings may schematically show the width, thickness, shape, etc. of each part as compared with the actual mode, but this is merely an example and limits the interpretation of the present invention. Not something to do. In this specification and the drawings, elements having the same functions as those described in regard to the drawings already shown are designated by the same reference numerals, and duplicate description may be omitted.

  Furthermore, in the detailed description of the present invention, when defining the positional relationship between a certain constituent and another constituent, the terms “above” and “below” refer only to the case where the constituent is directly above or below the certain constituent. Unless otherwise specified, the case where another component is further interposed is included.

[First Embodiment]
FIG. 1 is a plan view of the display device according to the first embodiment. Since the display device is actually folded and used, FIG. 1 is a development view before the display device is folded. FIG. 2 is a schematic view showing a usage state of the display device. FIG. 3 is a schematic view of a cross section taken along line III-III of the display device shown in FIG.

  The display device includes a display DSP. A spacer SP is arranged inside the bend to prevent the display DSP from being bent too much. The display DSP has flexibility and is bent outside the display area DA. The display DSP is equipped with an integrated circuit chip CP for driving an element for displaying an image. The flexible printed circuit board FP is connected to the display DSP outside the display area DA.

  The display device is, for example, an organic electroluminescence display device. The display device has a display area DA in which an image is displayed. In the display area DA, for example, unit pixels (subpixels) of a plurality of colors of red, green, and blue are combined to form a full-color pixel, and a full-color image is displayed.

  FIG. 4 is a sectional view taken along line IV-IV of the display device shown in FIG. The substrate 10 is made of polyimide. However, another resin material may be used as long as it is a base material having sufficient flexibility to form a sheet display or a flexible display.

  A barrier inorganic film 12 (undercoat layer) is laminated on the substrate 10. The barrier inorganic film 12 has a three-layer laminated structure of a silicon oxide film 12a, a silicon nitride film 12b, and a silicon oxide film 12c. The lowermost silicon oxide film 12a is for improving adhesion to the substrate 10, the middle silicon nitride film 12b is a block film for moisture and impurities from the outside, and the uppermost silicon oxide film 12c is a silicon nitride film. The hydrogen atoms contained in 12b are provided as block films respectively for preventing diffusion of hydrogen atoms to the semiconductor layer 16 side of the thin film transistor TR, but the invention is not particularly limited to this structure, and further stacked layers may be provided. It may be a layer or a two-layer laminate.

  The functional film 14 may be formed according to the location where the thin film transistor TR is formed. The functional film 14 suppresses a change in characteristics of the thin film transistor TR due to entry of light from the rear surface of the channel, or is formed of a conductive material to give a predetermined potential, thereby giving a back gate effect to the thin film transistor TR. You can Here, after the silicon oxide film 12a is formed, the functional film 14 is formed in an island shape in accordance with the position where the thin film transistor TR is formed, and then the silicon nitride film 12b and the silicon oxide film 12c are stacked to form a barrier inorganic material. Although the functional film 14 is formed so as to be enclosed in the film 12, the function film 14 may be first formed on the substrate 10 and then the barrier inorganic film 12 may be formed after that.

  A thin film transistor TR is formed on the barrier inorganic film 12. Although only the Nch transistor is shown here by taking a polysilicon thin film transistor as an example, a Pch transistor may be formed at the same time. The semiconductor layer 16 of the thin film transistor TR has a structure in which a low concentration impurity region is provided between the channel region and the source / drain region. A silicon oxide film is used here as the gate insulating film 18. The gate electrode 20 is a part of the first wiring layer W1 formed of MoW. The first wiring layer W1 has a first storage capacitor line CL1 in addition to the gate electrode 20. A part of the storage capacitor Cs is formed between the first storage capacitor line CL1 and the semiconductor layer 16 (source / drain region) via the gate insulating film 18.

  An interlayer insulating film 22 (silicon oxide film and silicon nitride film) is stacked on the gate electrode 20. A second wiring layer W2 including a portion to be the source / drain electrode 24 is formed on the interlayer insulating film 22. Here, a three-layer laminated structure of Ti, Al and Ti is adopted. The first storage capacitor line CL1 (a part of the first wiring layer W1) and the second storage capacitor line CL2 (a part of the second wiring layer W2) of the other storage capacitor Cs are interposed via the interlayer insulating film 22. A part is formed.

  A passivation film 26 is formed on the interlayer insulating film 22 so as to cover the second wiring layer W2 (source / drain electrodes 24). A planarizing organic film 28 is provided on the passivation film 26. A resin such as photosensitive acrylic is used for the flattening organic film 28 because it has excellent surface flatness as compared with an inorganic insulating material formed by CVD (Chemical Vapor Deposition) or the like.

  The planarizing organic film 28 and the passivation film 26 are removed at the pixel contact portion 30, and an indium tin oxide (ITO) film 32 is formed thereon. The indium tin oxide film 32 includes a first transparent conductive film 32a and a second transparent conductive film 32b which are separated from each other. The second wiring layer W2 whose surface is exposed by removing the planarizing organic film 28 and the passivation film 26 is covered with the first transparent conductive film 32a. A silicon nitride film 34 is provided on the planarizing organic film 28 so as to cover the first transparent conductive film 32a. The silicon nitride film 34 has an opening in the pixel contact portion 30, and the pixel electrode 36 is laminated so as to be electrically connected to the source / drain electrode 24 through this opening. The pixel electrode 36 is formed as a reflective electrode and has a three-layer laminated structure of an indium zinc oxide film, an Ag film, and an indium zinc oxide film. Here, an indium tin oxide film may be used instead of the indium zinc oxide film. The pixel electrode 36 extends laterally from the pixel contact portion 30 and reaches above the thin film transistor TR.

  The second transparent conductive film 32b is provided adjacent to the pixel contact portion 30 and below the pixel electrode 36 (and further below the silicon nitride film 34). The second transparent conductive film 32b, the silicon nitride film 34, and the pixel electrode 36 overlap with each other, and an additional capacitance Cad is formed by these.

  An insulating organic film 38, which is called a bank (rib) and serves as a partition between adjacent pixel regions, is formed on the flattening organic film 28 and above the pixel contact portion 30, for example. As the insulating organic film 38, photosensitive acrylic or the like is used as in the flattening organic film 28. It is preferable that the insulating organic film 38 is opened so that the surface of the pixel electrode 36 is exposed as a light emitting region, and the opening end has a gentle taper shape. If the opening end has a steep shape, poor coverage of the organic electroluminescent layer 40 formed thereon occurs.

  The planarizing organic film 28 and the insulating organic film 38 are in contact with each other through an opening provided in the silicon nitride film 34 located between them. As a result, moisture or degas that is desorbed from the planarizing organic film 28 can be extracted through the insulating organic film 38 by heat treatment or the like after the formation of the insulating organic film 38.

  An organic electroluminescent layer 40 made of an organic material is laminated on the pixel electrode 36. The organic electroluminescent layer 40 may be a single layer, or may have a structure in which a hole transport layer, a light emitting layer, and an electron transport layer are laminated in this order from the pixel electrode 36 side. These layers may be formed by vapor deposition, may be formed by coating on a solvent dispersion, may be formed selectively with respect to the pixel electrode 36 (each sub pixel), or may be displayed. It may be solidly formed on the entire surface covering the area DA. In the case of solid formation, white light is obtained from all the sub-pixels and a desired color wavelength portion is extracted by a color filter (not shown).

  A counter electrode 42 is provided on the organic electroluminescence layer 40. Since the top emission structure is adopted here, the counter electrode 42 is transparent. For example, the Mg layer and the Ag layer are formed as thin films that allow the light emitted from the organic electroluminescence layer 40 to pass therethrough. According to the formation order of the organic electroluminescence layer 40 described above, the pixel electrode 36 serves as an anode and the counter electrode 42 serves as a cathode. The plurality of pixel electrodes 36, the counter electrode 42, and the organic electroluminescent layer 40 interposed between the center portion of each of the plurality of pixel electrodes 36 and the counter electrode 42 constitute a light emitting element 44. The display circuit layer 46 for displaying an image by light emission includes a light emitting element 44 and a circuit element such as a thin film transistor TR.

  A sealing layer 48 that covers the light emitting element 44 is formed on the counter electrode 42. The sealing layer 48 has a function of preventing the intrusion of moisture from the outside of the organic electroluminescence layer 40 formed previously, and is required to have a high gas barrier property. The sealing layer 48 has a laminated structure of an organic film 50 and a first inorganic film 52 and a second inorganic film 54 (for example, a silicon nitride film) sandwiching the organic film 50. A resin layer 56 and a polarizing plate (for example, a circularly polarizing plate) are laminated on the sealing layer 48.

  FIG. 5 is a circuit diagram of the display device shown in FIG. The circuit has a plurality of scanning lines GL connected to the scanning circuit GD and a plurality of signal lines DL connected to the signal drive circuit SD. The signal drive circuit SD is arranged in the integrated circuit chip CP shown in FIG. A region surrounded by two adjacent scanning lines GL and two adjacent signal lines DL is one pixel PX. The pixel PX includes a thin film transistor TR as a drive transistor, a thin film transistor TR2 as a switch, and a storage capacitor Cs. By applying the gate voltage to the scanning line GL, the thin film transistor TR2 is turned on, the video signal is supplied from the signal line DL, and the charge is accumulated in the storage capacitor Cs. By accumulating charges in the storage capacitor Cs, the thin film transistor TR is turned on, and current flows from the power supply line PWL to the light emitting element OD. This current causes the light emitting element OD to emit light.

  6 is a sectional view taken along line VI-VI of the display device shown in FIG. The display device has a display circuit layer 46 (FIG. 4) laminated on the substrate 10 for displaying an image by light emission. An inner bank layer 60 surrounds the display circuit layer 46. The outer bank layer 62 surrounds the inner bank layer 60. The outer bank layer 62 has a height equal to or higher than that of the inner bank layer 60.

  The outer bank layer 62 is composed of a plurality of layers. The multiple layers include organic layers 64a and 64b. The uppermost layer of the plurality of layers is the organic layer 64a, which is formed simultaneously with the insulating organic film 38 shown in FIG. 4 (in the same layer). The organic layer 64b is formed simultaneously with the planarization organic film 28 shown in FIG. 4 (in the same layer). The multiple layers include conductive layers 66a to 66d (layers made of metal or oxide semiconductor). By stacking the conductive layers 66a to 66d, the height of the outer bank layer 62 is increased. The uppermost conductive layer 66a is formed simultaneously with the pixel electrode 36 shown in FIG. 4 (in the same layer), and is interposed between the two organic layers 64a and 64b. The conductive layers 66a to 66d are alternately laminated with a plurality of inorganic insulating films (for example, the gate insulating film 18, the interlayer insulating film 22, the passivation film 26).

  The inner bank layer 60 is composed of a plurality of layers. The multiple layers include organic layers 64a and 64b. The uppermost layer of the plurality of layers is the organic layer 64a, which is formed simultaneously with the insulating organic film 38 shown in FIG. 4 (in the same layer). The organic layer 64b is formed simultaneously with the planarization organic film 28 shown in FIG. 4 (in the same layer). The multiple layers include conductive layers 66a to 66d (layers made of metal or oxide semiconductor). By stacking the conductive layers 66a to 66d, the height of the inner bank layer 60 is increased. The uppermost conductive layer 66a is formed at the same time as the pixel electrode 36 shown in FIG. 4 (in the same layer), but since it is not placed on the second organic layer 64b from the top, the inner bank layer 60 is outside. It is lower than the bank layer 62. Further, the inner bank layer 60 is lower than the outer bank layer 62 because the organic layer 64a and the organic layer 64b are displaced.

  The display device has a sealing layer 48 that covers the display circuit layer 46. The sealing layer 48 includes a first inorganic film 52 and a second inorganic film 54. The organic film 50 is interposed between the first inorganic film 52 and the second inorganic film 54. The first inorganic film 52 and the second inorganic film 54 contact each other around the organic film 50 to seal the organic film 50. The organic film 50 has a peripheral edge at a position not exceeding the inner bank layer 60. The first inorganic film 52 and the second inorganic film 54 are placed on the inner bank layer and have a peripheral edge on the outer bank layer 62.

  The underlying surface on which the sealing layer 48 is placed includes the inner region R1 that is adjacent to the inner bank layer 60 inside. The surface of the inner region R1 is composed of the conductive layer 66a in the same layer as the pixel electrode 36 shown in FIG. In the inner region R1, all the conductive layers 66a to 66d included in the outer bank layer 62 are stacked.

  The underlying surface on which the sealing layer 48 rests includes an intermediate region R2 between the inner bank layer 60 and the outer bank layer 62. In the intermediate region R2, the conductive layers 66a to 66d stacked in the inner region R1 are not stacked. Therefore, the intermediate region R2 is lower than the inner region R1.

  A resin layer 56 is laminated on the sealing layer 48. The resin layer 56 covers the entire portion of the first inorganic film 52 and the second inorganic film 54 on the inner bank layer 60. The resin layer 56 has a peripheral edge above the outer bank layer 62 in a non-contact manner. According to the present embodiment, the outer bank layer 62 has a height equal to or higher than that of the inner bank layer 60, so that the resin layer 56 protects the sealing layer 48 without thinning on the inner bank layer 60. To do. These can prevent the deterioration of the sealing performance.

  FIG. 7 is a sectional view taken along line VII-VII of the display device shown in FIG. Even in the area between the display area DA and the integrated circuit chip CP or the flexible printed circuit board 10FP, the outer bank layer 62 includes the conductive layers 66a to 66d, so that the outer bank layer 62 has a height equal to or higher than that of the inner bank layer 60. . The details described with reference to FIG. 6 can be applied to other details.

[Production method]
FIG. 8 is a diagram for explaining the manufacturing method of the display device according to the first embodiment. In the present embodiment, a display circuit layer 46 (FIG. 4) for displaying an image by light emission, an inner bank layer 60 surrounding the display circuit layer 46, and an outer bank layer 62 surrounding the inner bank layer 60 are provided on the substrate 10. , Are formed. The inner bank layer 60 is formed to have a height not exceeding the outer bank layer 62.

  The first inorganic film 52 is formed so as to cover the display circuit layer 46, be placed on the inner bank layer 60 and the outer bank layer 62, and reach the outside of the outer bank layer 62. The organic film 50 is formed by covering the display circuit layer 46 and providing a liquid organic material on the first inorganic film 52 so as to be blocked by the inner bank layer 60. The second inorganic film so as to cover the display circuit layer 46 and to be mounted on the organic film 50 so as to be over the inner bank layer 60 and the outer bank layer 62 and contact the first inorganic film 52 outside the outer bank layer 62. 54 is formed.

  A liquid resin is provided on the second inorganic film 54 so as to cover the display circuit layer 46 and be blocked by the outer bank layer 62 to form a resin layer 56. The first inorganic film 52 and the second inorganic film 54 are etched using the resin layer 56 as a mask. The shape after etching is as shown in FIG.

  In this embodiment, the inner bank layer 60 has a height that does not exceed the outer bank layer 62. Therefore, in the step of forming the resin layer 56, the liquid resin stays above the inner bank layer 60. The resin layer 56 has a thickness that does not expose the second inorganic film 54 above the inner bank layer 60 even if it is shaved in the etching process, and the resin layer 56 does not become thin on the inner bank layer 60. The second inorganic film 54 is protected. As a result, it is possible to prevent the deterioration of the sealing performance.

[Modification]
FIG. 9 is a diagram showing a modification of the first embodiment. In this modification, the peripheral edge of the resin layer 156 projects from the peripheral edges of the first inorganic film 152 and the second inorganic film 154. In other words, the first inorganic film 152 and the second inorganic film 154 are recessed under the resin layer 156. This occurs when the first inorganic film 152 and the second inorganic film 154 are etched in the manufacturing process described above with reference to FIG.

[Second Embodiment]
FIG. 10 is a cross-sectional view of the display device according to the second embodiment. In the present embodiment, the inner bank layer 260 is lowered by eliminating the uppermost organic layer 64a forming a part of the inner bank layer 60 shown in FIG.

  FIG. 11 is another cross-sectional view of the display device according to the second embodiment. In the present embodiment, the inner bank layer 260 is lowered by eliminating the uppermost organic layer 64a forming a part of the inner bank layer 60 shown in FIG. The contents described in the first embodiment can be applied to the other contents of the present embodiment.

[Third Embodiment]
FIG. 12 is a cross-sectional view of the display device according to the third embodiment. FIG. 13 is another cross-sectional view of the display device according to the third embodiment. In the present embodiment, the outer bank layer 362 is raised by providing the outer bank layer 62 shown in FIGS. 6 and 7 with an additional layer 368. The uppermost layer of the outer bank layer 362 (additional layer 368) is higher than the uppermost layer of the inner bank layer 360. The second layer from the uppermost layer (the additional layer 368) of the outer bank layer 362 is lower than the uppermost layer of the inner bank layer 360.

  In the present embodiment, the plurality of conductive layers 66a to 66d for raising the outer bank layer 62 shown in FIGS. 6 and 7 are not provided, but the other contents are the same as those described in the first embodiment. Is applicable.

[Fourth Embodiment]
FIG. 14 is a cross-sectional view of the display device according to the fourth embodiment. FIG. 15 is another cross-sectional view of the display device according to the fourth embodiment. In the present embodiment, the structure shown in FIGS. 6 and 7 (first embodiment) is provided with an additional layer 468 similarly to the structure shown in FIGS. 12 and 13 (third embodiment), respectively. . This further raises the outer bank layer 462. The other contents correspond to the contents described in the first and third embodiments.

[Fifth Embodiment]
FIG. 16 is a cross-sectional view of the display device according to the fifth embodiment. FIG. 17 is another cross-sectional view of the display device according to the fifth embodiment. The structures shown in FIGS. 16 and 17 differ from the structures shown in FIGS. 6 and 7 (first embodiment) in the height of the intermediate region R2.

  The underlying surface on which the sealing layer 548 is placed includes the inner region R1 that is adjacent to the inner bank layer 560 inside. The underlying surface on which the sealing layer 548 rests includes an intermediate region R2 between the inner bank layer 560 and the outer bank layer 562.

  At least a part of the intermediate region R2 (the entire region in the present embodiment) is at the same height as or higher than the inner region R1. Therefore, the resin layer 556 does not become thin on the inner bank layer 560 and protects the sealing layer 548. The intermediate region R2 includes portions having different heights.

  The intermediate region R2 is a part of the surface of the organic layer 564b. The organic layer 564b is formed (in the same layer) at the same time as the planarization organic film 28 shown in FIG. The organic layer 564b has a portion forming the outer bank layer 562. In the organic film 550, at least a part of the part forming the intermediate region R2 is thinner than the part forming the outer bank layer 562.

  In the manufacturing process, the underlying surface on which the first inorganic film 552 is placed includes the inner region R1 that is adjacent to the inner bank layer 560 inside. The underlying surface on which the first inorganic film 552 is placed includes an intermediate region R2 between the inner bank layer 560 and the outer bank layer 562. At least a part of the intermediate region R2 has a height equal to or higher than that of the inner region R1.

  In the present embodiment, at least a part of the intermediate region R2 is at a height equal to or higher than that of the inner region R1, so that the intermediate region R2 (between the inner bank layer 560 and the outer bank layer 562 is more than the inner region R1). ), The second inorganic film 554 becomes high.

  Therefore, in the step of forming the resin layer 556, the liquid resin stays above the inner bank layer 560. The resin layer 556 has such a thickness that the second inorganic film 554 is not exposed above the inner bank layer 560 even if the resin layer 556 is thinned on the inner bank layer 560 even if the resin layer 556 is shaved in the etching step. The second inorganic film 554 is protected. As a result, it is possible to prevent the deterioration of the sealing performance. The other contents correspond to those described in the first embodiment.

[Sixth Embodiment]
FIG. 18 is a sectional view of the display device according to the sixth embodiment. FIG. 19 is another cross-sectional view of the display device according to the sixth embodiment. The structures shown in FIGS. 18 and 19 are different from the structures shown in FIGS. 16 and 17 (fifth embodiment) in the height of the intermediate region R2.

  In the present embodiment, the intermediate region R2 includes a higher portion and a lower portion than the inner region R1. A plurality of conductive layers 666a to 666d and a plurality of inorganic insulating films (for example, the gate insulating film 18, the interlayer insulating film 22 and the passivation film 26) are stacked in a portion higher than the inner region R1 and as shown in FIG. Also includes a portion where the organic layer 664b is laminated. In the portion lower than the inner region R1, the plurality of conductive layers 666a to 666d and the organic layer 664b are completely removed. The other contents correspond to the contents described in the first and fifth embodiments.

[Seventh Embodiment]
FIG. 20 is a sectional view of the display device according to the seventh embodiment. FIG. 21 is another cross-sectional view of the display device according to the seventh embodiment. The structures shown in FIGS. 20 and 21 are different from the structures shown in FIGS. 18 and 19 (sixth embodiment) in the height of the intermediate region R2.

  In the present embodiment, the intermediate region R2 is generally higher than the inner region R1. The organic layer 764b is stacked in the intermediate region R2. The other contents correspond to the contents described in the first and sixth embodiments.

  The present invention is not limited to the above-described embodiment, and various modifications can be made. For example, the configurations described in the embodiments can be replaced with substantially the same configurations, configurations having the same effects, or configurations capable of achieving the same object.

  10 substrate, 12 barrier inorganic film, 12a silicon oxide film, 12b silicon nitride film, 12c silicon oxide film, 14 functional film, 16 semiconductor layer, 18 gate insulating film, 20 gate electrode, 22 interlayer insulating film, 24 source / drain electrode , 26 passivation film, 28 flattening organic film, 30 pixel contact part, 32 indium tin oxide film, 32a first transparent conductive film, 32b second transparent conductive film, 34 silicon nitride film, 36 pixel electrode, 38 insulating organic film, 40 organic electroluminescence layer, 42 counter electrode, 44 light emitting element, 46 display circuit layer, 48 sealing layer, 50 organic film, 52 first inorganic film, 54 second inorganic film, 56 resin layer, 60 inner bank layer, 62 outer bank layer, 64a organic layer, 64b organic layer, 66a conductive layer, 66b conductive layer, 66c Conductive layer, 66d Conductive layer, 152 1st inorganic film, 154 2nd inorganic film, 156 resin layer, 260 inner bank layer, 360 inner bank layer, 362 outer bank layer, 368 additional layer, 462 outer bank layer, 468 additional layer 548 sealing layer, 550 organic film, 552 first inorganic film, 554 second inorganic film, 556 resin layer, 560 inner bank layer, 562 outer bank layer, 564b organic layer, 664b organic layer, 666a conductive layer, 666b conductive Layer, 666c conductive layer, 666d conductive layer, 764b organic layer, Cad additional capacitance, CL1 first holding capacitance line, CL2 second holding capacitance line, CP integrated circuit chip, Cs holding capacitance, DA display area, DL signal line, DSP Display, FP flexible printed circuit board, GD scanning circuit, GL scanning line, OD light emitting element, PWL power Source line, PX pixel, R1 inner region, R2 intermediate region, SD signal drive circuit, SP spacer, TR thin film transistor, TR2 thin film transistor, W1 first wiring layer, W2 second wiring layer.

Claims (9)

Board,
A display circuit layer laminated on the substrate for displaying an image by light emission;
An inner bank layer surrounding the display circuit layer,
An outer bank layer surrounding the inner bank layer,
A sealing layer covering the display circuit layer,
A resin layer laminated on the sealing layer,
Have
The sealing layer includes a pair of inorganic films and an organic film interposed between the pair of inorganic films, and the pair of inorganic films contact each other around the organic film to form the organic film. Sealed,
The organic film has a peripheral edge at a position not exceeding the inner bank layer,
The pair of inorganic films are mounted on the inner bank layer and have a peripheral edge on the outer bank layer,
The resin layer covers the entire portion of the pair of inorganic films on the inner bank layer, and has a non-contact peripheral edge above the outer bank layer,
The display device, wherein the outer bank layer has a height equal to or higher than that of the inner bank layer. The display device according to claim 1,
The underlying surface on which the sealing layer rests includes an inner region adjacent to the inner bank layer on the inner side, and an intermediate region between the inner bank layer and the outer bank layer,
At least a part of the intermediate region has a height equal to or higher than that of the inner region. Board,
A display circuit layer laminated on the substrate for displaying an image by light emission;
An inner bank layer surrounding the display circuit layer,
An outer bank layer surrounding the inner bank layer,
A sealing layer covering the display circuit layer,
A resin layer laminated on the sealing layer,
Have
The sealing layer includes a pair of inorganic films and an organic film interposed between the pair of inorganic films, and the pair of inorganic films contact each other around the organic film to form the organic film. Sealed,
The organic film has a peripheral edge at a position not exceeding the inner bank layer,
The pair of inorganic films are mounted on the inner bank layer and have a peripheral edge on the outer bank layer,
The resin layer covers the entire portion of the pair of inorganic films on the inner bank layer, and has a non-contact peripheral edge above the outer bank layer,
The underlying surface on which the sealing layer rests includes an inner region adjacent to the inner bank layer on the inner side, and an intermediate region between the inner bank layer and the outer bank layer,
At least a part of the intermediate region has a height equal to or higher than that of the inner region. The display device according to claim 2 or 3,
The display device, wherein the intermediate region includes portions having different heights. The display device according to any one of claims 1 to 4,
The display device, wherein the peripheral edge of the resin layer projects from the peripheral edge of the pair of inorganic films. The display device according to any one of claims 1 to 5,
The uppermost layer of the outer bank layer is higher than the uppermost layer of the inner bank layer,
The display device, wherein the second layer from the uppermost layer of the outer bank layer is lower than the uppermost layer of the inner bank layer. A step of preparing a substrate having a display circuit layer for displaying an image by light emission, an inner bank layer surrounding the display circuit layer, and an outer bank layer surrounding the inner bank layer;
Forming a first inorganic film on the inner bank layer and the outer bank layer so as to cover the display circuit layer and reach the outside of the outer bank layer;
Covering the display circuit layer, providing a liquid organic material on the first inorganic film so as to be dammed by the inner bank layer, and forming an organic film;
A second inorganic film so as to cover the display circuit layer and to be mounted on the organic film, and to be placed in contact with the first inorganic film outside the outer bank layer beyond the inner bank layer and the outer bank layer. A step of forming
Forming a resin layer by covering the display circuit layer and providing a liquid resin on the second inorganic film so as to be dammed by the outer bank layer;
Etching the first inorganic film and the second inorganic film using the resin layer as a mask;
Including,
The resin layer has a thickness that does not expose the second inorganic film above the inner bank layer even if the resin layer is scraped in the etching step,
In the step of forming the resin layer, the height of the second inorganic film between the inner bank layer and the outer bank layer and the inner side such that the liquid resin stays above the inner bank layer. A method of manufacturing a display device, characterized in that the bank layer has a low height and one of the heights is low. The method for manufacturing a display device according to claim 7,
The method for manufacturing a display device, wherein the inner bank layer is formed to have a height not exceeding the outer bank layer. The method for manufacturing a display device according to claim 7,
The underlying surface on which the first inorganic film is placed includes an inner region adjacent to the inner bank layer on the inner side, and an intermediate region between the inner bank layer and the outer bank layer,
At least a part of the intermediate region has a height equal to or higher than that of the inner region.

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