JP2020042999A - Manufacturing method of shield structure and shield structure - Google Patents

Abstract

To provide a manufacturing method of a shield structure and a shield structure capable of preventing a decrease in shield performance at a high frequency.SOLUTION: A manufacturing method of a shield structure including a resin connector housing, a terminal that is disposed partially inside the connector housing, one end of which is connected to a printed circuit board 7, and the other end of which is connected to the connector terminal of a mating connector, and a metal shield case 2 that houses the connector housing, includes: a step of applying a conductive member 41 to a bonding margin 29 of the shield case 2, a step of forming the shield case 2, a step of covering a connector housing with the shield case 2, and a step of curing the conductive member 41 by heat generated by heat treatment for soldering one end of the terminal and a circuit pattern of the printed circuit board 7.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a method for manufacturing a shield structure and a shield structure.

  Conventionally, high-frequency compatible shielded wires have been used to transmit high-frequency electrical signals to the control units of various electrical components mounted on automobiles and the like, and a shield case with a shielding function is used for electrical connection of the shielded wires. One that uses a shielded connector having the same has been proposed (for example, see Patent Document 1).

JP 2015-176657 A

  However, in the related art as described in Patent Document 1, the shield case is formed in a box shape by bending a plate material. Therefore, a gap is generated in the shield case at a portion where the plate material is bent and joined, which is a factor of lowering the shield performance at high frequencies.

  The present disclosure has been made in view of such a situation, and is intended to prevent a decrease in shielding performance at high frequencies.

  A method for manufacturing a shield structure according to a first aspect of the present disclosure includes a resin connector housing having a fitting opening on a front surface into which a mating connector is fitted, a part of which is disposed inside the connector housing, and one end side is provided. A method for manufacturing a shield structure comprising: a terminal connected to a printed circuit board, the other end of which is connected to a connector terminal of the mating connector; and a metal shield case for housing the connector housing, wherein the shield case is provided. A step of applying a conductive member having conductivity to a bonding margin that is a part of a plate material to be formed, and forming the shield case by bending another part of the plate material and facing the bonding margin. And placing one end of the terminal on the circuit pattern of the printed circuit board, and attaching the shield case to the connector housing. A step of, by the heat generated by the heat treatment for soldering a circuit pattern of the printed circuit board and one end of the terminal, and curing the conductive member is one comprising a.

  Further, the shield structure according to the second aspect of the present disclosure includes a resin connector housing having a fitting opening on the front surface into which a mating connector is fitted, and a part disposed inside the connector housing, and one end side printed. A shield structure comprising: a terminal connected to the substrate, the other end of which is connected to the connector terminal of the mating connector; and a metal shield case for housing the connector housing, wherein the shield case includes the shield case. And a conductive member that has been applied and cured at a bonding margin, which is a part of a plate material for forming the conductive material, and has conductivity.

  According to the first and second aspects of the present disclosure, it is possible to prevent a reduction in shielding performance at high frequencies at low cost.

1 is a perspective view of a shield structure according to an embodiment to which the present disclosure is applied. FIG. 2 is a sectional view taken along the line II of FIG. 1. It is a development view of shield case 2 concerning an embodiment to which the present disclosure is applied. FIG. 11 is a perspective view of the shield case 2 in a state where the conductive member is cured by heat generated by heat treatment for soldering the terminals 3 and the printed circuit board 7 according to the embodiment to which the present disclosure is applied.

  Hereinafter, embodiments of the present disclosure will be described with reference to the drawings, but the present disclosure is not limited to the following embodiments.

  FIG. 1 is a perspective view of a shield structure according to an embodiment to which the present disclosure is applied. FIG. 2 is a sectional view taken along the line II of FIG. The shield connector mounted on the printed circuit board 7 has a shield structure in which a metal shield case 2 partially covers another part of the terminal 3 disposed inside the connector housing 1. By connecting the shield case 2 to the ground pattern on the printed circuit board 7, the shield connector can electromagnetically shield the connection part of the connector terminal of the mating connector connected to the terminal 3.

  Specifically, the shielded connector includes a terminal 3, a resin-made connector housing 1 in which a part of the terminal 3 is arranged by press-fitting or insert-molding the terminal 3, and a shield case 2 for housing the connector housing 1. And a shield structure comprising: The connector housing 1 has a substantially rectangular parallelepiped outer shape including a rear surface portion 13 and a wall portion 14 erected from the outer edge side of the rear surface portion 13 toward the front.

  The rear surface portion 13 has a surface located inside the connector housing 1 as an inner bottom surface 13b, and a surface located outside the connector housing 1 as an outer bottom surface 13a. Therefore, the outer bottom surface 13a is the rear surface side of the connector housing 1. In the wall surface portion 14, a wall surface located inside the connector housing 1 is an inner wall surface 15. In the wall surface portion 14, a wall surface located outside the connector housing 1 is an outer wall surface 17 including an upper surface 14a, a side surface 14b, a side surface 14c, and a lower surface 14d. Thus, the lower surface 14d is a surface that rests on the printed circuit board 7.

  In addition, the connector housing 1 has a fitting port 11 on the front surface into which a mating connector is fitted. The fitting opening 11 is constituted by a wall surface portion 14. The inner wall surface 15 may have a fitting lock (not shown) that locks when the housing of the mating connector is fitted. The terminal 3 is of a male type. When the terminal 3 is press-fitted into the connector housing 1, an electric contact portion 31 having a distal end protruding from the inner bottom surface 13 b of the connector housing 1, and a base end side of the electric contact portion 31 being L-shaped. And a lead portion 32 which is bent into a letter shape so that it can be connected to the circuit pattern of the printed circuit board 7. The lead portion 32 projects below the lower surface 14d of the connector housing 1, is inserted into a plated through hole TH provided in a circuit pattern of the printed circuit board 7, and is soldered by heat generated by a heat treatment such as a reflow process. Attached. Note that the lead portion 32 is one end of the terminal 3 in the shield structure according to one aspect of the present disclosure, and the electrical contact portion 31 is the other end of the terminal 3 in the shield structure according to one aspect of the present disclosure.

  Specifically, the shield case 2 includes an upper surface portion 22 that covers the upper surface 14a side of the connector housing 1, a side surface portion 23 that covers the side surface 14b side and the side surface 14c side of the connector housing 1, and the upper surface portion 22 and the side surface portion 23. And a rear end portion 24 that covers the rear end side. In the shield case 2, an end surface 21 which is a front end side of the upper surface portion 22 and the side surface portion 23 has a substantially U shape, and a bottom surface portion 25 which is a lower end edge of the side surface portion 23 and the rear end portion 24 also has a substantially U shape. . That is, the shield case 2 is formed by bending a metal plate material by pressing so that an opening is provided downward from the upper surface 22 and an opening is provided forward from the rear end 24. It was formed as follows. In the shield case 2, a ground terminal 27 formed by bending a part extending outward from the side surface 23 is provided on a bottom surface 25 serving as a lower edge of the side surface 23 and the rear end 24. ing. The ground terminal 27 is for connecting the shield case 2 to a ground pattern on the printed circuit board 7. Further, the shield case 2 may be provided at the rear lower end edge of the side surface portion 23 with a notch engaging projection for engaging with the printed circuit board 7.

  Next, the steps of the method for manufacturing the shield structure of the shield connector will be described. FIG. 3 is a development view of the shield case 2 according to the embodiment to which the present disclosure is applied. FIG. 4 is a perspective view of the shield case 2 according to the embodiment to which the present disclosure is applied, in which the conductive member 41 is hardened by heat generated by heat treatment for soldering the terminal 3 and the printed board 7.

  First, as shown in FIG. 3, a plate material for forming the shield case 2 is formed by press working or the like. Next, a conductive member 41 having conductivity is applied to the bonding margin 29 which is a part of the plate material. The bonding margin 29 is formed such that a part of the side surface portion 23 extends outside the side surface portion 23. The conductive member 41 is a metal paste. Examples of the metal paste include copper, silver, aluminum, zirconium, niobium, gold, iron, nickel, cobalt, magnesium, tin, zinc, titanium, hafnium, tantalum, platinum, palladium, chromium, vanadium and alloys thereof. It is not particularly limited. Next, the side surface portion 23 and the rear end portion 24 are mountain-folded with respect to the upper surface portion 22, the bonding margin 29 is mountain-folded with respect to the side surface portion 23, and the ground terminal 27 is ground-folded with respect to the side surface portion 23. The shield case 2 is formed in a box shape. That is, the shield case 2 is formed by bending the rear end portion 24, which is another part of the plate material, to face the bonding margin 29.

  Next, the connector housing 1 in which the terminal 3 is press-fitted or insert-molded is prepared, the lead portion 32 at one end of the terminal 3 is arranged in a circuit pattern of the printed circuit board 7, and the connector housing 1 is covered with the shield case 2. At this time, the ground terminal 27 is arranged on the ground pattern of the printed circuit board 7. Next, the lead portion 32 and the circuit pattern of the printed circuit board 7 are soldered by a heat treatment such as a reflow treatment, and the conductive member 41 is cured by the heat generated by the heat treatment. At the same time, the ground terminal 27 and the ground pattern of the printed circuit board 7 are soldered by such heat treatment. As a result, the lead portion 32 is inserted into the plated through hole TH and soldered, and the attachment of the shield connector to the printed circuit board 7 is completed.

  In other words, in the shield case 2, the conductive member 41 applied to the bonding margin 29 is heated by heat generated by soldering the lead portion 32 on one end side of the terminal 3 and the circuit pattern of the printed circuit board 7. It is cured. That is, the shield case 2 includes the conductive member 41 applied to the bonding margin 29 and cured.

  The structure and material of the printed circuit board 7 are not particularly limited. As a material of the printed circuit board 7, an inorganic material such as glass, ceramics or metal, or an organic material such as resin or paper can be used. The structure of the printed board 7 is, for example, a flat plate.

  As described above, in the shield structure of the shield connector, the conductive member 41 is applied to the bonding margin 29, which is a part of the plate for forming the shield case 2, and the other part of the plate is bent and bonded. The connector case 1 is covered with the shield case 2 in a state where one end of the terminal 3 is arranged in the circuit pattern so as to face the matching margin 29, and is electrically conductive by heat generated by heat treatment for soldering the one end of the terminal 3 and the circuit pattern. The hard member 41 is cured. Therefore, the gap generated at the folded portion of the shield case 2 is closed by the conductive member 41. Therefore, a decrease in shield performance at high frequencies can be prevented.

  Further, in the present embodiment, the shield case 2 includes the conductive member 41 which is applied to a bonding margin 29 which is a part of a plate material for forming the shield case 2 and is cured. Therefore, the gap generated at the folded portion of the shield case 2 is closed by the conductive member 41. Therefore, a decrease in shield performance at high frequencies can be prevented. Further, since the conductive member 41 is cured during the heat treatment for soldering the one end of the terminal 3 and the circuit pattern, there is no need to provide another step for curing the conductive member 41. Therefore, the shield case 2 having a high electromagnetic shielding effect can be realized at low cost.

  As described above, the shield structure to which the present disclosure is applied has been described based on the embodiment. However, the present disclosure is not limited to this, and may be modified without departing from the gist of the present disclosure.

  For example, in the present embodiment, an example has been described in which the conductive member 41 is made of a metal paste, but the present invention is not particularly limited to this. For example, the conductive member 41 may be a conductive adhesive such as a conductive epoxy adhesive or a low-temperature curing type conductive adhesive. In this case, a conductive adhesive may be applied to the bonding margin 29.

DESCRIPTION OF SYMBOLS 1 Connector housing 11 Fitting opening, 13 rear surface part, 13a outer bottom surface, 13b inner bottom surface 14 wall surface portion, 14a upper surface, 14b, 14c side surface, 14d lower surface 15 inner wall surface, 17 outer wall surface 2 shield case 21 end surface, 22 upper surface portion, 23 Side surface part, 24 rear end part, 25 bottom part 27 ground terminal, 29 bonding margin 3 terminal, 31 electric contact part, 32 lead part 41 conductive member 7 printed circuit board TH sur hole

Claims (2)

A resin connector housing having a mating opening on the front surface with which a mating connector is fitted,
A terminal is disposed inside the connector housing, one end is connected to a printed circuit board, and the other end is connected to a connector terminal of the mating connector;
A metal shield case for housing the connector housing;
A method for manufacturing a shield structure comprising:
A step of applying a conductive member having conductivity to a bonding margin that is a part of a plate material for forming the shield case,
Bending the other part of the plate material to face the bonding margin to form the shield case;
Arranging one end of the terminal on a circuit pattern of the printed circuit board, and covering the connector housing with the shield case;
A step of curing the conductive member by heat generated by a heat treatment for soldering one end of the terminal and the circuit pattern of the printed board,
Comprising,
A method for manufacturing a shield structure, comprising: A resin connector housing having a mating opening on the front surface with which a mating connector is fitted,
A terminal is disposed inside the connector housing, one end is connected to a printed circuit board, and the other end is connected to a connector terminal of the mating connector;
A metal shield case for housing the connector housing;
A shield structure comprising
The shield case,
A conductive member having conductivity cured and applied to a bonding margin that is a part of a plate material for forming the shield case,
Comprising,
A shield structure characterized by that.

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