JP2019514067A - カメラモジュール用回路基板固定装置及びカメラモジュール - Google Patents
カメラモジュール用回路基板固定装置及びカメラモジュール Download PDFInfo
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- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B11/00—Filters or other obturators specially adapted for photographic purposes
- G03B11/04—Hoods or caps for eliminating unwanted light from lenses, viewfinders or focusing aids
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- G—PHYSICS
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- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/56—Accessories
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/08—Waterproof bodies or housings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2217/00—Details of cameras or camera bodies; Accessories therefor
- G03B2217/002—Details of arrangement of components in or on camera body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
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- Optics & Photonics (AREA)
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Abstract
【選択図】図6
Description
Claims (10)
- ベース部と、
複数の基板の各々の一側を支持する第一の固定部と前記複数の基板の各々の一側と対向する他側を支持する第二の固定部を含む固定ユニットを含み、
前記第一の固定部は、前記ベース部から複数が第一の方向に延びて、前記複数の基板の各々の一側を支持するために第一の方向と垂直な方向に突出した複数の突出部を含み、
前記第二の固定部は、前記ベースから複数が前記第一の方向に延びて、前記複数の基板の各々の他側を支持する複数の突出部を含むことを特徴とするカメラモジュール用回路基板固定装置。 - 前記第一の固定部は、前記ベース部の相互に向かい合う角の部分から延びて配置され、
前記第一の固定部の突出部は、前記第一の固定部の側面から突出した部分を折曲して形成されることを特徴とする請求項1に記載のカメラモジュール用回路基板固定装置。 - 前記第一の固定部は、前記ベース部に一対が相互に向かい合うように配置され、
前記第一の固定部の突出部は、前記基板が実装される内部空間に突出して形成されることを特徴とする請求項1に記載のカメラモジュール用回路基板固定装置。 - 前記第一の固定部の突出部の突出の長さは、前記ベース部から離れるほど減少することを特徴とする請求項1に記載のカメラモジュール用回路基板固定装置。
- 前記第二の固定部は、前記ベース部の相互に平行する辺から各々第一の方向に延びて形成され、
前記第二の固定部の突出部は、前記基板の前記他側を支持するために前記基板が実装される内部空間に向かって突出されることを特徴とする請求項1に記載のカメラモジュール用回路基板固定装置。 - 前記第二の固定部には、前記第二の固定部の突出部の間に形成された段差を持つことを特徴とする請求項5に記載のカメラモジュール用回路基板固定装置。
- 前記第一の固定部は、第一の幅で形成され、前記第二の固定部は、前記第一の幅よりも狭い第二の幅で形成されたことを特徴とする請求項1に記載のカメラモジュール用回路基板固定装置。
- 前記複数の基板は、上下相互向かい合うように複数が重なって配置されたリジッド回路基板及び前記リジッド回路基板を相互に電気的に連結する軟性回路基板を含むことを特徴とする請求項1に記載のカメラモジュール用回路基板固定装置。
- 前記基板には、前記第一の固定部の突出部中少なくとも一部の突出部と干渉を防止するために各々異なるサイズを持つ逃避溝が各々形成されたことを特徴とする請求項8に記載のカメラモジュール用回路基板固定装置。
- ベース部及び複数の基板の各々の一側を支持する第一の固定部と前記複数の基板の各々の他側を支持する第二の固定部を含む固定ユニットと、
前記基板中最上部に配置された基板に実装されるイメージセンサーと、
前記イメージセンサーに流入する光の経路上に配置されたレンズと、
前記レンズを固定するレンズバレルと、
前記固定ユニット、前記イメージセンサー及び前記レンズを収納するハウジングとを含み、
前記第一の固定部は、前記ベース部から複数が第一の方向に延びて、複数の回路基板の一側を各々支持するために第一の方向と垂直方向に突出した複数の突出部を含み、
前記第二の固定部は、前記ベースから複数が前記第一の方向に延びて、前記回路基板の前記一側と対向する他側と接触する複数の突出部を含むことを特徴とするカメラモジュール。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021196127A JP7364652B2 (ja) | 2016-04-14 | 2021-12-02 | カメラモジュール用回路基板固定装置及びカメラモジュール |
| JP2023173796A JP7698015B2 (ja) | 2016-04-14 | 2023-10-05 | カメラモジュール用回路基板固定装置及びカメラモジュール |
| JP2025098462A JP2025124910A (ja) | 2016-04-14 | 2025-06-12 | カメラモジュール用回路基板固定装置及びカメラモジュール |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0045409 | 2016-04-14 | ||
| KR1020160045409A KR102698563B1 (ko) | 2016-04-14 | 2016-04-14 | 카메라 모듈용 회로기판 고정 장치 및 이를 갖는 카메라 모듈 |
| KR10-2016-0092447 | 2016-07-21 | ||
| KR1020160092447A KR102595256B1 (ko) | 2016-07-21 | 2016-07-21 | 카메라 모듈 |
| PCT/KR2017/004064 WO2017179943A1 (ko) | 2016-04-14 | 2017-04-14 | 카메라 모듈용 회로기판 고정 장치 및 카메라 모듈 |
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| JP2021196127A Division JP7364652B2 (ja) | 2016-04-14 | 2021-12-02 | カメラモジュール用回路基板固定装置及びカメラモジュール |
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| Publication Number | Publication Date |
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| JP2019514067A true JP2019514067A (ja) | 2019-05-30 |
| JP6990194B2 JP6990194B2 (ja) | 2022-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2018553978A Active JP6990194B2 (ja) | 2016-04-14 | 2017-04-14 | カメラモジュール用回路基板固定装置及びカメラモジュール |
| JP2021196127A Active JP7364652B2 (ja) | 2016-04-14 | 2021-12-02 | カメラモジュール用回路基板固定装置及びカメラモジュール |
| JP2023173796A Active JP7698015B2 (ja) | 2016-04-14 | 2023-10-05 | カメラモジュール用回路基板固定装置及びカメラモジュール |
| JP2025098462A Pending JP2025124910A (ja) | 2016-04-14 | 2025-06-12 | カメラモジュール用回路基板固定装置及びカメラモジュール |
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| JP2021196127A Active JP7364652B2 (ja) | 2016-04-14 | 2021-12-02 | カメラモジュール用回路基板固定装置及びカメラモジュール |
| JP2023173796A Active JP7698015B2 (ja) | 2016-04-14 | 2023-10-05 | カメラモジュール用回路基板固定装置及びカメラモジュール |
| JP2025098462A Pending JP2025124910A (ja) | 2016-04-14 | 2025-06-12 | カメラモジュール用回路基板固定装置及びカメラモジュール |
Country Status (5)
| Country | Link |
|---|---|
| US (6) | US10660204B2 (ja) |
| EP (4) | EP4525470A3 (ja) |
| JP (4) | JP6990194B2 (ja) |
| CN (2) | CN113589618B (ja) |
| WO (1) | WO2017179943A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022043103A (ja) * | 2016-04-14 | 2022-03-15 | エルジー イノテック カンパニー リミテッド | カメラモジュール用回路基板固定装置及びカメラモジュール |
| KR20220127960A (ko) * | 2021-03-12 | 2022-09-20 | 주식회사 아이엠랩 | 인쇄회로기판의 다층 실장 가능한 카메라모듈 |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102362738B1 (ko) * | 2016-09-23 | 2022-02-11 | 젠텍스 코포레이션 | 와이어 하니스 연결 특징부를 갖는 이미저 |
| KR102318964B1 (ko) * | 2017-03-30 | 2021-10-29 | 엘지이노텍 주식회사 | 카메라 모듈 및 자동차 |
| CN110521200A (zh) * | 2017-04-27 | 2019-11-29 | 联合视觉技术有限责任公司 | 用于检测数据的设备 |
| CN109729238A (zh) * | 2017-10-31 | 2019-05-07 | 启碁科技股份有限公司 | 影像撷取装置 |
| USD937340S1 (en) * | 2018-04-03 | 2021-11-30 | Flir Systems, Inc. | Sensor module |
| USD896294S1 (en) * | 2018-05-29 | 2020-09-15 | Flir Commercial Systems, Inc. | Camera |
| USD995601S1 (en) * | 2018-06-05 | 2023-08-15 | Huddly As | Smart camera |
| USD896297S1 (en) * | 2018-07-24 | 2020-09-15 | Hanwha Techwin Co., Ltd. | Camera |
| USD894991S1 (en) * | 2018-07-24 | 2020-09-01 | Hanwha Techwin Co., Ltd. | Camera |
| US11987184B2 (en) * | 2018-11-15 | 2024-05-21 | Sony Semiconductor Solutions Corporation | Vehicle-mounted camera |
| CN109587382B (zh) * | 2018-12-18 | 2024-09-27 | 青岛小鸟看看科技有限公司 | 相机模组以及一种深度相机 |
| KR102754538B1 (ko) | 2018-12-19 | 2025-01-14 | 엘지이노텍 주식회사 | 카메라 모듈 |
| JP7074707B2 (ja) * | 2019-03-20 | 2022-05-24 | 京セラ株式会社 | 電子機器、撮像装置、および移動体 |
| USD954665S1 (en) * | 2019-05-03 | 2022-06-14 | Lumileds Holding B.V. | Flexible circuit board |
| DE102019115333A1 (de) * | 2019-06-06 | 2020-12-10 | Basler Ag | Elektronische Kamera |
| DE102019131393A1 (de) * | 2019-11-21 | 2021-05-27 | Connaught Electronics Ltd. | Intern ausgerichtete Kamera und Herstellungsverfahren hierfür |
| CN112839146B (zh) * | 2019-11-22 | 2025-07-01 | 上海欧菲智能车联科技有限公司 | 摄像头模组 |
| DE112021000982T5 (de) * | 2020-02-10 | 2022-11-24 | Sony Semiconductor Solutions Corporation | Sensormodul |
| KR20220001966A (ko) * | 2020-06-30 | 2022-01-06 | 엘지이노텍 주식회사 | 카메라 모듈 |
| US11809015B2 (en) * | 2020-08-28 | 2023-11-07 | Tdk Taiwan Corp. | Optical system |
| DE102021116319A1 (de) * | 2021-06-24 | 2022-12-29 | Valeo Schalter Und Sensoren Gmbh | Kameravorrichtung für ein fahrzeug, fahrzeug und verfahren zum herstellen einer kameravorrichtung |
| KR20230031693A (ko) * | 2021-08-27 | 2023-03-07 | 엘지이노텍 주식회사 | 카메라 모듈 |
| US12389096B2 (en) * | 2022-08-01 | 2025-08-12 | Google Llc | Camera module with electrostatic discharge protection |
| EP4590082A4 (en) * | 2022-09-15 | 2025-12-24 | Sony Semiconductor Solutions Corp | ELECTRONIC DEVICE AND IMAGING EQUIPMENT |
| US12464214B2 (en) * | 2023-02-10 | 2025-11-04 | Panasonic Automotive Systems Co., Ltd. | Vehicular camera |
| FR3149838A1 (fr) * | 2023-06-13 | 2024-12-20 | Sagemcom Broadband Sas | Module caméra rapporté à montage vertical |
| JP2025075949A (ja) * | 2023-11-01 | 2025-05-15 | ニデックプレシジョン株式会社 | 撮像ユニット |
| WO2025243459A1 (ja) * | 2024-05-23 | 2025-11-27 | シャープNecディスプレイソリューションズ株式会社 | 投写型表示装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233946A (ja) * | 1997-02-20 | 1998-09-02 | Matsushita Electric Ind Co Ltd | カメラの撮像素子保持構造 |
| JP2007142730A (ja) * | 2005-11-17 | 2007-06-07 | Auto Network Gijutsu Kenkyusho:Kk | シールド部材の取付部構造、シールド部材、カメラ装置及びカメラ装置の製造方法 |
| WO2008044487A1 (fr) * | 2006-10-13 | 2008-04-17 | Kabushiki Kaisha Yaskawa Denki | Dispositif de commande |
| JP2011259101A (ja) * | 2010-06-07 | 2011-12-22 | Ricoh Co Ltd | 撮像装置 |
| KR20130050767A (ko) * | 2011-11-08 | 2013-05-16 | 엘지이노텍 주식회사 | 차량용 카메라 모듈 |
| JP2014071252A (ja) * | 2012-09-28 | 2014-04-21 | Fujitsu General Ltd | 車載カメラ |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58111166A (ja) * | 1981-12-24 | 1983-07-02 | Canon Inc | Romパツク |
| US5381176A (en) * | 1991-08-11 | 1995-01-10 | Sony Corporation | Miniaturized video camera |
| KR200156894Y1 (ko) | 1996-12-03 | 1999-09-01 | 윤종용 | 영상기기 새시홀더의 pcb 부착장치 |
| JP2002006378A (ja) * | 2000-06-20 | 2002-01-09 | Fujitsu General Ltd | Ccdカメラユニット |
| JP3675719B2 (ja) * | 2001-01-19 | 2005-07-27 | 日本電気株式会社 | 電子機器内部実装基板の低インピーダンス実装方法及び実装構造 |
| US6544047B2 (en) * | 2001-03-30 | 2003-04-08 | Intel Corporation | Dual-swiping interconnection clip, and hook and slot arrangement for printed circuit board (PCB) attachment |
| JP2006324269A (ja) | 2005-05-17 | 2006-11-30 | Funai Electric Co Ltd | 基板の取付構造 |
| JP5005186B2 (ja) * | 2005-05-30 | 2012-08-22 | 市光工業株式会社 | 車載カメラ構造 |
| JP4077847B2 (ja) | 2005-10-07 | 2008-04-23 | トヨタ自動車株式会社 | 複数枚の回路基板を固定する固定部材とそれを利用したモジュール |
| US8064146B2 (en) * | 2006-07-28 | 2011-11-22 | Sony Corporation | Image pickup apparatus |
| KR20080052862A (ko) | 2006-12-08 | 2008-06-12 | 삼성전자주식회사 | 백라이트 어셈블리 및 이를 갖는 표시장치 |
| KR101131622B1 (ko) | 2007-07-06 | 2012-03-30 | 에스케이이노베이션 주식회사 | 다층 인쇄회로기판의 고정구조 |
| CN101349793A (zh) * | 2007-07-20 | 2009-01-21 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
| DE102007040085B3 (de) * | 2007-08-24 | 2008-07-24 | Fujitsu Siemens Computers Gmbh | Computer und Verfahren zur Montage einer Leiterplatte an einem Trägerblech |
| KR100982271B1 (ko) | 2008-10-30 | 2010-09-14 | 삼성전기주식회사 | 자동차용 카메라 모듈 |
| CN102025899B (zh) * | 2009-09-11 | 2013-11-06 | 鸿富锦精密工业(深圳)有限公司 | 相机模组及其组装方法 |
| JP2011071342A (ja) | 2009-09-25 | 2011-04-07 | Aisin Seiki Co Ltd | 基板保持装置 |
| JP4910038B2 (ja) * | 2009-12-25 | 2012-04-04 | 東芝テリー株式会社 | 工業用小型電子撮像カメラ |
| JP5381697B2 (ja) * | 2009-12-28 | 2014-01-08 | 株式会社リコー | 撮像装置 |
| WO2011089655A1 (ja) | 2010-01-25 | 2011-07-28 | 三菱電機株式会社 | 基板固定構造 |
| JP5691188B2 (ja) * | 2010-02-12 | 2015-04-01 | ソニー株式会社 | カメラ装置 |
| JP5821394B2 (ja) * | 2011-08-16 | 2015-11-24 | 株式会社リコー | 撮像装置 |
| JP5884976B2 (ja) * | 2012-01-31 | 2016-03-15 | ミツミ電機株式会社 | レンズホルダ駆動装置 |
| TWM433994U (en) * | 2012-04-10 | 2012-07-21 | Tung Thih Electronic Co Ltd | Camera module for vehicle |
| KR101416309B1 (ko) | 2012-06-01 | 2014-07-09 | (주)에이엔피 크리비즈 | 자동차용 커넥터 일체형 카메라 제조방법 |
| KR102003043B1 (ko) * | 2012-12-28 | 2019-07-23 | 삼성전자주식회사 | 연성 인쇄회로기판 및 이를 구비한 소형 카메라 장치 |
| DE102013021818A1 (de) * | 2013-12-21 | 2015-06-25 | Connaught Electronics Ltd. | Nach dem Baukastenprinzip aufgebaute Fahrzeugkamera und Kraftfahrzeug mit einer solchen Kamera |
| US9451167B2 (en) * | 2014-01-28 | 2016-09-20 | Lg Innotek Co., Ltd. | Lens moving unit and camera module having the same |
| JP2015216444A (ja) * | 2014-05-08 | 2015-12-03 | Smk株式会社 | 撮像装置 |
| EP2983026B1 (en) * | 2014-08-07 | 2022-12-28 | LG Innotek Co., Ltd. | Lens moving apparatus and camera module including the same |
| KR102248086B1 (ko) * | 2014-11-14 | 2021-05-04 | 엘지이노텍 주식회사 | 자동차용 카메라 모듈 |
| KR102338395B1 (ko) * | 2015-04-24 | 2021-12-13 | 엘지이노텍 주식회사 | 자동차용 카메라 모듈 |
| EP4525470A3 (en) * | 2016-04-14 | 2025-06-11 | Lg Innotek Co. Ltd | Device for fixing camera module circuit board, and camera module |
| CN109076150B (zh) * | 2016-04-14 | 2021-04-23 | Lg 伊诺特有限公司 | 相机模块和车辆 |
-
2017
- 2017-04-14 EP EP25150478.3A patent/EP4525470A3/en active Pending
- 2017-04-14 US US16/093,040 patent/US10660204B2/en active Active
- 2017-04-14 EP EP17782698.9A patent/EP3444666B1/en active Active
- 2017-04-14 EP EP20193555.8A patent/EP3779590B1/en active Active
- 2017-04-14 CN CN202110836315.XA patent/CN113589618B/zh active Active
- 2017-04-14 WO PCT/KR2017/004064 patent/WO2017179943A1/ko not_active Ceased
- 2017-04-14 CN CN201780023838.4A patent/CN109073959B/zh active Active
- 2017-04-14 JP JP2018553978A patent/JP6990194B2/ja active Active
- 2017-04-14 EP EP21211623.0A patent/EP4002005B1/en active Active
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- 2021-04-28 US US17/243,320 patent/US11602052B2/en active Active
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- 2023-01-17 US US18/155,269 patent/US11856697B2/en active Active
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-
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- 2025-06-12 JP JP2025098462A patent/JP2025124910A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233946A (ja) * | 1997-02-20 | 1998-09-02 | Matsushita Electric Ind Co Ltd | カメラの撮像素子保持構造 |
| JP2007142730A (ja) * | 2005-11-17 | 2007-06-07 | Auto Network Gijutsu Kenkyusho:Kk | シールド部材の取付部構造、シールド部材、カメラ装置及びカメラ装置の製造方法 |
| WO2008044487A1 (fr) * | 2006-10-13 | 2008-04-17 | Kabushiki Kaisha Yaskawa Denki | Dispositif de commande |
| JP2011259101A (ja) * | 2010-06-07 | 2011-12-22 | Ricoh Co Ltd | 撮像装置 |
| KR20130050767A (ko) * | 2011-11-08 | 2013-05-16 | 엘지이노텍 주식회사 | 차량용 카메라 모듈 |
| JP2014071252A (ja) * | 2012-09-28 | 2014-04-21 | Fujitsu General Ltd | 車載カメラ |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022043103A (ja) * | 2016-04-14 | 2022-03-15 | エルジー イノテック カンパニー リミテッド | カメラモジュール用回路基板固定装置及びカメラモジュール |
| US11602052B2 (en) | 2016-04-14 | 2023-03-07 | Lg Innotek Co., Ltd. | Device for fixing camera module circuit board, and camera module |
| JP7364652B2 (ja) | 2016-04-14 | 2023-10-18 | エルジー イノテック カンパニー リミテッド | カメラモジュール用回路基板固定装置及びカメラモジュール |
| US11856697B2 (en) | 2016-04-14 | 2023-12-26 | Lg Innotek Co., Ltd. | Device for fixing camera module circuit board, and camera module |
| US12213255B2 (en) | 2016-04-14 | 2025-01-28 | Lg Innotek Co., Ltd. | Device for fixing camera module circuit board, and camera module |
| KR20220127960A (ko) * | 2021-03-12 | 2022-09-20 | 주식회사 아이엠랩 | 인쇄회로기판의 다층 실장 가능한 카메라모듈 |
| KR102557212B1 (ko) * | 2021-03-12 | 2023-08-11 | 주식회사 아이엠랩 | 인쇄회로기판의 다층 실장 가능한 카메라모듈 |
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| Publication number | Publication date |
|---|---|
| EP3779590B1 (en) | 2022-01-12 |
| US11026329B2 (en) | 2021-06-01 |
| US20190132954A1 (en) | 2019-05-02 |
| EP4002005A1 (en) | 2022-05-25 |
| US20200245462A1 (en) | 2020-07-30 |
| CN113589618B (zh) | 2023-03-03 |
| EP3444666A4 (en) | 2019-02-27 |
| CN113589618A (zh) | 2021-11-02 |
| US11856697B2 (en) | 2023-12-26 |
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| US11602052B2 (en) | 2023-03-07 |
| CN109073959B (zh) | 2021-08-10 |
| US10660204B2 (en) | 2020-05-19 |
| JP2025124910A (ja) | 2025-08-26 |
| US20250133659A1 (en) | 2025-04-24 |
| JP7364652B2 (ja) | 2023-10-18 |
| EP4002005B1 (en) | 2025-03-12 |
| US20210267061A1 (en) | 2021-08-26 |
| EP3779590A1 (en) | 2021-02-17 |
| US20230156919A1 (en) | 2023-05-18 |
| JP2023174767A (ja) | 2023-12-08 |
| CN109073959A (zh) | 2018-12-21 |
| JP6990194B2 (ja) | 2022-01-12 |
| WO2017179943A1 (ko) | 2017-10-19 |
| EP4525470A3 (en) | 2025-06-11 |
| EP3444666A1 (en) | 2019-02-20 |
| US20240080983A1 (en) | 2024-03-07 |
| EP4525470A2 (en) | 2025-03-19 |
| EP3444666B1 (en) | 2020-10-07 |
| US12213255B2 (en) | 2025-01-28 |
| JP2022043103A (ja) | 2022-03-15 |
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