JP2019120589A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress heat from being trapped between two grip portions (first grip portion and second grip portion), and to acquire a stable image by an image pickup unit, an electronic component transfer device and an electronic component inspection device. I will provide a. SOLUTION: An electronic component transporting device is provided in a transporting section for transporting electronic components, a region in which an electronic component mounting section on which the electronic component is mounted can be arranged, and a region in which the electronic component is mounted, and grips the electronic component. The electronic component is mounted through between the first grip portion to be transported, the second grip portion provided in the region for gripping and transporting the electronic component, and the first grip portion and the second grip portion. It has an image pickup unit capable of imaging a stationary portion, and an air flow forming portion that forms an air flow between the first grip portion and the second grip portion. [Selection diagram] FIG. 11

Description

  The present invention relates to an electronic component conveyance device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an inspection apparatus for electrically inspecting an electronic component such as an IC device or the like is known (see, for example, Patent Document 1). In the inspection apparatus described in Patent Document 1, when the IC device is inspected, the IC device is transported to the inspection socket, mounted on the inspection socket, and the inspection is performed. Further, in the inspection apparatus described in Patent Document 1, prior to the inspection of the IC device, it is determined whether the IC device remains in the inspection socket, that is, the presence or absence of the IC device. As the necessity of this judgment, if, for example, an IC device remains in the inspection socket, the IC device to be inspected from now on may overlap this residual device, and an accurate inspection result may not be obtained. It is from. And in the inspection apparatus of patent document 1, judgment of the presence or absence of IC device obtains two images (before and after IC device conveyance) which differ in imaging timing in the state which irradiated slit light toward the socket for inspection. The difference between the two images (image difference) is detected, and this is performed based on the detection result.

JP, 2014-196908, A

  However, in the inspection apparatus described in Patent Document 1, two hand units (first hand unit and second hand unit) for conveying the IC device to the inspection socket and placing the IC device on the inspection socket are arranged side by side. It is done. Therefore, for example, when the hand unit is heated in a test in a high temperature environment (for example, 100 ° or more), heat is accumulated between the two hand units, and the temperature of the region rises. As a result, the refractive index of air in the area changes, and a stable image can not be acquired, and there is a possibility that the determination of the presence or absence of the IC device based on the image can not be stably performed. .

  The present invention has been made to solve the above-described problems, and can be realized as the following.

An electronic component transfer apparatus according to the present invention includes: a transfer unit that transfers an electronic component;
An area in which an electronic component placement unit on which the electronic component is placed can be arranged;
A first gripping portion provided in the area to grip and transport the electronic component;
A second holding unit provided in the area to hold and transport the electronic component;
An imaging unit capable of imaging the electronic component placement unit through between the first holding unit and the second holding unit;
And an air flow forming unit for forming an air flow between the first holding unit and the second holding unit.

  Thus, the heat (heated air) contained in the space can be removed by the air flow, and the temperature rise in the space can be suppressed. Therefore, it is possible to suppress the change in the refractive index of air in the space, and the imaging unit can acquire a stable image (an image in which distortion is suppressed). As a result, the presence or absence of the electronic component in the electronic component placement unit can be stably determined based on the image captured by the imaging unit.

  In the electronic component transfer apparatus of the present invention, the air flow forming unit is preferably provided between the first holding unit and the second holding unit.

  Thereby, the air flow can be more reliably formed in the space. Moreover, the space of space can be utilized and size reduction of an apparatus can also be achieved.

In the electronic component transfer apparatus according to the present invention, preferably, the air flow is formed in a direction intersecting the direction in which the first grip portion and the second grip portion are arranged.
Thereby, the heat collected in the space can be effectively removed.

  In the electronic component transfer apparatus of the present invention, the air flow forming unit includes a supply unit that supplies a gas to a space between the first holding unit and the second holding unit, and a suction unit that suctions the gas in the space. It is preferable to have.

  Thus, the configuration of the air flow forming unit is simplified, and the gas can be injected from the supply unit into the space, and the gas in the space can be drawn from the suction unit to form the air flow.

In the electronic component transfer apparatus of the present invention, the air flow is formed in a direction intersecting the direction in which the first grip portion and the second grip portion are arranged,
It is preferable that one of the supply unit and the suction unit is disposed at one end of the space at the back of the intersection, and the other is disposed at the other end of the space in the direction of the intersection.

  Thereby, an air flow can be formed in almost the entire space, and the heat of the space can be efficiently removed.

  In the electronic component transfer apparatus of the present invention, it is preferable that the supply unit supplies a gas having a temperature lower than that of the gas in the space to the space.

  As a result, an air flow can be formed over substantially the entire space, and heat in the space can be effectively removed (the space can be effectively cooled).

The electronic component transfer apparatus of the present invention includes a control unit that controls driving of the supply unit and the suction unit.
Preferably, the control unit drives the supply unit after driving the suction unit.

  Thereby, the heat in the space can be effectively suppressed from being expelled out of the space by the air flow. Therefore, it is possible to effectively suppress that the temperature of the entire region changes.

The electronic component transfer apparatus of the present invention includes a control unit that controls driving of the supply unit and the suction unit.
It is preferable that the control unit stops driving of the suction unit after stopping driving of the supply unit.

  Thereby, the heat in the space can be effectively suppressed from being expelled out of the space by the air flow. Therefore, it is possible to effectively suppress that the temperature of the entire region changes.

  In the electronic component transfer apparatus of the present invention, it is preferable to have a light emitting unit that applies light to the electronic component placement unit.

  Thus, for example, by imaging the projection shape of the light irradiated to the electronic component placement unit by the imaging unit, it can be determined whether the electronic component remains in the electronic component placement unit.

An electronic component inspection device according to the present invention comprises a transport unit for transporting an electronic component;
An electronic component placement unit on which the electronic component is placed;
An area where the electronic component placement portion can be arranged;
A first gripping portion provided in the area to grip and transport the electronic component;
A second holding unit provided in the area to hold and transport the electronic component;
An imaging unit capable of imaging the electronic component placement unit through between the first holding unit and the second holding unit;
And an air flow forming unit for forming an air flow between the first holding unit and the second holding unit,
The electronic component placement unit is an inspection unit capable of placing and inspecting the electronic component.

  Thus, the heat (heated gas) contained in the space can be removed by the air flow, and the temperature rise in the space can be suppressed. Therefore, it can suppress that the refractive index of the gas in space changes, and the imaging part can acquire the stable image (image by which distortion was suppressed). As a result, the presence or absence of the electronic component in the electronic component placement unit can be stably determined based on the image captured by the imaging unit.

  Further, the electronic component can be transported to the electronic component placement unit as the inspection unit, and the inspection unit can perform the inspection on the electronic component. Moreover, the electronic component after an inspection can be conveyed from an inspection part.

FIG. 1 is a schematic perspective view of a first embodiment of the electronic component inspection device of the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operation state of the electronic component inspection device shown in FIG. FIG. 3 is a partial cross-sectional view in the inspection area in FIG. FIG. 4 is an enlarged detailed plan view of the inspection area in FIG. FIG. 5 is a plan view showing a state in which the IC device is not placed on the inspection unit disposed in the inspection area shown in FIG. 6 is a partial cross-sectional view as viewed in the direction of arrow B in FIG. FIG. 7 is a plan view showing a state in which the IC device is mounted on the inspection unit disposed in the inspection area shown in FIG. FIG. 8 is a partial cross-sectional view as viewed in the direction of arrow C in FIG. FIG. 9 is a side view of the device transport head as viewed from the negative side in the X direction. FIG. 10 is a partial cross-sectional view of the device transfer head as viewed from the positive side in the Z direction. FIG. 11 is a cross-sectional view taken along line AA in FIG. FIG. 12 is a partial cross-sectional view of the device transfer head disposed in the inspection region of the electronic component inspection device (second embodiment) of the present invention as viewed from the positive side in the Z direction. FIG. 13 is a modification of the configuration shown in FIG. 12 and is a partial cross-sectional view of the device transfer head as viewed from the positive side in the Z direction. FIG. 14 is a partial cross-sectional view of the device transport head disposed in the inspection region of the electronic component inspection device (third embodiment) of the present invention as viewed from the negative side in the Y direction. FIG. 15 is a partial cross-sectional view of the device transfer head disposed in the inspection region of the electronic component inspection device (fourth embodiment) of the present invention as viewed from the positive side in the Z direction. FIG. 16 is a partial cross-sectional view of the device transfer head disposed in the inspection region of the electronic component inspection device (fifth embodiment) of the present invention as viewed from the positive side in the Z direction. FIG. 17 is a fragmentary sectional view which looked at the device conveyance head arranged in the inspection field of the electronic component inspection device (6th embodiment) of the present invention from the negative side of the Y direction.

  Hereinafter, an electronic component conveyance device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the attached drawings.

First Embodiment
Hereinafter, with reference to FIGS. 1-11, 1st Embodiment of the electronic component conveying apparatus and electronic component inspection apparatus of this invention is described. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are taken as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as "X direction (first direction)", a direction parallel to the Y axis is referred to as "Y direction (second direction)", and a direction parallel to the Z axis is referred to as " Also referred to as the Z direction (third direction). Also, the direction in which the arrows in each direction are directed is referred to as "positive", and the opposite direction is referred to as "negative". In addition, “horizontal” in the present specification is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to horizontal as long as transportation of the electronic component is not impeded. Also, the positive side in the Z direction may be referred to as “upper” or “upper”, and the negative side in the Z direction may be referred to as “lower” or “lower”.

  The electronic component transfer apparatus 10 of the present invention has an appearance shown in FIG. The electronic component transfer apparatus 10 of the present invention is a handler, for example, transfers an electronic component such as an IC device in a BGA (Ball Grid Array) package, and checks and tests the electrical characteristics of the electronic component in the transfer process ( Hereinafter, it is an apparatus which simply says "inspection". In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be representatively described, and this will be referred to as “IC device 90”. Further, the IC device 90 has a flat plate shape in the present embodiment. As the IC device 90, in addition to the above, for example, multiple modules of “LSI (Large Scale Integration)”, “CMOS (Complementary MOS)”, “CCD (Charge Coupled Device)”, and IC devices are packaged. And various sensor devices such as “quartz device”, “pressure sensor”, “inertial sensor (acceleration sensor)”, “gyro sensor (angular velocity sensor)”, “fingerprint sensor” and the like.

As shown in FIGS. 1 and 2, the electronic component inspection device 1 (electronic component transfer device 10) includes a tray supply region A1, a device supply region A2, an inspection region A3, a device recovery region A4, and a tray removal region. A5, and these areas are divided by each wall as described later. Then, IC device 90, from the tray supply area A1 to the tray removal area A5 via sequentially the respective regions in the arrow alpha ₉₀ direction, a check is made in the course of the inspection area A3. The electronic component inspection apparatus 1 includes an electronic component conveyance device 10 having a conveyance unit 25 for conveying the IC device 90 so as to pass through each area, an inspection unit 16 that performs inspection in the inspection area A3, and control for controlling each unit. And a unit 800. In addition, the electronic component inspection device 1 further includes a monitor 300, a signal lamp 400, and an operation panel 700. Note that the electronic component transfer device 10 is configured by the configuration excluding the inspection unit 16 from these configurations.

  The electronic component inspection apparatus 1 has the tray supply area A1 and the tray removal area A5 arranged, that is, the lower side in FIG. 2 is the front side and the inspection area A3 arranged, that is, the upper side in FIG. The side is used as the back side.

  Further, the electronic component inspection device 1 is used by mounting in advance what is called a "change kit" which is replaced for each type of the IC device 90. The change kit includes a placement unit (electronic component placement unit) on which the IC device 90 (electronic component) is placed. In the electronic component inspection device 1 of the present embodiment, the placement units are installed at a plurality of places, and include, for example, a temperature adjustment unit 12 described later, a device supply unit 14 and a device recovery unit 18. In addition, in the placement unit (electronic component placement unit) on which the IC device 90 (electronic component) is placed, the tray 200 prepared by the user separately from the change kit as described above, and the recovery tray 19 and There is also an inspection unit 16.

  The tray supply area A1 is a feeding unit to which the tray 200 in which a plurality of untested IC devices 90 are arrayed is supplied. The tray supply area A1 can also be referred to as a mounting area on which a plurality of trays 200 can be stacked and mounted. In the present embodiment, in each tray 200, a plurality of recesses (pockets) are arranged in a matrix. The IC device 90 can be housed and placed one by one in each recess.

The device supply area A2 is an area in which the plurality of IC devices 90 on the tray 200 transported from the tray supply area A1 are transported and supplied to the inspection area A3. Further, tray conveyance mechanisms 11A and 11B for conveying the trays 200 one by one horizontally are provided so as to straddle the tray supply area A1 and the device supply area A2. The tray transfer mechanism 11A is a part of the transfer unit 25 and moves the tray 200 together with the IC device 90 placed on the tray 200 in the positive side in the Y direction, that is, in the direction of the arrow α _{11A in} FIG. be able to. As a result, the IC device 90 can be stably fed into the device supply area A2. Further, the tray transport mechanism 11B is a moving unit capable of moving the empty tray 200 in the negative side in the Y direction, that is, in the direction of the arrow α _11B in FIG. Thus, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

  The device supply area A2 is provided with a temperature control unit (soak plate (English notation: soak plate, Chinese notation (one example): temperature uniforming plate)) 12, a device transport head 13, and a tray transport mechanism 15 There is. In addition, a device supply unit 14 is provided which moves so as to straddle the device supply area A2 and the inspection area A3.

  The temperature control unit 12 is a mounting unit on which a plurality of IC devices 90 are mounted, and is referred to as a “soak plate” capable of collectively heating or cooling the mounted IC devices 90. By this soak plate, the IC device 90 before being inspected by the inspection unit 16 can be heated or cooled in advance, and the temperature can be adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection).

  The temperature control part 12 as such a mounting part is being fixed. Thereby, the temperature of the IC device 90 on the temperature adjustment unit 12 can be stably adjusted. Further, the temperature control unit 12 is grounded (grounded). In the configuration shown in FIG. 2, two temperature adjustment units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray conveyance mechanism 11A is conveyed to any one of the temperature adjustment units 12.

The device transport head 13 grips the IC device 90, and is supported movably in the X direction and the Y direction in the device supply area A2, and is also supported movably in the Z direction. The device transport head 13 is also a part of the transport unit 25 and transports the IC device 90 between the temperature adjustment unit 12 and the tray 200 carried in from the tray supply area A1, and the temperature adjustment unit 12 and a device to be described later The transfer of the IC device 90 to and from the supply unit 14 can be responsible. In FIG. 2, the movement of the device transfer head 13 in the X direction is indicated by an arrow _α13X , and the movement of the device transfer head 13 in the Y direction is indicated by an arrow _α13Y .

  The device supply unit 14 is a placement unit on which the IC device 90 whose temperature is adjusted by the temperature adjustment unit 12 is placed, and the “supply shuttle plate” can transport the IC device 90 to the vicinity of the inspection unit 16. Or it is simply called a "supply shuttle". The device supply unit 14 can also be part of the transport unit 25. The device supply unit 14 has a recess (pocket) in which the IC device 90 is accommodated and placed.

Further, the device supply unit 14 as the placement unit is supported so as to be reciprocally movable (movable) along the X direction, that is, the direction of the arrow α ₁₄ between the device supply region A2 and the inspection region A3. As a result, the device supply unit 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection unit 16 of the inspection area A3. Can be returned to the device supply area A2 again.

  In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the device supply unit 14 on the Y direction negative side is referred to as “device supply unit 14A”, and the device supply unit on the Y direction positive side 14 may be referred to as "device supply unit 14B". Then, the IC device 90 on the temperature adjustment unit 12 is transported to the device supply unit 14A or the device supply unit 14B in the device supply area A2. Further, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14, as in the temperature adjustment unit 12. Thus, the temperature adjustment state of the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be maintained, and the IC device 90 can be transported to the vicinity of the inspection unit 16 in the inspection area A3. Further, the device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

Tray transporting mechanism 15, the positive side of the X direction empty tray 200 in a state where all of the IC devices 90 is removed in the device supply area A2, i.e., a mechanism for conveying the arrow alpha ₁₅ direction. Then, after this conveyance, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area for inspecting the IC device 90. In the inspection area A3, an inspection unit 16 for inspecting the IC device 90 and a device transport head 17 are provided.

  The device transfer head 17 is a part of the transfer unit 25 and, like the temperature control unit 12, is configured to be able to heat the held IC device 90. As shown in FIG. 3, the device transfer head 17 has a gripping portion 171 at its lower portion for gripping the IC device 90 (electronic component) by suction. Thus, the IC device 90 can be transported in the inspection area A3 while holding the temperature adjustment state by gripping the IC device 90 whose temperature adjustment state is maintained. In the present embodiment, a plurality (three) of gripping portions 171 are provided along the X direction, but the arrangement and the number of gripping portions 171 are not limited to this.

Such a device transfer head 17 is supported so as to be reciprocally movable in the Y direction and the Z direction in the inspection area A3, and is a part of a mechanism called an "index arm". In FIG. 2, the movement of the device transport head 17 in the Y direction is indicated by an arrow α ₁₇ Y. As shown in FIG. 4, two such device transport heads 17 are arranged side by side in the Y direction via the gap 172. Hereinafter, the device transport head 17 on the Y direction negative side may be referred to as “device transport head 17A”, and the device transport head 17 on the Y direction positive side may be referred to as “device transport head 17B”. In addition, the gripping portion 171 of the device transport head 17A is referred to as "gripping portion 171A (first gripping portion)", and the gripping portion 171 of the device transport head 17B is referred to as "gripping portion 171B (second gripping portion)". There is.

  The device transfer head 17A can handle transfer from the device supply unit 14A of the IC device 90 to the test unit 16 in the test area A3, and the device transfer head 17B can be a device of the IC device 90 in the test area A3. The conveyance from the supply unit 14B to the inspection unit 16 can be taken. In addition, the device transfer head 17A can handle transfer from the inspection unit 16 of the IC device 90 to the device recovery unit 18A in the inspection area A3, and the device transfer head 17B can be in the inspection unit 16 in the inspection area A3. Transport to the device recovery unit 18B. In the present embodiment, the relative positional relationship (width of the gap 172) between the device transfer head 17A and the device transfer head 17B is fixed, but the present invention is not limited to this. The device transfer head 17A and the device transfer head 17B can be approached and separated in the Y direction, and the width of the gap 172 can be adjusted. The width (length in the Y direction) of the gap 172 is not particularly limited, but can be, for example, 10 mm or more and 40 mm or less.

  The inspection unit 16 (socket) is a placement unit (electronic component placement unit) for placing an IC device 90, which is an electronic component, and testing the electrical characteristics of the IC device 90. As shown in FIGS. 3 and 4, the inspection unit 16 has a recess (pocket) 161 in which the IC device 90 is stored and placed, and a plurality of probe pins (not shown) are provided on the bottom surface 162 of the recess 161. ) Is provided. Then, when the terminals of the IC device 90 and the probe pins come into contact with each other, the IC device 90 can be inspected. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16.

  In the present embodiment, three recesses 161 are arranged at intervals in the X direction as shown in FIGS. 3 and 4 as an example, and “recesses 161A” and “recesses are sequentially arranged from the X direction negative side. It may be referred to as 161B "and" concave portion 161C ". Further, the arrangement mode (the number of arrangements in the X direction and the number of arrangements in the Y direction) of the concave portions 161 and the total number of arrangements are not limited to those shown in FIGS.

  Like the temperature control unit 12, the inspection unit 16 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.

  The device recovery area A4 is an area in which the plurality of IC devices 90 which are inspected in the inspection area A3 and whose inspection is completed are recovered. As shown in FIG. 2, in the device recovery area A4, a recovery tray 19, a device transport head 20, and a tray transport mechanism 21 are provided. A device recovery unit 18 is also provided that moves so as to straddle the inspection area A3 and the device recovery area A4. In addition, an empty tray 200 is also prepared in the device recovery area A4.

  The device recovery unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed, and the IC device 90 can be transported to the device recovery area A4, and “recovery shuttle plate” or It is simply called "recovery shuttle". The device recovery unit 18 can also be part of the transport unit 25.

Further, the device recovery unit 18 is supported so as to be capable of reciprocating between the inspection region A3 and the device recovery region A4 in the X direction, that is, the arrow α ₁₈ direction. Further, in the configuration shown in FIG. 2, two device recovery units 18 are disposed in the Y direction as in the device supply unit 14, and the device recovery unit 18 on the Y direction negative side is “device recovery unit 18 A”. In other words, the device recovery unit 18 on the positive side in the Y direction may be referred to as a “device recovery unit 18B”. Then, the IC device 90 on the inspection unit 16 is transported by the device transport head 17 to the device recovery unit 18A or the device recovery unit 18B and placed. The device recovery unit 18 is also grounded in the same manner as the temperature control unit 12 and the device supply unit 14.

  The recovery tray 19 is a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed, and is fixed so as not to move in the device recovery area A4. As a result, even in the device recovery area A4 in which various movable parts such as the device transport head 20 are relatively large, the tested IC device 90 is stably placed on the recovery tray 19. It becomes. In the configuration shown in FIG. 2, three recovery trays 19 are arranged along the X direction.

  Further, three empty trays 200 are also arranged along the X direction. The empty tray 200 also becomes a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the device recovery area A4 is transported to and placed on any of the recovery tray 19 and the empty tray 200. As a result, the IC devices 90 are classified and collected for each inspection result.

The device transport head 20 is movably supported in the device recovery area A4 in the X and Y directions, and further has a portion movable in the Z direction. The device transport head 20 is a part of the transport unit 25 and can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. Incidentally, in FIG. 2 shows the movement of the X-direction of the device carrying head 20 by the arrow alpha _20X, it shows a movement in the Y-direction of the device carrying head 20 by the arrow alpha _20Y.

Tray transfer mechanism 21, X-direction empty tray 200 is conveyed from the tray removal area A5 in the device collection region within A4, i.e., a mechanism for conveying the arrow alpha ₂₁ direction. Then, after this conveyance, the empty tray 200 will be disposed at a position where the IC device 90 is collected, that is, it can be any of the three empty trays 200.

  The tray removal area A5 is a removing unit from which the tray 200 in which the plurality of IC devices 90 in the inspected state are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

Further, a tray transport mechanism 22A and a tray transport mechanism 22B for transporting the trays 200 one by one in the Y direction are provided so as to straddle the device recovery area A4 and the tray removal area A5. The tray transport mechanism 22A is a part of the transport unit 25 and is a moving unit capable of reciprocating the tray 200 in the Y direction, that is, in the direction of the arrow α _22A . Thus, the inspected IC device 90 can be transported from the device recovery area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 in the positive side in the Y direction, that is, in the direction of the arrow α _22B . Thus, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4.

  The control unit 800 includes, for example, the tray conveyance mechanism 11A, the tray conveyance mechanism 11B, the temperature adjustment unit 12, the device conveyance head 13, the device supply unit 14, the tray conveyance mechanism 15, the inspection unit 16, and the device conveyance. Control of operation of each part of the head 17, the device recovery unit 18, the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22 A, the tray transfer mechanism 22 B and the residual detection unit 3 described later it can.

  The operator can set or confirm the operating conditions and the like of the electronic component inspection device 1 through the monitor 300. The monitor 300 has a display screen 301 configured of, for example, a liquid crystal screen, and is disposed on the front side upper portion of the electronic component inspection device 1. As shown in FIG. 1, a mouse stand 600 on which a mouse is placed is provided on the right side of the tray removal area A5 in the figure. This mouse is used when operating the screen displayed on the monitor 300.

  Further, an operation panel 700 is disposed at the lower right of FIG. 1 with respect to the monitor 300. The operation panel 700 instructs the electronic component inspection device 1 to perform a desired operation separately from the monitor 300. In addition, the signal lamp 400 can notify of the operation state of the electronic component inspection device 1 and the like by the combination of the light emitting colors. The signal lamp 400 is disposed on the top of the electronic component inspection device 1. A speaker 500 is built in the electronic component inspection device 1, and the operation state or the like of the electronic component inspection device 1 can also be notified by this speaker 500.

  In the electronic component inspection device 1, the space between the tray supply area A1 and the device supply area A2 is divided by the first partition wall 231, and the space between the device supply area A2 and the inspection area A3 is divided by the second partition wall 232 The third barrier rib 233 separates the inspection area A3 from the device recovery area A4, and the fourth barrier rib 234 separates the device recovery area A4 from the tray removal area A5. The fifth partition wall 235 also divides the device supply area A2 and the device recovery area A4.

  The outermost part of the electronic component inspection apparatus 1 is covered with a cover, and the cover includes, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

  The overall configuration of the electronic component inspection device 1 has been briefly described above. In such an electronic component inspection apparatus 1, when the inspection unit 16 inspects the IC device 90, the presence or absence of the IC device 90 in the recess 161 of the inspection unit 16 is detected prior to the inspection, that is, the IC device 90 remains. Do. The reason for performing residual detection is, for example, the following reason.

  When the IC device 90 remains in the concave portion 161 of the inspection unit 16 (hereinafter, this IC device 90 is referred to as “residual device”), the next IC device 90 to be inspected in the concave portion 161 (hereinafter, this IC device 90 The “untested device” is placed on top of the remaining device. In such a state, it may be difficult to accurately inspect an uninspected device. Therefore, in the inspection unit 16, it is preferable to detect the remaining of the IC device 90.

  Therefore, the electronic component inspection device 1 includes a residual detection unit 3 that detects the residual of the IC device 90 in the inspection unit 16. As shown in FIGS. 3 and 4, the residual detection unit 3 includes a light irradiation unit 4 and an imaging unit 5.

  As shown in FIG. 3, the light irradiator 4 is disposed on the upper left side of the inspection unit 16, that is, on the negative side in the X direction and the positive side in the Z direction with respect to the inspection unit 16. The light irradiation part 4 is comprised by the three laser light sources 41 in this embodiment. The laser light sources 41 are arranged at intervals along the Z direction, and may be referred to as “laser light source 41A”, “laser light source 41B”, and “laser light source 41C” in this order from the Z direction negative side.

The laser light source 41A irradiates the laser light L ₄₁ (light) as slit light along the Y direction toward the recess 161A of the inspection unit 16 (electronic component placement unit). The laser light source 41 B irradiates the laser light L ₄₁ as slit light along the Y direction toward the recess 161 B of the inspection unit 16. The laser light source ₄₁ C irradiates the laser light L ₄₁ as slit light along the Y direction toward the recess 161 C of the inspection unit 16. The laser light L ₄₁ emitted from each of the laser light sources 41 A, 41 B and ₄₁ C passes through the gap 172 between the device transfer head 17 A and the device transfer head 17 B and reaches the inspection unit 16. The laser light source 41A may irradiate the laser light L ₄₁ toward the recess 161C, and the laser light source 41C may irradiate the laser light L ₄₁ toward the recess 161A.

As each laser light source 41, for example, one having a cylindrical lens can be used. Thereby, the projection shape on the test _| inspection part 16 of the laser beam L41 becomes linear. Moreover, as each laser light source 41, you may use what scans a spot light along a Y direction other than said thing, for example. Moreover, as a light source which the light irradiation part 4 has, it is not limited to a laser light source, For example, LED, a halogen lamp etc. may be used, For example, Y direction can be provided by providing a slit ahead of a light source. It can be slit light along the

  In addition, the number of the laser light sources 41 is preferably equal to or greater than the number of the recesses 161 in the X direction. Moreover, although this arrangement number was three in this embodiment, it is not limited to this, For example, one, two or four or more may be sufficient. Further, although the arrangement position of the laser light source 41 (light irradiation unit 4) is obliquely upper left in the drawing with respect to the inspection unit 16 in the configuration shown in FIG. 4, the present invention is not limited thereto. It may be both the upper left and the upper right. In addition, the arrangement position of the laser light source 41 (light irradiation unit 4) may be directly above the inspection unit 16 (positive side in the Z direction).

  As shown in FIG. 3, the imaging unit 5 is disposed and fixed on the upper side of the inspection unit 16, that is, on the positive side in the Z direction with respect to the inspection unit 16. As shown in FIG. 4, in the present embodiment, the imaging unit 5 includes two cameras 51 arranged in the X direction. Each camera 51 can be imaged when the imaging range is different and the gap 172 is located immediately below. Then, the images captured by the respective cameras 51 can be combined to obtain an image of the entire inspection unit 16.

  Each camera 51 is not particularly limited, and, for example, a CCD (charge-coupled device) camera or a three-dimensional camera can be used. Moreover, although the number of arrangement | positioning of the camera 51 was two in this embodiment, it is not limited to this, For example, 1 or 3 or more may be sufficient. Further, the arrangement manners of the cameras 51 (the arrangement number in the X direction and the arrangement number in the Y direction) are not limited to those shown in FIGS. 3 and 4. Further, each camera 51 is fixed in the present embodiment, but is not limited to this, and may be rotatably supported, for example. Thus, for example, the imaging range of each camera 51 can be changed, and the total number of cameras 51 can be reduced as much as possible.

Then, the control unit 800 performs a process of detecting the remaining of the IC device 90 in each recess 161 of the inspection unit 16, that is, the process of determining the presence or absence of the IC device 90. The control unit 800, which is a processing unit, has at least one processor, and the processor reads various instructions, judgments and instructions stored in the control unit 800, and the processor performs various instructions and various judgments. And various instructions etc. The control unit 800 can perform the residual detection process based on at least one of the projection shape and the irradiation position on the inspection unit 16 of the laser light L ₄₁ projected on the inspection unit 16. Hereinafter, this process will be described with reference to FIGS. 5 to 8. 5 to 8 typically illustrate one concave portion 161 and laser light L ₄₁ irradiated to the concave portion 161.

As shown in FIGS. 5 and 6, in a state where the IC device 90 is not placed in the recess 161, the laser light L ₄₁ reaches the bottom surface 162 of the recess 161. In addition, the projection shape of the laser beam L ₄₁ on the inspection unit 16 at this time has a bent linear shape (line shape) as shown in FIG. 5 (see a portion surrounded by a two-dot chain line in FIG. 5). ). The projection shape of the laser beam L ₄₁ shown in FIG. 5 is captured by the imaging unit 5 as an image and stored in advance in the storage unit of the control unit 800.

On the other hand, as shown in FIGS. 7 and 8, in the state where the IC device 90 is mounted in the recess 161, the laser light L ₄₁ does not reach the bottom surface 162 of the recess 161 and the IC device in the recess 161 The top surface 901 of 90 is reached. Further, the projection shape of the laser beam L ₄₁ on the inspection unit 16 at this time is different from the projection shape of the laser beam L ₄₁ shown in FIG. 5 because the IC device 90 is mounted in the recess 161. It has a bent linear shape as shown in 7 (see a portion surrounded by a two-dot chain line in FIG. 7). The projection shape of the laser beam L ₄₁ shown in FIG. 7 is captured by the imaging unit 5 as an image and stored in advance in the storage unit of the control unit 800.

When actually performing the residual detection, by irradiating a laser beam L ₄₁ in the recess 161 should residual detection is performed, imaging the projected shape of the laser beam L ₄₁ by the imaging unit 5. Then, the projection shape of the laser beam L ₄₁ projected onto the concave portion 161 to be subjected to the residual detection is one of the projection shape of the laser beam L ₄₁ shown in FIG. 5 and the projection shape of the laser beam L ₄₁ shown in FIG. It is determined whether the IC device 90 remains or not by comparing which of the two is closer to. In addition, although the method of comparing the projection shape of the laser beam L ₄₁ as described above is employed as a method of determining whether or not the IC device 90 remains, the present invention is not limited to this. For example, the inspection unit 16 may be imaged by the imaging unit 5 without using the laser light L ₄₁ , and it may be determined whether or not the IC device 90 remains based on the imaged image.

  Here, as described above, the gripping portions 171A and 171B are each configured to be able to heat the IC device 90 that is gripped. Specifically, as shown in FIG. 3, a heater H is built in each gripping portion 171A, 171B, and it is possible to heat the IC device 90 gripped by each gripping portion 171A, 171B. As described above, by heating the IC device 90 held by the holding portions 171A and 171B, the IC device 90 can be easily inspected under a high temperature environment (for example, an environment of 100 ° or more). .

However, in the present embodiment, the device transfer heads 17A and 17B are arranged relatively close to each other in the Y direction (for example, separated by about 10 mm to 40 mm), as shown in FIG. The heat of the heater H is accumulated in the space Q between the holding portion 171A provided in 17A and the holding portion 171B provided in the device transfer head 17B, and the temperature in the space Q is easily increased. Since the refractive index of air depends on temperature, when the temperature in the space Q rises as described above, the refractive index of air in the space Q changes, and a space having a non-uniform refractive index is formed. The straightness of the laser beam L ₄₁ passing through Q is reduced. Therefore, there is a possibility that distortion (displacement from the actual state) may occur in the image captured by the imaging unit 5, and whether the above-described IC device 90 remains in the inspection unit 16 based on the image in which the distortion occurs. If the determination of no is made, the determination can not be made accurately.

Therefore, as shown in FIG. 10, the electronic component inspection device 1 includes the air flow forming unit 8 for suppressing the temperature rise of the space Q. The air flow forming unit 8 forms the air flow R in the space Q and removes (vents) the heat (heated air) accumulated in the space Q by the air flow R, thereby suppressing the temperature rise in the space Q (space It is configured to cool the inside of Q). Therefore, the decrease in the straightness of the laser beam L ₄₁ passing through the space Q is suppressed, distortion occurring in the image captured by the imaging unit 5 is reduced, and it is determined whether the IC device 90 remains in the inspection unit 16 or not. It is possible to make the judgment accurately.

  As shown in FIG. 11, the air flow forming unit 8 is provided in the space Q and supplies (sprays) the compressed air G (gas) to the space Q, and the compressed air with respect to the supply unit 81. And a suction portion 82 positioned on the downstream side of the injection direction of G and sucking the air (gas) in the space Q. As described above, the compressed air G is injected from the supply unit 81 to the space Q, and the air in the space Q is drawn by the suction unit 82 on the downstream side thereof, thereby forming the air flow R. Heat can be removed. In other words, the compressed air G is injected from the supply unit 81 to the space Q, and the space Q is ventilated by sucking the air in the space Q by the suction unit 82 (replacement of air), and the heat accumulated in the space Q is removed. be able to. Therefore, the excessive temperature rise of the space Q due to the heat of the heater H can be effectively suppressed. Moreover, the structure of the airflow formation part 8 becomes simple by setting it as mentioned above.

  Here, although air is present in the space Q in the present embodiment, the present invention is not limited to this. For example, the inspection area A3 is substituted with an inert gas such as nitrogen, helium, argon, etc. An inert gas such as nitrogen, helium or argon may be present therein. Thus, the gas in the space Q is not limited to anything. Further, in the present embodiment, the supply unit 81 is configured to inject air, but the gas injected by the supply unit 81 is not limited thereto, and, for example, the inspection area A3 is nitrogen, helium, argon, etc. And inert gases such as oxygen, nitrogen, hydrogen, etc. may be any gas. The gas injected by the supply unit 81 is preferably the same gas as the gas located in the space Q. Thereby, the atmosphere of the inspection area A3 can be maintained.

  If the air flow R is only formed in the space Q, the air flow forming unit 8 may have either the supply unit 81 or the suction unit 82. That is, the air flow R can be formed simply by injecting the compressed air G from the nozzle 811 into the space Q, and the air flow R can be formed only by sucking the air in the space Q from the nozzle 821. However, for example, when the air flow forming unit 8 includes only the supply unit 81, the heat in the space Q flows out to the outside of the space Q without being sucked by the suction unit 82. Therefore, for example, the temperature of the entire inspection area A3 may change depending on the magnitude of heat flowing out of the space Q, the size of the inspection area A3, and the like. Since the inspection area A3 is maintained at a temperature suitable for the inspection of the IC device 90, if the temperature of the inspection area A3 changes due to the heat flowing out of the space Q, the inspection accuracy of the IC device 90 may be reduced. There is. On the other hand, when the air flow forming portion 8 has only the suction portion 82, depending on the size of the space Q, the suction force is insufficient (that is, it is difficult to form the air flow R in the entire space Q). There is a possibility that the heat can not be removed uniformly from the entire area of the From this point of view, it can be said that having the supply portion 81 and the suction portion 82 of the air flow forming portion 8 as in the present embodiment is suitable for removing the heat of the space Q. However, the present invention does not exclude the configuration in which the air flow forming unit 8 includes only one of the supply unit 81 and the suction unit 82, and the air flow forming unit 8 includes only one of the supply unit 81 and the suction unit 82. May be included.

  As shown in FIG. 11, the supply unit 81 has a tubular nozzle 811 extending in the Z direction and closed at its lower end. The nozzle 811 is located at the end of the space Q on the positive side in the X direction, and is fixed at the upper end thereof to the side surface of the device transport head 17B. Further, the lower end portion of the nozzle 811 is located in the space Q, and a plurality of (four) injection holes 812 arranged in the Z direction are formed in the portion. Such a nozzle 811 is connected to a compressor 814 through a valve 813 so that the compressed air G supplied from the compressor 814 is injected from the respective injection holes 812 toward the X direction negative side. Further, by controlling the opening degree of the valve 813, it is possible to control the injection ON / OFF and further the injection amount of the compressed air G.

  The fixing position of the nozzle 811 is not particularly limited. For example, the nozzle 811 may be fixed to the side surface of the device transport head 17A, or may be fixed to the gripping portions 171A and 171B. The method for injecting the compressed air G is not particularly limited, and, for example, a cylinder filled with the compressed air G may be used instead of the compressor 814. Further, the number of injection holes 812 is not particularly limited, and may be, for example, three or less, or five or more.

  The compressed air G is preferably at a temperature lower than the temperature of the air in the space Q. Thereby, the space Q can be cooled effectively. The temperature of the compressed air G is not particularly limited, but is preferably 10 ° or more lower than the temperature of the air in the space Q, and more preferably 20 ° or more lower. Thereby, the space Q can be cooled more effectively, and an excessive temperature rise of the space Q can be effectively suppressed.

  As shown in FIG. 11, the suction portion 82 has a tubular nozzle 821 extending in the Z direction and having a closed lower end. The nozzle 821 is located at the end of the space Q on the negative side in the X direction (that is, the downstream side of the jet of the compressed air G with respect to the nozzle 811), and is fixed to the side of the device transport head 17B at its upper end There is. Further, the lower end portion of the nozzle 821 is located in the space Q, and a plurality of (four) suction holes 822 arranged in the Z direction are formed in the portion. Such a nozzle 821 is connected to a pump 824 via a valve 823. By depressurizing the inside of the nozzle 821 by the pump 824, air in the space Q is sucked via the suction hole 822. By controlling the opening degree of the valve 823, it is possible to control the suction ON / OFF and the suction amount.

  The fixing position of the nozzle 821 is not particularly limited. For example, the nozzle 821 may be fixed to the side surface of the device transport head 17A, or may be fixed to the gripping portions 171A and 171B. In addition, the number of suction holes 822 is not particularly limited, and may be, for example, three or less, or five or more. Further, the number of suction holes 822 may be the same as or different from the number of injection holes 812.

  Thus, the compressed air G is injected from the nozzle 811 into the space Q, and the air in the space Q is sucked by the nozzle 821 on the downstream side thereof, whereby the air flow R is formed in the space Q. In particular, in the present embodiment, since the plurality of gripping portions 171A and 171B are disposed along the X direction and the gripping portions 171A and 171B are disposed side by side in the Y direction, the space Q has a width in the Y direction. Rather, the width in the X direction is longer. Therefore, by forming the air flow R along the long axis (X direction) of the space Q, the heat collected in the space Q can be removed more effectively.

  Further, in the nozzle 811, the injection holes 812 are formed to face the negative side in the X direction, and in the nozzle 821, the suction holes 822 are formed to face the positive side in the X direction. As described above, by causing the injection holes 812 and the suction holes 822 to face each other, the air flow R is stabilized, and the heat in the space Q can be more efficiently removed. Furthermore, as described above, the nozzle 811 for injecting the compressed air G is provided on one end side (positive end) of the space Q in the X direction, and the space Q is provided on the other end (negative end). The nozzle 821 for suctioning the air is provided. Therefore, the air flow R can be formed over substantially the entire area of the space Q in the X direction, and heat can be uniformly removed from the space Q.

  Further, in the present embodiment, the compressed air G injected from each injection hole 812 of the nozzle 811 does not collide with the IC device 90 held by the holding portions 171A and 171B, that is, the injection holes 812 of the nozzle 811 are IC The nozzle 811 is disposed so as not to face the device 90. As a result, the IC device 90 heated to a predetermined temperature (inspection temperature) by the heater H is cooled by the compressed air G, and the temperature of the IC device 90 can be prevented from deviating from the inspection temperature. Therefore, the IC device 90 can be inspected under a predetermined temperature condition.

  As shown in FIG. 11, among the plurality of injection holes 812 formed in the nozzle 811, the injection hole 812 (812 a) located at the lowermost side is the upper surface of the IC device 90 held by the holding parts 171 A and 171 B. The IC device 90 and the injection hole 812a are disposed to be shifted in the Z direction. Furthermore, as described above, the injection holes 812 are formed such that the compressed air G is injected from the nozzle 811 to the negative side in the X direction. As a result, the compressed air G ejected from the nozzle 811 flows along the X direction above the IC device 90 held by the holding portions 171A and 171B, so that the compressed air G does not collide with the IC device 90. It has become.

  Here, the drive of the supply unit 81 and the drive of the suction unit 82 are respectively controlled by the control unit 800. The control method by the controller 800 is not particularly limited. For example, while the electronic component inspection device 1 is driven, the air flow R may be formed in the space Q by constantly driving the supply portion 81 and the suction portion 82. . Further, for example, a temperature sensor (not shown) for detecting the temperature of the space Q is disposed, and the supply portion 81 and the suction portion are arranged such that the space Q falls within a predetermined temperature range according to the output from the temperature sensor. 82 may be driven intermittently. That is, control unit 800 drives supply unit 81 and suction unit 82 when the upper limit of the predetermined temperature range is exceeded, and conversely, control such that supply unit 81 and suction unit 82 is stopped when the lower limit of the predetermined temperature range is exceeded. You may

  In addition, when the control unit 800 starts driving the supply unit 81 and the suction unit 82, first, the drive (suction of air) of the suction unit 82 is started, and then the drive of the supply unit 81 (injection of compressed air G) To start). That is, the time T1 at which the drive of the supply unit 81 is started is later than the time T2 at which the drive of the suction unit 82 is started. Thereby, the heat in the space Q can be effectively suppressed from being expelled out of the space Q by the air flow R.

  On the other hand, when stopping the drive of the supply unit 81 and the suction unit 82, the control unit 800 first stops the drive of the supply unit 81 (injection of the compressed air G), and then the drive of the suction unit 82 (suction of air Stop). That is, time T3 at which the drive of the suction unit 82 is stopped is later than time T4 at which the drive of the supply unit 81 is stopped. Thereby, the heat in the space Q can be effectively suppressed from being expelled out of the space Q by the air flow R.

  The electronic component inspection device 1 (the electronic component conveying device 10) of the present embodiment has been described above. As described above, such an electronic component inspection device 1 (electronic component conveyance device 10) includes the conveyance unit 25 for conveying the IC device 90 (electronic component) and the inspection unit 16 (electronic device on which the IC device 90 is mounted). Provided in an inspection area A3 (area) in which the component placement portion can be arranged, and in the inspection area A3, and grasping and transporting the IC device 90 (first grasping part), and in the inspection area A3 A gripping portion 171B (second gripping portion) for gripping and transporting the IC device 90, an imaging portion 5 capable of imaging the inspection portion 16 through the gap between the gripping portion 171A and the gripping portion 171B, the gripping portion 171A and the gripping portion And an air flow forming unit 8 that forms an air flow R between the air flow generating unit and the air supply unit 171B. Thereby, the heat (heated air) collected in the space Q can be removed by the air flow R, and the temperature rise in the space Q can be suppressed. Therefore, it is possible to suppress that the refractive index of air in the space Q changes, and the imaging unit 5 can acquire a stable image (an image in which distortion is suppressed), and based on the image The determination of the presence or absence of the IC device 90 in the inspection unit 16 can be stably performed.

  Further, as described above, the air flow forming unit 8 is provided between the gripping portion 171A and the gripping portion 171B. That is, the air flow forming unit 8 is provided in the space Q. Thereby, the air flow R can be formed in the space Q more reliably. In addition, by utilizing the space of the space Q, the device can be miniaturized.

  Further, as described above, the air flow R is formed in the direction (X direction) intersecting with the direction (Y direction) in which the gripping portions 171A and the gripping portions 171B are arranged. Thereby, the heat collected in the space Q can be effectively removed.

  Further, as described above, the air flow forming unit 8 supplies the compressed air G (gas) to the space Q between the gripping portion 171A (first gripping portion) and the gripping portion 171B (second gripping portion). 81 and a suction unit 82 for suctioning air (gas) in the space Q. Thus, the configuration of the air flow forming unit 8 is simplified, and the compressed air G can be injected from the supply unit 81 to the space Q, and the air flow R can be formed by sucking the air in the space Q from the suction unit 82. .

  Further, as described above, the air flow R is formed in the direction (X direction) intersecting with the direction (Y direction) in which the holding portion 171A and the holding portion 171B are arranged, and one of the supply portion 81 and the suction portion 82 is The space Q is disposed at one end in the X direction, and the other is disposed at the other end of the space Q in the X direction. In the present embodiment, the supply portion 81 is disposed at the end of the space Q on the positive side in the X direction, and the suction portion 82 is disposed at the end of the space Q on the negative side in the X direction. As a result, the air flow R can be formed substantially in the entire area of the space Q, and the heat of the space Q can be effectively removed.

  Further, as described above, the supply unit 81 supplies the space Q with air (gas) having a temperature lower than that of air (gas) in the space Q. Thereby, the air of the space Q can be cooled efficiently.

  Further, as described above, the electronic component inspection device 1 (electronic component conveyance device 10) has the control unit 800 that controls the drive of the supply unit 81 and the suction unit 82, and the control unit 800 drives the suction unit 82. After that, the supply unit 81 is driven. That is, the time T1 at which the drive of the supply unit 81 is started is later than the time T2 at which the drive of the suction unit 82 is started. Thereby, the heat in the space Q can be effectively suppressed from being expelled out of the space Q by the air flow R. Therefore, it is possible to effectively suppress the change in the temperature of the entire inspection area A3.

  In addition, as described above, the electronic component inspection device 1 (electronic component conveyance device 10) includes the control unit 800 that controls the drive of the supply unit 81 and the suction unit 82, and the control unit 800 drives the supply unit 81. Stop the driving of the suction unit 82. That is, time T3 at which the drive of the suction unit 82 is stopped is later than time T4 at which the drive of the supply unit 81 is stopped. Thereby, the heat in the space Q can be effectively suppressed from being expelled out of the space Q by the air flow R. Therefore, it is possible to effectively suppress the change in the temperature of the entire inspection area A3.

Further, as described above, the electronic component inspection device 1 (electronic component conveyance device 10) includes the light irradiation unit 4 that irradiates the inspection unit 16 with the laser light L ₄₁ (light). Thus, for example, by imaging the projection shape of the laser beam L ₄₁ irradiated to the inspection unit 16 by the imaging unit 5, it can be determined whether the IC device 90 remains in the inspection unit 16 or not.

  In addition, as described above, the electronic component inspection device 1 inspects the transport unit 25 for transporting the IC device 90 (electronic component), the inspection unit 16 (electronic component placement unit) on which the IC device 90 is placed, A gripping portion 171A (first gripping portion) which is provided in an inspection area A3 in which the portion 16 can be disposed and in the inspection area A3 and grips and transports the IC device 90, and is provided in the inspection area A3 and grips the IC device 90 , And an imaging unit 5 capable of capturing an image of the inspection unit 16 through the gap between the gripping unit 171A and the gripping unit 171B, and an air flow between the gripping unit 171A and the gripping unit 171B. And an air flow forming portion 8 for forming an R. Further, the inspection unit 16 is an inspection unit that can mount and inspect the IC device 90. Thereby, the heat (heated air) collected in the space Q can be removed by the air flow R, and the temperature rise in the space Q can be suppressed. Therefore, it is possible to suppress that the refractive index of air in the space Q changes, and the imaging unit 5 can acquire a stable image (an image in which distortion is suppressed), and based on the image The determination of the presence or absence of the IC device in the inspection unit 16 can be stably performed.

Second Embodiment
Hereinafter, although the second embodiment of the electronic component conveyance device and the electronic component inspection device of the present invention will be described with reference to FIG. 12, differences from the above-described embodiment will be mainly described, and the same matters will be described. Omit. The present embodiment is mainly the same as the first embodiment except that the configuration of the air flow forming unit 8 is different.

  As shown in FIG. 12, in the present embodiment, the air flow forming unit 8 includes a first air flow forming unit 8A and a second air flow forming unit 8B. Each of the first air flow forming unit 8A and the second air flow forming unit 8B has the same configuration as the air flow forming unit 8 of the first embodiment described above, and includes a supply unit 81 and a suction unit 82. . Therefore, the description of the configurations of the first air flow forming unit 8A and the second air flow forming unit 8B will be omitted.

  Further, in plan view from the Z direction, four divided by an axis J1 extending in the X direction through the center Q 'of the space Q and an axis J2 extending in the Y direction through the center Q' of the space Q When the region is a first quadrant Q1, a second quadrant Q2, a third quadrant Q3 and a fourth quadrant Q4, the first air flow forming unit 8A is disposed in the first quadrant Q1, and the second air flow forming unit 8B is , And is disposed in a third quadrant Q3 located on the opposite side of the first quadrant Q1.

  In the first air flow forming unit 8A disposed in the first quadrant Q1, the supply unit 81 and the suction unit 82 are respectively fixed to the side surface of the device transport head 17B. The suction unit 82 is located at the center of the space Q, and the supply unit 81 is located at the end of the space Q on the positive side in the X direction. In such a first air flow forming unit 8A, an air flow R1 that is directed to the X direction negative side is formed. On the other hand, in the second air flow forming unit 8B disposed in the third quadrant Q3, the supply unit 81 and the suction unit 82 are respectively fixed to the side surface of the device transport head 17B. The suction unit 82 is located at the center of the space Q, and the supply unit 81 is located at the end of the space Q on the negative side in the X direction. In such a second air flow forming unit 8B, an air flow R2 directed to the positive side in the X direction is formed.

  According to such a configuration, two air flows R1 and R2 can be formed, so heat in the space Q can be removed more effectively. In addition, for example, since the formation distance of the air flows R1 and R2 (the distance between the supply portion 81 and the suction portion 82) can be shortened as compared with the first embodiment described above, Heat can be removed more effectively. In particular, since the airflows R1 and R2 are both directed to the center side of the space Q, the heat in the space Q can be effectively suppressed from being expelled out of the space Q.

  In the first air flow formation unit 8A, the arrangement of the supply unit 81 and the suction unit 82 may be reversed. That is, the supply portion 81 is located at the center of the space Q, the suction portion 82 is located at the end of the space Q on the positive side in the X direction, and the air flow R1 toward the positive side in the X direction is formed. It is also good. Similarly, in the second air flow forming unit 8B, the arrangements of the supply unit 81 and the suction unit 82 may be reversed. That is, the supply portion 81 is located at the center of the space Q, the suction portion 82 is located at the end of the space Q on the negative side in the X direction, and the air flow R1 toward the negative side in the X direction is formed. It is also good.

  In addition, as a modification of the present embodiment, for example, the second air flow forming unit 8B may be disposed in the fourth quadrant Q4, and the first air flow forming unit 8A may be disposed in the second quadrant Q2. . Further, as shown in FIG. 13, the air flow forming unit 8 includes a first air flow forming unit 8A disposed in the first quadrant Q1, a second air flow forming unit 8B disposed in the second quadrant Q2, and a third quadrant. A third air flow forming unit 8C disposed in Q3 and a fourth air flow forming unit 8D disposed in the fourth quadrant Q4 may be provided. In this case, the airflows R1, R2, R3, and R4 formed by the first, second, third, and fourth airflow forming portions 8A, 8B, 8C, and 8D are respectively from the end of the space Q as illustrated. It may be toward the central part or, conversely, it may be from the central part to the end, and a part of the air flow R1, R2, R3, R4 (for example, the air flow R1, R3) is in the space Q From the end to the center, the rest (e.g., airflows R2, R4) may be from the center of the space to the end.

Third Embodiment
Hereinafter, although the third embodiment of the electronic component transfer apparatus and the electronic component inspection apparatus of the present invention will be described with reference to FIG. 14, differences from the above-described embodiment will be mainly described, and the same matters will be described. Omit. The present embodiment is mainly the same as the first embodiment except that the configuration of the air flow forming unit 8 is different.

  As shown in FIG. 14, in the present embodiment, the nozzle 811 of the supply unit 81 is disposed at the lower end of the space Q, and the nozzle 821 of the suction unit 82 is disposed at the upper end of the space Q. There is. Further, in the nozzle 811, the injection holes 812 face the positive side in the Z direction, and in the nozzle 821, the suction holes 822 face the negative side in the Z direction. Therefore, in the present embodiment, the air flow R toward the positive side in the Z direction is formed. The heat in the space Q can be effectively removed by the air flow R along the Z direction as in the first embodiment described above.

  In particular, in the present embodiment, the plurality of injection holes 812 are disposed substantially in the entire X direction of the space Q, and similarly, the plurality of suction holes 822 are disposed substantially in the entire X direction of the space Q It is done. Therefore, the heat can be uniformly removed over substantially the entire space Q. Further, since the nozzle 811 is positioned on the positive side in the Z direction with respect to the IC device 90 held by the holding portions 171A and 171B and the compressed air G is injected from the nozzle 811 on the positive side in the Z direction It will not hit the device 90. Therefore, the unintentional temperature drop of the IC device 90 can be effectively suppressed. However, the arrangement of the nozzles 811 and 821 may be the reverse of this embodiment.

Fourth Embodiment
Hereinafter, the fourth embodiment of the electronic component conveyance device and the electronic component inspection device of the present invention will be described with reference to FIG. 15, but differences from the above-described embodiments will be mainly described, and the same matters will be described. Omit. The present embodiment is mainly the same as the first embodiment except that the configuration of the air flow forming unit 8 is different.

  As shown in FIG. 15, in the present embodiment, the nozzle 811 included in the supply unit 81 is fixed to the side surface of the device transport head 17B at the end on the positive side in the X direction of the space Q, and the nozzle included in the suction unit 82 821 is fixed to the side surface of the device transport head 17A at the end of the space Q on the negative side in the X direction. The injection holes 812 formed in the nozzle 811 face the nozzle 821 side, and the compressed air G is injected from the nozzle 811 toward the nozzle 821. On the other hand, each suction hole 822 formed in the nozzle 821 is directed to the nozzle 811 side, and the heat flowed by the air flow R can be effectively sucked. In such a configuration, the air flow R formed in the space Q is inclined with respect to both the X axis and the Y axis in a plan view from the Z direction.

Fifth Embodiment
Hereinafter, although the fifth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described with reference to FIG. 16, differences from the above-described embodiment will be mainly described, and the same matters will be described. Omit. The present embodiment is mainly the same as the first embodiment except that the configuration of the air flow forming unit 8 is different.

  As shown in FIG. 16, in the present embodiment, the supply unit 81 and the suction unit 82 are respectively located outside the space Q. Specifically, the nozzle 811 of the supply unit 81 is located on the positive side in the X direction with respect to the space Q, and the nozzle 821 of the suction unit 82 is located on the negative side in the X direction with respect to the space Q. That is, the nozzles 811 and 821 are arranged side by side in the X direction, and the space Q is located between them. The injection holes 812 formed in the nozzle 811 face the space Q (nozzle 821), and the compressed air G is injected from the nozzle 811 toward the space Q. On the other hand, each suction hole 822 formed in the nozzle 821 faces the space Q (nozzle 811), and the heat (heated air) expelled from the space Q by the air flow R can be efficiently sucked by the nozzle 821. It is supposed to be.

Sixth Embodiment
Hereinafter, although the sixth embodiment of the electronic component conveyance device and the electronic component inspection device of the present invention will be described with reference to FIG. 17, differences from the above-described embodiment will be mainly described, and the same matters will be described. Omit. The present embodiment is mainly the same as the first embodiment except that the configuration of the air flow forming unit 8 is different.

  As shown in FIG. 17, in the present embodiment, the supply unit 81 includes a fan 819 provided in the space Q. Then, by driving the fan 819, air is fed into the space Q and an air flow R is formed. In particular, in the present embodiment, the fan 819 is located at the end of the space Q on the positive side in the X direction, and the air flow R toward the negative side in the X direction is formed by the drive of the fan 819. By positioning the nozzle 821 of the suction part 82 in the part, the heat in the space Q can be effectively removed.

  The electronic component transfer apparatus and the electronic component inspection apparatus according to the present invention have been described above with reference to the illustrated embodiment, but the present invention is not limited to this, and each component constituting the electronic component transfer apparatus and the electronic component inspection apparatus Can be replaced with any configuration that can perform the same function. Also, any component may be added.

  Further, the electronic component conveyance device and the electronic component inspection device of the present invention may be a combination of any two or more configurations (features) of the respective embodiments. In addition, although the electronic component placement unit for which residual detection is performed is the inspection unit in each of the above embodiments, the present invention is not limited to this. For example, a temperature adjustment unit, device supply unit, device recovery unit, recovery tray It may be another electronic component placement unit such as a tray or the like.

DESCRIPTION OF SYMBOLS 1 ... Electronic component inspection apparatus, 10 ... Electronic component conveyance apparatus, 11A, 11B ... Tray conveyance mechanism, 12 ... Temperature control part, 13 ... Device conveyance head, 14, 14A, 14B ... Device supply part, 15 ... Tray conveyance mechanism, 16 inspection unit 161 161A 161B 161C recess recess 162 bottom surface 17 17A 17B device transport head 171 171A 171B grip portion 172 gap 18 18A 18B device recovery Section 19 Collection tray 20 Device transport head 21, 22A, 22B Tray transport mechanism 25 Transport section 3 Residual detection unit 4 Light irradiator 41 41A, 41B, 41C Laser Light source 5 Imaging unit 51 Camera 8 Air flow forming unit 8A First air flow forming unit 8B Second air flow forming unit 8C Third air flow forming , 8D: fourth air flow forming unit, 81: supply unit, 811: nozzle, 812: injection hole, 812a: injection hole, 813: valve, 814: compressor, 819: fan, 82: suction unit, 821: nozzle, 822 ... Suction hole, 823 ... valve, 824 ... pump, 90 ... IC device, 901 ... top surface, 200 ... tray, 231 ... first partition, 232 ... second partition, 233 ... third partition, 234 ... fourth partition, 235 ... 5th partition, 241 ... front cover, 242 ... side cover, 243 ... side cover, 244 ... rear cover, 245 ... top cover, 300 ... monitor, 301 ... display screen, 400 ... signal lamp, 500 ... speaker, 600 ... mouse , 700: operation panel, 800: control unit, A1: tray supply area, A2: device supply area, A3: inspection area , A4 ... device collection area, A5 ... tray removal area, G ... compressed air, H ... heater, J1 ... shaft, J2 ... shaft, L _{41 ...} laser light, Q ... space, Q '... center, Q1 ... first quadrant , Q2 ... second quadrant, Q3 ... third quadrant, Q4 ... fourth quadrant, R, R1, R2, R3 , R4 ... air _{flow, α 11A, α 11B, α} 13X, α 13Y, α 14, α 15, α _{17Y, α 18, α 20X,} α 20Y, α 21, α 22A, α 22B, α 90 ... arrow

Claims (10)

A transport unit that transports the electronic component;
An area in which an electronic component placement unit on which the electronic component is placed can be arranged;
A first gripping portion provided in the area to grip and transport the electronic component;
A second holding unit provided in the area to hold and transport the electronic component;
An imaging unit capable of imaging the electronic component placement unit through between the first holding unit and the second holding unit;
And an air flow forming unit for forming an air flow between the first holding unit and the second holding unit.   The electronic component transfer apparatus according to claim 1, wherein the air flow forming unit is provided between the first holding unit and the second holding unit.   The electronic component conveying apparatus according to claim 1, wherein the air flow is formed in a direction intersecting with a direction in which the first holding unit and the second holding unit are arranged.   The said air flow formation part is a supply part which supplies gas to the space between the said 1st holding part and the said 2nd holding part, The attraction | suction part which attracts | sucks the gas of the said space of Claim 1 Electronic Component Transporter. The air flow is formed in a direction that intersects the direction in which the first grip portion and the second grip portion are arranged,
5. The apparatus according to claim 4, wherein one of the supply unit and the suction unit is disposed at the one end at which the space crosses back and the other is disposed at the other end in the cross direction of the space. Electronic Component Transporter.   The said supply part is an electronic component conveying apparatus of Claim 4 which supplies the gas whose temperature is lower than the gas in the said space to the said space. A control unit that controls driving of the supply unit and the suction unit;
The electronic component transport apparatus according to claim 4, wherein the control unit drives the supply unit after driving the suction unit. A control unit that controls driving of the supply unit and the suction unit;
The electronic component transfer apparatus according to claim 4, wherein the control unit stops driving of the suction unit after stopping driving of the supply unit.   The electronic component transfer apparatus according to claim 1, further comprising a light emitting unit that emits light to the electronic component placement unit. A transport unit that transports the electronic component;
An electronic component placement unit on which the electronic component is placed;
An area where the electronic component placement portion can be arranged;
A first gripping portion provided in the area to grip and transport the electronic component;
A second holding unit provided in the area to hold and transport the electronic component;
An imaging unit capable of imaging the electronic component placement unit through between the first holding unit and the second holding unit;
And an air flow forming unit for forming an air flow between the first holding unit and the second holding unit,
The said electronic component mounting part is an inspection part which can mount and test | inspect the said electronic component, The electronic component inspection apparatus characterized by the above-mentioned.

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